CN108600920A - a kind of bone-conduction speaker - Google Patents

Abstract

The present application relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly generates a first full magnetic field. The magnetic circuit assembly includes a first magnetic element, and the first magnetic element generates a second magnetic field. The magnetic circuit also includes a first magnetically permeable element and at least one second magnetic element. The at least one second magnetic element surrounds the first magnetic element and forms a magnetic gap with the first magnetic element. The magnetic field strength of the first full magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap.

Description

A bone conduction speaker

technical field

The present application relates to a bone conduction speaker, in particular to a magnetic circuit assembly in the bone conduction speaker.

Background technique

Bone conduction speakers can convert electrical signals into mechanical vibration signals, and transmit the vibration signals to the cochlea through human tissues and bones, allowing users to hear sounds. Compared with the air conduction speaker, which drives the air to vibrate through the diaphragm to produce sound, the bone conduction vibration speaker needs to drive the user's soft tissues and bones to vibrate, so it requires higher mechanical power. Improving the sensitivity of bone conduction speakers can make the conversion of electrical energy into mechanical energy more efficient, thereby outputting greater mechanical power. Improved sensitivity is even more important for bone conduction speakers with higher power requirements.

brief description

The present application relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly generates a first full magnetic field. The magnetic circuit assembly includes a first magnetic element, a first magnetic permeable element and at least one second magnetic element. The first magnetic element generates a second magnetic field. The at least one second magnetic element surrounds the first magnetic element and forms a magnetic gap with the first magnetic element, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic element. The magnetic field strength of the magnetic field within the magnetic gap.

According to some embodiments of the present application, the included angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.

According to some embodiments of the present application, the included angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is not less than 90 degrees.

According to some embodiments of the present application, the magnetic circuit assembly further includes a second magnetic permeable element, and at least one third magnetic element. The at least one third magnetic element is connected to the second magnetically conductive element and the at least one second magnetic element.

According to some embodiments of the present application, the included angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.

According to some embodiments of the present application, the included angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is not less than 90 degrees.

According to some embodiments of the present application, the magnetic circuit assembly further includes at least one fourth magnetic element. The at least one fourth magnetic element is located below the magnetic gap and connected to the first magnetic element and the second magnetic permeable element.

According to some embodiments of the present application, the included angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.

According to some embodiments of the present application, the included angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is no greater than 90 degrees.

According to some embodiments of the present application, the magnetic circuit assembly further includes at least one fifth magnetic element. The at least one fifth magnetic element is connected to the upper surface of the first magnetic permeable element.

According to some embodiments of the present application, the included angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is between 150 degrees and 180 degrees.

According to some embodiments of the present application, the ratio of the thickness of the first magnetic element to the sum of the thicknesses of the first magnetic element, the at least one fifth magnetic element, and the first magnetic permeable element ranges from 0.4 to 0.6.

According to some embodiments of the present application, the thickness of the at least one fifth magnetic element is equal to the thickness of the first magnetic element.

According to some embodiments of the present application, the thickness of the at least one fifth magnetic element is smaller than the thickness of the first magnetic element.

According to some embodiments of the present application, the magnetic circuit assembly further includes a third magnetic conduction element. The third magnetically permeable element is connected to the upper surface of the fifth magnetic element, and the third magnetically permeable element is configured to suppress field strength leakage of the first full magnetic field.

According to some embodiments of the present application, the first magnetic conducting element is connected to the upper surface of the first magnetic element, the second magnetic conducting element includes a bottom plate and a side wall, and the first magnetic element is connected to the first magnetic element. 2. The bottom plate of the magnetic conduction element.

According to some embodiments of the present application, the magnetic circuit assembly further includes at least one conductive element. The conductive element is connected to at least one of the first magnetic element, the first magnetically permeable element, or the second magnetically permeable element.

Some of the additional features of this application can be set forth in the description that follows. Additional features, in part, of the present application will be apparent to those skilled in the art from examination of the following description and accompanying drawings, or from knowledge of the production or operation of the embodiments. The characteristics disclosed in this application can be realized and achieved through the practice or use of various methods, means and combinations of the specific embodiments described below.

Description of drawings

The drawings described here are used to provide a further understanding of the application and constitute a part of the application. The schematic embodiments of the application and their descriptions are used to explain the application and do not limit the application. In the drawings, the same reference numerals denote the same components.

Fig. 1 is a structural block diagram of a bone conduction speaker according to some embodiments of the present application;

Fig. 2 is a schematic longitudinal sectional view of a bone conduction speaker according to some embodiments of the present application;

Fig. 3 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 4 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 5 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 6 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 7 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 8 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 9 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 10 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 11 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 12 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 13 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 14 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 15 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 16 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 17 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 18 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 19 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 20 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 21 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 22 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 23 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 24 is a schematic longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 25 is a schematic cross-sectional view of a magnetic element according to some embodiments of the present application;

Fig. 26 is a schematic diagram of a magnetic element according to some embodiments of the present application;

Fig. 27 is a schematic diagram of the magnetization direction of the magnetic element in the magnetic circuit assembly according to some embodiments of the present application;

Fig. 28 is a distribution diagram of magnetic induction lines of magnetic elements in a magnetic assembly according to some embodiments of the present application;

Fig. 29 is a schematic diagram showing the distribution of magnetic induction lines of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 30 is a relationship curve between the magnetic induction at the voice coil and the thickness of each element in the magnetic circuit assembly shown in Fig. 29 according to some embodiments of the present application;

Fig. 31 is a schematic diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 32 is a relationship curve between the magnetic induction at the voice coil and the thickness of each element in the magnetic circuit assembly shown in Fig. 31 according to some embodiments of the present application;

Fig. 33 is a schematic diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 34 is a relationship curve between the magnetic induction intensity and the thickness of the magnetic element shown in Fig. 29, Fig. 31 and Fig. 33 according to some embodiments of the present application;

Fig. 35 is a relationship curve between the magnetic induction at the voice coil and the thickness of each element in the magnetic circuit assembly shown in Fig. 33 according to some embodiments of the present application;

Fig. 36 is a schematic structural diagram of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 37 is a relationship curve between the inductive reactance in the voice coil and the conductive element in the magnetic circuit assembly shown in Fig. 36 according to some embodiments of the present application;

Fig. 38 is a schematic structural diagram of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 39 is a relationship curve between the inductive reactance in the voice coil and the conductive element in the magnetic circuit assembly shown in Fig. 38 according to some embodiments of the present application;

Fig. 40 is a schematic structural diagram of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 41 is a relationship curve between the inductance in the voice coil and the number of conductive elements in the magnetic circuit assembly shown in Fig. 40 according to some embodiments of the present application;

Fig. 42 is a schematic structural diagram of a magnetic circuit assembly according to some embodiments of the present application;

Fig. 43 is a relationship curve between the ampere force on the voice coil and the thickness of each element in the magnetic circuit assembly shown in Fig. 42 according to some embodiments of the present application;

Fig. 44 is a schematic structural diagram of a bone conduction speaker according to some embodiments of the present application;

Fig. 45 is a schematic structural diagram of a bone conduction speaker according to some embodiments of the present application;

Fig. 46 is a schematic structural diagram of a bone conduction speaker according to some embodiments of the present application; and

Fig. 47 is a schematic structural diagram of a bone conduction speaker according to some embodiments of the present application.

specific description

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings that need to be used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application, and those skilled in the art can also apply the present application to other similar scenarios. It should be understood that these exemplary embodiments are given only to enable those skilled in the relevant art to better understand and implement the present application, but not to limit the scope of the present application in any way. Unless otherwise apparent from context or otherwise indicated, like reference numerals in the figures represent like structures or operations.

As indicated in this application and claims, the terms "a", "an", "an" and/or "the" do not refer to the singular and may include the plural unless the context clearly indicates an exception. Generally speaking, the terms "comprising" and "comprising" only suggest the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list, and the method or device may also contain other steps or elements. The term "based on" is "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one further embodiment". Relevant definitions of other terms will be given in the description below. Hereinafter, without loss of generality, when describing bone conduction-related technologies in this application, the description of "bone conduction speaker" or "bone conduction earphone" will be used. This description is only a form of bone conduction application. For those of ordinary skill in the art, "speaker" or "earphone" can also be replaced by other similar words, such as "player", "hearing aid" and so on. In fact, various implementations in this application can be easily applied to other non-loudspeaker hearing devices. For example, for professionals in the field, after understanding the basic principles of bone conduction speakers, it is possible to make various forms and details of the specific methods and steps for implementing bone conduction speakers without departing from this principle. Modifications and changes, in particular, adding ambient sound pickup and processing functions to the bone conduction speaker so that the speaker functions as a hearing aid. For example, microphones and other microphones can pick up the sound of the user/wearer's surrounding environment, and under a certain algorithm, the sound is processed (or the generated electrical signal) and transmitted to the bone conduction speaker part. That is to say, the bone conduction speaker can be modified to add the function of picking up ambient sound, and after a certain signal processing, the sound can be transmitted to the user/wearer through the bone conduction speaker, so as to realize the function of the bone conduction hearing aid. As examples, the algorithms mentioned here may include noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active noise cancellation, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling One or a combination of suppression, volume control, etc.

The present application provides a high-sensitivity bone conduction speaker. In some embodiments, the bone conduction speaker may include a magnetic circuit assembly. The magnetic circuit assembly can generate a first full magnetic field. The magnetic circuit assembly may include a first magnetic element, a first magnetically permeable element, a second magnetically permeable element, and one or more second magnetic elements. The first magnetic element can generate a second magnetic field, the one or more second magnetic elements surround the first magnetic element, and form a magnetic gap with the first magnetic element, and the first full magnetic field The magnetic field strength in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. The plurality of second magnetic elements in the magnetic circuit assembly are arranged around the first magnetic element, which can reduce the volume and weight of the magnetic circuit assembly and improve the magnetic field strength of the magnetic gap and the sensitivity of the bone conduction speaker. The efficiency of bone conduction speakers increases the life of bone conduction speakers.

The bone conduction speaker has the characteristics of small size, light weight, high efficiency, high sensitivity and long service life. Optimize user experience. The wearable smart devices include, but are not limited to, smart earphones, smart glasses, smart headbands, smart helmets, smart watches, smart gloves, smart shoes, smart cameras, smart cameras, and the like. The bone conduction speaker can be further combined with smart materials, and the bone conduction speaker can be integrated in the manufacturing materials of the user's clothes, gloves, hats, shoes, etc. The bone conduction speaker can be further implanted into the human body, and cooperate with the implanted chip in the human body or an external processor to realize more personalized functions.

Fig. 1 is a structural block diagram of a bone conduction speaker 100 according to some embodiments of the present application. As shown, the bone conduction speaker 100 may include a magnetic circuit assembly 102 , a vibration assembly 104 , a support assembly 106 and a storage assembly 108 .

Magnetic circuit assembly 102 may provide a magnetic field. The magnetic field can be used to convert a signal containing sound information into a vibration signal. In some embodiments, the sound information may include video and audio files in a specific data format, or data or files that can be converted into sound through a specific method. The signal containing sound information may come from the storage component 108 of the bone conduction speaker 100 itself, or from an information generation, storage or transmission system other than the bone conduction speaker 100 . The signal containing sound information may include one or a combination of electrical signals, optical signals, magnetic signals, mechanical signals, and the like. The signal containing audio information may come from one source or multiple sources. The multiple signal sources may or may not be correlated. In some embodiments, the bone conduction speaker 100 can acquire the signal containing the sound information in a variety of different ways, and the acquisition of the signal can be wired or wireless, real-time or delayed. For example, the bone conduction speaker 100 may receive electrical signals containing sound information through wired or wireless means, or may directly obtain data from a storage medium (eg, the storage component 108 ) to generate sound signals. For another example, bone conduction hearing aids may include components with sound collection functions. By picking up sounds in the environment, the mechanical vibrations of the sounds are converted into electrical signals, which are processed by amplifiers to obtain electrical signals that meet specific requirements. In some embodiments, the wired connection may include metallic cables, optical cables, or hybrid metallic and optical cables, such as coaxial cables, communication cables, flexible cables, spiral cables, non-metallic sheathed cables, metal sheathed Cables, multi-core cables, twisted-pair cables, ribbon cables, shielded cables, telecommunication cables, twin-pair cables, parallel twin-core conductors, twisted-pair wires, etc. or a combination of more. The examples described above are only used for convenience of description, and the media of the wired connection may also be other types, for example, other transmission carriers of electrical signals or optical signals.

Wireless connections may include radio communication, free space optical communication, acoustic communication, and electromagnetic induction, among others. Among them, radio communication can include IEEE802.11 series standards, IEEE802.15 series standards (such as Bluetooth technology and Zigbee technology, etc.), first-generation mobile communication technology, second-generation mobile communication technology (such as FDMA, TDMA, SDMA, CDMA, and SSMA, etc.), general packet radio service technology, third-generation mobile communication technology (such as CDMA2000, WCDMA, TD-SCDMA, and WiMAX, etc.), fourth-generation mobile communication technology (such as TD-LTE and FDD-LTE, etc.), Satellite communication (such as GPS technology, etc.), near field communication (NFC) and other technologies operating in the ISM frequency band (such as 2.4GHz, etc.); free space optical communication can include visible light, infrared signals, etc.; acoustic communication can include sound waves, ultrasonic signals etc.; electromagnetic induction can include near-field communication technology, etc. The examples described above are only used for convenience of illustration, and the medium of wireless connection may also be of other types, for example, Z-wave technology, other charged civilian radio frequency bands and military radio frequency bands, etc. For example, as some application scenarios of the present technology, the bone conduction speaker 100 can obtain signals containing sound information from other devices through Bluetooth technology.

The vibration component 104 can generate mechanical vibrations. The generation of the vibration is accompanied by energy conversion, and the bone conduction speaker 100 can use a specific magnetic circuit component 102 and a vibration component 104 to convert a signal containing sound information into a mechanical vibration. The process of conversion may include the coexistence and conversion of many different types of energy. For example, electrical signals can be directly converted into mechanical vibrations by means of transducers to produce sound. For another example, sound information may be included in light signals, and a specific transducing device may realize the process of converting light signals into vibration signals. Other types of energy that can coexist and be converted during the working process of the transducer device include thermal energy, magnetic field energy, and the like. The energy conversion methods of the transducer device may include moving coil, electrostatic, piezoelectric, moving iron, pneumatic, electromagnetic, etc. The frequency response range and sound quality of the bone conduction speaker 100 will be affected by the vibrating component 104. For example, in a moving coil transducer, the vibrating component 104 includes a wound cylindrical coil and a vibrating body (for example, a vibrating plate). The cylindrical coil driven by the signal current drives the vibrating body to vibrate and sound in the magnetic field. The material of the vibrating body The extension and shrinkage of the bone conduction speaker 100 , the deformation, size, shape and fixing method of the folds, the magnetic density of the permanent magnet, etc., will have a great impact on the sound quality of the bone conduction speaker 100 . The vibrating body in the vibrating assembly 104 can be a mirror-symmetrical structure, a centrally-symmetrical structure or an asymmetrical structure; the vibrating body can be provided with discontinuous hole-like structures, so that the vibrating body can generate greater displacement, so that the bone conduction speaker can realize Higher sensitivity improves the output power of vibration and sound; the vibrating body can be a torus structure, and a plurality of struts converging toward the center are arranged in the torus, and the number of struts can be two or more.

The supporting component 106 can support the magnetic circuit component 102 , the vibrating component 104 and/or the storage component 108 . The support assembly 106 may include one or more housings, one or more connectors. The one or more housings may form a housing space for housing the magnetic circuit assembly 102 , the vibration assembly 104 and/or the storage assembly 108 . The one or more connectors may connect the housing to the magnetic circuit assembly 102 , the vibration assembly 104 and/or the storage assembly 108 .

The storage component 108 may store signals containing sound information. In some embodiments, storage component 108 may include one or more storage devices. The storage device may include storage devices on storage systems such as Direct Attached Storage (Direct Attached Storage), Network Attached Storage (Network Attached Storage), and Storage Area Network (Storage Area Network). Storage devices can include various storage devices such as solid-state storage devices (solid-state hard drives, solid-state hybrid hard drives, etc.), mechanical hard drives, USB flash drives, memory sticks, memory cards (such as CF, SD, etc.), other drives (such as CD, DVD, HD DVD, Blu-ray, etc.), random access memory (RAM) and read-only memory (ROM). Among them, RAM can include decimal counter tube, number selection tube, delay line memory, Williams tube, dynamic random access memory (DRAM), static random access memory (SRAM), thyristor random access memory (T-RAM), and zero-capacitance random access memory (Z-RAM), etc.; ROM can include bubble memory, magnetic button wire memory, thin film memory, magnetic plated wire memory, magnetic core memory, magnetic drum memory, optical drive, hard disk, magnetic tape, early NVRAM (non-volatile memory) , phase change memory, magnetoresistive random access memory, ferroelectric random access memory, non-volatile SRAM, flash memory, electronic erasable rewritable read-only memory, erasable programmable read-only memory, programmable read-only memory , shielded heap read memory, floating connection gate random access memory, nano random access memory, race track memory, variable resistance memory, and programmable metallization units, etc. The storage devices/storage units mentioned above are some examples, and the storage devices that can be used by the storage devices/storage units are not limited thereto.

The above description of the structure of the bone conduction speaker is only a specific example, and should not be regarded as the only possible implementation. Obviously, for professionals in the field, after understanding the basic principles of bone conduction speakers, it is possible to make various forms and details on the specific methods and steps of implementing bone conduction speakers without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, bone conduction speaker 100 may include one or more processors that may execute one or more sound signal processing algorithms. The sound signal processing algorithm can modify or strengthen the sound signal. For example, noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, etc. Or other similar processing, or any combination of the above, these amendments and changes are still within the protection scope of the claims of the present application. As another example, the bone conduction speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, and the like. The sensor can collect user information or environment information.

Fig. 2 is a schematic longitudinal sectional view of a bone conduction speaker 200 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 200 may include a first magnetic element 202 , a first magnetically conductive element 204 , a second magnetically conductive element 206 , a first vibration plate 208 , a voice coil 210 , a second vibration plate 212 and a vibration panel 214 .

The magnetic element described in this application refers to an element that can generate a magnetic field, such as a magnet or the like. The magnetic element may have a magnetization direction, which refers to the direction of the magnetic field inside the magnetic element. The first magnetic element 202 may include one or more magnets. In some embodiments, the magnets may include metal alloy magnets, ferrites, and the like. Wherein, the metal alloy magnet may include NdFeB, SmCo, AlNiCo, FeCrCo, AlFeB, FeCAl, or the like, or a combination thereof. The ferrite may include barium ferrite, iron ferrite, memanganese ferrite, lithium manganese ferrite, or the like, or combinations thereof.

The lower surface of the first magnetic permeable element 204 can be connected to the upper surface of the first magnetic element 202 . The second magnetically conductive element 206 can be connected to the first magnetic element 202 . It should be noted that the magnetic conductor mentioned here can also be called a magnetic field concentrator or an iron core. The magnetizer can adjust the distribution of the magnetic field (eg, the magnetic field generated by the first magnetic element 202 ). The magnetic conductor may comprise an element processed from soft magnetic material. In some embodiments, the soft magnetic material may include metal materials, metal alloys, metal oxide materials, amorphous metal materials, etc., such as iron, iron-silicon alloys, iron-aluminum alloys, nickel-iron alloys, iron-cobalt Alloy, low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, etc. In some embodiments, the magnetic conductor can be processed by one or more combined methods such as casting, plastic processing, cutting processing, powder metallurgy and the like. Casting can include sand casting, investment casting, pressure casting, centrifugal casting, etc.; plastic processing can include one or more combinations of rolling, casting, forging, stamping, extrusion, drawing, etc.; cutting processing can include turning, milling , planing, grinding, etc. In some embodiments, the processing method of the magnetic conductor may include 3D printing, numerical control machine tools and the like. The connection manner between the first magnetic conduction element 204 , the second magnetic conduction element 206 and the first magnetic element 202 may include one or more combinations of bonding, clamping, welding, riveting, and bolting. In some embodiments, the first magnetic element 202 , the first magnetically permeable element 204 and the second magnetically permeable element 206 may be arranged in an axisymmetric structure. The axisymmetric structure may be a ring structure, a column structure or other axisymmetric structures.

In some embodiments, a magnetic gap may be formed between the first magnetic element 202 and the second magnetic permeable element 206 . The voice coil 210 may be disposed in the magnetic gap. The voice coil 210 can be connected with the first diaphragm 208 . The first vibrating plate 208 can be connected to the second vibrating plate 212 , and the second vibrating plate 212 can be connected to the vibrating panel 214 . When the current is passed into the voice coil 210, the voice coil 210 is located in the magnetic field formed by the first magnetic element 202, the first magnetic conduction element 214 and the second magnetic conduction element 206, and will be affected by the Ampere force. The ampere force drives the voice coil 210 to vibrate, and the vibration of the voice coil 210 will drive the vibration of the first vibration plate 208 , the second vibration plate 212 and the vibration panel 214 . The vibration panel 214 transmits the vibration to the auditory nerve through tissues and bones, thereby allowing a person to hear sound. The vibration panel 214 may be in direct contact with human skin, or may be in contact with the skin through a vibration transmission layer made of specific materials.

In some embodiments, for a bone conduction speaker with a single magnetic element, the magnetic induction lines passing through the voice coil are not uniform but divergent. At the same time, magnetic flux leakage may be formed in the magnetic circuit, that is, more magnetic induction lines leak out of the magnetic gap and fail to pass through the voice coil, thereby reducing the magnetic induction intensity (or magnetic field intensity) at the position of the voice coil and affecting the bone conduction speaker. sensitivity. Therefore, the bone conduction speaker 200 may further include at least one second magnetic element and/or at least one third magnetic conductive element (not shown in the figure). The at least one second magnetic element and/or at least one third magnetically permeable element can suppress the leakage of the magnetic flux lines, constrain the shape of the magnetic flux lines passing through the voice coil, so that more magnetic flux lines pass through the sound coil as horizontally and densely as possible. coil, enhance the magnetic induction intensity (or magnetic field intensity) at the position of the voice coil, thereby improving the sensitivity of the bone conduction speaker 200, and then improving the mechanical conversion efficiency of the bone conduction speaker 200 (that is, converting the electric energy input into the bone conduction speaker 200 into the voice coil Efficiency of mechanical energy of vibration). More descriptions about the at least one second magnetic element can be found in FIGS. 3-24 .

The above description of the structure of the bone conduction speaker 200 is only a specific example, and should not be regarded as the only feasible implementation. Obviously, for professionals in the field, after understanding the basic principles of bone conduction speakers, it is possible to make various forms and details on the specific methods and steps of implementing bone conduction speakers without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the bone conduction speaker 200 may include a housing, connectors, and the like. The connecting piece can connect the vibrating panel 214 and the housing. For another example, the bone conduction speaker 200 may include a second magnetic element, and the second magnetic element may be connected to the first magnetic conduction element 204 . As another example, the bone conduction speaker 200 may further include one or more annular magnetic elements, and the annular magnetic elements may be connected to the second magnetically conductive element 206 .

Fig. 3 is a schematic longitudinal sectional view of a magnetic circuit assembly 3100 according to some embodiments of the present application. As shown in FIG. 3 , the magnetic circuit assembly 3100 may include a first magnetic element 302 , a first magnetically permeable element 304 , a second magnetically permeable element 306 and a second magnetic element 308 . In some embodiments, the first magnetic element 302 and/or the second magnetic element 308 may include any one or several types of magnets described in this application. In some embodiments, the first magnetic element 302 can include a first magnet and the second magnetic element 308 can include a second magnet, and the first magnet and the second magnet can be the same or different. The first magnetically permeable element 304 and/or the second magnetically permeable element 306 may include any one or several kinds of magnetically permeable materials described in this application. The processing method of the first magnetically permeable element 304 and/or the second magnetically permeable element 306 may include any one or several processing methods described in this application. In some embodiments, the first magnetic element 302 and/or the first magnetic permeable element 304 may be arranged in an axisymmetric structure. For example, the first magnetic element 302 and/or the first magnetic permeable element 304 may be a cylinder, a cuboid, or a hollow ring (eg, the cross section is in the shape of a racetrack). In some embodiments, the first magnetic element 302 and the first magnetic permeable element 304 may be coaxial cylinders with the same or different diameters. In some embodiments, the second magnetically conductive element 306 may be a groove-shaped structure. The groove-shaped structure may include a U-shaped cross section (as shown in FIG. 3 ). The groove-shaped second magnetic conduction element 306 may include a bottom plate and a side wall. In some embodiments, the bottom plate and the side wall may be integrally formed, for example, the side wall may be formed by extending the bottom plate in a direction perpendicular to the bottom plate. In some embodiments, the bottom plate can be connected to the side wall through any one or several connection methods described in this application. The second magnetic element 308 can be configured as a ring or a sheet. Regarding the shape of the second magnetic element 308, reference may be made to the description elsewhere in the specification (eg, FIGS. 25 and 26 and their related descriptions). In some embodiments, the second magnetic element 308 may be coaxial with the first magnetic element 302 and/or the first magnetic permeable element 304 .

The upper surface of the first magnetic element 302 can be connected to the lower surface of the first magnetic permeable element 304 . The lower surface of the first magnetic element 302 can be connected to the bottom plate of the second magnetic permeable element 306 . The lower surface of the second magnetic element 308 is connected to the sidewall of the second magnetic permeable element 306 . The connection method between the first magnetic element 302, the first magnetic conduction element 304, the second magnetic conduction element 306 and/or the second magnetic element 308 may include one or more methods such as bonding, clamping, welding, riveting, bolting, etc. Various combinations.

A magnetic gap is formed between the first magnetic element 302 and/or the first magnetic permeable element 304 and the inner ring of the second magnetic element 308 . A voice coil 328 may be disposed in the magnetic gap. In some embodiments, the heights of the second magnetic element 308 and the voice coil 328 relative to the bottom plate of the second magnetic conductive element 306 are equal. In some embodiments, the first magnetic element 302 , the first magnetically permeable element 304 , the second magnetically permeable element 306 , and the second magnetic element 308 may form a magnetic circuit. In some embodiments, the magnetic circuit assembly 3100 can generate a first full magnetic field (also referred to as "the total magnetic field of the magnetic circuit assembly"), and the first magnetic element 302 can generate a second magnetic field. The first full magnetic field is a magnetic field generated by all components in the magnetic circuit assembly 3100 (for example, the first magnetic element 302, the first magnetic element 304, the second magnetic element 306 and the second magnetic element 308) jointly formed. The magnetic field strength (also referred to as magnetic induction or magnetic flux density) of the first full magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. In some embodiments, the second magnetic element 308 can generate a third magnetic field that can increase the magnetic field strength of the first full magnetic field at the magnetic gap. The third magnetic field mentioned here increases the magnetic field strength of the first full magnetic field and refers to that the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that without the presence of the third magnetic field (that is, the presence of the second magnetic element 308). The third magnetic field is present (ie, the second magnetic element 308 is absent) of the first full magnetic field. In other embodiments in this specification, unless otherwise specified, the magnetic circuit assembly refers to the structure including all magnetic elements and magnetic permeable elements, the first full magnetic field refers to the magnetic field generated by the magnetic circuit assembly as a whole, the second magnetic field, and the third magnetic field , . . . , the Nth magnetic field respectively represent the magnetic field generated by the corresponding magnetic element. In different embodiments, the magnetic elements generating the second magnetic field (or the third magnetic field, . . . , the Nth magnetic field) may be the same or different.

In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and vertically upwards (the direction shown by a in the figure), and the magnetization direction of the second magnetic element 308 is determined by the first magnetic element 302. The inner ring of the second magnetic element 308 points to the outer ring (as indicated by b in the figure, on the right side of the first magnetic element 302 , the magnetization direction of the first magnetic element 302 is deflected by 90 degrees clockwise).

In some embodiments, at the position of the second magnetic element 308 , the included angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 308 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 308, the included angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

Compared with the magnetic circuit assembly with a single magnetic element, the second magnetic element 308 can increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3100 , thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the second magnetic element 308, the originally divergent magnetic induction lines will converge to the location of the magnetic gap, further increasing the magnetic induction in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 3100 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 3100 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the second magnetically permeable element 306 may be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 3100 may further include a magnetically permeable cover, and the magnetically permeable cover may surround the first magnetic element 302 , the first magnetically permeable element 304 , the second magnetically permeable element 306 and the second magnetic element 308 .

Fig. 4 is a schematic longitudinal sectional view of a magnetic circuit assembly 3200 according to some embodiments of the present application. As shown in FIG. 4 , different from the magnetic circuit assembly 3100 , the magnetic circuit assembly 3200 may further include a third magnetic element 310 .

The upper surface of the third magnetic element 310 is connected to the second magnetic element 308 , and the lower surface is connected to the sidewall of the second magnetic permeable element 306 . A magnetic gap may be formed between the first magnetic element 302 , the first magnetic permeable element 304 , the second magnetic element 308 and/or the third magnetic element 310 . A voice coil 328 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 302 , the first magnetically permeable element 304 , the second magnetically permeable element 306 , the second magnetic element 308 , and the third magnetic element 310 may form a magnetic circuit. In some embodiments, the magnetization direction of the second magnetic element 308 can refer to the detailed description of FIG. 3 of the present application.

In some embodiments, the magnetic circuit assembly 3200 can generate a first full magnetic field, and the first magnetic element 302 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in the Magnetic field strength within the magnetic gap. In some embodiments, the third magnetic element 310 can generate a third magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and vertically upwards (as shown in the direction a in figure), and the magnetization direction of the third magnetic element 310 is determined by the third The upper surface of the magnetic element 310 points to the lower surface (as shown in the direction c in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 180 degrees clockwise).

In some embodiments, at the position of the third magnetic element 310 , the included angle between the direction of the first full magnetic field and the magnetization direction of the third magnetic element 310 is no higher than 90 degrees. In some embodiments, at the position of the third magnetic element 310, the included angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

Compared with the magnetic circuit assembly 3100 , the magnetic circuit assembly 3200 further adds a third magnetic element 310 . The third magnetic element 310 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3200, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the third magnetic element 310 , the magnetic induction lines will further converge to the position where the magnetic gap is located, further increasing the magnetic induction in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 3200 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details of the specific manner and steps of implementing the magnetic circuit assembly 3200 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the second magnetically permeable element 306 may be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 3200 may not include the second magnetic permeable element 306 . For another example, the magnetic circuit assembly 3200 may further add at least one magnetic element. In some embodiments, the lower surface of the further added magnetic element may be connected to the upper surface of the second magnetic element 308 . The magnetization direction of the further added magnetic element is opposite to the magnetization direction of the third magnetic element 312 . In some embodiments, the further added magnetic element may connect the sidewalls of the first magnetic element 302 and the second magnetic permeable element 306 . The magnetization direction of the further added magnetic element is opposite to the magnetization direction of the second magnetic element 308 .

Fig. 5 is a schematic longitudinal sectional view of a magnetic circuit assembly 3300 according to some embodiments of the present application. As shown in FIG. 5 , different from the magnetic circuit assembly 3100 , the magnetic circuit assembly 3300 may further include a fourth magnetic element 312 .

The fourth magnetic element 312 can be connected to the side walls of the first magnetic element 302 and the second magnetic permeable element 306 by one or more combinations of bonding, clamping, welding, riveting, bolting, and the like. In some embodiments, the first magnetic element 302 , the first magnetically permeable element 304 , the second magnetically permeable element 306 , the second magnetic element 308 , and the fourth magnetic element 312 may form a magnetic gap. In some embodiments, the magnetization direction of the second magnetic element 308 can refer to the detailed description of FIG. 3 of the present application.

In some embodiments, the magnetic circuit assembly 3300 can generate a first full magnetic field, and the first magnetic element 302 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in Magnetic field strength within the magnetic gap. In some embodiments, the fourth magnetic element 312 can generate a fourth magnetic field, which can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is not higher than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and vertically upwards (as shown in the direction a in FIG. 1), and the magnetization direction of the fourth magnetic element 312 is determined by the fourth The outer ring of the magnetic element 312 points to the inner ring (as shown in the direction d in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 270 degrees clockwise).

In some embodiments, at the position of the fourth magnetic element 312 , the included angle between the direction of the first full magnetic field and the magnetization direction of the fourth magnetic element 312 is not higher than 90 degrees. In some embodiments, at the position of the fourth magnetic element 312, the included angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be 0 degrees, 10 degrees, 20 degrees, etc. Angles less than or equal to 90 degrees.

Compared with the magnetic circuit assembly 3100 , the magnetic circuit assembly 3300 further adds a fourth magnetic element 312 . The fourth magnetic element 312 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3300, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the fourth magnetic element 312 , the magnetic induction lines will further converge to the position where the magnetic gap is located, further increasing the magnetic induction in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 3300 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to describe the specific method and steps of implementing the magnetic circuit assembly 3300 in terms of form and details without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the second magnetically permeable element 306 may be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 3300 may not include the second magnetic element 308 . For another example, the magnetic circuit assembly 3300 may further add at least one magnetic element. In some embodiments, the lower surface of the further added magnetic element may be connected to the upper surface of the second magnetic element 308 . The magnetization direction of the further added magnetic element is the same as that of the first magnetic element 302 . In some embodiments, the upper surface of the further added magnetic element may be connected to the lower surface of the second magnetic element 308 . The magnetization direction of the magnetic element is opposite to the magnetization direction of the first magnetic element 302 .

Fig. 6 is a schematic longitudinal sectional view of a magnetic circuit assembly 3400 according to some embodiments of the present application. As shown in FIG. 6 , different from the magnetic circuit assembly 3100 , the magnetic circuit assembly 3400 may further include a fifth magnetic element 314 . The fifth magnetic element 314 may comprise any of the magnet materials described in this application. In some embodiments, the fifth magnetic element 314 may be configured as an axisymmetric structure. For example, the fifth magnetic element 314 may be a cylinder, a cuboid, or a hollow ring (eg, the cross section is in the shape of a racetrack). In some embodiments, the first magnetic element 302, the first magnetically permeable element 304, and/or the fifth magnetic element 314 may be coaxial cylinders with the same or different diameters. The thickness of the fifth magnetic element 314 and the first magnetic element 302 may be the same or different. The fifth magnetic element 314 can be connected to the first magnetic permeable element 304 .

In some embodiments, the angle between the magnetization direction of the fifth magnetic element 314 and the magnetization direction of the first magnetic element 302 is between 90 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the fifth magnetic element 314 and the magnetization direction of the first magnetic element 302 is between 150 degrees and 180 degrees. In some embodiments, the magnetization direction of the fifth magnetic element 314 is opposite to that of the first magnetic element 302 (direction a and direction e as shown).

Compared with the magnetic circuit assembly 3100 , the magnetic circuit assembly 3400 further adds a fifth magnetic element 314 . The fifth magnetic element 314 can suppress the magnetic flux leakage of the first magnetic element 302 in the magnetic circuit assembly 3400 in the magnetization direction, so that the magnetic field generated by the first magnetic element 302 can be compressed more into the magnetic gap, thus improving the magnetic gap. Intensity of magnetic induction.

The above description of the structure of the magnetic circuit assembly 3400 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details on the specific manner and steps of implementing the magnetic circuit assembly 3400 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the second magnetically permeable element 306 may be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 3400 may not include the second magnetic element 308 . For another example, the magnetic circuit assembly 3400 may further add at least one magnetic element. In some embodiments, the lower surface of the further added magnetic element may be connected to the upper surface of the second magnetic element 308 . The magnetization direction of the further added magnetic element is the same as that of the first magnetic element 302 . In some embodiments, the upper surface of the further added magnetic element may be connected to the lower surface of the second magnetic element 308 . The magnetization direction of the further added magnetic element is opposite to the magnetization direction of the first magnetic element 302 . In some embodiments, the further added magnetic element may connect the first magnetic element 302 and the second magnetically permeable element 306 , and the magnetization direction of the further added magnetic element is opposite to that of the second magnetic element 308 .

Fig. 7 is a schematic longitudinal sectional view of a magnetic circuit assembly 3500 according to some embodiments of the present application. As shown in FIG. 7 , different from the magnetic circuit assembly 3400 , the magnetic circuit assembly 3500 may further include a third magnetic conduction element 316 . In some embodiments, the third magnetically permeable element 316 may include any one or several kinds of magnetically permeable materials described in this application. The magnetically permeable materials included in the first magnetically permeable element 304, the second magnetically permeable element 306, and/or the third magnetically permeable element 316 may be the same or different. In some embodiments, the third magnetically permeable element 316 may be configured as a symmetrical structure. For example, the third magnetically permeable element 316 may be a cylinder. In some embodiments, the first magnetic element 302 , the first magnetically permeable element 304 , the fifth magnetic element 314 and/or the third magnetically permeable element 316 may be coaxial cylinders having the same or different diameters. The third magnetically conductive element 316 can be connected to the fifth magnetic element 314 . In some embodiments, the third magnetic element 316 can be connected to the fifth magnetic element 314 and the second magnetic element 308 . The third magnetic element 316, the second magnetic element 306 and the second magnetic element 308 can form a cavity, and the cavity can contain the first magnetic element 302, the fifth magnetic element 314 and the first magnetic element 304.

Compared with the magnetic circuit assembly 3400 , the magnetic circuit assembly 3500 further adds a third magnetic permeable element 316 . The third magnetic element 316 can suppress the magnetic flux leakage of the fifth magnetic element 314 in the magnetic circuit assembly 3500 in the magnetization direction, so that the magnetic field generated by the fifth magnetic element 314 can be more compressed into the magnetic gap, thus improving the magnetic field. Magnetic induction in the gap.

The above description of the structure of the magnetic circuit assembly 3500 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details on the specific manner and steps of implementing the magnetic circuit assembly 3500 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the second magnetically permeable element 306 may be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 3500 may not include the second magnetic element 308 . For another example, the magnetic circuit assembly 3500 may further add at least one magnetic element. In some embodiments, the lower surface of the further added magnetic element may be connected to the upper surface of the second magnetic element 308 . The magnetization direction of the further added magnetic element is the same as that of the first magnetic element 302 . In some embodiments, the upper surface of the further added magnetic element may be connected to the lower surface of the second magnetic element 308 . The magnetization direction of the further added magnetic element is opposite to the magnetization direction of the first magnetic element 302 . In some embodiments, the further added magnetic element may connect the first magnetic element 302 and the second magnetically permeable element 306 , and the magnetization direction of the further added magnetic element is opposite to that of the second magnetic element 308 .

Fig. 8 is a schematic longitudinal sectional view of a magnetic circuit assembly 3600 according to some embodiments of the present application. As shown in FIG. 8 , different from the magnetic circuit assembly 3100 , the magnetic circuit assembly 3600 may further include one or more conductive elements (eg, a first conductive element 318 , a second conductive element 320 and a third conductive element 322 ).

The conductive elements may include metal materials, metal alloy materials, inorganic non-metallic materials or other conductive materials. Metal materials may include gold, silver, copper, aluminum, etc.; metal alloy materials may include iron-based alloys, aluminum-based alloy materials, copper-based alloys, zinc-based alloys, etc.; inorganic non-metallic materials may include graphite, etc. The conductive element may be in the shape of a sheet, a ring, a mesh, or the like. The first conductive element 318 can be disposed on the upper surface of the first magnetic conductive element 304 . The second conductive element 320 can be connected to the first magnetic element 302 and the second magnetic conductive element 306 . The third conductive element 322 can be connected to the sidewall of the first magnetic element 302 . In some embodiments, the first magnetic conductive element 304 may protrude from the first magnetic element 302 to form a first recess, and the third conductive element 322 is disposed in the first recess. In some embodiments, the first conductive element 318, the second conductive element 320, and the third conductive element 322 may comprise the same or different conductive materials. The first conductive element 318, the second conductive element 320 and the third conductive element 322 can be respectively connected to the first magnetic conductive element 304, the second magnetic conductive element 306 and/or The first magnetic element 302 .

A magnetic gap is formed between the first magnetic element 302 , the first magnetic permeable element 304 and the inner ring of the second magnetic element 308 . A voice coil 328 may be disposed in the magnetic gap. The first magnetic element 302, the first magnetically permeable element 304, the second magnetically permeable element 306, and the second magnetic element 308 can form a magnetic circuit. In some embodiments, the conductive element can reduce the inductive reactance of the voice coil 328 . For example, if the voice coil 328 is supplied with a first alternating current, a first alternating induced magnetic field will be generated near the voice coil 328 . Under the action of the magnetic field in the magnetic circuit, the first alternating induction magnetic field will cause the voice coil 328 to generate inductive reactance and hinder the movement of the voice coil 328 . When a conductive element (for example, the first conductive element 318, the second conductive element 320 and the third conductive element 322) is set near the voice coil 328, under the action of the first alternating induction magnetic field, the conductive element can induce second alternating current. The third alternating current in the conductive element can generate a second alternating induction magnetic field in its vicinity, and the direction of the second alternating induction magnetic field is opposite to that of the first alternating induction magnetic field, which can weaken the first alternating induction magnetic field. Change the induction magnetic field, thereby reducing the inductance of the voice coil 328, increasing the current in the voice coil, and improving the sensitivity of the bone conduction speaker.

The above description of the structure of the magnetic circuit assembly 3600 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details on the specific manner and steps of implementing the magnetic circuit assembly 3600 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the second magnetically permeable element 306 may be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 3600 may not include the second magnetic element 308 . For another example, the magnetic circuit assembly 3500 may further add at least one magnetic element. In some embodiments, the lower surface of the further added magnetic element may be connected to the upper surface of the second magnetic element 308 . The magnetization direction of the further added magnetic element is the same as that of the first magnetic element 302 .

Fig. 9 is a schematic longitudinal sectional view of a magnetic circuit assembly 3700 according to some embodiments of the present application. As shown in Figure 9, unlike the magnetic circuit assembly 3500, the magnetic circuit assembly 3700 may further include a third magnetic element 310, a fourth magnetic element 312, a fifth magnetic element 314, a third magnetic conduction element 316, a sixth The magnetic element 324 and the seventh magnetic element 326 . The third magnetic element 310 , the fourth magnetic element 312 , the fifth magnetic element 314 , the third magnetically permeable element 316 and/or the sixth magnetic element 324 and the seventh magnetic element 326 may be arranged as coaxial annular cylinders.

In some embodiments, the upper surface of the second magnetic element 308 is connected to the seventh magnetic element 326 , and the lower surface of the second magnetic element 308 may be connected to the third magnetic element 310 . The third magnetic element 310 can be connected to the second magnetically conductive element 306 . The upper surface of the seventh magnetic element 326 can be connected to the third magnetic permeable element 316 . The fourth magnetic element 312 can connect the second magnetic element 306 and the first magnetic element 302 . The sixth magnetic element 324 can be connected to the fifth magnetic element 314 , the third magnetic permeable element 316 and the seventh magnetic element 326 . In some embodiments, the first magnetic element 302, the first magnetically permeable element 304, the second magnetically permeable element 306, the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, the fifth magnetic element 314, The third magnetic element 316 , the sixth magnetic element 324 and the seventh magnetic element 326 can form a magnetic circuit and a magnetic gap.

In some embodiments, the magnetization direction of the second magnetic element 308 can refer to the detailed description in FIG. 3 of the present application, the magnetization direction of the third magnetic element 310 can refer to the detailed description of FIG. The direction can refer to the detailed description in FIG. 5 of this application.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 324 may be between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 324 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 324 is no greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and vertically upwards (as shown in the direction a in FIG. 1 ), and the magnetization direction of the sixth magnetic element 324 is determined by the sixth The outer ring of the magnetic element 324 points to the inner ring (as shown in the direction g in the figure, on the right side of the first magnetic element 302 , the magnetization direction of the first magnetic element 302 is deflected 270 degrees clockwise). In some embodiments, in the same vertical direction, the magnetization direction of the sixth magnetic element 324 and the magnetization direction of the fourth magnetic element 312 may be the same.

In some embodiments, at the position of the sixth magnetic element 324 , the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 3700 and the magnetization direction of the sixth magnetic element 324 is not higher than 90 degrees. In some embodiments, at the position of the sixth magnetic element 324, the included angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the sixth magnetic element 324 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 326 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 326 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 326 is not higher than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is perpendicular to the lower surface or the upper surface of the first magnetic element 302 and vertically upwards (as shown in the direction a), and the magnetization direction of the seventh magnetic element 326 is determined by the seventh magnetic element 326. The lower surface of the magnetic element 326 points to the upper surface (as shown in the direction f in the figure, on the right side of the first magnetic element 302 , the magnetization direction of the first magnetic element 302 is deflected 360 degrees clockwise). In some embodiments, the magnetization direction of the seventh magnetic element 326 and the magnetization direction of the third magnetic element 310 may be opposite.

In some embodiments, at the seventh magnetic element 326 , the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 3700 and the magnetization direction of the seventh magnetic element 326 is not higher than 90 degrees. In some embodiments, at the position of the seventh magnetic element 326, the included angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the seventh magnetic element 326 may be 0 degrees, 10 degrees, or 20 degrees. and other angles less than or equal to 90 degrees.

In the magnetic circuit assembly 3700, the third magnetic conductive element 316 can close the magnetic circuit generated by the magnetic circuit assembly 3700, so that more magnetic induction lines are concentrated in the magnetic gap, so as to suppress magnetic flux leakage and increase the magnetic gap. The magnetic induction intensity and the effect of improving the sensitivity of the bone conduction speaker. The above description of the structure of the magnetic circuit assembly 3700 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details of the specific manner and steps of implementing the magnetic circuit assembly 3700 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the second magnetically permeable element 306 can be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 3700 may not include the second magnetic element 308 . For another example, the magnetic circuit assembly 3700 may further include at least one conductive element, and the conductive element may be connected to the first magnetic element 302, the fifth magnetic element 314, the first magnetic permeable element 304, the second magnetic permeable element 306 and/or The third magnetically permeable element 316 . In some embodiments, the magnetic circuit assembly 3700 can further add at least one conductive element, and the further added conductive element can connect the second magnetic element 308, the third magnetic element 310, the fourth magnetic element 312, and the sixth magnetic element 324 and at least one element of the seventh magnetic element 326 .

Fig. 10 is a schematic longitudinal sectional view of a magnetic circuit assembly 4100 according to some embodiments of the present application. As shown in FIG. 10 , the magnetic circuit assembly 4100 may include a first magnetic element 402 , a first magnetically permeable element 404 , a first full magnetic field changing element 406 and a second magnetic element 408 . In some embodiments, the first magnetic element 402 and/or the second magnetic element 408 may include any one or several types of magnets described in this application. The first magnetic element 402 may include a first magnet, the second magnetic element 408 may include a second magnet, and the first magnet and the second magnet may be the same or different. The first magnetically conductive element 404 may include any one or several magnetically permeable materials described in this application, such as low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, and the like. In some embodiments, the first magnetic element 402 and/or the first magnetic permeable element 404 may be arranged in an axisymmetric structure. The first magnetic element 402 and/or the first magnetically permeable element 404 may be cylindrical. In some embodiments, the first magnetic element 402 and the first magnetic permeable element 404 may be coaxial cylinders with the same or different diameters. In some embodiments, the first full magnetic field changing element 406 may be any one of a magnetic element or a magnetic permeable element. The first full magnetic field changing element 406 and/or the second magnetic element 408 may be configured in a ring shape or a sheet shape. A description of the first full magnetic field changing element 406 and the second magnetic element 408 can be found elsewhere in the specification (eg, FIGS. 19 and 20 and their associated descriptions). In some embodiments, the second magnetic element 408 may be an annular cylinder coaxial with the first magnetic element 402, the first magnetic permeable element 404, and/or the first full magnetic field altering element 406, containing an inner ring of the same or different diameter and /outer ring. The processing method of the first magnetic permeable element 404 and/or the first full magnetic field changing element 406 may include any one or several processing methods described in this application.

The upper surface of the first magnetic element 402 can be connected to the lower surface of the first magnetic permeable element 404 , and the second magnetic element 408 can be connected to the first magnetic element 402 and the first full magnetic field changing element 406 . The connection between the first magnetic element 402 , the first magnetic permeable element 404 , the first full magnetic field changing element 406 and/or the second magnetic element 408 may be based on any one or several connection methods described in this application. In some embodiments, the first magnetic element 402 , the first magnetically permeable element 404 , the first full magnetic field changing element 406 and/or the second magnetic element 408 may form a magnetic loop and a magnetic gap.

In some embodiments, the magnetic circuit assembly 4100 can generate a first full magnetic field, and the first magnetic element 402 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in Magnetic field strength within the magnetic gap. In some embodiments, the second magnetic element 408 can generate a third magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the second magnetic element 408 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the second magnetic element 408 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the second magnetic element 408 may not be greater than 90 degrees.

In some embodiments, at the position of the second magnetic element 408 , the included angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 408 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 408, the included angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the second magnetic element 408 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees. . For another example, the magnetization direction of the first magnetic element 402 is perpendicular to the lower surface or the upper surface of the first magnetic element 402 and vertically upwards (as shown in the direction a), and the magnetization direction of the second magnetic element 408 is determined by the second magnetic element 408 The outer ring points to the inner ring (as shown in the direction c in the figure, on the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is deflected 270 degrees clockwise).

Compared with the magnetic circuit assembly with a single magnetic element, the first full magnetic field changing element 406 in the magnetic circuit assembly 4100 can increase the total magnetic flux in the magnetic gap, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the first full magnetic field changing element 406, the originally diverging magnetic induction lines will converge to the location of the magnetic gap, further increasing the magnetic induction in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 4100 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 4100 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the magnetic circuit assembly 4100 may further include a magnetically permeable cover, and the magnetically permeable cover may include a first magnetic element 402 , a first magnetically permeable element 404 , a first full magnetic field changing element 406 and a second magnetic element 408 .

Fig. 11 is a schematic longitudinal sectional view of a magnetic circuit assembly 4200 according to some embodiments of the present application. As shown in FIG. 11 , different from the magnetic circuit assembly 4100 , the magnetic circuit assembly 4200 may further include a third magnetic element 410 .

The lower surface of the third magnetic element 410 may be connected to the first full magnetic field changing element 406 . The connection manner between the third magnetic element 410 and the first full magnetic field changing element 406 may be based on any one or several connection manners described in this application. In some embodiments, a magnetic gap may be formed between the first magnetic element 402 , the first magnetic permeable element 404 , the first full magnetic field altering element 406 , the second magnetic element 408 and/or the third magnetic element 410 . In some embodiments, the magnetic circuit assembly 4200 can generate a first full magnetic field, and the first magnetic element 402 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in the Magnetic field strength within the magnetic gap. In some embodiments, the third magnetic element 410 can generate a third magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the third magnetic element 410 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the third magnetic element 410 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the third magnetic element 410 may be equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 402 is perpendicular to the lower surface or the upper surface of the first magnetic element 402 and vertically upwards (as shown in the direction a in Figure 1), and the magnetization direction of the third magnetic element 410 is determined by the third The inner ring of the magnetic element 410 points to the outer ring (as shown in the direction b in the figure, on the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is deflected by 90 degrees clockwise).

In some embodiments, at the position of the third magnetic element 410 , the included angle between the direction of the first full magnetic field and the magnetization direction of the second magnetic element 408 is not higher than 90 degrees. In some embodiments, at the position of the third magnetic element 410, the included angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the third magnetic element 410 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

Compared with the magnetic circuit assembly 4100 , the magnetic circuit assembly 4200 further adds a third magnetic element 410 . The third magnetic element 410 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 4200, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the third magnetic element 410 , the lines of magnetic induction will further converge toward the location of the magnetic gap, thereby increasing the magnetic induction in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 4200 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to describe the specific method and steps of implementing the magnetic circuit assembly 4200 in terms of form and details without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the magnetic circuit assembly 4200 can further include a magnetically permeable cover, and the magnetically permeable cover can include a first magnetic element 402, a first magnetically permeable element 404, a first full magnetic field changing element 406, a second magnetic element 408, and a third magnetic element. Element 410.

Fig. 12 is a schematic structural diagram of a magnetic circuit assembly 4300 according to some embodiments of the present application. As shown in FIG. 12 , different from the magnetic circuit assembly 4200 , the magnetic circuit assembly 4300 may further include a fourth magnetic element 412 .

The lower surface of the fourth magnetic element 412 can be connected to the upper surface of the first full magnetic field changing element 406 , and the upper surface of the fourth magnetic element 412 can be connected to the lower surface of the second magnetic element 408 . The connection manner between the fourth magnetic element 412 and the first full magnetic field changing element 406 and the second magnetic element 408 may be based on any one or several connection manners described in this application. In some embodiments, the first magnetic element 402 , the first magnetically permeable element 404 , the first full magnetic field changing element 406 , the second magnetic element 408 , the third magnetic element 410 and/or the fourth magnetic element 412 may form magnetic gap. The magnetization directions of the second magnetic element 408 and the third magnetic element 410 can refer to the detailed description in FIG. 10 and/or 11 of the present application, respectively.

In some embodiments, the magnetic circuit assembly 4300 can generate a first full magnetic field, and the first magnetic element 402 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in Magnetic field strength within the magnetic gap. In some embodiments, the fourth magnetic element 412 can generate a third magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 may be equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 402 is perpendicular to the lower surface or the upper surface of the first magnetic element 402 and vertically upwards (as shown in the direction a in FIG. 1 ), and the magnetization direction of the fourth magnetic element 412 is determined by the fourth The upper surface of the magnetic element 412 points to the lower surface (as shown in the d direction in the figure, on the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is deflected 180 degrees clockwise).

In some embodiments, at the position of the fourth magnetic element 412 , the included angle between the direction of the first full magnetic field and the magnetization direction of the fourth magnetic element 412 is no higher than 90 degrees. In some embodiments, at the position of the fourth magnetic element 412, the included angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

Compared with the magnetic circuit assembly 4200 , the magnetic circuit assembly 4300 further adds a fourth magnetic element 412 . The fourth magnetic element 412 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 4300, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the fourth magnetic element 412 , the lines of magnetic induction will further converge toward the location of the magnetic gap, thereby increasing the magnetic induction in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 4300 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 4300 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the magnetic circuit assembly 4200 may further include one or more conductive elements, and the one or more conductive elements may be connected to the first magnetic element 402, the first magnetic conductive element 404, the second magnetic element 408, and the third magnetic element 410. and at least one of the fourth magnetic element 412 .

Fig. 13 is a schematic longitudinal sectional view of a magnetic circuit assembly 4400 according to some embodiments of the present application. As shown in FIG. 13 , different from the magnetic circuit assembly 4300 , the magnetic circuit assembly 4400 may further include a magnetic permeable cover 414 .

The magnetically permeable cover 414 may include any one or several kinds of magnetically permeable materials described in this application, for example, low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, and the like. The magnetic shield 414 can be connected to the first full magnetic field changing element 406 , the second magnetic element 408 , the third magnetic element 410 and the fourth magnetic element 412 through any one or several connection methods described in this application. The processing method of the magnetic permeable cover 414 may include any processing method described in this application, for example, one or more combinations of casting, plastic processing, cutting processing, powder metallurgy, and the like. In some embodiments, the magnetically permeable cover 414 may include a bottom plate and a side wall, and the side wall is an annular structure. In some embodiments, the bottom plate and the side wall may be integrally formed. In some embodiments, the bottom plate can be connected to the side wall through any one or several connection methods described in this application.

Compared with the magnetic circuit assembly 4300 , the magnetic circuit assembly 4400 further adds a magnetic permeable cover 414 . The magnetic permeable cover 414 can suppress the magnetic flux leakage of the magnetic circuit assembly 4300 , effectively reduce the magnetic circuit length and magnetic resistance, so that more magnetic induction lines can pass through the magnetic gap and increase the magnetic induction intensity in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 4400 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 4400 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the magnetic circuit assembly 4400 may further include one or more conductive elements, and the one or more conductive elements may be connected to the first magnetic element 402, the first magnetic conductive element 404, the second magnetic element 408, and the third magnetic element 410. and at least one of the fourth magnetic element 412 . For another example, the magnetic circuit assembly 4200 may further include a fifth magnetic element, the lower surface of the fifth magnetic element is connected to the upper surface of the first magnetic conduction element 404, and the magnetization direction of the fifth magnetic element is the same as that of the first magnetic element. The direction of magnetization of element 402 is opposite.

Fig. 14 is a schematic longitudinal sectional view of a magnetic circuit assembly 4500 according to some embodiments of the present application. As shown in FIG. 14 , different from the magnetic circuit assembly 4200 , the connecting surface of the first full magnetic field changing element 406 and the second magnetic element 408 of the magnetic circuit assembly 4500 may have a wedge-shaped cross section.

Compared with the magnetic circuit assembly 4100, the connecting surface of the first full magnetic field changing element 406 and the second magnetic element 408 of the magnetic circuit assembly 4500 is configured as a wedge-shaped cross section, which can make the magnetic induction line turn smoothly. At the same time, the wedge-shaped section can facilitate the assembly of the first full magnetic field changing element 406 and the second magnetic element 408 and can reduce the number of assembly components and reduce the weight of the bone conduction speaker.

The above description of the structure of the magnetic circuit assembly 4500 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 4500 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the magnetic circuit assembly 4500 can further include one or more conductive elements, which can connect at least one of the first magnetic element 402, the first magnetic conductive element 404, the second magnetic element 408, and the third magnetic element a component. For another example, the magnetic circuit assembly 4500 may further include a fifth magnetic element, the lower surface of the fifth magnetic element is connected to the upper surface of the first magnetic conduction element 404, and the magnetization direction of the fifth magnetic element is the same as that of the first magnetic element. The direction of magnetization of element 402 is opposite. In some embodiments, the magnetic circuit assembly 4500 may further include a magnetically permeable cover, and the magnetically permeable cover may include the first magnetic element 402, the first magnetically permeable element 404, the first full magnetic field changing element 406, the second magnetic element 408 and a third magnetic element 410 .

Fig. 15 is a schematic longitudinal sectional view of a magnetic circuit assembly 4600 according to some embodiments of the present application. As shown in FIG. 15 , different from the magnetic circuit assembly 4100 , the magnetic circuit assembly 4600 may further include a fifth magnetic element 416 . In some embodiments, fifth magnetic element 416 may include one or more magnets. The magnet may include any one or several magnet materials described in this application. In some embodiments, the fifth magnetic element 416 may include a first magnet, the first magnetic element 402 may include a second magnet, and the first magnet and the second magnet may include the same or different magnet materials. In some embodiments, the fifth magnetic element 416, the first magnetic element 402 and the first magnetic permeable element 404 can be arranged in an axisymmetric structure, for example, the fifth magnetic element 416, the first magnetic element 402 and the first magnetic permeable element 404 may be a cylinder. In some embodiments, the fifth magnetic element 416 , the first magnetic element 402 and the first magnetic permeable element 404 may be coaxial cylinders with the same or different diameters. For example, the diameter of the first magnetic element 404 may be larger than the first magnetic element 402 and/or the fifth magnetic element 416, and the sidewall of the first magnetic element 402 and/or the fifth magnetic element 416 may form a first recess and/or second recess. In some embodiments, the ratio of the thickness of the second magnetic element 416 to the sum of the thicknesses of the first magnetic element 402 , the second magnetic element 416 and the first magnetic permeable element 404 ranges from 0.4 to 0.6. The ratio of the first magnetic permeable element 404 to the sum of the thicknesses of the first magnetic element 402, the second magnetic element 416 and the first magnetic permeable element 404 ranges from 0.5 to 1.5.

In some embodiments, the angle between the magnetization direction of the fifth magnetic element 416 and the magnetization direction of the first magnetic element 402 is between 150 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the fifth magnetic element 416 and the magnetization direction of the first magnetic element 402 is between 90 degrees and 180 degrees. For example, the magnetization direction of the fifth magnetic element 416 is opposite to that of the first magnetic element 402 (direction a and direction e as shown in the figure).

Compared with the magnetic circuit assembly 4100 , the magnetic circuit assembly 4600 further adds a fifth magnetic element 416 . The fifth magnetic element 426 can suppress the magnetic flux leakage of the first magnetic element 402 in the magnetic circuit assembly 4600 in the magnetization direction, so that the magnetic field generated by the first magnetic element 402 can be more compressed into the magnetic gap, thus improving the magnetic gap. of magnetic induction.

The above description of the structure of the magnetic circuit assembly 4600 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to describe the specific method and steps of implementing the magnetic circuit assembly 4600 in terms of form and details without departing from this principle. Various modifications and changes, but still within the scope of the above description. In some embodiments, the magnetic circuit assembly 4600 can further include one or more conductive elements, and the one or more conductive elements can connect the first magnetic element 402, the first magnetic conductive element 404, the second magnetic element 408, and At least one element of the fifth magnetic element 416, such as the one or more conductive elements, may be disposed in the first recess and/or the second recess. In some embodiments, the magnetic circuit assembly 4600 can further add at least one magnetic element, and the further added magnetic element can be connected to the first full magnetic field changing element 406 . In some embodiments, the magnetic circuit assembly 4600 may further include a magnetically permeable cover, which includes a first magnetic element 402 , a first magnetically permeable element 404 , a first full magnetic field changing element 406 , and a second magnetic element 408 and fifth magnetic element 416 .

Fig. 16 is a schematic longitudinal sectional view of a magnetic circuit assembly 4700 according to some embodiments of the present application. The magnetic circuit assembly 4700 may include a first magnetic element 402 , a first magnetically permeable element 404 , a first full magnetic field changing element 406 , a second magnetic element 408 , a third magnetic element 410 , a fourth magnetic element 412 , and a fifth magnetic element 416 , the sixth magnetic element 418 , the seventh magnetic element 420 and the second ring element 422 . The first magnetic element 402 , the first magnetically permeable element 404 , the first full magnetic field changing element 406 , the second magnetic element 408 , the third magnetic element 410 , the third magnetic element 410 , the fourth magnetic element 412 and the fifth magnetic element 416 Reference can be made to the detailed description in FIGS. 10-15 of this application. In some embodiments, the first full magnetic field altering element 406 and/or the second annular element 422 may comprise an annular magnetic element or an annular magnetic permeable element. The annular magnetic element may include any one or several magnetic materials described in this application, and the annular magnetic permeable element may include any one or several magnetic materials described in this application.

In some embodiments, the sixth magnetic element 418 can be connected to the fifth magnetic element 416 and the second ring element 422 , and the seventh magnetic element 420 can be connected to the third magnetic element 410 and the second ring element 422 . In some embodiments, the first magnetic element 402, the fifth magnetic element 416, the second magnetic element 408, the third magnetic element 410, the fourth magnetic element 412, the sixth magnetic element 418, and/or the seventh magnetic element 420 are The first magnetically permeable element 404 , the first full magnetic field changing element 406 and the second annular element 422 may form a magnetic circuit.

The magnetization direction of the second magnetic element 408 can refer to the detailed description in FIG. 10 of the present application, and the magnetization directions of the third magnetic element 410, the fourth magnetic element 412, and the fifth magnetic element 416 can refer to FIGS. 11, 12 and 15 of the present application, respectively. a detailed description of .

In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the sixth magnetic element 418 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the sixth magnetic element 418 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the sixth magnetic element 418 is not higher than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 402 is perpendicular to the lower surface or the upper surface of the first magnetic element 402 and vertically upwards (as shown in the direction a in FIG. 1 ), and the magnetization direction of the sixth magnetic element 418 is determined by the sixth The outer ring of the magnetic element 418 points to the inner ring (as shown in the direction f in the figure, on the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is deflected 270 degrees clockwise). In some embodiments, the magnetization direction of the sixth magnetic element 418 and the magnetization direction of the second magnetic element 408 may be the same in the same vertical direction. In some embodiments, the magnetization direction of the first magnetic element 402 is perpendicular to the lower surface or the upper surface of the first magnetic element 402 and vertically upwards (as shown in the direction a in figure), and the magnetization direction of the seventh magnetic element 420 is determined by the seventh The lower surface of the magnetic element 420 points to the upper surface (as shown in the direction e in the figure, on the right side of the first magnetic element 402 , the magnetization direction of the first magnetic element 402 is deflected 360 degrees clockwise). In some embodiments, the magnetization direction of the seventh magnetic element 420 and the magnetization direction of the third magnetic element 412 may be the same.

In some embodiments, at the position of the sixth magnetic element 418 , the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 4700 and the magnetization direction of the sixth magnetic element 418 is not higher than 90 degrees. In some embodiments, at the position of the sixth magnetic element 418, the included angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the sixth magnetic element 418 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the seventh magnetic element 420 may be between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the seventh magnetic element 420 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the seventh magnetic element 420 is no higher than 90 degrees.

In some embodiments, at the position of the seventh magnetic element 420 , the included angle between the direction of the magnetic field generated by the magnetic circuit assembly 4700 and the magnetization direction of the seventh magnetic element 420 is not higher than 90 degrees. In some embodiments, at the position of the seventh magnetic element 420, the included angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the seventh magnetic element 420 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

In some embodiments, the first full magnetic field altering element 406 may be a ring magnetic element. In this case, the magnetization direction of the first full magnetic field altering element 406 may be the same as the magnetization direction of the second magnetic element 408 or the fourth magnetic element 412 . For example, on the right side of the first magnetic element 402 , the magnetization direction of the first full magnetic field changing element 406 can be directed from the outer ring of the first full magnetic field changing element 406 to the inner ring. In some embodiments, the second ring element 422 may be a ring magnetic element. In this case, the magnetization direction of the second ring element 422 may be the same as the magnetization direction of the sixth magnetic element 418 or the seventh magnetic element 420. For example, on the right side of the first magnetic element 402 , the magnetization direction of the second ring element 422 can be directed from the outer ring of the second ring element 422 to the inner ring.

In the magnetic circuit assembly 4700, multiple magnetic elements can increase the total magnetic flux, and the interaction of different magnetic elements can suppress the leakage of the magnetic induction line, increase the magnetic induction intensity at the magnetic gap, and improve the sensitivity of the bone conduction speaker.

The above description of the structure of the magnetic circuit assembly 4700 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 4700 without departing from this principle. Various modifications and changes, but still within the scope of the above description. In some embodiments, the magnetic circuit assembly 4700 can further include one or more conductive elements, and the one or more conductive elements can be connected to the first magnetic element 402, the first magnetic conductive element 404, the second magnetic element 408, the second At least one of the third magnetic element 410 , the fourth magnetic element 412 , the fifth magnetic element 416 , the sixth magnetic element 418 and the seventh magnetic element 420 .

Fig. 17 is a schematic longitudinal sectional view of a magnetic circuit assembly 4800 according to some embodiments of the present application. As shown in FIG. 17 , different from the magnetic circuit assembly 4700 , the magnetic circuit assembly 4800 may further include a magnetic permeable cover 414 .

The magnetically permeable cover 414 may include any one or several kinds of magnetically permeable materials described in this application, for example, low carbon steel, silicon steel sheet, silicon steel sheet, ferrite, and the like. The magnetic permeable cover 414 can be connected to the first magnetic element 402, the first full magnetic field changing element 406, the second magnetic element 408, the third magnetic element 410, and the fourth magnetic element through any one or several connection methods described in this application. 412 , fifth magnetic element 416 , sixth magnetic element 418 , seventh magnetic element 420 and second ring element 422 . The processing method of the magnetic permeable cover 414 may include any processing method described in this application, for example, one or more combinations of casting, plastic processing, cutting processing, powder metallurgy, and the like. In some embodiments, the magnetically permeable cover may include at least one bottom plate and a side wall, and the side wall is an annular structure. In some embodiments, the bottom plate and the side wall may be integrally formed. In some embodiments, the bottom plate can be connected to the side wall through any one or several connection methods described in this application. For example, the magnetically permeable cover 414 may include a first bottom plate, a second bottom plate and side walls, the first bottom plate and the side walls may be integrally formed, and the second bottom plate may be formed through any one or several methods described in this application. One connection way connects the side walls.

In the magnetic circuit assembly 4800, the magnetic permeable cover 414 can close the magnetic circuit generated by the magnetic circuit assembly 4800, so that more magnetic induction lines are concentrated in the magnetic gap in the magnetic circuit assembly 4800, so as to suppress magnetic flux leakage and increase The magnetic induction intensity at the magnetic gap and the effect of improving the sensitivity of the bone conduction speaker.

The above description of the structure of the magnetic circuit assembly 4800 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 4800 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the magnetic circuit assembly 4800 may further include one or more conductive elements, and the one or more conductive elements may be connected to the first magnetic element 402, the first magnetic conductive element 404, the second magnetic element 408, and the third magnetic element 410. , at least one of the fourth magnetic element 412 , the fifth magnetic element 416 , the sixth magnetic element 418 and the seventh magnetic element 420 .

Fig. 18 is a schematic longitudinal sectional view of a magnetic circuit assembly 4900 according to some embodiments of the present application. As shown in FIG. 18 , different from the magnetic circuit assembly 4100 , the magnetic circuit assembly 4900 may further include one or more conductive elements (eg, a first conductive element 424 , a second conductive element 426 and a third conductive element 428 ).

The description of the conductive elements is similar to that of the conductive element 318 , the conductive element 320 and the conductive element 322 , and their related descriptions will not be repeated here.

The above description of the structure of the magnetic circuit assembly 4900 is only a specific example and should not be considered as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 4900 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the magnetic circuit assembly 4900 may further include at least one magnetic element and/or magnetic permeable element.

Fig. 19 is a schematic longitudinal sectional view of a magnetic circuit assembly 5100 according to some embodiments of the present application. As shown in FIG. 19 , the magnetic circuit assembly 5100 may include a first magnetic element 502 , a first magnetically permeable element 504 , a second magnetically permeable element 506 and a second magnetic element 508 .

In some embodiments, the first magnetic element 502 and/or the second magnetic element 508 may include any one or several types of magnets described in this application. In some embodiments, the first magnetic element 502 can include a first magnet and the second magnetic element 508 can include a second magnet, and the first magnet and the second magnet can be the same or different. The first magnetically permeable element 504 and/or the second magnetically permeable element 506 may include any one or several kinds of magnetically permeable materials described in this application. The processing method of the first magnetic permeable element 504 and/or the second magnetic permeable element 506 may include any one or several processing methods described in this application. In some embodiments, the first magnetic element 502 , the first magnetically permeable element 504 and/or the second magnetic element 508 may be arranged in an axisymmetric structure. For example, the first magnetic element 502, the first magnetically permeable element 504, and/or the second magnetic element 508 may be cylinders. In some embodiments, the first magnetic element 502, the first magnetically permeable element 504, and/or the second magnetic element 508 may be coaxial cylinders having the same or different diameters. The thickness of the first magnetic element 502 may be greater than or equal to the thickness of the second magnetic element 508. In some embodiments, the second magnetically conductive element 506 may be a groove-shaped structure. The groove-shaped structure may include a U-shaped cross section (as shown in FIG. 19 ). The groove-shaped second magnetic conduction element 506 may include a bottom plate and a side wall. In some embodiments, the bottom plate and the side wall may be integrally formed, for example, the side wall may be formed by extending the bottom plate in a direction perpendicular to the bottom plate. In some embodiments, the bottom plate can be connected to the side wall through any one or several connection methods described in this application. The second magnetic element 508 can be configured as a ring or a sheet. Regarding the shape of the second magnetic element 508, reference may be made to the description elsewhere in the specification (eg, FIGS. 25 and 26 and their related descriptions). In some embodiments, the second magnetic element 508 may be coaxial with the first magnetic element 502 and/or the first magnetic permeable element 504.

The upper surface of the first magnetic element 502 can be connected to the lower surface of the first magnetic permeable element 504 . The lower surface of the first magnetic element 502 can be connected to the bottom plate of the second magnetic permeable element 506 . The lower surface of the second magnetic element 508 is connected to the upper surface of the first magnetic permeable element 504 . The connection between the first magnetic element 502, the first magnetic conduction element 504, the second magnetic conduction element 506 and/or the second magnetic element 508 may include one or more methods such as bonding, clamping, welding, riveting, bolting, etc. Various combinations.

A magnetic gap is formed between the first magnetic element 502 , the first magnetic permeable element 504 and/or the second magnetic element 508 and the sidewall of the second magnetic permeable element 506 . The voice coil 520 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 502 , the first magnetically permeable element 504 , the second magnetically permeable element 506 , and the second magnetic element 508 may form a magnetic circuit. In some embodiments, the magnetic circuit assembly 5100 can generate a first full magnetic field, and the first magnetic element 502 can generate a second magnetic field. The first full magnetic field is common to the magnetic fields generated by all components in the magnetic circuit assembly 5100 (for example, the first magnetic element 502, the first magnetic element 504, the second magnetic element 506, and the second magnetic element 508). form. The magnetic field strength (also referred to as magnetic induction or magnetic flux density) of the first full magnetic field in the magnetic gap is greater than the magnetic field strength of the second magnetic field in the magnetic gap. In some embodiments, the second magnetic element 508 can generate a third magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the angle between the magnetization direction of the second magnetic element 508 and the magnetization direction of the first magnetic element 502 is between 90 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the second magnetic element 508 and the magnetization direction of the first magnetic element 502 is between 150 degrees and 180 degrees. In some embodiments, the magnetization direction of the second magnetic element 508 is opposite to that of the first magnetic element 502 (direction a and direction b as shown).

Compared with the magnetic circuit assembly with a single magnetic element, the magnetic circuit assembly 5100 has a second magnetic element 508 added. The magnetization direction of the second magnetic element 508 is opposite to the magnetization direction of the first magnetic element 502, which can suppress the leakage flux of the first magnetic element 502 in the magnetization direction, so that the magnetic field generated by the first magnetic element 502 can be more compressed into the magnetic field. In the gap, thus increasing the magnetic induction in the magnetic gap.

The above description of the structure of the magnetic circuit assembly 5100 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone magnetic circuit assembly, it is possible to make formal and detailed descriptions of the specific methods and steps for implementing the magnetic circuit assembly 5100 without departing from this principle. Various modifications and changes, but still within the scope of the above description. For example, the second magnetically permeable element 506 may be a ring structure or a sheet structure. For another example, the magnetic circuit assembly 5100 may further include a conductive element, and the conductive element may connect the first magnetic element 502 , the first magnetically conductive element 504 , the second magnetically conductive element 506 and the second magnetic element 508 .

Fig. 20 is a schematic longitudinal sectional view of a magnetic circuit assembly 5200 according to some embodiments of the present application. As shown in FIG. 20 , different from the magnetic circuit assembly 5100 , the magnetic circuit assembly 5200 may further include a third magnetic element 510 .

The lower surface of the third magnetic element 510 is connected to the sidewall of the second magnetic permeable element 506 . A magnetic gap may be formed between the first magnetic element 502, the first magnetic permeable element 504, the second magnetic element 508, and/or the third magnetic element 510. The voice coil 520 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 502 , the first magnetically permeable element 504 , the second magnetically permeable element 506 , the second magnetic element 508 , and the third magnetic element 510 may form a magnetic circuit. In some embodiments, the magnetization direction of the second magnetic element 508 can refer to the detailed description of FIG. 3 of the present application.

In some embodiments, the magnetic circuit assembly 5200 can generate a first full magnetic field, and the first magnetic element 502 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in Magnetic field strength within the magnetic gap. In some embodiments, the third magnetic element 510 can generate a third magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the third magnetic element 510 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the third magnetic element 510 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the third magnetic element 510 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 502 is perpendicular to the lower surface or the upper surface of the first magnetic element 502 and is vertically upward (the direction shown by a in the figure), and the magnetization direction of the third magnetic element 510 is determined by the first magnetic element 502. The inner ring of the three magnetic elements 510 points to the outer ring (as indicated by c in the figure, on the right side of the first magnetic element 502, the magnetization direction of the first magnetic element 502 is deflected 90 degrees clockwise).

In some embodiments, at the position of the third magnetic element 510 , the included angle between the direction of the first full magnetic field and the magnetization direction of the third magnetic element 510 is not higher than 90 degrees. In some embodiments, at the position of the third magnetic element 510, the included angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the third magnetic element 510 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees.

Compared with the magnetic circuit assembly 5100 , the magnetic circuit assembly 5200 further adds a third magnetic element 510 . The third magnetic element 510 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5200, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the third magnetic element 510 , the magnetic induction lines will further converge to the position where the magnetic gap is located, further increasing the magnetic induction in the magnetic gap.

Fig. 21 is a schematic longitudinal sectional view of a magnetic circuit assembly 5300 according to some embodiments of the present application. As shown in FIG. 21 , different from the magnetic circuit assembly 5100 , the magnetic circuit assembly 5300 may further include a fourth magnetic element 512 .

The fourth magnetic element 512 can be connected to the side walls of the first magnetic element 502 and the second magnetic permeable element 506 through one or more combinations of adhesion, clamping, welding, riveting, bolting, and the like. In some embodiments, the first magnetic element 502 , the first magnetically permeable element 504 , the second magnetically permeable element 506 , the second magnetic element 508 , and the fourth magnetic element 512 may form a magnetic gap. In some embodiments, the magnetization direction of the second magnetic element 508 can refer to the detailed description of FIG. 19 of the present application.

In some embodiments, the magnetic circuit assembly 5200 can generate a first full magnetic field, and the first magnetic element 502 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in Magnetic field strength within the magnetic gap. In some embodiments, the fourth magnetic element 512 can generate a fourth magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fourth magnetic element 512 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fourth magnetic element 512 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fourth magnetic element 512 is no greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 502 is perpendicular to the lower surface or the upper surface of the first magnetic element 502 and vertically upwards (as shown in the direction a in FIG. 1), and the magnetization direction of the fourth magnetic element 512 is determined by the fourth The outer ring of the magnetic element 512 points to the inner ring (as shown in the direction e in the figure, on the right side of the first magnetic element 502, the magnetization direction of the first magnetic element 502 is deflected 270 degrees clockwise).

In some embodiments, at the position of the fourth magnetic element 512 , the included angle between the direction of the first full magnetic field and the magnetization direction of the fourth magnetic element 512 is no higher than 90 degrees. In some embodiments, at the position of the fourth magnetic element 512, the included angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the fourth magnetic element 512 may be 0 degrees, 10 degrees, 20 degrees, etc. Angles less than or equal to 90 degrees.

Compared with the magnetic circuit assembly 5200 , the magnetic circuit assembly 5300 further adds a fourth magnetic element 512 . The fourth magnetic element 512 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5300, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the fourth magnetic element 512 , the magnetic induction lines will further converge to the position where the magnetic gap is located, further increasing the magnetic induction in the magnetic gap.

Fig. 22 is a schematic longitudinal sectional view of a magnetic circuit assembly 5400 according to some embodiments of the present application. As shown in FIG. 22 , different from the magnetic circuit assembly 5200 , the magnetic circuit assembly 5400 may further include a fifth magnetic element 514 .

The lower surface of the third magnetic element 510 is connected to the fifth magnetic element 514 , and the lower surface of the fifth magnetic element 514 is connected to the sidewall of the second magnetic permeable element 506 . A magnetic gap may be formed between the first magnetic element 502 , the first magnetic permeable element 504 , the second magnetic element 508 and/or the third magnetic element 510 . The voice coil 520 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 502 , the first magnetically permeable element 504 , the second magnetically permeable element 506 , the second magnetic element 508 , the third magnetic element 510 , and the fifth magnetic element 514 may form a magnetic circuit. In some embodiments, the magnetization direction of the second magnetic element 508 and the third magnetic element 510 can refer to the detailed description of FIGS. 19 and 20 of the present application.

In some embodiments, the magnetic circuit assembly 5400 can generate a first full magnetic field, and the first magnetic element 502 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in Magnetic field strength within the magnetic gap. In some embodiments, the fifth magnetic element 514 can generate a fifth magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fifth magnetic element 514 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fifth magnetic element 514 is between 45 degrees and 135 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fifth magnetic element 514 is equal to or greater than 90 degrees.

In some embodiments, at the position of the fifth magnetic element 514 , the included angle between the direction of the first full magnetic field and the magnetization direction of the fifth magnetic element 514 is not higher than 90 degrees. In some embodiments, at the position of the fifth magnetic element 514, the included angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the fifth magnetic element 514 may be 0 degrees, 10 degrees, or 20 degrees. Angles less than or equal to 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 502 is perpendicular to the lower surface or the upper surface of the first magnetic element 502 and vertically upwards (as shown in the direction a), and the magnetization direction of the fifth magnetic element 514 is determined by the fifth The upper surface of the magnetic element 514 points to the lower surface (as shown in the direction d in the figure, on the right side of the first magnetic element 502 , the magnetization direction of the first magnetic element 502 is deflected 180 degrees clockwise).

Compared with the magnetic circuit assembly 5200 , the magnetic circuit assembly 5400 further adds a fifth magnetic element 514 . The fifth magnetic element 514 can further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5400, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the fourth magnetic element 514 , the magnetic induction lines will further converge to the position where the magnetic gap is located, further increasing the magnetic induction in the magnetic gap.

Fig. 23 is a schematic longitudinal sectional view of a magnetic circuit assembly 5500 according to some embodiments of the present application. As shown in FIG. 23 , different from the magnetic circuit assembly 5300 , the magnetic circuit assembly 5500 may further include a sixth magnetic element 516 .

The sixth magnetic element 516 can be connected to the second magnetic element 508 and the side wall of the second magnetic permeable element 506 by one or more combinations of bonding, clamping, welding, riveting, and bolting. In some embodiments, the first magnetic element 502 , the first magnetically permeable element 504 , the second magnetically permeable element 506 , the second magnetic element 508 , the fourth magnetic element 512 , and the sixth magnetic element 516 may form a magnetic gap. In some embodiments, the magnetization directions of the second magnetic element 508 and the fourth magnetic element 512 can refer to the detailed description of FIGS. 19 and 21 of the present application.

In some embodiments, the magnetic circuit assembly 5500 can generate a first full magnetic field, and the first magnetic element 502 can generate a second magnetic field, and the magnetic field strength of the first full magnetic field in the magnetic gap is greater than that of the second magnetic field in Magnetic field strength within the magnetic gap. In some embodiments, the sixth magnetic element 516 can generate a sixth magnetic field that can increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the included angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the sixth magnetic element 516 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the sixth magnetic element 516 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the sixth magnetic element 516 is no greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 502 is perpendicular to the lower surface or the upper surface of the first magnetic element 502 and vertically upwards (as shown in the direction a in FIG. 1 ), and the magnetization direction of the sixth magnetic element 516 is determined by the sixth The outer ring of the magnetic element 516 points to the inner ring (as shown in the direction f in the figure, on the right side of the first magnetic element 502, the magnetization direction of the first magnetic element 502 is deflected clockwise by 270 degrees).

In some embodiments, at the position of the sixth magnetic element 516 , the included angle between the direction of the first full magnetic field and the magnetization direction of the sixth magnetic element 516 is not higher than 90 degrees. In some embodiments, at the position of the sixth magnetic element 516, the included angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the sixth magnetic element 516 may be 90 degrees, 110 degrees, or 120 degrees. Angles greater than 90 degrees.

Compared with the magnetic circuit assembly 5100 , the magnetic circuit assembly 5500 further adds a fourth magnetic element 512 and a sixth magnetic element 516 . The fourth magnetic element 512 and the sixth magnetic element 516 can increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5500, increase the magnetic induction intensity at the magnetic gap, and thus improve the sensitivity of the bone conduction speaker.

Fig. 24 is a schematic longitudinal sectional view of a magnetic circuit assembly 5600 according to some embodiments of the present application. As shown in FIG. 24 , different from the magnetic circuit assembly 5100 , the magnetic circuit assembly 5600 may further include a third magnetic conduction element 518 .

In some embodiments, the third magnetically permeable element 518 may include any one or several kinds of magnetically permeable materials described in this application. The magnetically permeable materials included in the first magnetically permeable element 504 , the second magnetically permeable element 506 and/or the third magnetically permeable element 518 may be the same or different. In some embodiments, the third magnetically permeable element 5186 can be configured as a symmetrical structure. For example, the third magnetically permeable element 518 may be a cylinder. In some embodiments, the first magnetic element 502, the first magnetically permeable element 504, the second magnetic element 508, and/or the third magnetically permeable element 518 may be coaxial cylinders having the same or different diameters. The third magnetically conductive element 518 can be connected to the second magnetic element 508 . In some embodiments, the third magnetically permeable element 518 can connect the second magnetically permeable element 5084 and the second magnetically permeable element 506 so that the third magnetically permeable element 518 and the second magnetically permeable element 506 form a cavity, and the cavity A first magnetic element 502 , a second magnetic element 508 and a first magnetic permeable element 504 may be included.

Compared with the magnetic circuit assembly 5100 , the magnetic circuit assembly 5600 further adds a third magnetic permeable element 518 . The third magnetic element 518 can suppress the magnetic leakage of the second magnetic element 508 in the magnetic circuit assembly 5600 in the magnetization direction, so that the magnetic field generated by the second magnetic element 508 can be compressed into the magnetic gap more, thereby improving the magnetic field. Magnetic induction in the gap.

Fig. 25 is a schematic cross-sectional view of a magnetic element structure according to some embodiments of the present application. The magnetic element 600 can be used in any magnetic circuit assembly in the present application (for example, the magnetic circuit assembly shown in FIGS. 3-24 ). As shown, the magnetic element 600 may be annular. Magnetic element 600 may include an inner ring 602 and an outer ring 604 . In some embodiments, the shape of the inner ring 602 and/or the outer ring 604 may be a circle, an ellipse, a triangle, a quadrangle or other arbitrary polygons.

Fig. 26 is a schematic diagram of a structure of a magnetic element according to some embodiments of the present application. The magnetic element may be applicable to any magnetic circuit assembly in the present application (for example, the magnetic circuit assembly shown in FIGS. 3-24 ). As shown, the magnetic element may consist of a plurality of magnet arrangements. The two ends of any one of the magnets may be connected to the two ends of the adjacent magnets or have a certain distance therebetween. The spacing between multiple magnets can be the same or different. In some embodiments, the magnetic element may be composed of two or three sheet-shaped magnets (eg, magnets 608-2, 608-4, and 608-6) arranged equidistantly. The shape of the sheet-shaped magnet may be fan-shaped, quadrangle-shaped, or the like.

Fig. 27 is a schematic diagram of the magnetization directions of the magnetic elements in the magnetic circuit assembly according to some embodiments of the present application. As shown in the figure, the magnetic circuit assembly may include a first magnetic element 601 , a second magnetic element 603 and a third magnetic element 605 . The magnetization direction of the first magnetic element 601 can be directed from the lower surface of the first magnetic element 601 to the upper surface (that is, the direction perpendicular to the surface of the paper). The second magnetic element 603 can be disposed around the first magnetic element 601 . A magnetic gap may be formed between the inner ring of the second magnetic element 503 and the inner ring of the first magnetic element 601 . The magnetization direction of the second magnetic element 603 can be directed from the inner ring to the outer ring of the second magnetic element 603 . The inner ring of the third magnetic element 605 can be connected to the outer ring of the first magnetic element 601 , and the outer ring of the third magnetic element 605 can be connected to the inner ring of the second magnetic element 603 . The magnetization direction of the third magnetic element 605 can be directed from the outer ring to the inner ring of the third magnetic element 603 .

Fig. 28 is a schematic diagram of magnetic induction lines of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application. As shown, a magnetic circuit assembly 600 (eg, the magnetic circuit assembly shown in FIGS. 3-24 ) may include a first magnetic element 602 and a second magnetic element 604 . The magnetization direction of the first magnetic element 602 may be such that the lower surface of the first magnetic element 602 points to the upper surface (shown by arrow a). The first magnetic element 602 can generate a second magnetic field, and the second magnetic field can be represented by magnetic induction lines (the solid line in the figure represents the distribution of the second magnetic field without the presence of the second magnetic element 604), and the second The direction of the magnetic field at a certain point is the tangent direction of the point on the magnetic induction line. The magnetization direction of the second magnetic element 604 may be such that the inner ring of the second magnetic element 604 points to the outer ring (as shown by arrow b). The second magnetic element 604 can generate a third magnetic field. The third magnetic field can also be represented by magnetic induction lines (the dotted line in the figure represents the distribution of the third magnetic field in the absence of the first magnetic element 602), and the magnetic field direction of the third magnetic field at a certain point is Tangent direction on the third magnetic induction line. Under the interaction of the second magnetic field and the third magnetic field, the magnetic circuit assembly 600 can generate a first full magnetic field. The magnetic field strength of the first full magnetic field at the voice coil 606 is greater than the magnetic field strength of the second magnetic field or the third magnetic field at the voice coil 606 . As shown in the figure, the included angle between the magnetic field direction of the second magnetic field at the voice coil 606 and the magnetization direction of the second magnetic element 604 is less than or equal to 90 degrees.

Fig. 29 is a schematic diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly 700 according to some embodiments of the present application. As shown in the figure, the magnetic circuit assembly 700 may include a first magnetic element 702 , a first magnetically permeable element 704 , a second magnetically permeable element 706 and a second magnetic element 714 . The first magnetic element 702, the first magnetic element 704, the second magnetic element 706, and the second magnetic element 714 can refer to the first magnetic element 302, the first magnetic element 304, and the second magnetic element 302 in FIG. 6 of this application. Detailed description of element 306 and second magnetic element 314 . The magnetization direction of the first magnetic element 702 is opposite to the magnetization direction of the second magnetic element 714, and the magnetic field lines generated by the first magnetic element 702 interact with the magnetic field lines generated by the second magnetic element 714, so that the first magnetic element 702 The magnetic flux generated by the second magnetic element 714 and the magnetic flux generated by the second magnetic element 714 can pass through the voice coil 728 more perpendicularly, reducing the magnetic flux leaked by the magnetization direction of the first magnetic element 702 at the voice coil 728 .

FIG. 30 is a graph showing the relationship between the magnetic induction at the voice coil and the thickness of the elements in the magnetic circuit assembly 700 shown in FIG. 29 according to some embodiments of the present application. Wherein, the abscissa is the sum of the thickness (h3) of the first magnetic element 702 and the thickness (h3) of the first magnetic element 702, the thickness (h2) of the first magnetic permeable element 704 and the thickness (h5) of the second magnetic element 714 ( The ratio of h2+h3+h5) is hereinafter referred to as the first thickness ratio. The ordinate is the normalized magnetic induction at the voice coil 728, which can be the ratio of the actual magnetic induction at the voice coil 728 to the maximum magnetic induction under the magnetic circuit formed by the single magnetic circuit assembly. The single magnetic circuit component may refer to that the magnetic circuit formed by the magnetic circuit component includes only one magnetic element. For example, the single magnetic circuit assembly may include a first magnetic element, a first magnetically permeable element, and a second magnetically permeable element. The volume of the magnetic elements in the single magnetic circuit assembly is the same as that of the magnetic elements in the multi-magnetic circuit assembly corresponding to the single magnetic circuit assembly (for example, the first magnetic element 702 and the second magnetic element 714 in the magnetic circuit assembly 700) The sum of the volumes is equal. k is the ratio of the thickness (h2) of the first magnetic element 704 to the sum of the thicknesses (h2+h3+h5) of the first magnetic element 702, the first magnetic element 704 and the second magnetic element 714, hereinafter referred to as the second Thickness ratio (indicated by "k" in the figure). As shown in the figure, with the gradual increase of the first thickness ratio, the magnetic induction at the voice coil 728 gradually increases, and gradually decreases after reaching a certain value, that is, the magnetic induction at the voice coil 728 has a maximum value, The range of the first thickness ratio corresponding to the maximum value is between 0.4-0.6. The range of the second thickness ratio corresponding to the maximum value is between 0.26-0.34.

Fig. 31 is a schematic diagram showing the distribution of magnetic flux lines of a magnetic group 800 according to some embodiments of the present application. As shown in the figure, the magnetic circuit assembly 800 may include a first magnetic element 802 , a first magnetically permeable element 804 , a second magnetically permeable element 806 , a second magnetic element 814 and a third magnetically permeable element 816 . The first magnetic element 802, the first magnetic element 804, the second magnetic element 806, the second magnetic element 814, and the third magnetic element 816 can refer to the first magnetic element 302 and the first magnetic element 302 in FIG. 7 of this application. Detailed description of the element 304 , the second magnetically permeable element 306 , the second magnetic element 308 , the second magnetic element 314 and the third magnetically permeable element 316 . Wherein, the third magnetic permeable element 816 is not connected with the second magnetic permeable element 806 . The magnetization direction of the first magnetic element 802 is opposite to the magnetization direction of the second magnetic element 814, and the magnetic field lines generated by the first magnetic element 802 interact with the magnetic field lines generated by the second magnetic element 814, so that the first magnetic element 802 The magnetic flux generated by the second magnetic element 814 and the magnetic flux generated by the second magnetic element 814 can pass through the voice coil 828 more perpendicularly, reducing the magnetic flux leaked by the first magnetic element 802 at the voice coil 828 . The third magnetically permeable plate 816 further reduces the leakage magnetic flux lines of the first magnetic element 802 at the voice coil 828 .

Fig. 32 is a graph showing the relationship between the magnetic induction at the voice coil and the thickness of the elements in the magnetic circuit assembly according to some embodiments of the present application. Wherein, curve a corresponds to the magnetic circuit assembly 700 shown in FIG. 29 , and curve b corresponds to the magnetic circuit assembly 800 shown in FIG. 31 . The abscissa is the first thickness ratio, and the ordinate is the normalized magnetic induction at the voice coil 728 or 828. The first thickness ratio and the normalized magnetic induction can refer to the detailed description in FIG. 7 of this application. Curve a is the relationship between the magnetic induction of the voice coil 728 in the magnetic circuit assembly 700 and the first thickness ratio, and curve b is the relationship between the magnetic induction of the voice coil 828 in the magnetic circuit assembly 800 and the first thickness ratio. As shown in FIG. 32 , in the magnetic circuit assembly 800 provided with the third magnetically permeable element 816 , when the first thickness ratio ranges between 0-0.55, the magnetic induction at the voice coil 828 is significantly stronger than that at the voice coil 728 The magnetic induction intensity (such as the magnetic induction intensity corresponding to the curve b is higher than the magnetic induction intensity corresponding to the curve a). When the range of the first thickness ratio is between 0.55-1, the magnetic induction at the voice coil 828 is significantly lower than the magnetic induction at the voice coil 728 (such as the magnetic induction corresponding to curve b is lower than the magnetic induction corresponding to curve a ).

Fig. 33 is a schematic diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly 900 according to some embodiments of the present application. As shown in the figure, the magnetic circuit assembly 900 may include a first magnetic element 902 , a first magnetically permeable element 904 , a second magnetically permeable element 906 , a second magnetic element 914 and a third magnetically permeable element 916 . The first magnetic element 902, the first magnetic element 904, the second magnetic element 906, the second magnetic element 914, and the third magnetic element 916 can refer to the first magnetic element 302 and the first magnetic element 302 in FIG. 7 of this application. Detailed description of the element 304 , the second magnetic element 306 , the second magnetic element 308 , the fifth magnetic element 314 and the third magnetic element 316 . The third magnetically permeable element 916 is connected to the second magnetically permeable element 906 . The magnetization direction of the first magnetic element 902 is opposite to the magnetization direction of the second magnetic element 914 . The magnetic field of the first magnetic element 902 and the magnetic field of the second magnetic element 914 repel each other at the junction of the first magnetic element 902 and the second magnetic element 914, so that the originally divergent magnetic field (for example, only generated by the first magnetic element 902 The magnetic field or only the magnetic field generated by the second magnetic element 914 ) can pass through the voice coil 928 under the action of the mutually repulsive magnetic field, thereby increasing the magnetic field strength at the voice coil 928 . The third magnetically permeable plate 916 is connected to the second magnetically permeable element 906, so that the magnetic field of the second magnetically permeable element 914 and the first magnetic element 902 is bound in the magnetic circuit formed by the second magnetically permeable element 906 and the third magnetically permeable element 916 , further increasing the magnetic induction at the voice coil 928 .

Fig. 34 is a graph showing the relationship between the magnetic induction intensity and the thickness of each element in the magnetic circuit assembly according to some embodiments of the present application. Wherein, curve a corresponds to the magnetic circuit assembly 700 shown in FIG. 29 , curve b corresponds to the magnetic circuit assembly 800 shown in FIG. 31 , and curve c corresponds to the magnetic circuit assembly 900 shown in FIG. 33 . The abscissa is the thickness (h3) of the first magnetic element (702, 802, 902), and the sum (h3+ The ratio of h5) is hereinafter referred to as the third thickness ratio. The ordinate is the normalized magnetic induction at the voice coil (728, 828, 928), and the normalized magnetic induction can refer to the detailed description in FIG. 30 of the present application. Curve a is the change relationship curve between the magnetic induction intensity of the voice coil 728 in the magnetic circuit assembly 700 and the first thickness ratio, and curve b is the change relationship curve between the magnetic induction intensity of the voice coil 828 in the magnetic circuit assembly 800 and the first thickness ratio, Curve c is a relationship curve between the magnetic induction of the voice coil 928 in the magnetic circuit assembly 900 and the first thickness ratio. As shown in FIG. 34 , the magnetic circuit components 800 and 900 including the third magnetically permeable element (for example, magnetically permeable element 814, magnetically permeable element 914), when the first thickness ratio is less than 0.7, the corresponding voice coil (for example, The magnetic induction at the voice coil 828, voice coil 928) is stronger than the magnetic induction at the voice coil 728 in the magnetic circuit assembly 700 that does not contain the third magnetic conductive element (such as the magnetic induction corresponding to curve b and curve c is higher than that corresponding to curve a magnetic induction intensity). When the third magnetically permeable element is connected to the second magnetically permeable element (for example, the third magnetically permeable element 916 in the magnetic circuit assembly 900 is connected to the second magnetically permeable element 906), the magnetic induction at the voice coil 928 is stronger than The magnetic induction at the voice coil 828 (for example, the magnetic induction corresponding to curve c is higher than the magnetic induction corresponding to curve b).

FIG. 35 is a graph showing the relationship between the magnetic induction at the voice coil and the thickness of the elements in the magnetic circuit assembly 900 shown in FIG. 33 according to some embodiments of the present application. The abscissa is the second thickness ratio (indicated by "k" in the figure), and the ordinate is the normalized magnetic induction at the voice coil 928. The second thickness ratio and the normalized magnetic induction can refer to the figure of this application 30 for a detailed description. As shown in FIG. 35 , as the second thickness ratio gradually increases, the magnetic induction at the voice coil 928 gradually increases to a maximum value and then decreases. The range of the second thickness ratio corresponding to the maximum value of magnetic induction is between 0.3-0.6.

Fig. 36 is a schematic structural diagram of a magnetic circuit assembly 1000 according to some embodiments of the present application. As shown, the bone conduction speaker 1000 may include a first magnetic element 1002 , a first magnetically conductive element 1004 , a second magnetically conductive element 1006 and a first conductive element 1008 . For the first magnetic element 1002, the first magnetically permeable element 1004, the second magnetically permeable element 1006, and the first conductive element 1008, reference may be made to relevant descriptions in this application. The first conductive element 1004 may protrude from the first magnetic element 1002 to form a first recess, and the first conductive element 1008 may be disposed in the first recess and connected to the first magnetic element 1002 .

The first magnetic element 1002 , the first magnetic permeable element 1004 and the second magnetic permeable element 1006 can form a magnetic gap. A voice coil 1010 may be placed in the magnetic gap. The cross-sectional shape of the voice coil 1010 can be circular or non-circular, such as ellipse, rectangle, square, pentagon, other polygons or other irregular shapes. In some embodiments, an alternating current may be fed into the voice coil 1010 , and the direction of the alternating current is as shown in the figure, which is perpendicular to the inside of the paper. In the magnetic circuit formed by the first magnetic element 1002, the first magnetic conductive element 1004 and the second magnetic conductive element 1006, the voice coil 1010 can generate an alternating induced magnetic field A ( It may also be referred to as "the first alternating induction magnetic field"), and the direction of the induction magnetic field A is counterclockwise (as shown by A). The alternating induced magnetic field A will generate a reverse induced current in the voice coil 1010 , thereby reducing the current in the voice coil 1010 . The first conductive element 1008 can generate an alternating induction current under the action of the alternating induction magnetic field A, and the alternating induction current can generate an alternating induction magnetic field B under the action of the magnetic field in the magnetic circuit (also may be referred to as the "second alternating induction magnetic field"). The direction of the induced magnetic field B is counterclockwise (shown as B). Since the direction of the induced magnetic field A is opposite to that of the induced magnetic field B, the reverse induced current in the voice coil 1010 is reduced, that is, the inductive reactance in the voice coil 1010 is reduced, and the current in the voice coil 1010 is increased.

The above description of the structure of the magnetic circuit assembly 1000 is only a specific example and should not be considered as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the bone conduction speaker, it is possible to make various forms and details of the specific method and steps of implementing the magnetic circuit assembly 1000 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the first conductive element 1008 may be disposed near the voice coil 1010 , such as an inner wall, an outer wall, an upper surface and/or a lower surface of the voice coil 1010 .

Fig. 37 is a graph showing the effect of the conductive element in the magnetic circuit assembly 1000 shown in Fig. 36 on the inductive reactance in the voice coil according to some embodiments of the present application. Wherein, curve a corresponds to the magnetic circuit assembly 1000 without the first conductive element 1008 , and curve b corresponds to the magnetic circuit assembly 1000 with the first conductive element 1008 provided. The abscissa is the alternating current frequency in the voice coil 1010 , and the ordinate is the inductive reactance in the voice coil 1010 . As shown in Figure 37, when the frequency of the alternating current increases to about 1000 Hz, the inductance in the voice coil 1010 increases with the increase of the frequency of the alternating current. The inductive reactance is significantly lower than the inductive reactance in the voice coil when the first conductive element 1008 is not provided (for example, the inductive reactance corresponding to curve b is lower than the inductive reactance corresponding to curve a).

Fig. 38 is a schematic structural diagram of a magnetic circuit assembly 1100 according to some embodiments of the present application. As shown in the figure, the magnetic circuit assembly 1100 may include a first magnetic element 1102 , a first magnetically permeable element 1104 , a second magnetically permeable element 1106 and a first conductive element 1118 . For the first magnetic element 1102, the first magnetically permeable element 1104, the second magnetically permeable element 1106, and the first conductive element 1118, reference may be made to relevant descriptions in this application. The first conductive element 1118 can be connected to the upper surface of the first magnetic conductive element 1104 . The shape of the first conductive element 1118 can be sheet, ring, mesh, orifice plate, etc.

The first magnetic element 1102 , the first magnetically permeable element 1104 and the second magnetically permeable element 1106 can form a magnetic gap. A voice coil 1128 may be placed in the magnetic gap. The cross-sectional shape of the voice coil 1128 can be circular or non-circular. The non-circular shapes may include ellipses, triangles, quadrilaterals, pentagons, other polygons, or other irregular shapes.

The above description of the structure of the magnetic circuit assembly 1100 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details on the specific manner and steps of implementing the magnetic circuit assembly 1100 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the first conductive element 1118 may be disposed near the voice coil 1128 , such as an inner wall, an outer wall, an upper surface and/or a lower surface of the voice coil 1128 .

Fig. 39 is a graph showing the influence of the magnetic conduction element in the magnetic circuit assembly 1100 shown in Fig. 38 on the inductive reactance in the voice coil according to some embodiments of the present application. Wherein, curve a corresponds to the magnetic circuit assembly 1100 without the first conductive element 1118 , and curve b corresponds to the magnetic circuit assembly 1100 with the first conductive element 1118 . The abscissa is the alternating current frequency in the voice coil 1110 , and the ordinate is the inductive reactance in the voice coil 1110 . As shown in Figure 39, when the frequency of the alternating current increases to around 1000 Hz, the inductive reactance inside the voice coil 1110 increases with the increase of the frequency of the alternating current. The inductance of is significantly lower than the inductance of the voice coil when the first conductive element 1118 is not provided (eg, the inductance corresponding to curve b is lower than the inductance corresponding to curve a).

Fig. 40 is a schematic structural diagram of a magnetic circuit assembly 1200 according to some embodiments of the present application. As shown, the magnetic circuit assembly 1200 may include a first magnetic element 1202 , a first magnetically permeable element 1204 , a second magnetically permeable element 1206 , a first conductive element 1218 , a second conductive element 1220 and a third conductive element 1222 . For the first magnetic element 1202 , the first magnetically permeable element 1204 , the second magnetically permeable element 1206 , the first conductive element 1218 , the second conductive element 1220 , and the third conductive element 1222 , reference may be made to the relevant description in FIG. 8 of this application. The first magnetic element 1102 , the first magnetically permeable element 1104 and the second magnetically permeable element 1106 can form a magnetic gap. A voice coil 1228 may be placed in the magnetic gap. The cross-sectional shape of the voice coil 1228 can be circular or non-circular. The non-circular shapes may include ellipses, triangles, quadrilaterals, pentagons, other polygons, or other irregular shapes.

The above description of the structure of the magnetic circuit assembly 1200 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details on the specific manner and steps of implementing the magnetic circuit assembly 1200 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the first conductive element 1218 may be disposed near the voice coil 1228 , such as the inner wall, outer wall, upper surface and/or lower surface of the voice coil 1228 .

FIG. 41 is a graph showing the influence of the number of conductive elements in the magnetic circuit assembly 1220 shown in FIG. 40 on the inductive reactance in the voice coil according to some embodiments of the present application. Curve m corresponds to a magnetic circuit assembly without conductive elements, curve n corresponds to a magnetic circuit assembly with one conductive element (magnetic circuit assembly 1000 as shown in Figure 36), and curve l corresponds to a magnetic circuit assembly with multiple conductive elements (such as Magnetic circuit assembly 1200 shown in FIG. 40). The abscissa is the frequency of the alternating current in the voice coil, and the ordinate is the inductance in the voice coil. As shown in Figure 41, when the frequency of the alternating current increases to about 1000HZ, the inductance in the voice coil increases with the increase of the frequency of the alternating current. In the case of setting one or more conductive elements, the The inductive reactance is significantly lower than the inductive reactance in the voice coil when no conductive element is provided (for example, the inductive reactance corresponding to curve n and l is lower than the inductive reactance corresponding to curve m). In the case of setting multiple conductive elements, the inductance in the voice coil is significantly lower than that in the voice coil when one conductive element is set (for example, the inductance corresponding to curve l is lower than the inductance corresponding to curve n).

Fig. 42 is a schematic structural diagram of a magnetic circuit assembly 1300 according to some embodiments of the present application. As shown, the magnetic circuit assembly 1300 may include a first magnetic element 1302 , a first magnetically permeable element 1304 , a first annular element 1306 , a first annular magnetic element 1308 , a second annular magnetic element 1310 , and a third annular magnetic element 1312 , the magnetic permeable cover 1314 and the second magnetic element 1316 . The first magnetic element 1302, the first magnetic element 1304, the first annular element 1306, the first annular magnetic element 1308, the second annular magnetic element 1310, the third annular magnetic element 1312, the magnetic shield 1314 and the second magnetic element 1316 Reference can be made to the detailed description in FIGS. 10-18 of this application.

The first magnetic element 1302, the first magnetically permeable element 1304, the second magnetic element 1316, the second annular magnetic element 1310, and/or the third annular magnetic element 1312 may form a magnetic gap. A voice coil 1328 may be placed in the magnetic gap. Voice coil 1328 may be circular or non-circular. The non-circular shapes may include ellipses, triangles, quadrilaterals, pentagons, other polygons, or other irregular shapes.

The above description of the structure of the magnetic circuit assembly 1300 is only a specific example, and should not be regarded as the only possible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details of the specific manner and steps of implementing the magnetic circuit assembly 1300 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, the magnetic circuit assembly 1300 may further include one or more conductive elements, and the conductive elements may be disposed near the voice coil 1328 , such as the inner wall, outer wall, upper surface and/or lower surface of the voice coil 1328 . In some embodiments, the conductive element may be connected to the first magnetic element 1302 , the second magnetic element 1316 , the first annular magnetic element 1308 , the second annular magnetic element 1310 and/or the third annular magnetic element 1312 . For another example, the magnetic circuit assembly 1300 may further include a third magnetic permeable element, and the third magnetic permeable element is connected to the second magnetic element 1316 .

FIG. 43 is a graph showing the relationship between the ampere force on the voice coil and the thickness of the magnetic element in the magnetic circuit assembly 1300 shown in FIG. 42 according to some embodiments of the present application. Wherein, the abscissa is the first thickness ratio, and the ordinate is the normalized ampere force that the voice coil is subjected to, and the normalized ampere force can refer to the actual ampere force that the voice coil is subjected to and the actual ampere force received in the single magnetic magnetic circuit assembly. The ratio of the maximum ampere force. The single magnetic circuit assembly may include one magnetic element, for example, the single magnetic circuit assembly may include a first magnetic element, a first magnetically permeable element, and a second magnetically permeable element. The volume of the first magnetic element in the single magnetic circuit assembly is the same as the sum of the volumes of the first magnetic element 1302 and the second magnetic element 1316 in the magnetic circuit assembly 1300 . For the first thickness ratio and the second thickness ratio, refer to the detailed description in FIG. 30 of this application. As shown in Figure 43, for any second thickness ratio k, the ordinate value is greater than 1, that is, in the magnetic circuit assembly 1300, the ampere force experienced by the voice coil 1328 is greater than the ampere force experienced by the voice coil in the single magnetic magnetic circuit assembly . When the second thickness ratio k remains constant, as the first thickness ratio increases, the ampere force experienced by the voice coil 1328 gradually decreases. When the first thickness ratio remains unchanged, as the second thickness ratio k decreases, the ampere force in the voice coil 1328 increases gradually. When the range of the first thickness ratio is between 0.1-0.3 or the range of the second thickness ratio k is between 0.2-0.7, the ampere force suffered by the voice coil 1328 is improved compared with the ampere force suffered by the voice coil in the single magnetic magnetic circuit assembly 50%-60%.

Fig. 44 is a schematic structural diagram of a bone conduction speaker 1400 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 1400 may include a first magnetic element 1402, a first magnetically conductive element 1404, a second magnetically conductive element 1406, a second magnetic element 1408, a voice coil 1410, a third magnetically conductive element 1412, and a bracket 1414 and connector 1416. For the first magnetic element 1402 , the first magnetically permeable element 1404 , the second magnetically permeable element 1406 , the second magnetic element 1408 , the voice coil 1410 and/or the third magnetically permeable element 1412 , reference may be made to the relevant descriptions of other figures in this application.

The upper surface of the first magnetic element 1402 can be connected to the lower surface of the first magnetic permeable element 1404 . The lower surface of the second magnetic element 1408 can be connected to the upper surface of the first magnetic permeable element 1404 . The second magnetic permeable element 1406 may include a first bottom plate and a first side wall. The lower surface of the first magnetic element 1402 may be connected to the upper surface of the first bottom plate. The sidewalls of the second magnetic permeable element 1406 and the sidewalls of the first magnetic element 1402 , the first magnetic permeable element 1404 and/or the second magnetic element 1408 form a magnetic gap. The bracket 1414 may include a second bottom plate and a second side wall. After the bracket 1414 is connected with the voice coil 1410, the voice coil 1410 can be arranged in the magnetic gap. The voice coil 1410 can be connected to the second side wall. A side seam may be formed between the upper surface of the voice coil 1410 and the second bottom plate. After the voice coil 1410 is placed in the magnetic gap, the third magnetic conduction element 1412 can connect the upper surface of the second magnetic element 1408 and the first side wall of the second magnetic conduction element 1406 through the side seam, so that the third magnetic conduction element 1406 The three magnetic conductive elements 1412 and the second magnetic conductive element 1406 form a closed cavity. The connection between the first magnetic element 1402, the first magnetic element 1404, the second magnetic element 1406, the second magnetic element 1408, the voice coil 1410 and/or the third magnetic element 1412 can be through the Any one or several connection methods described. In some embodiments, one or more Hole-like structures (eg, pin holes, threaded holes, etc.). The hole-like structure can be arranged in the center, around or other locations. The connecting piece 1416 can pass through the hole structure and connect various components. For example, connector 1416 may be a pipe pin. The tube pin 1416 can be punched and deformed through the bracket 1414 by a punching head, so as to fix various components in the bone conduction speaker 1400 .

The above description of the structure of the bone conduction speaker 1400 is only a specific example, and should not be regarded as the only feasible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details of the specific method and steps of implementing the bone conduction speaker 1400 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, bone conduction speaker 1400 may include one or more conductive elements disposed on the inner sidewall, outer sidewall, top and/or bottom of voice coil 1410 . For another example, the bone conduction speaker 1400 may further include one or more annular magnetic elements, and the one or more annular magnetic elements may be connected to the upper surface of the side wall of the second magnetic conductive element 1406 or fixed in the magnetic gap.

Fig. 45 is a schematic structural diagram of a bone conduction speaker 1500 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 1500 may include a first magnetic element 1502, a first magnetic element 1504, a second magnetic element 1506, a second magnetic element 1508, a voice coil 1510, a third magnetic element 1512, and a bracket 1514 , connecting piece 1516 , bracket link 1518 and washer 1520 . The upper surface of the first magnetic element 1502 can be connected to the lower surface of the first magnetic permeable element 1506. The lower surface of the second magnetic element 1508 can be connected to the upper surface of the first magnetic permeable element 1506 . The second magnetic conduction element 1506 may include a first bottom plate and a first side wall, and the first side wall may be formed by extending the bottom plate along a direction perpendicular to the bottom plate. The lower surface of the first magnetic element 1502 can be connected to the upper surface of the bottom plate of the second magnetic permeable element 1506 . The sidewalls of the second magnetic permeable element 1906 and the sidewalls of the first magnetic element 1502 , the first magnetic permeable element 1504 and/or the second magnetic element 1508 form a magnetic gap. One or more rod-shaped structures may be arranged around the bracket link 1518 . The voice coil 1510 can be connected to the bracket link 1518 . After the bracket connecting rod 1518 is connected with the voice coil 1510, the voice coil 1510 can be arranged in the magnetic gap. The third magnetic conduction element 1512 may include a second bottom plate and a second side wall, the second side wall may be formed by extending the second bottom plate, and the second side wall may be provided with one or more first holes structure, the first hole-like structure corresponds to the rod-like structure of the bracket connecting rod 1518 , and the rod-like structure of the bracket connecting rod 1518 can pass through the first hole-like structure of the third magnetic conduction element 1512 . After the voice coil 1510 is placed in the magnetic gap, the second side wall of the third magnetic conduction element 1512 can be connected to the rod-shaped structure of the bracket link 1518 through the first hole structure, and the second bottom plate can be connected to the second The upper surface of the magnetic element 1508 . The connection between the first magnetic element 1502, the first magnetic element 1504, the second magnetic element 1506, the second magnetic element 1508, the voice coil 1510 and/or the third magnetic element 1512 can be through the Any one or several connection methods described. In some embodiments, the first magnetic element 1502 , the first magnetically permeable element 1504 , the second magnetically permeable element 1506 , the second magnetic element 1508 , the third magnetically permeable element 1512 and/or the center, periphery or other positions of the support 1514 A second porous structure may be provided. The connecting piece 1516 can pass through the hole structure and connect various components. For example, connector 1516 may be a pipe pin. The tube pin 1516 can be stamped and deformed by using a punching head through the bracket 1514 to fix the first magnetic element 1502 , the first magnetic element 1504 , the second magnetic element 1506 , the second magnetic element 1508 and the third magnetic element 1512 . The bracket 1514 can be connected to the bracket railing 1518, and the washer 1520 can further connect the second side wall of the third magnetic conduction element 1512 and the first side wall of the second magnetic conduction element 1506, thereby further fixing the second magnetic conduction element 1506 and the third conduction element 1506. Magnetic element 1512 . In some embodiments, the washer 1520 can be connected to the bracket 1514 through a vibrating plate.

The above description of the structure of the bone conduction speaker 1500 is only a specific example, and should not be regarded as the only feasible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details of the specific method and steps of implementing the bone conduction speaker 15900 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, bone conduction speaker 1500 may include one or more conductive elements disposed on the inner sidewall, outer sidewall, top and/or bottom of voice coil 1510 . For another example, the bone conduction speaker 1500 may further include one or more annular magnetic elements, and the one or more annular magnetic elements may be connected to the upper surface of the side wall of the second magnetic conduction element 1506 or fixed in the magnetic gap.

Fig. 46 is a schematic structural diagram of a bone conduction speaker 1600 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 1600 may include a first magnetic element 1602, a first magnetically conductive element 1604, a second magnetically conductive element 1606, a washer 1608, a voice coil 1610, a first vibrating plate 1612, a bracket 1614, a second vibrating plate 1616 and vibrating panel 1618 . The lower surface of the first magnetic element 1602 is connected to the inner wall of the second magnetic permeable element 1606 . The upper surface of the first magnetic element 1602 is connected to the upper surface of the first magnetic permeable element 1604 . A magnetic gap can be formed between the first magnetic element 1602 , the first magnetically permeable element 1604 and the second magnetically permeable element 1606 . A voice coil 1610 may be placed in the magnetic gap. In some embodiments, the voice coil 1610 may be a circular or non-circular structure, such as a triangle, rectangle, square, ellipse, pentagon or other irregular shapes. The voice coil 1610 is connected to the support 1614 , the support 1614 is connected to the first vibrating plate 1612 , and the first vibrating plate 1612 is connected to the second magnetic conductive element 1606 through the washer 1608 . The lower surface of the second vibrating plate 1616 is connected to the bracket 1614 , and the upper surface of the second vibrating plate 1616 is connected to the vibrating panel 1618 . In some embodiments, the first magnetic element 1602, the first magnetically permeable element 1604, the second magnetically permeable element 1606, the washer 1608, the voice coil 1610, the first vibrating plate 1612, the bracket 1614, the second vibrating plate 1616 and/or The components in the vibrating panel 1618 can be connected by any one or several connection methods described in this application. For example, the first magnetic element 1602 may be connected to the first magnetically permeable element 1604 and/or the second magnetically permeable element 1606 by welding. For another example, elements such as the first magnetic element 1602, the first magnetically permeable element 1604 and/or the second magnetically permeable element 1606 can be provided with a hole-like structure, and the first magnetic element 1602, the first magnetically permeable element 1604 and/or the second magnetically permeable element 1604 The magnetic element 1606 can be connected by stamping and deformation of a tube pin. In some embodiments, the first vibrating plate 1612 and/or the second vibrating plate 1616 can be configured as one or more coaxial toruses, and multiple struts converging toward the center are arranged in the plurality of toruses , whose center of convergence coincides with the center of the first vibration plate 1612 and/or the second vibration plate 1616 . The plurality of struts are arranged in a staggered manner.

The above description of the structure of the bone conduction speaker 1600 is only a specific example, and should not be regarded as the only feasible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, it is possible to make various forms and details of the specific method and steps for implementing the bone conduction speaker 1600 without departing from this principle. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, bone conduction speaker 1600 may include one or more conductive elements disposed on the inner sidewall, outer sidewall, top and/or bottom of voice coil 1610 . For another example, the bone conduction speaker 1600 may further include one or more annular magnetic elements, and the one or more annular magnetic elements may be connected to the upper surface of the side wall of the second magnetic conductive element 1606 or fixed in the magnetic gap. In some embodiments, the bone conduction speaker may further include a second magnetic element and/or a third magnetically conductive element.

Fig. 47 is a schematic structural diagram of a bone conduction speaker 1700 according to some embodiments of the present application. As shown in the figure, the bone conduction speaker 1700 may include a first magnetic element 1702, a first magnetically conductive element 1710, a second magnetic element 1704, a third magnetic element 1706, a second magnetically conductive element 1708, a washer 1714, a voice coil 1712, The first vibration plate 1716 , the bracket 1718 , the second vibration plate 1720 and the vibration panel 1722 . The lower surface of the first magnetic element 1702 is connected to the inner wall of the second magnetic permeable element 1708 . The upper surface of the first magnetic element 1702 is connected to the lower surface of the first magnetic permeable element 1710 . The outer wall of the second magnetic element 1704 is connected to the inner wall of the second magnetic conductive element 1708 . The third magnetic element 1706 is below the second magnetic element 1704, and at the same time, the outer wall of the third magnetic element 1706 is connected to the inner wall of the second magnetic permeable element 1708; the inner wall of the third magnetic element 1706 is connected to the inner wall of the first magnetic element 1702 The outer wall; the lower surface of the third magnetic element 1706 is connected to the inner wall of the second magnetic element 1708; magnetic elements can be formed between the first magnetic element 1702, the first magnetic element 1710, the second magnetic element 1704, and the third magnetic element 1706. gap. A voice coil 1712 may be placed in the magnetic gap. In some embodiments, the voice coil 1712 can be in the shape of a racetrack as shown in FIG. 47 , or in other geometric shapes, such as triangle, rectangle, square, ellipse, pentagon or other irregular shapes. The voice coil 1712 is connected to the bracket 1718 , the bracket 1718 is connected to the first vibrating plate 1716 , and the first vibrating plate 1716 is connected to the second magnetic conductive element 1708 through the washer 1714 . The lower surface of the second vibrating plate 1720 is connected to the bracket 1718 , and the upper surface of the second vibrating plate 1720 is connected to the vibrating panel 1722 . In some embodiments, the second magnetic element 1704 can be composed of multiple magnetic elements, for example, it can be composed of 4 magnetic elements as shown in FIG. 47 . The shape surrounded by a plurality of magnetic elements can be the racetrack shape shown in FIG. 47 , or other geometric shapes, such as triangle, rectangle, square, ellipse, pentagon or other irregular shapes. The third magnetic element 1706 can be composed of multiple magnetic elements, for example, it can be composed of 4 magnetic elements as shown in FIG. 47 . The shape surrounded by a plurality of magnetic elements can be the racetrack shape shown in FIG. 47 , or other geometric shapes, such as triangle, rectangle, square, ellipse, pentagon or other irregular shapes. As described in other embodiments in this application, the second magnetic element 1704 or the third magnetic element 1706 can be replaced by a plurality of interconnected magnetic elements with different magnetization directions, and the plurality of interconnected magnetic elements with different magnetization directions The magnetic element can increase the magnetic field strength at the magnetic gap in the bone conduction speaker 1700 , thereby improving the sensitivity of the bone conduction speaker 1700 .

In some embodiments, the first magnetic element 1702, the first magnetic element 1710, the second magnetic element 1704, the third magnetic element 1706, the second magnetic element 1708, the washer 1714, the voice coil 1712, the first vibrating plate 1716 , the support 1718 , the second vibrating plate 1720 and/or the vibrating panel 1722 can be connected by any one or several connection methods described in this application. For example, the first magnetic element 1702 , the second magnetic element 1704 , and the third magnetic element 1706 can be connected to the first magnetically permeable element 1710 and/or the second magnetically permeable element 1708 by bonding. For another example, the washer 1714 can be connected to the second magnetic conduction element 1708 through an undercut structure, and further, the washer 1714 can be connected to the second magnetic conduction element 1708 and/or the second magnetic element 1704 through an undercut structure and bonding . In some embodiments, the first vibrating plate 1716 and/or the second vibrating plate 1720 can be configured as one or more coaxial rings, and a plurality of struts converging toward the center are arranged in the plurality of rings, which The center of convergence coincides with the center of the first vibration plate 1716 and/or the second vibration plate 1720 . The plurality of struts are arranged in a staggered manner. The plurality of struts are straight rods or curved rods or partly straight rods and partly curved rods. Preferably, the plurality of struts are curved rods. In some embodiments, the outer surface of the vibrating panel 1722 may be a plane or a curved surface. For example, the outer surface of the vibrating panel 1722 is a convex arc surface as shown in FIG. 47 .

The above description of the structure of the bone conduction speaker 1700 is only a specific example, and should not be regarded as the only feasible implementation. Obviously, for those skilled in the art, after understanding the basic principle of the magnetic circuit assembly, without departing from this principle, the specific methods and steps for implementing the bone conduction speaker 1700 can be described in various forms and details. modifications and changes, but these modifications and changes are still within the scope of the above description. For example, bone conduction speaker 1700 may include one or more conductive elements disposed on the inner sidewall, outer sidewall, top and/or bottom of voice coil 1712 . For another example, the bone conduction speaker 1700 may further include one or more annular magnetic elements, and the one or more annular magnetic elements may connect the lower surface of the second magnetic element 1704 and the upper surface of the third magnetic element 1706 . In some embodiments, the bone conduction speaker may further include a fifth magnetic element and/or a third magnetically conductive element as described in other embodiments of this application.

The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is only an example and does not constitute a limitation to the present application. Although not expressly stated here, various modifications, improvements and amendments to this application may be made by those skilled in the art. Such modifications, improvements, and amendments are suggested in this application, so such modifications, improvements, and amendments still belong to the spirit and scope of the exemplary embodiments of this application.

Meanwhile, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment" and/or "some embodiments" means a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that two or more references to "an embodiment" or "an embodiment" or "an alternative embodiment" in different places in this specification do not necessarily refer to the same embodiment . In addition, certain features, structures or characteristics of one or more embodiments of the present application may be properly combined.

In addition, those skilled in the art will understand that various aspects of the present application may be illustrated and described in several patentable categories or circumstances, including any new and useful process, machine, product or combination of substances or combinations thereof Any new and useful improvements. Correspondingly, various aspects of the present application may be entirely executed by hardware, may be entirely executed by software (including firmware, resident software, microcode, etc.), or may be executed by a combination of hardware and software. The above hardware or software may be referred to as "block", "module", "engine", "unit", "component" or "system". Additionally, aspects of the present application may be embodied as a computer product comprising computer readable program code on one or more computer readable media.

In addition, the order of processing elements and sequences described in the application, the use of numbers and letters, or the use of other names are not used to limit the order of the flow and methods of the application unless explicitly stated in the claims. While the foregoing disclosure discusses, by way of various examples, some embodiments of the application presently believed to be useful, it should be understood that such details are for illustrative purposes only and that the appended claims are not limited to the disclosed embodiments, but instead claim The claims are intended to cover all modifications and equivalent combinations that fall within the spirit and scope of the embodiments of the application. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by a software-only solution, such as installing the described system on an existing server or mobile device.

In the same way, it should be noted that in order to simplify the expression disclosed in this application and thus help the understanding of one or more application embodiments, in the foregoing descriptions of the embodiments of the application, sometimes multiple features are combined into one embodiment, drawings or descriptions thereof. This method of disclosure does not, however, imply that the subject matter of the application requires more features than are recited in the claims. Indeed, embodiment features are less than all features of a single foregoing disclosed embodiment.

In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of the embodiments use modifiers such as "about", "approximately" or "substantially" in some examples. to modify. Unless otherwise stated, "about", "approximately" or "substantially" indicates that the stated figure allows for a variation of ±20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximations that can vary depending upon the desired characteristics of individual embodiments. In some embodiments, numerical data should take into account the specified significant digits and adopt the general digit reservation method. Although the numerical ranges and data used in some embodiments of this application to confirm the breadth of the range are approximations, in specific embodiments, such numerical values are set as precisely as practicable.

Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other modifications are also possible within the scope of this application. Therefore, by way of example and not limitation, alternative configurations of the embodiments of the present application may be considered consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims (18)

1. a kind of magnetic circuit component of bone-conduction speaker, the magnetic circuit component generates the first full field, and the magnetic circuit component includes：

First magnetic element, first magnetic element generate the second magnetic field；

First magnetic conductive component；And

At least one second magnetic element, at least one second magnetic element around first magnetic element, and with institute It states and forms magnetic gap between the first magnetic element, magnetic field intensity of first full field in the magnetic gap is more than described the Magnetic field intensity of two magnetic fields in the magnetic gap.

2. magnetic circuit component described in claim 1, the direction of magnetization and first magnetic of at least one second magnetic element Angle between the direction of magnetization of property element is between 45 degree and 135 degree.

3. the magnetic circuit component described in claim 2, the direction of magnetization and first magnetic of at least one second magnetic element Property element the direction of magnetization between angle be not less than 90 degree.

4. magnetic circuit component described in claim 1, further comprises：

Second magnetic conductive component；And

At least one third magnetic element, wherein at least one third magnetic element connect second magnetic conductive component and At least one second magnetic element.

5. the magnetic circuit component described in claim 4, the direction of magnetization and first magnetic of at least one third magnetic element Angle between the direction of magnetization of property element is between 45 degree and 135 degree.

6. the magnetic circuit component described in claim 5, the direction of magnetization and first magnetic of at least one third magnetic element Property element the direction of magnetization between angle be not less than 90 degree.

7. the magnetic circuit component described in claim 5, further comprises：

At least one 4th magnetic element, wherein at least one 4th magnetic element is located at the lower section of the magnetic gap simultaneously Connect first magnetic element and second magnetic conductive component.

8. the magnetic circuit component described in claim 7, the direction of magnetization and first magnetic of at least one 4th magnetic element Angle between the direction of magnetization of property element is between 45 degree and 135 degree.

9. magnetic circuit component according to any one of claims 8, the direction of magnetization and first magnetic of at least one 4th magnetic element Property element the direction of magnetization between angle be not more than 90 degree.

10. the magnetic circuit component described in claim 4, further comprises：

At least one 5th magnetic element, wherein at least one 5th magnetic element connects first magnetic conductive component Upper surface.

11. magnetic circuit component according to any one of claims 10, the direction of magnetization and described first of at least one 5th magnetic element The angle of the direction of magnetization of magnetic element is at 150 degree between 180 degree.

It is the thickness of first magnetic element and first magnetic element, described 12. magnetic circuit component according to any one of claims 10 The ratio range of the sum of the thickness of at least one 5th magnetic element and first magnetic conductive component is 0.4-0.6.

13. the thickness of magnetic circuit component according to any one of claims 10, at least one 5th magnetic element is equal to first magnetic The thickness of property element.

14. the thickness of magnetic circuit component according to any one of claims 10, at least one 5th magnetic element is less than first magnetic The thickness of property element.

15. magnetic circuit component according to any one of claims 10, further comprises：

Third magnetic conductive component, wherein the third magnetic conductive component connects the upper surface of the 5th magnetic element, and the third is led Magnetic cell is configured as inhibiting the field strength of first full field to reveal.

16. the magnetic circuit component described in claim 4, first magnetic conductive component connects the upper surface of first magnetic element, Second magnetic conductive component includes the bottom that bottom plate and side wall and first magnetic element connect second magnetic conductive component Plate.

17. the magnetic circuit component described in claim 4, further comprises：

At least one conducting element, wherein the conducting element connects first magnetic element, first magnetic conductive component, Or at least one of described second magnetic conductive component element.

18. a kind of bone-conduction speaker, the bone-conduction speaker include：

Vibration component, the vibration component include voice coil and at least one oscillating plate；And

Any magnetic circuit components of claim 1-17.