CN108611620A - The transfer control method and device of magnetron sputtering apparatus, support plate - Google Patents
The transfer control method and device of magnetron sputtering apparatus, support plate Download PDFInfo
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- CN108611620A CN108611620A CN201810886697.5A CN201810886697A CN108611620A CN 108611620 A CN108611620 A CN 108611620A CN 201810886697 A CN201810886697 A CN 201810886697A CN 108611620 A CN108611620 A CN 108611620A
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 45
- 238000012546 transfer Methods 0.000 title claims abstract description 21
- 230000001939 inductive effect Effects 0.000 claims abstract description 85
- 230000005540 biological transmission Effects 0.000 claims abstract description 62
- 230000001133 acceleration Effects 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 14
- 230000006698 induction Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 15
- 239000013077 target material Substances 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005291 magnetic effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 oxide Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
An embodiment of the present invention provides magnetron sputtering apparatus, the transfer control methods and device of support plate.The magnetron sputtering apparatus includes：Controller, the surge chamber being sequentially communicated, molecule pump chamber and target chamber；It is provided with to transmit the first conveyer belt of support plate in surge chamber；Surge chamber side is provided with first position sensor in molecular pump room, first position sensor is used to send the first inductive signal to controller when sensing support plate；The side of target chamber is provided with second position sensor in molecular pump room, second position sensor is used to send the second inductive signal to controller when sensing support plate；Controller is connect with the first conveyer belt, first position sensor and second position sensor respectively, the speed of service for adjusting the first conveyer belt according to the first inductive signal and the second inductive signal.By adjusting the speed of service of the first conveyer belt, the distance between the support plate of target indoor transmissions can be reduced, to reduce the target quantity for being splashed to chamber bottom.
Description
Technical field
The present invention relates to magnetron sputtering technique field more particularly to magnetron sputtering apparatus, support plate transfer control method and
Device.
Background technology
It is thin that magnetron sputtering apparatus can prepare various hard films, metal film, semiconductor film, deielectric-coating, ferromagnetic film and magnetism
The nano level single layer such as film and multilayer functional membrane.Its feature is：The a variety of materials that target can be prepared into can be used as film material
Material, including various metals, semiconductor, ferromagnetic material and the substances such as oxide, ceramics, polymer of insulation, are especially suitable for height
The material deposition plating of fusing point and low-steam pressure, therefore, magnetron sputtering plating are a kind of currently used film plating process.Current
The distance between support plate and support plate are larger in magnetron sputtering apparatus, and a large amount of target materials is caused not to be splashed on support plate, but
Be splashed to magnetron sputtering apparatus bottom (such as：Chamber bottom), to cause the utilization rate of target material relatively low.
Invention content
To overcome the problems in correlation technique, an embodiment of the present invention provides the transmission of magnetron sputtering apparatus, support plate
Control method and device.
According to a first aspect of the embodiments of the present invention, a kind of magnetron sputtering apparatus is provided, the magnetron sputtering apparatus includes：
Controller, the surge chamber being sequentially communicated, molecule pump chamber and target chamber；
It is provided with to transmit the first conveyer belt of support plate in the surge chamber；
The surge chamber side is provided with first position sensor, the first position sensing in the molecular pump room
Device is used to send the first inductive signal to the controller when sensing the support plate；
The side of the target chamber is provided with second position sensor, the second position sensing in the molecular pump room
Device is used to send the second inductive signal to the controller when sensing the support plate；
The controller is connect with first conveyer belt, first position sensor and second position sensor respectively, is used
In the speed of service for adjusting first conveyer belt according to first inductive signal and second inductive signal.
The technical solution that the embodiment of the present invention provides can include the following benefits：The magnetron sputtering apparatus includes：
Controller, the surge chamber being sequentially communicated, molecule pump chamber and target chamber；It is provided with to transmit the first transmission of support plate in surge chamber
Band；Surge chamber side is provided with first position sensor in molecular pump room, first position sensor is used to sense load
When plate the first inductive signal is sent to controller；Side in molecular pump room close to target chamber is provided with second position sensor, the
Two position sensors are used to send the second inductive signal to controller when sensing support plate；Controller is transmitted with first respectively
Band, first position sensor are connected with second position sensor, for being adjusted according to the first inductive signal and the second inductive signal
The speed of service of whole first conveyer belt.By adjusting the speed of service of the first conveyer belt so that the distance between front and back support plate is
Controllable, by selecting the speed of service of suitable first conveyer belt, two loads reduced in target indoor transmissions can be reached
The purpose of distance between plate promotes the utilization of target material to effectively reduce the target quantity for being splashed to chamber bottom
Rate, to save target cost.
In one embodiment, the third place sensor, institute are also set up close to the target chamber side in the molecular pump room
The third place sensor is stated for sending third inductive signal to the controller when sensing support plate；
The controller is also connect with the third place sensor, for not receiving second sense simultaneously when detection
When induction signal and the third inductive signal, prompt message is exported；The prompt message is for prompting the magnetron sputtering apparatus
It breaks down.
In one embodiment, the first position sensor, the second position sensor and the third place pass
Sensor includes laser sensor.
According to a second aspect of the embodiments of the present invention, a kind of transfer control method of support plate is provided, the method is applied to
Control to above-mentioned first aspect any one of them magnetron sputtering apparatus, the method includes：
When control support plate enters the first conveyer belt in surge chamber, first control signal is sent to first conveyer belt,
The first control signal indicates that first conveyer belt is run with preset First Speed；
When receiving the first inductive signal that the first position sensor is sent, the is sent to first conveyer belt
Two control signals, the second control signal indicate that first conveyer belt is gradually run slowly with preset acceleration；
When receiving the second inductive signal that the second position sensor is sent, the is sent to first conveyer belt
Three control signals, the third control signal are used to indicate first conveyer belt and are run with second speed；The second speed
Less than First Speed；
When detecting that first conveyer belt transfers support plate, controls next support plate and enter first conveyer belt.
The technical solution that the embodiment of the present invention provides can include the following benefits：When control support plate enters surge chamber
In the first conveyer belt when, to the first conveyer belt send first control signal, first control signal indicate the first conveyer belt with pre-
If First Speed operation；When receiving the first inductive signal that first position sensor is sent, sent to the first conveyer belt
Second control signal, second control signal indicate that the first conveyer belt is gradually run slowly with preset acceleration；When receiving
When the second inductive signal that two position sensors are sent, sends third to the first conveyer belt and control signal, third controls signal and uses
It is run with second speed in the first conveyer belt of instruction；Second speed is less than First Speed.Wherein, controller is passed by first position
The second inductive signal that the first inductive signal and second position sensor that sensor is sent are sent changes first in surge chamber
The transmission speed of conveyer belt so as to effectively control into the distance between two support plates in target chamber, and then reduces and enters
The distance between two support plates in target chamber are splashed to chamber bottom to reduce from the gap between former and later two support plates
Target quantity, effectively promote the utilization rate of target material, and saved target cost.
In one embodiment, the method further includes：
It is passed according to the First Speed, the second speed and the first position sensor and the second position
The distance between sensor determines the acceleration.
In one embodiment, the method further includes：It controls described in two neighboring support plate enters with prefixed time interval
First conveyer belt.
In one embodiment, the method further includes：
When detecting that the transmission belt of the surge chamber transfers current support plate, controls next support plate and enter the buffering
Transmission belt in room.
In one embodiment, the method further includes：
When detection does not receive the second inductive signal and the third place that the second position sensor is sent simultaneously
When the third inductive signal that sensor is sent, prompt message is exported；The prompt message is for prompting the magnetron sputtering apparatus
It breaks down.
According to a third aspect of the embodiments of the present invention, a kind of transmission control unit of support plate is provided, described device includes：
First sending module, for when control support plate enters the first conveyer belt in surge chamber, being transmitted to described first
Band sends first control signal, and the first control signal indicates that first conveyer belt is run with preset First Speed；
Second sending module, for when receiving the first inductive signal that the first position sensor is sent, to institute
It states the first conveyer belt and sends second control signal, the second control signal indicates first conveyer belt with preset acceleration
Gradually run slowly；
Third sending module, for when receiving the second inductive signal that the second position sensor is sent, to institute
It states the first conveyer belt and sends third control signal, the third control signal is used to indicate first conveyer belt with second speed
Operation；The second speed is less than First Speed.
In one embodiment, described device further includes：Determining module；
The determining module, for according to the First Speed, the second speed and the first position sensor
The distance between described second position sensor, determines the acceleration.
In one embodiment, described device further includes：First control module；
First control module enters first transmission for controlling two neighboring support plate with prefixed time interval
Band.
In one embodiment, described device further includes：Second control module；
Second control module, for when detecting that first conveyer belt transfers current support plate, control to be next
A support plate enters described first and transmits.
In one embodiment, described device further includes：Output module；
The output module, for not receiving the second induction letter that the second position sensor is sent simultaneously when detection
Number and the third place sensor send third inductive signal when, export prompt message；The prompt message is for prompting
The magnetron sputtering apparatus breaks down.
It should be understood that above general description and following detailed description is only exemplary and explanatory, not
It can the limitation present invention.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the present invention
Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is the structural schematic diagram according to the magnetron sputtering apparatus shown in an exemplary embodiment.
Fig. 2 is the structural schematic diagram of the magnetron sputtering apparatus shown according to another exemplary embodiment.
Fig. 3 is the flow chart according to the transfer control method of the support plate shown in an exemplary embodiment.
Fig. 4 is the structural schematic diagram of the magnetron sputtering apparatus shown according to another exemplary embodiment.
Fig. 5 is the structural schematic diagram of the magnetron sputtering apparatus shown according to another exemplary embodiment.
Fig. 6 is the structural schematic diagram of the magnetron sputtering apparatus shown according to another exemplary embodiment.
Fig. 7 is the structural schematic diagram of the magnetron sputtering apparatus shown according to another exemplary embodiment.
Fig. 8 is the structural schematic diagram of the magnetron sputtering apparatus shown according to another exemplary embodiment.
Fig. 9 is the structural schematic diagram of the magnetron sputtering apparatus shown according to another exemplary embodiment.
Figure 10 is a kind of block diagram of the transmission control unit of support plate shown according to an exemplary embodiment.
Figure 11 is a kind of block diagram of the transmission control unit of the support plate shown according to another exemplary embodiment.
Figure 12 is a kind of block diagram of the transmission control unit of the support plate shown according to another exemplary embodiment.
Figure 13 is a kind of block diagram of the transmission control unit of the support plate shown according to another exemplary embodiment.
Figure 14 is a kind of block diagram of the transmission control unit of the support plate shown according to another exemplary embodiment.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent and the consistent all embodiments of the present invention.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects being described in detail in claims, of the invention.
Fig. 1 is according to the structural schematic diagram of the magnetron sputtering apparatus shown in an exemplary embodiment, as shown in Figure 1, the magnetic
Controlling sputtering equipment 10 includes：
Controller 11, the surge chamber 12 being sequentially communicated, molecule pump chamber 13 and target chamber 14；
It is provided with to transmit the first conveyer belt 121 of support plate in surge chamber 12；
Surge chamber side is provided with first position sensor 131 in molecule pump chamber 13, first position sensor 131 is used
In when sensing support plate to controller 11 send the first inductive signal；
The side of target chamber is provided with second position sensor 132 in molecule pump chamber 14, second position sensor 132 is used
In when sensing support plate to controller send the second inductive signal；
Controller 11 is connect with the first conveyer belt 121, first position sensor 131 and second position sensor 132 respectively,
The speed of service for adjusting the first conveyer belt according to the first inductive signal and the second inductive signal.
Since the magnetic control target in target chamber 14 is lasting sputtering target material, then, it is splashed to chamber bottom in target chamber 14
Target quantity and target chamber 14 in the distance between former and later two support plates it is directly proportional, that is, if former and later two loads in target chamber 14
The distance between plate is larger, then just have more target is splashed to vacuum chamber bottom from the gap between former and later two support plates
Portion, and if the distance between former and later two support plates are smaller in target chamber 14, less target is just had from former and later two loads
Gap between plate is splashed to chamber bottom, therefore, by reducing the distance between former and later two support plates in target chamber 14, just
The target quantity for being splashed to chamber bottom can be effectively reduced, to effectively promote the utilization rate of target material, to save
Target cost.
And in magnetron sputtering apparatus, the second conveyer belt 141 in target chamber 14 travels at the uniform speed, therefore can not pass through tune
The transmission speed of the second conveyer belt 141 in whole target chamber 14 come reduce between former and later two support plates transmitted in target chamber 14 away from
From, and the first conveyer belt 121 in surge chamber 12 can be achieved on what high low speed was converted mutually, in order to reduce transmission in target chamber 14
The distance between former and later two support plates, can be by controlling the speed of service of the first conveyer belt 121 in surge chamber 12, to adjust
The speed of the support plate transmitted on whole the first conveyer belt 121 in surge chamber 12, to reduce two transmitted in target chamber 14
The distance between support plate.
Specifically, by the way that first position sensor is arranged close to 12 side of surge chamber in molecule pump chamber 13 in the present invention
131, second position sensor 132 is set close to the side of target chamber 14 in molecule pump chamber 13, when first position sensor 131 is felt
When should arrive support plate, the first inductive signal is sent to controller 11, when second position sensor 132 senses support plate, to control
Device 11 sends the second inductive signal, and controller 11 can be based on being adjusted according to the first inductive signal and the second inductive signal
The speed of service of first conveyer belt 121, by adjusting the speed of service of the first conveyer belt 121, so that it may so that being transmitted to target chamber
The distance between two support plates in 14 are controllable, by selecting the speed of service of suitable first conveyer belt, can be reached
To the purpose for reducing the distance between two support plates of transmission in target chamber 14.It is exemplary, when control support plate enters in surge chamber 12
The first conveyer belt 121 when, the first conveyer belt 121 with preset First Speed run, and when support plate with preset First Speed
When being transmitted to the position of first position sensor 131, first position sensor 131 sends the first inductive signal to controller 11,
After controller 11 receives the first inductive signal, just controls the first conveyer belt 121 and is gradually run slowly with preset acceleration,
When support plate continues to be transmitted to the position of second position sensor 132, second position sensor 132 sends second to controller 11
Inductive signal just controls the first conveyer belt 121 with less than First Speed when controller 11 receives the second inductive signal
Two speed are run.Since support plate can run slowly a period of time in surge chamber 12, when support plate is detached from surge chamber with second speed
When 12, the speed of support plate is less than preset First Speed, and when next support plate enters the first transmission in surge chamber 12
When band 121, the speed of the first conveyer belt 121 becomes preset First Speed again, and then continues to execute above-mentioned in surge chamber 12
The process to run slowly can so that the distance between front and back support plate is controllable by this kind of method, and select suitable add
Speed can achieve the purpose that reduce the distance between former and later two support plates in target chamber 14.
The technical solution that the embodiment of the present invention provides can include the following benefits：The magnetron sputtering apparatus includes：
Controller, the surge chamber being sequentially communicated, molecule pump chamber and target chamber；It is provided with to transmit the first transmission of support plate in surge chamber
Band；Surge chamber side is provided with first position sensor in molecular pump room, first position sensor is used to sense load
When plate the first inductive signal is sent to controller；Side in molecular pump room close to target chamber is provided with second position sensor, the
Two position sensors are used to send the second inductive signal to controller when sensing support plate；Controller is transmitted with first respectively
Band, first position sensor are connected with second position sensor, for being adjusted according to the first inductive signal and the second inductive signal
The speed of service of whole first conveyer belt.By adjusting the speed of service of the first conveyer belt so that the distance between front and back support plate is
Controllable, by selecting the speed of service of suitable first conveyer belt, two loads reduced in target indoor transmissions can be reached
The purpose of distance between plate promotes the utilization of target material to effectively reduce the target quantity for being splashed to chamber bottom
Rate, to save target cost.
In one embodiment, as shown in Fig. 2, also setting up the third place sensing close to 14 side of target chamber in molecule pump chamber 13
Device 133, the third place sensor 133 are used to send third inductive signal to controller 11 when sensing support plate.
Controller 11 is also connect with the third place sensor 133, for not receiving the second inductive signal simultaneously when detection
When with third inductive signal, prompt message is exported；Prompt message is for prompting magnetron sputtering apparatus to break down.
By the setting the third place sensor 133 in molecule pump chamber 13, so that controller 11 can be according to third
The second inductive signal that the third inductive signal and second position sensor 132 that position sensor 133 is sent are sent is come before determining
Whether latter two support plate is transferred to respective predeterminated position, when former and later two support plate simultaneous transmission to respective predeterminated positions,
Just show former and later two support plate normal transmissions, magnetron sputtering apparatus normal operation, when the non-simultaneous transmission of former and later two support plates is to each
From predeterminated position when, just show former and later two carrier plate transmissions exception, at this point it is possible to prompt message be exported in time, to prompt to use
Family magnetron sputtering apparatus operation exception, needs to overhaul, to effectively improve magnetron sputtering apparatus reliability of operation.
In one embodiment, above-mentioned first position sensor 131, second position sensor 132 and the third place pass
Sensor 133 includes laser sensor.
Since the hot spot of laser sensor is smaller, to which the precision for incuding support plate is higher, therefore, first in the present invention
It can includes laser sensor to set sensor 131, second position sensor 132 and the third place sensor 133, also may be used certainly
To include other kinds of position sensor, such as：Infrared sensor etc., the present invention do not limit the type of position sensor
System.
Fig. 3 is according to the flow chart of the transfer control method of the support plate shown in an exemplary embodiment, as shown in figure 3, side
Method is applied to the control to the magnetron sputtering apparatus of any of the above-described embodiment, this approach includes the following steps S101-S103：
In step S101, when control support plate enters the first conveyer belt 121 in surge chamber 12, to the first conveyer belt
121 send first control signal, and first control signal indicates that the first conveyer belt 121 is run with preset First Speed.
In step s 102, when receiving the first inductive signal of the transmission of first position sensor 131, to the first transmission
Band 121 sends second control signal, and second control signal indicates that the first conveyer belt 121 is gradually slowed down fortune with preset acceleration
Row.
In step s 103, when receiving the second inductive signal of the transmission of second position sensor 132, to the first transmission
Band 121 sends third and controls signal, and third control signal is used to indicate the first conveyer belt 121 and is run with second speed；Second speed
Degree is less than First Speed.
In one embodiment, as shown in figure 4, when control support plate 15 enters the first conveyer belt 121 in surge chamber 12,
First conveyer belt 121 of the meeting of controller 11 into surge chamber 12 is sent the first conveyer belt 121 of instruction and is transported with preset First Speed
Capable first control signal, after the first conveyer belt 121 in surge chamber 12 receives first control signal, the first conveyer belt
121 are just run with First Speed, and support plate 15 transmits under the drive of the first conveyer belt 121 to the direction of molecule pump chamber 13 at this time.
And since support plate 15 to be ensured is run in target chamber 14 with smaller speed, to promote coating effects, therefore, carrying
When plate 15 enters target chamber 14, the transmission speed by support plate 15 is just needed to be reduced to process speed needed for target chamber 14 (that is, the
Two speed), this is because if just by the transmission of support plate 15 speed after support plate 15 enters the second conveyer belt 141 in target chamber 14
Degree is reduced to process speed, then due to the inertia of itself of support plate 15, support plate 15 may be transmitted along second in target chamber 14
Band 141 moves forward, alternatively, support plate 15 may transmit a distance with the speed less than the second conveyer belt 141 in target chamber 14,
Then just continue to transmit with the process speed of the second conveyer belt 141 in target chamber 14, the plating of support plate 15 can be caused in the case of this kind
Film effect is bad, therefore, when support plate 15 enters target chamber 14, the transmission speed by support plate 15 is needed to be reduced to second speed, this
When can ensure support plate 15 with second speed at the uniform velocity enter target chamber 14 in the second conveyer belt 141, to promote support plate 15
Coating effects, so, the first conveyer belt 121 in surge chamber 12, which needs to execute, to run slowly.
In the present invention, as shown in figure 5, when the position where the end-transfer to first position sensor 131 of support plate 15
When, first position sensor 131 just senses support plate 15, at this point, first position sensor 131 just sends first to controller 11
Inductive signal, when controller 11 receives the first inductive signal of the transmission of first position sensor 131, just to the first conveyer belt
121 send the second control signal that the first conveyer belt 121 of instruction is gradually run slowly with preset acceleration, at this point, first passes
Band 121 is sent just to run slowly, and it is the second conveyer belt 141 operation in target chamber 14 to execute the final goal speed to run slowly just
Second speed, can ensure the second conveyer belt 141 that support plate 15 is at the uniform velocity entered with second speed in target chamber 14 in this way, and be
The distance between former and later two support plates 15 when control enters target chamber 14 just need to control first conveyer belt in surge chamber 12
121 deceleration distance (or deceleration time), as shown in fig. 6, where the end-transfer to second position sensor 132 of support plate 15
Position when, second position sensor 132 just senses support plate 15, at this point, second position sensor 132 just to controller 11 send out
The second inductive signal is sent, when controller 11 receives the second inductive signal of the transmission of second position sensor 132, at this time just really
The moderating process for determining the first conveyer belt in surge chamber 12 is completed, and needs to execute uniform motion, then controller 11 will be to slow
The first conveyer belt 121 rushed in room 12 sends third control signal, to indicate the first conveyer belt 121 in surge chamber 12 with second
Speed is run, and controls signal when the first conveyer belt 121 in surge chamber 12 receives third, the first conveyer belt 121 is just according to the
Two speed travel at the uniform speed, by support plate 15 with the second conveyer belt 141 in second speed feeding target chamber 14.
In the present invention, the opportunity for also needing to control the first conveyer belt 121 that two neighboring support plate enters in surge chamber 12, because
For if not controlling the opportunity for the transmission belt that two neighboring support plate enters in surge chamber 12, it may appear that previous support plate is also slow
It rushes and carries out deceleration transmission in the transmission belt of room 12, and the latter support plate has been transmitted with First Speed, then before causing
The case where latter two support plate bumps against occurs, and therefore, in the present invention, also needs to control the biography that two neighboring support plate enters in surge chamber 12
The opportunity of defeated band.
In one embodiment, the above method further includes following sub-step：Two neighboring support plate is controlled between preset time
Transmission belt in entrance surge chamber 12.
Wherein, it can ensure that former and later two support plates are not in above-mentioned touch in surge chamber 12 by prefixed time interval
Problem appearance is hit, above-mentioned prefixed time interval can be obtained by experimental data, and the present invention does not obtain prefixed time interval
Mode is taken to limit.
In one embodiment, the above method further includes following sub-step：When the transmission belt transmission for detecting surge chamber 12
When complete current support plate, the transmission belt that next support plate enters in surge chamber 12 is controlled.
In order to effectively avoid the collision problem that former and later two support plates will not be above-mentioned in surge chamber 12, surge chamber 12 can be worked as
Transmission belt transfer current support plate after, then control the transmission belt that next support plate enters in surge chamber 12.
As shown in fig. 7, when detecting that the first conveyer belt 121 transfers support plate 15, controls next support plate 16 and enter the
One conveyer belt 121 equally executes the biography of the first conveyer belt of above-mentioned adjustment 121 when the first conveyer belt 121 transmits next support plate 16
The method and step of defeated speed can control distance between former and later two support plates by this kind of mode, as shown in figure 8, when by upper
The speed of service of the first conveyer belt 121 in the method control surge chamber 12 stated, can control the tail portion of previous support plate 15
The distance between end of the latter support plate 16, and by adjusting first position sensor 131 and second position sensor 132
The distance between, the mesh of distance between the tail portion and the end of the latter support plate 16 that reduce previous support plate 15 can be reached
, wherein due to the latter support plate 16 end-transfer to second position sensor 132 position when, it is just even with second speed
Speed moves ahead, hereafter, the distance between the tail portion of previous support plate 15 and the end of the latter support plate 16 just at a distance from this time, by
The distance between end in the tail portion and the latter support plate 16 for reducing previous support plate 15, to reduce from former and later two loads
Gap between plate is splashed to the target quantity of chamber bottom, effectively promotes the utilization rate of target material, and has saved target
Material cost.
Wherein, the first inductive signal that first position sensor 131 is sent could be provided as working as first position sensor 131
Sense from it is unobstructed be changed to block when (namely at this time the end-transfer of support plate to the position of first position sensor 131
Set), the first inductive signal that first position sensor 131 is just sent (is for laser sensor with first position sensor 131
Example, laser sensor can determine whether to be changed to block from unobstructed according to the time for receiving reflection light)；Certainly
May be set to be when first position sensor 131 has been sensed and blocked, just to controller 11 send the first inductive signal (with
First position sensor 131 be laser sensor for, at this time laser sensor send the first inductive signal in can carry
Laser sensor receives the time of reflection light, with allow controller 11 according to the time for receiving reflection light determine be carry
The end of plate or the tail portion of support plate), can be detected at this time by controller 11 be support plate end or trailer transmission to first
The position of position sensor 131, when controller 11 detect be support plate end-transfer to the position of first position sensor 131
When, just the transmission belt into surge chamber 12 sends first control signal.
The realization method for the second inductive signal that corresponding second position sensor 132 is sent is sensed with above-mentioned first position
The realization method that device 131 sends the first inductive signal is identical, and details are not described herein again.
The technical solution that the embodiment of the present invention provides can include the following benefits：When control support plate enters surge chamber
In the first conveyer belt when, to the first conveyer belt send first control signal, first control signal indicate the first conveyer belt with pre-
If First Speed operation；When receiving the first inductive signal that first position sensor is sent, sent to the first conveyer belt
Second control signal, second control signal indicate that the first conveyer belt is gradually run slowly with preset acceleration；When receiving
When the second inductive signal that two position sensors are sent, sends third to the first conveyer belt and control signal, third controls signal and uses
It is run with second speed in the first conveyer belt of instruction；Second speed is less than First Speed.Wherein, controller is passed by first position
The second inductive signal that the first inductive signal and second position sensor that sensor is sent are sent changes first in surge chamber
The transmission speed of conveyer belt so as to effectively control into the distance between two support plates in target chamber, and then reduces and enters
The distance between two support plates in target chamber are splashed to chamber bottom to reduce from the gap between former and later two support plates
Target quantity, effectively promote the utilization rate of target material, and saved target cost.
Method in through the invention, when can effectively control into target chamber 14, distance between former and later two support plates, and
The distance can be accurately controlled to very little, such as：10mm.And after distance reduces between former and later two support plates, in target chamber 14
The material that magnetic control target is splashed to chamber bottom can be reduced, and to extend the clearance time of process chamber, improve whole line
Working efficiency.
In one embodiment, the above method further includes following sub-step：
According between First Speed, second speed and first position sensor 131 and second position sensor 132
Distance determines acceleration.
It can basisWithIt can determine acceleration
Wherein, S is the distance between first position sensor 131 and second position sensor 132；V1For First Speed；V2For the second speed
Degree.
In order to ensure support plate in the second conveyer belt 141 in entering target chamber 14, the transmission speed of support plate is the second speed
Degree, then just needing to control the acceleration that the first conveyer belt 121 in surge chamber 12 runs slowly, to work as surge chamber 12
In the first conveyer belt 121 when being run slowly with the acceleration, at the position of carrier plate transmission to second position sensor 132,
The transmission speed of support plate is second speed, that is, at the position of carrier plate transmission to second position sensor 132, surge chamber 12
In the speed of service of the first conveyer belt 121 be second speed, to effectively control distance before former and later two support plates.
In one embodiment, the above method further includes following sub-step：It is passed when detection does not receive the second position simultaneously
When the third inductive signal that the second inductive signal and the third place sensor 133 that sensor 132 is sent are sent, output prompt letter
Breath；Prompt message is for prompting magnetron sputtering apparatus to break down.
It is exemplary, as shown in figure 9, the third place sensor 133 can sense from block be changed to unobstructed when
(namely at this time the trailer transmission of support plate to the position of the third place sensor 133) sends third inductive signal to controller 11,
The first position sensor 131 in the realization method and above-described embodiment of the third place sensor 133 and the second position pass at this time
The realization method of sensor 132 is identical, and details are not described herein again.In order to control support plate and when support plate enters the transmission belt of target chamber 14, support plate
Tail portion and support plate the distance between end, avoid distance from changing, so that it may to pass through the setting the in the molecule pump chamber 13
Three position sensors 133 so that controller 11 can according to the third place sensor 133 send third inductive signal and
The second inductive signal that second position sensor 132 is sent determines former and later two support plates whether normal operation, when former and later two
When the non-normal operation of support plate, prompt message can be exported in time, to prompt user's magnetron sputtering apparatus operation exception, occur therefore
Barrier, needs to overhaul, to effectively improve magnetron sputtering apparatus reliability of operation.
Wherein, the distance between the third place sensor 133 and second position sensor 132 are to be controlled in the present invention
When former and later two support plates of system enter the transmission belt in target chamber 14, between the tail portion and the end of the latter support plate of previous support plate
Distance.
Following is apparatus of the present invention embodiment, can be used for executing the method for the present invention embodiment.
Figure 10 is a kind of block diagram of the transmission control unit of support plate shown according to an exemplary embodiment, such as Figure 10 institutes
Show, the transmission control unit of the support plate includes：
First sending module 21, for when control support plate enters the first conveyer belt in surge chamber, being passed to described first
Band is sent to send first control signal, the first control signal indicates that first conveyer belt is run with preset First Speed；
Second sending module 22, for when receiving the first inductive signal that the first position sensor is sent, to
First conveyer belt sends second control signal, and the second control signal indicates first conveyer belt with preset acceleration
Degree gradually runs slowly；
Third sending module 23, for when receiving the second inductive signal that the second position sensor is sent, to
First conveyer belt sends third and controls signal, and the third control signal is used to indicate first conveyer belt with the second speed
Degree operation；The second speed is less than First Speed.
In one embodiment, as shown in figure 11, described device further includes：Determining module 24；
The determining module 24, for being sensed according to the First Speed, the second speed and the first position
The distance between device and the second position sensor, determine the acceleration.
In one embodiment, as shown in figure 12, described device further includes：First control module 25；
First control module 25 is entered with prefixed time interval in the surge chamber for controlling two neighboring support plate
Transmission belt.
In one embodiment, as shown in figure 13, described device further includes：First detection module 26 and the second control module
27；
Whether the first detection module 26, the transmission belt for detecting the surge chamber transfer current support plate；
Second control module 27, the transmission belt transmission for detecting the surge chamber when the first detection mould 26
When complete current support plate, next support plate is controlled into the transmission belt in the surge chamber.
In one embodiment, as shown in figure 14, described device further includes：Second detection module 28 and output module 29；
Second detection module 28, for detecting whether receiving the second position sensor is sent second simultaneously
The third inductive signal that inductive signal and the third place sensor are sent；
The output module 29 is passed for working as the detection of the second detection module 28 not while receiving the second position
When the third inductive signal that the second inductive signal and the third place sensor that sensor is sent are sent, prompt message is exported；
The prompt message is for prompting the magnetron sputtering apparatus to break down.
About the device in above-described embodiment, wherein modules execute the concrete mode of operation in related this method
Embodiment in be described in detail, explanation will be not set forth in detail herein.
Those skilled in the art will readily occur to its of the present invention after considering specification and putting into practice the invention invented here
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and includes the common knowledge in the art that the present invention does not invent
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be understood that the invention is not limited in the precision architectures for being described above and being shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (9)
1. a kind of magnetron sputtering apparatus, which is characterized in that the magnetron sputtering apparatus includes：
Controller, the surge chamber being sequentially communicated, molecule pump chamber and target chamber；
It is provided with to transmit the first conveyer belt of support plate in the surge chamber；
The surge chamber side is provided with first position sensor in the molecular pump room, the first position sensor is used
In when sensing the support plate to the controller send the first inductive signal；
The side of the target chamber is provided with second position sensor in the molecular pump room, the second position sensor is used
In when sensing the support plate to the controller send the second inductive signal；
The controller is connect with first conveyer belt, first position sensor and second position sensor respectively, is used for root
The speed of service of first conveyer belt is adjusted according to first inductive signal and second inductive signal.
2. magnetron sputtering apparatus according to claim 1, which is characterized in that close to the target chamber one in the molecular pump room
Side also sets up the third place sensor, and the third place sensor is used to send the to the controller when sensing support plate
Three inductive signals；
The controller is also connect with the third place sensor, for not receiving the second induction letter simultaneously when detection
Number and when the third inductive signal, export prompt message；The prompt message is for prompting the magnetron sputtering apparatus to occur
Failure.
3. magnetron sputtering apparatus according to claim 2, which is characterized in that the first position sensor, described second
Position sensor and the third place sensor include laser sensor.
4. a kind of transfer control method of support plate, which is characterized in that the method is applied to any one of such as claim 1-3 institutes
The control for the magnetron sputtering apparatus stated, the method includes：
When control support plate enters the first conveyer belt in surge chamber, first control signal, institute are sent to first conveyer belt
It states first control signal and indicates that first conveyer belt is run with preset First Speed；
When receiving the first inductive signal that the first position sensor is sent, the second control is sent to first conveyer belt
Signal processed, the second control signal indicate that first conveyer belt is gradually run slowly with preset acceleration；
When receiving the second inductive signal that the second position sensor is sent, third control is sent to first conveyer belt
Signal processed, the third control signal are used to indicate first conveyer belt and are run with second speed；The second speed is less than
First Speed；
When detecting that first conveyer belt transfers support plate, controls next support plate and enter first conveyer belt.
5. according to the method described in claim 4, it is characterized in that, the method further includes：
According to the First Speed, the second speed and the first position sensor and the second position sensor
The distance between, determine the acceleration.
6. according to the method described in claim 4, it is characterized in that, the method further includes：Two neighboring support plate is controlled with pre-
If time interval enters first conveyer belt.
7. according to the method described in claim 4, it is characterized in that, the method further includes：
When detecting that the transmission belt of the surge chamber transfers current support plate, controls next support plate and enter in the surge chamber
Transmission belt.
8. according to the method described in claim 4, it is characterized in that, the method further includes：
When detection does not receive the second inductive signal that the second position sensor is sent and the third place sensing simultaneously
When the third inductive signal that device is sent, prompt message is exported；The prompt message is for prompting the magnetron sputtering apparatus to occur
Failure.
9. a kind of transmission control unit of support plate, which is characterized in that described device includes：
First sending module, for when control support plate enters the first conveyer belt in surge chamber, being sent out to first conveyer belt
First control signal, the first control signal is sent to indicate that first conveyer belt is run with preset First Speed；
Second sending module, for when receiving the first inductive signal that the first position sensor is sent, to described the
One conveyer belt sends second control signal, and the second control signal indicates that first conveyer belt is gradual with preset acceleration
It runs slowly；
Third sending module, for when receiving the second inductive signal that the second position sensor is sent, to described the
One conveyer belt sends third and controls signal, and the third control signal is used to indicate first conveyer belt and is transported with second speed
Row；The second speed is less than First Speed.
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| CN201810886697.5A CN108611620A (en) | 2018-08-06 | 2018-08-06 | The transfer control method and device of magnetron sputtering apparatus, support plate |
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|---|---|---|---|
| CN201810886697.5A CN108611620A (en) | 2018-08-06 | 2018-08-06 | The transfer control method and device of magnetron sputtering apparatus, support plate |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111041443A (en) * | 2018-10-11 | 2020-04-21 | 君泰创新（北京）科技有限公司 | Coating device and coating method |
| CN111352445A (en) * | 2018-12-20 | 2020-06-30 | 东泰高科装备科技有限公司 | Carrier plate transmission control method and system |
| CN111443670A (en) * | 2020-04-02 | 2020-07-24 | 蚌埠凯盛工程技术有限公司 | Control method and device for photovoltaic glass coating production line |
| CN113120578A (en) * | 2020-01-15 | 2021-07-16 | 顺丰科技有限公司 | Transmission device, transmission mechanism control method, and storage medium |
| CN118668167A (en) * | 2024-06-27 | 2024-09-20 | 安徽华远装备科技有限公司 | Control method of magnetron sputtering coating equipment |
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| CN103451615A (en) * | 2013-05-13 | 2013-12-18 | 辽宁北宇真空科技有限公司 | Continuously winding vacuum ion film plating machine for preparing negative carbon foil of film-type capacitor |
| CN105575864A (en) * | 2014-11-03 | 2016-05-11 | 辛古勒斯技术股份公司 | Method and device for connecting matrixes in coating system together in series |
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| JPH01309967A (en) * | 1988-06-07 | 1989-12-14 | Ishikawajima Harima Heavy Ind Co Ltd | Driving device for sputtering substrate holder |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111041443A (en) * | 2018-10-11 | 2020-04-21 | 君泰创新（北京）科技有限公司 | Coating device and coating method |
| CN111352445A (en) * | 2018-12-20 | 2020-06-30 | 东泰高科装备科技有限公司 | Carrier plate transmission control method and system |
| CN113120578A (en) * | 2020-01-15 | 2021-07-16 | 顺丰科技有限公司 | Transmission device, transmission mechanism control method, and storage medium |
| CN111443670A (en) * | 2020-04-02 | 2020-07-24 | 蚌埠凯盛工程技术有限公司 | Control method and device for photovoltaic glass coating production line |
| CN118668167A (en) * | 2024-06-27 | 2024-09-20 | 安徽华远装备科技有限公司 | Control method of magnetron sputtering coating equipment |
| CN118668167B (en) * | 2024-06-27 | 2025-02-14 | 安徽华远装备科技有限公司 | A control method for magnetron sputtering coating equipment |
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