CN108456397A - Halogen-free epoxy resin composition with low dielectric loss - Google Patents

Abstract

The invention discloses a halogen-free epoxy resin composition with low dielectric loss, which comprises the following components in part by weight: (A)100 parts by weight of an epoxy resin; (B)10-30 parts by weight of DOPO modified hardener; (C)1-10 parts by weight of benzoxazine resin; (D)60-90 parts by weight of an active ester compound; (E)20-50 parts by weight of a flame retardant; and (F)0.5 to 10 parts by weight of a hardening accelerator. The invention adopts the active ester as the hardener of the epoxy resin, so that the hardened product can achieve the circuit substrate characteristics of low dielectric constant, low dielectric loss, high heat resistance, low water absorption, flame retardance, no halogen and the like. The halogen-free epoxy resin composition can be prepared into a semi-cured film or a resin film and is applied to the preparation of metal laminated plates and printed circuit boards.

Description

Halogen-free epoxy resin composition with low dielectric loss

technical field

The invention relates to a halogen-free epoxy resin composition, in particular to a halogen-free epoxy resin composition with low dielectric loss.

Background technique

With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. In addition to maintaining higher requirements for the heat resistance of laminate materials, their dielectric constant and dielectric The loss value requirement will be lower and lower.

The existing traditional epoxy glass fiber cloth laminate (FR-4) is difficult to meet the high-frequency and high-speed development of electronic products. At the same time, the substrate material no longer plays the role of mechanical support in the traditional sense, but will be integrated with Together, components are an important way for designers of printed circuit boards (PCBs) and end manufacturers to improve product performance. Because a high dielectric constant (Dk) will slow down the signal transmission rate, and a high dielectric loss value (Df) will cause part of the signal to be converted into heat energy loss in the substrate material, so reducing the dielectric constant and dielectric loss value has become the focus of the substrate industry. Focus. Traditional epoxy glass fiber cloth laminate materials mostly use dicyandiamide as hardener. This kind of hardener has good operability due to its tertiary reactive amine, but because of its weak carbon-nitrogen bond, it is easy to Cracking, resulting in a low heat-resistant decomposition temperature of the hardened product, which cannot meet the heat-resistant requirements of lead-free technology. In this context, with the large-scale implementation of lead-free technology a few years ago, the industry began to use phenolic resin as a hardener for epoxy resin. Phenolic resin has a high-density benzene ring heat-resistant structure, so after epoxy hardening The heat resistance of the system is very excellent, but at the same time there is a tendency that the dielectric properties of the hardened product are deteriorated.

It has been reported that a series of active ester hardeners containing benzene ring, naphthalene ring or biphenyl structure have been synthesized as hardeners for epoxy resins, such as IAAN, IABN, TriABN and TAAN. Compared with traditional phenolic resins, the hardened products obtained have Can significantly reduce its dielectric constant and dielectric loss value.

Although the technology reported above proposes that the use of active ester as a hardener for epoxy resin can improve the moisture resistance of the hardened product, reduce water absorption, and reduce the dielectric constant and dielectric loss value of the hardened product, but its disadvantage is that it is difficult to improve the heat resistance. A good balance is achieved between the dielectric properties and the hardened product, so that the hardened product has a high glass transition temperature and a low dielectric loss value at the same time, and the dielectric properties are relatively stable with the change of frequency, and the water absorption rate is lower.

Contents of the invention

An object of the present invention is to provide a halogen-free epoxy resin composition with low dielectric loss, using active ester as a hardener for epoxy resin, so that the hardened product can reach a high glass transition temperature, low dielectric properties, Circuit board characteristics such as high heat resistance, flame retardancy and halogen-free.

In order to achieve the above object, the present invention provides a halogen-free epoxy resin composition with low dielectric loss, comprising: (A) 100 parts by weight of epoxy resin; (B) 10-30 parts by weight of DOPO modified Hardener; (C) benzoxazine resin of 1-10 parts by weight; (D) active ester compound of 60-90 parts by weight; (E) flame retardant of 20-50 parts by weight; and (F) 0.5- 10 parts by weight of hardening accelerator.

In one aspect of the present invention, the epoxy resin is selected from: bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin Oxygen resin, bisphenol A novolac epoxy resin, bisphenol F novolac epoxy resin, stilbene epoxy resin, epoxy resin containing triazine skeleton, epoxy resin containing fluorene skeleton, triphenol phenol methane Type epoxy resin, biphenyl type epoxy resin, xylylene type epoxy resin, biphenyl aralkyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, alicyclic type Epoxy resin, diglycidyl ether compound of multifunctional phenols and fused ring aromatics, trifunctional and tetrafunctional epoxy resin with 3 or 4 epoxy groups in the molecule, and phosphorus-containing epoxy resin One of the group is preferably a dicyclopentadiene epoxy resin, which has the functions of effectively increasing the glass transition temperature Tg (~175°), reducing low water absorption, and improving dimensional stability.

The DOPO modified hardener of the present invention is selected from: 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- oxide (DOPO)) and its derivatives or resins, for example, DOPO resins can be DOPO-HQ, DOPO-NQ, DOPO-PN, DOPO-BPN, and DOPO-bonded epoxy Resin, etc., where DOPO-PN is DOPO-phenolic novolac, DOPO-BPN can be DOPO-BPAN (DOPO-bisphenol A novolac), DOPO-BPFN (DOPO-bisphenol F novolac), DOPO-BPSN (DOPO-bisphenol S novolac) Such as bisphenol novolac compound, DOPO modified hardener is mainly used as a hardener combined with epoxy resin in this resin composition. In addition to providing good thermal stability and low dielectric properties, the hardener is also It has the function of helping flame retardancy.

The benzoxazine resin of the present invention is selected from: bisphenol F (BPF) type benzoxazine, bisphenol S (BPS) type benzoxazine, diaminodiphenylmethane (DDM) type benzoxazine, One of the group consisting of diaminodiphenyl ether (ODA) type benzoxazine and polyimide benzoxazine (polybenzoxazine with polyimide), preferably ODA type benzoxazine, which can reduce Dielectric constant Dk (1 to 10GHz, average about 4.0) and dielectric loss factor Df (1 to 10GHz, average about 0.0065) of hardened products, improve heat resistance, and reduce water absorption. The halogen-free epoxy resin composition of the present invention adopts ODA type benzoxazine resin, and this benzoxazine resin contains ODA type structure, besides having traditional benzoxazine high glass transition temperature (Tg), low water absorption, In addition to the advantages of high dimensional stability, low thermal expansion coefficient, good heat resistance and flame retardancy, it also has excellent dielectric properties. Mixing the benzoxazine resin in the epoxy resin can not only reduce the dielectric constant and dielectric loss of the hardened product value, and water absorption, and can keep the adhesive force from falling; the combination of the benzoxazine and non-dopo phosphorus-containing flame retardants can also help increase the flame retardant effect, and can reduce the flame retardancy of the hardened product to reach UL 94V -0 required phosphorus content to further reduce water absorption.

The active ester compound of the present invention is selected from: containing at least one ester group with high reactivity, which can participate in the hardening reaction of epoxy resin, and this reaction provides excellent low dielectric strength due to the absence of polar groups. Electrical constant, low dielectric dissipation factor, high heat resistance, and low water absorption. The active ester compound has the following structure: active ester hardening system is a function of active ester as an epoxy resin hardener, which can react with epoxy resin to form a network cross-linked structure without secondary alcoholic hydroxyl groups. Compared with the general epoxy resin system in the ring-opening reaction to produce a network structure of secondary alcoholic hydroxyl groups, it will have lower dielectric properties and low water absorption properties. In addition, from the prior art such as Japanese Patent Application Laid-Open 2002-012650, 2003-082063 and 2003-252958, etc., it can be known that when active ester compounds with benzene ring, naphthalene ring or biphenyl structure are used as hardeners for epoxy resins, The hardened product obtained from the epoxy resin composition has lower dielectric constant and dielectric loss value compared with traditional phenolic formaldehyde.

The active ester compound used in the present invention may be an active ester compound having an active ester group, but in the present invention, a compound having at least two active ester groups in its molecule is preferred. The active ester compound can be obtained by reacting a carboxylic acid compound with a hydroxyl compound and/or a thiol compound. Preferably, the active ester compound can be obtained by reacting a carboxylic acid compound with a free phenol compound and a naphthol compound. The above compounds are obtained by reacting, especially preferably, the aromatic compounds obtained by the reaction of active ester compounds, carboxylic acid compounds and naphthol compounds, which have phenolic hydroxyl groups and have at least two active compounds in the molecule. Ester-based aromatic compounds. Active ester compounds may be linear or highly branched. Such as the active ester compound has at least two carboxylic acids in its molecule and the compound with at least two carboxylic acids in the molecule contains an aliphatic chain, it can improve its compatibility with epoxy resins, and when it has When an aromatic ring is used, heat resistance can be improved.

Specific examples of carboxylic acid compounds that form active ester compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, etc. . Among them, from the viewpoint of heat resistance, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, phthalic acid, and isophthalic acid are preferable. Formic acid, more preferably isophthalic acid and terephthalic acid.

Specific examples of hydroxy compounds that form active ester compounds may include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, formazan Hydroxylated bisphenol S, phenol, o-cresol m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglycine, benzenetriol, dicyclopentadienyl diphenol, and phenol novolac, etc. . Among them, from the viewpoint of improving the heat resistance of active ester compounds, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, three Hydroxybenzophenones, tetrahydroxybenzophenones, dicyclopentadienyldiphenols and phenol novolacs, more preferably dihydroxybenzophenones, trihydroxybenzophenones, tetrahydroxybenzophenones , dicyclopentadienyl diphenol and phenol novolaks, particularly preferred are dicyclopentadienyl diphenol and phenol novolacs. Since the dicyclopentadiene structure is a rigid structure, it not only has the effect of improving heat resistance, but also has the effect of suppressing the coefficient of linear expansion at a low level, and has the advantage of making the molded substrate less likely to warp.

The active ester compound of the present invention also includes an amine structure, which can increase the compatibility of the active ester compound with epoxy resins and other hardeners. The amine structure can be reacted and cross-linked with monomers containing amine groups, especially Preferably, diamine monomers include: p-phenylenediamine (p-phenylene diamine; PPDA for short), 4,4'-oxydianiline (4,4'-oxydianiline; 4,4'-ODA for short), 3,4'-oxydianiline (3,4'-Oxydianiline referred to as 3,4'-ODA), 2,2-bis(4-[4-aminophenoxy]phenyl)propane (2,2- Bis(4-[4-aminophenoxy]phenyl)propane; BAPP for short), 2,2-bis(4-[3-aminophenoxy]phenyl)sulfone (2,2-Bis(4-[3-aminophenoxy ]phenyl)sulfone; m-BAPS for short), 1,3-bis(4-aminophenoxy)benzene (1,3-Bis(4-aminophenoxy)benzene; TPE-R for short), and other monomers, especially preferred The most popular is 4,4'-oxydianiline-4,4'-oxidized diphenylamine (referred to as 4,4'-ODA, the structure is as follows).

The active ester compound may be a resin having more than one ester group in one molecule, or may be obtained from a commercially available product through synthetic modification. For example, it can be synthetically modified from "EXB-9460", "EXB-9470", "EXB-9480", "EXB-9420" manufactured by DIC Corporation.

The production method of the active ester compound is not particularly limited. It can be produced synthetically by known methods. For example, it can be obtained by a condensation reaction between a carboxylic acid compound and a hydroxyl compound.

Active ester is used as the hardener of epoxy resin. There are two or more ester groups with high activity in the molecule of active ester hardener, which can undergo hardening reaction with epoxy resin, and active ester reacts with epoxy resin It can form a network structure without secondary alcohol hydroxyl groups and is not easy to generate polar groups, so the hardened epoxy resin has low water absorption, low dielectric loss and excellent heat resistance.

An example of active ester compound of the present invention, following formula 1:

X is a benzene ring or a naphthalene ring, l, m, k=0 or 1, n=0.25-2. in formula 1 (Dicyclopentadiene, DCPD) can be replaced by structures such as naphthol, phenol, biphenol, bisphenol A, bisphenol F or bisphenol S, mainly because it can match the structure of epoxy resin in the composition to increase both compatibility between them.

The halogen-free epoxy resin composition of the present invention uses an active ester compound as a hardening agent, and fully utilizes the advantages of no polar group formed by the reaction of the active ester and the epoxy resin, thereby having excellent dielectric properties and good heat and humidity resistance.

The reason why the resin composition of the present invention does not use maleic anhydride modified hardener is because the addition of the maleic anhydride resin composition will cause the substrate to become brittle (lower in strength), and the heat resistance will also deteriorate. The active ester compound used in the invention can effectively improve the overall heat resistance of the resin composition and provide excellent low dielectric dissipation factor (Df).

The flame retardant of the present invention, such as non-dopo flame retardant, is a compound containing phosphorus and/or vinyl, and the flame retardant is selected from one of the group consisting of flame retardants with the following structural formula, which has flame retardant Function;

formula one

where R is selected from:

one of the group formed;

formula two

where X is selected from:

one of the group formed;

Y is selected from:

One of the formed groups, n is an integer of 0-500;

formula three

where X is selected from:

one of the group formed;

A is selected from:

one of the group formed;

When n is 0, Y is:

When n is an integer of 1-500, Y is selected from:

One of the groups formed, m≧0;

Z is selected from:

One of the formed groups, m≧0.

The halogen-free epoxy resin composition of the present invention has already used DOPO as a modified hardener. The disadvantage is that the P-O-C bond in the DOPO structure is easily hydrolyzed into P-OH, which will increase the dielectric constant and low dielectric loss of the material. Non-dopo type flame retardant is selected to avoid increasing the Dk/Df of the material, and the above-mentioned active ester hardener is added to avoid increasing the water absorption of the material.

In addition to the Non-dopo type flame retardant, the present invention can optionally add at least one specific flame retardant compound listed below. The selected flame retardant compound may be a phosphate compound or a nitrogen-containing phosphate compound, but is not limited thereto, for example: resorcinol dixylenylphosphate (RDXP (such as PX-200) ), melamine polyphosphate, tri(2-carboxyethyl)phosphine (TCEP), trimethyl phosphate (TMP), tri(isopropyl chloride) Phosphate, dimethyl methyl phosphate (DMMP), bisphenol diphenyl phosphate, ammonium polyphosphate, hydroquinone-bis-(biphenyl Phosphate) (hydroquinone bis-(diphenyl phosphate)), bisphenol A-bis-(biphenyl phosphate) (bisphenol A bis-(diphenylphosphate)) in one or more.

The hardening accelerator of the present invention is selected from: imidazole (imidazole), boron trifluoride amine complex, 2-ethyl-4-methylimidazole (2-ethyl-4-methylimidazole (2E4MI)), 2-methyl Imidazole (2-methylimidazole (2MI)), 2-phenylimidazole (2-phenyl-1H-imidazole (2PZ)), ethyltriphenylphosphonium chloride (ethyltriphenylphosphonium chloride), triphenylphosphine (triphenylphosphine (TPP) ) and one or more of 4-dimethylaminopyridine (DMAP) and low molecular weight bromine-based liquid butadiene rubber BTPB (terminalbromine-based liquid butadiene rubber).

The halogen-free epoxy resin composition of the present invention may further contain inorganic fillers to increase the thermal conductivity of the resin composition, improve its thermal expansion and mechanical strength and other properties. The inorganic filler is preferably uniformly distributed in the resin composition. Inorganic fillers can be pre-surface-treated with silane coupling agents. Inorganic fillers can be spherical, flaky, granular, columnar, plate-like, needle-like or irregular. The inorganic filler may contain silica (fused, non-fused, porous or hollow), alumina, aluminum hydroxide, magnesium oxide, magnesium hydroxide, calcium carbonate, aluminum nitride, boron nitride, aluminum carbide One or more of silicon, silicon carbide, titanium dioxide, zinc oxide, zirconium oxide, barium sulfate, magnesium carbonate, barium carbonate, mica, talc, and graphene.

In order for those skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification and the scope of the claims, those skilled in the art can easily understand the related objectives and advantages of the present invention, so it will be implemented The detailed features and advantages of the present invention are described in detail in the manner, but they are not intended to limit the present invention.

Detailed ways

In order to make the above purpose and other purposes, features and advantages of the present invention more obvious and understandable, several specific examples are given in detail as follows: The resin compositions of Examples 1 to 5 (E1 to E5) are listed in Table 1 , the resin compositions of Comparative Examples 1 to 4 (C1 to C4) are listed in Table 3.

Mix the resin compositions of the above-mentioned Examples 1 to 5 and Comparative Examples 1 to 4 in batches in a stirring tank and put them into an impregnation tank, then pass the glass fiber cloth through the impregnation tank to make the resin composition adhere to the Glass fiber cloth, then heated and baked into a semi-cured state to obtain a semi-cured film.

For the above-mentioned prepregs prepared in batches, take four prepregs and two 18μm copper foils from the same batch, and laminate them in the order of copper foil, four prepregs, and copper foils, and then place them under vacuum conditions. The copper foil substrate is formed by pressing at 220°C for 2 hours, and four prepregs are cured to form an insulating layer between the two copper foils.

The physical properties of the above-mentioned copper-containing substrates and copper-free substrates etched by copper foil were measured respectively. The physical property measurement items included glass transition temperature (Tg), heat resistance of copper-containing substrates (T288), and PCT moisture absorption of copper-free substrates. Post immersion tin test, peeling strength, half ounce copper foil, P/S, dielectric constant (the lower the Dk, the better), dielectric loss (the lower the Df, the better), flame resistance ( Flaming test, UL94, in which the grades are ranked as V-0>V-1>V-2).

The physical property measurement results of the substrates made of the resin compositions of Examples 1 to 5 are listed in Table 2, and the physical property measurement results of the substrates made of the resin compositions of Comparative Examples 1 to 4 are listed in Table 4. From Table 2 and Table 4, comprehensively comparing Examples 1 to 5 and Comparative Examples 1 to 4, it can be found that according to the addition ratio of each component content of the resin composition disclosed in the present invention, a substrate with better physical properties can be obtained. The physical properties of the substrates in Examples 1 to 4 are all poor. Among them, Examples 1 to 5 (E1 to E5) use the active ester compound together with DOPO modified hardener and benzoxazine resin, and the results show that the dielectric loss (Df) decreases with the decrease of the active ester compound addition. As shown in E1, the substrate with the addition of active ester compound and benzoxazine resin but without DOPO modified hardener obtained a high Tg; as shown in E5, the addition of active ester compound and DOPO modified hardener without benzoxazine Oxazine resin substrates get higher copper foil pull (P/S) and lower dielectric constant (Dk).

Comparative examples 1 to 4 (C1 to C4) use styrene maleic anhydride (EF60) with benzoxazine resin. The results show that as the amount of styrene maleic anhydride (EF60) increases, the heat resistance of the substrate is better. Poor (Tg, T288). Comparing Examples 1 to 5 and Comparative Examples 1 to 4, it can be found that the active ester compound used in Examples 1 to 5 of the present invention can effectively improve the overall heat resistance of the resin composition and provide excellent low dielectric dissipation factor (Df ).

Table I

Table II

Table three

Table four

The halogen-free resin composition of the present invention can achieve low dielectric constant, low dielectric loss, high heat resistance and high flame resistance by including specific components and ratios; it can be made into prepreg or The resin film can be applied to copper foil substrates and printed circuit boards; in terms of industrial applicability, the products derived from the present invention can fully meet the needs of the current market.

Certainly, the present invention also can have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes All changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (10)

1. a kind of halogen-free epoxy resin component with low-dielectric loss, which is characterized in that include：

(A) epoxy resin of 100 parts by weight；

(B) DOPO of 10-30 parts by weight modifies curing agent；

(C) benzoxazine resin of 1-10 parts by weight；

(D) active ester compound of 60-90 parts by weight；

(E) fire retardant of 20-50 parts by weight；And

(F) hardening accelerator of 0.5-10 parts by weight.

2. the halogen-free epoxy resin component according to claim 1 with low-dielectric loss, which is characterized in that the ring Oxygen resin is selected from by bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol novolak type asphalt mixtures modified by epoxy resin Fat, cresol novolak type epoxy resin, bisphenol-A phenolic type epoxy resin, bisphenol F phenolic type epoxy resin, Stilbene-based epoxy Resin, the epoxy resin of the skeleton containing triazine, the epoxy resin containing fluorene skeleton, triphenol phenol methane type epoxy resin, biphenyl type epoxy Resin, xylylene type epoxy resin, biphenyl aralkyl-type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy Resin, alicyclic epoxy resin, multifunctional phenols and the 2-glycidyl ether compound of the polycyclic aromatic same clan, intramolecular have 3 One of the group that a or 4 epoxy groups trifunctional and tetrafunctional epoxy resin and phosphorous epoxy resin are formed.

3. the halogen-free epoxy resin component according to claim 1 with low-dielectric loss, which is characterized in that the work Property ester compounds be molecule in at least two active ester groups compound.

4. the halogen-free epoxy resin component according to claim 3 with low-dielectric loss, which is characterized in that the work Property ester compounds such as following formula 1：

X is phenyl ring or naphthalene nucleus, l, m, k=0 or 1, n=0.25-2.

5. the halogen-free epoxy resin component according to claim 4 with low-dielectric loss, which is characterized in that the formula In 1Functional group can be replaced with naphthols, phenol, xenol, bisphenol-A, Bisphenol F or bisphenol S structure.

6. the halogen-free epoxy resin component according to claim 1 with low-dielectric loss, which is characterized in that should DOPO modification curing agents are selected from the group being made of the miscellaneous -10- phosphorus phenanthrene -10- oxides of 9,10- dihydro-9-oxies and its derivative One material of group.

7. the halogen-free epoxy resin component according to claim 1 with low-dielectric loss, which is characterized in that the benzene And oxazines resin is selected from by bisphenol-f type benzoxazine, bisphenol S type benzoxazine, diaminodiphenylmethane type benzoxazine, two One resin of the group that aminodiphenyl ether type benzoxazine and polyimides benzoxazine are formed.

8. the halogen-free epoxy resin component according to claim 1 with low-dielectric loss, which is characterized in that the resistance Combustion agent is selected from one of the group for having following structure that the fire retardant of formula is formed：

Formula one

Wherein R be selected from：

One of group formed；

Formula two

Wherein X be selected from：

One of group formed；

Y be selected from：

One of group formed, n are the integer of 0-500；

Formula three

Wherein X be selected from：

One of group formed；

A be selected from：

One of group formed；

When n is 0, Y is：

When n be 1-500 integer when, Y be selected from：

One of group formed, m≤0；

Z be selected from：

One of group formed, m≤0.

9. the halogen-free epoxy resin component according to claim 1 with low-dielectric loss, which is characterized in that more wrap It is selected from by resorcinol bis-xylene based phosphates, polyphosphoric acid melamine, three -2- carboxyethyls containing fire-retardant compound Phosphine, front three based phosphates, three-isopropyl chlorides-phosphate, dimethyl-methyl phosphate, bis-phenol biphenyl phosphate, ammonium polyphosphate, Hydroquinone-is bis--biphenyl based phosphates and bisphenol-A-it is bis--one of the group that is formed of biphenyl based phosphates.

10. the halogen-free epoxy resin component according to claim 1 with low-dielectric loss, which is characterized in that should Hardening accelerator is selected from by imidazoles, boron trifluoride amine compound, 2-ethyl-4-methylimidazole, 2-methylimidazole, 2- phenyl miaows One of the group that azoles, chlorination Yi bases triphenyl phosphonium, triphenylphosphine and 4- dimethylaminopyridines are formed.