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CN108594106A - System level chip assessment device and method - Google Patents

System level chip assessment device and method Download PDF

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Publication number
CN108594106A
CN108594106A CN201810326534.1A CN201810326534A CN108594106A CN 108594106 A CN108594106 A CN 108594106A CN 201810326534 A CN201810326534 A CN 201810326534A CN 108594106 A CN108594106 A CN 108594106A
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chip
level
soc
test
tested
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王小强
罗军
唐锐
李军求
孙宇
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China Electronic Product Reliability and Environmental Testing Research Institute
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China Electronic Product Reliability and Environmental Testing Research Institute
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2834Automated test systems [ATE]; using microprocessors or computers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889Interfaces, e.g. between probe and tester

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

本发明涉及一种系统级芯片测评装置和方法。包括ATE测试板、SoC系统验证板和控制器,控制器控制ATE测试板获取待测系统级芯片的参数级数据,控制SoC系统验证板获取待测系统级芯片的应用级数据,根据待测系统级芯片的参数级数据和应用级数据,得到待测系统芯片的测评结果。不仅可以实现对待测系统级芯片的参数级测试,也可以实现对待测系统级芯片的应用级测试,能够更加全面系统地对SoC芯片进行性能测试,从而得到更全面的测评结果,这样可降低SoC芯片测试对自动化测试设备的依赖度,也可大幅降低由于自动化测试设备硬件升级带来的巨大成本。

The invention relates to a system-level chip evaluation device and method. Including ATE test board, SoC system verification board and controller. The controller controls the ATE test board to obtain the parameter-level data of the system-level chip to be tested, and controls the SoC system verification board to obtain the application-level data of the system-level chip to be tested. The parameter-level data and application-level data of the level chip are used to obtain the evaluation results of the system chip under test. It can not only realize the parameter-level test of the system-level chip to be tested, but also realize the application-level test of the system-level chip to be tested. It can perform performance tests on the SoC chip more comprehensively and systematically, so as to obtain more comprehensive evaluation results, which can reduce SoC. The dependence of chip testing on automated testing equipment can also greatly reduce the huge cost caused by hardware upgrades of automated testing equipment.

Description

系统级芯片测评装置和方法System-level chip evaluation device and method

技术领域technical field

本发明涉及芯片测试技术领域,特别是涉及一种系统级芯片测评装置和方法。The invention relates to the technical field of chip testing, in particular to a system-level chip evaluation device and method.

背景技术Background technique

随着集成电路的快速发展,SoC(System on Chip,片上系统/系统级芯片)芯片应用日益广泛,特别是在电子消费产品的高性能、低功耗和小型化应用领域。SoC技术通过IP(Intellectual Property,知识产权)核复用,将数字、模拟、射频及相应接口等模块进行集成,充分利用了已有的设计积累,并在降低功耗、减少面积、增加系统功能、提高速度、节省成本等方面具有明显优势。With the rapid development of integrated circuits, SoC (System on Chip, system-on-chip/system-on-chip) chips are increasingly widely used, especially in the fields of high performance, low power consumption and miniaturization of electronic consumer products. SoC technology integrates digital, analog, radio frequency and corresponding interface modules through IP (Intellectual Property, intellectual property) core multiplexing, making full use of existing design accumulation, and reducing power consumption, reducing area, and increasing system functions It has obvious advantages in terms of improving speed and saving costs.

在SoC芯片制造过程中,任何一个微小的工艺误差和变动都会导致芯片有缺陷,使得芯片无法正常工作。而芯片的测试结果也可以反应芯片设计过程中是否有设计缺陷和没有考虑到的边界问题。因此,需要对生产出来的SoC芯片进行测试。In the manufacturing process of SoC chips, any slight process error and change will cause defects in the chip, making the chip unable to work normally. The test results of the chip can also reflect whether there are design defects and boundary problems that have not been considered in the chip design process. Therefore, it is necessary to test the produced SoC chips.

SoC芯片由数百万个乃至上亿个元器件组成,具有高达数百MHz甚至上GHz的系统时钟频率,芯片要实现的功能繁多,各模块内和模块间有着错综复杂的时序关系,大多采用深亚微米工艺加工技术,SoC芯片的这些特点给其测试工作带来了挑战。传统的SoC芯片测试受限于硬件条件,对其开展的芯片测试存在测试片面的问题,不能很好地实现对SoC芯片的芯片测试。The SoC chip is composed of millions or even hundreds of millions of components, with a system clock frequency as high as hundreds of MHz or even GHz. The chip needs to realize a variety of functions, and there are intricate timing relationships within and between modules. Most of them use deep Sub-micron process technology, these characteristics of SoC chips have brought challenges to its testing work. Traditional SoC chip testing is limited by hardware conditions, and the chip testing carried out on it has the problem of one-sided testing, which cannot well realize the chip testing of SoC chips.

发明内容Contents of the invention

基于此,有必要针对上述问题,提供一种能够对SoC芯片进行完整测试的系统级芯片测评装置和方法。Based on this, it is necessary to provide a system-level chip evaluation device and method capable of performing a complete test on the SoC chip to address the above problems.

一种系统级芯片测评装置,包括ATE测试板、SoC系统验证板和控制器,ATE测试板和SoC系统验证板分别与控制器连接;A system-level chip evaluation device includes an ATE test board, a SoC system verification board and a controller, and the ATE test board and the SoC system verification board are respectively connected to the controller;

控制器控制ATE测试板获取待测系统级芯片的参数级数据,控制SoC系统验证板获取待测系统级芯片的应用级数据,根据待测系统级芯片的参数级数据和应用级数据,得到待测系统芯片的测评结果。The controller controls the ATE test board to obtain the parameter-level data of the system-level chip to be tested, controls the SoC system verification board to obtain the application-level data of the system-level chip to be tested, and obtains the parameter-level data and application-level data of the system-level chip to be tested. The evaluation results of the SoC.

上述系统级芯片测评装置,包括ATE测试板、SoC系统验证板和控制器,控制器控制ATE测试板获取待测系统级芯片的参数级数据,控制SoC系统验证板获取待测系统级芯片的应用级数据,ATE测试板获取待测系统级芯片的参数级数据,SoC系统验证板获取待测系统级芯片的应用级数据,控制器根据待测系统级芯片的参数级数据和应用级数据,得到待测系统芯片的测评结果。该系统级芯片测评装置从待测系统级芯片的参数级数据和应用级数据两个方面对待测系统级芯片进行测评,不仅可以实现对待测系统级芯片的参数级测试,也可以实现对待测系统级芯片的应用级测试,能够更加全面系统地对SoC芯片进行性能测试,从而得到更全面的测评结果,而且这样可降低SoC芯片测试对自动化测试设备的依赖度,也可大幅降低由于自动化测试设备硬件升级带来的巨大成本。The above-mentioned system-level chip evaluation device includes an ATE test board, a SoC system verification board and a controller. The controller controls the ATE test board to obtain the parameter-level data of the system-level chip to be tested, and controls the SoC system verification board to obtain the application of the system-level chip to be tested. The ATE test board obtains the parameter-level data of the system-level chip to be tested, the SoC system verification board obtains the application-level data of the system-level chip to be tested, and the controller obtains the parameter-level data and application-level data of the system-level chip to be tested. Evaluation results of the SoC under test. The system-level chip evaluation device evaluates the system-level chip to be tested from two aspects: parameter-level data and application-level data of the system-level chip to be tested. It can not only realize the parameter-level test of the system-level chip to be tested, but also realize the The application-level testing of level chips can perform performance tests on SoC chips more comprehensively and systematically, so as to obtain more comprehensive evaluation results, and this can reduce the dependence of SoC chip testing on automated testing equipment, and can also greatly reduce the impact of automated testing equipment. Huge costs associated with hardware upgrades.

在一个实施例中,系统级芯片测评装置还包括开发板,开发板与SoC系统验证板连接。In one embodiment, the SoC evaluation device further includes a development board connected to the SoC system verification board.

在一个实施例中,系统级芯片测评装置还包括信号发生器,信号发生器与SoC系统验证板连接。In one embodiment, the SoC evaluation device further includes a signal generator connected to the SoC system verification board.

在一个实施例中,系统级芯片测评装置还包括示波器,示波器与SoC系统验证板连接。In one embodiment, the SoC evaluation device further includes an oscilloscope connected to the SoC system verification board.

在一个实施例中,系统级芯片测评装置还包括上位机,上位机与SoC系统验证板连接。In one embodiment, the SoC evaluation device further includes a host computer connected to the SoC system verification board.

在一个实施例中,系统级芯片测评装置中的SoC系统验证板包括外设接口和处理器,外设接口与处理器连接,处理器与待测系统级芯片连接。In one embodiment, the SoC system verification board in the system-on-a-chip evaluation device includes a peripheral interface and a processor, the peripheral interface is connected to the processor, and the processor is connected to the system-on-chip to be tested.

在一个实施例中,系统级芯片测评装置中的SoC系统验证板还包括SoC测试插座,待测系统级芯片通过SoC测试插座与处理器连接。In one embodiment, the SoC system verification board in the system-on-a-chip evaluation device further includes a SoC test socket, and the system-on-chip to be tested is connected to the processor through the SoC test socket.

在一个实施例中,系统级芯片测评装置中的SoC系统验证板还包括存储器接口,存储器接口与处理器连接。In one embodiment, the SoC system verification board in the system-on-chip evaluation device further includes a memory interface, and the memory interface is connected to the processor.

一种如上述任意一项所述的系统级芯片测评装置的系统级芯片测评方法,包括:A system-level chip evaluation method of the system-on-chip evaluation device described in any one of the above, comprising:

对待测系统级芯片通过ATE测试板进行ATE测试,得到待测系统级芯片的参数级数据;The system-level chip to be tested is tested through the ATE test board to obtain the parameter-level data of the system-level chip to be tested;

当待测系统级芯片的ATE测试合格时,对待测系统级芯片通过SoC系统验证板进行板级测试,得到待测系统级芯片的应用级数据;When the ATE test of the system-level chip to be tested is qualified, the system-level chip to be tested is subjected to a board-level test through the SoC system verification board, and the application-level data of the system-level chip to be tested is obtained;

根据待测系统级芯片的参数级数据以及待测系统级芯片的应用级数据,得到待测系统级芯片的测评结果。According to the parameter-level data of the system-level chip to be tested and the application-level data of the system-level chip to be tested, an evaluation result of the system-level chip to be tested is obtained.

在一个实施例中,系统级芯片测评方法中,对待测系统级芯片通过ATE测试板进行ATE测试,得到待测系统级芯片的参数级数据之后还包括:In one embodiment, in the system-level chip evaluation method, the system-level chip to be tested is subjected to an ATE test through an ATE test board, and after obtaining the parameter-level data of the system-level chip to be tested, it also includes:

当待测系统级芯片的ATE测试不合格时,对ATE测试不合格的待测系统级芯片进行失效分析。When the ATE test of the system-on-chip to be tested is unqualified, a failure analysis is performed on the unqualified system-on-chip under the ATE test.

上述系统级芯片测评方法,包括对待测系统级芯片通过ATE测试板进行ATE测试,得到待测系统级芯片的参数级数据;当待测系统级芯片的ATE测试合格时,对待测系统级芯片通过SoC系统验证板进行板级测试,得到待测系统级芯片的应用级数据;根据待测系统级芯片的参数级数据以及待测系统级芯片的应用级数据,得到待测系统级芯片的测评结果。该系统级芯片测评方法从待测系统级芯片的参数级数据以及应用级数据两个方面对待测系统级芯片进行测评,不仅可以实现对待测系统级芯片的参数级测试,也可以实现对待测系统级芯片的应用级测试,能够更加全面系统地对SoC芯片进行性能测试,从而得到更全面的测评结果,而且这样可降低SoC芯片测试对自动化测试设备的依赖度,也可大幅降低由于自动化测试设备硬件升级带来的巨大成本。The above system-level chip evaluation method includes performing an ATE test on the system-level chip to be tested through an ATE test board to obtain parameter-level data of the system-level chip to be tested; when the system-level chip to be tested passes the ATE test, the system-level chip to be tested passes The SoC system verification board conducts board-level testing to obtain the application-level data of the system-level chip to be tested; according to the parameter-level data of the system-level chip to be tested and the application-level data of the system-level chip to be tested, the evaluation results of the system-level chip to be tested are obtained . The system-level chip evaluation method evaluates the system-level chip under test from two aspects: parameter-level data and application-level data of the system-level chip to be tested. The application-level testing of level chips can perform performance tests on SoC chips more comprehensively and systematically, so as to obtain more comprehensive evaluation results, and this can reduce the dependence of SoC chip testing on automated testing equipment, and can also greatly reduce the impact of automated testing equipment. Huge costs associated with hardware upgrades.

附图说明Description of drawings

图1为一个实施例中系统级芯片测评装置的结构框图;Fig. 1 is a structural block diagram of a system-level chip evaluation device in an embodiment;

图2为一个实施例中系统级芯片测试框架的示意图;Fig. 2 is a schematic diagram of a SoC testing framework in an embodiment;

图3为一个实施例中ATE测试设备的示意图;Fig. 3 is the schematic diagram of ATE test equipment in an embodiment;

图4为一个实施例中SoC系统验证板的系统架构图;Fig. 4 is a system architecture diagram of a SoC system verification board in an embodiment;

图5为一个实施例中SoC插座示意图;Fig. 5 is a schematic diagram of the SoC socket in one embodiment;

图6为一个实施例中系统级芯片测评方法的流程示意图;FIG. 6 is a schematic flowchart of a system-level chip evaluation method in an embodiment;

图7为一个实施例中SoC芯片综合性能测试评价流程图。Fig. 7 is a flow chart of SoC chip comprehensive performance test and evaluation in one embodiment.

具体实施方式Detailed ways

一种系统级芯片测评装置,如图1所示,包括ATE测试板100、SoC系统验证板200和控制器300,ATE测试板100和SoC系统验证板200分别与控制器300连接;控制器300控制ATE测试板100获取待测系统级芯片的参数级数据,控制SoC系统验证板200获取待测系统级芯片的应用级数据,根据待测系统级芯片的参数级数据和应用级数据,得到待测系统芯片的测评结果。A system level chip evaluation device, as shown in Figure 1, comprises ATE test board 100, SoC system verification board 200 and controller 300, and ATE test board 100 and SoC system verification board 200 are connected with controller 300 respectively; Controller 300 Control the ATE test board 100 to obtain the parameter-level data of the system-level chip to be tested, control the SoC system verification board 200 to obtain the application-level data of the system-level chip to be tested, and obtain the parameter-level data and application-level data of the system-level chip to be tested. The evaluation results of the SoC.

ATE测试板100用于获取待测系统级芯片的参数级数据。参数级数据是指对与SoC芯片接口特性相关的参数进行测试得到的数据,包括直流参数、交流参数等,在不同电压、电流、频率和负载条件下完成特定测试。芯片的电气测试可以通过ATE(Automatic TestEquipment,自动化测试设备)来实现,自动化测试设备可以通过对待测系统级芯片施加一定的激励或测试向量,使待测系统级芯片处于某种状态,以便测试待测系统级芯片的电气特性。The ATE test board 100 is used to acquire parameter-level data of the SoC under test. Parameter-level data refers to the data obtained by testing parameters related to SoC chip interface characteristics, including DC parameters, AC parameters, etc., and specific tests are completed under different voltage, current, frequency and load conditions. The electrical test of the chip can be realized by ATE (Automatic Test Equipment, automated test equipment). The automated test equipment can apply a certain stimulus or test vector to the system-level chip to be tested, so that the system-level chip to be tested is in a certain state, so that the test Measure the electrical characteristics of the system-on-a-chip.

自动化测试设备包括测试头,可以给测试头配置多个测试卡,每个测试卡会有测试探针,测试头可以连接ATE测试板,测试头对ATE测试板施加激励或测试向量时,在ATE测试板上的待测系统级芯片将得到相应的测试激励和向量。待测系统级芯片得到相应的测试激励和向量,将输出一些响应给ATE测试板。The automated test equipment includes a test head, which can be configured with multiple test cards. Each test card has a test probe. The test head can be connected to the ATE test board. When the test head applies stimulus or test vector to the ATE test board, the ATE The SoC under test on the test board will get the corresponding test stimulus and vector. The SoC under test gets the corresponding test stimulus and vector, and will output some responses to the ATE test board.

SoC系统验证板200用于获取待测系统级芯片的应用级数据。应用级数据是指将SoC芯片放在真实的工作环境下对其进行功能级测试得到的数据,待测SoC芯片执行相应的测试程序,测试程序中包含了待测SoC芯片需要被测试的各功能级。比如可以针对操作性能、高速通信接口协议、系统级平均功耗、最高工作频率等应用级测试项目,建立测试程序用例库,在SoC系统验证板上,待测SoC芯片正常启动后,分别加载测试程序用例库中的应用程序,通过程序运行时待测SoC芯片的输出信号和指示信号,实现待测SoC芯片的应用级数据测试。The SoC system verification board 200 is used to obtain application-level data of the SoC under test. Application-level data refers to the data obtained by placing the SoC chip in a real working environment for functional-level testing. The SoC chip to be tested executes the corresponding test program. The test program includes the functions that the SoC chip to be tested needs to be tested. class. For example, a test program use case library can be established for application-level test items such as operating performance, high-speed communication interface protocol, system-level average power consumption, and maximum operating frequency. On the SoC system verification board, after the SoC chip to be tested starts normally, load the test The application program in the program use case library realizes the application-level data test of the SoC chip to be tested through the output signal and indicator signal of the SoC chip to be tested when the program is running.

控制器300用于控制ATE测试板获取待测系统级芯片的参数级数据,控制SoC系统验证板获取待测系统级芯片的应用级数据,根据待测系统级芯片的参数级数据和应用级数据,得到待测系统芯片的测评结果。控制器300接收ATE测试板获取到的待测系统级芯片的参数级数据以及SoC系统验证板获取到的待测系统级芯片的应用级数据,将获取到的待测系统级芯片的参数级数据与预设的参数标准进行比对,从而判断待测系统级芯片是良好的芯片或是有缺陷的芯片,达到筛选出不合格芯片的目的。将获取到的待测系统级芯片的待测系统级芯片的应用级数据与对应的预设值进行比对,进一步判断待测系统级芯片的性能。The controller 300 is used to control the ATE test board to obtain the parameter-level data of the system-level chip to be tested, and control the SoC system verification board to obtain the application-level data of the system-level chip to be tested. , to obtain the evaluation result of the system chip under test. The controller 300 receives the parameter-level data of the system-level chip under test acquired by the ATE test board and the application-level data of the system-level chip under test acquired by the SoC system verification board, and converts the acquired parameter-level data of the system-level chip under test into Compared with the preset parameter standards, it can be judged whether the system-level chip to be tested is a good chip or a defective chip, so as to achieve the purpose of screening out unqualified chips. Comparing the obtained application-level data of the SoC under test with the corresponding preset value, and further judging the performance of the SoC under test.

上述系统级芯片测评装置,包括ATE测试板、SoC系统验证板和控制器,控制器控制ATE测试板获取待测系统级芯片的参数级数据,控制SoC系统验证板获取待测系统级芯片的应用级数据,ATE测试板获取待测系统级芯片的参数级数据,SoC系统验证板获取待测系统级芯片的应用级数据,控制器根据待测系统级芯片的参数级数据和应用级数据,得到待测系统芯片的测评结果。该系统级芯片测评装置从待测系统级芯片的参数级数据和应用级数据两个方面对待测系统级芯片进行测评,不仅可以实现对待测系统级芯片的参数级测试,也可以实现对待测系统级芯片的应用级测试,能够更加全面系统地对SoC芯片进行性能测试,从而得到更全面的测评结果,而且这样可降低SoC芯片测试对自动化测试设备的依赖度,也可大幅降低由于自动化测试设备硬件升级带来的巨大成本。The above-mentioned system-level chip evaluation device includes an ATE test board, a SoC system verification board and a controller. The controller controls the ATE test board to obtain the parameter-level data of the system-level chip to be tested, and controls the SoC system verification board to obtain the application of the system-level chip to be tested. The ATE test board obtains the parameter-level data of the system-level chip to be tested, the SoC system verification board obtains the application-level data of the system-level chip to be tested, and the controller obtains the parameter-level data and application-level data of the system-level chip to be tested. Evaluation results of the SoC under test. The system-level chip evaluation device evaluates the system-level chip to be tested from two aspects: parameter-level data and application-level data of the system-level chip to be tested. It can not only realize the parameter-level test of the system-level chip to be tested, but also realize the The application-level testing of level chips can perform performance tests on SoC chips more comprehensively and systematically, so as to obtain more comprehensive evaluation results, and this can reduce the dependence of SoC chip testing on automated testing equipment, and can also greatly reduce the impact of automated testing equipment. Huge costs associated with hardware upgrades.

在一个实施例中,控制器还用于控制SoC系统验证板获取极限测试数据,根据待测系统级芯片的参数级数据、待测系统级芯片的应用级数据以及待测系统级芯片的极限测试数据,得到待测系统级芯片的测评结果。对待测系统级芯片进行极限参数测试,得到待测系统级芯片的极限测试数据,极限参数指的是各测量参数的极限值,比如最高频率、最高电压等。In one embodiment, the controller is also used to control the SoC system verification board to obtain limit test data, according to the parameter level data of the system level chip under test, the application level data of the system level chip under test and the limit test of the system level chip under test data to obtain the evaluation results of the SoC under test. The limit parameter test of the system-level chip to be tested is performed to obtain the limit test data of the system-level chip to be tested. The limit parameter refers to the limit value of each measurement parameter, such as the highest frequency and the highest voltage.

在一个实施例中,系统级芯片测评装置还包括开发板,开发板与SoC系统验证板连接。开发板可提供SoC系统验证板的输入信号或采集SoC系统验证板的输出信号,开发板是用来进行嵌入式系统开发的电路板,包括中央处理器、存储器、输入设备、输出设备、数据通路/总线和外部资源接口等一系列硬件组件。一般而言,在嵌入式系统开发过程中,硬件被分成两个平台,一个是开发平台,一个是目标平台即开发板。开发平台指的是使用计算机,通过传输的界面,例如串口、USB(Universal Serial Bus,通用串行总线)、并口、或者网络与目标平台连接。具体地,开发板可以是FPGA开发板,FPGA(Field ProgrammableGateArray,现场可编程门阵列)作为专用集成电路领域中的一种半定制电路既解决了定制电路的不足,又克服了原有可编程器件门电路数有限的缺点。In one embodiment, the SoC evaluation device further includes a development board connected to the SoC system verification board. The development board can provide the input signal of the SoC system verification board or collect the output signal of the SoC system verification board. The development board is a circuit board used for embedded system development, including a central processing unit, a memory, an input device, an output device, and a data path. A series of hardware components such as / bus and external resource interface. Generally speaking, in the embedded system development process, the hardware is divided into two platforms, one is the development platform, and the other is the target platform, that is, the development board. The development platform refers to using a computer to connect to a target platform through a transmission interface, such as a serial port, USB (Universal Serial Bus, universal serial bus), parallel port, or a network. Specifically, the development board can be an FPGA development board, and FPGA (Field Programmable Gate Array, Field Programmable Gate Array), as a semi-custom circuit in the field of application-specific integrated circuits, not only solves the shortcomings of custom circuits, but also overcomes the limitations of original programmable devices. The disadvantage of the limited number of gate circuits.

在一个实施例中,系统级芯片测评装置还包括信号发生器,信号发生器与SoC系统验证板连接。信号发生器用于产生被测电路所需特定参数的电测试信号。在测试待测SoC芯片时,为测定待测SoC芯片的一些电参量,如测量频率响应、噪声系数等,提供符合所定技术条件的电信号,以模拟在实际工作中使用的待测SoC芯片的激励信号。信号源可以根据输出波形的不同,划分为正弦波信号发生器、矩形脉冲信号发生器、函数信号发生器和随机信号发生器等四大类。信号发生器的作用是信号调制功能,信号调制是指被调制信号中,幅度、相位或频率变化把低频信息嵌入到高频的载波信号中,得到的信号可以传送从语音、到数据、到视频的任何信号。In one embodiment, the SoC evaluation device further includes a signal generator connected to the SoC system verification board. The signal generator is used to generate electrical test signals of specific parameters required by the circuit under test. When testing the SoC chip to be tested, in order to measure some electrical parameters of the SoC chip to be tested, such as measuring frequency response, noise figure, etc., provide electrical signals that meet the specified technical conditions to simulate the SoC chip to be tested in actual work. motivating signal. Signal sources can be divided into four categories according to different output waveforms: sine wave signal generator, rectangular pulse signal generator, function signal generator and random signal generator. The function of the signal generator is the signal modulation function. Signal modulation refers to the amplitude, phase or frequency change of the modulated signal, which embeds low-frequency information into the high-frequency carrier signal. The obtained signal can be transmitted from voice, to data, to video. any signal.

在一个实施例中,系统级芯片测评装置还包括示波器,示波器与SoC系统验证板连接。示波器是一种电子测量仪器,能把电信号变换成图像,便于研究各种电现象的变化过程。示波器利用狭窄的、由高速电子组成的电子束,打在涂有荧光物质的屏面上,就可产生细小的光点。在被测信号的作用下,电子束就好像一支笔的笔尖,可以在屏面上描绘出被测信号的瞬时值的变化曲线。利用示波器能观察各种不同信号幅度随时间变化的波形曲线,还可以测试各种不同的电量,如电压、电流、频率、相位差、调幅度等。可以通过示波器观察待测SoC芯片的输出信号,对其性能进行判断。In one embodiment, the SoC evaluation device further includes an oscilloscope connected to the SoC system verification board. An oscilloscope is an electronic measuring instrument that can convert electrical signals into images, which is convenient for studying the changing process of various electrical phenomena. The oscilloscope uses a narrow electron beam composed of high-speed electrons to hit a screen coated with fluorescent substances to produce tiny light spots. Under the action of the signal under test, the electron beam is like the tip of a pen, which can draw the change curve of the instantaneous value of the signal under test on the screen. The oscilloscope can be used to observe the waveform curves of various signal amplitudes changing with time, and can also test various electric quantities, such as voltage, current, frequency, phase difference, amplitude modulation, etc. The output signal of the SoC chip to be tested can be observed through an oscilloscope to judge its performance.

在一个实施例中,系统级芯片测评装置还包括上位机,上位机与SoC系统验证板连接。上位机负责串口及其它网络端口数据的通信,通过串口线或其它端口与SoC系统验证板连接,具体可以是PC(Personal Computer,个人计算机)机。In one embodiment, the SoC evaluation device further includes a host computer connected to the SoC system verification board. The upper computer is responsible for data communication of the serial port and other network ports, and is connected to the SoC system verification board through a serial port cable or other ports, specifically, it may be a PC (Personal Computer, personal computer).

在一个实施例中,系统级芯片测评装置中的SoC系统验证板包括外设接口和处理器,外设接口与处理器连接,处理器与待测系统级芯片连接。外设接口用于连接外部设备,外设接口与处理器连接,处理器可以读取外部设备的信息。In one embodiment, the SoC system verification board in the system-on-a-chip evaluation device includes a peripheral interface and a processor, the peripheral interface is connected to the processor, and the processor is connected to the system-on-chip to be tested. The peripheral interface is used to connect external devices, the peripheral interface is connected with the processor, and the processor can read information of the external device.

在一个实施例中,系统级芯片测评装置中的SoC系统验证板还包括SoC测试插座,待测系统级芯片通过SoC测试插座与处理器连接。通过SoC测试插座可实现SoC芯片和SoC系统验证板的电学连接,以实现SoC芯片样品的更换。In one embodiment, the SoC system verification board in the system-on-a-chip evaluation device further includes a SoC test socket, and the system-on-chip to be tested is connected to the processor through the SoC test socket. The electrical connection between the SoC chip and the SoC system verification board can be realized through the SoC test socket, so as to realize the replacement of the SoC chip sample.

在一个实施例中,系统级芯片测评装置中的SoC系统验证板还包括存储器接口,存储器接口与处理器连接。根据SoC芯片的基本性能要求,SoC系统验证板包括处理器、存储器接口、外设接口、状态指示、电源管理、电源开关等模块,具备开发环境及软件支持度的测试能力。In one embodiment, the SoC system verification board in the system-on-chip evaluation device further includes a memory interface, and the memory interface is connected to the processor. According to the basic performance requirements of the SoC chip, the SoC system verification board includes modules such as processor, memory interface, peripheral interface, status indication, power management, power switch, etc., and has the ability to test the development environment and software support.

在一个实施例中,一种系统级芯片测评装置,包括ATE测试和板级测试两个部分,分别开展基本功能、结构测试、接口特性相关参数级测试和操作性能、高速通信接口协议、测试程序用例验证、系统级平均功耗、最高工作频率等应用级测试,其测试框架如图2所示。In one embodiment, a system-level chip evaluation device includes two parts: ATE test and board-level test, which respectively carry out basic function, structural test, interface characteristic-related parameter level test and operational performance, high-speed communication interface protocol, and test program Application-level tests such as use case verification, system-level average power consumption, and maximum operating frequency are shown in Figure 2.

ATE测试基于PER-PIN架构可以完成SoC芯片接口特性相关参数级测试,包括直流、交流等参数。ATE参数测试包括:1、明确参数定义,制定测试方案;2、设计测试板,确保测试板能实现该类参数测试(如某些参数需加入特殊接口);3、制作针对该类参数测试的测试向量;4、向量转换;5、上机台调试向量,编写测试代码进行参数测试。在ATE测试中,可以通过软交化编程界面灵活地实现不同电压、电流、频率、负载条件特定或多种组合测试,同时测试精度高,可以实现nA、ns、uV等级微观测量,SoC芯片的接口特性部分参数列举如表1所示。The ATE test is based on the PER-PIN architecture and can complete the SoC chip interface characteristic-related parameter level test, including DC, AC and other parameters. ATE parameter testing includes: 1. Clear parameter definition and formulate test plan; 2. Design test board to ensure that the test board can realize this type of parameter test (for example, some parameters need to be added to special interface); 3. Make test for this type of parameter Test vectors; 4. Vector conversion; 5. Debug vectors on the machine, write test codes for parameter testing. In the ATE test, different voltage, current, frequency, load condition specific or multiple combination tests can be flexibly realized through the soft interactive programming interface, and the test accuracy is high, and microscopic measurements of nA, ns, uV levels can be realized. SoC chip Some parameters of the interface characteristics are listed in Table 1.

表1 SoC芯片的接口特性部分参数Table 1 Some parameters of the interface characteristics of the SoC chip

SoC芯片的ATE测试设备如图3所示,图中左边是整体图,整体图中柜子里面主要放置电源、数据线,整体图中倾斜的方形部件是测试头,上面放置测试板,右图是测试板的近距离图片,上面有固定SoC芯片在测试板上的插座。The ATE test equipment for SoC chips is shown in Figure 3. The left side of the figure is the overall picture. In the overall picture, the power supply and data lines are mainly placed in the cabinet. The inclined square part in the overall picture is the test head, and the test board is placed on it. The right picture is A close-up picture of the test board with the sockets that hold the SoC chip on the test board.

SoC系统验证板的系统架构如图4所示,上位机为PC机,负责串口及其它网络端口数据的通信,PC机通过串口线或其它端口与SoC系统验证板连接;信号发生器、示波器、FPGA开发板以及直流供电电源分别与SoC系统验证板连接,提供SoC系统验证板的输入信号或采集检测其输出信号。针对操作性能、高速通信接口协议、测试程序用例验证、系统级平均功耗、最高工作频率等应用级测试项目,建立测试程序用例库,部分测试程序用例库如表2所示。The system architecture of the SoC system verification board is shown in Figure 4. The upper computer is a PC, which is responsible for the data communication of the serial port and other network ports. The PC is connected to the SoC system verification board through a serial port line or other ports; The FPGA development board and the DC power supply are respectively connected to the SoC system verification board to provide the input signal of the SoC system verification board or collect and detect its output signal. For application-level test items such as operational performance, high-speed communication interface protocol, test program use case verification, system-level average power consumption, and maximum operating frequency, a test program use case library is established. Some test program use case libraries are shown in Table 2.

表2测试程序用例库Table 2 Test program use case library

在SoC系统验证板上,芯片正常启动后分别加载测试程序用例库中的应用程序,通过程序运行时芯片的输出信号和指示信号进行判断,开展芯片的应用级测试验证。On the SoC system verification board, after the chip starts normally, the application programs in the test program use case library are loaded respectively, and the chip's output signal and indicator signal are judged when the program is running, and the application-level test verification of the chip is carried out.

系统级芯片测评装置中的测试板分为ATE测试板和SoC系统验证板两种类型。在ATE机台上对具有高速接口的SoC芯片进行测试时,信号通路上有很多因素会影响信号的质量,甚至会导致测试结果失效。ATE测试板的设计主要原则包括高速信号传输需要基于信号完整性开展设计仿真工作和布局布线需要根据具体型号的ATE。根据SoC芯片的基本性能要求,SoC系统验证板的板上包括SoC待测芯片、处理器、外部存储器接口、外设接口、状态指示、电源管理、电源开关等模块,具备开发环境及软件支持度的测试能力,外设接口可以是UART(Universal Asynchronous Receiver/Transmitter,通用异步收发传输器)、SPI(Serial Peripheral Interface,串行外设接口)、GPIO(General Purpose Input Output,通用输入/输出)、I2C(Inter-Integrated Circuit)、PWM(Pulse Width Modulation,脉冲宽度调制)、CAN(Controller Area Network,控制器局域网络)、TIMER(定时器)、WATCHDOG(看门狗)等接口。SoC系统验证板上需要采用专用测试插座实现芯片和SoC系统验证板的电学连接,以实现SoC样品的更换,SoC测试插座如图5所示。The test boards in the SoC evaluation device are divided into two types: ATE test boards and SoC system verification boards. When testing a SoC chip with a high-speed interface on an ATE machine, many factors in the signal path will affect the quality of the signal, and even cause the test result to be invalid. The main principles of ATE test board design include that high-speed signal transmission needs to be based on signal integrity to carry out design simulation work and layout and wiring needs to be based on specific models of ATE. According to the basic performance requirements of the SoC chip, the board of the SoC system verification board includes the SoC chip under test, processor, external memory interface, peripheral interface, status indication, power management, power switch and other modules, with development environment and software support The test capability, the peripheral interface can be UART (Universal Asynchronous Receiver/Transmitter, Universal Asynchronous Receiver Transmitter), SPI (Serial Peripheral Interface, Serial Peripheral Interface), GPIO (General Purpose Input Output, general purpose input/output), I2C (Inter-Integrated Circuit), PWM (Pulse Width Modulation, pulse width modulation), CAN (Controller Area Network, controller area network), TIMER (timer), WATCHDOG (watchdog) and other interfaces. The SoC system verification board needs to use a special test socket to realize the electrical connection between the chip and the SoC system verification board, so as to realize the replacement of the SoC sample. The SoC test socket is shown in Figure 5.

在一个实施例中,如图6所示,一种如上述任意一项所述的系统级芯片测评装置的系统级芯片测评方法,包括:In one embodiment, as shown in FIG. 6, a system-on-chip evaluation method of the system-on-chip evaluation device described in any one of the above, including:

步骤602,对待测系统级芯片通过ATE测试板进行ATE测试,得到待测系统级芯片的参数级数据。Step 602 , performing ATE test on the SoC under test through the ATE test board to obtain parameter level data of the SoC under test.

ATE测试板用于获取待测系统级芯片的参数级数据。参数级数据是指对与SoC芯片接口特性相关的参数进行测试得到的数据,包括直流参数、交流参数等,在不同电压、电流、频率和负载条件下完成特定测试。芯片的电气测试可以通过ATE(Automatic TestEquipment,自动化测试设备)来实现,自动化测试设备可以通过对待测系统级芯片施加一定的激励或测试向量,使待测系统级芯片处于某种状态,以便测试待测系统级芯片的电气特性。The ATE test board is used to obtain parameter-level data of the SoC under test. Parameter-level data refers to the data obtained by testing parameters related to SoC chip interface characteristics, including DC parameters, AC parameters, etc., and specific tests are completed under different voltage, current, frequency and load conditions. The electrical test of the chip can be realized by ATE (Automatic Test Equipment, automated test equipment). The automated test equipment can apply a certain stimulus or test vector to the system-level chip to be tested, so that the system-level chip to be tested is in a certain state, so that the test Measure the electrical characteristics of the system-on-a-chip.

具体地,ATE测试需要经过三个不同温度的测试,依次是室温、高温和低温。芯片的规格中,会定义芯片的最高温度和最低温度,这是芯片测试中需要检测的两个极限温度。此外,由于芯片大多的工作状态是在室温下进行,通过室温测试可以使得芯片测试更加全面。有些测试,芯片最差的情况是出现在低温的,而另外一些芯片的最差情况可能是出现在高温的,通过高温测试可以筛选高温下失效的芯片。Specifically, the ATE test needs to be tested at three different temperatures, which are room temperature, high temperature and low temperature in sequence. In the chip specification, the maximum temperature and the minimum temperature of the chip are defined, which are the two extreme temperatures that need to be detected in the chip test. In addition, since most chips work at room temperature, testing at room temperature can make chip testing more comprehensive. In some tests, the worst case of chips occurs at low temperature, while the worst case of other chips may appear at high temperature. Through high temperature testing, chips that fail at high temperatures can be screened.

步骤604,当待测系统级芯片的ATE测试合格时,对待测系统级芯片通过SoC系统验证板进行板级测试,得到待测系统级芯片的应用级数据。Step 604 , when the ATE test of the SoC under test is qualified, perform a board-level test on the SoC system verification board to obtain application-level data of the SoC under test.

将获取到的待测系统级芯片的参数级数据与预设标准进行比对,当获取的参数级数据处于预设标准范围内时,表示待测系统级芯片的ATE测试合格。当待测系统级芯片的ATE测试合格时,对待测系统级芯片通过SoC系统验证板进行板级测试,得到待测系统级芯片的应用级数据。应用级数据是指将SoC芯片放在真实的工作环境下对其进行功能级测试得到的数据,待测SoC芯片执行相应的测试程序,测试程序中包含了待测SoC芯片需要被测试的各功能级。比如可以针对操作性能、高速通信接口协议、系统级平均功耗、最高工作频率等应用级测试项目,建立测试程序用例库,在SoC系统验证板上,待测SoC芯片正常启动后,分别加载测试程序用例库中的应用程序,通过程序运行时待测SoC芯片的输出信号和指示信号,实现待测SoC芯片的应用级数据测试。The obtained parameter-level data of the system-level chip under test is compared with the preset standard, and when the obtained parameter-level data is within the range of the preset standard, it means that the ATE test of the system-level chip under test is qualified. When the ATE test of the system-level chip to be tested is qualified, the system-level chip to be tested is subjected to a board-level test through the SoC system verification board to obtain application-level data of the system-level chip to be tested. Application-level data refers to the data obtained by placing the SoC chip in a real working environment for functional-level testing. The SoC chip to be tested executes the corresponding test program. The test program includes the functions that the SoC chip to be tested needs to be tested. class. For example, a test program use case library can be established for application-level test items such as operating performance, high-speed communication interface protocol, system-level average power consumption, and maximum operating frequency. On the SoC system verification board, after the SoC chip to be tested starts normally, load the test The application program in the program use case library realizes the application-level data test of the SoC chip to be tested through the output signal and indicator signal of the SoC chip to be tested when the program is running.

步骤606,根据待测系统级芯片的参数级数据以及待测系统级芯片的应用级数据,得到待测系统级芯片的测评结果。Step 606: Obtain an evaluation result of the SoC under test according to the parameter level data of the SoC under test and the application level data of the SoC under test.

将待测系统级芯片的参数级数据与预设标准参数数据进行比对,得到待测系统级芯片的ATE测试结果。将待测系统级芯片的应用级数据与预设标准应用数据进行比对,得到待测系统级芯片的板级测试结果。根据待测系统级芯片的ATE测试结果和板级测试结果,进行分析整理,得到待测系统级芯片的测评结果。The parameter-level data of the SoC under test is compared with the preset standard parameter data to obtain the ATE test result of the SoC under test. The application-level data of the system-level chip to be tested is compared with the preset standard application data to obtain a board-level test result of the system-level chip to be tested. According to the ATE test results of the system-level chip to be tested and the board-level test results, analysis and sorting are carried out to obtain the evaluation results of the system-level chip to be tested.

上述系统级芯片测评方法,包括对待测系统级芯片通过ATE测试板进行ATE测试,得到待测系统级芯片的参数级数据;当待测系统级芯片的ATE测试合格时,对待测系统级芯片通过SoC系统验证板进行板级测试,得到待测系统级芯片的应用级数据;根据待测系统级芯片的参数级数据以及待测系统级芯片的应用级数据,得到待测系统级芯片的测评结果。该系统级芯片测评方法从待测系统级芯片的参数级数据以及应用级数据两个方面对待测系统级芯片进行测评,不仅可以实现对待测系统级芯片的参数级测试,也可以实现对待测系统级芯片的应用级测试,能够更加全面系统地对SoC芯片进行性能测试,从而得到更全面的测评结果,而且这样可降低SoC芯片测试对自动化测试设备的依赖度,也可大幅降低由于自动化测试设备硬件升级带来的巨大成本。The above system-level chip evaluation method includes performing an ATE test on the system-level chip to be tested through an ATE test board to obtain parameter-level data of the system-level chip to be tested; when the system-level chip to be tested passes the ATE test, the system-level chip to be tested passes The SoC system verification board conducts board-level testing to obtain the application-level data of the system-level chip to be tested; according to the parameter-level data of the system-level chip to be tested and the application-level data of the system-level chip to be tested, the evaluation results of the system-level chip to be tested are obtained . The system-level chip evaluation method evaluates the system-level chip under test from two aspects: parameter-level data and application-level data of the system-level chip to be tested. The application-level testing of level chips can perform performance tests on SoC chips more comprehensively and systematically, so as to obtain more comprehensive evaluation results, and this can reduce the dependence of SoC chip testing on automated testing equipment, and can also greatly reduce the impact of automated testing equipment. Huge costs associated with hardware upgrades.

在一个实施例中,系统级芯片测评方法中,对待测系统级芯片通过ATE测试板进行ATE测试,得到待测系统级芯片的参数级数据之后还包括:当待测系统级芯片的ATE测试不合格时,对ATE测试不合格的待测系统级芯片进行失效分析。对ATE测试不合格的待测系统级芯片进行失效分析,比如可以先将失效种类进行分类,比如可以按照模拟信号、音频信号、视频信号、外设接口等分类。In one embodiment, in the system-on-chip evaluation method, the system-on-chip to be tested is subjected to ATE testing through an ATE test board, and after obtaining the parameter-level data of the system-on-chip to be tested, it further includes: when the ATE test of the system-on-chip to be tested fails When qualified, failure analysis is performed on the SoCs under test that fail the ATE test. Perform failure analysis on the system-level chips under test that fail the ATE test. For example, you can first classify the failure types, such as analog signals, audio signals, video signals, and peripheral interfaces.

在一个实施例中,系统级芯片测评方法中,当待测系统级芯片的ATE测试合格时,对待测系统级芯片通过SoC系统验证板进行板级测试,得到待测系统级芯片的应用级数据之后还包括:当待测系统级芯片的板级测试合格时,对待测系统级芯片进行极限参数测试,得到待测系统级芯片的极限测试数据;根据待测系统级芯片的参数级数据以及待测系统级芯片的应用级数据,得到待测系统级芯片的测评结果,包括:根据待测系统级芯片的参数级数据、待测系统级芯片的应用级数据以及待测系统级芯片的极限测试数据,得到待测系统级芯片的测评结果。将获取到的待测系统级芯片的应用级数据与预设标准进行比对,当获取的应用级数据处于预设标准范围内时,表示待测系统级芯片的板级测试合格。当待测系统级芯片的板级测试合格时,对待测系统级芯片进行极限参数测试,得到待测系统级芯片的极限测试数据。极限参数指的是各测量参数的极限值,比如最高频率、最高电压等。In one embodiment, in the system-level chip evaluation method, when the ATE test of the system-level chip to be tested is qualified, the system-level chip to be tested is subjected to a board-level test through the SoC system verification board, and the application-level data of the system-level chip to be tested is obtained. Afterwards, it also includes: when the board-level test of the system-level chip to be tested is qualified, the limit parameter test is performed on the system-level chip to be tested to obtain the limit test data of the system-level chip to be tested; according to the parameter-level data of the system-level chip to be tested and the The application-level data of the system-level chip under test is obtained to obtain the evaluation results of the system-level chip under test, including: based on the parameter-level data of the system-level chip under test, the application-level data of the system-level chip under test, and the limit test of the system-level chip under test data to obtain the evaluation results of the SoC under test. The obtained application-level data of the system-level chip under test is compared with the preset standard, and when the obtained application-level data is within the range of the preset standard, it means that the board-level test of the system-level chip under test is qualified. When the board-level test of the system-level chip to be tested is qualified, the limit parameter test is performed on the system-level chip to be tested to obtain limit test data of the system-level chip to be tested. The limit parameter refers to the limit value of each measurement parameter, such as the highest frequency, the highest voltage and so on.

在一个实施例中,SoC芯片综合性能测试评价流程如图7所示,首先开展常温25℃条件下的ATE测试,完成产品参数指标性能优选测试。同时根据芯片产品等级要求,分别开展高低温测试,根据需要设定温度值。必要时针对ATE测试不合格的芯片进行失效分析。然后再开展SoC系统功能验证测试,先进行常温25℃条件下操作性能、高速通信接口协议、测试程序用例验证、系统级平均功耗等应用级测试,再根据芯片产品等级要求,分别开展高低温测试(根据需要设定温度值)。完成后再开展极限参数测试(如最高频率、最高电压等),根据需要开展温度条件下的测试。完成所有项目后,对数据进行整理。In one embodiment, the comprehensive performance test and evaluation process of the SoC chip is shown in FIG. 7 . Firstly, the ATE test is carried out at a normal temperature of 25° C., and the product parameter index performance optimization test is completed. At the same time, according to the requirements of the chip product grade, high and low temperature tests are carried out respectively, and the temperature value is set according to the need. If necessary, conduct failure analysis for chips that fail the ATE test. Then carry out the SoC system function verification test, first conduct application-level tests such as operating performance at room temperature at 25°C, high-speed communication interface protocol, test program use case verification, system-level average power consumption, and then conduct high and low temperature tests according to the requirements of the chip product level. Test (set the temperature value as needed). After completion, carry out limit parameter tests (such as maximum frequency, maximum voltage, etc.), and carry out tests under temperature conditions as needed. After completing all the projects, organize the data.

以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1.一种系统级芯片测评装置,其特征在于,包括ATE测试板、SoC系统验证板和控制器,所述ATE测试板和所述SoC系统验证板分别与所述控制器连接;1. A system-level chip evaluation device, characterized in that, comprises an ATE test board, a SoC system verification board and a controller, and the ATE test board and the SoC system verification board are respectively connected to the controller; 所述控制器控制所述ATE测试板获取待测系统级芯片的参数级数据,控制所述SoC系统验证板获取所述待测系统级芯片的应用级数据,并根据所述待测系统级芯片的参数级数据和应用级数据,得到所述待测系统芯片的测评结果。The controller controls the ATE test board to obtain parameter-level data of the system-level chip to be tested, controls the SoC system verification board to obtain application-level data of the system-level chip to be tested, and according to the system-level chip to be tested Parameter-level data and application-level data to obtain the evaluation results of the system chip under test. 2.根据权利要求1所述的系统级芯片测评装置,其特征在于,还包括开发板,所述开发板与所述SoC系统验证板连接。2. The system-on-a-chip evaluation device according to claim 1, further comprising a development board connected to the SoC system verification board. 3.根据权利要求1所述的系统级芯片测评装置,其特征在于,还包括信号发生器,所述信号发生器与所述SoC系统验证板连接。3. The SoC evaluation device according to claim 1, further comprising a signal generator connected to the SoC system verification board. 4.根据权利要求1所述的系统级芯片测评装置,其特征在于,还包括示波器,所述示波器与所述SoC系统验证板连接。4. The SoC evaluation device according to claim 1, further comprising an oscilloscope connected to the SoC system verification board. 5.根据权利要求1所述的系统级芯片测评装置,其特征在于,还包括上位机,所述上位机与所述SoC系统验证板连接。5. The system-on-a-chip evaluation device according to claim 1, further comprising a host computer connected to the SoC system verification board. 6.根据权利要求1所述的系统级芯片测评装置,其特征在于,所述SoC系统验证板包括外设接口和处理器,所述外设接口与所述处理器连接,所述处理器与待测系统级芯片连接。6. The system-level chip evaluation device according to claim 1, wherein the SoC system verification board includes a peripheral interface and a processor, the peripheral interface is connected to the processor, and the processor is connected to the processor System-on-chip connections under test. 7.根据权利要求6所述的系统级芯片测评装置,其特征在于,所述SoC系统验证板还包括SoC测试插座,所述待测系统级芯片通过所述SoC测试插座与所述处理器连接。7. The system-on-a-chip evaluation device according to claim 6, wherein the SoC system verification board further comprises a SoC test socket, and the system-on-chip to be tested is connected to the processor through the SoC test socket . 8.根据权利要求6所述的系统级芯片测评装置,其特征在于,所述SoC系统验证板还包括存储器接口,所述存储器接口与所述处理器连接。8. The system-on-a-chip evaluation device according to claim 6, wherein the SoC system verification board further comprises a memory interface, and the memory interface is connected to the processor. 9.一种如权利要求1-8任一项所述的系统级芯片测评装置的系统级芯片测评方法,其特征在于,包括步骤:9. A system-on-chip evaluation method of the system-on-chip evaluation device according to any one of claims 1-8, characterized in that it comprises the steps of: 对所述待测系统级芯片通过所述ATE测试板进行ATE测试,得到所述待测系统级芯片的参数级数据;Performing an ATE test on the system-level chip to be tested through the ATE test board to obtain parameter-level data of the system-level chip to be tested; 当所述待测系统级芯片的ATE测试合格时,对所述待测系统级芯片通过SoC系统验证板进行板级测试,得到所述待测系统级芯片的应用级数据;When the ATE test of the system-level chip to be tested is qualified, a board-level test is performed on the system-level chip to be tested through a SoC system verification board to obtain application-level data of the system-level chip to be tested; 根据所述待测系统级芯片的参数级数据以及所述待测系统级芯片的应用级数据,得到所述待测系统级芯片的测评结果。An evaluation result of the SoC under test is obtained according to the parameter level data of the SoC under test and the application level data of the SoC under test. 10.根据权利要求9所述的系统级芯片测评方法,其特征在于,所述对所述待测系统级芯片通过所述ATE测试板进行ATE测试,得到所述待测系统级芯片的参数级数据之后还包括:10. The system-level chip evaluation method according to claim 9, wherein the system-level chip to be tested is subjected to an ATE test through the ATE test board to obtain the parameter level of the system-level chip to be tested. After the data also include: 当所述待测系统级芯片的ATE测试不合格时,对所述ATE测试不合格的待测系统级芯片进行失效分析。When the ATE test of the system-on-a-chip under test fails, a failure analysis is performed on the system-on-chip under test that fails the ATE test.
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