CN108493296A - A kind of flexible CdTe thin film solar cell and its preparation method and application - Google Patents
A kind of flexible CdTe thin film solar cell and its preparation method and application Download PDFInfo
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- 239000010409 thin film Substances 0.000 title claims abstract description 29
- 229910004613 CdTe Inorganic materials 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 239000010410 layer Substances 0.000 claims abstract description 95
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 230000008021 deposition Effects 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims description 26
- 238000000151 deposition Methods 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 15
- 239000000243 solution Substances 0.000 claims description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- 229910007709 ZnTe Inorganic materials 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 238000002207 thermal evaporation Methods 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 239000010408 film Substances 0.000 claims description 6
- 229920006332 epoxy adhesive Polymers 0.000 claims description 5
- -1 polyethylene naphthalate Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052794 bromium Inorganic materials 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000314 transition metal oxide Inorganic materials 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000012459 cleaning agent Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920006393 polyether sulfone Polymers 0.000 claims description 2
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 230000002745 absorbent Effects 0.000 claims 2
- 239000002250 absorbent Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 229910015844 BCl3 Inorganic materials 0.000 claims 1
- YKYOUMDCQGMQQO-UHFFFAOYSA-L Cadmium chloride Inorganic materials Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 claims 1
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 claims 1
- 239000004425 Makrolon Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 229910017629 Sb2Te3 Inorganic materials 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 238000003486 chemical etching Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000008020 evaporation Effects 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L magnesium chloride Substances [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims 1
- 229910001629 magnesium chloride Inorganic materials 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000001020 plasma etching Methods 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 238000005092 sublimation method Methods 0.000 claims 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 6
- 239000002346 layers by function Substances 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 51
- 229910052782 aluminium Inorganic materials 0.000 description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 22
- 229910006404 SnO 2 Inorganic materials 0.000 description 10
- 238000002202 sandwich sublimation Methods 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- LHQLJMJLROMYRN-UHFFFAOYSA-L cadmium acetate Chemical compound [Cd+2].CC([O-])=O.CC([O-])=O LHQLJMJLROMYRN-UHFFFAOYSA-L 0.000 description 4
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 3
- 239000005695 Ammonium acetate Substances 0.000 description 3
- 229910008449 SnF 2 Inorganic materials 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 229940043376 ammonium acetate Drugs 0.000 description 3
- 235000019257 ammonium acetate Nutrition 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 229920006335 epoxy glue Polymers 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VXAPDXVBDZRZKP-UHFFFAOYSA-N nitric acid phosphoric acid Chemical compound O[N+]([O-])=O.OP(O)(O)=O VXAPDXVBDZRZKP-UHFFFAOYSA-N 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- MODGUXHMLLXODK-UHFFFAOYSA-N [Br].CO Chemical compound [Br].CO MODGUXHMLLXODK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/125—The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe
- H10F71/1253—The active layers comprising only Group II-VI materials, e.g. CdS, ZnS or CdTe comprising at least three elements, e.g. HgCdTe
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
本发明属于光伏新能源材料与器件领域,公开了一种柔性CdTe薄膜太阳电池及其制备方法和应用。本发明通过开始时引入临时金属衬底沉积电池功能层,并在电池制备结束后刻蚀掉临时金属衬底薄层的方式,使得能够在临时金属衬底上采用成熟的上基板结构CdTe电池制备工艺获得下基板结构的柔性CdTe太阳电池,避免了下基板结构电池制备中由于功能层沉积顺序导致的背接触制备、Cu掺杂、CdS/CdTe热处理等的技术限制,有利于实现电池制备技术的最优化。
The invention belongs to the field of photovoltaic new energy materials and devices, and discloses a flexible CdTe thin-film solar cell and a preparation method and application thereof. The present invention introduces a temporary metal substrate to deposit the functional layer of the battery at the beginning, and etches off the thin layer of the temporary metal substrate after the battery is prepared, so that the mature upper substrate structure CdTe battery can be prepared on the temporary metal substrate The process obtains flexible CdTe solar cells with lower substrate structure, which avoids the technical limitations of back contact preparation, Cu doping, CdS/CdTe heat treatment, etc. due to the deposition sequence of functional layers in the preparation of lower substrate structure cells, and is conducive to the realization of cell preparation technology. optimize.
Description
技术领域technical field
本发明属于光伏新能源材料与器件领域,特别涉及一种柔性CdTe薄膜太阳电池及其制备方法和应用。The invention belongs to the field of photovoltaic new energy materials and devices, in particular to a flexible CdTe thin film solar cell and its preparation method and application.
背景技术Background technique
碲化镉(CdTe)是禁带宽度为1.45eV的直接带隙半导体,对可见光的吸收系数高于硅材料100倍,是一种理想的光伏材料。CdTe薄膜太阳电池是基于n-CdS/p-CdTe异质结结构的薄膜太阳电池器件。目前CdTe太阳电池的实验室最高转换效率为22.1%,组件转换效率为18.6%,理论转换效率可达33%。CdTe薄膜太阳电池作为最具竞争力的太阳电池之一,兼具高转换效率和低成本,经过近20年的快速发展,已成为目前光伏产品市场上晶硅太阳电池以外的第二大产品体系,极具研究价值和市场潜力。值得指出的是,高效率CdTe薄膜太阳电池普遍采用的是刚性衬底,如硼硅玻璃衬底等,刚性衬底的太阳电池由于没有柔软的特性而无法满足许多领域的应用需求。作为CdTe太阳电池的重要分支,柔性CdTe太阳电池可以集成在窗户或屋顶、外墙或内墙上,实现光伏建筑一体化;还可以应用于便携式光伏产品方面,如太阳能汽车、太阳能飞行器、太阳能帐篷、太阳能背包等,是CdTe太阳电池未来重要的研究和发展方向。Cadmium telluride (CdTe) is a direct bandgap semiconductor with a bandgap width of 1.45eV, and its absorption coefficient for visible light is 100 times higher than that of silicon, so it is an ideal photovoltaic material. CdTe thin film solar cell is a thin film solar cell device based on n-CdS/p-CdTe heterojunction structure. At present, the highest laboratory conversion efficiency of CdTe solar cells is 22.1%, the module conversion efficiency is 18.6%, and the theoretical conversion efficiency can reach 33%. As one of the most competitive solar cells, CdTe thin-film solar cell has both high conversion efficiency and low cost. After nearly 20 years of rapid development, it has become the second largest product system in the current photovoltaic product market after crystalline silicon solar cells. , with great research value and market potential. It is worth pointing out that high-efficiency CdTe thin-film solar cells generally use rigid substrates, such as borosilicate glass substrates, etc. Solar cells with rigid substrates cannot meet the application requirements of many fields due to their lack of softness. As an important branch of CdTe solar cells, flexible CdTe solar cells can be integrated on windows or roofs, exterior walls or interior walls to realize building-integrated photovoltaics; they can also be applied to portable photovoltaic products, such as solar cars, solar aircraft, and solar tents , solar backpacks, etc., are important research and development directions for CdTe solar cells in the future.
目前,柔性CdTe太阳电池的最高转换效率为16.4%,远低于传统的基于玻璃基板的CdTe太阳电池的最高转换效率。区别于传统CdTe太阳电池的上基板(superstrate)结构(沿光入射方向:玻璃基板/透明导电层/n-CdS/p-CdTe/背接触/金属电极),柔性CdTe太阳电池通常采用下基板(substrate)结构(沿光入射方向:透明导电层/n-CdS/p-CdTe/背接触/导电基板),电池结构上的差异使得柔性CdTe太阳电池不能采用传统CdTe太阳电池成熟的制备工艺,尤其是低阻背接触制备工艺。虽然针对下基板结构CdTe太阳电池的工艺特点已经进行了一些探索,但受到电池结构上的限制,柔性太阳电池的制备存在着难以克服技术瓶颈(背接触界面工程、CdCl2“激活”热处理等),器件性能一直不能得到有效提升。在此背景下,如何创新柔性CdTe太阳电池制备工艺,使得柔性CdTe太阳电池结构能够兼容传统上基板CdTe太阳电池成熟的制备工艺,是提高柔性CdTe太阳电池光电转换性能的可行和相对廉价的技术路径。Currently, the highest conversion efficiency of flexible CdTe solar cells is 16.4%, which is much lower than that of traditional CdTe solar cells based on glass substrates. Different from the upper substrate (superstrate) structure of traditional CdTe solar cells (along the direction of light incidence: glass substrate/transparent conductive layer/n-CdS/p-CdTe/back contact/metal electrode), flexible CdTe solar cells usually use the lower substrate ( substrate) structure (along the direction of light incidence: transparent conductive layer/n-CdS/p-CdTe/back contact/conductive substrate), the difference in cell structure makes flexible CdTe solar cells unable to adopt the mature preparation process of traditional CdTe solar cells, especially It is a low resistance back contact preparation process. Although some explorations have been made on the process characteristics of CdTe solar cells with a lower substrate structure, due to the limitations of the cell structure, there are technical bottlenecks that are difficult to overcome in the preparation of flexible solar cells (back contact interface engineering, CdCl 2 "activation" heat treatment, etc.) , the performance of the device has not been effectively improved. In this context, how to innovate the fabrication process of flexible CdTe solar cells so that the structure of flexible CdTe solar cells can be compatible with the mature fabrication process of traditional substrate CdTe solar cells is a feasible and relatively cheap technical path to improve the photoelectric conversion performance of flexible CdTe solar cells .
发明内容Contents of the invention
为了克服上述现有技术的缺点与不足,本发明的首要目的在于提供一种柔性CdTe薄膜太阳电池的制备方法。该制备方法可以采用传统上基板结构CdTe太阳电池的成熟制备工艺获得下基板结构的柔性CdTe薄膜太阳电池,这个方法避免了直接在柔性衬底上生长功能层的固有缺陷,同时实现了柔性CdTe太阳电池与传统上基板CdTe太阳电池成熟制备工艺的兼容。In order to overcome the above-mentioned shortcomings and deficiencies of the prior art, the primary purpose of the present invention is to provide a method for preparing a flexible CdTe thin film solar cell. The preparation method can adopt the mature preparation process of the traditional upper substrate structure CdTe solar cell to obtain the flexible CdTe thin film solar cell with the lower substrate structure. The battery is compatible with the mature preparation process of traditional substrate CdTe solar cells.
本发明的另一目的在于提供一种上述方法制备得到的柔性CdTe薄膜太阳电池。Another object of the present invention is to provide a flexible CdTe thin film solar cell prepared by the above method.
本发明的再一目的在于提供上述柔性CdTe薄膜太阳电池的应用。Another object of the present invention is to provide the application of the above-mentioned flexible CdTe thin film solar cell.
本发明的目的通过下述方案实现:The object of the present invention is achieved through the following solutions:
一种柔性CdTe薄膜太阳电池的制备方法,其主要包括以下步骤:A preparation method for a flexible CdTe thin film solar cell, which mainly includes the following steps:
(1)提供临时金属衬底并对其进行清洗预处理;(1) Provide a temporary metal substrate and perform cleaning pretreatment on it;
(2)在清洗预处理后的临时金属衬底表面沉积透明导电层;(2) Depositing a transparent conductive layer on the surface of the temporary metal substrate after cleaning and pretreatment;
(3)在透明导电层上沉积窗口层;(3) depositing a window layer on the transparent conductive layer;
(4)在窗口层上沉积吸收层,并进行热处理;(4) Depositing an absorbing layer on the window layer and performing heat treatment;
(5)对热处理后的吸收层进行反应刻蚀,然后沉积背接触层;(5) Reactive etching is carried out to the heat-treated absorber layer, and then the back contact layer is deposited;
(6)在背接触层上沉积背电极层;(6) depositing a back electrode layer on the back contact layer;
(7)提供柔性衬底,并将柔性衬底的表面通过粘胶贴合在背电极层上;(7) A flexible substrate is provided, and the surface of the flexible substrate is bonded to the back electrode layer by adhesive;
(8)刻蚀剥离掉临时金属衬底,得到包含透明导电层、窗口层、吸收层、背接触层、背电极层、粘胶层、柔性衬底的柔性CdTe薄膜太阳电池。(8) Etching and peeling off the temporary metal substrate to obtain a flexible CdTe thin film solar cell comprising a transparent conductive layer, a window layer, an absorber layer, a back contact layer, a back electrode layer, an adhesive layer, and a flexible substrate.
步骤(1)中所述的临时金属衬底主要用作沉积后续功能层的支撑衬底,可为廉价的金属材料,如铝(Al)、钼(Mo)等,厚度为0.5~3mm;步骤(1)中所述的预处理是指用清洗剂对临时金属衬底表面进行清洗,然后超声清洗,再用水冲洗干净,并用N2吹干。The temporary metal substrate described in step (1) is mainly used as a supporting substrate for depositing subsequent functional layers, and can be a cheap metal material, such as aluminum (Al), molybdenum (Mo), etc., with a thickness of 0.5 to 3 mm; The pretreatment described in (1) refers to cleaning the surface of the temporary metal substrate with a cleaning agent, then cleaning it ultrasonically, rinsing it with water, and drying it with N2 .
步骤(2)中所述的透明导电层为SnO2:F(FTO)薄膜,透明导电层的厚度为300-500nm;The transparent conductive layer described in step (2) is SnO 2 : F(FTO) film, and the thickness of the transparent conductive layer is 300-500nm;
步骤(2)中所述的沉积透明导电层可通过磁控溅射FTO陶瓷靶材。The deposition of the transparent conductive layer described in step (2) can be done by magnetron sputtering FTO ceramic target.
步骤(3)中所述的窗口层为CdS或CdS:O,厚度为50~200nm;步骤(3)中所述的CdS可通过化学水浴法或磁控溅射法制备得到,所述的CdS:O可通过反应磁控溅射法获得。The window layer described in step (3) is CdS or CdS:O, with a thickness of 50-200nm; the CdS described in step (3) can be prepared by chemical water bath method or magnetron sputtering method, and the described CdS :O can be obtained by reactive magnetron sputtering.
步骤(4)中所述的吸收层为CdTe层,厚度为2~6μm;步骤(4)中所述的沉积吸收层的方法可为近空间升华法或者气相输运法。The absorbing layer described in the step (4) is a CdTe layer with a thickness of 2-6 μm; the method of depositing the absorbing layer described in the step (4) can be a close space sublimation method or a gas phase transport method.
步骤(4)中所述的热处理指将沉积了吸收层的样品置于含CdCl2(或MgCl2)和O2的气氛下进行热处理,热处理温度为350~420℃,热处理时间为10~30分钟。热处理可提高电池的效率。The heat treatment described in step (4) refers to placing the sample deposited with the absorbing layer in an atmosphere containing CdCl 2 (or MgCl 2 ) and O 2 for heat treatment, the heat treatment temperature is 350-420°C, and the heat treatment time is 10-30 minute. Heat treatment increases the efficiency of the battery.
步骤(5)中所述的背接触层为对吸收层CdTe表面Cu掺杂形成的表面p型重掺杂层或高功函数缓冲层;The back contact layer described in step (5) is a surface p-type heavily doped layer or a high work function buffer layer formed by doping Cu on the surface of the absorbing layer CdTe;
优选的,当所述的背接触层为对吸收层CdTe表面Cu掺杂形成的表面p型重掺杂层时,沉积背接触层的方法为:首先采用刻蚀液对CdTe表面进行化学刻蚀,刻蚀时间为5-50s,然后热蒸发或磁控溅射法沉积Cu薄层,Cu在CdTe表面的厚度为2~5nm;其中刻蚀液为体积比为1:1000-1:100的溴和甲醇的混合溶液、或体积比为70:1:29的85%磷酸、68%硝酸和水的混合溶液;Preferably, when the back contact layer is a surface p-type heavily doped layer formed by doping Cu on the surface of the absorbing layer CdTe, the method for depositing the back contact layer is: firstly use an etching solution to chemically etch the CdTe surface , the etching time is 5-50s, and then a thin layer of Cu is deposited by thermal evaporation or magnetron sputtering. A mixed solution of bromine and methanol, or a mixed solution of 85% phosphoric acid, 68% nitric acid and water with a volume ratio of 70:1:29;
优选的,当所述的背接触层为高功函数缓冲层时,沉积背接触层的方法为采用热蒸发或磁控溅射法沉积高功函数缓冲层,高功能函数缓冲层的厚度为5~100nm;所述的高功函数缓冲层可为金属碲化物(CuxTe、ZnTe、Sb2Te3、ZnTe:Cu、ZnTe:N等,其中x=1~2)或过渡金属氧化物(MoO3、WO3、V2O5等)。Preferably, when the back contact layer is a high work function buffer layer, the method of depositing the back contact layer is to deposit a high work function buffer layer by thermal evaporation or magnetron sputtering, and the thickness of the high function function buffer layer is 5 ~100nm; the high work function buffer layer can be a metal telluride ( CuxTe , ZnTe, Sb 2 Te 3 , ZnTe:Cu, ZnTe:N, etc., where x=1~2) or a transition metal oxide ( MoO 3 , WO 3 , V 2 O 5 , etc.).
步骤(6)中所述的背电极层包括金属背电极(Au、Mo等)、石墨等导电材料,当背电极层为金属背电极时,厚度为100~1000nm;当背电极层为石墨时,背电极厚度为1~10μm;The back electrode layer described in step (6) includes conductive materials such as metal back electrodes (Au, Mo, etc.), graphite, and when the back electrode layer is a metal back electrode, the thickness is 100 to 1000 nm; when the back electrode layer is graphite , the thickness of the back electrode is 1-10 μm;
当步骤(6)中所述的背电极层为金属背电极时,所述的沉积背电极层的方法为热蒸发法;当步骤(6)中所述的背电极层为石墨时,所述的沉积背电极层的方法为将石墨浆料涂覆在背接触层上,然后在200℃热处理10~30min;When the back electrode layer described in the step (6) is a metal back electrode, the method for depositing the back electrode layer is thermal evaporation; when the back electrode layer described in the step (6) is graphite, the The method of depositing the back electrode layer is to coat the graphite slurry on the back contact layer, and then heat-treat at 200°C for 10-30min;
步骤(7)中所述的柔性衬底材料可为聚酰亚胺、聚碳酸酯、聚萘二甲酸乙二醇酯、聚丙烯酸酯、聚砜或聚醚砜;所述粘胶优选为3吨型环氧胶层;The flexible substrate material described in the step (7) can be polyimide, polycarbonate, polyethylene naphthalate, polyacrylate, polysulfone or polyethersulfone; Described viscose is preferably 3 Ton-shaped epoxy adhesive layer;
步骤(8)中所述的刻蚀剥离主要采用干法刻蚀工艺去除临时金属衬底,同时不损伤沉积于衬底上的透明导电层。其具体方法为将步骤(7)中的产物放入金属刻蚀机台,向刻蚀反应腔通入刻蚀气体,调节腔内气体压强样品台偏置功率,利用刻蚀气体与金属表面的轰击反应去除金属衬底。The etching stripping described in step (8) mainly adopts a dry etching process to remove the temporary metal substrate without damaging the transparent conductive layer deposited on the substrate. The specific method is to put the product in step (7) into the metal etching machine, feed the etching gas into the etching reaction chamber, adjust the gas pressure in the chamber and the bias power of the sample stage, and utilize the contact between the etching gas and the metal surface. The bombardment reaction removes the metal substrate.
步骤(8)中所述的刻蚀气体可为Cl2、BCl3、Ar、N2、CHF3、CH4等;优选为Cl2。The etching gas described in step (8) can be Cl 2 , BCl 3 , Ar, N 2 , CHF 3 , CH 4 , etc.; preferably Cl 2 .
一种由上述方法制备得到的柔性CdTe薄膜太阳电池。A flexible CdTe thin film solar cell prepared by the above method.
上述的柔性CdTe薄膜太阳电池在柔性可穿戴光伏产品,光伏建筑一体化,便携式光伏产品及其他弯曲折叠类光伏产品中的应用。The application of the above-mentioned flexible CdTe thin film solar cell in flexible wearable photovoltaic products, photovoltaic building integration, portable photovoltaic products and other bending and folding photovoltaic products.
本发明相对于现有技术,具有如下的优点及有益效果:Compared with the prior art, the present invention has the following advantages and beneficial effects:
本发明通过开始时引入临时金属衬底沉积电池功能层,并在电池制备结束后刻蚀掉临时金属衬底薄层的方式,使得能够在临时金属衬底上采用成熟的上基板结构CdTe电池制备工艺获得下基板结构的柔性CdTe太阳电池,避免了下基板结构电池制备中由于功能层沉积顺序导致的背接触制备、Cu掺杂、CdS/CdTe热处理等的技术限制,有利于实现电池制备技术的最优化。The present invention introduces a temporary metal substrate to deposit the functional layer of the battery at the beginning, and etches off the thin layer of the temporary metal substrate after the battery is prepared, so that the mature upper substrate structure CdTe battery can be prepared on the temporary metal substrate The flexible CdTe solar cell with the lower substrate structure is obtained by the process, which avoids the technical limitations of back contact preparation, Cu doping, CdS/CdTe heat treatment, etc. caused by the deposition sequence of the functional layer in the preparation of the lower substrate structure cell, which is conducive to the realization of the battery preparation technology. optimize.
附图说明Description of drawings
图1为实施例2中制备得到的CdTe太阳电池在标准光强(AM1.5G,1000W/m2)下的电流-电压曲线。Fig. 1 is the current-voltage curve of the CdTe solar cell prepared in Example 2 under standard light intensity (AM1.5G, 1000W/m 2 ).
具体实施方式Detailed ways
下面结合实施例和附图对本发明作进一步详细的描述,但本发明的实施方式不限于此。The present invention will be further described in detail below with reference to the examples and drawings, but the implementation of the present invention is not limited thereto.
实施例中所用试剂如无特殊说明均可从市场常规购得。The reagents used in the examples can be routinely purchased from the market unless otherwise specified.
实施例1Example 1
(1)采用厚度为2mm的铝片作为临时衬底,使用铝用清洗液对铝表面进行清洗,超声清洗时间为5分钟,然后使用去离子水冲洗干净,并使用N2吹干。(1) Use an aluminum sheet with a thickness of 2 mm as a temporary substrate, and use an aluminum cleaning solution to clean the aluminum surface. The ultrasonic cleaning time is 5 minutes, then rinse it with deionized water, and dry it with N2 .
(2)采用磁控溅射的方法在铝衬底表面沉积透明导电氧化物SnO2:F(FTO),薄膜厚度约500nm。利用磁控溅射在Ar气氛下溅射SnO2:F靶材(摩尔比为10:1的SnO2和SnF2粉末混合热压靶材),衬底温度为200℃,溅射功率为90W,溅射时间30min。(2) The transparent conductive oxide SnO 2 :F(FTO) is deposited on the surface of the aluminum substrate by magnetron sputtering, and the film thickness is about 500nm. Using magnetron sputtering to sputter SnO 2 :F target (mixed SnO 2 and SnF 2 powder hot-pressed target with a molar ratio of 10:1) under Ar atmosphere, the substrate temperature is 200°C, and the sputtering power is 90W , sputtering time 30min.
(3)采用化学水浴(CBD)法在FTO表面沉积CdS,反应前驱物为乙酸铵(0.7708g)、乙酸镉(0.1333g)和硫脲(0.1903g),溶液体积为500mL,反应沉积温度为80℃,沉积时间为30分钟,CdS层厚度为100nm。(3) CdS was deposited on the surface of FTO by the chemical water bath (CBD) method, the reaction precursors were ammonium acetate (0.7708g), cadmium acetate (0.1333g) and thiourea (0.1903g), the solution volume was 500mL, and the reaction deposition temperature was 80°C, the deposition time is 30 minutes, and the thickness of the CdS layer is 100nm.
(4)采用近空间升华(CSS)法在CdS表面生长CdTe薄膜,生长温度为550℃,生长时间为5分钟,厚度约5μm。(4) A CdTe thin film was grown on the surface of CdS by the close-space sublimation (CSS) method, the growth temperature was 550° C., the growth time was 5 minutes, and the thickness was about 5 μm.
(5)将上述叠层置于包含CdCl2和O2的气氛环境中进行热处理,热处理温度为400℃,热处理时间为10分钟。(5) Place the above laminate in an atmosphere environment containing CdCl 2 and O 2 for heat treatment, the heat treatment temperature is 400° C., and the heat treatment time is 10 minutes.
(6)将上述样品放入磷酸硝酸溶液(体积比:68%硝酸:85%磷酸:水=1:70:29)中刻蚀50秒,刻蚀完成后用去离子水将样品表面冲洗干净,然后用N2吹干。(6) Put the above sample into phosphoric acid nitric acid solution (volume ratio: 68% nitric acid: 85% phosphoric acid: water = 1:70:29) and etch for 50 seconds, after the etching is completed, rinse the surface of the sample with deionized water , and then blow dry with N2 .
(7)将刻蚀完成的样品放入真空室,真空度为5×10‐6Pa,将掩膜版固定在样品表面,采用电子束蒸发法,在样品表面沉积2nm厚的Cu金属层,然后真空热蒸发沉积200nm厚的Au电极。(7) Put the etched sample into a vacuum chamber with a vacuum degree of 5× 10-6 Pa, fix the mask on the surface of the sample, and deposit a 2nm-thick Cu metal layer on the surface of the sample by electron beam evaporation. Then a 200 nm thick Au electrode was deposited by vacuum thermal evaporation.
(8)以聚丙烯酸酯衬底作为柔性衬底,将3吨型环氧胶的A胶和B胶等量的、均匀的涂覆在清洁干净的柔性衬底上,再将上述步骤(7)中Au电极表面层叠于涂覆有粘胶的柔性衬底表面上,并固化3小时,保证3吨型环氧胶完全固化,并使得Au电极牢固的层叠于柔性衬底上。(8) Using the polyacrylate substrate as a flexible substrate, apply the same amount of A glue and B glue of 3 tons of epoxy glue on the clean flexible substrate evenly, and then apply the above steps (7) ) in which the surface of the Au electrode is laminated on the surface of the flexible substrate coated with adhesive, and cured for 3 hours to ensure that the 3-ton epoxy adhesive is completely cured, and the Au electrode is firmly laminated on the flexible substrate.
(9)将步骤(1)中的铝衬底样品放入金属刻蚀反应腔,通入压强为10毫托的Cl2,调节双射频功率源的偏置功率为80W,源功率为40W,使用Cl2和铝表面接触轰击进行反应刻蚀,反应时间为40分钟,由于Cl2和FTO不能反应,所以待铝衬底完全去除,然后即可得到“FTO/CdS/CdTe/Cu‐Au/柔性衬底”结构的柔性CdTe太阳电池。(9) Put the aluminum substrate sample in step (1) into the metal etching reaction chamber, feed Cl 2 with a pressure of 10 mTorr, adjust the bias power of the dual radio frequency power source to 80W, and the source power to 40W, Use Cl 2 and aluminum surface contact bombardment to carry out reactive etching, and the reaction time is 40 minutes. Since Cl 2 and FTO cannot react, the aluminum substrate can be completely removed, and then the “FTO/CdS/CdTe/Cu‐Au/ Flexible CdTe solar cells with flexible substrate" structure.
实施例2Example 2
(1)采用厚度为1mm的铝片作为临时衬底,使用铝用清洗液对铝表面进行清洗,超声清洗时间为5分钟,然后使用去离子水冲洗干净,并使用N2吹干。(1) Use an aluminum sheet with a thickness of 1mm as a temporary substrate, clean the aluminum surface with an aluminum cleaning solution, and ultrasonically clean it for 5 minutes, then rinse it with deionized water, and dry it with N2 .
(2)采用磁控溅射的方法在铝衬底表面沉积透明导电氧化物SnO2:F(FTO),薄膜厚度约300nm。利用磁控溅射在Ar气氛下溅射SnO2:F靶材(摩尔比为10:1的SnO2和SnF2粉末混合热压靶材),衬底温度为200℃,溅射功率为90W,溅射时间20min。(2) The transparent conductive oxide SnO 2 :F(FTO) is deposited on the surface of the aluminum substrate by magnetron sputtering, and the film thickness is about 300nm. Using magnetron sputtering to sputter SnO 2 :F target (mixed SnO 2 and SnF 2 powder hot-pressed target with a molar ratio of 10:1) under Ar atmosphere, the substrate temperature is 200°C, and the sputtering power is 90W , sputtering time 20min.
(3)采用化学水浴(CBD)法在FTO表面沉积CdS,反应前驱物为乙酸铵(0.7708g)、乙酸镉(0.1333g)和硫脲(0.1903g),溶液体积为500mL,反应沉积温度为80℃,沉积时间为30分钟,CdS层厚度为100nm。(3) CdS was deposited on the surface of FTO by the chemical water bath (CBD) method, the reaction precursors were ammonium acetate (0.7708g), cadmium acetate (0.1333g) and thiourea (0.1903g), the solution volume was 500mL, and the reaction deposition temperature was 80°C, the deposition time is 30 minutes, and the thickness of the CdS layer is 100nm.
(4)采用近空间升华(CSS)法在CdS表面生长CdTe薄膜,生长温度为550℃,生长时间为5分钟,厚度约5μm。(4) A CdTe thin film was grown on the surface of CdS by the close-space sublimation (CSS) method, the growth temperature was 550° C., the growth time was 5 minutes, and the thickness was about 5 μm.
(5)将上述叠层置于包含CdCl2和O2的气氛环境中进行热处理,热处理温度为400℃,热处理时间为10分钟。(5) Place the above laminate in an atmosphere environment containing CdCl 2 and O 2 for heat treatment, the heat treatment temperature is 400° C., and the heat treatment time is 10 minutes.
(6)将上述样品放入磷酸硝酸溶液(体积比:68%硝酸:85%磷酸:水=1:70:29)中刻蚀50秒,刻蚀完成后用去离子水将样品表面冲洗干净,然后用N2吹干。(6) Put the above sample into phosphoric acid nitric acid solution (volume ratio: 68% nitric acid: 85% phosphoric acid: water = 1:70:29) and etch for 50 seconds, after the etching is completed, rinse the surface of the sample with deionized water , and then blow dry with N2 .
(7)将刻蚀完成的样品放入真空室,真空度为5×10‐5Pa,将掩膜版固定在样品表面,采用双源共蒸发法,在样品表面沉积厚度为200nm的ZnTe:Cu背接触缓冲层,然后热蒸发沉积200nm厚的Au电极。(7) Put the etched sample into a vacuum chamber with a vacuum degree of 5× 10-5 Pa, fix the mask on the surface of the sample, and deposit ZnTe with a thickness of 200 nm on the surface of the sample by double-source co-evaporation method: The Cu back contacted the buffer layer, and then a 200nm thick Au electrode was deposited by thermal evaporation.
(8)以聚丙烯酸酯衬底作为柔性衬底,将3吨型环氧胶的A胶和B胶等量的、均匀的涂覆在清洁干净的柔性衬底上,再将上述步骤(7)中Au电极表面层叠于涂覆有粘胶的柔性衬底表面上,并固化3小时,保证3吨型环氧胶完全固化,并使得Au电极牢固的层叠于柔性衬底上。(8) Using the polyacrylate substrate as a flexible substrate, apply the same amount of A glue and B glue of 3 tons of epoxy glue on the clean flexible substrate evenly, and then apply the above steps (7) ) in which the surface of the Au electrode is laminated on the surface of the flexible substrate coated with adhesive, and cured for 3 hours to ensure that the 3-ton epoxy adhesive is completely cured, and the Au electrode is firmly laminated on the flexible substrate.
(9)将步骤(1)中的铝衬底样品放入金属刻蚀反应腔,通入压强为10毫托的Cl2,调节双射频功率源的偏置功率为80W,源功率为40W,使用Cl2和铝表面接触轰击进行反应刻蚀,反应时间为40分钟,由于Cl2和FTO不能反应,所以待铝衬底完全去除,然后即可得到“FTO/CdS/CdTe/ZnTe:Cu/Au/柔性衬底”结构的柔性CdTe太阳电池。(9) Put the aluminum substrate sample in step (1) into the metal etching reaction chamber, feed Cl 2 with a pressure of 10 mTorr, adjust the bias power of the dual radio frequency power source to 80W, and the source power to 40W, Use Cl 2 and aluminum surface contact bombardment to carry out reactive etching, the reaction time is 40 minutes, because Cl 2 and FTO cannot react, so after the aluminum substrate is completely removed, then you can get "FTO/CdS/CdTe/ZnTe:Cu/ Flexible CdTe solar cells with Au/flexible substrate structure.
实施例2制备得到的CdTe太阳电池在标准光强(AM1.5G,1000W/m2)下的电流‐电压曲线如图1所示,从图1中可以得出,电池的性能参数为:开路电压为0.777V,短路电流密度为23.2mA/cm2,填充因子为68.9%,电池光电转换效率为12.4%。说明基于本发明的结构设计,使得可以采用传统上基板CdTe太阳电池成熟制备工艺,制备得到下基板结构的高效率的柔性CdTe太阳电池。The current-voltage curve of the CdTe solar cell prepared in Example 2 under standard light intensity (AM1.5G, 1000W/m 2 ) is shown in Figure 1. From Figure 1, it can be concluded that the performance parameters of the battery are: open circuit The voltage is 0.777V, the short-circuit current density is 23.2mA/cm2, the fill factor is 68.9%, and the photoelectric conversion efficiency of the cell is 12.4%. It shows that based on the structural design of the present invention, it is possible to prepare a high-efficiency flexible CdTe solar cell with a lower substrate structure by adopting the mature preparation process of the traditional upper substrate CdTe solar cell.
实施例3Example 3
(1)采用厚度为0.5mm的铝片作为临时衬底,使用铝用清洗液对铝表面进行清洗,超声清洗时间为5分钟,然后使用去离子水冲洗干净,并使用N2吹干。(1) Use an aluminum sheet with a thickness of 0.5 mm as a temporary substrate, and use an aluminum cleaning solution to clean the aluminum surface. The ultrasonic cleaning time is 5 minutes, then rinse it with deionized water, and dry it with N2 .
(2)采用磁控溅射的方法在铝衬底表面沉积透明导电氧化物SnO2:F(FTO),薄膜厚度约300nm。利用磁控溅射在Ar气氛下溅射SnO2:F靶材(摩尔比为10:1的SnO2和SnF2粉末混合热压靶材),衬底温度为200℃,溅射功率为90W,溅射时间20min。(2) The transparent conductive oxide SnO 2 :F(FTO) is deposited on the surface of the aluminum substrate by magnetron sputtering, and the film thickness is about 300nm. Using magnetron sputtering to sputter SnO 2 :F target (mixed SnO 2 and SnF 2 powder hot-pressed target with a molar ratio of 10:1) under Ar atmosphere, the substrate temperature is 200°C, and the sputtering power is 90W , sputtering time 20min.
(3)采用化学水浴(CBD)法在FTO表面沉积CdS,反应前驱物为乙酸铵、乙酸镉和硫脲乙酸铵(0.7708g)、乙酸镉(0.1333g)和硫脲(0.1903g),溶液体积为500mL,反应沉积温度为80℃,沉积时间为30分钟,CdS层厚度为100nm。(3) CdS was deposited on the surface of FTO by the chemical water bath (CBD) method. The reaction precursors were ammonium acetate, cadmium acetate and thiourea ammonium acetate (0.7708g), cadmium acetate (0.1333g) and thiourea (0.1903g). The volume is 500mL, the reaction deposition temperature is 80°C, the deposition time is 30 minutes, and the thickness of the CdS layer is 100nm.
(4)采用近空间升华(CSS)法在CdS表面生长CdTe薄膜,生长温度为550℃,生长时间为5分钟,厚度约3μm。(4) A CdTe thin film was grown on the surface of CdS by the close-space sublimation (CSS) method, the growth temperature was 550°C, the growth time was 5 minutes, and the thickness was about 3 μm.
(5)将上述叠层置于包含CdCl2和O2的气氛环境中进行热处理,热处理温度为390℃,热处理时间为10分钟。(5) Place the above laminate in an atmosphere containing CdCl 2 and O 2 for heat treatment, the heat treatment temperature is 390° C., and the heat treatment time is 10 minutes.
(6)将上述样品放入溴甲醇溶液(体积比:溴/甲醇=1/500)中刻蚀50秒,刻蚀完成后用去离子水将样品表面冲洗干净,然后用N2吹干。(6) Put the above sample into bromine methanol solution (volume ratio: bromine/methanol=1/500) and etch for 50 seconds. After the etching is completed, rinse the surface of the sample with deionized water, and then dry it with N2 .
(7)将刻蚀完成的样品放入真空室,真空度为5×10‐5Pa,将掩膜版固定在样品表面,采用真空热蒸发法在样品表面沉积厚度为20nm的高功函过渡金属氧化物MoO3作为背接触缓冲层,然后热蒸发沉积200nm厚的Au电极。(7) Put the etched sample into a vacuum chamber with a vacuum degree of 5× 10-5 Pa, fix the mask on the surface of the sample, and deposit a high work function transition film with a thickness of 20 nm on the surface of the sample by vacuum thermal evaporation. Metal oxide MoO3 was used as the back contact buffer layer, and then a 200 nm thick Au electrode was deposited by thermal evaporation.
(8)以聚酰亚胺衬底作为柔性衬底,将3吨型环氧胶的A胶和B胶等量的、均匀的涂覆在清洁干净的柔性衬底上,再将上述步骤(7)中Au电极表面层叠于涂覆有粘胶的柔性衬底表面上,并固化3小时,保证3吨型环氧胶完全固化,并使得Au电极牢固的层叠于柔性衬底上。(8) Using the polyimide substrate as a flexible substrate, apply the same amount of A glue and B glue of 3 tons of epoxy glue on the clean flexible substrate evenly, and then apply the above steps ( 7) The surface of the Au electrode is laminated on the surface of the flexible substrate coated with adhesive, and cured for 3 hours to ensure that the 3-ton epoxy adhesive is completely cured, and the Au electrode is firmly laminated on the flexible substrate.
(9)将步骤(1)中的铝衬底样品放入金属刻蚀反应腔,通入压强为10毫托的Cl2,调节双射频功率源的偏置功率为80W,源功率为40W,使用Cl2和铝表面接触轰击进行反应刻蚀,反应时间为40分钟,由于Cl2和FTO不能反应,所以待铝衬底完全去除,然后即可得到“FTO/CdS/CdTe/Cu‐Au/柔性衬底”结构的柔性CdTe太阳电池。(9) Put the aluminum substrate sample in step (1) into the metal etching reaction chamber, feed Cl 2 with a pressure of 10 mTorr, adjust the bias power of the dual radio frequency power source to 80W, and the source power to 40W, Use Cl 2 and aluminum surface contact bombardment to carry out reactive etching, and the reaction time is 40 minutes. Since Cl 2 and FTO cannot react, the aluminum substrate can be completely removed, and then the “FTO/CdS/CdTe/Cu‐Au/ Flexible CdTe solar cells with flexible substrate" structure.
上述实施例为本发明较佳的实施方式,但本发明的实施方式并不受上述实施例的限制,其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化,均应为等效的置换方式,都包含在本发明的保护范围之内。The above-mentioned embodiment is a preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above-mentioned embodiment, and any other changes, modifications, substitutions, combinations, Simplifications should be equivalent replacement methods, and all are included in the protection scope of the present invention.
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