CN108506756A - A kind of on-chip power type LED light with 4 π luminescent screens - Google Patents

Abstract

The invention provides a built-in power supply LED lamp with a 4π luminous board, which includes a bulb shell, a core seat with an exhaust pipe, a capacitor, a lamp holder and a 4π LED luminous board. The present invention places the 4πLED light-emitting board in the sealed bulb shell, which is safe and reliable; and the capacitor of the present invention uses the capacitance filtering feature to improve the power utilization rate and the capacitor is placed in the lamp holder, which solves the problem that the capacitor is easily damaged in a high temperature environment question. Moreover, the front and back sides of the 4πLED light-emitting board are provided with fluorescent adhesive layers containing heat radiation materials, which can directly convert the heat generated by the LED chip and the driver into 2-20 μm infrared waves, and then pass through the silicic acid with an infrared transmittance greater than 0.8. The salt-based glass bulb transmits into the surrounding environment; in addition, the high thermal conductivity gas in the bulb shell can convect the gas to the glass bulb, and then conduct it to the surrounding environment, realizing heat dissipation in multiple directions.

Description

A kind of LED lamp with built-in power supply with 4π light-emitting board

technical field

The invention relates to the technical field of lighting, in particular to a power supply built-in LED lamp with a 4π light-emitting board.

Background technique

The emergence of tungsten filament incandescent lamps in the 19th century led the world into the era of artificial lighting. Since the emergence of a revolutionary new light source—LED in the 20th century, it has quickly become popular in the lighting market due to its advantages of energy saving, environmental protection, and long life. LED has become the mainstream lighting source in the future and is widely used in commercial lighting, industrial lighting, and outdoor lighting. However, the previous LED light sources, such as plug-in LEDs, SMD LEDs, COB (Chip On Board, chip on board packaging), integrated high-power LED lamp beads, can only be used without optical devices such as lenses. flat light source.

In 2008, Japan Ushio Light Source launched a bulb-type lamp with an incandescent lamp prototype configured with an LED filament. The emergence of "LED Filament Lamp" has truly realized a 360-degree full-angle light-emitting three-dimensional light source, which meets customers' full-angle light requirements, brings unprecedented lighting experience and is more energy-saving. Since Japan’s Ushio light source was first launched and mass-produced, candle lamps, bulb shells and other products using LED filaments as light sources have gradually been favored by more and more consumers in the market.

Existing LED lamps generally adopt 4π light-emitting LED light-emitting strips to be sealed in a bulb filled with gas, and the driver is installed in the lamp holder. Its 4π emitting LED strip is usually a strip-shaped transparent substrate, on which 4π emitting LED chips are distributed and wrapped with a phosphor layer to achieve 4π emitting.

However, the existing LED lamps have the following problems, which restrict the further development of LED lamps.

One is heat dissipation. The heat of the LED lamp is mainly generated by the LED chip and the power device of the driving circuit. The LED lamps in the prior art generally use low-voltage and high-current power LEDs, one LED chip and one PN junction, the working current is as large as 0.35A or even several A, and the electric power of 1W to several W or more is concentrated in 1 to several square millimeters. On the chip, and its external quantum efficiency is only about 30%, plus the energy difference between the injected electrons and the generated photons, the energy difference between the photons generated by the PN junction and the last outgoing photons, about 70% of the electric power will be converted into heat How to dissipate this large amount of heat has always been one of the key problems of LED filament lamps. LED is a semiconductor device, the rise of the junction temperature of its PN junction will lead to a rapid decline in luminous efficiency, or even burn the PN junction, and as the temperature rises, the silica gel used to wrap the LED chip will crack, which will directly affect the LED. Filament lamp life.

For a single LED, if the heat is concentrated in a chip with a small size and cannot be dissipated effectively, the temperature of the chip will rise, resulting in non-uniform distribution of thermal stress, and a decrease in chip luminous efficiency and phosphor lasing efficiency. Studies have shown that: when the temperature exceeds a certain value, the failure rate of the device will rise exponentially, and the reliability will drop by 10% for every 2°C increase in the component temperature. In order to ensure the life of the device, it is generally required that the junction temperature of the PN junction be below 110°C. With the temperature rise of the PN junction, the emission wavelength of the white LED device will be red-shifted. Statistics show that: at a temperature of 100°C, the wavelength can be red-shifted by 4~9nm, which will cause the YAG phosphor to increase as the temperature increases, resulting in an increase in the non-radiation of the phosphor, a decrease in the converted light energy, and a decrease in the conversion efficiency. Luminous intensity will decrease and white light chromaticity will deteriorate. Near room temperature, for every 1°C increase in temperature, the luminous intensity of the LED will decrease by about 1%.

The second is the problem of low power efficiency. Existing LED lamps are powered by AC power, and LED is a semiconductor device with a PN junction structure, which has a potential barrier potential, which forms a conduction threshold voltage. When the voltage value added to the LED exceeds this threshold voltage, the LED will be will be fully turned on. Take the mains 220V as an example, when the 220V mains is used for power supply, since the voltage of the alternating current changes according to the law of the sinusoidal function, the threshold voltage of the LED is 1.2 times the average voltage of 220V, that is, 260~280V, when the voltage is lower than this value, The LED light does not light up, so its power efficiency is only about 30%.

The third is the stroboscopic problem of LED lights. As mentioned above, when the voltage is lower than the threshold voltage of the LED, the LED light will not light up, thus causing the problem of stroboscopic flicker and causing harm to the human body. In order to solve the stroboscopic problem, someone added a filter capacitor to the driver to solve the stroboscopic problem. However, the capacitor is a device that is very sensitive to temperature, and the high temperature environment in the LED lamp will reduce the service life of the capacitor, thereby reducing the service life of the LED lamp.

Fourth, the driver of the existing LED lamp is generally placed in the lamp holder, and the lamp holder is a conductive metal, so the driver must be put on an insulating sleeve before being put into the lamp holder. Manual operation is required, the process is cumbersome, and the efficiency is low. Narrow and small, after putting into the driver, the bonding space between the lamp holder and the bulb shell is not enough, the bonding fastness is reduced, and it is easy to fall off, and the bonding needs to go through a high temperature of 300 degrees, which has a great impact on the life of the electronic components in the driver. Comprehensive failure High rate.

In order to solve this problem, some people built the power supply into the bulb shell, but as mentioned above, the capacitor in the driver is a device that is very sensitive to temperature, and when the LED lamp is working, the temperature inside the bulb shell will be very high, which is easy to cause Capacitor damage will affect the service life of LED lights. On the other hand, the volume of the capacitor is also relatively large, and the installation inside the bulb shell will also complicate the production process.

The 5th, existing LED lamp generally adopts the stem column that has support, and described support is the glass support that extends into the bulb center, and LED filament is scattered and fixed on the glass support. LED filament is a fine and tiny industrial part product, only automatic machine production can maintain their consistency and reliability. Therefore, the production of filament substrate base material, the installation of pins and brackets, the binding and solidification of LED lamp beads, the connection of gold wires, the coating of phosphor powder, etc. should all be automatically completed in industrial automatic production machinery and equipment. One end of the existing LED filament is welded to the upper end of the bracket, and the other end is welded to the lower end of the core seat. The welding points are divided into upper and lower ends, and the existing LED filaments are generally connected in series or in parallel to meet the voltage requirements, which requires more The LED filament, the welding points are further increased, and the wick assembly is more complicated.

In summary, in order to further develop LED lamps, the prior art still needs to be further improved and developed.

Contents of the invention

The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and deficiencies in the prior art. Correspondingly, the object of the present invention is to provide a 4π light-emitting LED lamp with excellent heat dissipation performance, simple production process, no flicker, high power supply efficiency and long service life.

In order to solve the above problems, the technical solution of the present invention is as follows:

A built-in power LED lamp with a 4π light-emitting board, including a bulb shell, a core seat with an exhaust pipe, a capacitor, a lamp holder, and a 4π LED light-emitting plate; the bulb shell and the core seat are vacuum-sealed to form a vacuum-sealed cavity, The vacuum-sealed cavity is provided with a high thermal conductivity gas; the 4πLED light-emitting panel is located inside the vacuum-sealed cavity, and is fixed on the core base by at least two metal wires. The driver and several LED chips on the board-type substrate, the board-type substrate is transparent, the driver is electrically connected to the LED chips, the LED chips are connected in series or in parallel, and the front and back sides of the 4πLED light-emitting board are provided with A fluorescent glue layer, the fluorescent glue layer includes a heat radiation material with a refractive index greater than 1.4 and a heat radiation rate greater than 0.8; the capacitor is arranged in the lamp holder outside the vacuum-sealed cavity, and is electrically connected to the driver through the metal wire .

Further, the plate substrate is any one of a rectangular substrate, a square substrate, a circular substrate, an elliptical substrate or an irregularly shaped substrate, and the plate substrate is a transparent glass substrate, a transparent or translucent ceramic substrate of any kind.

Further, the plate substrate is placed vertically, horizontally or obliquely.

Further, the LED chips are arranged on one or both sides of the 4π light-emitting panel.

Further, the number of the metal wires is 2 or 4.

Further, the fluorescent adhesive layer includes fluorescent powder, thermal radiation material and colloid, the mass of the thermal radiation material accounts for 0.5-10% of the total mass of the fluorescent adhesive layer; the mass of the fluorescent powder accounts for 0.5% to 10% of the total mass of the fluorescent adhesive 25-45% of the total mass of the fluorescent adhesive layer; the mass of the colloid accounts for 45-74.5% of the total mass of the fluorescent adhesive layer.

Further, the refractive index of the heat radiation material is composed of one or more of mica powder, boron nitride, aluminum oxide, silicon oxide or calcium fluoride, and may also be composed of mica powder and boron nitride, aluminum oxide, silicon oxide Or one or more covalent bonds in calcium fluoride.

Further, the bulb shell is a silicate-based glass bulb shell with an infrared transmittance greater than 0.8.

Further, the driver also includes a driver housing and a driving circuit; the driving circuit is located inside the driver housing, and the driving circuit is any one of a resistance-capacitance step-down power supply, a linear constant current power supply or a switching constant current power supply kind.

Further, the bulb shell adopts A-type bulb, G-type bulb, PAR-type bulb, T-type bulb, candle-type bulb, P-type bulb, PS-type bulb, BR-type bulb, ER-type bulb Blister shell or BRL type bulb shell; the lamp holder adopts E12 type, E14 type, E27 type, E26 type, E40 type, GU type, BX type, BA type, EP type, EX type, GY type, GX type, GR type , GZ type or G type.

The beneficial effects of the present invention include:

Safe and reliable, long life. The present invention provides a built-in power supply LED lamp with 4π luminous boards. The driver is arranged on the 4π LED luminous boards and placed in a sealed bulb shell. Because the high working voltage is isolated in the bulb shell, it is safe and reliable. , to overcome the problem that the existing LED light bulb radiator is easy to carry high voltage and is unsafe; the driver is placed in the bulb shell with a large space, which does not affect the bonding of the lamp cap and the bulb shell, so that the lamp cap and the bulb shell The bonding is the same as that of traditional incandescent lamps, and it can be assembled by machine, which greatly improves the production efficiency and ensures the life of the electronic components of the driver. Moreover, both the driver and the LED filament are sealed in a bulb filled with inert gas, which can also avoid the influence of water vapor in the surrounding environment and have a long service life.

high productivity. The present invention adopts 4πLED light-emitting board, and arranges several LED chips electrically connected in series or in series-parallel on a transparent board-type substrate, realizes 360-degree omni-directional light emission, can integrate a large number of LEDs, has fewer soldering points, and simplifies the production process , greatly improving production efficiency. However, in the existing LED lights using light strips, the number of LED chips placed on each light strip is limited, and only a plurality of light strips can be used for combination. Both ends of each light strip need to be welded, and the production process is complicated.

Good cooling effect. Aiming at the heat dissipation problem caused by the driver and the LED chip, the present invention is provided with a fluorescent glue layer on both sides of the 4πLED luminous panel, and the heat radiation material is combined in the fluorescent glue, which can directly convert the heat generated by the LED chip and the fluorescent glue into 2 The infrared wave of ~20μm is transmitted to the surrounding environment through the silicate glass bulb with an infrared transmittance greater than 0.8, without additional heat dissipation devices or spraying of heat dissipation coatings, and the heat dissipation performance is good; moreover, the bulb inside the bulb shell The gas with high thermal conductivity can also conduct heat to the glass bulb through gas convection, and then conduct it to the surrounding environment, realizing heat dissipation in multiple directions.

High power utilization. The driver of the present invention is also connected with the capacitor. When the rectified voltage is higher than the capacitor voltage, the capacitor is charged, and when the rectified voltage is lower than the capacitor voltage, the capacitor is discharged, so that the output voltage is basically stable, thereby utilizing the capacitor filter feature to improve the power utilization rate, and In the present invention, the capacitor is arranged in the lamp holder outside the vacuum-sealed cavity, which solves the problem that the capacitor is easily damaged in a high-temperature environment, improves the service life of the capacitor, and solves the problem of stroboscopic flicker while improving the power supply efficiency.

Description of drawings

Fig. 1 is a schematic structural diagram of a LED lamp with a built-in power supply according to an embodiment of the invention.

Fig. 2 is a schematic structural diagram of a built-in power LED lamp with a 4π light-emitting panel according to yet another embodiment of the invention.

Fig. 3 is a schematic structural diagram of a 4π LED light-emitting panel with a built-in power supply.

Fig. 4 is a schematic diagram of the side structure of a 4πLED light-emitting panel with a built-in power supply.

Fig. 5 is a schematic cross-sectional structure diagram of a 4π LED light-emitting panel.

Fig. 6 is a schematic circuit diagram of the LED lamp with a built-in power supply of the present invention having a 4π light-emitting panel.

Fig. 7 is a schematic diagram of the structure of the LED lamp with a built-in power supply with a 4π light-emitting panel of the present invention.

Explanation of Reference Signs: 1. Bulb shell; 2. Core base; 3. Capacitor; 4. Lamp holder; 5. 4πLED light-emitting board; 6. High thermal conductivity gas; 7. Metal wire; 21. Exhaust pipe; 51. LED Chip; 52, plate substrate; 53, electrical connecting wire; 54, fluorescent adhesive layer; 55, driver.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " The orientation or positional relationship indicated by "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the Orientation or positional relationship is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

FIG. 1 is an embodiment of a power built-in LED lamp with a 4π light-emitting panel according to the present invention. The LED lamp with built-in power supply with 4π luminous board includes a bulb shell 1 , a core seat 2 with an exhaust pipe 21 , a capacitor 3 , a lamp holder 4 and a 4π LED luminous board 5 . In practical application, the bulb shell 1 and the core base 2 are welded and sealed by high-temperature heat treatment at the joint position to form a vacuum-sealed cavity. When sealing, after the vacuum-sealed cavity is evacuated through the exhaust pipe 21, the high thermal conductivity gas 6 is filled. The high thermal conductivity gas 6 is helium or hydrogen, or a mixed gas of helium and hydrogen. The gas pressure is any value between 50-1520 Torr at room temperature, which is easy to form effective convection heat dissipation. The 4πLED light-emitting panel 5 The heat generated during work is taken away. Further, each component is protected by inert gas such as helium and sealed in a vacuum, so it is completely free from the influence of water vapor in the surrounding environment, making the LED longer service life.

In practical application, referring to FIG. 1 or FIG. 2 , the exhaust pipe 21 is located inside the core base 2 , and the end port of the exhaust pipe 21 is provided with a fusing head.

In practical application, the core base 2 does not have the long and narrow pillars or brackets extending into the bulb shell for fixing the LED filament in the prior art. When performing the wick assembly process, the 4πLED light-emitting board 5 can be directly welded to the upper end of the core base 2 through the metal wire 7, and the number of welding points is small, which simplifies the production process. In practical applications, there may be two or four metal wires 7, and in this embodiment, there are four metal wires, so that the 4πLED light-emitting board 5 is fixed on the core base 2 more firmly. Preferably, the metal wire 7 can be made of hard metal to enhance its mechanical strength and ensure the stability of the 4πLED light-emitting panel 5 when fixed.

As shown in FIG. 1 , the 4πLED light-emitting board 5 is located inside the vacuum-sealed cavity and is fixed on the core base 2 through the metal wire 7 . The 4πLED light-emitting board 5 includes a transparent plate substrate 52 . Preferably, the plate substrate 52 can be placed vertically, horizontally or obliquely. In this embodiment, the plate substrate 52 is placed vertically. Preferably, the plate substrate 52 may be any one of a rectangular substrate, a square substrate, a circular substrate, an elliptical substrate or an irregular substrate. In this embodiment, the plate substrate 52 is a rectangular substrate. Further, the plate substrate 52 is a transparent glass substrate or a transparent ceramic substrate, and may also be a translucent ceramic substrate, and the light emitted by several LED chips 51 arranged on the plate substrate 52 is emitted to the transparent substrate to realize omnidirectional The light output is 4π light emission, and because the vacuum-sealed cavity is filled with high thermal conductivity gas 6 for rapid heat dissipation, it is not necessary to use materials that can withstand the high temperature generated by the LED chip 51. The transparent glass or transparent ceramic material used in the transparent substrate 52 of the present invention It is relatively cheap and can greatly reduce the manufacturing cost of the 4πLED light-emitting panel 5. In this embodiment, the transparent substrate 52 is a transparent glass substrate.

As shown in FIG. 1 , the 4πLED light-emitting panel 5 also includes a driver 55 and several LED chips 51 arranged on the panel substrate 52 . In practical applications, the driver 55 may include a driver housing and a driving circuit, the driving circuit is located inside the driver housing, and the driving circuit is any one of a resistance-capacitance step-down power supply, a linear constant current power supply or a switching constant current power supply. One, in this embodiment, the drive circuit is a linear constant current power supply, as shown in FIG. 7 , specifically a bridge rectifier circuit with four diodes. Several LED chips 51 are electrically connected in series or series-parallel by means of electrical connection wires 53 , and further, the driver 55 is electrically connected with the LED chip groups electrically connected in series or series-parallel. As shown in FIG. 7 , the chipset is connected in parallel with the capacitor 3 , and the utilization rate of the power supply is improved by using the capacitance filtering feature. The circuit principle is shown in FIG. 6 .

As shown in FIG. 3 , the driver 55 is electrically connected to the LED chipset and packaged on the 4πLED light-emitting board 5 by means of the fluorescent adhesive layer 54 . As shown in FIG. 1 , the capacitor 3 is arranged in the lamp holder 4 outside the vacuum-sealed cavity, and the driver 55 is electrically connected to the capacitor 3 through the metal wire 7 . In the embodiment shown in FIG. 1 , the driver 55 is electrically connected to the capacitor 3 through two of the four metal wires 7 . In practical applications, the LED chip 51 is one of a blue LED chip, a red LED chip, a green LED chip, a yellow LED chip, a purple LED chip or any combination thereof. Further, the LED chips 51 are arranged on one or both sides of the plate substrate 52. In the embodiment of FIG. 360-degree omni-directional light emission can be realized with a small number of LED chips 51 on one side of the light emitting diode, and the luminous efficiency is high.

As shown in FIG. 3 , fluorescent adhesive layers 54 are provided on the front and back sides of the 4πLED light-emitting board 5 to ensure that the filaments are completely covered by the phosphor powder layer and will not leak blue light. Further, the fluorescent adhesive layer 54 includes fluorescent powder, thermal radiation material and colloid, the mass of the thermal radiation material accounts for 0.5-10% of the total mass of the fluorescent adhesive layer; the mass of the fluorescent powder accounts for 25-45% of the total mass of the adhesive layer; the mass of the colloid accounts for 45-74.5% of the total mass of the fluorescent adhesive layer.

In practical applications, the fluorescent powder is YAG series yellow powder, yellow-green powder, or silicate series yellow powder, yellow-green powder, orange powder, or nitride, nitrogen oxide series red powder or YAG series phosphor, silicic acid Any combination of salt series phosphors, nitrides, and nitrogen oxide series phosphors, the particle size of the phosphors is 5-20um.

In practical applications, the thermal radiation material has a refractive index greater than 1.4 and a thermal radiation rate greater than 0.8, preferably, it is composed of one or more of mica powder, boron nitride, aluminum oxide, silicon oxide or calcium fluoride, It can also be formed by combining mica powder with one or more covalent bonds of boron nitride, aluminum oxide, silicon oxide or calcium fluoride. Mica powder and other heat radiation materials are bonded through bonds, which have It has a more stable structure, and mica powder can also be used as a good dispersant and coupling agent to evenly disperse heat radiation materials and phosphors into the colloid.

Wherein, the colloid is methyl organic silica gel or phenyl organic silica gel, for example, it can be one or more of organic silica gel, epoxy resin, modified epoxy resin, plastic, transparent glue, transparent lacquer and polymer kind. Since the refractive index of this type of glue is similar to that of the glass substrate or the translucent ceramic substrate, the light loss of the light emitted by the LED on the interface of each medium is very small, so the 4π light emission rate of the LED is high.

Correspondingly, the bulb shell 1 is a silicate-based glass bulb with an infrared transmittance greater than 0.8. The silicate-based glass bulb has a good infrared transmittance, and the infrared transmittance is above 0.9. When heat is converted into infrared waves, It can be transmitted efficiently and easily. In practical applications, according to different requirements, the bulb shell 1 can be a transparent bulb, a milky white bulb, a frosted bulb, a colored bulb, a bulb with a reflective layer on a part of the surface, or a bulb with a prism on a part of the surface. , Blister shells or silicon-based bulbs with lenses on part of the surface.

In practical applications, according to different requirements, the bulb shell 1 can adopt A-type bulbs, G-type bulbs, PAR-type bulbs, T-type bulbs, candle-type bulbs, P-type bulbs, PS-type bulbs, BR type bulb, ER type bulb or BRL type bulb; the lamp cap adopts E12 type, E14 type, E27 type, E26 type, E40 type, GU type, BX type, BA type, EP type, EX type, GY type Type, GX type, GR type, GZ type or G type to suit different lamp holders. As shown in FIG. 2 or FIG. 3 , the light bulb shell 1 in these embodiments adopts an A60 type light bulb shell, which is one of the light bulb shells of existing light bulbs.

Fig. 2 is yet another embodiment of a power built-in LED lamp with a 4π light-emitting panel according to the present invention. In this embodiment, the plate substrate 52 is placed horizontally. Preferably, in this embodiment, there are four metal wires 7 for fixing the 4πLED light-emitting board 5 on the core base 2, so as to enhance the stability of the board-type substrate 52 placed horizontally. In this embodiment, the plate substrate 52 is elliptical, and the LED chip group and the driver 55 electrically connected in series or series-parallel are packaged on the opposite side of the plate substrate 52 and the core base 2 by means of the fluorescent adhesive layer 54 . A small number of LED chips 51 can realize 360-degree omni-directional light emission. Other settings in this embodiment are the same as those in the embodiment in FIG. 1 .

In the present invention, the driver 55 is arranged on the 4πLED light-emitting board 5 and placed in the sealed bulb shell 1. Because the high working voltage is isolated in the bulb shell, it is safe and reliable, and overcomes the problem that the radiator of the existing LED light bulb is easy to be high. Piezoelectricity, unsafe problem; the present invention adopts 4πLED light-emitting board, and a plurality of LED chips 51 electrically connected in series or series-parallel are arranged on a transparent plate substrate, and a large number of LEDs can be integrated, with fewer welding points and simplified The production process greatly improves the production efficiency; wherein the front and back sides of the 4πLED light-emitting board 5 are provided with a fluorescent glue layer 54, and the fluorescent glue is combined with a heat radiation material, which can directly combine the LED chip 51 and the fluorescent glue layer 54 to produce The heat is converted into 2~20μm infrared waves, and then transmitted to the surrounding environment through the silicate glass bulb with an infrared transmittance greater than 0.8. The high thermal conductivity gas in 1 can also conduct heat to the glass bulb through gas convection, and then conduct it to the surrounding environment to realize heat dissipation in multiple directions; and the driver 55 of the present invention is connected to the capacitor 3, when the rectified voltage is higher than the capacitance When the rectified voltage is lower than the capacitor voltage, the capacitor is charged, and the capacitor is discharged when the rectified voltage is lower than the capacitor voltage, so that the output voltage is basically stable, thereby using the capacitor filter feature to improve the power utilization rate, and the capacitor is arranged in the lamp holder outside the vacuum sealed cavity, which solves the problem Capacitors that are very sensitive to temperature are easily damaged in high temperature environments, which improves the service life of capacitors, thereby improving power supply efficiency and solving the problem of flickering LED lights.

It should be understood that the application of the present invention is not limited to the above examples, and those skilled in the art can make improvements or transformations according to the above descriptions, and all these improvements and transformations should belong to the protection scope of the appended claims of the present invention.

Claims (10)

1. a kind of on-chip power type LED light with 4 π luminescent screens, which is characterized in that the core including bulb housing, with exhaust pipe Seat, capacitor, lamp cap and a 4 π LED lighting boards；The bulb housing forms vacuum sealing cavity, institute with core print seat vacuum sealing It states and is equipped with high thermal conductivity gas in vacuum-sealed cavity body；The 4 π LED lighting boards are located at vacuum sealing inside cavity, by least Two wires are fixed on core print seat, and the 4 π LED lighting boards include plate type substrate and are arranged on the plate type substrate Driver and several LED chips, the plate type substrate are transparent, and the driver is electrically connected with LED chip, the LED Chip is serially connected or connection in series-parallel connection, the tow sides of the 4 π LED lighting boards are provided with fluorescent adhesive layer, the fluorescent adhesive layer Including refractive index is more than 1.4 and thermal-radiating material of the thermal emissivity rate more than 0.8；The capacitor setting is external in vacuum-sealed cavity In the lamp cap, it is electrically connected with the driver by the metal wire.

2. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the board-like base Plate is any one of rectangular substrate, square substrate, circular substrate, elliptical base or irregular shape substrate, described board-like Substrate is transparent glass substrate, transparent or semitransparent any one of ceramic substrate.

3. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the board-like base Plate be vertically put, level is put or is tilted and is put.

4. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the LED chip One or both sides in the 4 π luminescent screens are set.

5. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the metal wire Quantity be 2 or 4.

6. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the fluorescent glue Layer includes fluorescent powder, thermal-radiating material and colloid, and the quality of the thermal-radiating material accounts for the 0.5 of the fluorescent adhesive layer gross mass ~10%；The quality of the fluorescent powder accounts for the 25 ~ 45% of the fluorescent adhesive layer gross mass；The quality of the colloid accounts for the fluorescent glue The 45 ~ 74.5% of layer gross mass.

7. the on-chip power type LED light with 4 π luminescent screens according to claim 1 or 6, which is characterized in that the hot spoke Refractive Index of Material is penetrated to be made of one or more in mica powder, boron nitride, aluminium oxide, silica or calcirm-fluoride, it also can be by cloud Female powder is formed with one or more Covalent bonding togethers in boron nitride, aluminium oxide, silica or calcirm-fluoride.

8. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the bulb housing It is more than 0.8 silicate Glass blister for ir transmissivity.

9. the on-chip power type LED light with 4 π luminescent screens as described in claim 1, which is characterized in that the driver is also Including actuator housing and driving circuit；The driving circuit is located at the inside of actuator housing, and the driving circuit is capacitance-resistance Any one of voltage dropping power supply, linear constant current power supply or switch constant-current supply.

10. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the bulb housing Using A types blister, G types blister, PAR types blister, T-type blister, candle type blister, p-type blister, PS types blister, BR types blister, ER types Blister or BRL type blisters；The lamp cap is using E12 types, E14 types, E27 types, E26 types, E40 types, GU types, BX types, BA types, EP Type, EX types, GY types, GX types, GR types, GZ types or G types.