CN108600598A - Camera module and its assemble method - Google Patents
Camera module and its assemble method Download PDFInfo
- Publication number
- CN108600598A CN108600598A CN201810814622.6A CN201810814622A CN108600598A CN 108600598 A CN108600598 A CN 108600598A CN 201810814622 A CN201810814622 A CN 201810814622A CN 108600598 A CN108600598 A CN 108600598A
- Authority
- CN
- China
- Prior art keywords
- sensor chip
- image sensor
- camera module
- light transmission
- transmission piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000005540 biological transmission Effects 0.000 claims abstract description 71
- 230000003287 optical effect Effects 0.000 claims abstract description 60
- 238000003384 imaging method Methods 0.000 claims abstract description 53
- 238000005452 bending Methods 0.000 claims abstract description 33
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 21
- 239000003292 glue Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 241001062009 Indigofera Species 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000005321 cobalt glass Substances 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 210000000593 adipose tissue white Anatomy 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
The present invention provides a kind of camera module and its assemble methods, are related to camera module field.Camera module includes image sensor chip, optical filter, lens assembly and light transmission piece, the optical filter is arranged between described image sensor chip and the lens assembly, and the light transmission piece is arranged between described image sensor chip and the lens assembly for making image formation by rays in the imaging surface of the bending formed by described image sensor chip warpage in the light transmission piece.The defect that imaging surface caused by camera module can make up the warpage of image sensor chip is bent, makes image formation by rays on the imaging surface of bending, improves the quality of image.
Description
Technical field
The present invention relates to camera module fields, in particular to a kind of camera module and its assemble method.
Background technology
Currently, in the preparation process of camera module, when image sensor chip is bonded on pcb board, due to point
Glue on pcb board is not completely homogeneously coated between pcb board and image sensor chip, generally will appear image sensing
Device chip local location does not have the phenomenon that glue and pcb board contact, typically, be easy in image sensor chip edge or
Occur there is no the phenomenon that glue in four endpoint locations of image sensor chip, thus during molding pressing mold, is molded up and down
When conjunction, image sensor chip part will produce warpage due to the support of not no colloid.In addition, itself be mayed in the surface of pcb board
With regard to out-of-flatness, after image sensor chip is bonded in pcb board surface, image sensor chip is naturally as pcb board generates warpage.
And the warpage of image sensor chip can then make imaging surface deviate normal imaging surface, the imaging surface of a bending is formed, this
When, the focus point of normal imaging light does not fall the imaging in the bending finally due to the bending of actual imaging surface originally
On face, therefore cause camera module that cannot form clearly picture point, image quality is caused to decline.
Therefore, a kind of camera module is designed, the imaging surface bending that the warpage of image sensor chip is brought can be made up
Defect, make image formation by rays on the imaging surface of bending, improve the quality of image, this is a technical problem to be solved urgently.
Invention content
A kind of camera module of offer of the embodiment of the present invention and its assemble method, can make up image sensor chip
The defect for the imaging surface bending that warpage is brought, makes image formation by rays on the imaging surface of bending, improves the quality of image.
The embodiment of the present invention provides a kind of technical solution：
A kind of camera module includes image sensor chip, optical filter, lens assembly and light transmission piece, and the optical filter is set
Set between described image sensor chip and the lens assembly, light transmission piece setting described image sensor chip with
Between the lens assembly, the light transmission piece is for making image formation by rays in the bending formed by described image sensor chip warpage
Imaging surface on.
Further, the light transmission piece is arranged between described image sensor chip and the optical filter, alternatively, described
Light transmission piece is arranged between the optical filter and the lens assembly.
Further, the light transmission piece is bonded in the surface of the optical filter.
Further, the light transmission piece is identical with the optical filter material, and the two is integrally formed.
Further, the light transmission piece is any one of resin, white glass, smalt, optical glue.
Further, the camera module further includes pcb board, and described image sensor die bonding is in the pcb board
Surface.
Further, the camera module further includes filter supporter, and the filter supporter is arranged in the pcb board
Between the lens assembly, the optical filter is mounted in the filter supporter.
Further, the camera module further includes lens bracket, and the lens bracket is arranged in the optical filter branch
Side of the frame far from the pcb board, the lens assembly are mounted on the lens bracket.
Further, the camera module further includes motor, and the motor is arranged in the filter supporter far from institute
The side of pcb board is stated, the motor is set on the lens assembly, and the motor is for driving the lens assembly.
The embodiment of the present invention provides another technical solution：
A kind of assemble method of camera module includes the following steps：
Image sensor chip is bonded on pcb board；
In the side of described image sensor chip, optical filter is set；
In the side of described image sensor chip, light transmission piece is set；
Lens assembly is arranged in the other side of the optical filter with respect to described image sensor chip so that the optical filtering
Piece and the light transmission piece are arranged between described image sensor chip and the lens assembly, wherein the light transmission piece is used for
Make image formation by rays on the imaging surface of the bending formed by described image sensor chip warpage.
Compared with prior art, camera module provided by the invention and its advantageous effect of assemble method are：
By the way that the light transmission piece is arranged between described image sensor chip and the lens assembly, image can be made up
The defect for the imaging surface bending that sensor chip warpage is brought, makes image formation by rays on the imaging surface of bending, improves the quality of image.
Also, without the optical design for changing lens assembly, without the encapsulation procedure for changing image sensor chip, cost is relatively low,
It ensure that the parsing power and process rate of camera module.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is a kind of structural schematic diagram for the camera module that first embodiment of the invention provides.
Fig. 2 is another structural schematic diagram for the camera module that first embodiment of the invention provides.
Fig. 3 is the structural schematic diagram for the camera module that second embodiment of the invention provides.
Fig. 4 is the structural schematic diagram for the camera module that third embodiment of the invention provides.
Fig. 5 is the flow diagram of the assemble method for the camera module that fourth embodiment of the invention provides.
Icon：10- camera modules；11-PCB plates；12- image sensor chips；13- filter supporters；14- filters
Piece；15- light transmission pieces；16- lens brackets；17- lens assemblies；18- motors.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, below the detailed description of the embodiment of the present invention to providing in the accompanying drawings be not intended to limit it is claimed
The scope of the present invention, but be merely representative of the present invention selected embodiment.Based on the embodiments of the present invention, this field is common
The every other embodiment that technical staff is obtained without creative efforts belongs to the model that the present invention protects
It encloses.
It should be noted that：Similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined, then it further need not be defined and explained in subsequent attached drawing in a attached drawing.
In the description of the present invention, it is to be understood that, term "center", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, or be somebody's turn to do
Invention product using when the orientation or positional relationship usually put or those skilled in the art orientation or position that usually understand
Relationship is set, is merely for convenience of description of the present invention and simplification of the description, equipment is not indicated or implied the indicated or element is necessary
With specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, it is not understood to indicate or imply
Relative importance.
In the description of the present invention, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " setting ",
" installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, can also be electrical connection；It can be directly connected, it can also be indirect by intermediary
It is connected, can is the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
In the preparation process of camera module, image sensor chip encapsulation processing procedure can cause image sensor chip without
Method reaches ideal flat state, and image sensor chip is made warpage occur, also leads to the imaging of the camera module after encapsulation
Surface has that bending, imaging surface bending refer to that the surrounding of imaging surface is protruded or is recessed with respect to center, i.e. imaging table
The problem of face out-of-flatness.The embodiment of the present invention between lens assembly and image sensor chip by being arranged light transmission piece, energy
The problem of imaging surface caused by image sensor chip warpage is bent enough is made up, makes image formation by rays on the imaging surface of bending,
Improve the quality of image.
First embodiment
Referring to Fig. 1, present embodiments providing a kind of camera module 10, camera module 10 includes imaging sensor core
Piece 12, optical filter 14, lens assembly 17 and light transmission piece 15.Optical filter 14 is arranged in image sensor chip 12 and lens assembly 17
Between, light transmission piece 15 is arranged between image sensor chip 12 and lens assembly 17.
In the imaging process of camera module 10, the light path of light surrounding is more than the light path at center, in imaging sensor core
Light transmission piece 15 is set between piece 12 and optical filter 14, and light transmission piece 15 can make light in the focal position of surrounding with respect to gonglion
It is mobile, make image formation by rays on the imaging surface of bending, what imaging surface caused by making up 12 warpage of image sensor chip was bent lacks
It falls into.
In the present embodiment, as long as light transmission piece 15 is arranged between image sensor chip 12 and lens assembly 17, ask
Referring to Fig.2, light transmission piece 15 is arranged between optical filter 14 and lens assembly 17, it can equally play and make up image sensor chip
The defect for the imaging surface bending that 12 warpage is brought, makes image formation by rays on the imaging surface of bending, improves the effect of the quality of image.
There are many selections for the installation form of light transmission piece 15, and holder support light transmission piece 15 may be used, can also be by light transmission piece
15 are bonded in the surface of optical filter 14.Light transmission piece 15 is any one of resin, white glass, smalt, optical glue.
Certainly, in other embodiments, light transmission piece 15 and 14 material of optical filter also can be identical, and the two is integrally formed.One
Molding light transmission piece 15 and optical filter 14 are larger relative to existing filter thickness, can not only play the role of optical filter 14,
It can also play the role of light transmission piece 15.
It is arranged after light transmission piece 15 between image sensor chip 12 and lens assembly 17, if image sensor chip
12 imaging surface is in still convex, then selects the light transmission piece 15 that thickness is larger, or the light transmission piece 15 for selecting refractive index larger, makes light
Line imaging is on the imaging surface of bending；If the imaging surface of image sensor chip 12 is still concave, select thickness smaller
Light transmission piece 15, or select the smaller light transmission piece 15 of refractive index, make image formation by rays on the imaging surface of bending.
The advantageous effect of camera module 10 provided in this embodiment：
By the way that light transmission piece 15 is arranged between image sensor chip 12 and lens assembly 17, light transmission piece 15 can make up figure
The defect that the imaging surface as caused by 12 warpage of sensor chip is bent, makes image formation by rays on the imaging surface of bending, ensures camera shooting
The quality of image of head mould group 10.Also, without the optical design for changing lens assembly 17, without change image sensor chip
12 encapsulation procedure, cost is relatively low, ensure that the parsing power and process rate of camera module 10.
Second embodiment
Referring to Fig. 3, present embodiments providing a kind of camera module 10, which is fixed-focus module.It takes the photograph
As head mould group 10 includes pcb board 11, image sensor chip 12, filter supporter 13, optical filter 14, light transmission piece 15, camera lens branch
Frame 16 and lens assembly 17.Lens assembly 17, light transmission piece 15, optical filter 14 and image sensor chip 12 are set gradually.
Pcb board 11 is arranged in side of the image sensor chip 12 far from optical filter 14, and image sensor chip 12 is bonded
On the surface of pcb board 11, image sensor chip 12 is electrically connected with pcb board 11 using gold thread realization.
Pcb board 11 is also known as printed circuit board, has upper surface and opposite lower surface, is that electronic component is electrically connected
Supplier, can be used rigid pcb board, flexible PCB and Rigid Flex, and the present embodiment is preferably Rigid Flex.Image passes
Sensor chip 12 can be charge coupled cell imaging sensor (CCD), or complementary metal oxide semiconductor figure
As sensor (CMOS) etc..
Filter supporter 13 is arranged between pcb board 11 and lens assembly 17, is adopted between pcb board 11 and filter supporter 13
With bonding.Optical filter 14 is mounted in filter supporter 13, makes optical filter 14 and 12 spaced and parallel setting of image sensor chip.
The upper surface of optical filter 14 is bonded with light transmission piece 15, although imaging surface is curved due to 12 warpage of image sensor chip
Song, but light transmission piece 15 can make image formation by rays on the imaging surface of bending, improve the effect of the quality of image.Light transmission piece 15 is tree
Any one of fat, white glass, smalt, optical glue.
In other embodiments, light transmission piece 15 can also be bonded in the lower surface of optical filter 14, i.e. the setting of light transmission piece 15 exists
It between image sensor chip 12 and optical filter 14, equally can make image formation by rays on the imaging surface of bending, improve image matter
The effect of amount.
Lens bracket 16 is arranged in side of the filter supporter 13 far from pcb board 11, filter supporter 13 and lens bracket
Using bonding between 16.Lens assembly 17 is mounted on lens bracket 16.
The advantageous effect of camera module 10 provided in this embodiment：
By the way that light transmission piece 15 is arranged between image sensor chip 12 and lens assembly 17, light transmission piece 15 can make up figure
The defect that the imaging surface as caused by 12 warpage of sensor chip is bent, makes image formation by rays on the imaging surface of bending, ensures camera shooting
The quality of image of head mould group 10.Also, without the optical design for changing lens assembly 17, without change image sensor chip
12 encapsulation procedure, cost is relatively low, ensure that the parsing power and process rate of camera module 10.
3rd embodiment
Referring to Fig. 4, present embodiments providing a kind of camera module 10, which is auto-focusing mould
Group.Camera module 10 includes pcb board 11, image sensor chip 12, filter supporter 13, optical filter 14, light transmission piece 15, horse
Up to 18 and lens assembly 17.Lens assembly 17, light transmission piece 15, optical filter 14 and image sensor chip 12 are set gradually.
Pcb board 11 is arranged in side of the image sensor chip 12 far from optical filter 14, and image sensor chip 12 is bonded
On the surface of pcb board 11, image sensor chip 12 is connect with pcb board 11 using gold thread.
Filter supporter 13 is arranged between pcb board 11 and lens assembly 17, is adopted between pcb board 11 and filter supporter 13
With bonding.Optical filter 14 is mounted in filter supporter 13, makes optical filter 14 and 12 spaced and parallel setting of image sensor chip.
The upper surface of optical filter 14 is bonded with light transmission piece 15, and light transmission piece 15, which can play, makes up image sensor chip 12
The defect for the imaging surface bending that warpage is brought, makes image formation by rays on the imaging surface of bending, improves the effect of the quality of image.
In other embodiments, light transmission piece 15 can also be bonded in the lower surface of optical filter 14, i.e. the setting of light transmission piece 15 exists
Between image sensor chip 12 and optical filter 14.Can equally play make up that the warpage of image sensor chip 12 brings at
The defect of curvature of the image makes image formation by rays on the imaging surface of bending, improves the effect of the quality of image.
Motor 18 is arranged in side of the filter supporter 13 far from pcb board 11, and motor 18 is set on lens assembly 17, horse
Up to 18 for driving lens assembly 17.
The advantageous effect of camera module 10 provided in this embodiment：
By the way that light transmission piece 15 is arranged between image sensor chip 12 and lens assembly 17, light transmission piece 15 can make up figure
The defect as caused by 12 warpage of sensor chip, makes image formation by rays on the imaging surface of bending, ensures the shadow of camera module 10
Image quality amount.Also, without the optical design for changing lens assembly 17, without the encapsulation system for changing image sensor chip 12
Journey, cost is relatively low, ensure that the parsing power and process rate of camera module 10.
Fourth embodiment
The present embodiment provides a kind of assemble methods of camera module, referring to Fig. 5, method includes the following steps：
Step S1：Image sensor chip 12 is bonded on pcb board 11.
Step S2：In the side of image sensor chip 12, optical filter 14 is set.
Filter supporter 13 can be first bonded on pcb board 11 before step S2, is then set in filter supporter 13
Set optical filter 14.
Step S3：In the side of image sensor chip 12, light transmission piece 15 is set.Wherein, light transmission piece 15, which can be arranged, is filtering
Mating plate 14 may also be arranged on one of optical filter 14 far from image sensor chip 12 close to the side of image sensor chip 12
Side.
Step S4：Lens assembly 17 is arranged in the other side of 14 relative image sensor chip 12 of optical filter so that filter
Mating plate 14 and light transmission piece 15 are arranged between image sensor chip 12 and lens assembly 17, and wherein light transmission piece 15 is for making light
Line imaging is on the imaging surface of the bending formed by 12 warpage of image sensor chip.
Lens bracket 16 or motor 18 can be first set in filter supporter 13 before step S 4, then in camera lens branch
Lens assembly 17 is installed on frame 16 or motor 18.
Wherein, the form of lens bracket 16 is arranged in filter supporter 13 to be taken the photograph referring in particular to what second embodiment provided
As head mould group 10.The camera shooting head mould that the form of motor 18 can be provided referring in particular to 3rd embodiment is set in filter supporter 13
Group 10.
The advantageous effect of the assemble method of camera module provided in this embodiment：
By the way that light transmission piece 15 is arranged between image sensor chip 12 and lens assembly 17, light transmission piece 15 can make up figure
The defect that the imaging surface as caused by 12 warpage of sensor chip is bent, makes image formation by rays on the imaging surface of bending, ensures camera shooting
The quality of image of head mould group 10.Also, without the optical design for changing lens assembly 17, without change image sensor chip
12 encapsulation procedure, cost is relatively low, ensure that the parsing power and process rate of camera module 10.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of camera module, which is characterized in that the camera module includes image sensor chip (12), optical filter
(14), lens assembly (17) and light transmission piece (15), the optical filter (14) are arranged in described image sensor chip (12) and institute
Between stating lens assembly (17), the light transmission piece (15) is arranged in described image sensor chip (12) and the lens assembly
(17) between, the light transmission piece (15) is for making image formation by rays in the bending formed by described image sensor chip (12) warpage
Imaging surface on.
2. camera module according to claim 1, which is characterized in that light transmission piece (15) setting is passed in described image
Between sensor chip (12) and the optical filter (14), alternatively, the light transmission piece (15) is arranged in the optical filter (14) and institute
It states between lens assembly (17).
3. camera module according to claim 1, which is characterized in that the light transmission piece (15) is bonded in the optical filter
(14) surface.
4. camera module according to claim 1, which is characterized in that the light transmission piece (15) and the optical filter (14)
Material is identical, and the two is integrally formed.
5. camera module according to claim 1, which is characterized in that the light transmission piece (15) is resin, white glass, indigo plant
Any one of glass, optical glue.
6. camera module according to claim 1, which is characterized in that the camera module further includes pcb board (11),
Described image sensor chip (12) is bonded in the surface of the pcb board (11).
7. camera module according to claim 6, which is characterized in that the camera module further includes filter supporter
(13), the filter supporter (13) is arranged between the pcb board (11) and the lens assembly (17), the optical filter
(14) it is mounted in the filter supporter (13).
8. camera module according to claim 7, which is characterized in that the camera module further includes lens bracket
(16), lens bracket (16) setting is in side of the filter supporter (13) far from the pcb board (11), the camera lens
Component (17) is mounted on the lens bracket (16).
9. camera module according to claim 7, which is characterized in that the camera module further includes motor (18),
In side of the filter supporter (13) far from the pcb board (11), the motor (18) is arranged for motor (18) setting
On the lens assembly (17), the motor (18) is for driving the lens assembly (17).
10. a kind of assemble method of camera module, which is characterized in that the described method comprises the following steps：
Image sensor chip (12) is bonded on pcb board (11)；
In the side of described image sensor chip (12) setting optical filter (14)；
In the side of described image sensor chip (12) setting light transmission piece (15)；
By lens assembly (17) setting in the other side of the optical filter (14) with respect to described image sensor chip (12) so that
The optical filter (14) and the light transmission piece (15) are arranged at described image sensor chip (12) and the lens assembly
(17) between, wherein the light transmission piece (15) is used to that image formation by rays to be made to be formed because of described image sensor chip (12) warpage
On the imaging surface of bending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814622.6A CN108600598B (en) | 2018-07-23 | 2018-07-23 | Camera module and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810814622.6A CN108600598B (en) | 2018-07-23 | 2018-07-23 | Camera module and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108600598A true CN108600598A (en) | 2018-09-28 |
| CN108600598B CN108600598B (en) | 2024-03-12 |
Family
ID=63618135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810814622.6A Active CN108600598B (en) | 2018-07-23 | 2018-07-23 | Camera module and assembling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108600598B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113726985A (en) * | 2020-05-21 | 2021-11-30 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module and terminal equipment |
| CN114500801A (en) * | 2022-01-19 | 2022-05-13 | 横店集团东磁有限公司 | A camera module and its packaging method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2603523Y (en) * | 2003-01-17 | 2004-02-11 | 胜开科技股份有限公司 | Simplified image sensor module |
| US20050018302A1 (en) * | 2003-07-24 | 2005-01-27 | Seiko Epson Corporation | Optical multilayer-film filter, method for fabricating optical multilayer-film filter, optical low-pass filter, and electronic apparatus |
| CN205067775U (en) * | 2015-09-22 | 2016-03-02 | 浙江水晶光电科技股份有限公司 | Electronic equipment and camera module thereof |
| CN105721641A (en) * | 2016-04-29 | 2016-06-29 | 信利光电股份有限公司 | Camera shooting module, assembling method of camera shooting module and electronic device |
| CN105842961A (en) * | 2015-01-15 | 2016-08-10 | 宁波舜宇光电信息有限公司 | Light filter, camera module and manufacturing method thereof |
| JPWO2016017791A1 (en) * | 2014-08-01 | 2017-06-01 | Jsr株式会社 | Optical filter |
| CN206348473U (en) * | 2016-12-21 | 2017-07-21 | 歌尔科技有限公司 | Camera module |
| CN107734227A (en) * | 2017-10-27 | 2018-02-23 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, camera module and preparation method thereof |
| CN107835351A (en) * | 2017-12-14 | 2018-03-23 | 信利光电股份有限公司 | A kind of dual camera module and terminal |
| CN208489921U (en) * | 2018-07-23 | 2019-02-12 | 昆山丘钛微电子科技有限公司 | Camera module |
-
2018
- 2018-07-23 CN CN201810814622.6A patent/CN108600598B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2603523Y (en) * | 2003-01-17 | 2004-02-11 | 胜开科技股份有限公司 | Simplified image sensor module |
| US20050018302A1 (en) * | 2003-07-24 | 2005-01-27 | Seiko Epson Corporation | Optical multilayer-film filter, method for fabricating optical multilayer-film filter, optical low-pass filter, and electronic apparatus |
| JPWO2016017791A1 (en) * | 2014-08-01 | 2017-06-01 | Jsr株式会社 | Optical filter |
| CN105842961A (en) * | 2015-01-15 | 2016-08-10 | 宁波舜宇光电信息有限公司 | Light filter, camera module and manufacturing method thereof |
| CN205067775U (en) * | 2015-09-22 | 2016-03-02 | 浙江水晶光电科技股份有限公司 | Electronic equipment and camera module thereof |
| CN105721641A (en) * | 2016-04-29 | 2016-06-29 | 信利光电股份有限公司 | Camera shooting module, assembling method of camera shooting module and electronic device |
| CN206348473U (en) * | 2016-12-21 | 2017-07-21 | 歌尔科技有限公司 | Camera module |
| CN107734227A (en) * | 2017-10-27 | 2018-02-23 | 昆山丘钛微电子科技有限公司 | Image sensor package structure, camera module and preparation method thereof |
| CN107835351A (en) * | 2017-12-14 | 2018-03-23 | 信利光电股份有限公司 | A kind of dual camera module and terminal |
| CN208489921U (en) * | 2018-07-23 | 2019-02-12 | 昆山丘钛微电子科技有限公司 | Camera module |
Non-Patent Citations (1)
| Title |
|---|
| 王清泉;李旭宇;张茂林;: "基于CCD的多浊度快速检测技术", 仪表技术与传感器, no. 01, pages 101 - 105 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113726985A (en) * | 2020-05-21 | 2021-11-30 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module and terminal equipment |
| CN113726985B (en) * | 2020-05-21 | 2022-09-06 | 宁波舜宇光电信息有限公司 | Photosensitive chip assembly, camera module and terminal equipment |
| CN114500801A (en) * | 2022-01-19 | 2022-05-13 | 横店集团东磁有限公司 | A camera module and its packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108600598B (en) | 2024-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20210203818A1 (en) | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | |
| CN101014092B (en) | Camera module | |
| KR20080047002A (en) | Lens assembly of camera module and its manufacturing method | |
| JP2022002396A (en) | Multi-lens camera module conjoined stand, multi-lens camera module and application thereof | |
| US8274599B2 (en) | Miniature camera module | |
| CN102449524B (en) | Vehicular camera and lens assembly | |
| US20090079863A1 (en) | Camera module, manufacturing method of imaging apparatus and hot melt molding method | |
| US7619684B2 (en) | Camera module, manufacturing method of camera module, electronic apparatus, and manufacturing method of electronic apparatus | |
| CN208509047U (en) | Camera module | |
| KR20110002266A (en) | Imaging module | |
| CN204168381U (en) | Imaging modules and mobile terminal | |
| CN108600598A (en) | Camera module and its assemble method | |
| CN112399037B (en) | Photosensitive assembly, camera module and manufacturing method thereof | |
| CN208489921U (en) | Camera module | |
| CN111371971B (en) | A COB camera module and its packaging method | |
| US20240061322A1 (en) | Lens and Camera Module with Lens | |
| JP4913240B2 (en) | Small camera | |
| CN105100556B (en) | Image Acquisition Module | |
| CN206629146U (en) | Camera module and electronic device | |
| CN107172331A (en) | One kind focuses camera module and preparation method thereof and electronic equipment | |
| KR20120079551A (en) | Focus free camera module | |
| CN204967970U (en) | Array module of making a video recording | |
| CN105470270B (en) | The packaging method and camera module of COB chip camera module | |
| CN114339000A (en) | Camera module and preparation method thereof | |
| CN112311968B (en) | Photosensitive assembly, camera module, manufacturing method of photosensitive assembly and camera module, and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |