CN108667991B - Housing assembly and electronic device - Google Patents

Abstract

The application discloses casing subassembly, this casing subassembly includes: the shell is provided with a heat dissipation area; the shielding cover is connected to the shell through a circuit board and comprises a plurality of connecting plates, and the connecting plates are surrounded to form accommodating cavities; the chip is arranged in the accommodating cavity; the heat pipe comprises a receiving part and an extending part, wherein the receiving part is at least one connecting plate in the shielding cover, and the extending part is at least partially positioned on the shell and extends to the heat dissipation area towards the direction away from the chip, so that heat emitted by the chip is transferred to the extending part through the receiving part and is transferred to the heat dissipation area through the extending part. By adopting the structure, the heat generated by the chip can be directly transmitted to the receiving part, transmitted to the extending part by the receiving part and transmitted to the radiating area by the extending part, and then the heat generated by the chip is dispersed to the radiating area with lower temperature, so that the problem that the temperature of the position where the chip is arranged is locally too high is solved. The application also provides an electronic device comprising the shell assembly.

Description

Housing assembly and electronic device

technical field

The present application relates to the technical field of structural design, and in particular, to a housing assembly and an electronic device.

Background technique

With the continuous development of technology, electronic devices such as mobile phones have more and more functions, so that when the electronic device runs some functions or multiple functions at the same time, the operating frequency of the chip is getting higher and higher, which makes it easier to install the chip. The location temperature is locally high.

SUMMARY OF THE INVENTION

Aiming at the technical problem that electronic devices such as mobile phones are prone to high local temperature at the location where the chip is arranged, the present application provides a housing assembly and an electronic device.

A technical solution adopted in the present application is to provide a housing assembly, which includes:

a casing, a heat dissipation area is formed on the casing;

The shielding cover is connected to the casing through a circuit board, the shielding cover includes a plurality of connecting plates, and the plurality of the connecting plates are surrounded to form an accommodating cavity;

a chip, the chip is arranged in the accommodating cavity;

a heat pipe, the heat pipe includes a receiving part and an extending part, the receiving part is at least one connecting plate in the shielding cover, the extending part is at least partially located on the casing and extends away from the chip to the the heat dissipation area, so that the heat emitted by the chip is transferred to the extension part by the receiving part, and then transferred to the heat dissipation area by the extension part.

The present application also provides an electronic device including the above-described housing assembly.

The housing assembly and electronic device in the present application include a housing, a chip arranged on the housing through a circuit board, and a shielding cover, a heat dissipation area is formed on the housing, and the shielding cover includes a plurality of connecting plates, and the plurality of connecting plates are surrounded to form An accommodating cavity, and the chip is located in the accommodating cavity. The heat pipe includes a receiving part and an extending part, wherein the receiving part is a connecting plate in the shielding case, so that the heat pipe is in direct contact with the chip. At the same time, the extension part is located on the casing and extends to the heat dissipation area in the direction away from the chip, so that the heat generated by the chip can be directly transferred to the receiving part, and then transferred from the receiving part to the extension part, from the extension part to the heat dissipation area, and then the chip generates heat. The heat is dissipated to the heat dissipation area with lower temperature, so as to improve the problem that the temperature of the chip is set to be too high locally.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device of the present application;

FIG. 2 is a schematic diagram of the distribution structure of the main components of the housing assembly in an embodiment of the present application;

FIG. 3 is a partial cross-sectional structural diagram of the casing assembly in the thickness direction in an embodiment of the present application;

4 is a schematic diagram of the distribution structure of the main components of the housing assembly in another embodiment of the present application;

5 is a schematic structural diagram of the bottom of a battery compartment in an embodiment of the present application;

6 is a schematic diagram of the distribution structure of the main components of the housing assembly in another embodiment of the present application;

FIG. 7 is a schematic diagram of the distribution structure of the main components of the housing assembly in still another embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all the structures related to the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", "third" may expressly or implicitly include at least one of that feature. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear...) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings). , motion situation, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes For other steps or units inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

Referring to FIG. 1 to FIG. 3 , the housing assembly 100 and the electronic device 200 provided by the present application are mainly used to transfer the heat generated by the chip to a lower temperature area or an area conducive to heat dissipation, so as to improve the local temperature excess at the location where the chip is arranged. high situation. The housing assembly 100 includes a housing 10 , a shield 20 connected to the housing 10 through a circuit board, a chip 30 located in the shield 20 , and a heat pipe 40 connected to the chip 30 .

Specifically, in one embodiment, the housing 10 is used as a carrier to carry a glass cover plate, a display screen, a circuit board, and many electronic components of the electronic device 200 . Specifically, in different embodiments, the casing 10 may be one of the middle frame, the battery cover or the front casing of the electronic device 200 , which is not specifically limited. A heat dissipation area is formed on the housing 10 . Specifically, the heat dissipation area is an area that does not generate heat, or generates less heat, or is conducive to heat dissipation, which will be illustrated by different embodiments below.

The shielding cover 20 is connected to the housing 10 through the circuit board 50 . The shielding cover 20 includes a plurality of connecting plates 22 , and the plurality of connecting plates 22 are surrounded to form an accommodating cavity 24 , and the chip 30 is disposed in the accommodating cavity 24 . It can be understood that the chip 30 includes a CPU processor, a gpu processor or audio processing, etc. Therefore, when the chip 30 is working, the operating frequency of the chip 30 will be adjusted according to different working scenarios, such as online games and online videos. Different operating frequencies and multiplications of the operating frequencies may interfere with the communication signal of the antenna. Therefore, a shielding cover 20 needs to be provided, and the chip 30 is arranged in the shielding cover 20 . In one embodiment, the accommodating cavity 24 in the shielding cover 20 is a closed space to achieve the best possible shielding effect. In other embodiments, some slot holes may also be opened on the shielding cover 20 for accommodating components such as capacitors. Specifically, in different embodiments, the shielding case 20 formed by the plurality of connecting plates 22 is a rectangular parallelepiped, a prism, or other irregular shapes, which are not specifically limited.

The heat pipe 40 is used to partially transfer the heat generated by the chip 30 to the heat dissipation area. Specifically, in this embodiment, the heat pipe 40 includes a receiving portion 42 and an extending portion 44 , and the receiving portion 42 is at least one connecting plate 22 in the shielding case 20 . Therefore, the receiving portion 42 of the heat pipe 40 is directly in contact with the chip 30 or very close to the chip 30 , so that the heat generated by the chip 30 can be quickly transferred to the receiving portion 42 . The extension portion 44 is at least partially located on the housing 10 and extends to the heat dissipation area away from the chip 30 , so that the heat emitted by the chip 30 is transferred to the extension portion 44 through the receiving portion 42 , and is transferred to the heat dissipation area by the extension portion 44 . Specifically, in one implementation, an accommodating groove (not shown) is formed on the housing 10 , the accommodating groove forms a path of the extension 44 from the position of the chip 30 to the position of the heat dissipation area, and the extension 44 of the heat pipe 40 is disposed in the accommodating groove middle.

With this structural design, the receiving portion 42 of the heat pipe 40 is used as a part of the shielding case 20, so that the heat generated by the chip 30 can be directly transferred to the heat pipe 40, so that the heat generated by the chip can be transferred to the heat pipe 40 faster and more. The heat pipe 40 is transferred to the heat dissipation area.

Specifically, in one implementation, the receiving portion 42 is the part of the shielding case 20 parallel to the chip 30 , that is, the bottom or the top of the shielding case 20 . Such an arrangement can maximize the contact area between the heat pipe 40 and the chip 30 or an area close to the chip 30 , so that the heat generated by the chip 30 can be transferred to the heat pipe 40 faster and more. Specifically, the present application defines the connection plate 22 in the shield 20 that is parallel to the plane of the chip 30 as the bottom and the top, the bottom is the connection plate 22 close to the display screen of the electronic device, and the top is the connection plate 22 disposed away from the display screen relative to the bottom. The bottom and top connecting plates 22 are the side walls of the shielding case 20 .

In other embodiments, the receiving portion 42 includes a plurality of parts, which are respectively a plurality of connecting plates 22 in the shielding case 20 . For example, the top and bottom of the shielding case 20 are both the receiving portion 42 , or the top of the shielding case 20 is the receiving portion 42 . One of the bottom and the entire side wall (or a part of the side wall) of the shielding case is the receiving portion. Further, the area where the heat pipe 40 is in contact with or close to the chip 30 is greatly increased, so that more heat does not need to be transferred to the heat pipe 40 through the part of the shield 20 that is not formed by the receiving portion 42, but the chip 30 generates heat and directly reaches the heat pipe 40. The receiving portion 42 of the heat pipe 40 .

In one embodiment, all the connecting plates 22 in the shielding cover 20 are the receiving portions 42 of the heat pipes 40 , that is, the entire shielding cover 20 is made of the receiving portions 42 of the heat pipes 40 , and the entire shielding cover 20 is a part of the heat pipes 40 . In turn, the heat generated by the chip 30 is quickly transferred to the receiving portion 42 of the heat pipe 40 , and is transferred to other regions on the housing 10 where the temperature is lower by the extension portion 44 of the heat pipe 40 .

Taking the case 10 as the middle frame of the mobile phone as an example, the case 10 is provided with a battery compartment 14 for arranging batteries, and the heat dissipation area is at least a part of the location of the battery compartment 14 . Specifically, in one embodiment, the battery compartment 14 includes a compartment bottom 142, and a part of the compartment bottom 142 away from the battery is removed to make the compartment bottom 142 thinner to form a heat dissipation area on the side of the compartment bottom 142 away from the battery. Alternatively, a part of the bottom 142 of the compartment is removed to form a through groove 1422 (as shown in FIG. 5 ) that communicates with the battery compartment 14 to form a heat dissipation area. On the one hand, the battery only generates heat when it is being charged. On the other hand, the corresponding position of the battery compartment has a large area, which provides favorable conditions for forming a large heat dissipation area. In this embodiment, the extending portion 44 extends from the receiving portion 42 away from the chip 30 to the side of the battery compartment 14 away from the battery, so that at least part of the heat generated by the chip 30 can be transferred to the position corresponding to the battery compartment 14 through the heat pipe 40 , improving the arrangement of the chip The temperature at the 30 position is locally too high.

Further, in one embodiment, the end of the extension portion 44 includes an extension portion 442 to increase the area of the heat pipe 40 in the heat dissipation area, so that the heat can be more uniformly dissipated in the heat dissipation area of the battery compartment 14 . That is, in this embodiment, the middle part of the heat pipe 40 is in the shape of a long strip, and the area of both ends of the heat pipe is significantly larger than the area of the middle part of the heat pipe 40 . For example, the expanded portion 442 of the heat pipe 40 is in the shape of a sheet, or a curved and encircling structure, as shown in FIG. 4 . Optionally, in one embodiment, the area of the expanded portion 442 in the form of a sheet is equivalent to the area of the bin bottom 142 . In another embodiment, a plurality of through slots 1422 are formed on the warehouse bottom 142, so that the warehouse bottom 142 forms a hollow structure. As shown in FIG. Set in the through groove 1422 .

Furthermore, in order to improve the situation that the heat generated by the chip 30 is transferred to the battery during the use of the electronic device 200 while being charged, resulting in the battery overheating and reducing the charging speed. An insulating layer 70 is provided between the heat pipe 40 and the battery, as shown in FIG. 3 . The specific heat insulating layer 70 is located on the side of the bin bottom 142 away from the battery, and is sandwiched between the expansion part 442 and the bin bottom 142 . Optionally, in different embodiments, the heat insulating layer 70 may be foam cotton, glass wool, or high-silica cotton, etc., which is not specifically limited.

In one embodiment, the heat insulating layer 70 is a hollow structure. With such a structure, when the battery is charged, the heat generated by the battery can also be dissipated through the hollowed-out part.

Referring to FIG. 6 , in another embodiment, the heat dissipation area is the side of the casing 10 , and specifically, the casing is a front casing or a middle frame. The casing 10 is rectangular and has two long sides 16 . Therefore, in this embodiment, the heat generated by the chip 30 is transferred to the sides 16 of the casing 10 through the heat pipe 40 , thereby improving the local high temperature at the location where the chip 30 is disposed. The problem.

Further, the extension portion 44 includes a transition section 444 that transitions from the chip 30 to the side of the casing 10 , and a contact section 446 that is disposed in contact with the side 16 of the casing 10 . Therefore, the heat generated by the chip 30 is transferred to the position of the side 16 of the casing 10 through the close contact between the contact section 446 and the side 16 of the casing 10 to disperse part of the heat generated by the chip 30 .

In one embodiment, when the side 16 of the casing 10 is very close to the battery, in order to improve the process of using the electronic device 200 while charging, the heat generated by the chip 30 is transferred to the battery, causing the battery to overheat and reduce the charging speed. Happening. Located at the side 16 of the casing 10, an insulating layer 70 is provided between the heat pipe 40 and the battery. Specifically, the insulating layer 70 is a long strip and is located between the contact section 446 and the battery.

Referring to FIG. 7 , in another embodiment, a SIM card area 18 is provided on the casing 10 for setting the SIM card. Specifically, the SIM card is set on the circuit board through a card holder (not shown), and then set on the casing 10 through the circuit board. Specifically, the area where the SIM card is set is the SIM card area 18. Since the SIM card does not generate heat during use, the position of the SIM card area relative to the setting of the chip is a low temperature area. In this embodiment, the extending body 44 extends away from the chip 30 to the area where the SIM card is disposed, so that part of the heat generated by the chip 30 can be transferred to the SIM card area 18 for dispersion. Optionally, an extension portion 442 is formed at the end of the extension portion 44, and the extension portion 442 is fitted with the SIM card or the card holder, so as to increase the area of the heat pipe 40 in the SIM card area, thereby allowing more heat to be transferred to the sub-SIM card. Location. Specifically, the expansion portion 442 may be a sheet-like or curved and encircling structure, or a hollow structure, which is not specifically limited.

In other embodiments, the heat dissipation area may also be a rear case (not shown), or other clearance areas of the electronic device 200, which are not specifically limited.

In one embodiment, the extension portion 44 of the heat pipe 40 may simultaneously extend to the side edge 16 of the housing 10 , at least a partial area of the battery compartment 14 , or at least two areas of the SIM card area 18 , etc. . In turn, the heat generated by the chip 30 can be shared by a plurality of different regions at the same time.

The electronic device 200 provided in the present application includes the housing assembly 100 described in any of the above embodiments. In different embodiments, the electronic device 200 may be any one of a plurality of electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, and other media players. music recorders, video recorders, cameras, other media recorders, radios, medical equipment, calculators, programmable remote controls, pagers, netbook computers, personal digital assistants (PDAs), portable multimedia players (PMPs), moving images Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices and digital cameras and combinations thereof.

Continuing to refer to FIG. 1 to FIG. 3 , in one embodiment, the electronic device 200 further includes a display screen 210 , the display screen 210 is disposed on the casing 10 , and the display screen 210 serves as an interface for the electronic device 200 to interact with the user for displaying pictures or videos, etc. It can be understood that the display screen 210 also generates heat during use. In order to reduce the heat transfer to the front of the electronic device 200, the user's touch feeling is affected. In this embodiment, a graphite layer 80 is further arranged between the display screen 210 and the casing 10 , and the setting of the graphite layer 80 can dissipate the heat generated by the display screen 210 to the side close to the casing 10 as much as possible.

It can be understood that the area of the graphite layer 80 may be as large as that of the display screen 210 , or the graphite layer 80 may only be provided at a partial position, which is not specifically limited. Further, since it is difficult to ensure that the surface of the heat pipe 40 adjacent to the display screen 210 is flat and uniform, if the heat pipe 40 is in direct contact with the graphite layer 80 , the graphite layer 80 may be uneven, which may affect the display effect of the display screen 210 . Therefore, in this embodiment, the graphite layer 80 and the extension portion 44 of the heat pipe 40 are arranged at intervals. Specifically, a gap is provided between the graphite layer 80 and the heat pipe 40 , or a thin plate 90 is reserved on the casing 10 to separate the graphite layer 80 and the extension portion 44 of the heat pipe 40 .

The housing assembly 100 and the electronic device 200 of the present application use a heat pipe to replace a part of the shielding case 20 , so that the heat generated by the chip 30 can be directly and quickly transferred to the receiving portion 42 of the heat pipe 40 , and is transferred from the extension portion 44 of the heat pipe 40 to other parts of the heat pipe 40 . The area that generates heat, or generates less heat, or is conducive to heat dissipation. In this way, the heat generated by the chip 30 can be dispersed to the low temperature region, so as to prevent the temperature at the location where the chip 30 is set from being locally too high.

The above description is only an embodiment of the present application, and is not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims (11)

1. A housing assembly, comprising:

the shell is provided with a heat dissipation area;

the shielding cover is connected to the shell through a circuit board and comprises a plurality of connecting plates, and the connecting plates are surrounded to form accommodating cavities;

the chip is arranged in the accommodating cavity;

the heat pipe, the heat pipe includes receiving part and extension, and wherein whole shield cover does the receiving part, the shield cover is a part of heat pipe, just the receiving part with chip direct contact, the chip quilt the receiving part parcel, the extension is at least partially located on the casing and towards keeping away from the chip direction extends to the radiating area, makes the heat that the chip sent with the help of the receiving part transfer extremely the extension, and by the extension transfer extremely the radiating area.

2. The housing assembly of claim 1, wherein the heat dissipation area is a side of the housing; or the shell is provided with a battery compartment, and the heat dissipation area is at least a partial area of the position of the battery compartment; or an SIM card area is arranged on the shell, and the heat dissipation area is the SIM card area.

3. The housing assembly of claim 2, wherein when the heat dissipation region is at least a portion of the SIM card region or the battery compartment, the end of the extension includes an extension to increase the area of the end of the extension in the SIM card region or the battery compartment.

4. The housing assembly of claim 3, wherein the extension is a sheet or curved surround structure.

5. The housing assembly of claim 2, further comprising a battery disposed on the housing, wherein when the heat dissipation region is a battery compartment or a side of the housing, a thermal insulation layer is disposed between the heat pipe and the battery.

6. The housing assembly of claim 5, wherein the insulation layer is a hollowed-out structure.

7. The housing assembly of claim 2, wherein when the heat dissipation area is a side of the housing, the extension portion comprises a transition section connected to the chip and a contact section connected to the transition section and disposed on the side of the housing.

8. The housing assembly of claim 1, wherein the housing defines a receiving cavity, and the extension portion of the heat pipe is disposed in the receiving cavity.

9. An electronic device comprising the housing assembly of any one of claims 1-8.

10. The electronic device of claim 9, further comprising a display screen disposed on the housing, wherein a graphite layer is disposed between the display screen and the housing.

11. The electronic device of claim 10, wherein the graphite layer is spaced apart from the extension of the heat pipe.

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