CN108573992A - Display panel, manufacturing method and electronic device using the display panel - Google Patents

Abstract

A display panel, comprising a μLED array substrate, an upper substrate, a light-shielding portion and a color conversion layer, the μLED array substrate is arranged opposite to the upper substrate, and the μLED array substrate is provided with a plurality of arrays arranged at intervals from each other μLED, the light-shielding part is located between the μLED array substrate and the upper substrate, and its two sides are respectively in contact with the μLED array substrate and the upper substrate. Hole, so that each μLED is accommodated in an accommodating hole, the light-shielding part is opaque, the color conversion layer is arranged on the surface of the upper substrate facing the μLED array substrate, and the color conversion layer includes a plurality of color conversion units Each color conversion unit is located in an accommodating hole, and the μLED located in the same accommodating hole is spaced apart from the color conversion unit, and the color conversion layer contains quantum dot material. The invention also provides a preparation method of the display panel and an electronic device using the display panel.

Description

Display panel, manufacturing method and electronic device using the display panel

technical field

The invention relates to a display panel, a preparation method of the display panel and an electronic device using the display panel.

Background technique

A Micro-LED (Micro-LED or μLED) display is a display that uses a high-density micro-sized μLED array integrated on a substrate as display pixels to display images. Like a large-size outdoor LED display, each The pixels can be addressed and turned on individually, which can be regarded as a reduced version of the outdoor LED display, reducing the pixel distance from millimeters to microns. μLED displays are the same as Organic Light-Emitting Diode (OLED) displays It belongs to self-luminous display, but compared with OLED display, μLED display also has the advantages of better material stability, longer life, and no image burn-in. As used herein, μLEDs generally refer to LEDs with dimensions smaller than 200 microns.

There are currently two main structures for μLED displays. One is to transfer red (R), green (G) and blue (B) μLEDs through mass transfer on the active matrix backplane, and through red (R), Green (G) and blue (B) μLEDs can directly obtain full-color effects; another structure is to form monochrome (usually blue) μLEDs on the active matrix backplane, and set a color conversion layer to convert blue light to full color. colorful effect. For the first structure, due to the difficulty of mass transfer technology, the use of this structure is limited. For the structure of monochromatic μLED and color conversion layer, an existing color conversion layer is to use phosphor powder mixed with viscose, and the technical solution of phosphor powder mixed with glue, due to insufficient density of phosphor powder and uneven distribution , its optical uniformity and reliability are not ideal. The common size of phosphor is 5-15um, which cannot be applied to high-resolution displays, but can only be used in backlight modules or low-resolution displays.

Another color conversion layer uses quantum dots for color conversion. Quantum dots, also known as nanocrystals, are generally spherical or quasi-spherical, and are nanoparticles with a diameter of 2-20 nm made of semiconductor materials (usually composed of IIB-VIA or IIIA-VA elements). The excitation spectrum of quantum dots is wide and continuously distributed, and the emission spectrum of quantum dots is narrow and symmetrical, with adjustable colors and high photochemical stability. The emission spectrum of quantum dots can be controlled by changing the size of quantum dots, and the spectrum covers the entire visible light region. When quantum dots are used as the color conversion layer, the powder of quantum dots is sprayed on the outer surface of μLED. The quantum dots are in direct contact with μLEDs, and the heat emitted by μLEDs is directly transferred to the quantum dots, causing the quantum dots to deteriorate due to high-temperature light. Furthermore, the display quality of the display panel is degraded. Quantum dot materials will not only be destroyed by high temperature, but also by water and oxygen corrosion.

Contents of the invention

In view of this, the present invention provides a display panel with a relatively high service life.

In addition, a method for preparing the display panel and an electronic device using the display panel are also provided.

A display panel, comprising a μLED array substrate, an upper substrate, a light-shielding portion, and a color conversion layer, the μLED array substrate is arranged opposite to the upper substrate, and the μLED array substrate is provided with a plurality of For the set μLED, the light-shielding part is located between the μLED array substrate and the upper substrate, and its two sides are respectively in contact with the μLED array substrate and the upper substrate. accommodating holes for each μLED to be accommodated in one accommodating hole, the light-shielding portion is opaque, the color conversion layer is disposed on the surface of the upper substrate facing the μLED array substrate, and the color conversion layer includes a plurality of color A conversion unit, each color conversion unit is located in an accommodating hole, and the μLED located in the same accommodating hole is spaced apart from the color conversion unit, and the color conversion layer contains quantum dot material.

A method for preparing a display panel, comprising:

A light-transmitting upper substrate is provided, and a light-shielding portion is formed on the surface of the upper substrate. The light-shielding portion is formed of an opaque material, and the light-shielding portion is formed with a plurality of accommodating holes passing through the light-shielding portion;

A color conversion layer is formed on the surface of the upper substrate on which the light-shielding portion is formed, and the color conversion layer includes a plurality of color conversion units, and each color conversion unit is located in an accommodating hole;

A μLED array substrate is provided, the μLED array substrate is provided with a plurality of μLEDs arranged in an array and arranged at intervals from each other;

The upper substrate is docked with the μLED array substrate, so that the light-shielding part is located between the μLED array substrate and the upper substrate and its two sides are respectively in contact with the μLED array substrate and the upper substrate, so that each μLED is accommodated in a container Put in the hole.

An electronic device includes a main body and a display panel arranged in the main body.

In the display panel of the present invention, the quantum dot material is placed in a closed space, and after the packaging is completed, water and oxygen will hardly enter the closed space, effectively preventing the quantum dot material from being corroded by water and oxygen. Moreover, the quantum dot material is not in direct contact with the LED, and the heat emitted by the LED will not be directly transferred to the quantum dot material to cause deterioration of the quantum dot material.

Description of drawings

FIG. 1 is a schematic plan view of a display panel according to a first embodiment of the present invention.

Fig. 2 is a sectional view along II-II of Fig. 1 .

FIG. 3 is a schematic cross-sectional view of a display panel according to a second embodiment of the present invention.

FIG. 4 is a schematic diagram of an electronic device using a display panel according to a preferred embodiment of the present invention.

Description of main component symbols

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

In order to make the technical content disclosed in this application more detailed and complete, reference may be made to the drawings and the following various specific embodiments of the present invention, and the same symbols in the drawings represent the same or similar elements. However, those skilled in the art should understand that the examples provided below are not intended to limit the scope of the present invention. In addition, the drawings are for illustrative purposes only and are not drawn to scale according to their actual size.

The specific implementation manners of the present invention will be described in further detail below with reference to the accompanying drawings.

first embodiment

Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a schematic plan view of a display panel according to a first embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of the display panel in FIG. 1 along a section line II-II.

The display panel 10 of this embodiment includes a μLED array substrate 12 , an upper substrate 13 , a light shielding portion 15 and a color conversion layer 16 .

As shown in Figure 2, the μLED array substrate 12 is arranged opposite to the upper substrate 13, the μLED array substrate 12 is provided with a plurality of μLEDs 123 arranged in an array and spaced from each other, and the light shielding part 15 is located between the upper substrate 13 and the μLED array substrate 12. Between and its two sides are in contact with the μLED array substrate 12 and the upper substrate 13 respectively, the light shielding portion 15 has a certain thickness, and the position of the light shielding portion 15 corresponding to each μLED 123 is formed with a capacity penetrating through the two sides of the light shielding portion 15. The hole 151 is arranged so that each μLED 123 is accommodated in the accommodating hole 151 , and the light-shielding portion 15 is opaque. The color conversion layer 16 is formed on the surface of the upper substrate 13 facing the μLED array substrate 12. The color conversion layer 16 includes a plurality of color conversion units, each color conversion unit is located in a housing hole 151, and the μLEDs located in the same housing hole 123 and the color conversion unit are set at intervals. The μLED array substrate 12 is used to emit light as the display light source of the display panel 10, and the color conversion layer 16 contains quantum dot materials, which can convert the color of the light emitted by the μLED array substrate 12 to obtain the required color for display, and light-shielding The part 15 can shield the light emitted by the μLED array substrate 12 and propagates in some specific directions.

The light-shielding portion 15 , the upper substrate 13 and the μLED array substrate 12 cooperate to seal the accommodating hole 151 to form a closed space.

The μLED array substrate 12 includes a bottom plate 121 and the μLEDs 123 disposed on the surface of the bottom plate 121 facing the upper substrate 13 , and each μLED 123 is located in an accommodating hole 151 . In this embodiment, the μLED 123 may be a micro light emitting diode containing gallium nitride (GaN), and the GaN micro light emitting diode emits light in the blue band.

The material of the bottom plate 121 can be inorganic, such as silicon dioxide (SiO ₂ ); the material of the bottom plate 121 can also be organic, such as, polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA), polyimide (Polyimide, PI), polyethylene naphthalate two formic acid glycol ester (PEN), polycarbonate (Polycarbonate, PC) or polyethylene terephthalate (polyethylene glycol terephthalate, PET). The bottom plate 121 can be a flexible material or a non-flexible material. In this embodiment, the bottom plate 121 is made of a non-flexible material, and the bottom plate 121 is PMMA, which has better rigidity, so that the μLED array substrate 12 is not easily deformed, so as to ensure that the accommodating hole 151 The structure is relatively stable and remains airtight. In other embodiments, the bottom plate 121 can also be a flexible material (such as PC, PMMA, PI or PEN), correspondingly, the upper substrate 13 should be a flexible material, and the light shielding part 15 should also have better deformability, so that The accommodating hole 151 will not lose its airtightness when the display panel 10 undergoes deformation such as bending or bending.

The light emitted by the μLED array substrate 12 needs to pass through the upper substrate 13 to be observed by the user. Therefore, the upper substrate 13 is a transparent material with better light transmission; the upper substrate 13 is the color conversion layer 16 and the light shielding part 15, the upper substrate 13 can be a flexible material or a non-flexible material. In this embodiment, both the upper substrate 13 and the bottom plate 121 are non-flexible materials, and both have good rigidity, so that when the display panel 10 is subject to external forces and produces deformation tendencies such as twisting and bending, it is difficult to deform or the degree of deformation is relatively small. To ensure that the structure of the accommodating hole 151 is relatively stable and keeps it sealed; correspondingly, the material of the upper substrate 13 can be an inorganic substance, such as silicon dioxide (SiO ₂ ), and the material of the upper substrate 13 can also be an organic substance, such as a polymer Carbonate (Polycarbonate, PC), polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA) or polyethylene terephthalate (polyethylene glycol terephthalate, PET). In other embodiments, both the upper substrate 13 and the bottom plate 121 are made of flexible materials, so that the accommodating hole 151 will not lose its airtightness when the display panel 10 is bent, twisted or other deformations; the upper substrate 13 can be an optical film , the material of the upper substrate 13 can be organic, such as polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA), polycarbonate (Polycarbonate, PC), polyimide (Polyimide, PI) or polyethylene naphthalate Alcohol ester (Polyethylene naphthalate two formic acid glycol ester, PEN).

It can be understood that the materials of the upper substrate 13 and the bottom plate 121 can be selected according to actual needs, but when selecting the materials of the upper substrate 13 and the bottom plate 121, the influence of material matching on the sealing performance of the accommodating hole 151 should be fully considered, and the accommodating hole 151 should be ensured as much as possible. The sealing of the hole 151 is not damaged, so as to prevent water and oxygen from entering the containing hole 151 and causing damage to the quantum dot material.

The upper substrate 13 includes a first surface 131 facing the μLED array substrate 12 , and the light shielding portion 15 is disposed on the first surface 131 . The light shielding portion 15 has a certain thickness, which at least makes the color conversion layer 16 disposed in the accommodating hole 151 not in contact with the μLED 123 . The light-shielding portion 15 can be a patterned black matrix layer or a black photoresist layer, and the light-shielding portion 15 can be fabricated by printing, chemical etching, laser etching and other processes.

Press the opposite upper substrate 13 and the μLED array substrate 12, make the side of the light-shielding portion 15 far away from the upper substrate 13 and the μLED array substrate 12 bonded by adhesive 11, and each accommodating hole 151 defines a sub-pixel 190, There is at least one μ.LED 123 in each sub-pixel. Part of the light emitted by the μLED 123 passes through the upper substrate 13 , and the other part is blocked, absorbed or reflected by the light shielding portion 15 or the μLED array substrate 12 . In this embodiment, only one μLED 123 is provided in each accommodating hole 151. In other embodiments, there may be two or more μLEDs 123 in each accommodating hole 151, which can be adjusted according to the brightness requirement of the display panel 10 The number of μLEDs 123 in the accommodation hole 151 is adjusted.

The sub-pixel 190 includes a red sub-pixel 191, a green sub-pixel 192, and a blue sub-pixel 193 with three different colors. A color conversion unit is also arranged in the accommodating hole 151 corresponding to the red sub-pixel 191 and the green sub-pixel 192. The unit is disposed on a portion of the first surface 131 located in the receiving hole 151 . The color conversion layer 16 includes a red color conversion unit 161 and a green color conversion unit 162 , the red color conversion unit 161 is set corresponding to the red sub-pixel 191 , and the green color conversion unit 162 is set corresponding to the green sub-pixel 192 . The color conversion layer 16 can be formed by coating or spraying the quantum dot material on the first surface 131; the quantum dot material in the red color conversion unit 161 is mainly a quantum dot material with a diameter of 7nm, and the light emitted by the μLED 123 passes through the upper substrate 13 , the quantum dot material in the red color conversion unit 161 is converted into light in the red band; the quantum dot material in the green color conversion unit 162 is mainly a quantum dot material with a diameter of 3nm, and when the light emitted by the μLED 123 passes through the upper substrate 13 , is converted into light in the green band by the quantum dot material in the green color conversion unit 162; the color conversion layer 16 is not provided in the accommodation hole 151 corresponding to the blue sub-pixel 193, and the blue light emitted by the blue-emitting μLED 123 directly penetrates the upper Substrate 13. The display panel 10 includes a plurality of pixels 17 , and a pixel 17 is composed of a plurality of sub-pixels 19 , and each sub-pixel 19 includes at least one red sub-pixel 191 , one green sub-pixel 192 and one blue sub-pixel 193 . Gallium nitride micro-light emitting diodes emit blue light. Compared with the traditional white light μLED 123, white light is formed by mixing light of different frequencies. The utilization rate of quantum dot materials for white light is lower than that of quantum dot materials for monochromatic blue light. utilization rate.

The display panel 10 also includes a sealant 14 coated on the outer wall of the display panel 10 to cover the connection gap between the light shielding portion 15 and the μLED array substrate 12 and the upper substrate 13 to improve the sealing performance of the display panel 10 .

The display panel 10 also includes an active matrix substrate 18, and the active matrix substrate 18 includes a plurality of thin film transistors 181 (thin film transistor, TFT) arranged in an array, and the plurality of TFTs 181 are used to control the μLED 123 Each μLED 123 is provided with at least one TFT 181 correspondingly.

There is no contact between the μLED 123 and the color conversion layer 16 , the μLED 123 will generate heat while emitting light, and the quantum dot material in the color conversion layer 16 will deteriorate due to high temperature, which will directly cause the display effect of the display panel 10 to decline. The thermal conductivity of the filling in the receiving hole 151 is smaller than that of the bottom plate 121 . In this embodiment, the filler in the accommodation hole 151 is air, and the average thermal conductivity of air is 0.026W/mK. The material of the bottom plate 121 in this embodiment is polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA). The thermal conductivity of PMMA is 0.2W/mK, and the thermal conductivity of PMMA is much greater than that of air. The heat emitted by μLED 123 will be preferentially transmitted through the material with high thermal conductivity among the materials in contact with it. μLED 123 is in contact with the base plate 121 and the air filled in the accommodating hole 151 at the same time, because the thermal conductivity of the base plate 121 is much greater than that of air. thermal conductivity, and the color conversion layer 16 and the μLED 123 are isolated by air without direct contact, therefore, the heat generated by the μLED 123 is preferentially exported through the bottom plate 121, and only a small amount of heat is conducted to the color conversion layer 16 through the air, making the color conversion layer The quantum dot material in 16 avoids being destroyed by high temperature. In other embodiments, the accommodating hole 151 may also be filled with optical glue whose thermal conductivity is lower than that of the material of the bottom plate 121 .

A method for manufacturing a display panel according to a first embodiment of the present invention is provided.

Step S11: Provide a light-transmitting upper substrate 13, and form a light-shielding portion 15 on the surface of the upper substrate 13. The light-shielding portion 15 is formed of an opaque material. Hole 151 is set.

Specifically, the substrate has a first surface 131, and a dark opaque photoresist material is formed on the first surface 131, and the light shielding part 15 etches the photoresist by using laser etching or chemical etching. Etch-resistant materials are obtained. In this embodiment, the light-shielding portion 15 has a plurality of accommodating holes 151 arranged in a matrix and having almost the same size. removed to expose the first surface 131 of the upper substrate 13 .

Step S12 : forming a color conversion layer 16 on the surface of the upper substrate 13 on which the light shielding portion 15 is formed. The color conversion layer 16 includes a plurality of color conversion units, and each color conversion unit is located in an accommodating hole 151 .

Specifically, the color conversion layer 16 may be prepared in a partial area of the first surface 131 not covered by the light-shielding portion 15 by coating, spraying, and the like. Each accommodating hole 151 corresponds to a sub-pixel 19, and the sub-pixel 19 includes at least three different sub-pixels. In this embodiment, the sub-pixel 19 includes a red sub-pixel 191, a green sub-pixel 192, and a blue sub-pixel 193. , the color conversion unit of the color conversion layer 16 includes a red color conversion unit 161 and a green color conversion unit 162, wherein the red color conversion unit 161 is set corresponding to the red sub-pixel 191, the green color conversion unit 162 is set corresponding to the green sub-pixel 192, and corresponding to the blue color conversion unit 162. The area of the color sub-pixel is not provided with the color conversion layer 16 .

Step S13: providing a μLED array substrate 12, the μLED array substrate 12 is provided with a plurality of μLEDs 123 arranged in an array and spaced from each other; connecting the upper substrate 13 to the μLED array substrate 12, so that the light-shielding The portion 15 is located between the μLED array substrate 12 and the upper substrate 13 and its two sides are respectively in contact with the μLED array substrate 12 and the upper substrate 13 , so that each μLED 123 is accommodated in an accommodating hole 151 .

Specifically, a thin film transistor array substrate 18 including a plurality of TFTs 181 stacked with the μLED array substrate 122 is also provided, the TFTs 181 are arranged in a matrix, and each μLED 123 is provided with at least one TFT 181 . In this embodiment, the display panel 10 may further include a sealant 14 coated on the outer wall of the display panel 10 to cover the connection gap between the light shielding portion 15 and the μLED array substrate 12 and the upper substrate 13 .

second embodiment

Please refer to FIG. 3 . FIG. 3 shows a schematic structural view of a display panel according to a second embodiment of the present invention. The schematic plan view of the display panel of the second embodiment is the same as that of the display panel of the first embodiment. Refer to FIG. 1 .

The display panel 20 of this embodiment includes a μLED array substrate 22 , an upper substrate 23 , a light shielding portion 25 and a color conversion layer 26 .

As shown in Figure 3, the μLED array substrate 22 is arranged opposite to the upper substrate 23, and the μLED array substrate 22 is provided with a plurality of μLEDs 223 arranged in an array and arranged at intervals from each other, and the light shielding part 25 is located between the upper substrate 23 and the μLED array substrate 22. Between and its two sides are in contact with the μLED array substrate 22 and the upper substrate 23 respectively, the light shielding portion 25 has a certain thickness, and the position of the light shielding portion 25 corresponding to each μLED 223 is formed with a space through the two sides of the light shielding portion 25. The hole 251 is arranged so that each μLED 223 is accommodated in the accommodating hole 251 , and the light-shielding portion 25 is opaque. The color conversion layer 26 is formed on the surface of the upper substrate 23 facing the μLED array substrate 22. The color conversion layer 26 includes a plurality of color conversion units, each color conversion unit is located in a receiving hole 251, and the μLEDs located in the same receiving hole 223 and the color conversion unit are set at intervals. The μLED array substrate 22 is used to emit light as the display light source of the display panel 20, and the color conversion layer 26 contains quantum dot materials, which can convert the color of the light emitted by the μLED array substrate 22 to obtain the required color for display, shading The part 25 can shield the light emitted by the μLED array substrate 22 and propagated in some specific directions.

The light shielding portion 25 , the upper substrate 23 and the μLED array substrate 22 cooperate to seal the accommodating hole 251 to form a closed space.

The μLED array substrate 22 includes a bottom plate 221 and the μLEDs 223 disposed on the surface of the bottom plate 221 facing the upper substrate 23 , and each μLED 223 is located in an accommodating hole 251 . In this embodiment, the μLED 223 may be a micro light emitting diode containing aluminum gallium nitride (AlGaN), and the micro light emitting diode of aluminum gallium nitride emits ultraviolet light.

The material of the bottom plate 221 can be inorganic, such as silicon dioxide (SiO ₂ ); the material of the bottom plate 221 can also be organic, such as, polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA), polyimide (Polyimide, PI), polyethylene naphthalate two formic acid glycol ester (PEN), polycarbonate (Polycarbonate, PC) or polyethylene terephthalate (polyethylene glycol terephthalate, PET). The bottom plate 221 can be a flexible material or a non-flexible material. In this embodiment, the bottom plate 221 is a non-flexible material, and the bottom plate 221 is PMMA, which has better rigidity, so that the μLED array substrate 22 is not easily deformed, so as to ensure that the accommodating hole 251 The structure is relatively stable and remains airtight. In other embodiments, the bottom plate 221 can also be a flexible material (such as PC, PMMA, PI or PEN), correspondingly, the upper substrate 23 should be a flexible material, and the light shielding part 25 should also have better deformability, so that The accommodating hole 251 will not lose its airtightness when the display panel 20 is deformed such as bending or bending.

The light emitted by the μLED array substrate 22 needs to pass through the upper substrate 23 to be observed by the user. Therefore, the upper substrate 23 is a transparent material with better light transmission; the upper substrate 23 is a color conversion layer 26 and a light-shielding part 25, the upper substrate 23 can be a flexible material or a non-flexible material. In this embodiment, both the upper substrate 23 and the bottom plate 221 are non-flexible materials, and both have relatively good rigidity, so that the display panel 20 is less likely to be deformed or deformed to a lesser extent when it is subjected to external forces and produces deformation tendencies such as twisting and bending. To ensure that the structure of the accommodating hole 251 is relatively stable and keeps it sealed; correspondingly, the material of the upper substrate 23 can be an inorganic substance, such as silicon dioxide (SiO ₂ ), and the material of the upper substrate 23 can also be an organic substance, such as a polymer Carbonate (Polycarbonate, PC), polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA) or polyethylene terephthalate (polyethylene glycol terephthalate, PET). In other embodiments, both the upper substrate 23 and the bottom plate 221 are made of flexible materials, so that the accommodating hole 251 will not lose its airtightness when the display panel 20 is bent, twisted or other deformations; the upper substrate 23 can be an optical film , the material of the upper substrate 23 can be organic, such as polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA), polycarbonate (Polycarbonate, PC), polyimide (Polyimide, PI) or polyethylene naphthalate Alcohol ester (Polyethylene naphthalate two formic acid glycol ester, PEN).

It can be understood that the materials of the upper substrate 23 and the bottom plate 221 can be selected according to actual needs, but when selecting the materials of the upper substrate 23 and the bottom plate 221, the influence of material matching on the sealing of the accommodation hole 251 should be fully considered, and the accommodation should be ensured as much as possible. The sealing of the hole 251 is not damaged, so as to prevent water and oxygen from entering the containing hole 251 and causing damage to the quantum dot material.

The upper substrate 23 includes a first surface 231 facing the μLED array substrate 22 , and the light shielding portion 25 is disposed on the first surface 231 . The light shielding portion 25 has a certain thickness, which at least makes the color conversion layer 26 disposed in the accommodating hole 251 not in contact with the μLED 223 . The light-shielding portion 25 can be a patterned black matrix layer or a black photoresist layer, and the light-shielding portion 25 can be fabricated by printing, chemical etching, laser etching and other processes.

Press the opposite upper substrate 23 and the μLED array substrate 22, so that the side of the light shielding portion 25 away from the upper substrate 23 is bonded to the μLED array substrate 22 through the adhesive 21, and each accommodating hole 251 defines a sub-pixel 290, There is at least one μLED 223 in each sub-pixel, part of the light emitted by the μLED 223 penetrates the upper substrate 23 , and the other part is blocked, absorbed or reflected by the light shielding portion 25 or the μLED array substrate 22 . In this embodiment, only one μLED 223 is provided in each accommodation hole 251. In other embodiments, there may be two or more μLEDs 223 in each accommodation hole 251, which can be adjusted according to the brightness requirement of the display panel 20. The number of μLEDs 223 in the accommodation hole 251 is adjusted.

The sub-pixel 290 includes a red sub-pixel 291, a green sub-pixel 292 and a blue sub-pixel 293 with three different colors. The color converting unit is disposed on the part of the first surface 231 located in the accommodating hole 251 . The color conversion layer 26 includes a red color conversion unit 261, a green color conversion unit 262, and a blue color conversion unit 263. The red color conversion unit 261 is set corresponding to the red sub-pixel 291, the green color conversion unit 262 is set corresponding to the green sub-pixel 292, and the blue color conversion unit 262 is set corresponding to the green sub-pixel 292. The color conversion unit 263 is provided corresponding to the blue sub-pixel 293 . The color conversion layer 26 can be formed by coating or spraying the quantum dot material on the first surface 231; the quantum dot material in the red color conversion unit 261 is mainly a quantum dot material with a diameter of 7nm, and when the light emitted by μLED223 passes through the upper substrate 23 , is converted into light in the red band by the quantum dot material in the red color conversion unit 261; the quantum dot material in the green color conversion unit 262 is mainly a quantum dot material with a diameter of 3nm, and when the light emitted by the μLED 223 passes through the upper substrate 23, The light in the green band is converted by the quantum dot material in the green color conversion unit 262; the quantum dot material in the blue color conversion unit 263 is mainly a quantum dot material with a diameter of 2nm. When the light emitted by the μLED 223 passes through the upper substrate 23, The quantum dot material in the blue color conversion unit 263 is converted into blue wavelength light. The display panel 20 includes a plurality of pixels 27 , and a pixel 27 is composed of a plurality of sub-pixels 29 , and each sub-pixel 29 includes at least one red sub-pixel 291 , one green sub-pixel 292 and one blue sub-pixel 293 . Gallium aluminum nitride micro-light emitting diodes emit ultraviolet light. Compared with traditional white light μLEDs, white light is formed by mixing light of various frequencies. The utilization rate of quantum dot materials for white light is lower than that of quantum dot materials for monochromatic ultraviolet light. utilization rate.

The display panel 20 also includes a sealant 24 coated on the outer wall of the display panel 20 to cover the connection gap between the light shielding portion 25 and the μLED array substrate 22 and the upper substrate 23 to improve the sealing of the display panel 20 .

The display panel 20 also includes an active matrix substrate 28, and the active matrix substrate includes a plurality of thin film transistors 281 (thin film transistor, TFT) arranged in an array, and the plurality of TFTs 281 are used to control the μLED 223 For turning on and off, each μLED 223 is provided with at least one TFT 281 correspondingly.

There is no contact between the μLED 223 and the color conversion layer 26 , the μLED 223 will generate heat while emitting light, and the quantum dot material in the color conversion layer 26 will deteriorate due to high temperature, which will directly cause the display effect of the display panel 20 to decline. The thermal conductivity of the filling in the receiving hole 251 is smaller than that of the bottom plate 221 . In this embodiment, the filler in the accommodation hole 251 is air, and the average thermal conductivity of the air is 0.026W/mK. The material of the bottom plate 221 in this embodiment is polymethyl methacrylate (Polymeric Methyl Methacrylate, PMMA). The thermal conductivity of PMMA is 0.2W/mK, and the thermal conductivity of PMMA is much greater than that of air. The heat emitted by μLED 223 will be preferentially transmitted through the material with high thermal conductivity among the materials in contact with it, and μLED 223 is in contact with the base plate 221 and the air filled in the accommodating hole 251 at the same time, because the thermal conductivity of the base plate 221 is much greater than that of air. thermal conductivity, and the color conversion layer 26 and the μLED 223 are isolated by air without direct contact, therefore, the heat generated by the μLED 223 is preferentially exported through the bottom plate 221, and only a small amount of heat is conducted to the color conversion layer 26 through the air, making the color conversion layer The quantum dot material in 26 avoids being destroyed by high temperature. In other embodiments, the accommodating hole 251 may also be filled with optical glue whose thermal conductivity is lower than that of the material of the bottom plate 221 .

A method for manufacturing a display panel according to a second embodiment of the present invention is provided.

Step S21: Provide a light-transmitting upper substrate 23, and form a light-shielding portion 25 on the surface of the upper substrate 23. The light-shielding portion 25 is formed of an opaque material. Hole 251 is set.

Specifically, the substrate has a first surface 231, and a dark photoresist material is formed on the first surface 231, and the light shielding part 25 etches the photoresist material by using laser etching or chemical etching. get. In this embodiment, the light-shielding portion 25 has a mesh pattern, and the light-shielding portion 25 has a plurality of accommodating holes 251 arranged in a matrix with almost the same size, and the photoresist material in the corresponding area of the accommodating holes 251 is removed. to expose the first surface 231 of the upper substrate 23 .

Step S22 : forming a color conversion layer 26 on the surface of the upper substrate 23 on which the light-shielding portion 25 is formed. The color conversion layer 26 includes a plurality of color conversion units, and each color conversion unit is located in an accommodating hole 251 .

Specifically, the color conversion layer 26 may be prepared in a partial area of the first surface 231 not covered by the light-shielding portion 25 by coating, spraying, and the like. Each accommodating hole 251 corresponds to a sub-pixel 29, and the sub-pixel 29 includes at least three different sub-pixels. In this embodiment, the sub-pixel 29 includes a red sub-pixel 291, a green sub-pixel 292, and a blue sub-pixel 293. The color conversion unit of the color conversion layer 26 includes a red color conversion unit 261 and a green color conversion unit 262, the red color conversion unit 261 is set corresponding to the red sub-pixel 291, the green color conversion unit 262 is set corresponding to the green sub-pixel 292, and the blue color conversion The unit 263 is set corresponding to the blue sub-pixel 293 .

Step S23: providing a μLED array substrate 22, the μLED array substrate 22 is provided with a plurality of μLEDs 223 arranged in an array and spaced from each other; connecting the upper substrate 23 with the μLED array substrate 22, so that the light-shielding The portion 25 is located between the μLED array substrate 22 and the upper substrate 23 and its two sides are respectively in contact with the μLED array substrate 22 and the upper substrate 23 , so that each μLED 223 is accommodated in an accommodating hole 251 .

Specifically, a thin film transistor array substrate 28 including a plurality of TFTs 281 stacked with the μLED array substrate 222 is also provided, the TFTs 281 are arranged in a matrix, and each μLED 223 is provided with at least one TFT 281 . In this embodiment, the display panel 20 may further include a sealant 24 coated on the outer wall of the display panel 20 to cover the connection gap between the light shielding portion 25 and the μLED array substrate 22 and the upper substrate 23 .

Please refer to FIG. 4 , which is a schematic diagram of a specific embodiment of the electronic device 1 using the display panel of the present invention. When describing the electronic device 1 of this embodiment, the same elements are given the same reference numerals as in the previous embodiment. In this embodiment, the electronic device 1 is a mobile phone, including a main body 2 and a display panel disposed in the main body 2. The display panel is the display panel provided by the present invention, such as the display panel 10 described in the first embodiment above. , or the display panel 20 described in the second embodiment.

In FIG. 4 , the electronic device 1 is only taken as an example of a mobile phone. In other embodiments, the electronic device 1 can also be a personal computer, a smart home appliance, an industrial controller, and the like. When the electronic device 1 is a mobile phone, the display panel 20 can be disposed corresponding to the front of the mobile phone.

Hereinbefore, specific embodiments of the present invention have been described with reference to the accompanying drawings. However, those skilled in the art can understand that without departing from the spirit and scope of the present invention, various changes and substitutions can be made to the specific embodiments of the present invention. These changes and substitutions all fall within the scope defined by the claims of the present invention.

Claims (18)

1. A display panel, characterized in that: comprising a μLED array substrate, an upper substrate, a light-shielding portion and a color conversion layer, the μLED array substrate is set opposite to the upper substrate, and the μLED array substrate is provided with a plurality of μLEDs arranged in an array and arranged at intervals from each other, the light-shielding part is located between the μLED array substrate and the upper substrate, and its two sides are respectively in contact with the μLED array substrate and the upper substrate, and the light-shielding part corresponds to each μLED. The accommodating holes on both sides of the accommodating holes allow each μLED to be accommodated in one accommodating hole, the light-shielding part is opaque, the color conversion layer is arranged on the surface of the upper substrate facing the μLED array substrate, and the color The conversion layer includes a plurality of color conversion units, each color conversion unit is located in an accommodating hole, and the μLED located in the same accommodating hole is spaced apart from the color conversion unit, and the color conversion layer contains quantum dot material. 2 . The display panel according to claim 1 , wherein the μLED array substrate further comprises a bottom plate, and the plurality of μLEDs are all disposed on a surface of the bottom plate facing the upper substrate. 3. The display panel according to claim 2, wherein the light-shielding portion is formed on the surface of the upper substrate facing the μLED array substrate, and the side of the light-shielding portion away from the upper substrate is bonded to the μLED array substrate by adhesive to shield light. Part, the upper substrate and the μLED array substrate cooperate to make each accommodating hole be sealed to form a closed space, the space in the closed space except the μLED and the color conversion unit is empty or filled with optical glue, the heat conduction of the bottom plate The coefficient is greater than the thermal conductivity of the optical glue. 4. The display panel according to claim 1, wherein the optical glue is an acrylic optical glue, and its thermal conductivity is less than or equal to 0.2. 5. The display panel as claimed in claim 1, wherein the plurality of μLEDs emit the same light. 6. The display panel according to claim 5, wherein the plurality of μLEDs emit ultraviolet light or blue light. 7. The display panel according to claim 1, characterized in that: the display panel defines a plurality of pixels, each pixel is composed of a plurality of sub-pixels, and each sub-pixel includes one μLED. 8. The display panel according to claim 7, wherein the sub-pixels include red sub-pixels, green sub-pixels and blue sub-pixels with three different colors; the color conversion unit includes a red color conversion unit and a red color conversion unit. A green color conversion unit, the red color conversion unit is provided with a red quantum dot material, and the green color conversion unit is provided with a green quantum dot material; each red sub-pixel includes a red sub-pixel located in the same accommodation hole as its μLED A color conversion unit, each green sub-pixel includes a green color conversion unit located in the same accommodating hole as the μLED, and no color conversion unit is provided in the blue sub-pixel. 9. The display panel according to claim 7, wherein the color conversion unit comprises a red color conversion unit, a green color conversion unit, and a blue color conversion unit, and red quantum dots are arranged in the red color conversion unit material, the green color conversion unit is provided with a green quantum dot material, and the blue color conversion unit is provided with a blue quantum dot material; each red sub-pixel includes a red color sub-pixel located in the same accommodation hole as its μLED For the conversion unit, each green sub-pixel includes a green color conversion unit located in the same accommodation hole as its μLED, and each blue sub-pixel includes a blue color conversion unit located in the same accommodation hole as its μLED. 10. The display panel according to claim 1, wherein the light shielding portion is a black matrix or a dark photoresist. 11. The display panel according to claim 1, characterized in that: the display panel further comprises a sealant, the sealant is coated on the outer wall of the display panel, and the covering part and the μLED array substrate and the connection gap between the upper substrate. 12. An electronic device, comprising a main body and a display panel disposed in the main body, wherein the display panel is the display panel according to any one of claims 1-11. 13. A method for preparing a display panel, comprising: A light-transmitting upper substrate is provided, and a light-shielding portion is formed on the surface of the upper substrate. The light-shielding portion is formed of an opaque material, and the light-shielding portion is formed with a plurality of accommodating holes passing through the light-shielding portion; A color conversion layer is formed on the surface of the upper substrate on which the light-shielding portion is formed, and the color conversion layer includes a plurality of color conversion units, and each color conversion unit is located in an accommodating hole; A μLED array substrate is provided, the μLED array substrate is provided with a plurality of μLEDs arranged in an array and arranged at intervals from each other; The upper substrate is docked with the μLED array substrate, so that the light-shielding part is located between the μLED array substrate and the upper substrate and its two sides are respectively in contact with the μLED array substrate and the upper substrate, so that each μLED is accommodated in a container Put in the hole. 14 . The method for manufacturing a display panel according to claim 13 , wherein the side of the light-shielding portion away from the upper substrate is bonded to the μLED array substrate. 15 . 15 . The method for manufacturing a display panel according to claim 13 , wherein the display panel defines a plurality of pixels, each pixel is composed of a plurality of sub-pixels, and each sub-pixel includes one μLED. 16. The method for manufacturing a display panel according to claim 15, wherein the sub-pixels include red sub-pixels, green sub-pixels and blue sub-pixels with three different colors; the color conversion unit includes A red color conversion unit and a green color conversion unit, the red color conversion unit is provided with a red quantum dot material, and the green color conversion unit is provided with a green quantum dot material; each red sub-pixel includes a A red color conversion unit is placed in the hole, and each green sub-pixel includes a green color conversion unit located in the same housing hole as its μLED, and no color conversion unit is arranged in the blue sub-pixel. 17. The method for manufacturing a display panel according to claim 15, wherein the color conversion unit comprises a red color conversion unit, a green color conversion unit, and a blue color conversion unit, and the red color conversion unit A red quantum dot material is provided, a green quantum dot material is provided in the green color conversion unit, and a blue quantum dot material is provided in the blue color conversion unit; each red sub-pixel includes a The red color conversion unit in the hole, each green sub-pixel includes a green color conversion unit located in the same accommodation hole with its μLED, and each blue sub-pixel includes a blue color conversion unit located in the same accommodation hole with its μLED conversion unit. 18. A method for preparing a display panel according to claim 13, wherein the display panel further comprises a sealant, the sealant is coated on the outer sidewall of the display panel, and the covering is light-shielding The connection gap between the part and the μLED array substrate and the upper substrate.