CN108666012A - A kind of nano conductive film and preparation method thereof - Google Patents
A kind of nano conductive film and preparation method thereof Download PDFInfo
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- CN108666012A CN108666012A CN201810292308.6A CN201810292308A CN108666012A CN 108666012 A CN108666012 A CN 108666012A CN 201810292308 A CN201810292308 A CN 201810292308A CN 108666012 A CN108666012 A CN 108666012A
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- Prior art keywords
- conductive
- conductive film
- nano
- film substrate
- film
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 claims abstract description 32
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 25
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 25
- 238000010422 painting Methods 0.000 claims abstract description 24
- 238000013007 heat curing Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000001723 curing Methods 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000010426 asphalt Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims 1
- 239000002071 nanotube Substances 0.000 claims 1
- 239000010408 film Substances 0.000 abstract description 72
- 238000000034 method Methods 0.000 abstract description 5
- 239000002800 charge carrier Substances 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 3
- 238000011031 large-scale manufacturing process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 16
- 239000002344 surface layer Substances 0.000 description 5
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 organic siliconresin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to thin film technique fields, and more particularly to a kind of nano conductive film and preparation method thereof, the nano conductive film, including film substrate and painting are formed on the conductive layer on film substrate surface；Conductive layer is made of hot setting adhesive and carbon nanotube.Since conductive layer is made of hot setting adhesive and carbon nanotube, the excessive concentration of electric charge carrier can be avoided, and then improves the transparency of the conductive film, and can guarantee its good conductivity.The preparation method of the nano conductive film, including step 1 prepare conductive；Step 2, ultrasonic disperse；Conductive painting is formed on film substrate by step 3；Step 4, heat cure.The preparation method of the nano conductive film have method it is simple, production cost is low, and can be suitable for large-scale production the characteristics of.
Description
Technical field
The present invention relates to thin film technique fields, more particularly to a kind of nano conductive film and preparation method thereof.
Background technology
Transparent conductive film is often used as the transparent electrode or electromagnetism wave screen of liquid crystal display, transparent touch formula panel etc.
Cover material.Currently, generally use vacuum evaporation or magnetron sputtering mode prepare transparent conductive material tin indium oxide (ITO)
Conductive film is formed on film substrate to be applied to liquid crystal display, transparent touch formula panel etc..
The main characteristic of carbon nanotube is the conduction of its electricity and optically transparent combination.However, using vacuum evaporation or
Magnetron sputtering mode prepares transparent conductive material carbon nanotube (ITO) on film substrate, and the concentration of electric charge carrier is higher,
Although the conductivity of material can be increased, its transparency can be reduced.Therefore, there is an urgent need for seek new method to prepare conductive thin
Film.
Invention content
It, should it is an object of the present invention to providing a kind of nano conductive film aiming at the deficiencies in the prior art
The transparency of nano conductive film is high, and can guarantee its good conductivity.
The second object of the present invention is to provide a kind of nano conductive film aiming at the deficiencies in the prior art
The transparency of preparation method, the nano conductive film obtained by the preparation method of the nano conductive film is high, and can guarantee that its is good
Good conductivity.
One of in order to achieve the above objectives, the present invention is achieved through the following technical solutions.
A kind of nano conductive film is provided, including film substrate and painting are formed on the conductive layer on the film substrate surface；
The conductive layer is made of hot setting adhesive and carbon nanotube.
The weight ratio of the hot setting adhesive and the carbon nanotube is 1:1~10.
The hot setting adhesive be epoxy resin, organic siliconresin, polyimide resin, phenolic resin, polyurethane or
One kind in acrylic resin or arbitrary two or more composition.
The thickness of the conductive layer is set as 0.5 μm~5 μm.
In order to achieve the above objectives two, the present invention is achieved through the following technical solutions.
A kind of preparation method of nano conductive film is provided, it includes the following steps：
Step 1 prepares conductive：Carbon nanotube is added in hot setting adhesive, and is stirred evenly, is obtained
Conductive；
Step 2, ultrasonic disperse：Ultrasonic disperse certain time is carried out to the conductive that step 1 obtains；
Conductive painting is formed on film substrate by step 3：Conductive painting after ultrasonic disperse is formed on film
Substrate；
Step 4, heat cure：The film substrate for having coated conductive carries out under certain temperature to being heating and curing one
It fixes time, obtains the nano conductive film.
In above-mentioned technical proposal, in the step 2, the time of the ultrasonic disperse is 0.5h~2h.
In above-mentioned technical proposal, in the step 4, the temperature being heating and curing is 100 DEG C~120 DEG C, the heating
The cured time is 15min~30min.
Beneficial effects of the present invention：
(1) a kind of nano conductive film provided by the invention, including film substrate and painting are formed on film substrate surface
Conductive layer；Conductive layer is made of hot setting adhesive and carbon nanotube.Since conductive layer is received by hot setting adhesive and carbon
Mitron forms, and can avoid the excessive concentration of electric charge carrier, and then improve the transparency of the conductive film, and can guarantee that its is good
Good conductivity.
(2) preparation method of a kind of nano conductive film provided by the invention has method simple, and production cost is low, and
The characteristics of capable of being suitable for large-scale production.
Specific implementation mode
In order to make the technical problems, technical solutions and beneficial effects solved by the present invention be more clearly understood, below in conjunction with
Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used to explain
The present invention is not intended to limit the present invention.
Embodiment 1.
A kind of nano conductive film of the present embodiment, including film substrate and painting are formed on the conduction on film substrate surface
Layer；Wherein, conductive layer is made of hot setting adhesive and carbon nanotube.
In the present embodiment, the weight ratio of hot setting adhesive and carbon nanotube is 1:5.
In the present embodiment, hot setting adhesive is asphalt mixtures modified by epoxy resin.
In the present embodiment, the thickness of conductive layer is set as 2 μm.
A kind of preparation method of above-mentioned nano conductive film, it includes the following steps：
Step 1 prepares conductive：Carbon nanotube is added in hot setting adhesive, and is stirred evenly, is obtained
Conductive；
Step 2, ultrasonic disperse：Ultrasonic disperse 1h is carried out to the conductive that step 1 obtains；
Conductive painting is formed on film substrate by step 3：Conductive painting after ultrasonic disperse is formed on film
Substrate；
Step 4, heat cure：The film substrate for having coated conductive is subjected to the 22min that is heating and curing at 110 DEG C,
Obtain the conductive film.
Embodiment 2.
A kind of nano conductive film of the present embodiment, including film substrate and painting are formed on the conduction on film substrate surface
Layer；Wherein, conductive layer is made of hot setting adhesive and carbon nanotube.
In the present embodiment, the weight ratio of hot setting adhesive and carbon nanotube is 1:1.
In the present embodiment, hot setting adhesive is organic siliconresin.
In the present embodiment, the thickness of conductive layer is set as 0.5 μm.
A kind of preparation method of above-mentioned nano conductive film, it includes the following steps：
Step 1 prepares conductive：Carbon nanotube is added in hot setting adhesive, and is stirred evenly, is obtained
Conductive；
Step 2, ultrasonic disperse：Ultrasonic disperse 0.5h is carried out to the conductive that step 1 obtains；
Conductive painting is formed on film substrate by step 3：Conductive painting after ultrasonic disperse is formed on film
Substrate；
Step 4, heat cure：The film substrate for having coated conductive is subjected to the 30min that is heating and curing at 100 DEG C,
Obtain the conductive film.
Embodiment 3.
A kind of nano conductive film of the present embodiment, including film substrate and painting are formed on the conduction on film substrate surface
Layer；Wherein, conductive layer is made of hot setting adhesive and carbon nanotube.
In the present embodiment, the weight ratio of hot setting adhesive and carbon nanotube is 1:10.
In the present embodiment, hot setting adhesive is polyimide resin.
In the present embodiment, the thickness of conductive layer is set as 5 μm.
A kind of preparation method of above-mentioned nano conductive film, it includes the following steps：
Step 1 prepares conductive：Carbon nanotube is added in hot setting adhesive, and is stirred evenly, is obtained
Conductive；
Step 2, ultrasonic disperse：Ultrasonic disperse 2h is carried out to the conductive that step 1 obtains；
Conductive painting is formed on film substrate by step 3：Conductive painting after ultrasonic disperse is formed on film
Substrate；
Step 4, heat cure：The film substrate for having coated conductive is subjected to the 15min that is heating and curing at 120 DEG C,
Obtain the conductive film.
Embodiment 4.
A kind of nano conductive film of the present embodiment, including film substrate and painting are formed on the conduction on film substrate surface
Layer；Wherein, conductive layer is made of hot setting adhesive and carbon nanotube.
In the present embodiment, the weight ratio of hot setting adhesive and carbon nanotube is 1:2.
In the present embodiment, hot setting adhesive is the composition of phenolic resin and polyurethane.
In the present embodiment, the thickness of conductive layer is set as 0.8 μm.
A kind of preparation method of above-mentioned nano conductive film, it includes the following steps：
Step 1 prepares conductive：Carbon nanotube is added in hot setting adhesive, and is stirred evenly, is obtained
Conductive；
Step 2, ultrasonic disperse：Ultrasonic disperse 0.8h is carried out to the conductive that step 1 obtains；
Conductive painting is formed on film substrate by step 3：Conductive painting after ultrasonic disperse is formed on film
Substrate；
Step 4, heat cure：The film substrate for having coated conductive is subjected to the 27min that is heating and curing at 105 DEG C,
Obtain the conductive film.
Embodiment 5.
A kind of nano conductive film of the present embodiment, including film substrate and painting are formed on the conduction on film substrate surface
Layer；Wherein, conductive layer is made of hot setting adhesive and carbon nanotube.
In the present embodiment, the weight ratio of hot setting adhesive and carbon nanotube is 1:8.
In the present embodiment, hot setting adhesive is the composition of polyurethane and acrylic resin.
In the present embodiment, the thickness of conductive layer is set as 4 μm.
A kind of preparation method of above-mentioned nano conductive film, it includes the following steps：
Step 1 prepares conductive：Carbon nanotube is added in hot setting adhesive, and is stirred evenly, is obtained
Conductive；
Step 2, ultrasonic disperse：Ultrasonic disperse 1.5h is carried out to the conductive that step 1 obtains；
Conductive painting is formed on film substrate by step 3：Conductive painting after ultrasonic disperse is formed on film
Substrate；
Step 4, heat cure：The film substrate for having coated conductive is subjected to the 18min that is heating and curing at 115 DEG C,
Obtain the conductive film.
Finally it should be noted that above example is only used to illustrate the technical scheme of the present invention rather than is protected to the present invention
The limitation of range, although being explained in detail to the present invention with reference to preferred embodiment, those skilled in the art should manage
Solution, technical scheme of the present invention can be modified or replaced equivalently, without departing from technical solution of the present invention essence and
Range.
Claims (7)
1. a kind of nano conductive film, it is characterised in that：It is formed on leading for the film substrate surface including film substrate and painting
Electric layer；
The conductive layer is made of hot setting adhesive and carbon nanotube.
2. a kind of nano conductive film according to claim 1, it is characterised in that：The hot setting adhesive and the carbon
The weight ratio of nanotube is 1:1~10.
3. a kind of nano conductive film according to claim 1, it is characterised in that：The hot setting adhesive is asphalt mixtures modified by epoxy resin
One kind or arbitrary two or more in fat, organic siliconresin, polyimide resin, phenolic resin, polyurethane or acrylic resin
Composition.
4. a kind of nano conductive film according to claim 1, it is characterised in that：The thickness of the conductive layer is set as
0.5 μm~5 μm.
5. a kind of preparation method of nano conductive film described in Claims 1-4 any one, it is characterised in that：It includes
Following steps：
Step 1 prepares conductive：Carbon nanotube is added in hot setting adhesive, and is stirred evenly, conduction is obtained
Layer material；
Step 2, ultrasonic disperse：Ultrasonic disperse certain time is carried out to the conductive that step 1 obtains；
Conductive painting is formed on film substrate by step 3：Conductive painting after ultrasonic disperse is formed on film substrate；
Step 4, heat cure：The film substrate for having coated conductive is carried out to the timing that is heating and curing under certain temperature
Between, obtain the nano conductive film.
6. a kind of preparation method of nano conductive film according to claim 5, it is characterised in that：In the step 2,
The time of the ultrasonic disperse is 0.5h~2h.
7. a kind of preparation method of nano conductive film according to claim 5, it is characterised in that：In the step 4,
The temperature being heating and curing is 100 DEG C~120 DEG C, and the time being heating and curing is 15min~30min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292308.6A CN108666012A (en) | 2018-03-30 | 2018-03-30 | A kind of nano conductive film and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292308.6A CN108666012A (en) | 2018-03-30 | 2018-03-30 | A kind of nano conductive film and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108666012A true CN108666012A (en) | 2018-10-16 |
Family
ID=63782158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810292308.6A Pending CN108666012A (en) | 2018-03-30 | 2018-03-30 | A kind of nano conductive film and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108666012A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1543399A (en) * | 2001-03-26 | 2004-11-03 | Coatings containing carbon nanotubes | |
| CN101084260A (en) * | 2004-08-31 | 2007-12-05 | 海珀里昂催化国际有限公司 | Conductive thermosets by extrusion |
| CN101466598A (en) * | 2006-03-10 | 2009-06-24 | 豪富公司 | Low density lightning strike protection for use in airplanes |
| CN102361921A (en) * | 2009-03-23 | 2012-02-22 | 阿克马法国公司 | Method for preparing a thermosetting composite material with a high nanotube content |
| JP2013082595A (en) * | 2011-10-12 | 2013-05-09 | National Institute Of Advanced Industrial Science & Technology | Carbon nanotube composite material and conductive material |
-
2018
- 2018-03-30 CN CN201810292308.6A patent/CN108666012A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1543399A (en) * | 2001-03-26 | 2004-11-03 | Coatings containing carbon nanotubes | |
| CN101084260A (en) * | 2004-08-31 | 2007-12-05 | 海珀里昂催化国际有限公司 | Conductive thermosets by extrusion |
| CN101466598A (en) * | 2006-03-10 | 2009-06-24 | 豪富公司 | Low density lightning strike protection for use in airplanes |
| CN102361921A (en) * | 2009-03-23 | 2012-02-22 | 阿克马法国公司 | Method for preparing a thermosetting composite material with a high nanotube content |
| JP2013082595A (en) * | 2011-10-12 | 2013-05-09 | National Institute Of Advanced Industrial Science & Technology | Carbon nanotube composite material and conductive material |
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Application publication date: 20181016 |