CN108428678B - Waterproof fingerprint module and electronic equipment - Google Patents
Waterproof fingerprint module and electronic equipment Download PDFInfo
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- CN108428678B CN108428678B CN201810377897.8A CN201810377897A CN108428678B CN 108428678 B CN108428678 B CN 108428678B CN 201810377897 A CN201810377897 A CN 201810377897A CN 108428678 B CN108428678 B CN 108428678B
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- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000012790 adhesive layer Substances 0.000 claims abstract description 50
- 239000003292 glue Substances 0.000 claims description 51
- 239000002184 metal Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000011241 protective layer Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 12
- 238000009434 installation Methods 0.000 abstract description 19
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- GJSURZIOUXUGAL-UHFFFAOYSA-N Clonidine Chemical compound ClC1=CC=CC(Cl)=C1NC1=NCCN1 GJSURZIOUXUGAL-UHFFFAOYSA-N 0.000 description 4
- 229960002896 clonidine Drugs 0.000 description 4
- 238000004078 waterproofing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention provides a waterproof fingerprint module and electronic equipment, which relate to the technical field of fingerprint modules, and the waterproof fingerprint module comprises a fingerprint identification chip, a circuit substrate and a support piece, wherein the fingerprint identification chip comprises a first plane and a second plane, the first plane is electrically connected with the circuit substrate, the support piece comprises a first installation surface and a second installation surface opposite to the first installation surface, the first installation surface is connected with the second plane of the fingerprint identification chip through a first adhesive layer, the second installation surface is connected with the circuit substrate through a second adhesive layer, and the stability of the adhesive layer is enhanced by arranging a plurality of plane adhesive layers on the outer side of the fingerprint identification chip, so that the adhesive area is enlarged, the influence of single adhesive layer on the waterproof performance due to the existence of bubbles is avoided, the influence of vapor permeation on the electric connection of the fingerprint identification chip and the circuit substrate is prevented, and the waterproof performance of the fingerprint module is improved.
Description
Technical Field
The invention relates to the technical field of fingerprint modules, in particular to a waterproof fingerprint module and electronic equipment.
Background
The information interaction between mobile terminal users is multiplied, meanwhile, various telecom fraud and identity information theft events frequently occur, the technical safety problem of identity ID information identification of the users becomes a research hot spot, in mobile internet interaction, the biological identification technology is gradually accepted by the masses as an emerging interaction technology under the lead of the era, and the application of a novel safe and reliable fingerprint identification technology in various electronic equipment brings good news to mobile internet terminal users.
At present, traditional fingerprint module structure only sets up the waterproof function of one deck waterproof glue through the fingerprint chip in the periphery, but because there is gas between fingerprint chip bottom and the circuit substrate in the packing glue parcel process, leads to packing glue unable complete parcel to glue is liquidity liquid, and whole packing glue process can't accurate control, often has the product outflow that waterproof function is not enough, influences product quality.
Disclosure of Invention
Accordingly, an objective of the present invention is to provide a waterproof fingerprint module and an electronic device, so as to solve the problem that the waterproof performance of the existing fingerprint module cannot meet the requirement.
The technical scheme adopted by the invention is as follows:
The embodiment of the invention provides a waterproof fingerprint module, which comprises a circuit substrate, a support piece and a fingerprint identification chip, wherein the fingerprint identification chip and the support piece are arranged on the circuit substrate, the support piece is arranged on the periphery of the fingerprint identification chip, the fingerprint identification chip comprises a first plane and a second plane which form a step-shaped structure, the first plane protrudes relative to the second plane, the first plane is electrically connected with the circuit substrate, the support piece comprises a first mounting surface and a second mounting surface opposite to the first mounting surface, the first mounting surface is connected with the second plane of the fingerprint identification chip through a first adhesive layer, and the second mounting surface is connected with the circuit substrate through a second adhesive layer.
Further, the support piece comprises a gasket and a metal ring, the gasket is connected with the circuit substrate, the metal ring is arranged on the gasket, and the metal ring is arranged on the periphery of the fingerprint identification chip.
Further, the spacer is annular, and the first mounting surface and the second mounting surface are formed on the spacer.
Further, the periphery of fingerprint identification chip forms the chamfer, the chamfer of fingerprint identification chip with the second plane is connected, the chamfer with the junction of second installation face sets up waterproof glue.
Further, the metal ring comprises a bonding surface, and the bonding surface is bonded with the second mounting surface of the gasket through a third adhesive layer.
Further, the inner periphery of the metal ring is formed with a chamfer, and the chamfer of the metal ring is connected with the bonding surface.
Further, the periphery of the support piece is provided with a first chamfer, the first chamfer of the support piece is connected with the second mounting surface, and a waterproof adhesive is arranged at the joint of the first chamfer and the second mounting surface.
Further, a second chamfer is provided on the inner periphery of the support member, and the second chamfer is connected with the second mounting surface.
Further, the waterproof fingerprint module further comprises a protective layer, and the protective layer is arranged on one side surface of the fingerprint identification chip far away from the circuit substrate.
The embodiment of the invention provides electronic equipment, which comprises an equipment body and a waterproof fingerprint module, wherein the waterproof fingerprint module comprises a circuit substrate, a support piece and a fingerprint identification chip, the fingerprint identification chip and the support piece are arranged on the circuit substrate, the support piece is arranged on the periphery of the fingerprint identification chip, the fingerprint identification chip comprises a first plane and a second plane which form a stepped structure, the first plane protrudes relative to the second plane, the first plane is electrically connected with the circuit substrate, the support piece comprises a first mounting surface and a second mounting surface opposite to the first mounting surface, the first mounting surface is connected with the second plane of the fingerprint identification chip through a first adhesive layer, the second mounting surface is connected with the circuit substrate through a second adhesive layer, and the waterproof fingerprint module is arranged on the equipment body.
Compared with the prior art, the invention has the following beneficial effects:
The invention provides a waterproof fingerprint module and electronic equipment, the waterproof fingerprint module comprises a fingerprint identification chip, a circuit substrate and a support piece, wherein the fingerprint identification chip comprises a first plane and a second plane, the support piece comprises a first installation surface and a second installation surface opposite to the first installation surface, the first installation surface is connected with the second plane of the fingerprint identification chip through a first adhesive layer, the second installation surface is connected with the circuit substrate through a second adhesive layer, the adhesive area is enlarged by arranging a plurality of plane adhesive layers on the outer side of the fingerprint identification chip, the problems that adhesive cannot be fully filled due to air bubbles and the like are avoided, the electric connection of the fingerprint identification chip and the circuit substrate is prevented from being influenced by water vapor permeation, the original single waterproof adhesive is optimized into a plurality of plane adhesive layers, the adhesive layer area is enlarged, the waterproof effect can be greatly improved, and the waterproof performance of the module is obviously improved.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the invention and should not be considered as limiting the scope, and that other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 shows a schematic diagram of a conventional fingerprint module.
Fig. 2 is a schematic diagram of a waterproof fingerprint module according to a first embodiment of the present invention.
Fig. 3 is a schematic diagram of a waterproof fingerprint module according to a first embodiment of the present invention.
Fig. 4 is a schematic diagram of a waterproof fingerprint module according to a second embodiment of the present invention.
Fig. 5 is a schematic diagram of a waterproof fingerprint module according to a second embodiment of the present invention.
Fig. 6 shows a schematic diagram of an electronic device.
The icons comprise 10-fingerprint modules, 101-appearance protective layers, 102-fingerprint chips, 103-metal rings, 104-substrates, 105-waterproof glue, 20-waterproof fingerprint modules, 210-circuit substrates, 211-conductive materials, 213-second glue layers, 215-waterproof glue, 230-supporting pieces, 231-first mounting surfaces, 232-second mounting surfaces, 233-first glue layers, 241-gaskets, 243-metal rings, 2431-bonding surfaces, 2432-third glue layers, 250-fingerprint identification chips, 251-first planes, 253-second planes, 255-third planes, 270-protective layers, 40-electronic equipment and 41-equipment bodies.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements.
In the description of the present invention, it should also be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Some embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1, fig. 1 shows a schematic structure diagram of a conventional fingerprint module 10, which includes an appearance protection layer 101, a fingerprint chip 102, a metal ring 103 and a substrate 104, wherein the fingerprint chip 102 is fixed on the substrate 104 by a conductive material, the metal ring is fixed on the substrate by an adhesive layer, and the appearance protection layer 101 is disposed on the surface of the fingerprint chip 102. The vapor enters the inside of the module through the gap between the metal ring 103 and the fingerprint chip 102. The waterproof glue 105 wraps the conductive material between the fingerprint chip 102 and the substrate 104, so as to realize the waterproof function of the module body.
In the existing actual fingerprint module manufacturing process, because gas exists between the bottom of the fingerprint chip 102 and the substrate 104 in the process of packaging by the filling glue, the filling glue cannot be completely packaged, the glue is a flowable liquid, the whole glue filling process cannot be accurately controlled, and often products with insufficient waterproof functions flow out to cause loss.
First embodiment
The present embodiment provides a waterproof fingerprint module 20 to improve the problem of insufficient waterproof function of the existing fingerprint module 10.
Referring to fig. 2, fig. 2 is a schematic diagram of a waterproof fingerprint module 20 according to the present embodiment.
The waterproof fingerprint module 20 includes a circuit substrate 210, a support 230, a fingerprint recognition chip 250, and a protective layer 270. The fingerprint recognition chip 250 and the supporting member 230 are disposed on the circuit substrate 210, and the supporting member 230 is disposed at the outer circumference of the fingerprint recognition chip 250. The fingerprint recognition chip 250 includes a first plane 251 and a second plane 253 forming a stepped structure, the support 230 includes a first mounting surface 231 and a second mounting surface 232 opposite to the first mounting surface 231, the first plane 251 of the fingerprint recognition chip 250 is electrically connected to the circuit substrate 210, and the second plane 253 of the fingerprint recognition chip 250 is connected to the first mounting surface 231 of the support 230 through the first adhesive layer 233. The second mounting surface 232 of the support 230 is connected to the circuit substrate 210 through the second adhesive layer 213, and the protective layer 270 is disposed on the fingerprint recognition chip 250. Compared with the traditional fingerprint module 10, the waterproof fingerprint module 20 provided in this embodiment sets up the first glue film 233 between the fingerprint identification chip 250 and the support member 230, sets up the second glue film 213 between the support member 230 and the circuit substrate 210, and the first glue film 233 and the second glue film 213 have planar support, and is more stable, keeps apart the junction of the fingerprint identification chip 250 and the circuit substrate 210 with the external world, has increased the glue film area, has avoided leading to the problem that waterproof performance is not enough because of unable complete filling that causes of reasons such as bubble.
The fingerprint recognition chip 250 includes a first plane 251, a second plane 253, and a third plane 255, wherein the first plane 251 and the second plane 253 form a stepped structure, the first plane 251 protrudes relative to the second plane 253, and the third plane 255 is a surface opposite to the first plane 251 and the second plane 253.
For example, in the present embodiment, the fingerprint identification chip 250 includes a plastic package, a die, a gold wire and a circuit substrate, the die is fixed on the circuit substrate by glue, the die is electrically connected with the circuit substrate by the gold wire, and the plastic package wraps the die and the gold wire, so that the die and the gold wire are fixed on the circuit substrate. The wiring substrate thus actually includes a circuit region and a non-circuit region surrounding the circuit region. After the fingerprint recognition chip 250 is packaged, the non-circuit area of the circuit substrate can be removed by machining, so that the fingerprint recognition chip 250 forms a stepped structure. In this embodiment, the first plane 251 protrudes relative to the second plane 253, that is, the first plane 251 includes a circuit area of the circuit substrate of the fingerprint recognition chip 250, and the second plane 253 is a step surface formed after removing a non-circuit area. It should be noted that, the positions of the wafer, the gold wire and the circuit substrate may be fixed by a mold by means of injection molding, and the fingerprint identification chip 250 having a stepped structure may be manufactured by means of injection molding.
The first plane 251 of the fingerprint recognition chip 250 is connected with the circuit substrate 210, on one hand, the fingerprint recognition chip 250 is fixedly mounted on the circuit substrate 210, and on the other hand, the fingerprint recognition chip 250 is electrically connected with the circuit substrate 210, so that signal transmission is completed.
The first plane 251 of the fingerprint recognition chip 250 may be fixedly connected to the circuit substrate 210 through the conductive material 211, for example, the conductive material 211 may be solder paste, or an ACF adhesive film (Anisotropic Conductive Film, ACF), but is not limited thereto. The fingerprint recognition chip 250 may be fixedly connected to the circuit substrate 210 by a solder paste or an ACF adhesive film. The second plane 253 of the fingerprint recognition chip 250 is connected to the supporter 230.
The support 230 is disposed on the circuit substrate 210, and disposed at the periphery of the fingerprint recognition chip 250. The support 230 is used for supporting the fingerprint recognition chip 250, providing a supporting surface for stably disposing the adhesive layer, and is sleeved on the periphery of the fingerprint recognition chip 250 for protecting the fingerprint recognition chip 250.
The support 230 includes a first mounting surface 231 and a second mounting surface 232 opposite the first mounting surface 231. A first adhesive layer 233 is disposed between the first mounting surface 231 of the support 230 and the second plane 253 of the fingerprint recognition chip 250, and the first mounting surface 231 of the support 230 and the second plane 253 of the fingerprint recognition chip 250 are adhered by the first adhesive layer 233. The first adhesive layer 233 is more stable because it has the first mounting surface 231 of the support 230 and the second planar surface 253 of the fingerprint recognition chip 250. The first adhesive layer 233 firmly adheres the fingerprint identification chip 250 and the support member 230, and simultaneously fills gaps between the first mounting surface 231 of the support member 230 and the second plane 253 of the fingerprint identification chip 250, so that water vapor can be prevented from penetrating through the gaps between the support member 230 and the fingerprint identification chip 250, and the waterproof performance of the waterproof fingerprint module 20 is improved.
The first adhesive layer 233 may be made of a glue material having waterproof property, for example, ASEC301403 or clonidine 3128, etc., but is not limited thereto. Compared with the traditional waterproof glue 215 only wrapping the connecting surface, the waterproof fingerprint module 20 provided in this embodiment improves the waterproof performance of the waterproof fingerprint module 20 by setting the first glue layer 233.
The second mounting surface 232 of the support 230 is connected to the circuit substrate 210 through the second adhesive layer 213. The second adhesive layer 213 is disposed between the second mounting surface 232 of the support 230 and the circuit substrate 210, and has two planar supports, so that the support is more stable and the waterproof effect is better. The second adhesive layer 213 firmly adheres the support 230 and the circuit substrate 210, completely fills the gap between the second mounting surface 232 of the support 230 and the circuit substrate 210, and prevents the electrical connection between the fingerprint recognition chip 250 and the circuit substrate 210 from being affected due to penetration of moisture from the gap between the support 230 and the circuit substrate 210.
The second adhesive layer 213 may be the same or different from the first adhesive layer 233 and may be made of ASEC301403, or clonidine 3128, for example.
The periphery of support piece 230 sets up first chamfer, and the first chamfer of support piece 230 is connected with the second installation face 232 of support piece 230, sets up waterproof glue 215 in the junction of first chamfer and second installation face 232, and waterproof glue 215 wraps up second glue film 213 completely, makes second glue film 213 keep apart with the external world, prevents moisture infiltration. The first chamfer may guide the waterproofing glue 215 such that the waterproofing glue 215 completely encapsulates the second glue layer 213. The waterproof performance of the waterproof fingerprint module 20 is improved.
The waterproof glue 215 may be, but not limited to, glue with better waterproof performance, such as the yutaiuf 3808.
The support 230 is disposed at the outer periphery of the fingerprint recognition chip 250, and the inner periphery of the support 230 is adjacent to the fingerprint recognition chip 250, and the inner periphery of the support 230 is provided with a second chamfer. The second chamfer of the support 230 is connected to the second mounting surface 232. The inner circumference of the supporter 230 is formed with a second chamfer to prevent the fingerprint recognition chip 250 or the circuit substrate 210 from being cut due to the inner corners.
The waterproof fingerprint module 20 includes a protective layer 270, where the protective layer 270 is disposed on a side surface of the fingerprint recognition chip 250 away from the circuit substrate 210, i.e. the third plane 255. The protective layer 270 is used to protect the fingerprint recognition chip 250, and the protective layer 270 may be made of glass, sapphire, ceramic, paint, etc., but is not limited thereto. The protective layer 270 may also be used to print logo and the like.
The size of the protective layer 270 is equal to the area of the fingerprint recognition chip 250, so that the fingerprint recognition chip 250 can be completely covered without exceeding the range of the fingerprint recognition chip 250.
In the present embodiment, the supporting member 230 may be an integral metal ring 243 made of metal, but is not limited thereto. Referring to fig. 3, in order to improve the waterproof performance of the waterproof fingerprint module 20 as much as possible, the area of the second adhesive layer 213 between the supporting member 230 and the circuit substrate 210 can be increased without affecting the size of other devices, i.e. the area of the second mounting surface 232 of the supporting member 230 is increased.
It should be noted that, in the present embodiment, the circuit substrate 210 may be a conventional circuit board or a flexible circuit board, but is not limited thereto.
Second embodiment
Referring to fig. 4, the present embodiment provides a waterproof fingerprint module 20, the basic principle of the waterproof fingerprint module 20 provided in the present embodiment is substantially the same as that of the waterproof fingerprint module 20 provided in the first embodiment, and for a brief description of the present embodiment, detailed description will not be given in this embodiment, but the detailed description will be given in this embodiment.
The waterproof fingerprint module 20 includes a circuit substrate 210, a support 230, a fingerprint recognition chip 250, and a protective layer 270. The fingerprint recognition chip 250 and the supporting member 230 are disposed on the circuit substrate 210, and the supporting member 230 is disposed at the outer circumference of the fingerprint recognition chip 250. The fingerprint recognition chip 250 includes a first plane 251 and a second plane 253 forming a stepped structure, the support 230 includes a first mounting surface 231 and a second mounting surface 232 opposite to the first mounting surface 231, the first plane 251 of the fingerprint recognition chip 250 is electrically connected to the circuit substrate 210, and the second plane 253 of the fingerprint recognition chip 250 is connected to the first mounting surface 231 of the support 230 through the first adhesive layer 233. The second mounting surface 232 of the support 230 is connected to the circuit substrate 210 through the second adhesive layer 213, and the protective layer 270 is disposed on the fingerprint recognition chip 250. Compared with the traditional fingerprint module, the waterproof fingerprint module 20 provided in this embodiment sets up the first glue film 233 between the fingerprint identification chip 250 and the support member 230, sets up the second glue film 213 between the support member 230 and the circuit substrate 210, isolates the junction of the fingerprint identification chip 250 and the circuit substrate 210 from the outside, increases the glue film area, and avoids the problem of insufficient waterproof performance caused by incomplete filling due to the reasons of air bubbles and the like.
In the present embodiment, the supporting member 230 includes a spacer 241 and a metal ring 243. The pad 241 is connected to the circuit substrate 210, the metal ring 243 is disposed on the pad 241, and the metal ring 243 is disposed on the periphery of the fingerprint recognition chip 250.
The spacer 241 has a ring shape, and the first mounting surface 231 and the second mounting surface 232 are formed on the spacer 241 as two opposite surfaces on the spacer 241.
The second plane 253 of the fingerprint recognition chip 250 is connected to the first mounting surface 231 of the pad 241 through the first adhesive layer 233. The outer periphery of the fingerprint recognition chip 250 is formed with a chamfer, and the chamfer of the fingerprint recognition chip 250 is connected with the second plane 253. The joint of chamfer and the second plane 253 of fingerprint identification chip 250 sets up waterproof glue 215, and waterproof glue 215 wraps up first glue film 233, avoids the moisture to permeate from the gap between the first installation face 231 of second plane 253 of fingerprint identification chip 250 and gasket 241. The chamfer may guide the waterproofing glue 215 such that the waterproofing glue 215 completely encapsulates the first glue layer 233. Third glue layer 2432 may be made of a glue material having waterproof property, for example, ASEC301403 or clonidine 3128, but not limited thereto.
The second mounting surface 232 of the spacer 241 is connected to the circuit substrate 210 through the second adhesive layer 213.
A metal ring 243 is provided on the pad 241, and the metal ring 243 is provided on the periphery of the fingerprint recognition chip 250. The metal ring 243 includes an adhesive surface 2431, and the adhesive surface of the metal ring 243 is connected to the first mounting surface 231 of the spacer 241 by a third adhesive layer 2432. Third glue layer 2432 firmly adheres metal ring 243 to gasket 241 and also prevents moisture from penetrating through the gap between metal ring 243 and gasket 241.
Third adhesive layer 2432 may be the same or different adhesive layer with waterproof property as first adhesive layer 233 and second adhesive layer 213, and may be made of ASEC301403, or clonidine 3128, for example.
The inner periphery of the metal ring 243 is chamfered, and the chamfer of the inner periphery of the metal ring 243 is connected to the bonding surface 2431 of the metal ring 243. In this embodiment, the metal ring 243 is disposed on the periphery of the fingerprint identification chip 250, and by disposing a chamfer on the inner periphery of the metal ring 243, the metal ring 243 is prevented from cutting the fingerprint identification chip 250, and the quality of the product is improved.
The waterproof fingerprint module 20 includes a protective layer 270, where the protective layer 270 is disposed on a side surface of the fingerprint recognition chip 250 away from the circuit substrate 210, i.e. the third plane 255. The protective layer 270 is used to protect the fingerprint recognition chip 250, and the protective layer 270 may be made of glass, sapphire, ceramic, paint, etc., but is not limited thereto. The protective layer 270 may also be used to print logo and the like.
The size of the protective layer 270 is equal to the area of the fingerprint recognition chip 250, so that the fingerprint recognition chip 250 can be completely covered without exceeding the range of the fingerprint recognition chip 250.
In the present embodiment, the waterproof performance of the waterproof fingerprint module 20 can be improved by increasing the area of the second adhesive layer 213, and referring to fig. 5, the area of the second mounting surface of the spacer 241 is correspondingly increased.
It should be noted that, in the present embodiment, the circuit substrate 210 may be a conventional circuit board or a flexible circuit board, but is not limited thereto.
Third embodiment
Referring to fig. 6, an electronic device 40 is provided in this embodiment, where the electronic device 40 includes a device body and a waterproof fingerprint module 20 provided in any one of the first embodiment or the second embodiment, and the waterproof fingerprint module 20 is connected to the device body. The electronic device 40 includes, but is not limited to, a cell phone, tablet computer, notebook computer, etc. For example, the waterproof fingerprint module 20 may be disposed on any plane or curved surface of the electronic device 40. The waterproof fingerprint module 20 is electrically connected with the device body 41 to transmit information such as the identified fingerprint to the device body 41.
In summary, the waterproof fingerprint module and the electronic device provided by the invention include the fingerprint identification chip, the circuit substrate and the supporting member, the fingerprint identification chip includes the first plane and the second plane, the supporting member includes the first installation surface and the second installation surface opposite to the first installation surface, the first installation surface is connected with the second plane of the fingerprint identification chip through the first adhesive layer, the second installation surface is connected with the circuit substrate through the second adhesive layer, the adhesive area is enlarged by arranging a plurality of plane adhesive layers on the outer side of the fingerprint identification chip, the problems that the adhesive cannot be fully filled due to air bubbles and the like are avoided, the electric connection of the fingerprint identification chip and the circuit substrate is prevented from being influenced by water vapor permeation, the original single waterproof adhesive is optimized into a plurality of plane adhesive layers, the adhesive layer area is enlarged, the waterproof effect can be greatly increased, and the waterproof performance of the module is obviously improved.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377897.8A CN108428678B (en) | 2018-04-25 | 2018-04-25 | Waterproof fingerprint module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810377897.8A CN108428678B (en) | 2018-04-25 | 2018-04-25 | Waterproof fingerprint module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108428678A CN108428678A (en) | 2018-08-21 |
| CN108428678B true CN108428678B (en) | 2024-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810377897.8A Active CN108428678B (en) | 2018-04-25 | 2018-04-25 | Waterproof fingerprint module and electronic equipment |
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| CN109299710A (en) * | 2018-12-06 | 2019-02-01 | 上海摩软通讯技术有限公司 | Fingerprint mould group and terminal device |
| CN110164829B (en) * | 2019-03-04 | 2024-11-08 | 昆山丘钛生物识别科技有限公司 | Waterproof fingerprint module |
| CN110321831A (en) * | 2019-06-28 | 2019-10-11 | 维沃移动通信有限公司 | Fingerprint mould group and mobile terminal |
| CN111198598A (en) * | 2019-12-19 | 2020-05-26 | 东莞宇龙通信科技有限公司 | Fingerprint module, installation method of fingerprint module and terminal |
| CN113542467B (en) * | 2021-07-13 | 2023-06-30 | 深圳市光千合新材料科技有限公司 | Waterproof fingerprint identification device for mobile phone |
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| CN106953947B (en) * | 2017-03-14 | 2019-08-20 | Oppo广东移动通信有限公司 | Cover plate assembly, the manufacturing method of cover plate assembly and electronic device |
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