CN108668453A - A kind of porous heating component and preparation method thereof - Google Patents
A kind of porous heating component and preparation method thereof Download PDFInfo
- Publication number
- CN108668453A CN108668453A CN201810393763.5A CN201810393763A CN108668453A CN 108668453 A CN108668453 A CN 108668453A CN 201810393763 A CN201810393763 A CN 201810393763A CN 108668453 A CN108668453 A CN 108668453A
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- Prior art keywords
- circuit
- glass
- porous
- slurry
- conductive exothermal
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of porous heating components and preparation method thereof, are included in porous material substrate surface printing the first glass circuit, are then sintered；Conductive exothermal circuit is printed in the first glass circuit surface, is then sintered；The second glass circuit finally is covered in the conductive exothermal circuit surface, is sintered again, obtains porous heating component, also, the power connection end of the conductive exothermal circuit of the porous heating component is drawn by the trepanning of the second glass circuit.Conducting wire preferably can be fixed on porous material surface by the glassy layer in the porous material surface circuit of the present invention, and can prevent damage of the hot-spot to circuit, thus service life when can significantly improve surface lines electrified regulation.
Description
Technical field
The present invention relates to porous material surface printed wire production field, more particularly, to a kind of porous heating component and its
Production method.
Background technology
There are holes, rough on porous material surface such as porous ceramics, directly in surface printing circuit, are easy
It causes circuit to be combined at System of Detecting Surface Defects For Material with porous material poor, causes when circuit electrified regulation works, electrode is from porous
It is detached from the defective locations of material, to cause circuit to disconnect, can not continue to be powered on.
The disclosure of background above technology contents is only used for inventive concept and the technical solution that auxiliary understands the present invention, not
The prior art for necessarily belonging to present patent application, no tangible proof show the above present patent application the applying date
Before have disclosed in the case of, above-mentioned background technology should not be taken to evaluation the application novelty and creativeness.
Invention content
It is a primary object of the present invention to overcome the deficiencies in the prior art, a kind of porous heating component of proposition and its making side
Method, by between conducting wire and porous material surface printed glass circuit make conducting wire and porous material surface to reach
The firm purpose combined, conductor wire Louis falls off from porous material surface during solving the problems, such as fever.
A kind of porous heating component, including porous material substrate, the first glass for being printed in the porous material substrate surface
Glass circuit, the conductive exothermal circuit for being printed in the first glass circuit surface and it is printed in the conductive exothermal circuit surface
The second glass circuit, wherein the power connection end of the conductive exothermal circuit is drawn by the corresponding aperture of the second glass circuit
Go out.
The porous material surface of existing porous material heating device (such as porous ceramics atomization core in electronic cigarette) adds
During heating power, temperature is excessively high to cause circuit to fall off from porous material surface on hot line road, and the present invention provides
Above-mentioned porous heating component, the first glass circuit by conductive exothermal circuit closely, be strongly adhered to porous material table
On face, existing conducting wire is not only solved the problem of adstante febre is easy to fall off, moreover it is possible to prevent hot-spot to circuit
Damage, thus service life when can significantly improve porous material surface conductive exothermal circuit electrified regulation.
The production method that the present invention separately also proposed previous porous heating component, includes the following steps：
Using one first mask plate, first glass circuit described in porous material substrate surface printing, then it is sintered；
The conductive exothermal circuit is printed in the first glass circuit surface using first mask plate, is then burnt
Knot；
The second glass circuit is printed in the conductive exothermal circuit surface, and is reserved on second glass thread road
The trepanning, then sintering obtain the porous heating component.
Since glass and porous material and conducting wire have good caking property, can be remained in circuit heating process
It keeps the height with the two to be combined, prevents from being detached from from porous material surface during circuit heating work, so as to improve circuit
Reliability is heated, service life when product electrified regulation is extended.The present invention can be prepared by the technological process of above-mentioned low cost
The high circuit of heating reliability is obtained, existing porous material surface circuit is overcome and heats asking for easy to fall off, easy high temperature damage
Topic.
Description of the drawings
Fig. 1 is the sectional view for the porous heating component that one embodiment of the invention provides；
Fig. 2 is the production method process flow chart of the porous heating component of the present invention.
Specific implementation mode
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
The specific implementation mode of the present invention provides a kind of porous heating component, with reference to figure 1, the porous heating component packet
It includes porous material substrate 10, the first glass circuit 20 for being printed in 10 surface of the porous material substrate, be printed in described first
The conductive exothermal circuit 30 on 20 surface of glass circuit and the second glass circuit for being printed in 30 surface of conductive exothermal circuit
40；Wherein, the corresponding aperture (not shown) that the power connection end of the conductive exothermal circuit 30 passes through the second glass circuit 40
It draws.Wherein, the first glass circuit 20 and the conductive exothermal circuit 30 are printed to obtain by same mask plate；And second
Glass circuit 40 is transferred to 30 surface of conductive exothermal circuit and obtains after identical mask plate printing, laser boring may be used,
30 surface of conductive exothermal circuit can also be directly printed onto using another mask plate, another mask plate has conductive with printing
The identical line pattern of mask plate to generate heat used in circuit additionally has the patterning to reserve used in the trepanning, i.e.,
It is exactly second with the trepanning directly to come out circuit in 30 surface printing of conductive exothermal circuit using another mask plate
Glass circuit；Alternatively, another mask plate is the slightly smaller circle of outer edge, directly printed in this way in conductive exothermal circuit surface
Glass circuit can a slightly smaller circle (not impact effect), to which the power connection end of conductive exothermal circuit can be exposed.
The porous material substrate 10 of the porous heating component for example can be porous ceramic matrices suitable, such as Woelm Alumina pottery
Porcelain, porous silicon carbide ceramic and porous cordierite ceramic etc. can also be that porous diatomite matrix etc. is without being limited thereto.Described matrix
" porous " on surface is typically micron openings, is also not excluded for being nano-pore.The porous heating component is, for example, the porous pottery of electronic cigarette
Porcelain atomization core.
In addition, the material used in printed glass circuit for example can be soda lime glass, sodium aluminum silicate glass or
Sodium borosilicate glass etc., it is without being limited thereto.
With reference to figure 2, the production method for the porous heating component that previous embodiment provides includes the following steps S1 extremely
S3：
S1, using one first mask plate, first glass circuit described in porous material substrate surface printing, be then sintered
It is sintered with suitable temperature in stove, the first glass circuit is made to be densified.
S2, the conductive exothermal circuit is printed in the first glass circuit surface using first mask plate, then
It is sintered with suitable temperature in sintering furnace, makes the conductive exothermal circuit densification.Conductive exothermal circuit is printed in this step
Slurry used for example can be silver paste, silver-colored platinum slurry, silver-colored palladium slurry, nickel slurry, Aludirome slurry, tungsten slurry, gold paste, platinum slurry, nickel chromium triangle
The conductive pastes such as slurry or electric resistance of stainless slurry, wherein electric resistance of stainless slurry e.g. iron-nickel-chromium slurry.
S3, the second glass circuit is printed in the conductive exothermal circuit surface, and on second glass thread road
The trepanning is reserved, then sintering obtains the porous heating component.The conductive exothermal circuit surface is covered in this step
The second glass circuit, the mode directly printed may be used, can also using transfer by the way of.Covering when directly printing
Diaphragm plate must satisfy " power connection end that the conductive exothermal circuit can be exposed after printing "；The mode of transfer then can be used directly
First mask plate is to print out individual glass line pattern, then beats individual glass line pattern progress laser
Then hole is transferred to the surface of the conductive exothermal circuit again.
The above-mentioned production method of the present invention is illustrated below by five specific embodiments.
Embodiment 1
1.1, the 500 mesh expanded metal laths made is taken directly to exist using silk-screen mode using borosilicic acid system glass paste as raw material
Porous alumina ceramic material surface prints the first glass circuit, is then sintered in net strip sintering furnace, under air atmosphere,
Sintering temperature is 850 DEG C, when heat preservation a length of 15min, the porous plate sample of the first glass circuit with densification is obtained after coming out of the stove
Product；
1.2, it using same Printing screen (being equivalent to mask plate), is printed on the porous plate sample made by above-mentioned 1.1
Brush conductive pattern (uses silver paste), is then sintered in net strip sintering furnace, under air atmosphere, and sintering temperature is 850 DEG C, is protected
A length of 30min when warm obtains the porous plate sample with densification conductive exothermal circuit and glass circuit after coming out of the stove；
1.3, by it is above-mentioned 1.2 gained porous plate sample, take transfer film in a manner of transferring by laser opening,
Glass line pattern identical with the first glass circuit is equably covered in the conductive exothermal circuit surface, is then burnt in guipure
Be sintered in freezing of a furnace, under air atmosphere, sintering temperature is 850 DEG C, when heat preservation a length of 15min, surface is obtained after coming out of the stove and is had
There is the porous material circuit product of glass-conductive layer-glass pattern covering.
Embodiment 2
2.1, the 500 mesh expanded metal laths made is taken directly to exist using silk-screen mode using borosilicic acid system glass paste as raw material
Porous silicon carbide ceramic material surface prints the first glass circuit, is then sintered in net strip sintering furnace, under air atmosphere,
Sintering temperature is 850 DEG C, when heat preservation a length of 15min, the porous plate sample of the first glass circuit with densification is obtained after coming out of the stove
Product；
2.2, it using same Printing screen (being equivalent to mask plate), is printed on the porous plate sample made by above-mentioned 2.1
Brush conductive pattern (uses Ag9Pd1Electrocondution slurry), it is then sintered in net strip sintering furnace, under air atmosphere, sintering temperature
Be 850 DEG C, when heat preservation a length of 30min, the porous plate sample with densification conductive exothermal circuit and glass circuit is obtained after coming out of the stove
Product；
2.3, by it is above-mentioned 2.2 gained porous plate sample, take transfer film in a manner of transferring by laser opening,
Glass line pattern identical with the first glass circuit is equably covered in the conductive exothermal circuit surface, is then burnt in guipure
Be sintered in freezing of a furnace, under air atmosphere, sintering temperature is 850 DEG C, when heat preservation a length of 15min, surface is obtained after coming out of the stove and is had
There is the porous material circuit product of glass-conductive layer-glass pattern covering.
Embodiment 3
3.1, the 500 mesh expanded metal laths made is taken directly to exist using silk-screen mode using manosil AS system glass paste as raw material
Porous cordierite material surface prints the first glass circuit, is then sintered in net strip sintering furnace, under air atmosphere, is sintered
Temperature is 860 DEG C, when heat preservation a length of 15min, the porous plate sample of the first glass circuit with densification is obtained after coming out of the stove；
3.2, it using same Printing screen (being equivalent to mask plate), is printed on the porous plate sample made by above-mentioned 3.1
Brush conductive pattern (is starched) using silver-colored platinum, is then sintered in net strip sintering furnace, under air atmosphere, and sintering temperature is 860 DEG C,
A length of 30min when heat preservation obtains the porous plate sample with densification conductive exothermal circuit and glass circuit after coming out of the stove；
3.3, by it is above-mentioned 3.2 gained porous plate sample, take transfer film in a manner of transferring by laser opening,
Glass line pattern identical with the first glass circuit is equably covered in the conductive exothermal circuit surface, is then burnt in guipure
Be sintered in freezing of a furnace, under air atmosphere, sintering temperature is 860 DEG C, when heat preservation a length of 15min, surface is obtained after coming out of the stove and is had
There is the porous material circuit product of glass-conductive layer-glass pattern covering.
Embodiment 4
4.1, the 500 mesh expanded metal laths made is taken directly to exist using silk-screen mode using manosil AS system glass paste as raw material
Porous diatomite material surface prints the first glass circuit, is then sintered in net strip sintering furnace, under air atmosphere, is sintered
Temperature is 860 DEG C, when heat preservation a length of 15min, the porous plate sample of the first glass circuit with densification is obtained after coming out of the stove；
4.2, it using same Printing screen (being equivalent to mask plate), is printed on the porous plate sample made by above-mentioned 4.1
Brush conductive pattern (is starched) using Aludirome, is then sintered in net strip sintering furnace, under air atmosphere, sintering temperature is
860 DEG C, when heat preservation a length of 30min, the porous plate sample with densification conductive exothermal circuit and glass circuit is obtained after coming out of the stove；
4.3, by it is above-mentioned 4.2 gained porous plate sample, take transfer film in a manner of transferring by laser opening,
Glass line pattern identical with the first glass circuit is equably covered in the conductive exothermal circuit surface, is then burnt in guipure
Be sintered in freezing of a furnace, under air atmosphere, sintering temperature is 860 DEG C, when heat preservation a length of 15min, surface is obtained after coming out of the stove and is had
There is the porous material circuit product of glass-conductive layer-glass pattern covering.
Embodiment 5
5.1, the 500 mesh expanded metal laths made is taken directly to exist using silk-screen mode using calcium silicic acid system's glass paste as raw material
Porous alumina ceramic surface printing the first glass circuit, is then sintered in net strip sintering furnace, under air atmosphere, sintering
Temperature is 800 DEG C, when heat preservation a length of 15min, the porous plate sample of the first glass circuit with densification is obtained after coming out of the stove；
5.2, it using same Printing screen (being equivalent to mask plate), is printed on the porous plate sample made by above-mentioned 5.1
Brush conductive pattern (uses Ag7Pd3Electrocondution slurry), it is then sintered in net strip sintering furnace, under air atmosphere, sintering temperature
Be 880 DEG C, when heat preservation a length of 30min, the porous plate sample with densification conductive exothermal circuit and glass circuit is obtained after coming out of the stove
Product；
5.3, by it is above-mentioned 5.2 gained porous plate sample, take transfer film in a manner of transferring by laser opening,
Glass line pattern identical with the first glass circuit is equably covered in the conductive exothermal circuit surface, is then burnt in guipure
Be sintered in freezing of a furnace, under air atmosphere, sintering temperature is 880 DEG C, when heat preservation a length of 15min, surface is obtained after coming out of the stove and is had
There is the porous material circuit product of glass-conductive layer-glass pattern covering.
Porous material circuit product obtained by Example 1 carries out rush of current experiment, sample under DC constant voltage power supply
The results are shown in Table 1 for product testing performance index, while the performance of the same race that the product for not using glass circuit is also appended in table 1 refers to
Mark, comparing result are as follows：
Table 1
It can be seen that the prepared porous material surface circuit of production method of the present invention by the data of above-mentioned table 1
Product, in the cycled on fever course of work, the circuit of porous material surface can still work normally, and have very strong heating can
By property；Contrast sample is reviewed, since conducting wire is directly printed on porous material surface, is bonded not firm, heating power process
Middle circuit, which falls off, to be caused to open a way.As it can be seen that the glassy layer in the porous material surface circuit of the present invention can be preferably by conducting wire
It is fixed on porous material surface, and damage of the hot-spot to circuit can be prevented, thus surface lines can be significantly improved and be powered and added
Service life when hot.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For those skilled in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, several equivalent substitute or obvious modifications can also be made, and performance or use is identical, all answered
When being considered as belonging to protection scope of the present invention.
Claims (8)
1. a kind of porous heating component, it is characterised in that：Including porous material substrate (10), it is printed in the porous material substrate
The first glass circuit (20) on surface is printed in the conductive exothermal circuit (30) of the first glass circuit surface and is printed in
The second glass circuit (40) on conductive exothermal circuit (30) surface, wherein the power connection end of the conductive exothermal circuit (30)
It is drawn by the corresponding aperture of the second glass circuit.
2. porous heating component as described in claim 1, it is characterised in that：The first glass circuit (20) and the conduction
Fever circuit (30) is printed to obtain by same mask plate.
3. porous heating component as described in claim 1, it is characterised in that：The porous material substrate (10) is porous oxidation
Aluminum substrate, porous silicon carbide silicon substrate, porous cordierite matrix or porous diatomite matrix.
4. porous heating component as described in claim 1, it is characterised in that：The first glass circuit and second glass
Glass material used in circuit is soda lime glass, sodium aluminum silicate glass or sodium borosilicate glass.
5. such as the production method of the porous heating component of Claims 1-4 any one of them, which is characterized in that including following step
Suddenly：
Using one first mask plate, first glass circuit described in porous material substrate surface printing, then it is sintered；
The conductive exothermal circuit is printed in the first glass circuit surface using first mask plate, is then sintered；
The second glass circuit is printed in the conductive exothermal circuit surface, and reserved described on second glass thread road
Trepanning, then sintering obtain the porous heating component.
6. production method as claimed in claim 5, it is characterised in that：The second glass circuit is to use one second mask plate
It is directly printed onto the conductive exothermal circuit surface, wherein second mask plate has identical with first mask plate
Line pattern also has patterning corresponding with the trepanning, to reserve the trepanning in printing.
7. production method as claimed in claim 5, it is characterised in that：The manufacturing process of the second glass circuit includes：First
It prints to obtain independent circuit using first mask plate, then the trepanning is made on the independent circuit, finally by trepanning
The independent circuit be transferred to the conductive exothermal circuit surface, obtain the second glass circuit.
8. production method as claimed in claim 5, it is characterised in that：It is silver to print the slurry used in the conductive exothermal circuit
Slurry, silver-colored platinum slurry, silver-colored palladium slurry, nickel slurry, Aludirome slurry, nickel chromium triangle slurry, tungsten slurry, gold paste, platinum slurry or electric resistance of stainless slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810393763.5A CN108668453A (en) | 2018-04-27 | 2018-04-27 | A kind of porous heating component and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810393763.5A CN108668453A (en) | 2018-04-27 | 2018-04-27 | A kind of porous heating component and preparation method thereof |
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| Publication Number | Publication Date |
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| CN108668453A true CN108668453A (en) | 2018-10-16 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810393763.5A Pending CN108668453A (en) | 2018-04-27 | 2018-04-27 | A kind of porous heating component and preparation method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413772A (en) * | 2018-10-25 | 2019-03-01 | 深圳顺络电子股份有限公司 | A kind of porous heating component of high thermal efficiency and preparation method thereof |
| CN109832673A (en) * | 2019-02-27 | 2019-06-04 | 深圳市合元科技有限公司 | Electronic smoke atomizer, electronic cigarette, atomizing component and preparation method thereof |
| CN110037351A (en) * | 2019-04-30 | 2019-07-23 | 深圳陶陶科技有限公司 | The preparation method of tobacco tar atomizer |
| CN110477463A (en) * | 2019-09-11 | 2019-11-22 | 深圳市博迪科技开发有限公司 | A kind of cellular glass atomising device and the electronic cigarette comprising it |
| CN113142665A (en) * | 2021-04-20 | 2021-07-23 | 潘付强 | Atomization component sintering method for electronic cigarette |
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| EP2866534A1 (en) * | 2012-06-21 | 2015-04-29 | Kyocera Corporation | Circuit board and electronic apparatus provided with same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413772A (en) * | 2018-10-25 | 2019-03-01 | 深圳顺络电子股份有限公司 | A kind of porous heating component of high thermal efficiency and preparation method thereof |
| CN109832673A (en) * | 2019-02-27 | 2019-06-04 | 深圳市合元科技有限公司 | Electronic smoke atomizer, electronic cigarette, atomizing component and preparation method thereof |
| CN110037351A (en) * | 2019-04-30 | 2019-07-23 | 深圳陶陶科技有限公司 | The preparation method of tobacco tar atomizer |
| CN110477463A (en) * | 2019-09-11 | 2019-11-22 | 深圳市博迪科技开发有限公司 | A kind of cellular glass atomising device and the electronic cigarette comprising it |
| CN113142665A (en) * | 2021-04-20 | 2021-07-23 | 潘付强 | Atomization component sintering method for electronic cigarette |
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