CN108598070B - A double-chip chip-level LED packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention provides a two-chip chip-level LED packaging structure and a manufacturing method thereof. The invention uses two chips to emit different lights to excite different fluorescent layers, and then mixes adjacent lights to emit light, so that the flexibility of color temperature can be realized. Adjustment; the copper pillar with solder layer realizes the convenience of welding, and at the same time improves the strength of the cured board and enhances its heat dissipation effect; the fluorescent layer covers the side of the resin block in the slit to prevent unexcited light from the side Shoot straight out.

Description

A double-chip chip-level LED packaging structure and manufacturing method thereof

technical field

The invention relates to the field of LED packaging, in particular to a double-chip chip-level LED packaging structure and a manufacturing method thereof.

Background technique

For the chip-level LED packaging structure, most of them are single-chip packaging. The packaging structure is simple, but the color temperature range is single, and the light output angle is mostly single-sided, which is not conducive to the effective use of light.

Contents of the invention

Based on solving the above problems, the present invention provides a method for manufacturing a two-chip chip-level LED packaging structure, including:

(1) molding to form a transparent resin curing plate, the curing plate is provided with a plurality of grooves;

(2) Insert multiple flip-chip LED chips into the grooves respectively;

(3) forming a first resin layer on the first surface, the first resin layer completely sealing the LED chip;

(4) A plurality of slits are formed at the position of the first resin layer between the LED chips, and the slits divide the first resin layer into a plurality of resin blocks, and the resin blocks respectively seal a single LED chip;

(5) forming a fluorescent layer on the resin block and in the slit, the fluorescent layer comprising a first layer capable of absorbing emitted light of the first wavelength and a second layer capable of absorbing emitted light of the second wavelength;

(6) A second resin layer is formed on the fluorescent layer, and the resin layer covers the fluorescent layer.

According to an embodiment of the present invention, in step (1), the curing plate has an opposite first surface and a second surface, a plurality of grooves are formed on the first surface, and a plurality of grooves are formed in the curing plate. Copper column, the upper end and the lower end of the copper column are provided with a solder layer, the solder layer at the upper end is flush with the bottom wall of the groove and exposed from the groove while the solder layer at the lower end is not exposed from the groove. The second surface is exposed.

According to an embodiment of the present invention, in step (2), the solder layer passing through the upper end is soldered to the copper pillar, and the LED chip includes a first LED chip emitting light with a first wavelength and a first LED chip with a second wavelength. The second LED chip emits light, and the LED chips of two different colors are alternately arranged.

According to an embodiment of the present invention, after step (6), it further includes: thinning the second surface so that the solder layer at the lower end of the copper pillar is exposed from the second surface; and removing the solder layer at the lower end Reflow is performed to form solder balls.

According to an embodiment of the present invention, the fluorescent layer is formed on the resin block and in the slit by a compression molding process.

The present invention also provides a two-chip chip-level LED packaging structure, including:

a transparent resin curing plate on which a plurality of grooves are formed;

A plurality of flip-chip LED chips are respectively stuck in the grooves;

A first resin layer, the first resin layer completely seals the LED chips, and a plurality of slits are formed at positions of the first resin layer between the LED chips;

a fluorescent layer formed on the resin block and in the slit, the fluorescent layer includes a first layer capable of absorbing emitted light of the first wavelength and a second layer capable of absorbing emitted light of the second wavelength;

The second resin layer is formed and covered on the fluorescent layer.

According to an embodiment of the present invention, the cured plate, the first resin layer and the second resin layer are made of the same transparent resin material.

According to an embodiment of the present invention, the first chip is a blue LED chip, and the second chip is a red LED chip.

According to an embodiment of the present invention, the depth of the groove is smaller than the height of the LED chip.

According to an embodiment of the present invention, solder balls are further included, formed on the lower ends of the copper pillars.

The advantages of the present invention are as follows:

(1) It uses two chips to emit different light to excite different fluorescent layers, and then mixes adjacent light to emit light, which can realize flexible adjustment of color temperature;

(2) The copper pillar with solder layer realizes the convenience of welding, and at the same time improves the strength of the cured board and enhances its heat dissipation effect;

(3) The fluorescent layer covers the sides of the resin block in the slit to prevent the unexcited light from the sides from directly emitting.

Description of drawings

Fig. 1-8 is the schematic diagram of the chip level LED package structure that the present invention manufactures two chips;

FIG. 9 is a schematic diagram of the copper pillar before and after reflow of the present invention.

Detailed ways

Referring to Figures 1-9, the manufacturing method of the double-chip chip-level LED packaging structure of the present invention includes:

Referring to Fig. 1, molding forms a transparent resin cured plate 1, and described cured plate 1 has opposite first surface and second surface, and a plurality of grooves 2 are formed on the described first surface, in described cured plate 1 There are a plurality of copper pillars 3, the upper and lower ends of the copper pillars 3 are provided with a solder layer 11 (see the unreflowed copper pillar 3 in Figure 9), and the solder layer 11 at the upper end is in contact with the bottom wall of the groove 2 flush and exposed from the groove 2 while the solder layer 11 at the lower end is not exposed from the second surface;

Referring to FIG. 2 , a plurality of flip-chip LED chips are snapped into the grooves 2 respectively, and soldered to the copper pillar 3 through the solder layer 11 at the upper end, and the LED chips include light emitting light having a first wavelength. The first LED chip 4 and the second LED chip 5 having the second wavelength of light emission, and the LED chips of two different colors are arranged alternately;

Referring to FIG. 3, a first resin layer 6 is formed on the first surface, and the first resin layer 6 completely seals the LED chip;

Referring to FIG. 4 , a plurality of slits 7 are formed at the position of the first resin layer 6 between the LED chips, and the slits 7 divide the first resin layer 6 into a plurality of resin blocks, and the resin Each block separately seals a single LED chip;

Referring to FIG. 5, a fluorescent layer 8 is formed on the resin block and in the slit 7, and the fluorescent layer 8 includes a first layer capable of absorbing emitted light of the first wavelength and a first layer capable of absorbing emitted light of the second wavelength. second floor;

Referring to FIG. 6, a second resin layer 9 is formed on the fluorescent layer 8, and the resin layer 9 covers the fluorescent layer 8;

Referring to FIG. 7, the second surface is thinned so that the solder layer 11 at the lower end of the copper pillar 3 is exposed from the second surface;

Referring to FIG. 8 , the solder layer 11 at the lower end is reflowed to form solder balls 10 .

Wherein, the cured plate 1 , the first resin layer 6 and the second resin layer 9 are made of the same transparent resin material. The first chip 4 is a blue LED chip, and the second chip 5 is a red LED chip. The depth of the groove 2 is smaller than the height of the LED chip. The fluorescent layer 8 is formed on the resin block and in the slit by a compression molding process.

Referring to Fig. 8, the present invention provides a two-chip chip-level LED packaging structure according to the above method, including:

A transparent resin curing plate, the curing plate has a first surface and a second surface opposite, a plurality of grooves are formed on the first surface, a plurality of copper pillars are arranged in the curing plate, and the upper ends of the copper pillars A solder layer is provided, the solder layer at the upper end is flush with the bottom wall of the groove and exposed from the groove, and the lower end of the copper pillar is exposed from the second surface;

A plurality of flip-chip LED chips are respectively stuck in the grooves and soldered to the copper pillars through the solder layer at the upper end, the LED chips include a first LED chip emitting light with a first wavelength and There is a second LED chip emitting light at a second wavelength, and the LED chips of two different colors are arranged alternately;

A first resin layer is formed on the first surface, the first resin layer completely seals the LED chips, and a plurality of slits are formed at positions of the first resin layer between the LED chips, so The slit divides the first resin layer into a plurality of resin blocks, and the resin blocks respectively seal a single LED chip;

a fluorescent layer formed on the resin block and in the slit, the fluorescent layer includes a first layer capable of absorbing emitted light of the first wavelength and a second layer capable of absorbing emitted light of the second wavelength;

a second resin layer formed and covered on the fluorescent layer;

Solder balls are formed on the lower ends of the copper pillars.

Wherein, the cured plate, the first resin layer and the second resin layer are made of the same transparent resin material. The first chip is a blue LED chip, and the second chip is a red LED chip. The depth of the groove is smaller than the height of the LED chip. The fluorescent layer wraps the top and side surfaces of the resin block.

Finally, it should be noted that obviously, the above-mentioned embodiments are only examples for clearly illustrating the present invention, rather than limiting the implementation. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. However, obvious changes or modifications derived therefrom are still within the protection scope of the present invention.

Claims (10)

1. A method for manufacturing a chip-scale LED packaging structure of two chips, comprising: (1) forming a transparent resin curing plate by molding, the curing plate has a first surface and a second surface opposite, and a plurality of grooves are formed on the first surface; (2) snapping a plurality of flip-chip LED chips into the grooves respectively; wherein, the LED chips include a first LED chip emitting light at a first wavelength and a second LED chip emitting light at a second wavelength, And the LED chips of two different colors are arranged alternately; (3) forming a first resin layer on the first surface, the first resin layer completely sealing the LED chip; (4) A plurality of slits are formed at the position of the first resin layer between the LED chips, and the slits divide the first resin layer into a plurality of resin blocks, and the resin blocks respectively seal a single LED chip; (5) forming a fluorescent layer on the resin block and in the slit, the fluorescent layer comprising a first layer capable of absorbing emitted light of the first wavelength and a second layer capable of absorbing emitted light of the second wavelength; (6) Forming a second resin layer on the fluorescent layer, the resin layer covering the fluorescent layer. 2. The manufacturing method of the chip-scale LED packaging structure of two chips according to claim 1, characterized in that: in step (1), there are a plurality of copper pillars in the curing plate, the upper end of the copper pillar and the A solder layer is provided at the lower end, the solder layer at the upper end is flush with the bottom wall of the groove and exposed from the groove while the solder layer at the lower end is not exposed from the second surface. 3 . The method for manufacturing a two-chip chip-scale LED packaging structure according to claim 2 , characterized in that: in step (2), the solder layer passing through the upper end is soldered to the copper pillar. 4 . 4. The method for manufacturing a two-chip chip-scale LED packaging structure according to claim 2, characterized in that: after the step (6), further comprising: thinning the second surface so that the lower end of the copper column The solder layer is exposed from the second surface; and the solder layer at the lower end is reflowed to form solder balls. 5 . The method for manufacturing a two-chip chip-scale LED packaging structure according to claim 2 , wherein the fluorescent layer is formed on the resin block and in the slit by a compression molding process. 6 . 6. A two-chip chip-scale LED packaging structure, comprising: a transparent resin curing plate on which a plurality of grooves are formed, the curing plate has a first surface opposite to a second surface, and a plurality of grooves are formed on the first surface; A plurality of flip-chip LED chips are respectively stuck in the groove; wherein, the LED chips include a first chip emitting light at a first wavelength and a second chip emitting light at a second wavelength, and the two types are different LED chips of different colors are arranged alternately; The first resin layer, the first resin layer completely seals the LED chips, and a plurality of slits are formed at the positions of the first resin layer between the LED chips, and the slits connect the first resin The layer is divided into a plurality of resin blocks, each of which encapsulates a single LED chip; a fluorescent layer formed on the resin block and in the slit, the fluorescent layer includes a first layer capable of absorbing emitted light at the first wavelength and a second layer capable of absorbing emitted light at the second wavelength; The second resin layer is formed and covered on the fluorescent layer. 7. The two-chip chip-scale LED packaging structure according to claim 6, wherein the curing plate, the first resin layer and the second resin layer are made of the same transparent resin material. 8. The two-chip chip-level LED packaging structure according to claim 7, wherein the first chip is a blue LED chip, and the second chip is a red LED chip. 9. The double-chip chip-scale LED packaging structure according to claim 7, wherein the depth of the groove is smaller than the height of the LED chip. 10. The two-chip chip-level LED packaging structure according to claim 7, further comprising solder balls, a plurality of copper pillars are provided in the curing board, and the solder balls are formed at the lower ends of the copper pillars .