CN108630479A - Keyboard device and method for manufacturing key frame thereof - Google Patents
Keyboard device and method for manufacturing key frame thereof Download PDFInfo
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- CN108630479A CN108630479A CN201710174461.4A CN201710174461A CN108630479A CN 108630479 A CN108630479 A CN 108630479A CN 201710174461 A CN201710174461 A CN 201710174461A CN 108630479 A CN108630479 A CN 108630479A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims abstract description 86
- 239000010410 layer Substances 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 30
- 239000010408 film Substances 0.000 claims description 20
- 239000010409 thin film Substances 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 239000006261 foam material Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 23
- 230000004044 response Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/86—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the casing, e.g. sealed casings or casings reducible in size
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2231/00—Applications
- H01H2231/002—Calculator, computer
Landscapes
- Push-Button Switches (AREA)
- Input From Keyboards Or The Like (AREA)
Abstract
Description
技术领域technical field
本发明涉及输入装置的领域,尤其涉及一种键盘装置及其键框的制造方法。The invention relates to the field of input devices, in particular to a keyboard device and a method for manufacturing the key frame.
背景技术Background technique
常见的电脑周边的输入装置包括滑鼠装置、键盘装置以及轨迹球装置等,其中键盘装置可供使用者直接地将文字以及符号输入至电脑,因此相当受到重视。The common input devices around the computer include a mouse device, a keyboard device, and a trackball device, among which the keyboard device can be used for users to directly input characters and symbols into the computer, so it is highly valued.
首先说明现有键盘装置的结构以及功能,请参阅图1~图3,图1为现有键盘装置的外观结构示意图,图2为图1所示键盘装置的部分结构的立体示意图,图3为图1所示键盘装置的部分结构的立体分解示意图。为了更清楚地示意,图2与图3中仅绘出部分键框、单一按键结构及相关元件结构。现有的键盘装置1包括多个按键结构10、按键底板11、薄膜线路板12以及键框13,且薄膜线路板12上具有相对应于多个按键结构10的多个薄膜开关121,而每一按键结构10包括键帽101、剪刀式连接元件102以及弹性体103,剪刀式连接元件102则连接于键帽101以及按键底板11之间,并包括第一框架1021以及枢接于第一框架1021的第二框架1022,因此第一框架1021与第二框架1022可彼此相对摆动。此外,弹性体103设置于键帽101与按键底板11之间,并具有抵顶部(图未示)。First, the structure and function of the existing keyboard device will be described. Please refer to FIGS. 1 to 3. FIG. 1 is a schematic diagram of the appearance structure of the existing keyboard device. FIG. A perspective exploded schematic diagram of a partial structure of the keyboard device shown in FIG. 1 . For a clearer illustration, only part of the key frame, single key structure and related component structures are depicted in FIG. 2 and FIG. 3 . The existing keyboard device 1 includes a plurality of key structures 10, a key base plate 11, a thin film circuit board 12 and a key frame 13, and the thin film circuit board 12 has a plurality of membrane switches 121 corresponding to the plurality of key structures 10, and each A button structure 10 includes a keycap 101, a scissors-type connection element 102, and an elastic body 103. The scissors-type connection element 102 is connected between the keycap 101 and the key base 11, and includes a first frame 1021 and is pivotally connected to the first frame. 1021 of the second frame 1022, so the first frame 1021 and the second frame 1022 can swing relative to each other. In addition, the elastic body 103 is disposed between the key cap 101 and the key bottom plate 11 and has a contact portion (not shown).
其中,当任一按键结构10的键帽101被触压而相对于按键底板11往下移动时,剪刀式连接元件102的第一框架1021与第二框架1022会由开合状态变更为叠合状态,且往下移动的键帽101会挤压弹性体103,使弹性体103的抵顶部抵顶并触发相对应的薄膜开关121,而使键盘装置1产生相对应的按键信号。而当按键结构10的键帽101不再被触压时,键帽101会因应弹性体103的弹性力而相对于按键底板11往上移动,此时第一框架1021与第二框架1022会由叠合状态变更为开合状态,且键帽101会恢复原位。Wherein, when the key cap 101 of any key structure 10 is pressed and moves downward relative to the key base plate 11, the first frame 1021 and the second frame 1022 of the scissors-type connection element 102 will be changed from the open-closed state to the folded state. state, and the key cap 101 moving downward will press the elastic body 103, so that the abutment of the elastic body 103 will abut against and trigger the corresponding membrane switch 121, so that the keyboard device 1 generates a corresponding key signal. And when the keycap 101 of the key structure 10 is no longer pressed, the keycap 101 will move upward relative to the key base plate 11 in response to the elastic force of the elastic body 103. At this time, the first frame 1021 and the second frame 1022 will be formed by The folded state is changed to the open state, and the keycap 101 will return to its original position.
再者,键框13设置于薄膜线路板12的上方,并具有壳体132以及分别对应于多个按键结构10的多个容置孔131,且每一容置孔131用以供相对应的按键结构10的键帽101活动于其中。在特定的目的下,例如,为了让使用该键盘装置1的笔记本电脑(图未示)可于携带时具有较薄的外型,而供使用者操作时令键帽101具有较大的移动行程以带给使用者较佳的操作手感,键盘装置1会被设计为键帽101可因应键框13的移动而上升或下降,如此的机构设计为熟知本技艺人士所知悉,在此即不再予以赘述。Moreover, the key frame 13 is disposed above the thin film circuit board 12, and has a housing 132 and a plurality of accommodating holes 131 respectively corresponding to the plurality of key structures 10, and each accommodating hole 131 is used for a corresponding The key cap 101 of the key structure 10 moves therein. For a specific purpose, for example, in order to allow a notebook computer (not shown) using the keyboard device 1 to have a thinner profile when carried, and to allow the keycap 101 to have a larger travel distance for the user to operate. To bring users a better operating feel, the keyboard device 1 is designed so that the keycap 101 can rise or fall in response to the movement of the key frame 13. Such a mechanism design is known to those skilled in the art and will not be described here. repeat.
然而,上述的机构设计会导致使用者操作键盘装置1时因按键结构10的键帽101与键框13的相对位置关系而感到不适。详言之,请参阅图4A与图4B,图4A为图1所示键盘装置的的按键结构的键帽未被触压时的状态示意图,图4B为图1所示键盘装置的的按键结构的键帽被触压后的状态示意图,而为了更清楚地示意,图4A与图4B中亦仅绘出部分的按键结构与键框。图4A与图4B示意了当键盘装置1的按键结构10的键帽101被触压后,键帽101会低于键框13的壳体132的上表面,此时键框13的壳体132与触压键帽101的手指头9会产生干涉的情况而造成不佳的操作手感,其如图4B的圆圈标示处所示。因此,现有的键盘装置1具有改善的空间。However, the above mechanism design will cause the user to feel uncomfortable when operating the keyboard device 1 due to the relative positional relationship between the key cap 101 of the key structure 10 and the key frame 13 . In detail, please refer to FIG. 4A and FIG. 4B. FIG. 4A is a schematic diagram of the state when the keycap of the key structure of the keyboard device shown in FIG. 1 is not pressed, and FIG. 4B is the key structure of the keyboard device shown in FIG. 1 4A and 4B also only draw part of the key structure and key frame for a clearer illustration. 4A and 4B illustrate that when the key cap 101 of the key structure 10 of the keyboard device 1 is pressed, the key cap 101 will be lower than the upper surface of the housing 132 of the key frame 13, and the housing 132 of the key frame 13 Interference with the finger 9 touching the keycap 101 will result in an unfavorable operating feel, as shown by the circle mark in FIG. 4B . Therefore, the existing keyboard device 1 has room for improvement.
发明内容Contents of the invention
本发明的一个目的在提供一种其键框包括有多个材质的键盘装置,由此提升使用者于按压键盘装置的键帽时的操作手感。An object of the present invention is to provide a keyboard device whose keyframe includes a plurality of materials, thereby improving the user's operating feel when pressing the keycaps of the keyboard device.
本发明的另一目的在提供一种上述键盘装置的键框的制造方法,由此简化多个材质的对位程序。Another object of the present invention is to provide a method for manufacturing the key frame of the above-mentioned keyboard device, thereby simplifying the alignment process of multiple materials.
于一较佳实施例中,本发明提供一种键盘装置,包括一薄膜线路板、一键框及一按键结构;薄膜线路板具有一薄膜开关;键框设置于该薄膜线路板的上方,并包括一壳体以及纵向贯穿该壳体的一容置孔;其中,该壳体具有纵向层叠的一第一基材层、一第二基材层以及位于该第一基材层以及该第二基材层之间的一贴合层,且该第一基材层通过该贴合层而与该第二基材层相结合;按键结构对应于该薄膜开关,并包括一键帽,且该键帽用以被触压而于该容置孔中活动。In a preferred embodiment, the present invention provides a keyboard device, including a thin film circuit board, a key frame and a key structure; the thin film circuit board has a membrane switch; the key frame is arranged on the top of the thin film circuit board, and It includes a housing and an accommodating hole longitudinally penetrating through the housing; wherein, the housing has a first base material layer, a second base material layer stacked vertically, and the first base material layer and the second base material layer An adhesive layer between the substrate layers, and the first substrate layer is combined with the second substrate layer through the adhesive layer; the button structure corresponds to the membrane switch and includes a keycap, and the The keycap is used to move in the accommodating hole by being pressed.
于一较佳实施例中,本发明还提供一种键盘装置的键框的制造方法,用以制造一键盘装置的一键框,该键框包括一壳体以及多个容置孔,且该多个容置孔用以分别供该键盘装置的多个键帽活动于其中,该键框的制造方法包括:In a preferred embodiment, the present invention also provides a method for manufacturing a key frame of a keyboard device, which is used to manufacture a key frame of a keyboard device. The key frame includes a housing and a plurality of accommodating holes, and the A plurality of accommodating holes are respectively used for a plurality of key caps of the keyboard device to move therein, and the manufacturing method of the key frame includes:
以一射出制程形成该壳体的一第一基材层;其中,该第一基材层由一第一材质所制成,并包括分别对应于该多个容置孔的多个第一穿孔;A first base material layer of the housing is formed by an injection process; wherein the first base material layer is made of a first material and includes a plurality of first through holes respectively corresponding to the plurality of accommodating holes ;
通过一贴合层将由一第二材质所制成的一单片基材与该第一基材层相结合;以及bonding a monolithic substrate made of a second material to the first substrate layer via an adhesive layer; and
以一切割制程于该单片基材上切割出分别对应于该多个容置孔的多个第二穿孔,以形成该壳体的一第二基材层;其中,任一该第二穿孔与相对应的该第一穿孔相连通。Cutting out a plurality of second through holes respectively corresponding to the plurality of accommodating holes on the single base material by a cutting process to form a second base material layer of the housing; wherein, any of the second through holes communicate with the corresponding first through hole.
附图说明Description of drawings
图1为现有键盘装置的外观结构示意图。FIG. 1 is a schematic diagram of the appearance and structure of a conventional keyboard device.
图2为图1所示键盘装置的部分结构的立体示意图。FIG. 2 is a three-dimensional schematic diagram of a partial structure of the keyboard device shown in FIG. 1 .
图3为图1所示键盘装置的部分结构的立体分解示意图。FIG. 3 is a three-dimensional exploded schematic diagram of a partial structure of the keyboard device shown in FIG. 1 .
图4A为图1所示键盘装置的的按键结构的键帽未被触压时的状态示意图。FIG. 4A is a schematic diagram of the state of the key structure of the keyboard device shown in FIG. 1 when the key cap is not pressed.
图4B为图1所示键盘装置的的按键结构的键帽被触压后的状态示意图。FIG. 4B is a schematic diagram of the state after the key cap of the key structure of the keyboard device shown in FIG. 1 is pressed.
图5为本发明键盘装置于一第一较佳实施例的外观结构示意图。FIG. 5 is a schematic diagram of the appearance structure of a keyboard device in a first preferred embodiment of the present invention.
图6为图5所示键盘装置的部分结构的立体示意图。FIG. 6 is a three-dimensional schematic diagram of a partial structure of the keyboard device shown in FIG. 5 .
图7为图5所示键盘装置的部分结构的立体分解示意图。FIG. 7 is a three-dimensional exploded schematic diagram of a partial structure of the keyboard device shown in FIG. 5 .
图8为图5所示键盘装置的薄膜线路板的立体分解示意图。FIG. 8 is a three-dimensional exploded view of the thin film circuit board of the keyboard device shown in FIG. 5 .
图9A为图5所示键盘装置的的按键结构的键帽未被触压时的状态示意图。FIG. 9A is a schematic diagram of the state of the key structure of the keyboard device shown in FIG. 5 when the key cap is not pressed.
图9B为图5所示键盘装置的的按键结构的键帽被触压后的状态示意图。FIG. 9B is a schematic diagram of the state after the key cap of the key structure of the keyboard device shown in FIG. 5 is pressed.
图10为本发明键盘装置的键框的制造方法的一较佳方法流程图。FIG. 10 is a flow chart of a preferred method for manufacturing the key frame of the keyboard device of the present invention.
图11A为图10所示方法的第一步骤的概念示意图。FIG. 11A is a conceptual diagram of the first step of the method shown in FIG. 10 .
图11B为图10所示方法的第二步骤的概念示意图。FIG. 11B is a conceptual diagram of the second step of the method shown in FIG. 10 .
图11C为图10所示方法的第三步骤的概念示意图。FIG. 11C is a conceptual schematic diagram of the third step of the method shown in FIG. 10 .
图12为本发明键盘装置于一第二较佳实施例的按键结构与键框的结构示意图。FIG. 12 is a structural schematic diagram of the key structure and key frame of the keyboard device of the present invention in a second preferred embodiment.
图13为图12所示键盘装置的的按键结构的键帽被触压后的状态示意图。FIG. 13 is a schematic diagram of the keycap of the key structure of the keyboard device shown in FIG. 12 after being pressed.
【符号说明】【Symbol Description】
1键盘装置 2键盘装置1 keyboard unit 2 keyboard unit
7单片基材 8手指头7 single substrate 8 fingers
9手指头 10按键9 fingers 10 buttons
11按键底板 12薄膜线路板11 button bottom plate 12 film circuit board
13键框 20按键13 key box 20 keys
21按键底板 22薄膜线路板21 button bottom plate 22 film circuit board
23键框 101键帽23 key frames 101 key caps
102剪刀式连接元件 103弹性体102 scissors connection element 103 elastomer
121薄膜开关 131容置孔121 Membrane switch 131 Accommodating hole
132壳体 201键帽132 Shell 201 Keycap
202连接元件 203弹性体202 Connecting element 203 Elastomer
221薄膜开关 222上层薄膜221 membrane switch 222 upper membrane
223下层薄膜 224中层薄膜223 lower film 224 middle film
231容置孔 232壳体231 Accommodating hole 232 Housing
1021第一框架 1022第二框架1021 First frame 1022 Second frame
2021第一框架 2022第二框架Frame 1 in 2021 Frame 2 in 2022
2221第一电路图案 2231第二电路图案2221 first circuit pattern 2231 second circuit pattern
2222上接点 2232下接点2222 upper contact 2232 lower contact
2241接点开孔 2321第一基材层2241 contact hole 2321 first substrate layer
2322第二基材层 2322’第二基材层2322 second substrate layer 2322'second substrate layer
2323贴合层 23211第一穿孔2323 Laminating layer 23211 First perforation
23221第二穿孔 23222裙边23221 second perforation 23222 skirt
具体实施方式Detailed ways
请参阅图5~图7,图5为本发明键盘装置于一第一较佳实施例的外观结构示意图,图6为图5所示键盘装置的部分结构的立体示意图,图7为图5所示键盘装置的部分结构的立体分解示意图。为了更清楚地示意,图6与图7中仅绘出部分键框、单一按键结构及相关元件结构。键盘装置2包括多个按键结构20、按键底板21、薄膜线路板22以及键框23,多个所述按键结构20可被分类为一般键、数字键以及功能键等,其分别供使用者以手指触压而使键盘装置2产生相对应的按键信号予电脑,进而使电脑执行相对应的功能,例如一般键用以输入英文字母等符号,数字键用以输入数字,而功能键则用以提供各种快捷功能,例如F1~F12等。Please refer to FIGS. 5 to 7. FIG. 5 is a schematic diagram of the appearance structure of the keyboard device of the present invention in a first preferred embodiment. FIG. 6 is a perspective view of a part of the structure of the keyboard device shown in FIG. 5. FIG. A three-dimensional exploded schematic diagram showing a partial structure of the keyboard device. For a clearer illustration, only part of the key frame, single key structure and related component structures are depicted in FIG. 6 and FIG. 7 . The keyboard device 2 includes a plurality of key structures 20, a key base plate 21, a thin film circuit board 22, and a key frame 23. The plurality of key structures 20 can be classified into general keys, number keys, and function keys, etc. The finger touches the keyboard device 2 to generate corresponding key signals to the computer, thereby enabling the computer to perform corresponding functions. For example, the general keys are used to input symbols such as English letters, the numeric keys are used to input numbers, and the function keys are used to input numbers. Provide various shortcut functions, such as F1~F12, etc.
再者,请同步参阅图8,其为图5所示键盘装置的薄膜线路板的立体分解示意图。薄膜线路板22包括相互层叠的多个薄膜。于本较佳实施例中,多个薄膜包括上层薄膜222以及下层薄膜223,上层薄膜222的下表面具有第一电路图案2221,且第一电路图案2221上具有分别对应于多个按键结构20的多个上接点2222,而下层薄膜223的上表面具有第二电路图案2231,且第二电路图案2231上具有分别对应于多个上接点2222的多个下接点2232;其中,每一上接点2222与其相对应的下接点2232之间具有间隔距离,并与相对应的下接点2232共同形成一薄膜开关221。而为了使每一上接点2222与其相对应的下接点2232之间具有间隔距离,薄膜线路板22还包括中层薄膜224,其设置于上层薄膜222与下层薄膜223之间,且中层薄膜224具有分别对应于多个上接点2222及多个下接点2232的多个接点开孔2241。较佳者,但不以此为限,上层薄膜222、下层薄膜223以及中层薄膜224中的任一者皆可由聚碳酸酯(PC)材质、聚乙烯对苯二甲酸酯(PET)材质、压克力塑胶(PMMA)材质、聚氨酯(Polyurethane,PU)材质或聚酰亚胺(Polyimide,PI)材质所制成。Furthermore, please refer to FIG. 8 , which is an exploded perspective view of the thin film circuit board of the keyboard device shown in FIG. 5 . The thin film wiring board 22 includes a plurality of thin films stacked on each other. In this preferred embodiment, the multiple films include an upper film 222 and a lower film 223, the lower surface of the upper film 222 has a first circuit pattern 2221, and the first circuit pattern 2221 has a corresponding to the plurality of button structures 20 respectively. A plurality of upper contacts 2222, and the upper surface of the lower film 223 has a second circuit pattern 2231, and the second circuit pattern 2231 has a plurality of lower contacts 2232 respectively corresponding to the plurality of upper contacts 2222; wherein, each upper contact 2222 There is a distance between the corresponding lower contacts 2232 , and form a membrane switch 221 together with the corresponding lower contacts 2232 . In order to make each upper contact 2222 and its corresponding lower contact 2232 have a spacing distance, the thin film circuit board 22 also includes a middle film 224, which is arranged between the upper film 222 and the lower film 223, and the middle film 224 has respectively The plurality of contact openings 2241 correspond to the plurality of upper contacts 2222 and the plurality of lower contacts 2232 . Preferably, but not limited thereto, any one of the upper film 222, the lower film 223 and the middle film 224 can be made of polycarbonate (PC), polyethylene terephthalate (PET), It is made of acrylic plastic (PMMA) material, polyurethane (Polyurethane, PU) material or polyimide (Polyimide, PI) material.
另外,每一按键结构20包括键帽201、连接元件202以及弹性体203,且连接元件202连接于键帽201以及按键底板21之间,用以使键帽201可相对于按键底板21上下移动,而弹性体203则设置于键帽201与按键底板21之间,并具有一抵顶部(图未示)。于本较佳实施例中,连接元件202为剪刀式连接元件,并包括第一框架2021以及枢接于第一框架2021的第二框架2022,因此第一框架2021与第二框架2022可彼此相对摆动。In addition, each key structure 20 includes a key cap 201, a connecting element 202 and an elastic body 203, and the connecting element 202 is connected between the key cap 201 and the key bottom plate 21, so that the key cap 201 can move up and down relative to the key bottom plate 21 , and the elastic body 203 is disposed between the key cap 201 and the key base plate 21, and has a top (not shown). In this preferred embodiment, the connecting element 202 is a scissors-type connecting element, and includes a first frame 2021 and a second frame 2022 pivotally connected to the first frame 2021, so the first frame 2021 and the second frame 2022 can be opposite to each other swing.
当任一按键结构20的键帽201被触压而相对于按键底板21往下移动时,连接元件202的第一框架2021与第二框架2022会由开合状态变更为叠合状态,且往下移动的键帽201会挤压弹性体203,使弹性体203的抵顶部抵顶并触发相对应的的上接点2222,进而使其相对应的上接点2222经由相对应的接点开孔2241而接触相对应的下接点2232,由此令相对应的薄膜开关221达成电性导通,以使键盘装置2产生相对应的按键信号。而当按键结构20的键帽201不再被触压时,键帽201会因应弹性体203的弹性力而相对于按键底板21往上移动,此时第一框架2021与第二框架2022会由叠合状态变更为开合状态,且键帽201会恢复原位。但是,上述仅为一实施方式,并不以此限定本案连接元件202、按键底板21以及键帽201间的连接关系。When the key cap 201 of any key structure 20 is pressed and moves downward relative to the key base plate 21, the first frame 2021 and the second frame 2022 of the connecting element 202 will change from the open state to the folded state, and The keycap 201 moving downward will squeeze the elastic body 203, so that the abutting portion of the elastic body 203 will abut against and trigger the corresponding upper contact 2222, and then make the corresponding upper contact 2222 go through the corresponding contact opening 2241. Contacting the corresponding lower contact 2232 makes the corresponding membrane switch 221 achieve electrical conduction, so that the keyboard device 2 generates a corresponding key signal. And when the key cap 201 of the key structure 20 is no longer pressed, the key cap 201 will move upward relative to the key bottom plate 21 in response to the elastic force of the elastic body 203, and at this time the first frame 2021 and the second frame 2022 will be formed by The folded state is changed to the folded state, and the keycap 201 will return to its original position. However, the above is only an implementation manner, and does not limit the connection relationship between the connection element 202 , the key base plate 21 and the keycap 201 in this application.
再者,键框23设置于薄膜线路板22的上方,其具有壳体232以及分别对应于多个按键结构20并纵向贯穿壳体232的多个容置孔231,且每一容置孔231用以供相对应的按键结构20的键帽201活动于其中。在特定的目的下,例如,为了让使用该键盘装置2的笔记本电脑(图未示)可于携带时具有较薄的外型,而供使用者操作时令键帽201具有较大的移动行程以带给使用者较佳的操作手感,键盘装置2会被设计为键帽201可因应键框23的移动而上升或下降,惟通过键框23的移动而使键帽201上升或下降的机构设计为熟知本技艺人士所知悉,在此即不再予以赘述。Moreover, the key frame 23 is disposed above the thin film circuit board 22, and has a housing 232 and a plurality of accommodating holes 231 corresponding to the plurality of key structures 20 and longitudinally penetrating the housing 232, and each accommodating hole 231 The keycap 201 of the corresponding key structure 20 is used to move therein. For a specific purpose, for example, in order to allow a notebook computer (not shown) using the keyboard device 2 to have a thinner profile when carried, and to allow the keycap 201 to have a larger travel range for the user to operate. To bring users a better operating feel, the keyboard device 2 will be designed so that the keycap 201 can rise or fall in response to the movement of the key frame 23, but the movement of the key frame 23 makes the key cap 201 rise or fall. Known by those skilled in the art, it will not be repeated here.
另外,键框23的壳体232具有纵向层叠的第一基材层2321、第二基材层2322以及位于第一基材层2321以及第二基材层2322之间的贴合层2323,且第二基材层2322通过贴合层2323而与第一基材层2321相结合;其中,第一基材层2321以及第二基材层2322分别由第一材质以及第二材质所制成,且第二材质的硬度小于第一材质的硬度,如此设计的好处以图9A与图9B来说明。In addition, the housing 232 of the key frame 23 has a first base material layer 2321, a second base material layer 2322, and a bonding layer 2323 between the first base material layer 2321 and the second base material layer 2322 stacked vertically, and The second base material layer 2322 is combined with the first base material layer 2321 through the bonding layer 2323; wherein, the first base material layer 2321 and the second base material layer 2322 are respectively made of the first material and the second material, Moreover, the hardness of the second material is smaller than that of the first material. The benefits of such a design are illustrated in FIG. 9A and FIG. 9B .
请参阅图9A与图9B,图9A为图5所示键盘装置的的按键结构的键帽未被触压时的状态示意图,图9B为图5所示键盘装置的的按键结构的键帽被触压后的状态示意图,而为了更清楚地示意,图9A与图9B中亦仅绘出部分的按键结构与键框。图9A与图9B示意了当键盘装置2的按键结构20的键帽201被触压后,键帽20的上表面会低于键框23的第二基材层2322的上表面,此时虽然第二基材层2322与触压键帽201的手指头8会产生干涉的情况,但由于第二基材层2322是可随着压力而变形的软性材质,因此能够大幅减少尖锐的角落影响到手指头8的操作,其如图9B的圆圈标示处所示。Please refer to FIG. 9A and FIG. 9B. FIG. 9A is a schematic diagram of the state when the keycap of the key structure of the keyboard device shown in FIG. A schematic diagram of the state after being pressed, and for a clearer illustration, only part of the key structure and key frame are drawn in FIG. 9A and FIG. 9B . 9A and 9B show that when the key cap 201 of the key structure 20 of the keyboard device 2 is pressed, the upper surface of the key cap 20 will be lower than the upper surface of the second base material layer 2322 of the key frame 23, although at this time The second base material layer 2322 may interfere with the finger 8 touching the keycap 201, but because the second base material layer 2322 is a soft material that can deform with pressure, it can greatly reduce the impact of sharp corners To the operation of the finger 8, it is shown as the circle mark in Fig. 9B.
较佳者,但不以此为限,第一材质为硬度较高的塑胶材质或金属材质,例如现有用来制作键框的丙烯腈-丁二烯-苯乙烯共聚物(ABS)或铝材,而第二材质可为皮革材质或泡棉材质。其中,采用皮革材质的好处在于,除了可如上述说明般减少手指头8操作键帽201时的被干涉程度外,还能为第二基材层2322带来有色图案,如花纹效果,其有别于现有键框仅具有单色彩质感,可提升美观效果,亦有利于键帽201的识别。Preferably, but not limited thereto, the first material is plastic material or metal material with higher hardness, such as acrylonitrile-butadiene-styrene copolymer (ABS) or aluminum material currently used to make key frames , and the second material can be leather material or foam material. Among them, the advantage of using leather material is that, in addition to reducing the degree of interference when the finger 8 operates the keycap 201 as described above, it can also bring colored patterns to the second base material layer 2322, such as pattern effects, which are useful. Different from the existing key frame which only has a single-color texture, it can improve the aesthetic effect and is also conducive to the identification of the key cap 201 .
接下来说明本发明键盘装置的键框的制造方法。请参阅图10,其为本发明键盘装置的键框的制造方法的一较佳方法流程图。首先,以一射出制程形成壳体232的第一基材层2321;其中,第一基材层2321包括分别对应于多个容置孔231的多个第一穿孔23211,其如图11A所示;接着,通过贴合层2323将由第二材质所制成的单片基材7与第一基材层2321相结合,其如图11B所示;最后,以一切割制程于单片基材7上切割出分别对应于多个容置孔231的多个第二穿孔23221,以形成壳体232的第二基材层2322;其中,任一第二穿孔23221与相对应的第一穿孔23211相连通,亦即任一第二穿孔23221与相对应的第一穿孔23211共同形成相对应的容置孔231,其如图11C所示。Next, the manufacturing method of the key frame of the keyboard device of the present invention will be described. Please refer to FIG. 10 , which is a flow chart of a preferred method of manufacturing the key frame of the keyboard device of the present invention. Firstly, the first substrate layer 2321 of the casing 232 is formed by an injection process; wherein, the first substrate layer 2321 includes a plurality of first through holes 23211 respectively corresponding to the plurality of accommodating holes 231, as shown in FIG. 11A ; Then, the monolithic substrate 7 made of the second material is combined with the first substrate layer 2321 through the bonding layer 2323, as shown in FIG. 11B ; finally, a cutting process is performed on the monolithic substrate 7 A plurality of second through holes 23221 corresponding to the plurality of accommodating holes 231 are cut out to form the second base material layer 2322 of the housing 232; wherein, any second through hole 23221 is connected with the corresponding first through hole 23211 That is, any second through hole 23221 and the corresponding first through hole 23211 together form a corresponding receiving hole 231, as shown in FIG. 11C.
较佳者,但不以此为限,上述切割制程可为光束切割制程,其利用高能量的光束,如激光,来对单片基材7进行切割。特别说明的是,先将单片基材7与第一基材层2321相结合,再从单片基材7上切割出多个第二穿孔23221的好处在于,可减化第二基材层2322的多个第二穿孔23221与第一基材层2321的多个第一穿孔23211对位的程序。Preferably, but not limited thereto, the above-mentioned cutting process can be a beam cutting process, which utilizes a high-energy beam, such as a laser, to cut the single substrate 7 . In particular, the advantage of first combining the monolithic substrate 7 with the first substrate layer 2321 and then cutting out a plurality of second perforations 23221 from the monolithic substrate 7 is that the second substrate layer can be reduced in size. The process of aligning the plurality of second through holes 23221 of 2322 with the plurality of first through holes 23211 of the first substrate layer 2321 .
请参阅图12,其为本发明键盘装置于一第二较佳实施例的按键结构与键框的结构示意图。为了更清楚地示意,图11中亦仅绘出部分的按键结构与键框。其中,本较佳实施例的键盘装置大致类似于本案第一较佳实施例中所述者,在此即不再予以赘述。而本较佳实施例与前述第一较佳实施例不同之处在于,第二基材层2322’具有向下延伸的裙边23222,因此第二基材层2322’可通过其裙边23222的开口由上往下套设于第一基材层2321上,而套设于第一基材层2321后的第二基材层2322’仍通过贴合层2323而固定于第一基材层2321上。Please refer to FIG. 12 , which is a structural schematic diagram of the key structure and key frame of the keyboard device in a second preferred embodiment of the present invention. For a clearer illustration, only part of the key structure and key frame are drawn in FIG. 11 . Wherein, the keyboard device of this preferred embodiment is roughly similar to that described in the first preferred embodiment of this application, and will not be repeated here. The difference between this preferred embodiment and the aforementioned first preferred embodiment is that the second base material layer 2322' has a skirt 23222 extending downward, so the second base material layer 2322' can pass through the edge of the skirt 23222. The opening is sleeved on the first base material layer 2321 from top to bottom, and the second base material layer 2322 ′ sleeved behind the first base material layer 2321 is still fixed to the first base material layer 2321 through the bonding layer 2323 superior.
请参阅图13,其为图12所示键盘装置的的按键结构的键帽被触压后的状态示意图,当键帽201被触压后,键帽201的上表面会低于第二基材层2322’的上表面,此时虽然第二基材层2322’与触压键帽201的手指头8会产生干涉的情况,但由于第二基材层2322’是可随着压力而变形的软性材质,因此能够大幅减少尖锐的角落影响到手指头8的操作。Please refer to FIG. 13 , which is a schematic view of the keycap of the key structure of the keyboard device shown in FIG. 12 after being pressed. When the keycap 201 is pressed, the upper surface of the keycap 201 will be lower than the second substrate. layer 2322', although the second base material layer 2322' will interfere with the finger 8 touching the keycap 201 at this time, since the second base material layer 2322' can deform with pressure The soft material can greatly reduce the impact of sharp corners on the operation of the finger 8 .
以上所述仅为本发明的较佳实施例,并非用以限定本发明的权利要求,因此凡其它未脱离本发明所公开的精神下所完成的等效改变或修饰,均应包含于本案的权利要求内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the claims of the present invention. Therefore, all other equivalent changes or modifications that do not deviate from the disclosed spirit of the present invention should be included in the scope of this case. within the claims.
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CN1530986A (en) * | 2003-03-10 | 2004-09-22 | 三美电机株式会社 | Keyboard devices |
US8086291B2 (en) * | 2002-03-08 | 2011-12-27 | Nokia Corporation | Cover to a portable electronic apparatus composed of leather and/or textile |
US9390869B2 (en) * | 2013-03-15 | 2016-07-12 | Logitech Europe S.A. | Keyframe modules for a flexible keyboard |
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US8086291B2 (en) * | 2002-03-08 | 2011-12-27 | Nokia Corporation | Cover to a portable electronic apparatus composed of leather and/or textile |
CN1530986A (en) * | 2003-03-10 | 2004-09-22 | 三美电机株式会社 | Keyboard devices |
US9390869B2 (en) * | 2013-03-15 | 2016-07-12 | Logitech Europe S.A. | Keyframe modules for a flexible keyboard |
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