CN108470684B - A kind of semiconductor diode manufacturing process - Google Patents
A kind of semiconductor diode manufacturing process Download PDFInfo
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- CN108470684B CN108470684B CN201810534881.3A CN201810534881A CN108470684B CN 108470684 B CN108470684 B CN 108470684B CN 201810534881 A CN201810534881 A CN 201810534881A CN 108470684 B CN108470684 B CN 108470684B
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Abstract
本发明属于二极管生产制造技术领域，具体的说是一种半导体二极管生产制造工艺，包括酸洗、电镀、焊接、绝缘保护、引脚折弯和后处理等工艺步骤；所述引脚折弯工序中所用到的二极管引脚成形设备包括安装架、折弯模块和夹持模块，安装架包括工作台和支撑架；支撑架位于工作台下端；工作台上设置有弧形通孔，且弧形通孔位于折弯模块处；夹持模块位于工作台的台面上，夹持模块与工作台为可拆卸式连接，夹持模块用于夹持二极管的引脚；折弯模块位于夹持模块端部，折弯模块用于对二极管的引脚折弯；本发明通过二极管引脚成形设备改良了二极管生产制造工艺，使得二极管引脚的折弯方式更为简单，提高了二极管引脚的折弯效率以及二极管的品质。
The invention belongs to the technical field of diode production and manufacturing, in particular to a semiconductor diode production and manufacturing process, including process steps such as pickling, electroplating, welding, insulation protection, pin bending and post-processing; the pin bending process The diode pin forming equipment used in the invention includes a mounting frame, a bending module and a clamping module. The mounting frame includes a worktable and a support frame; the support frame is located at the lower end of the worktable; the worktable is provided with an arc-shaped through hole, and the arc-shaped The through hole is located at the bending module; the clamping module is located on the table top of the workbench, the clamping module and the workbench are detachably connected, and the clamping module is used to clamp the pins of the diode; the bending module is located at the end of the clamping module The bending module is used to bend the pins of the diode; the invention improves the diode production and manufacturing process through the diode pin forming equipment, so that the bending method of the diode pins is simpler, and the bending of the diode pins is improved. efficiency and diode quality.
Description
Technical Field
The invention belongs to the technical field of diode production and manufacturing, and particularly relates to a semiconductor diode production and manufacturing process.
Background
The diode is one of the most commonly used electronic components, the largest characteristic is unidirectional conduction, namely, current can only flow through the diode from one direction, the diode is used for a rectifying circuit, a detection circuit and a voltage stabilizing circuit, and various modulation circuits are also mainly formed by the diode;
at present, a chip, a solder and a lead wire are adopted for high-temperature welding, and then the surface of the chip is subjected to acid treatment, but in the acid cleaning process, metal impurities in the solder and the lead wire can react with acid liquor to influence the corrosion rate of the chip; meanwhile, metal ions generated by the reaction of the metals and the acid can be attached to the surface of the chip, and a large amount of clean water and chemical reagents are needed for cleaning in the later process; the cleaning not only consumes a large amount of resources, but also can not thoroughly clean the copper ions attached to the surface of the chip, so that the electrical property of the product is degraded, and the product has faults of thermal breakdown and the like at high temperature;
meanwhile, the diodes are bent and processed according to different types and purposes of the diodes in the production process, a plurality of diodes are bent after photoresist equalization is completed, diode leads are bent, when the diodes are bent manually, a clamp is used for clamping and fixing diode pins, and the other clamp is used for bending the diode pins. At present, the bending and forming link process of the diode is being improved in an effort to seek for a high-quality diode so as to optimize various devices applying the diode.
In view of the above, the invention provides a semiconductor diode production and manufacturing process, which is mainly used for providing a diode production and manufacturing process capable of reducing impurities of chip corrosion and reducing cleaning cost.
Disclosure of Invention
The invention provides a semiconductor diode production and manufacturing process for making up the defects of the prior art, and is mainly used for providing a diode production and manufacturing process capable of reducing impurities of chip corrosion and reducing cleaning cost. The invention improves the diode production and manufacturing process through the diode pin forming equipment and solves the problem that the glue layer is easy to fold or break when the glue layer is elongated when the glued diode pin is bent and formed.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a semiconductor diode production and manufacturing process, which adopts the following process steps to carry out production and manufacturing:
the method comprises the following steps: acid washing; placing the diode chip in a mixed acid solution of sulfuric acid and phosphoric acid for acid corrosion, wherein the volume ratio of the sulfuric acid to the phosphoric acid is 1:2, the corrosion time is 10-15 min, and the acid temperature is controlled to be 1-5 ℃;
step two: electroplating; after the pickling process in the step one is finished, electroplating the pickled diode chip to form a metal protective layer on the surface of the diode chip, wherein the thickness of the coating is 3-5 microns, and the metal of the coating is tin;
step three: welding; after the electroplating process in the second step is finished, two metal pins, soldering lugs and the electroplated diode chip are placed into a fixture and sent into a welding furnace for heating for three times, wherein the first temperature is controlled to be 270-280 ℃, the welding time is 4-5 min, the second temperature is controlled to be 280-290 ℃, the welding time is 4-5 min, the third temperature is controlled to be 290-300 ℃, and the welding time is 4-5 min, so that the diode chip is connected with the pins;
step four: insulation protection; after the welding procedure in the third step is finished, cleaning and drying the welded material, applying insulating protective glue on a corresponding jig, and then, promoting the glue layer formed by the insulating protective glue on the pins to be completely cured through a curing process;
step five: bending the pins; after the insulation protection process of the fourth step is finished, putting the pins of the diode into diode pin forming equipment, clamping and fixing the pins of the diode, softening the glue layer of the pins of the diode, and then bending and forming the pins of the diode;
step six: post-treatment; after the step five of pin bending working procedures are finished, carrying out surface treatment on the cured product, and testing the finished product package;
the diode pin forming equipment used in the fifth step comprises a mounting rack, a bending module and a clamping module, wherein the mounting rack comprises a workbench and a supporting frame; the support frame is positioned at the lower end of the workbench and fixedly connected with the workbench, and the support frame is used for supporting the workbench; an arc-shaped through hole is formed in the workbench and is positioned at the bending module; the clamping module is positioned on the table surface of the workbench, the clamping module is detachably connected with the workbench, and the clamping module is used for clamping pins of the diode; the bending module is located at the end of the clamping module and used for bending the pins of the diode.
The bending module comprises a first motor, an L-shaped bending rod, a fixing rod and a hot air inlet pipe, the first motor is fixed at the lower end of the workbench, the center of the first motor and the arc center of the arc-shaped through hole are in the same vertical direction, and the first motor is used for driving the L-shaped bending rod to rotate; the fixed rod is positioned at the edge of the arc-shaped through hole and is fixedly connected with the workbench; the L-shaped bending rod is fixedly connected with a rotating shaft of the motor I, the upper part of the L-shaped bending rod is positioned in the arc-shaped through hole, the L-shaped bending rod is in sliding fit with the arc-shaped through hole, a first semicircular notch is formed in the rod curved surface of the L-shaped bending rod, and a first heat flow chamber is formed in the center of the L-shaped bending rod; a first vent hole is formed between the first heat flow chamber and the first semicircular notch, and the first vent hole is communicated with the first heat flow chamber and the first semicircular notch; the hot gas inlet pipe is communicated with the first heat flow chamber and used for introducing hot gas into the first heat flow chamber to soften the adhesive layer on the pins of the diodes. When the diode pin bending device works, hot air is introduced into the first heat flow chamber by the hot air introducing pipe, the hot air in the first heat flow chamber enters the first semicircular notch along the first vent hole, and the hot air softens the adhesive layer at the bending part of the diode pin; at the moment, the first motor is started, the first motor drives the L-shaped bending rod to rotate, the L-shaped bending rod moves in the arc-shaped through hole around the fixing rod, and the L-shaped bending rod and the fixing rod are matched with each other to bend and form the pins of the diodes.
A first conical hole is also formed in the first semicircular gap; the first conical hole is provided with a plurality of, and a conical hole equipartition is around semi-circular breach, and the main aspects aperture of conical hole one is towards semi-circular breach one, and the tip drill way and the air vent intercommunication of conical hole one make steam pass through conical hole, can expand fast temporarily, and steam can fully soften the glue film on the diode pin, reduces the glue film fold or avoids the glue film to be elongated and break.
A second semicircular notch is formed in the edge of the fixing rod, and a second hot flow chamber is formed in the center of the fixing rod; a second vent hole is formed between the second hot flow chamber and the second semicircular notch, and the second vent hole is communicated with the second hot flow chamber and the second semicircular notch; the hot gas inlet pipe is also communicated with the second hot flow chamber and is used for introducing hot gas into the second hot flow chamber to soften the adhesive layer on the pins of the diodes; a second conical hole is formed in the second semicircular gap; the second conical holes are uniformly distributed around the second semicircular gap, the large-end hole openings of the second conical holes face the second semicircular gap, and the small-end hole openings of the second conical holes are communicated with the second vent holes. When the diode pin bending device works, hot air is introduced into the hot air chamber II through the hot air inlet pipe, the hot air in the hot air chamber II flows into the semicircular notch II along the communication of the vent hole II and the expansion of the conical hole II, and the hot air softens the glue layer at the bending part of the diode pin in contact with the fixing rod.
The clamping module comprises a clamp body, a motor II, a driving shaft, a chuck, a shaft sleeve and a spring, wherein the clamp body is provided with a sliding groove I and is fixed on the workbench; the driving shaft penetrates through the clamp body, is rotatably connected with the clamp body and comprises a plurality of driving shaft units; each driving shaft unit is provided with two sections of spiral grooves which are the same in length and opposite in rotation direction, and a coupler is arranged between the driving shaft units and is used for connecting two adjacent driving shaft units; the second motor is fixed at one end of the clamp body and used for driving the driving shaft to rotate; the clamping heads are in sliding fit with the first sliding groove, the two clamping heads form a clamping unit, the two clamping heads in each clamping unit are adjacent and opposite in installation direction, and the lower ends of the clamping heads are provided with second sliding grooves; the shaft sleeve is in linear sliding connection with the second sliding groove; the spring is positioned in the second sliding groove, one end of the spring is fixedly connected with the side wall of the shaft sleeve, the other end of the spring is fixedly connected with the inner wall of the chuck, and the spring is used for buffering and reducing the axial force borne by the shaft sleeve; the driving shaft penetrates through the shaft sleeve, the driving shaft is matched with the shaft sleeve, each driving shaft unit is matched with the corresponding clamping unit, and the driving shaft units rotate forwards and backwards to drive the two chucks in the clamping units to move in the opposite direction or in the opposite direction; the driving shaft rotates forward and backward to drive each clamping unit to clamp one pin of the diode. When the device works, a second motor is started, the second motor drives a driving shaft to rotate in the forward direction, a driving shaft unit on the driving shaft rotates, two sections of spiral grooves on the driving shaft unit rotate in opposite directions, the driving shaft unit drives two chucks on a clamping unit to move in opposite directions, the two chucks move in opposite directions to clamp pins of a diode, when the pins of the diode are taken out, the second motor drives the driving shaft to rotate in the reverse direction, the driving shaft unit drives the two chucks on the clamping unit to move in opposite directions, and the two chucks move in opposite directions to loosen the chucks of the diode; two pins of the clamping diode need two driving shaft units, two clamping units and a motor II, when the three pins of the triode are clamped, three driving shaft units, three clamping units and a motor II are needed, and by analogy, when the four pins of the four-stage tube are clamped, four driving shaft units, four clamping units and a motor II are needed, the driving shaft units can be replaced mutually, and the clamping units can be replaced mutually.
A lubricating oil storage chamber is arranged in the shaft sleeve; the lubricating oil storage chamber is annular, lubricating oil is injected into the lubricating oil storage chamber and used for lubricating the shaft sleeve and the driving shaft and enabling the driving shaft to be suspended in the shaft sleeve, a plurality of oil holes are formed between the lubricating oil storage chamber and the inner wall of the shaft sleeve, and the oil holes penetrate through the inner wall of the shaft sleeve; the two ends of the shaft sleeve are provided with sealing rings, one side of each sealing ring is in contact with the spring, the other side of each sealing ring is in contact with the shaft sleeve, and the sealing rings are used for sealing the shaft sleeve and the driving shaft and enabling lubricating oil to be not prone to leaking. During operation, lubricating oil in the lubricating oil storage chamber is pressurized, the driving shaft is suspended in the shaft sleeve, abrasion between the driving shaft and the shaft sleeve is reduced, the driving shaft can rotate in the shaft sleeve more flexibly under the action of the lubricating oil, the lubricating oil in the lubricating oil storage chamber keeps pressure under the sealing action of the sealing ring, dust is prevented from entering the shaft sleeve under the sealing action of the sealing ring, abrasion of the driving shaft and the shaft sleeve is reduced, and the service life of the driving shaft and the service life of the shaft sleeve are prolonged.
The invention has the beneficial effects that:
1. according to the semiconductor diode production and manufacturing process, the chip is subjected to acid corrosion before welding by firstly pickling, then welding and finally welding, so that the phenomenon that metal impurities in a welding flux and a lead react with acid liquor to influence the corrosion rate of the chip in the pickling process is avoided; metal ions generated by the reaction of metal and acid are prevented from being attached to the surface of the chip, so that a large number of cleaning processes are omitted, and resources are saved; the metal content in the discharged cleaning liquid is reduced, and the pollution to soil is reduced, so that the environment is protected.
2. According to the semiconductor diode production and manufacturing process, the diode production and manufacturing process is improved through the diode pin forming equipment, so that the bending mode of the diode pin is simpler, and the bending efficiency of the diode pin is improved; meanwhile, the invention solves the problem that the glue layer on the glued diode pin is easy to wrinkle or break when the glued diode pin is bent and formed.
3. According to the semiconductor diode production and manufacturing process, the mounting frame, the clamping module and the bending module are matched with each other, the diode pin is clamped and fixed through the clamping module, the diode pin is bent and formed through the bending module, meanwhile, hot air is introduced into the L-shaped bending rod and the fixing rod to soften the glue layer of the diode pin, so that the glue layer on the diode pin is not prone to wrinkle and fracture, and the diode production quality is improved.
4. According to the semiconductor diode production manufacturing process, the clamping module is composed of the clamp body, the second motor, the second driving shaft, the chuck, the shaft sleeve, the driving shaft unit, the coupler and the clamping unit, so that the clamping module can adapt to diodes with different numbers of pins by adding the chuck, the shaft sleeve, the driving shaft unit, the coupler and the clamping unit, the change of functions of the clamping module can be adapted without increasing the number of the second motor, all parts are easy to replace, and the clamp module is convenient to use.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a process flow diagram of the diode manufacturing process of the present invention;
FIG. 2 is a front view of the diode pin forming apparatus of the present invention;
FIG. 3 is a top view of the diode pin forming apparatus of the present invention;
FIG. 4 is a schematic diagram of a diode pin structure according to the present invention;
FIG. 5 is a schematic view of an L-shaped bending bar configuration of the present invention;
FIG. 6 is a schematic view of a retaining bar construction of the present invention;
FIG. 7 is a schematic view of a clamping module of the present invention;
FIG. 8 is a schematic view of the drive shaft and bushing connection of the present invention;
in the figure: the device comprises a mounting frame 1, a workbench 11, an arc-shaped through hole 111, a support frame 12, a bending module 2, a first motor 21, an L-shaped bending rod 22, a first semicircular notch 221, a first heat flow chamber 222, a first vent hole 223, a hot air inlet pipe 24, a first tapered hole 224, a fixing rod 23, a second semicircular notch 231, a second heat flow chamber 232, a second vent hole 233, a second tapered hole 234, a hot air inlet pipe 24, a clamping module 3, a clamp body 31, a second motor 32, a driving shaft 33, a clamp head 34, a shaft sleeve 35, a lubricating oil storage chamber 351, an oil hole 352, a sealing ring 353, a spring 36, a driving shaft unit 331, a coupler 332, a clamping unit 341, a pin 4 and.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-8, a semiconductor diode manufacturing process, which comprises the following steps:
the method comprises the following steps: acid washing; placing the diode chip in a mixed acid solution of sulfuric acid and phosphoric acid for acid corrosion, wherein the volume ratio of the sulfuric acid to the phosphoric acid is 1:2, the corrosion time is 10-15 min, and the acid temperature is controlled to be 1-5 ℃;
step two: electroplating; after the pickling process in the step one is finished, electroplating the pickled diode chip to form a metal protective layer on the surface of the diode chip, wherein the thickness of the coating is 3-5 microns, and the metal of the coating is tin;
step three: welding; after the electroplating process in the second step is finished, placing the two metal pins 4, the soldering lug and the electroplated diode chip into a fixture, feeding the fixture into a welding furnace for heating for three times, wherein the first temperature is controlled to be 270-280 ℃, the welding time is 4-5 min, the second temperature is controlled to be 280-290 ℃, the welding time is 4-5 min, the third temperature is controlled to be 290-300 ℃, and the welding time is 4-5 min, so that the diode chip is connected with the pins 4;
step four: insulation protection; after the welding procedure in the third step is completed, cleaning and drying the welded material, applying insulating protective glue on the corresponding jig, and then, promoting the glue layer 41 formed by the insulating protective glue on the pins 4 to be completely cured through a curing process;
step five: bending the pin 4; after the insulating protection procedure in the fourth step is completed, putting the pin 4 of the diode into a forming device of the pin 4 of the diode, clamping and fixing the pin 4 of the diode and softening the adhesive layer of the pin 4 of the diode, and then bending and forming the pin 4 of the diode;
step six: post-treatment; after the step of bending the pins 4 is finished, performing surface treatment on the cured product, and testing and packaging the finished product;
the diode pin forming device used in the fifth step comprises a mounting frame 1, a bending module 2 and a clamping module 3, wherein the mounting frame 1 comprises a workbench 11 and a supporting frame 12; the support frame 12 is positioned at the lower end of the workbench 11, the support frame 12 is fixedly connected with the workbench 11, and the support frame 12 is used for supporting the workbench 11; an arc-shaped through hole 111 is formed in the workbench 11, and the arc-shaped through hole 111 is located at the bending module 2; the clamping module 3 is positioned on the table top of the workbench 11, the clamping module 3 is detachably connected with the workbench 11, and the clamping module 3 is used for clamping the pins 4 of the diode; the bending module 2 is located at the end of the clamping module 3, and the bending module 2 is used for bending the pin 4 of the diode.
The bending module 2 comprises a first motor 21, an L-shaped bending rod 22, a fixing rod 23 and a hot air inlet pipe 24, the first motor 21 is fixed at the lower end of the workbench 11, the center of the first motor 21 and the arc center of the arc through hole 111 are in the same vertical direction, and the first motor 21 is used for driving the L-shaped bending rod 22 to rotate; the fixed rod 23 is positioned at the edge of the arc-shaped through hole 111, and the fixed rod 23 is fixedly connected with the workbench 11; the L-shaped bending rod 22 is fixedly connected with a rotating shaft of the motor I21, the upper portion of the L-shaped bending rod 22 is located in the arc-shaped through hole 111, the L-shaped bending rod 22 is in sliding fit with the arc-shaped through hole 111, a semicircular notch I221 is formed in the rod curved surface of the L-shaped bending rod 22, and a hot flow chamber I222 is formed in the center of the L-shaped bending rod 22; a first vent hole 223 is formed between the first heat flow chamber 222 and the first semicircular notch 221, and the first vent hole 223 is communicated with the first heat flow chamber 222 and the first semicircular notch 221; the hot gas inlet pipe 24 is communicated with the first heat flow chamber 222, and the hot gas inlet pipe 24 is used for introducing hot gas into the first heat flow chamber 222 to soften the glue layer 41 on the diode pin 4. When the diode pin bending device works, hot air is introduced into the first heat flow chamber 222 through the hot air introducing pipe 24, the hot air in the first heat flow chamber 222 flows into the first semicircular notch 221 along the first vent hole 223, and the hot air softens the adhesive layer 41 at the bending part of the diode pin; at this time, the first motor 21 is started, the first motor 21 drives the L-shaped bending rod 22 to rotate, the L-shaped bending rod 22 moves around the fixing rod 23 in the arc-shaped through hole 111, and the L-shaped bending rod 22 and the fixing rod 23 are matched with each other to bend and form the pin 4 of the diode.
A first conical hole 224 is further formed in the first semicircular notch 221; the first conical holes 224 are arranged in a plurality, the first conical holes 224 are uniformly distributed around the first semicircular gap 221, the large end hole openings of the first conical holes 224 face the first semicircular gap 221, and the small end hole openings of the first conical holes 224 are communicated with the first vent holes 223, so that hot air can be rapidly expanded when passing through the first conical holes 224, the hot air can fully soften the adhesive layer 41 on the diode pins 4, and wrinkles of the adhesive layer 41 are reduced or the adhesive layer 41 is prevented from being stretched and broken.
A second semicircular gap 231 is formed in the edge of the fixed rod 23, and a second hot flow chamber 232 is formed in the center of the fixed rod 23; a second air vent 233 is arranged between the second hot flow chamber 232 and the second semicircular notch 231, and the second air vent 233 is communicated with the second hot flow chamber 232 and the second semicircular notch 231; the hot gas inlet pipe 24 is also communicated with the second hot gas flow chamber 232, and the hot gas inlet pipe 24 is used for introducing hot gas into the second hot gas flow chamber 232 to soften the adhesive layer 41 on the diode pin 4; a second conical hole 234 is further formed in the second semicircular gap 231; the second conical holes 234 are arranged in a plurality, the second conical holes 234 are uniformly distributed around the second semicircular gap 231, the large-end hole openings of the second conical holes 234 face the second semicircular gap 231, and the small-end hole openings of the second conical holes 234 are communicated with the second vent holes 233. When the diode pin bending device works, hot air is introduced into the second hot air chamber 232 through the hot air introducing pipe 24, the hot air in the second hot air chamber 232 flows into the second semicircular notch 231 along the communication of the second vent holes 233 and the expansion of the second tapered holes 234, and the hot air softens the adhesive layer 41 at the bending part of the diode pin contacting with the fixing rod 23.
The clamping module 3 comprises a clamp body 31, a motor II 32, a driving shaft 33, a clamping head 34, a shaft sleeve 35 and a spring 36, wherein the clamp body 31 is provided with a sliding groove I, and the clamp body 31 is fixed on the workbench 11; the driving shaft 33 penetrates through the clamp body 31, the driving shaft 33 is rotatably connected with the clamp body 31, and the driving shaft 33 comprises a plurality of driving shaft units 331; two sections of spiral grooves with the same length but opposite rotation directions are arranged on the driving shaft units 331, a coupler 332 is arranged between the driving shaft units 331, and the coupler 332 is used for connecting two adjacent driving shaft units 331; the second motor 32 is fixed at one end of the clamp body 31, and the second motor 32 is used for driving the driving shaft 33 to rotate; the clamping heads 34 are in sliding fit with the first sliding grooves, the two clamping heads 34 form a clamping unit 341, the two clamping heads 34 in each clamping unit 341 are adjacent and opposite in installation direction, and the second sliding grooves are formed at the lower ends of the clamping heads 34; the shaft sleeve 35 is in linear sliding connection with the second sliding groove; the spring 36 is positioned in the second sliding groove, one end of the spring 36 is fixedly connected with the side wall of the shaft sleeve 35, the other end of the spring 36 is fixedly connected with the inner wall of the chuck 34, and the spring 36 is used for buffering and reducing the axial force borne by the shaft sleeve 35; the driving shaft 33 passes through the shaft sleeve 35, the driving shaft 33 is matched with the shaft sleeve 35, each driving shaft unit 331 is matched with the corresponding clamping unit 341, the driving shaft units 331 rotate forward and backward to drive the two clamping heads 34 in the clamping units 341 to move towards or away from each other, and the driving shaft units 331 rotate forward and backward to drive the clamping units 341 to clamp one pin 4 of the diode. When the diode clamping device works, the second motor 32 is started, the second motor 32 drives the driving shaft 33 to rotate in the forward direction, the driving shaft unit 331 on the driving shaft 33 rotates, the two spiral grooves on the driving shaft unit 331 rotate in opposite directions, the driving shaft unit 331 drives the two clamping heads 34 on the clamping unit 341 to move in opposite directions, the two clamping heads 34 move in opposite directions to clamp the pin 4 of the diode, when the pin 4 of the diode is taken out, the second motor 32 drives the driving shaft 33 to rotate in the reverse direction, the driving shaft unit 331 drives the two clamping heads 34 on the clamping unit 341 to move in opposite directions, and the two clamping heads move in opposite directions to release the diode clamping heads; two driving shaft units 331, two clamping units 341 and one motor two 32 are needed for clamping two pins 4 of the diode, three driving shaft units 331, three clamping units 341 and one motor two 32 are needed for clamping three pins 4 of the triode, and so on, four driving shaft units 331, four clamping units 341 and one motor two 32 are needed for clamping four pins 4 of the four-stage tube, the driving shaft units 331 can be replaced with each other, and the clamping units 341 can be replaced with each other.
A lubricating oil storage chamber 351 is arranged in the shaft sleeve 35; the lubricating oil storage chamber 351 is annular, lubricating oil is injected into the lubricating oil storage chamber 351, the lubricating oil is used for lubricating the shaft sleeve 35 and the driving shaft 33 and enabling the driving shaft 33 to be suspended in the shaft sleeve 35, a plurality of oil holes 352 are formed between the lubricating oil storage chamber 351 and the inner wall of the shaft sleeve 35, and the oil holes 352 penetrate through the inner wall of the shaft sleeve 35; both ends of the shaft sleeve 35 are provided with sealing rings 353, one side of each sealing ring 353 is in contact with the spring 36, the other side of each sealing ring 353 is in contact with the shaft sleeve 35, and the sealing rings 353 are used for sealing the shaft sleeve 35 and the driving shaft 33 and enabling lubricating oil to be difficult to leak out. During operation, pressurize the lubricating oil in the lubricating oil storage chamber 351, make the drive shaft 33 suspend in axle sleeve 35, reduce the wearing and tearing between drive shaft 33 and the axle sleeve 35, through the effect of lubricating oil, make the more nimble rotation in axle sleeve 35 of drive shaft 33, through the sealing effect of sealing washer 353, make the lubricating oil in the lubricating oil storage chamber 351 keep pressure, in reducing the dust with the sealing effect of sealing washer 353 and getting into axle sleeve 35 simultaneously, reduce the wearing and tearing of drive shaft 33 and axle sleeve 35, improve the life-span of drive shaft 33 and axle sleeve 35.
The specific use flow is as follows:
when the lubricating oil pressure-maintaining device is used, lubricating oil in the lubricating oil storage chamber 351 needs to be pressurized firstly, so that the driving shaft 33 is suspended in the shaft sleeve 35, abrasion between the driving shaft 33 and the shaft sleeve 35 is reduced, the driving shaft 33 can rotate in the shaft sleeve 35 more flexibly under the action of the lubricating oil, the lubricating oil in the lubricating oil storage chamber 351 keeps pressure under the sealing action of the sealing ring 353, meanwhile, dust is prevented from entering the shaft sleeve 35 under the sealing action of the sealing ring 353, abrasion between the driving shaft 33 and the shaft sleeve 35 is reduced, and the service lives of the driving shaft 33 and the shaft sleeve 35 are prolonged;
starting a second motor 32, driving the driving shaft 33 to rotate in the forward direction by the second motor 32, driving a driving shaft unit 331 on the driving shaft 33 to rotate, the two sections of spiral grooves on the driving shaft unit 331 rotate in opposite directions, the driving shaft unit 331 drives two chucks 34 on the clamping unit 341 to move in opposite directions, the two chucks 34 move in opposite directions to clamp the pin 4 of the diode, when the pin 4 of the diode is taken out, driving the driving shaft 33 to rotate in the reverse direction by the second motor 32, driving the two chucks 34 on the clamping unit 341 to move in opposite directions by the driving shaft unit 331, and loosening the diode chucks 34 by the movement of the two chucks in opposite directions; two driving shaft units 331, two clamping units 341 and one motor two 32 are needed for clamping two pins 4 of the diode, three driving shaft units 331, three clamping units 341 and one motor two 32 are needed for clamping three pins 4 of the triode, and so on, four driving shaft units 331, four clamping units 341 and one motor two 32 are needed for clamping four pins 4 of the four-stage tube, the driving shaft units 331 can be replaced with each other, and the clamping units 341 can be replaced with each other;
after the diode pin 4 is clamped, hot air is introduced into the first heat flow chamber 222 and the second heat flow chamber 232 through the hot air introducing pipe 24, and pressure is applied, so that the hot air enters the first semicircular notch 221 and the second semicircular notch 231, and the glue layer 41 at the bending part of the diode pin 4 is softened; the softened adhesive layer 41 is easily elongated or shortened, and the softening of the adhesive layer 41 can reduce the wrinkles of the adhesive layer 41 on the diode pins 4 or prevent the adhesive layer 41 from being elongated and broken; after the pin 4 of the diode is softened, starting a first motor 21, driving an L-shaped bending rod 22 to rotate by the first motor 21, moving the L-shaped bending rod 22 in the arc-shaped through hole 111 around a fixed rod 23, and mutually matching the L-shaped bending rod 22 and the fixed rod 23 to bend and form the pin 4 of the diode; after forming, the hot gas introduction pipe 24 is stopped to introduce hot gas into the first hot gas flow chamber 222 and the second hot gas flow chamber 232, the clamping module 3 is opened, and the formed diode is taken out, so that the bending of the diode pin 4 is completed.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A semiconductor diode production and manufacturing process is characterized in that: the production and manufacture are carried out by adopting the following process steps:
the method comprises the following steps: acid washing; placing the diode chip in a mixed acid solution of sulfuric acid and phosphoric acid for acid corrosion, wherein the volume ratio of the sulfuric acid to the phosphoric acid is 1:2, the corrosion time is 10-15 min, and the acid temperature is controlled to be 1-5 ℃;
step two: electroplating; after the pickling process in the step one is finished, electroplating the pickled diode chip to form a metal protective layer on the surface of the diode chip, wherein the thickness of the coating is 3-5 microns, and the metal of the coating is tin;
step three: welding; after the electroplating process in the second step is finished, the two metal pins (4), the soldering lug and the electroplated diode chip are placed into a fixture and sent into a welding furnace for heating for three times, wherein the first temperature is controlled to be 270-280 ℃, the welding time is 4-5 min, the second temperature is controlled to be 280-290 ℃, the welding time is 4-5 min, the third temperature is controlled to be 290-300 ℃, and the welding time is 4-5 min, so that the diode chip is connected with the pins (4);
step four: insulation protection; after the welding procedure in the third step is finished, cleaning and drying the welded material, applying insulating protective glue on a corresponding jig, and then, promoting the glue layer (41) formed by the insulating protective glue on the pins (4) to be completely cured through a curing process;
step five: bending the pins (4); after the insulation protection process of the fourth step is completed, putting the pins (4) of the diode into diode pin forming equipment, clamping and fixing the pins (4) of the diode, softening the glue layer of the pins (4) of the diode, and then bending and forming the pins (4) of the diode;
step six: post-treatment; after the bending process of the pins (4) in the step five is finished, performing surface treatment on the cured product, and testing and packaging the finished product;
the diode pin forming equipment used in the fifth step comprises a mounting rack (1), a bending module (2) and a clamping module (3), wherein the mounting rack (1) comprises a workbench (11) and a supporting frame (12); the support frame (12) is positioned at the lower end of the workbench (11), the support frame (12) is fixedly connected with the workbench (11), and the support frame (12) is used for supporting the workbench (11); an arc-shaped through hole (111) is formed in the workbench (11), and the arc-shaped through hole (111) is located at the bending module (2); the clamping module (3) is positioned on the table top of the workbench (11), the clamping module (3) is detachably connected with the workbench (11), and the clamping module (3) is used for clamping pins (4) of the diode; the bending module (2) is positioned at the end part of the clamping module (3), and the bending module (2) is used for bending the pin (4) of the diode;
the clamping module (3) comprises a clamp body (31), a motor II (32), a driving shaft (33), a clamping head (34), a shaft sleeve (35) and a spring (36), wherein a first sliding groove is formed in the clamp body (31), and the clamp body (31) is fixed on the workbench (11); the driving shaft (33) penetrates through the clamp body (31), the driving shaft (33) is rotatably connected with the clamp body (31), and the driving shaft (33) comprises a plurality of driving shaft units (331); the spiral groove type driving device is characterized in that two sections of spiral grooves which are identical in length and opposite in rotation direction are arranged on the driving shaft units (331), a coupler (332) is arranged between the driving shaft units (331), and the coupler (332) is used for connecting two adjacent driving shaft units (331); the second motor (32) is fixed at one end of the clamp body (31), and the second motor (32) is used for driving the driving shaft (33) to rotate; the clamping heads (34) are in sliding fit with the first sliding grooves, the two clamping heads (34) form a clamping unit (341), the two clamping heads (34) in each clamping unit (341) are adjacent and opposite in installation direction, and the second sliding grooves are formed in the lower ends of the clamping heads (34); the shaft sleeve (35) is in linear sliding connection with the second sliding groove; the spring (36) is positioned in the second sliding groove, one end of the spring (36) is fixedly connected with the side wall of the shaft sleeve (35), the other end of the spring (36) is fixedly connected with the inner wall of the chuck (34), and the spring (36) is used for buffering and reducing the axial force borne by the shaft sleeve (35); the driving shaft (33) penetrates through the shaft sleeve (35), the driving shaft (33) is matched with the shaft sleeve (35), each driving shaft unit (331) is matched with the corresponding clamping unit (341), the driving shaft units (331) rotate forward and backward to drive the two chucks (34) in the clamping units (341) to move in opposite directions or in opposite directions, and the driving shaft units (331) rotate forward and backward to drive the clamping units (341) to clamp one pin (4) of the diode.
2. The manufacturing process of claim 1, wherein: the bending module (2) comprises a first motor (21), an L-shaped bending rod (22), a fixing rod (23) and a hot air inlet pipe (24), the first motor (21) is fixed at the lower end of the workbench (11), the center of the first motor (21) and the arc center of the arc through hole (111) are in the same vertical direction, and the first motor (21) is used for driving the L-shaped bending rod (22) to rotate; the fixed rod (23) is positioned at the edge of the arc-shaped through hole (111), and the fixed rod (23) is fixedly connected with the workbench (11); the L-shaped bending rod (22) is fixedly connected with a rotating shaft of the motor I (21), the upper part of the L-shaped bending rod (22) is positioned in the arc-shaped through hole (111), the L-shaped bending rod (22) is in sliding fit with the arc-shaped through hole (111), a semicircular notch I (221) is formed in the rod curved surface of the L-shaped bending rod (22), and a hot flow chamber I (222) is arranged in the center of the L-shaped bending rod (22); a first vent hole (223) is formed between the first hot flow chamber (222) and the first semicircular notch (221), and the first vent hole (223) is communicated with the first hot flow chamber (222) and the first semicircular notch (221); the hot gas inlet pipe (24) is communicated with the first heat flow chamber (222), and the hot gas inlet pipe (24) is used for introducing hot gas into the first heat flow chamber (222) to soften the glue layer (41) on the diode pin (4).
3. A semiconductor diode production and manufacturing process according to claim 2, wherein: a first conical hole (224) is further formed in the first semicircular notch (221); the first conical holes (224) are arranged in a plurality of numbers, the first conical holes (224) are uniformly distributed around the first semicircular gap (221), the large-end hole openings of the first conical holes (224) face the first semicircular gap (221), and the small-end hole openings of the first conical holes (224) are communicated with the first vent holes (223).
4. A semiconductor diode production and manufacturing process according to claim 2, wherein: a second semicircular gap (231) is formed in the edge of the fixed rod (23), and a second hot flow chamber (232) is formed in the center of the fixed rod (23); a second air vent (233) is arranged between the second heat flow chamber (232) and the second semicircular gap (231), and the second air vent (233) is communicated with the second heat flow chamber (232) and the second semicircular gap (231); the hot gas inlet pipe (24) is also communicated with the second hot flow chamber (232), and the hot gas inlet pipe (24) is used for introducing hot gas into the second hot flow chamber (232) to soften the adhesive layer (41) on the diode pin (4); a second conical hole (234) is also formed in the second semicircular notch (231); the second conical holes (234) are arranged in a plurality, the second conical holes (234) are uniformly distributed around the second semicircular gap (231), the large-end hole of the second conical holes (234) faces the second semicircular gap (231), and the small-end hole of the second conical holes (234) is communicated with the second vent holes (233).
5. The manufacturing process of claim 4, wherein: a lubricating oil storage chamber (351) is arranged in the shaft sleeve (35); the lubricating oil storage chamber (351) is annular, lubricating oil is injected into the lubricating oil storage chamber (351), the lubricating oil is used for lubricating the shaft sleeve (35) and the driving shaft (33) and enabling the driving shaft (33) to be suspended in the shaft sleeve (35), a plurality of oil holes (352) are formed between the lubricating oil storage chamber (351) and the inner wall of the shaft sleeve (35), and the oil holes (352) penetrate through the inner wall of the shaft sleeve (35); both ends of the shaft sleeve (35) are provided with sealing rings (353), one side of each sealing ring (353) is in contact with the spring (36), the other side of each sealing ring (353) is in contact with the shaft sleeve (35), and the sealing rings (353) are used for sealing the shaft sleeve (35) and the driving shaft (33) and enabling lubricating oil to be difficult to leak.
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| US20100020839A1 (en) * | 2006-03-28 | 2010-01-28 | Mitsubishi Electric Corporation | Optical device package and optical semiconductor device using the same |
| CN101834103A (en) * | 2010-03-25 | 2010-09-15 | 浙江阳光集团股份有限公司 | Method for processing double-helix energy-saving fluorescent lamp |
| CN102693952A (en) * | 2011-03-24 | 2012-09-26 | 比亚迪股份有限公司 | Packaging structure of TVS diode and method for manufacturing TVS diode |
| CN106734677A (en) * | 2017-02-16 | 2017-05-31 | 高佳 | A kind of bender for clamping stabilization |
| CN107591325A (en) * | 2017-09-08 | 2018-01-16 | 如皋市下原科技创业服务有限公司 | A kind of production technology of diode |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100020839A1 (en) * | 2006-03-28 | 2010-01-28 | Mitsubishi Electric Corporation | Optical device package and optical semiconductor device using the same |
| CN101834103A (en) * | 2010-03-25 | 2010-09-15 | 浙江阳光集团股份有限公司 | Method for processing double-helix energy-saving fluorescent lamp |
| CN102693952A (en) * | 2011-03-24 | 2012-09-26 | 比亚迪股份有限公司 | Packaging structure of TVS diode and method for manufacturing TVS diode |
| CN106734677A (en) * | 2017-02-16 | 2017-05-31 | 高佳 | A kind of bender for clamping stabilization |
| CN107591325A (en) * | 2017-09-08 | 2018-01-16 | 如皋市下原科技创业服务有限公司 | A kind of production technology of diode |
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