CN108564159B - Double-interface smart card - Google Patents
Double-interface smart card Download PDFInfo
- Publication number
- CN108564159B CN108564159B CN201810742438.5A CN201810742438A CN108564159B CN 108564159 B CN108564159 B CN 108564159B CN 201810742438 A CN201810742438 A CN 201810742438A CN 108564159 B CN108564159 B CN 108564159B
- Authority
- CN
- China
- Prior art keywords
- antenna
- conductive adhesive
- double
- interface
- conductive wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000001070 adhesive effect Effects 0.000 claims abstract description 71
- 239000000853 adhesive Substances 0.000 claims abstract description 70
- 238000007731 hot pressing Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 4
- 238000003466 welding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004831 Hot glue Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
Abstract
The invention provides a double-interface smart card, which comprises an antenna layer and a double-interface card chip layer, wherein the antenna layer comprises an antenna card base and an antenna, the double-interface card chip layer comprises a double-interface card base and a double-interface chip, the double-interface chip comprises a chip body and a circuit board, the circuit board comprises a positive electrode and a negative electrode, the circuit board further comprises unidirectional conductive adhesive, the positive electrode is electrically connected with the upper surface of the unidirectional conductive adhesive, one end of the antenna is electrically connected with the lower surface of the unidirectional conductive adhesive, and the negative electrode is electrically connected with the upper surface of the unidirectional conductive adhesive. Compared with the prior art, the invention can respectively realize that the positive electrode is conducted with one end of the antenna and the negative electrode is conducted with the other end of the antenna. Through the unidirectional conductive adhesive, the double-interface chip is stably positioned and fixed in the double-interface card base, and is not easy to fall off.
Description
Technical Field
The invention relates to the technical field of smart cards, in particular to a dual-interface smart card.
Background
The current production process for producing the dual-interface smart card in the prior art generally comprises the following steps: firstly, an antenna layer is manufactured by embedding a copper enameled wire on an antenna substrate by using ultrasonic waves. Since the two ends of the antenna must have appropriate relative positions to accommodate the two pads of the dual interface module, one end of the antenna may cross the inner ring from the outer ring to a suitable position at the other end of the antenna, and this structure is prone to short circuit, so the wound antenna must use enameled wires to avoid short circuit of the antenna circuit. The other constituent materials of the card base are then sequentially stacked and laminated. And (5) placing the laminated large semi-finished product into a card punching machine, and punching the semi-finished product into a standard double-interface card base. And milling a groove at the position of the double-interface module of the double-interface card base to expose the wire heads at the two ends of the antenna, manually picking the wire heads at the two ends of the antenna from the antenna base material, pulling the antenna out of the antenna base material for a certain length, trimming the pulled two sections of the antenna into the same length and enabling the two sections of the antenna to vertically upwards. And (3) tin plating is carried out on the bonding pad of the double-interface module, and a hot melt adhesive film is stuck at the position outside the bonding pad. Welding the bonding pad of the double-interface module and the upright antenna on the double-interface card base together by a manual or automatic machine, and placing the welded double-interface module in the milled groove of the double-interface card base. And after the hot melt adhesive film on the double-interface module is melted by using hot-pressing equipment, finally bonding the double-interface module and the double-interface card base together. The defects are that: in the process of welding the wire ends of the antenna to the bonding pads of the dual-interface module, a plurality of steps such as wire picking, wire pulling, standing wires, wire cutting, placing the dual-interface card base with the standing wire ends on equipment and the like need to be completed manually, so that the yield is low, the quality is difficult to ensure, and in addition, the operation difficulty is high and the rejection rate is high.
Disclosure of Invention
The invention aims to solve the problems of the prior art and provides a dual-interface smart card.
The above object is achieved by the following technical scheme:
the invention provides a double-interface smart card, which comprises an antenna layer and a double-interface card chip layer, wherein the antenna layer comprises an antenna card base and an antenna, the double-interface card chip layer comprises a double-interface card base and a double-interface chip, the double-interface chip comprises a chip body and a circuit board, the circuit board comprises a positive electrode and a negative electrode, the circuit board further comprises unidirectional conductive adhesive, the positive electrode is electrically connected with the upper surface of the unidirectional conductive adhesive, one end of the antenna is electrically connected with the lower surface of the unidirectional conductive adhesive, the negative electrode is electrically connected with the upper surface of the unidirectional conductive adhesive, the other end of the antenna is electrically connected with the lower surface of the unidirectional conductive adhesive, the upper surface of the unidirectional conductive adhesive is connected with the lower surface of the double-interface chip, and the lower surface of the unidirectional conductive adhesive is connected with the upper surface of the antenna card base.
Further, one end of the antenna is located directly below the positive electrode, and the other end of the antenna is located directly below the negative electrode.
Further, a first plane is arranged on the outer peripheral surface of one end of the antenna, a second plane is arranged on the outer peripheral surface of the other end of the antenna, the first plane is parallel to the lower surface of the unidirectional conductive adhesive, and the second plane is parallel to the lower surface of the unidirectional conductive adhesive.
Further, one half of one end of the antenna is implanted in the upper surface of the antenna card base, and the other half of the other end of the antenna is implanted in the upper surface of the antenna card base.
Further, the dual-interface card base is provided with a placing through hole for accommodating the dual-interface chip, and the dual-interface chip is placed in the placing through hole.
Further, the antenna card base is provided with a wavy first conductive wire and a wavy second conductive wire, one end of the first conductive wire is connected with one end of the antenna, a local part of the first conductive wire is located under the placing through hole and is connected with the lower surface of the unidirectional conductive adhesive, a local part of the first conductive wire is located under the positive electrode, one end of the second conductive wire is connected with the other end of the antenna, a local part of the second conductive wire is located under the placing through hole and is connected with the lower surface of the unidirectional conductive adhesive, and a local part of the second conductive wire is located under the negative electrode.
Further, a third plane is arranged on the outer peripheral surface of the local part of the first conductive wire, a fourth plane is arranged on the outer peripheral surface of the local part of the second conductive wire, the third plane is parallel to the lower surface of the unidirectional conductive adhesive, and the fourth plane is parallel to the lower surface of the unidirectional conductive adhesive.
Further, half of the first conductive line is implanted in the upper surface of the antenna card base, and half of the second conductive line is implanted in the upper surface of the antenna card base.
The beneficial effects of the invention are as follows: the two ends of the antenna are conducted with the double-interface chip through unidirectional conductive adhesive, and the unidirectional conductive adhesive is adhesive which has conductivity in the pressurizing direction and is non-conductive in the direction perpendicular to the pressurizing direction or insulated in the direction perpendicular to the pressurizing direction. In the same one-way conductive adhesive, the conduction between the positive electrode and one end of the antenna and the conduction between the negative electrode and the other end of the antenna can be realized respectively. Through the unidirectional conductive adhesive, the double-interface chip is stably positioned and fixed in the double-interface card base, and is not easy to fall off. Compared with the prior art, the two ends of the antenna are conducted with the double-interface chip through the unidirectional conductive adhesive, so that the welding of the wire ends of the antenna to the welding pads of the double-interface module in the prior art is replaced, and the procedure of manually completing the welding process is omitted: such as thread picking, pulling, standing thread, thread cutting and the like, thereby improving the production efficiency; in addition, the unidirectional conductive adhesive has an adhesive effect, and no additional hot melt adhesive is needed.
Drawings
Fig. 1 is a schematic diagram of an antenna layer structure according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of an antenna layer and a dual-interface card base according to a first embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a first embodiment of the present invention;
fig. 4 is a schematic diagram of an antenna layer structure according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of an antenna layer and a dual-interface card base according to a second embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a second embodiment of the present invention;
fig. 7 is a cross-sectional view of the two ends of the antenna of the first embodiment and the first conductive line and the second conductive line of the second embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the attached drawings and detailed description:
fig. 1 to 3 show a first embodiment of the present invention, the present invention provides a dual-interface smart card, comprising an antenna layer 1 and a dual-interface card chip layer, the antenna layer 1 comprises an antenna card base 11 and an antenna 12, the antenna 12 is implanted in the upper surface of the antenna card base 11 through a wire burying machine, the dual-interface card chip layer comprises a dual-interface card base 21 and a dual-interface chip 22, the dual-interface chip comprises a positive electrode 221 and a negative electrode 222, and further comprises a unidirectional conductive adhesive 3, the unidirectional conductive adhesive 3 is a vertical unidirectional conductive adhesive 3, and may also be called an anisotropic conductive adhesive film, abbreviated as ACF (Anisotropic Conductive Film), the positive electrode 221 is electrically connected with the upper surface of the vertical unidirectional conductive adhesive 3 through hot pressing, one end 121 of the antenna 12 is electrically connected with the lower surface of the vertical unidirectional conductive adhesive 3 through hot pressing, one end 121 of the antenna 12 is located under the positive electrode 221, the negative electrode 222 is electrically connected with the upper surface of the vertical unidirectional conductive adhesive 3 through hot pressing, the other end 122 of the antenna 12 is electrically connected with the lower surface of the vertical unidirectional conductive adhesive 3 through hot pressing, the other end 122 of the antenna 12 is located under the negative electrode 222, the upper surface of the vertical unidirectional conductive adhesive 3 is bonded with the lower surface of the dual-interface card chip 22 through hot pressing, the lower surface of the vertical unidirectional conductive adhesive 3 is bonded with the upper surface of the antenna card base 11 through hot pressing, the dual-interface card base 21 is provided with a placement through hole 211 for accommodating the dual-interface chip 22, and the dual-interface chip 22 is placed in the placement through hole 211. With the above structure, the two ends of the antenna 12 are conducted with the dual-interface chip 22 through the unidirectional conductive adhesive 3, and the unidirectional conductive adhesive 3 is an adhesive which has conductivity in the pressurizing direction and is non-conductive in the direction perpendicular to the pressurizing direction or insulated in the direction perpendicular to the pressurizing direction. In this way, in the same unidirectional conductive paste 3, conduction between the positive electrode 221 and one end 121 of the antenna 12 and conduction between the negative electrode 222 and the other end 122 of the antenna 12 can be achieved respectively. The double-interface chip 22 is firmly fixed in the double-interface card base 21 through the tackiness of the unidirectional conductive adhesive 3, and is not easy to fall off.
Preferably, as shown in fig. 7, the outer peripheral surface of the one end 121 of the antenna 12 is provided with a first plane 1211, the outer peripheral surface of the other end 122 of the antenna 12 is provided with a second plane 1221, the first plane 1211 is parallel to the lower surface of the unidirectional conductive adhesive 3, and the second plane 1221 is parallel to the lower surface of the unidirectional conductive adhesive 3. Through the structure, when hot pressing lamination is performed, the unidirectional conductive adhesive 3 is better laminated with one end 121 and the other end 122 of the antenna 12, and the conductive effect is better.
Preferably, half of one end 121 of the antenna 12 is implanted in the upper surface of the antenna card base 11, and half of the other end 122 of the antenna 12 is implanted in the upper surface of the antenna card base 11. Through the structure, when hot pressing lamination is performed, the unidirectional conductive adhesive 3 is better laminated with one end 121 and the other end 122 of the antenna 12, and the conductive effect is better.
Fig. 4 to 6 show a second embodiment, which differs from the first embodiment in that: the antenna base 11 is provided with a wavy first conductive wire 13 and a wavy second conductive wire 14, the first conductive wire 13 and the second conductive wire 14 are implanted in the upper surface of the antenna base 11 through a wire burying machine, one end of the first conductive wire 13 is connected with one end 121 of the antenna 12, a local part of the first conductive wire 13 is located right below the placement through hole 211 and is connected with the lower surface of the unidirectional conductive adhesive 3, a local part of the first conductive wire 13 is located right below the positive electrode 221, one end of the second conductive wire 14 is connected with the other end 122 of the antenna 12, a local part of the second conductive wire 13 is located right below the placement through hole 211 and is connected with the lower surface of the unidirectional conductive adhesive 3, and a local part of the second conductive wire 14 is located right below the negative electrode 222. When a through hole is milled, even if one section of the first conductive wire 13 and the second conductive wire 14 is milled, the other sections can be in contact with the unidirectional conductive adhesive 3 for conduction, so that the antenna 12 and the unidirectional conductive adhesive 3 are kept in a conducting state, and the stability is higher.
Preferably, as shown in fig. 7, the outer peripheral surface of the partial portion of the first conductive wire 13 is provided with a third plane 131, the outer peripheral surface of the partial portion of the second conductive wire 14 is provided with a fourth plane 141, the third plane 131 is parallel to the lower surface of the unidirectional conductive adhesive 3, and the fourth plane 141 is parallel to the lower surface of the unidirectional conductive adhesive 3. Through the structure, when hot pressing lamination is carried out, the unidirectional conductive adhesive 3 is respectively laminated with the first conductive wire 13 and the second conductive wire 14 better, and the conductive effect is better.
Preferably, half of the first conductive line 13 is implanted in the upper surface of the antenna card base 11, and half of the second conductive line 14 is implanted in the upper surface of the antenna card base 11. Through the structure, when hot pressing lamination is carried out, the unidirectional conductive adhesive 3 is respectively laminated with the first conductive wire 13 and the second conductive wire 14 better, and the conductive effect is better.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the invention without departing from the principles thereof are intended to be within the scope of the invention as set forth in the following claims.
Claims (4)
1. The double-interface smart card is characterized by comprising an antenna layer and a double-interface card chip layer, wherein the antenna layer comprises an antenna card base and an antenna, the double-interface card chip layer comprises a double-interface card base and a double-interface chip, the double-interface chip comprises a chip body and a circuit board, the circuit board comprises a positive electrode and a negative electrode, and further comprises unidirectional conductive adhesive, the unidirectional conductive adhesive is vertical unidirectional conductive adhesive, and the unidirectional conductive adhesive is adhesive which has conductivity in a pressurizing direction and is non-conductive in a direction vertical to the pressure direction or is insulated in a direction vertical to the pressure direction; the positive electrode is electrically connected with the upper surface of the unidirectional conductive adhesive, one end of the antenna is electrically connected with the lower surface of the unidirectional conductive adhesive, the negative electrode is electrically connected with the upper surface of the unidirectional conductive adhesive, the other end of the antenna is electrically connected with the lower surface of the unidirectional conductive adhesive, the upper surface of the unidirectional conductive adhesive is connected with the lower surface of the double-interface chip, and the lower surface of the unidirectional conductive adhesive is connected with the upper surface of the antenna card base; the double-interface card base is provided with a placing through hole for accommodating the double-interface chip, and the double-interface chip is placed in the placing through hole; the antenna clamp base is provided with a wavy first conductive wire and a wavy second conductive wire, and the first conductive wire and the second conductive wire are implanted into the upper surface of the antenna clamp base through a wire burying machine; one end of the first conductive wire is connected with one end of the antenna, a local part of the first conductive wire is positioned right below the placing through hole and is connected with the lower surface of the unidirectional conductive adhesive, a local part of the first conductive wire is positioned right below the positive electrode, one end of the second conductive wire is connected with the other end of the antenna, a local part of the second conductive wire is positioned right below the placing through hole and is connected with the lower surface of the unidirectional conductive adhesive, and a local part of the second conductive wire is positioned right below the negative electrode; when one placing through hole is milled, even if one section of the first conductive wire and the second conductive wire is milled, the other section is in contact conduction with the unidirectional conductive adhesive, so that the antenna and the unidirectional conductive adhesive are kept in a conducting state; the outer peripheral surface of the partial part of the first conductive wire is provided with a third plane, the outer peripheral surface of the partial part of the second conductive wire is provided with a fourth plane, the third plane is parallel to the lower surface of the unidirectional conductive adhesive, and the fourth plane is parallel to the lower surface of the unidirectional conductive adhesive; half of the first conductive wire is implanted in the upper surface of the antenna card base, half of the second conductive wire is implanted in the upper surface of the antenna card base, and when hot pressing lamination is performed, the unidirectional conductive adhesive is respectively laminated with the first conductive wire and the second conductive wire.
2. A dual interface smart card as defined in claim 1, wherein: one end of the antenna is positioned right below the positive electrode, and the other end of the antenna is positioned right below the negative electrode.
3. A dual interface smart card as claimed in claim 1 or 2, wherein: the outer peripheral surface of one end of the antenna is provided with a first plane, the outer peripheral surface of the other end of the antenna is provided with a second plane, the first plane is parallel to the lower surface of the unidirectional conductive adhesive, and the second plane is parallel to the lower surface of the unidirectional conductive adhesive.
4. A dual interface smart card as defined in claim 3, wherein: one half of one end of the antenna is implanted in the upper surface of the antenna card base, and one half of the other end of the antenna is implanted in the upper surface of the antenna card base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810742438.5A CN108564159B (en) | 2018-07-09 | 2018-07-09 | Double-interface smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810742438.5A CN108564159B (en) | 2018-07-09 | 2018-07-09 | Double-interface smart card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108564159A CN108564159A (en) | 2018-09-21 |
| CN108564159B true CN108564159B (en) | 2023-11-24 |
Family
ID=63555691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810742438.5A Active CN108564159B (en) | 2018-07-09 | 2018-07-09 | Double-interface smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108564159B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200709069A (en) * | 2005-08-26 | 2007-03-01 | Gd Teco | Chip card and antenna structure |
| CN1969287A (en) * | 2004-06-16 | 2007-05-23 | 韩国造币公社 | Combi-card and method for making the same |
| CN101420069A (en) * | 2008-11-20 | 2009-04-29 | 北京握奇数据系统有限公司 | Connection method for antenna and intelligent card and double interface smart card |
| JP2009205338A (en) * | 2008-02-27 | 2009-09-10 | Toppan Printing Co Ltd | Method of manufacturing dual interface ic card and dual interface ic card |
| CN104166870A (en) * | 2014-07-01 | 2014-11-26 | 珠海市金邦达保密卡有限公司 | Double-interface metal intelligent chip card and manufacture method |
| CN104361381A (en) * | 2014-11-17 | 2015-02-18 | 深圳市华鑫精工机械技术有限公司 | Double-interface card and method for packaging double-interface card |
| CN105453115A (en) * | 2013-06-07 | 2016-03-30 | 格马尔托股份有限公司 | Method for making an anti-crack electronic device |
| CN208421876U (en) * | 2018-07-09 | 2019-01-22 | 东莞市芯安智能科技有限公司 | A kind of double-interface smart card |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4241147B2 (en) * | 2003-04-10 | 2009-03-18 | ソニー株式会社 | IC card manufacturing method |
| US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
-
2018
- 2018-07-09 CN CN201810742438.5A patent/CN108564159B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1969287A (en) * | 2004-06-16 | 2007-05-23 | 韩国造币公社 | Combi-card and method for making the same |
| TW200709069A (en) * | 2005-08-26 | 2007-03-01 | Gd Teco | Chip card and antenna structure |
| JP2009205338A (en) * | 2008-02-27 | 2009-09-10 | Toppan Printing Co Ltd | Method of manufacturing dual interface ic card and dual interface ic card |
| CN101420069A (en) * | 2008-11-20 | 2009-04-29 | 北京握奇数据系统有限公司 | Connection method for antenna and intelligent card and double interface smart card |
| CN105453115A (en) * | 2013-06-07 | 2016-03-30 | 格马尔托股份有限公司 | Method for making an anti-crack electronic device |
| CN104166870A (en) * | 2014-07-01 | 2014-11-26 | 珠海市金邦达保密卡有限公司 | Double-interface metal intelligent chip card and manufacture method |
| CN104361381A (en) * | 2014-11-17 | 2015-02-18 | 深圳市华鑫精工机械技术有限公司 | Double-interface card and method for packaging double-interface card |
| CN208421876U (en) * | 2018-07-09 | 2019-01-22 | 东莞市芯安智能科技有限公司 | A kind of double-interface smart card |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108564159A (en) | 2018-09-21 |
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