CN108598155A - Thin film transistor (TFT), array substrate and display device - Google Patents
Thin film transistor (TFT), array substrate and display device Download PDFInfo
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
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- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
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- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
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- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/258—Source or drain electrodes for field-effect devices characterised by the relative positions of the source or drain electrodes with respect to the gate electrode
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- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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Abstract
本发明公开了一种薄膜晶体管,包括栅极、源漏极金属层以及半导体层;所述栅极设置在透明基板上;所述透明基板上还设有栅极绝缘层覆盖所述栅极;所述半导体层设置在所述栅极绝缘层上并位于所述栅极的上方;所述源漏极金属层设置在所述半导体层上,包括源极和漏极,所述源极和所述漏极彼此分离并与所述半导体层接触,所述半导体层设有沟道,所述沟道设置在所述源极和所述漏极之间,所述栅极与所述源漏极金属层在垂直于所述透明基板方向上具有交叠区域,所述栅极与所述源漏极金属层中至少一个设置有用于减小所述栅极与所述源漏极金属层之间的正对面积的镂空结构。本发明还涉及一种阵列基板和显示装置。
The invention discloses a thin film transistor, comprising a gate, a source-drain metal layer and a semiconductor layer; the gate is arranged on a transparent substrate; a gate insulating layer is also provided on the transparent substrate to cover the gate; The semiconductor layer is disposed on the gate insulating layer and above the gate; the source-drain metal layer is disposed on the semiconductor layer, including a source and a drain, and the source and the drain are disposed on the semiconductor layer. The drains are separated from each other and are in contact with the semiconductor layer, the semiconductor layer is provided with a channel, the channel is arranged between the source and the drain, and the gate is connected to the source and drain The metal layer has an overlapping area in a direction perpendicular to the transparent substrate, and at least one of the gate and the source-drain metal layer is provided with a device for reducing the gap between the gate and the source-drain metal layer. The hollow structure of the facing area. The invention also relates to an array substrate and a display device.
Description
技术领域technical field
本发明涉及显示的技术领域,特别是涉及一种薄膜晶体管、阵列基板及显示装置。The present invention relates to the technical field of display, in particular to a thin film transistor, an array substrate and a display device.
背景技术Background technique
显示装置,例如液晶显示装置(liquid crystal display,LCD)具有画质好、体积小、重量轻、低驱动电压、低功耗、无辐射和制造成本相对较低的优点,在平板显示领域占主导地位。液晶显示装置包括阵列基板、彩色滤光基板及背光模组等几部分。阵列基板包括:透明基板和形成成于透明基板上的多条扫描线(Scan Line)和多条数据线(Data Line),多条扫描线和多条数据线相互交叉形成多个像素单元,每个像素单元包括薄膜晶体管(ThinFilm Transistor,TFT)和像素电极,薄膜晶体管作为开关器件用于控制像素单元的状态。Display devices, such as liquid crystal display (liquid crystal display, LCD) have the advantages of good image quality, small size, light weight, low driving voltage, low power consumption, no radiation and relatively low manufacturing cost, and dominate the field of flat panel display. status. A liquid crystal display device includes several parts such as an array substrate, a color filter substrate, and a backlight module. The array substrate includes: a transparent substrate and a plurality of scan lines (Scan Line) and a plurality of data lines (Data Line) formed on the transparent substrate, and a plurality of scan lines and a plurality of data lines intersect each other to form a plurality of pixel units, each Each pixel unit includes a thin film transistor (ThinFilm Transistor, TFT) and a pixel electrode, and the thin film transistor is used as a switching device to control the state of the pixel unit.
如图1所示,阵列基板中每一像素单元的等效电路由薄膜晶体管、像素液晶层电容Clc、像素存储电容Cst组成,且该像素单元通过薄膜晶体管的栅极G经由扫描线电性连接栅极驱动芯片(Gate Driver IC),以及通过薄膜晶体管的源极S经由数据线电性连接源极驱动芯片(Source Driver IC),薄膜晶体管的漏极D电性连接一像素电极、像素液晶层电容和像素存储电容。当栅极驱动芯片通过扫描线驱动薄膜晶体管的栅极导通时,从源极驱动芯片输入的数据电压信号即可经由数据线自薄膜晶体管的源极和漏极传递至像素液晶层电容和像素存储电容,并由像素液晶层电容和像素存储电容储存其所接收到的电压信号。As shown in Figure 1, the equivalent circuit of each pixel unit in the array substrate is composed of a thin film transistor, a pixel liquid crystal layer capacitor Clc, and a pixel storage capacitor Cst, and the pixel unit is electrically connected through the scan line through the gate G of the thin film transistor. The gate driver IC (Gate Driver IC), and the source S of the thin film transistor is electrically connected to the source driver IC (Source Driver IC) through the data line, and the drain D of the thin film transistor is electrically connected to a pixel electrode, a pixel liquid crystal layer capacitor and pixel storage capacitor. When the gate drive chip drives the gate of the thin film transistor through the scan line, the data voltage signal input from the source drive chip can be transmitted from the source and drain of the thin film transistor to the pixel liquid crystal layer capacitor and pixel through the data line. storage capacitor, and the voltage signal received by the pixel liquid crystal layer capacitor and the pixel storage capacitor is stored.
阵列基板的像素电路还存在若干个寄生电容。如图2所示,现有的薄膜晶体管包括设置在透明基板(图未示)上的栅极10、源极21、漏极22和半导体层30,半导体层30设置在栅极10的上方,源极21和漏极22同层设置且彼此分离并与半导体层30接触,部分半导体层30从源极21和漏极22之间露出形成沟道31。在垂直于透明基板的方向上,栅极10与源极21、栅极10与漏极22之间均存在交叠区域,该交叠区域便会产生寄生电容,如栅极与漏极之间的交叠电容Cgd、栅极与源极之间的交叠电容Cgs等。当栅极驱动芯片将扫描线上的电压升到扫描线高电压Vgh之际,源极驱动芯片也将数据线上的电压上升从而开始对像素电极充电。当像素电极的电压上升到预定电压时,扫描线上的电压降到扫描线低电压Vgl。此时,扫描线上的压降对像素电极造成耦合效应而使像素电极上的电压亦产生一压降ΔVp。该压降ΔVp也被称为馈通电压(Feed Through Voltage),其以栅极与漏极之间的交叠电容Cgd、像素液晶层电容Clc、像素存储电容Cst、扫描线高电压(Vgh)与扫描线低电压(Vgl)所表示的数学关系式如下:There are also several parasitic capacitances in the pixel circuit of the array substrate. As shown in FIG. 2, the existing thin film transistor includes a gate 10, a source 21, a drain 22 and a semiconductor layer 30 arranged on a transparent substrate (not shown), and the semiconductor layer 30 is arranged above the gate 10, The source 21 and the drain 22 are arranged in the same layer and are separated from each other and are in contact with the semiconductor layer 30 , a part of the semiconductor layer 30 is exposed between the source 21 and the drain 22 to form a channel 31 . In the direction perpendicular to the transparent substrate, there are overlapping regions between the gate 10 and the source 21, and between the gate 10 and the drain 22, which will generate parasitic capacitance, such as between the gate and the drain. The overlap capacitance Cgd, the overlap capacitance Cgs between the gate and the source, etc. When the gate driving chip raises the voltage on the scanning line to the high voltage Vgh on the scanning line, the source driving chip also raises the voltage on the data line to start charging the pixel electrode. When the voltage of the pixel electrode rises to a predetermined voltage, the voltage on the scan line drops to the scan line low voltage Vgl. At this time, the voltage drop on the scan line causes a coupling effect to the pixel electrode, so that the voltage on the pixel electrode also produces a voltage drop ΔVp. The voltage drop ΔVp is also called feed through voltage (Feed Through Voltage). The mathematical relationship expressed with the scan line low voltage (Vgl) is as follows:
△Vp=(Vgh-Vgl)×{Cgd/(Cgd+Clc+Cst)}△Vp=(Vgh-Vgl)×{Cgd/(Cgd+Clc+Cst)}
馈通电压会导致显示画面闪烁、残像和灰度错乱等问题,降低显示装置的显示品质。在形成馈通电压的过程中,栅极与漏极之间的交叠电容Cgd对馈通电压的影响最大。再有,沟道31的宽和长也会对馈通电压产生影响,沟道31的宽和长的选择还涉及到薄膜晶体管的开态电流、关态电流、开口率等,因此需要选择能兼顾各方后最优化的沟道31的宽和长。在沟道31的宽和长为定值的前提下,如何进一步减小馈通电压以提升显示品质是业内人员待解决的问题之一。The feed-through voltage will cause problems such as flickering of the display screen, afterimages and gray scale disorder, and reduce the display quality of the display device. In the process of forming the feed-through voltage, the overlap capacitance Cgd between the gate and the drain has the greatest influence on the feed-through voltage. Furthermore, the width and length of the channel 31 will also affect the feedthrough voltage. The selection of the width and length of the channel 31 also involves the on-state current, off-state current, aperture ratio, etc. of the thin film transistor, so it is necessary to select the The width and length of the channel 31 are optimized after taking all parties into consideration. On the premise that the width and length of the channel 31 are constant, how to further reduce the feed-through voltage to improve the display quality is one of the problems to be solved by those in the industry.
发明内容Contents of the invention
本发明的目的在于提供一种薄膜晶体管、阵列基板及显示装置,可降低馈通电压,提高显示装置的显示品质。The object of the present invention is to provide a thin film transistor, an array substrate and a display device, which can reduce the feed-through voltage and improve the display quality of the display device.
本发明实施例提供一种薄膜晶体管,包括栅极、源漏极金属层以及半导体层;所述栅极设置在透明基板上;所述透明基板上还设有栅极绝缘层覆盖所述栅极;所述半导体层设置在所述栅极绝缘层上并位于所述栅极的上方;所述源漏极金属层设置在所述半导体层上,包括源极和漏极,所述源极和所述漏极彼此分离并与所述半导体层接触,所述半导体层设有沟道,所述沟道设置在所述源极和所述漏极之间,所述栅极与所述源漏极金属层在垂直于所述透明基板方向上具有交叠区域,所述栅极与所述源漏极金属层中至少一个设置有用于减小所述栅极与所述源漏极金属层之间的正对面积的镂空结构。An embodiment of the present invention provides a thin film transistor, including a gate, a source-drain metal layer, and a semiconductor layer; the gate is disposed on a transparent substrate; a gate insulating layer is also provided on the transparent substrate to cover the gate ; the semiconductor layer is disposed on the gate insulating layer and located above the gate; the source-drain metal layer is disposed on the semiconductor layer, including a source and a drain, the source and The drains are separated from each other and are in contact with the semiconductor layer, the semiconductor layer is provided with a channel, the channel is arranged between the source and the drain, the gate is connected to the source and drain The electrode metal layer has an overlapping area in the direction perpendicular to the transparent substrate, and at least one of the gate and the source-drain metal layer is provided with a The hollow structure of the facing area.
进一步地,所述镂空结构为设置在所述栅极上的第一镂空结构。Further, the hollow structure is a first hollow structure provided on the gate.
进一步地,所述栅极与所述源极在垂直于所述透明基板方向上具有第一交叠区域,所述栅极与漏极在垂直于所述透明基板方向上具有第二交叠区域;所述第一镂空结构包括设置在所述第一交叠区域内的第一镂空图案和设置在所述第二交叠区域内的第二镂空图案。Further, the gate and the source have a first overlapping area in a direction perpendicular to the transparent substrate, and the gate and the drain have a second overlapping area in a direction perpendicular to the transparent substrate ; The first hollow structure includes a first hollow pattern arranged in the first overlapping region and a second hollow pattern arranged in the second overlapping region.
进一步地,所述镂空结构为设置在所述源极和所述漏极上的第二镂空结构。Further, the hollow structure is a second hollow structure disposed on the source and the drain.
进一步地,所述源极与栅极在垂直于所述透明基板方向上具有第一交叠区域,所述漏极与栅极在垂直于所述透明基板方向上具有第二交叠区域;所述第二镂空结构包括设置在所述第一交叠区域内的第三镂空图案和设置在所述第二交叠区域内的第四镂空图案。Further, the source and the gate have a first overlapping area in a direction perpendicular to the transparent substrate, and the drain and the gate have a second overlapping area in a direction perpendicular to the transparent substrate; The second hollow structure includes a third hollow pattern arranged in the first overlapping region and a fourth hollow pattern arranged in the second overlapping region.
进一步地,所述镂空结构为设置在所述栅极上的第一镂空结构和设置在所述源极、所述漏极上的第二镂空结构。Further, the hollow structure is a first hollow structure disposed on the gate and a second hollow structure disposed on the source and the drain.
进一步地,所述栅极与源极在垂直于所述透明基板方向上具有第一交叠区域,所述栅极与漏极在垂直于所述透明基板方向上具有第二交叠区域;所述第一镂空结构包括设置在所述第一交叠区域内的第一镂空图案和设置在所述第二交叠区域内的第二镂空图案;所述第二镂空结构包括设置在所述第一交叠区域内的第三镂空图案和设置在所述第二交叠区域内的第四镂空图案。Further, the gate and the source have a first overlapping area in a direction perpendicular to the transparent substrate, and the gate and the drain have a second overlapping area in a direction perpendicular to the transparent substrate; The first hollow structure includes a first hollow pattern arranged in the first overlapping region and a second hollow pattern arranged in the second overlapping region; the second hollow structure includes a first hollow pattern arranged in the first overlapping region. A third hollow pattern in an overlapping area and a fourth hollow pattern arranged in the second overlapping area.
进一步地,所述第一镂空结构和所述第二镂空结构在垂直于所述透明基板方向上的重合面积大于所述第一交叠区域和所述第二交叠区域的总面积的80%以上。Further, the overlapping area of the first hollow structure and the second hollow structure in a direction perpendicular to the transparent substrate is greater than 80% of the total area of the first overlapping area and the second overlapping area above.
本发明实施例提供一种阵列基板,所述阵列基板包括多条扫描线和多条数据线,所述多条扫描线和所述多条数据线相互交叉限定出多个像素单元,每个像素单元包括像素电极,所述每个像素单元还包括上述的薄膜晶体管,所述薄膜晶体管的栅极与对应的扫描线连接,所述薄膜晶体管的漏极与所述像素电极连接。An embodiment of the present invention provides an array substrate, the array substrate includes a plurality of scanning lines and a plurality of data lines, the plurality of scanning lines and the plurality of data lines intersect to define a plurality of pixel units, each pixel The unit includes a pixel electrode, and each pixel unit further includes the above-mentioned thin film transistor, the gate of the thin film transistor is connected to the corresponding scanning line, and the drain of the thin film transistor is connected to the pixel electrode.
本发明实施例提供一种显示装置,包括上述的阵列基板。An embodiment of the present invention provides a display device, including the above-mentioned array substrate.
本发明实施例提供的薄膜晶体管中,栅极与源漏极金属层在垂直于透明基板方向上具有交叠区域,栅极与源漏极金属层中至少一个设置有用于减小栅极与源漏极金属层之间的正对面积的镂空结构,通过减小栅极与源极、栅极与漏极之间的正对面积,进而减小了栅极与源极、栅极与漏极之间的交叠电容(寄生电容),在薄膜晶体管打开为像素电极充电过程中,有效降低了耦合至使像素电极上的馈通电压,提高显示装置的显示品质。In the thin film transistor provided by the embodiment of the present invention, the gate and the source-drain metal layer have an overlapping area in the direction perpendicular to the transparent substrate, and at least one of the gate and the source-drain metal layer is provided with a The hollow structure of the facing area between the drain metal layers, by reducing the facing area between the gate and the source, the gate and the drain, thereby reducing the gate and the source, the gate and the drain The overlapping capacitance (parasitic capacitance) between the thin film transistors effectively reduces the feed-through voltage coupled to the pixel electrodes during the process of turning on the thin film transistors to charge the pixel electrodes, thereby improving the display quality of the display device.
附图说明Description of drawings
图1为现有一种阵列基板中一像素单元的等效电路图。FIG. 1 is an equivalent circuit diagram of a pixel unit in an existing array substrate.
图2为图1所示的薄膜晶体管的局部结构示意图。FIG. 2 is a schematic diagram of a partial structure of the thin film transistor shown in FIG. 1 .
图3为本发明第一实施例的薄膜晶体管的局部结构示意图。FIG. 3 is a schematic diagram of a partial structure of a thin film transistor according to a first embodiment of the present invention.
图4为本发明第一实施例的薄膜晶体管的栅极的结构示意图。FIG. 4 is a schematic structural diagram of a gate of a thin film transistor according to a first embodiment of the present invention.
图5为本发明第一实施例的薄膜晶体管的源漏极的结构示意图。FIG. 5 is a schematic structural diagram of the source and drain of the thin film transistor according to the first embodiment of the present invention.
图6为图3中沿着A-A线的截面示意图。FIG. 6 is a schematic cross-sectional view along line A-A in FIG. 3 .
图7为本发明第二实施例的薄膜晶体管的局部结构示意图。FIG. 7 is a schematic diagram of a partial structure of a thin film transistor according to a second embodiment of the present invention.
图8为本发明第二实施例的薄膜晶体管的栅极的结构示意图。FIG. 8 is a schematic structural diagram of a gate of a thin film transistor according to a second embodiment of the present invention.
图9为本发明第二实施例的薄膜晶体管的源漏极的结构示意图。FIG. 9 is a schematic structural diagram of the source and drain of the thin film transistor according to the second embodiment of the present invention.
图10为图7中沿着B-B线的截面示意图。Fig. 10 is a schematic cross-sectional view along line B-B in Fig. 7 .
图11为本发明第三实施例的薄膜晶体管的局部结构示意图。FIG. 11 is a schematic diagram of a partial structure of a thin film transistor according to a third embodiment of the present invention.
图12为本发明第三实施例的薄膜晶体管的栅极的结构示意图。FIG. 12 is a schematic structural diagram of a gate of a thin film transistor according to a third embodiment of the present invention.
图13为本发明第三实施例的薄膜晶体管的源漏极的结构示意图。FIG. 13 is a schematic structural diagram of the source and drain of the thin film transistor according to the third embodiment of the present invention.
图14为图11中沿着C-C线的截面示意图。FIG. 14 is a schematic cross-sectional view along line C-C in FIG. 11 .
具体实施方式Detailed ways
为更进一步阐述本发明为达成预定发明目的所采取的技术方式及功效,以下结合附图及实施例,对本发明的具体实施方式、结构、特征及其功效,详细说明如后。In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and examples.
[第一实施例][first embodiment]
请参图3至图6,本发明第一实施例提供的薄膜晶体管包括设置在透明基板100上的栅极110、源漏极金属层120以及半导体层300。其中,栅极110设置在透明基板100上;透明基板100上还设有栅极绝缘层101覆盖该栅极110;半导体层300设置在栅极绝缘层101上并位于栅极110的上方;源漏极金属层120设置在半导体层300上,包括源极121和漏极122,源极121和漏极122彼此分离并与半导体层300接触,半导体层300设有沟道301,沟道301设置在源极121和漏极122之间。Referring to FIGS. 3 to 6 , the thin film transistor provided by the first embodiment of the present invention includes a gate 110 , a source-drain metal layer 120 and a semiconductor layer 300 disposed on a transparent substrate 100 . Wherein, the gate 110 is arranged on the transparent substrate 100; the gate insulating layer 101 is also provided on the transparent substrate 100 to cover the gate 110; the semiconductor layer 300 is arranged on the gate insulating layer 101 and is located above the gate 110; The drain metal layer 120 is disposed on the semiconductor layer 300, including a source electrode 121 and a drain electrode 122. The source electrode 121 and the drain electrode 122 are separated from each other and are in contact with the semiconductor layer 300. The semiconductor layer 300 is provided with a channel 301, and the channel 301 is provided with between the source 121 and the drain 122 .
源极121为“U”型或“C”型结构,但并不以此为限。该源极121的“U”型或“C”型结构的开口朝向漏极122。The source 121 is a "U"-shaped or "C"-shaped structure, but not limited thereto. The opening of the “U”-shaped or “C”-shaped structure of the source 121 faces the drain 122 .
漏极122的其中靠近源极121的一端为长条型并部分伸入源极121的“U”型或“C”型结构的开口。漏极122的另一端用于与像素电极连接。One end of the drain 122 close to the source 121 is elongated and partially extends into the opening of the “U” or “C” structure of the source 121 . The other end of the drain 122 is used to connect to the pixel electrode.
栅极110与源漏极金属层120在垂直于透明基板100方向上具有交叠区域,栅极110与源漏极金属层120中至少一个设置有用于减小栅极110与源漏极金属层120之间的正对面积的镂空结构。本实施例中,栅极110上设有用于减小栅极110与源漏极金属层120之间的正对面积的第一镂空结构130。The gate 110 and the source-drain metal layer 120 have overlapping areas in a direction perpendicular to the transparent substrate 100, and at least one of the gate 110 and the source-drain metal layer 120 is provided with a layer for reducing the size of the gate 110 and the source-drain metal layer. The hollow structure of the facing area between 120. In this embodiment, the gate 110 is provided with a first hollow structure 130 for reducing the facing area between the gate 110 and the source-drain metal layer 120 .
具体地,栅极110与源极121在垂直于透明基板100方向上具有第一交叠区域S1,栅极110与漏极122在垂直于透明基板100方向上具有第二交叠区域S2。第一镂空结构130设置在第一交叠区域S1和第二交叠区域S2。Specifically, the gate 110 and the source 121 have a first overlapping region S1 in a direction perpendicular to the transparent substrate 100 , and the gate 110 and the drain 122 have a second overlapping region S2 in a direction perpendicular to the transparent substrate 100 . The first hollow structure 130 is disposed in the first overlapping region S1 and the second overlapping region S2.
本实施例中,第一镂空结构130包括设置在第一交叠区域S1内的第一镂空图案131和设置在第二交叠区域S2内的第二镂空图案132。但并不以此为限,在其它实施例中,也可以只在其中一个交叠区域内设置镂空图案。In this embodiment, the first hollow structure 130 includes a first hollow pattern 131 disposed in the first overlapping region S1 and a second hollow pattern 132 disposed in the second overlapping region S2. But it is not limited thereto, and in other embodiments, the hollow pattern can also be provided only in one of the overlapping regions.
本实施例中,第一镂空结构130的总面积大于第一交叠区域S1和第二交叠区域S2的总面积的50%以上。In this embodiment, the total area of the first hollow structure 130 is more than 50% of the total area of the first overlapping region S1 and the second overlapping region S2.
如图4所示,本实施例中,第一镂空图案131为两个与源极121同心设置的弧形结构1311、1312,第二镂空图案132为一个“U”型结构,但并不以此为限。As shown in FIG. 4, in this embodiment, the first hollow pattern 131 is two arc-shaped structures 1311 and 1312 concentrically arranged with the source 121, and the second hollow pattern 132 is a "U"-shaped structure, but not This is the limit.
在栅极110上设置第一镂空结构130,减小了栅极110与源极121、栅极110与漏极122之间的正对面积,进而减小了栅极110与源极121、栅极110与漏极122之间的交叠电容(寄生电容),在薄膜晶体管打开为像素电极充电过程中,有效降低了耦合至使像素电极上的馈通电压。The first hollow structure 130 is arranged on the gate 110, which reduces the facing area between the gate 110 and the source 121, and between the gate 110 and the drain 122, thereby reducing the area between the gate 110 and the source 121, the gate The overlap capacitance (parasitic capacitance) between the electrode 110 and the drain electrode 122 effectively reduces the feed-through voltage coupled to the pixel electrode when the thin film transistor is turned on to charge the pixel electrode.
下表为本实施例的薄膜晶体管与现有技术的薄膜晶体管在沟道的宽和长为定值的前提下的特性比较,从表中可看出,本实施例的薄膜晶体管的栅极110与漏极122之间的交叠电容相比现有技术有所减小(下降了35%),本实施例的薄膜晶体管的馈通电压的最小值和最大值均相比现有技术有较大幅度减小(下降了36%和34%)。The following table compares the characteristics of the thin film transistor of this embodiment and the thin film transistor of the prior art under the premise that the width and length of the channel are constant values. It can be seen from the table that the gate 110 of the thin film transistor of this embodiment Compared with the overlap capacitance between the drains 122 in the prior art, it is reduced (by 35%), and the minimum value and the maximum value of the feedthrough voltage of the thin film transistor of the present embodiment are lower than those in the prior art. Significant reductions (36% and 34% drops).
[第二实施例][Second embodiment]
请参图7至图10,本发明第二实施例提供的薄膜晶体管包括设置在透明基板100上的栅极110、源漏极金属层120以及半导体层300。其中,栅极110设置在透明基板100上;透明基板100上还设有栅极绝缘层101覆盖该栅极110;半导体层300设置在栅极绝缘层101上并位于栅极110的上方;源漏极金属层120设置在半导体层300上,包括源极121和漏极122,源极121和漏极122彼此分离并与半导体层300接触,半导体层300设有沟道301,沟道301设置在源极121和漏极122之间。Referring to FIG. 7 to FIG. 10 , the thin film transistor provided by the second embodiment of the present invention includes a gate 110 , a source-drain metal layer 120 and a semiconductor layer 300 disposed on a transparent substrate 100 . Wherein, the gate 110 is arranged on the transparent substrate 100; the gate insulating layer 101 is also provided on the transparent substrate 100 to cover the gate 110; the semiconductor layer 300 is arranged on the gate insulating layer 101 and is located above the gate 110; The drain metal layer 120 is disposed on the semiconductor layer 300, including a source electrode 121 and a drain electrode 122. The source electrode 121 and the drain electrode 122 are separated from each other and are in contact with the semiconductor layer 300. The semiconductor layer 300 is provided with a channel 301, and the channel 301 is provided with between the source 121 and the drain 122 .
源极121为“U”型或“C”型结构,但并不以此为限。该源极121的“U”型或“C”型结构的开口朝向漏极122。The source 121 is a "U"-shaped or "C"-shaped structure, but not limited thereto. The opening of the “U”-shaped or “C”-shaped structure of the source 121 faces the drain 122 .
漏极122的其中靠近源极121的一端为长条型并部分伸入源极121的“U”型或“C”型结构的开口内。漏极122的另一端用于与像素电极连接。One end of the drain 122 close to the source 121 is elongated and partially extends into the opening of the “U” or “C” structure of the source 121 . The other end of the drain 122 is used to connect to the pixel electrode.
栅极110与源漏极金属层120在垂直于透明基板100方向上具有交叠区域,栅极110与源漏极金属层120中至少一个设置有用于减小栅极110与源漏极金属层120之间的正对面积的镂空结构。本实施例中,源漏极金属层120上设有用于减小栅极110与源漏极金属层120之间的正对面积的第二镂空结构140。The gate 110 and the source-drain metal layer 120 have overlapping areas in a direction perpendicular to the transparent substrate 100, and at least one of the gate 110 and the source-drain metal layer 120 is provided with a layer for reducing the size of the gate 110 and the source-drain metal layer. The hollow structure of the facing area between 120. In this embodiment, the second hollow structure 140 for reducing the facing area between the gate 110 and the source-drain metal layer 120 is disposed on the source-drain metal layer 120 .
具体地,源极121与栅极110在垂直于透明基板100方向上具有第一交叠区域S1,漏极122与栅极110在垂直于透明基板100方向上具有第二交叠区域S2。第二镂空结构140设置在第一交叠区域S1和第二交叠区域S2。Specifically, the source 121 and the gate 110 have a first overlapping region S1 in a direction perpendicular to the transparent substrate 100 , and the drain 122 and the gate 110 have a second overlapping region S2 in a direction perpendicular to the transparent substrate 100 . The second hollow structure 140 is disposed on the first overlapping area S1 and the second overlapping area S2.
本实施例中,第二镂空结构140包括设置在第一交叠区域S1内的第三镂空图案141和设置在第二交叠区域S2内的第四镂空图案142。但并不以此为限,在其它实施例中,也可以只在其中一个交叠区域内设置镂空图案。In this embodiment, the second hollow structure 140 includes a third hollow pattern 141 disposed in the first overlapping region S1 and a fourth hollow pattern 142 disposed in the second overlapping region S2. But it is not limited thereto, and in other embodiments, the hollow pattern can also be provided only in one of the overlapping regions.
本实施例中,第二镂空结构140的总面积大于第一交叠区域S1和第二交叠区域S2的总面积的30%以上。In this embodiment, the total area of the second hollow structure 140 is greater than 30% of the total area of the first overlapping region S1 and the second overlapping region S2.
如图7所示,本实施例中,第三镂空图案141为一个与源极121同心设置的弧形结构,第四镂空图案142为一个与漏极122靠近漏极122一端的长度延伸方向相同的长条型结构,但并不以此为限。As shown in FIG. 7 , in this embodiment, the third hollow pattern 141 is an arc-shaped structure arranged concentrically with the source electrode 121 , and the fourth hollow pattern 142 is an arc structure that is in the same direction as the length of the end of the drain electrode 122 near the drain electrode 122 . The elongated structure, but not limited to this.
在源漏极金属层120上设置第二镂空结构140,减小了栅极110与源极121、栅极110与漏极122之间的正对面积,进而减小了栅极110与源极121、栅极110与漏极122之间的交叠电容(寄生电容),在薄膜晶体管打开为像素电极充电过程中,有效降低了耦合至使像素电极上的馈通电压。The second hollow structure 140 is provided on the source-drain metal layer 120, which reduces the facing area between the gate 110 and the source 121, and between the gate 110 and the drain 122, thereby reducing the distance between the gate 110 and the source. 121. The overlapping capacitance (parasitic capacitance) between the gate 110 and the drain 122 effectively reduces the feed-through voltage coupled to the pixel electrode when the thin film transistor is turned on to charge the pixel electrode.
下表为本实施例的薄膜晶体管与现有技术的薄膜晶体管在沟道的宽和长为定值的前提下的特性比较,从表中可看出,本实施例的薄膜晶体管的栅极110与漏极122之间的交叠电容相比现有技术有所减小(下降了3.2%),本实施例的薄膜晶体管的馈通电压的最小值和最大值均相比现有技术也有所减小(均下降了4%)。The following table compares the characteristics of the thin film transistor of this embodiment and the thin film transistor of the prior art under the premise that the width and length of the channel are constant values. It can be seen from the table that the gate 110 of the thin film transistor of this embodiment Compared with the overlapping capacitance between the drains 122 in the prior art, it is reduced (by 3.2%), and the minimum value and the maximum value of the feedthrough voltage of the thin film transistor of the present embodiment are also reduced compared with the prior art. decrease (both down 4%).
[第三实施例][Third embodiment]
请参图11至图14,本发明第三实施例提供的薄膜晶体管包括设置在透明基板100上的栅极110、源漏极金属层120以及半导体层300。其中,栅极110设置在透明基板100上;透明基板100上还设有栅极绝缘层101覆盖该栅极110;半导体层300设置在栅极绝缘层101上并位于栅极110的上方;源漏极金属层120设置在半导体层300上,包括源极121和漏极122,源极121和漏极122彼此分离并与半导体层300接触,半导体层300设有沟道301,沟道301设置在源极121和漏极122之间。Referring to FIG. 11 to FIG. 14 , the thin film transistor provided by the third embodiment of the present invention includes a gate 110 , a source-drain metal layer 120 and a semiconductor layer 300 disposed on a transparent substrate 100 . Wherein, the gate 110 is arranged on the transparent substrate 100; the gate insulating layer 101 is also provided on the transparent substrate 100 to cover the gate 110; the semiconductor layer 300 is arranged on the gate insulating layer 101 and is located above the gate 110; The drain metal layer 120 is disposed on the semiconductor layer 300, including a source electrode 121 and a drain electrode 122. The source electrode 121 and the drain electrode 122 are separated from each other and are in contact with the semiconductor layer 300. The semiconductor layer 300 is provided with a channel 301, and the channel 301 is provided with between the source 121 and the drain 122 .
源极121为“U”型或“C”型结构,但并不以此为限。该源极121的“U”型或“C”型结构的开口朝向漏极122。The source 121 is a "U"-shaped or "C"-shaped structure, but not limited thereto. The opening of the “U”-shaped or “C”-shaped structure of the source 121 faces the drain 122 .
漏极122的其中靠近源极121的一端为长条型并部分伸入源极121的“U”型或“C”型结构的开口。漏极122的另一端用于与像素电极连接。One end of the drain 122 close to the source 121 is elongated and partially extends into the opening of the “U” or “C” structure of the source 121 . The other end of the drain 122 is used to connect to the pixel electrode.
栅极110与源漏极金属层120在垂直于透明基板100方向上具有交叠区域,栅极110与源漏极金属层120中至少一个设置有用于减小栅极110与源漏极金属层120之间的正对面积的镂空结构。本实施例中,栅极110上设有用于减小栅极110与源漏极金属层120之间的正对面积的第一镂空结构130;源漏极金属层120上设有用于减小栅极110与源漏极金属层120之间的正对面积的第二镂空结构140。The gate 110 and the source-drain metal layer 120 have overlapping areas in a direction perpendicular to the transparent substrate 100, and at least one of the gate 110 and the source-drain metal layer 120 is provided with a layer for reducing the size of the gate 110 and the source-drain metal layer. The hollow structure of the facing area between 120. In this embodiment, a first hollow structure 130 for reducing the facing area between the gate 110 and the source-drain metal layer 120 is provided on the gate 110; The second hollow structure 140 in the facing area between the electrode 110 and the source-drain metal layer 120 .
具体地,栅极110与源极121在垂直于透明基板100方向上具有第一交叠区域S1,栅极110与漏极122在垂直于透明基板100方向上具有第二交叠区域S2。第一镂空结构130和第二镂空结构140均设置在第一交叠区域S1和第二交叠区域S2。Specifically, the gate 110 and the source 121 have a first overlapping region S1 in a direction perpendicular to the transparent substrate 100 , and the gate 110 and the drain 122 have a second overlapping region S2 in a direction perpendicular to the transparent substrate 100 . Both the first hollow structure 130 and the second hollow structure 140 are disposed in the first overlapping region S1 and the second overlapping region S2.
本实施例中,第一镂空结构130包括设置在第一交叠区域S1内的第一镂空图案131和设置在第二交叠区域S2内的第二镂空图案132。但并不以此为限,在其它实施例中,也可以只在其中一个交叠区域内设置镂空图案。In this embodiment, the first hollow structure 130 includes a first hollow pattern 131 disposed in the first overlapping region S1 and a second hollow pattern 132 disposed in the second overlapping region S2. But it is not limited thereto, and in other embodiments, the hollow pattern can also be provided only in one of the overlapping regions.
本实施例中,第二镂空结构140包括设置在第一交叠区域S1内的第三镂空图案141和设置在第二交叠区域S2内的第四镂空图案142。但并不以此为限,在其它实施例中,也可以只在其中一个交叠区域内设置镂空图案。In this embodiment, the second hollow structure 140 includes a third hollow pattern 141 disposed in the first overlapping region S1 and a fourth hollow pattern 142 disposed in the second overlapping region S2. But it is not limited thereto, and in other embodiments, the hollow pattern can also be provided only in one of the overlapping regions.
本实施例中,第一镂空结构130和第二镂空结构140在垂直于透明基板100方向上重合的总面积大于第一交叠区域S1和第二交叠区域S2的总面积的80%以上。In this embodiment, the total overlapping area of the first hollow structure 130 and the second hollow structure 140 in the direction perpendicular to the transparent substrate 100 is more than 80% of the total area of the first overlapping region S1 and the second overlapping region S2.
本实施例中,如图12所示,第一镂空图案131为两个与源极121同心设置的弧形结构1311、1312,第二镂空图案132为一个“U”型结构;如图13所示,第三镂空图案141为一个与源极121同心设置的弧形结构,第四镂空图案142为一个与漏极122靠近漏极122一端的长度延伸方向相同的长条型结构。如图10所示,第一镂空图案131和第三镂空图案141在垂直于透明基板100方向上重合之后将占据了大部分第一交叠区域S1。第二镂空图案132和第四镂空图案142重合之后将占据了大部分第二交叠区域S2。In this embodiment, as shown in FIG. 12, the first hollow pattern 131 is two arc-shaped structures 1311 and 1312 arranged concentrically with the source electrode 121, and the second hollow pattern 132 is a "U"-shaped structure; as shown in FIG. 13 As shown, the third hollow pattern 141 is an arc-shaped structure arranged concentrically with the source 121 , and the fourth hollow pattern 142 is an elongated structure extending in the same direction as the length of the end of the drain 122 near the drain 122 . As shown in FIG. 10 , the first hollow pattern 131 and the third hollow pattern 141 will occupy most of the first overlapping area S1 after overlapping in a direction perpendicular to the transparent substrate 100 . The overlapping of the second hollow pattern 132 and the fourth hollow pattern 142 will occupy most of the second overlapping area S2.
同时在栅极110上设置第一镂空结构130和在源漏极金属层120上设置第二镂空结构140,大幅减小了栅极110与源极121、栅极110与漏极122之间的正对面积,进而减小了栅极110与源极121、栅极110与漏极122之间的交叠电容(寄生电容),在薄膜晶体管打开为像素电极充电过程中,有效降低了耦合至使像素电极上的馈通电压。At the same time, the first hollow structure 130 is set on the gate 110 and the second hollow structure 140 is set on the source-drain metal layer 120, which greatly reduces the distance between the gate 110 and the source 121, and between the gate 110 and the drain 122. The facing area further reduces the overlapping capacitance (parasitic capacitance) between the gate 110 and the source 121, and between the gate 110 and the drain 122. When the thin film transistor is turned on to charge the pixel electrode, it effectively reduces the coupling to enables the feedthrough voltage on the pixel electrode.
下表为本实施例的薄膜晶体管与现有技术的薄膜晶体管在沟道的宽和长为定值的前提下的特性比较,从表中可看出,本实施例的薄膜晶体管的栅极110与漏极122之间的交叠电容相比现有技术有较大幅度减小(下降了49.8%),本实施例的薄膜晶体管的馈通电压的最小值和最大值均相比现有技术均有较大幅度减小(下降了51%和50%)。The following table compares the characteristics of the thin film transistor of this embodiment and the thin film transistor of the prior art under the premise that the width and length of the channel are constant values. It can be seen from the table that the gate 110 of the thin film transistor of this embodiment Compared with the overlapping capacitance between the drains 122, the existing technology has a relatively large reduction (49.8%), and the minimum value and the maximum value of the feedthrough voltage of the thin film transistor of the present embodiment are compared with the prior art. Both have a relatively large decrease (51% and 50% decrease).
本发明还涉及一种阵列基板,该阵列基板包括多条扫描线和多条数据线,多条扫描线和多条数据线相互交叉设置从而限定出多个像素单元,每个像素单元包括像素电极,每个像素单元还包括上述的薄膜晶体管,薄膜晶体管的栅极110与对应的扫描线连接,薄膜晶体管的漏极122与与该像素单元内的像素电极连接。The present invention also relates to an array substrate, the array substrate includes a plurality of scanning lines and a plurality of data lines, the plurality of scanning lines and the plurality of data lines are intersected to define a plurality of pixel units, and each pixel unit includes a pixel electrode Each pixel unit further includes the above thin film transistor, the gate 110 of the thin film transistor is connected to the corresponding scanning line, and the drain 122 of the thin film transistor is connected to the pixel electrode in the pixel unit.
本发明还涉及一种显示装置,该显示装置包括上述的阵列基板。该显示装置例如是液晶显示装置,包括与该阵列基板对置的彩色滤光基板和夹设在该阵列基板和该彩色滤光基板之间的液晶层,显示装置的其它结构为本领域技术人员所熟知,在此不再赘述。The present invention also relates to a display device, which includes the above-mentioned array substrate. The display device is, for example, a liquid crystal display device, including a color filter substrate opposite to the array substrate and a liquid crystal layer sandwiched between the array substrate and the color filter substrate. Other structures of the display device are known to those skilled in the art. It is well known and will not be repeated here.
以上所述,仅是本发明的薄膜晶体管、阵列基板和显示装置的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above descriptions are only preferred embodiments of the thin film transistor, array substrate and display device of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to To limit the present invention, any skilled person familiar with the profession, without departing from the scope of the technical solution of the present invention, may use the technical content disclosed above to make some changes or be modified into equivalent embodiments with equivalent changes, provided that they do not depart from the present invention The content of the technical solution of the invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention still belong to the scope of the technical solution of the present invention.
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