CN108695418A - A kind of LED alphanumeric displays and preparation method thereof - Google Patents

Abstract

The present invention provides a kind of preparation method of LED character display, and it is used for making LED character display, protects chip and diffuses light source by the protruding structure formed on chip outer surface specifically, it is characterized in that, comprises the following steps: a. The chips used to form the LED characters are solidly planted on the circuit board; b. preparing a perforated steel mesh, and covering the perforated steel mesh on the circuit board; c. filling the perforated part of the steel mesh with a filler, Make the circuit board form a protruding structure under the cover of the detachment steel mesh. The invention has the advantages of simple structure, powerful function, convenient operation, mass production and high commercial value.

Description

A kind of LED character display and preparation method thereof

technical field

The invention relates to the field of LED semiconductor lighting, in particular to an LED character display and a preparation method thereof.

Background technique

With the development of science and technology, the rapid development of electronic technology, all kinds of LED flat panel display devices, as an important medium for modern information display, have been widely used in many fields, and all kinds of LED flat panel displays are divided into LED display modules and LCD display modules Among them, the LED display integrates microelectronics technology, computer technology, and information processing. It is characterized by bright colors, wide dynamic range, high brightness, high definition, low working voltage, low power consumption, long life, impact resistance, bright colors and With the advantages of stable and reliable work, it has become the most advantageous new generation of display media. LED displays have been widely used in large squares, commercial advertisements, stadiums, information dissemination, news releases, securities transactions, etc., and can meet the needs of different environments, especially LED character displays are widely used in railway stations, stadiums, large shopping malls and other public places.

At this stage, LED character displays usually include a circuit board, and LED chips, optical films, and packaging films that are sequentially arranged on the circuit board. In order to better prolong the service life of the LED chip, the LED digital on the LED chip The outside of the tube is covered by glue filling process. Although this can protect the LED digital tube from the influence of external bad weather, enhance heat dissipation to improve LED performance, optimize beam distribution and improve light output efficiency, but because the glue filling process directly affects The entire LED chip is filled with glue, which is likely to cause damage to the LED chip during the glue filling process, reducing the use function and service life of the LED character display.

At present, there is no technology that can solve the above technical problems, a technology that can not only protect the LED digital tube, but also be easy to operate and use. Specifically, there is no method for preparing an LED character display.

Contents of the invention

For the technical defects existing in the prior art, the purpose of the present invention is to provide a preparation method of a LED character display, which protects the chip and diffuses the light source by a protruding structure formed on the outer surface of the chip, including the following steps:

a. The chips used to form LED characters are solidly planted on the circuit board;

b. preparing a perforated steel mesh, and covering the perforated steel mesh on the circuit board;

c. Use fillers to fill the openings on the steel mesh, so that the circuit board forms a protruding structure under the cover of the steel mesh.

Preferably, in the step b, the position, shape and size of the opening are adapted to the position, shape and size of the chip on the circuit board.

Preferably, the step c includes: repeatedly painting the filler on the perforated stencil by means of a brushing device, so that the filler enters the opening and covers the sides and surroundings of the LED character display on the chip.

Preferably, the step c includes: dripping the filling into the perforated stencil through a syringe, so that the filling enters the opening and covers on and around the chip.

Preferably, the step c includes: using a spraying device to spray the filler in the perforated stencil, so that the filler enters the opening and covers on and around the chip.

Preferably, after said step c, the step further includes:

d. Press the circuit board prepared in the step c into the opening direction of the reflection cavity;

e. Paste a diffusion protective film on the outer surface of the reflective cavity;

f. Open the Pin.

Preferably, the reflective cavity is a plastic reflective cover or an isolation cover with character cavity features.

Preferably, the shape of the reflection cavity is any one of rectangle, circle, triangle, trapezoid, regular or irregular curved shape.

Preferably, the shape of the circuit board is any one of rectangle, circle, triangle, trapezoid, regular or irregular curved shape.

Preferably, the filler includes a mixture of epoxy resin or silicone resin or phosphor powder mixed resin.

Preferably, the LED character display displays single-code or multi-code numbers from 0 to 8, arrows, triangles, circles, regular or irregular graphics.

According to another aspect of the present invention, an LED character display includes a circuit board, an LED chip fixed on the outer surface of the circuit board, and a filler protruding from the outer surface of the LED chip.

Preferably, the filler has a thickness of 0.5mm˜1.5mm.

Preferably, a reflective cavity is further included, and the reflective cavity is arranged half-covering the circuit board.

Preferably, a diffusion protection film is also included, and the diffusion protection film is arranged on the outer surface of the reflective cavity.

Preferably, a PIN pin is also included, and the PIN pin is installed on the back of the circuit board.

Beneficial effects of the present invention: the present invention replaces the original glue-filling process of the LED digital tube, protects the LED chip by printing and can use the method of mixing fluorescent powder to make the wrapped blue chip emit white light, which is used in various Characters in form and size show that the present invention implants the chip on the circuit board, covers the circuit board with a steel mesh with corresponding holes, and brushes epoxy resin, silicone grease, and synthetic resin on the steel with a scraper. net, so that the resin can pass through the holes of the stencil and accurately cover the top and surrounding of the chip to play a role of protection and diffusion. The characteristic plastic reflective cover or isolation cover is pressed on the circuit board, so that the light-emitting area can emit light in the reflective cavity, and finally the protective touch and diffusion touch are pasted to beautify the appearance, uniform the luminosity and protect the light-emitting surface. An integrated character display is formed. The display can be 0-8 single code or numbers of various codes, various shapes of arrows, triangles, circles or irregular circles, and the synthesized character reflective devices. The invention has the advantages of simple structure, powerful function, convenient operation, mass production and high commercial value.

Description of drawings

Other characteristics, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

Fig. 1 shows according to the specific embodiment of the present invention, the specific schematic flow chart of the preparation method of a kind of LED character display;

Fig. 2 shows according to the first embodiment of the present invention, a specific flow diagram of a method for preparing an LED character display;

Fig. 3 shows the process structure making figure of a kind of LED character display of the present invention;

Fig. 4 shows a topological diagram of an LED character display in the present invention.

Detailed ways

In order to better clearly express the technical solution of the present invention, the present invention will be further described below in conjunction with the accompanying drawings.

Fig. 1 shows a preparation method according to a specific embodiment of the present invention, which provides a preparation method of an LED character display. The present invention will describe in detail the specific embodiment of the present invention in conjunction with Fig. 1 and Fig. 2, specifically, It protects the chip and diffuses the light source through the protruding structure formed on the outer surface of the chip, including the following steps:

Firstly, enter step S101, the chip for forming LED characters is fixed on the circuit board, further, the chip can be fixed on the circuit board by welding or inserting. Further, the shape of the circuit board is rectangular, but in other embodiments, it can also be any of circular, triangular, trapezoidal, regular or irregular curved shapes, which does not affect the Specific embodiments, and in the embodiment shown in the present invention, it is preferable to use a rectangle to further describe the specific implementation of the present invention, but this does not mean that only one shape and structure of a rectangle can be used, Specifically, specific analysis can be made according to specific situations, and details are not repeated here.

Further, the chips of the LED characters can be MB chips, GB chips, TS chips, AS chips, etc. Each of the above-mentioned chips has different characteristics, and which one is actually used can be determined according to actual needs.

Furthermore, the size of the LED character chip can be designed according to the lighting power actually used by the user. In a preferred embodiment, the LED character display shows power, the larger the size of the LED character chip is.

Then, enter step S102, prepare a perforated steel mesh, and cover the perforated steel mesh on the circuit board, further, the perforated steel mesh prepared in the step S102, the position, shape, The size is adapted to the position, shape and size of the chip on the circuit board.

Finally, enter step S103 to fill the openings on the stencil with fillers, so that the circuit board forms a protruding structure under the cover of the stencil. Usually, after filling with fillers, the fillers will have A certain cooling time, at this time, the cooling process can be accelerated by a certain method, such as drying, increasing the wind speed, etc. Further, the filling includes epoxy resin or silicone grease synthetic resin or fluorescent powder mixed A mixture of resins, further, the mixed resin material mixed with fluorescent powder can make the wrapped blue chip emit white light, meeting the needs of more occasions, usually, blue chips are often used in the prior art as the preparation of LED Character display, but in other embodiments, red, yellow or other colors can also be used, more specifically, after adding phosphor, it will also display white light, which depends on the composition of the phosphor, but It does not affect the specific implementation of the present invention, but more specifically, the finally displayed light is not only white light, but also blue, amber, green, purple, orange, etc., which will not be repeated here.

Those skilled in the art understand that the step S102 can not only be performed after the step S101, but also can be performed before the step S101, that is, the steel mesh is prepared first, and then the chips used to form the LED characters are implanted on the circuit board , which does not affect the specific embodiments of the present invention.

Further, the filling of the openings on the steel mesh with the filler can be achieved in three ways, specifically including:

Method 1: Repeatedly paint the filler on the perforated stencil with the brushing device, so that the filler enters the opening and covers the sides and surroundings of the LED character display on the chip. Further, the method of brushing , means to use a scraper to directly paint the mixture of epoxy resin or silicone resin synthetic resin or phosphor powder mixed resin on the entire surface of the stencil, so that the resin can accurately cover the top and surrounding of the chip through the holes of the stencil.

The second method is to drip the filling into the perforated stencil through the syringe, so that the filling enters the opening and covers the top and surrounding of the chip. Further, the dripping method refers to filling The used epoxy resin or silicone resin synthetic resin or the mixture of fluorescent powder mixed resin is poured into the syringe, and then the resin is dripped into the opening of the perforated steel mesh from the syringe, so that the resin can be accurately covered. on and around the chip.

Method 3: Spray the filler in the perforated stencil with a spraying device, make the filler enter the opening and cover the top and surrounding of the chip. Further, the spraying method refers to the filling with The epoxy resin or silicone resin synthetic resin or phosphor powder mixed resin mixture is poured into the spraying device, and then the resin is sprayed into the openings of the perforated steel mesh by the spraying device, so that the resin can be accurately covered on the chip above and around.

Further, when the circuit board is filled with fillers, the stencil needs to wait for the fillers to solidify before leaving the top of the circuit board. The curing time of the fillers should be based on the ambient temperature when filling. In a preferred embodiment, it generally takes about 6-8 hours to cure at room temperature, and in another preferred embodiment, it can be cured by heating, and the curing time is 15-30 minutes at 80°C.

Fig. 2 shows according to the specific embodiment of the present invention, the specific flowchart of the preparation method of a kind of LED character display, specifically, comprises the following steps:

Those skilled in the art understand that, for the steps S201 to S203, reference may be made to the steps S101 to S103 shown in FIG. 1 , which will not be repeated here.

Immediately after S203, step S204 is also included, pressing the prepared circuit board into the opening direction of the reflective cavity. Further, the prepared circuit board refers to the LED chip that has been soldered or inserted, and filled with The printed circuit board is filled and covered, and the filler has been cured.

Further, the reflective cavity is a plastic reflective cover or isolation cover with character cavity features.

Further, the shape of the reflective cavity is any one of rectangular, circular, triangular, trapezoidal, regular or irregular curved shapes, and further, the shape of the reflective cavity is consistent with the shape of the circuit board , further, in the embodiment shown in the present invention, it is preferable to adopt the shape of the circuit board as a rectangle, and the shape of the reflection cavity is also a rectangle, while in other embodiments, when the circuit board The shape of the reflection cavity is any one of circular, triangular, trapezoidal, regular or irregular curved shapes, and the shape of the reflective cavity can also be circular, triangular, trapezoidal, regular or irregular curved with the same shape as the circuit board Any of the shapes does not affect the specific implementation of the present invention. Specifically, specific analysis can be made according to specific situations, and details will not be repeated here.

Further, the size of the reflection cavity is based on the size of the circuit board it covers, and further, the length and width of the reflection cavity are the length and width of the circuit board it covers.

Furthermore, the main function of the reflective cavity is to collect the light emitted from the side and interface of the die, and emit it in a desired direction angle, so as to improve the utilization rate of LED light.

Then, enter step S205, paste a diffusion protection film on the outer surface of the reflective cavity, the diffusion protection film mainly plays the role of uniform luminosity and protective glue on the light-emitting surface of the characters, and can also beautify the LED characters The role of display appearance,

Further, the material of the diffusion protection film can be the prepared polymer sheet or film of the microlens array. In a preferred embodiment, in order to better diffuse the display range of the character display and protect the use of the LED character display, The thickness of the diffusion protection film can be 0.1 mm, and in other embodiments, the thickness of the diffusion protection film can be adjusted to be thicker or thinner according to actual needs and manufacturing processes.

Further, the size and shape of the diffusion protection film are based on the size and shape of the reflection cavity covered by it. In a preferred embodiment, we can preferentially cut the diffusion protection film into The size and shape of the reflective cavity are the same, and in other embodiments, we can also paste a large piece of diffusion protection film that is larger than the radiation cavity on the reflective cavity, and then cut off the excess part. The specific implementations that affect the present invention will not be repeated here.

Finally, enter step S206, open the Pin needle, further, the Pin needle is "tungsten carbide" material, and the Pin needle is opened on the back of the circuit board, further, the Pin needle is used to connect and complete the electrical connection. transmission of signals.

Further, the size of the Pin may be in the range of φ0.3mm˜φ0.8mm, 0.3*0.5mm˜0.5*0.8mm. And other specifications.

Further, the plurality of arrangement pitches of the Pin needles may be various arrangement pitches such as 1.0 mm˜3.0 mm, 1.0 mm˜5.0 mm, and the like.

Fig. 3 has shown the technological structure making figure of a kind of LED character display of the present invention, the present invention will be described further to the specific embodiment of the present invention in conjunction with Fig. 3 and Fig. 4, and in the present invention, also can have not involved The connecting parts are not shown in the specification and drawings, but this does not mean that the present invention does not have these parts. The present invention preferably shows the important connecting parts of the present invention, which will not be repeated here. Those skilled in the art understand that the specific operation mode is as follows:

In a preferred embodiment, the LED chips 3 are first fixed on the circuit board 4, and then the circuit board 4 is covered with a steel mesh that has been opened through holes corresponding to the LED character light emitting devices, and then the filler 1 is covered with a scraper. Painted on the steel mesh, the filler 1 refers to epoxy resin or silicone-based synthetic resin or a mixture of fluorescent powder mixed resin, etc., so that the filler 1 penetrates the hole of the steel mesh 2 and accurately covers the top of the LED chip 3 And surrounding, play protection and diffusion effect, after curing, then the reflective cavity 5 with character cavity characteristics, the reflective cavity 5 can be plastic reflective cover or isolation board, press on the circuit board 4, make the light-emitting area It can emit light in the light-emitting cavity, and finally paste the diffusion protective film 6 to make the byte light-emitting surface uniform in luminosity and protect the effect of the glue while playing the role of beautifying the appearance, and install the PIN pin 7 on the back of the circuit board 4 to form A full character display. The LED character display can be a single code or each code number of 0-8, various shapes of arrows, triangles, circles or irregular circles, and a character reflective device synthesized.

In another preferred embodiment, after the LED chip 3 is firmly planted on the circuit board 4, those skilled in the art understand that the filler can also be injected into the syringe, and then the filler can be injected through the syringe. 1 Accurately cover above and around the LED chip 3 before proceeding to the next step.

In other embodiments, after the LED chip 3 is firmly planted on the circuit board 4, those skilled in the art understand that the filler can also be injected into the spraying device, and then the filler is sprayed on the top of the LED chip 3 by the spraying device. and around.

Fig. 4 shows the topological diagram of a kind of LED character display of the present invention, those skilled in the art understands, the present invention also provides a kind of LED character display, specifically comprises: circuit board 4, the LED that is solidly planted on the outer surface of circuit board and is arranged The chip 3 , the filler 1 protruding from the outer surface of the LED chip 3 , the reflection cavity 5 , the diffusion protection film 6 , and the PIN pin 7 .

Further, the filler 1 provided on the outer surface of the protruding LED chip 3 is a mixture of epoxy resin or silicone resin synthetic resin or fluorescent powder mixed resin, and the thickness of the filler 1 is 0.5 mm to 1.5 mm. , in a preferred embodiment, the thickness of the filler 1 may be 0.5 mm or 0.6 mm or 1.1 mm, which will not affect the specific implementation of the present invention, and will not be repeated here.

Further, the reflective cavity 5 is half-covered on the circuit board, further, the half-covered means that the reflective cavity only covers the side of the circuit board on which the LED chip is disposed. Further, after the reflective cavity 5 is half covered with the circuit board, the interface between it and the circuit board will be bonded and sealed with resin.

Further, the diffusion protection film 6 is attached to the outer surface of the reflection cavity, and further, the diffusion protection film 6 is specifically attached to the light-transmitting front of the reflection cavity.

Further, the PIN needle 7 is installed on the back of the circuit board 4 .

To sum up the above, in conjunction with Figure 1 and Figure 2, a method for preparing an LED character display is shown. Specifically, in a preferred embodiment, we first plant the LED chips on the circuit board, and then place the LED chips that have been planted on the circuit board. The outer surface of the LED chip is covered with a filler. When the covered filler is cured, the reflective cavity is covered on the circuit board, and a diffusion protective film is pasted on the covered reflective cavity. Finally, a PIN is installed on the back of the circuit board. Pin 7, such an LED character display is completed.

Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art may make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention.

Claims (16)

1. a kind of preparation method of LED alphanumeric displays protects chip simultaneously by the projective structure formed in chip outer surface Spread light source, which is characterized in that include the following steps:

A. the chip for being used to form LED characters is planted admittedly on wiring board;

B. trepanning steel mesh is prepared, and the trepanning steel mesh is covered on the wiring board;

C. aperture segment on filler filling steel mesh is used, the wiring board is made to form projective structure in the case where being detached from steel mesh covering.

2. preparation method according to claim 1, which is characterized in that the position of trepanning, shape, big in the step b It is small to be adapted with the position of the circuit chip on board, shape, size.

3. preparation method according to claim 1, which is characterized in that the step c includes:It will be filled by painting device Object is brushed repeatedly on trepanning steel mesh, so that the filler is entered trepanning and is covered the alphanumeric display sides LED on the chip And surrounding.

4. preparation method according to claim 1, which is characterized in that the step c includes:Filler is dripped by syringe Note makes the filler enter trepanning and is covered in the chip over and around in trepanning steel mesh.

5. preparation method according to claim 1, which is characterized in that the step c includes:It will be filled by spray equipment Object is sprayed in trepanning steel mesh, so that the filler is entered trepanning and is covered in the chip over and around.

6. preparation method according to any one of claim 1 to 5, which is characterized in that after the step c, also wrap Include step:

D. the wiring board prepared in the step c is pressed into reflection cavity opening direction;

E. diffusing protection film is sticked in the outer surface of the reflection cavity;

F. Pin needles are opened.

7. preparation method according to claim 6, which is characterized in that the reflection cavity is the modeling with character cavity feature Expect reflecting cover or isolation lid.

8. preparation method according to claim 7, which is characterized in that the shape of the reflection cavity is rectangle, circle, triangle Any one of shape, trapezoidal, regular or irregular curved shape.

9. according to the preparation method described in any one of claim 1-5 or 7 or 8, which is characterized in that the shape of the wiring board For any one of rectangle, circle, triangle, trapezoidal, regular or irregular curved shape.

10. preparation method according to claim 9, which is characterized in that the filler includes epoxy resin or silica gel silicon The mixture of lipid synthetic resin or fluorescent powder hybrid resin.

11. according to the preparation method described in right 1-5 or 7 or 8 or 10, which is characterized in that in the LED alphanumeric displays are shown Hold the solid size or multi-code number, arrow, triangle, circle, rule or irregular figure for 0~8.

12. a kind of LED alphanumeric displays, which is characterized in that including wiring board, plant the LED core being arranged in wiring board outer surface admittedly The filler of piece, protrusion the LED chip outer surface setting.

13. display according to claim 12, which is characterized in that the thickness of the filler is 0.5mm~1.5mm.

14. display according to claim 12, which is characterized in that further include reflection cavity, the reflection cavity partly coats institute State wiring board setting.

15. requiring the display according to right 12, which is characterized in that further include diffusing protection film, the diffusing protection film It is bonded the reflection cavity outer surface setting.

16. requiring the display according to right 12, which is characterized in that further include PIN needle, the PIN needle is mounted on circuit Back.