CN108427909A - Manufacturing method of patterned fingerprint module - Google Patents

Abstract

The invention discloses a method for manufacturing a patterned fingerprint module, which comprises the following steps: providing a transfer printing film and a fingerprint chip, wherein one surface of the fingerprint chip is a plastic package layer, and the other surface of the fingerprint chip is a functional circuit layer; sequentially manufacturing a hardening layer, a pattern layer and a color layer on one surface of the transfer printing film, wherein the color layer covers the pattern layer and the hardening layer to form a transfer module layer; aligning and attaching the transfer module layer and the fingerprint chip to form a chip module, wherein the color layer is aligned and attached with the plastic packaging layer; removing the transfer printing film, and carrying out roughness treatment on the surface of the hardening layer, which faces away from the pattern layer, so that the surface becomes a flat surface; cut into a plurality of patterning fingerprint modules with the chip module, wherein every patterning fingerprint module includes sclerosis layer, predetermines pattern, colour layer, plastic envelope layer and functional structure circuit. The invention not only realizes the patterning of the surface of the fingerprint film group, but also simplifies and reduces the process manufacturing difficulty and improves the quality and the manufacturing efficiency of the fingerprint film group.

Description

A method of making a patterned fingerprint module

technical field

The invention relates to the technical field of fingerprint identification, in particular to a method for making a patterned fingerprint module.

Background technique

With the sweeping of full-screen, in order to expand the screen-to-body ratio of the screen, post-mounting the fingerprint recognition module of the Coating solution has become the preferred solution, and the market potential is huge. In the field of touch screen technology, fingerprint recognition has the characteristics of uniqueness, high stability, high accuracy and high security. Therefore, fingerprint recognition is widely used in the field of touch screen technology and has great market potential.

However, in the prior art, the surface color of the fingerprint module of the coating solution is mostly black, white, gray or silver, and the user experience is poor. The main reason for the above-mentioned problems is that the Coating scheme of the prior art is processed and manufactured by using a full-page spraying process. If you want to make patterns on the surface of the Coating layer, the manufacturing process is very difficult or even impossible to make. Therefore, it is necessary to provide A new process method to realize the surface patterning of the fingerprint module of the Coating scheme in a simple and high-quality way.

Contents of the invention

The embodiment of the present invention mainly provides a method for making a patterned fingerprint module to solve the problem in the prior art that the pattern is made on the surface of the coating layer by using the full-page spraying process, which is very difficult or even impossible to make.

In order to solve the above technical problems, the technical solutions adopted in the embodiments of the present invention are as follows:

A method for making a patterned fingerprint module, comprising:

Provide a transfer film and a fingerprint chip, wherein one side of the fingerprint chip is a plastic sealing layer, and the other side is a functional circuit layer; on one side of the transfer film, a hardened layer, a pattern layer and a color layer are sequentially produced, and the The color layer covers the pattern layer and the hardened layer to form a transfer module layer, wherein the pattern layer includes a plurality of preset patterns, and each of the preset patterns is arranged at intervals, and the functional circuit layer includes A plurality of functional circuit structures, and each of the functional circuit structures corresponds to a plurality of the preset patterns in space; the transfer module layer and the fingerprint chip are aligned and bonded to form a chip module , wherein the color layer is aligned with the plastic sealing layer; the transfer film is removed, and the surface of the hardened layer facing away from the pattern layer is subjected to roughness treatment, so that the surface becomes a flat surface; cutting the chip module into a plurality of patterned fingerprint modules, wherein each of the patterned fingerprint modules includes the hardened layer, the preset pattern, the color layer, the plastic sealing layer and The functional structural circuit.

In the present invention, the hardened layer, the pattern layer and the color layer are made on the transfer film in sequence, and after the transfer module layer is formed, the transfer module layer is attached to the fingerprint chip by a transfer method, and finally the transfer film is removed and then cut to obtain Multiple patterned fingerprint modules not only realize the patterning of the surface of the fingerprint film group, but also simplify and reduce the difficulty of manufacturing the process, and improve the quality and production efficiency of the fingerprint module.

Description of drawings

Fig. 1 is the implementation flowchart of the manufacturing method of the patterned fingerprint module of the embodiment of the present invention;

Fig. 2 is the top view of the partial structure after the hardened layer is made on the transfer film of the manufacturing method of the patterned fingerprint module according to the embodiment of the present invention;

3 is a top view of a partial structure after a patterned layer is made on the hardened layer of the method for making a patterned fingerprint module according to an embodiment of the present invention;

4 is a top view of a part of the structure after the color layer is made on the pattern layer of the method for making a patterned fingerprint module according to an embodiment of the present invention;

Fig. 5 is a partial structural schematic diagram of a fingerprint chip according to an embodiment of the present invention;

Fig. 6 is a schematic diagram of a part of the structure of the patterned fingerprint module manufacturing method according to the embodiment of the present invention after the transfer module layer is attached to the fingerprint chip and the transfer film is removed;

FIG. 7 is a cross-sectional view of a partial structure of a patterned fingerprint module according to the manufacturing method of the patterned fingerprint module according to the embodiment of the present invention.

Detailed ways

Embodiment one

As shown in Fig. 1 and Fig. 7, Fig. 1 is the implementation flowchart of the manufacturing method of the patterned fingerprint module of the embodiment of the present invention, Fig. 7 is a patterned pattern of the manufacturing method of the patterned fingerprint module of the embodiment of the present invention Sectional view of the partial structure of the fingerprint module.

Can obtain from Fig. 1, the manufacture method of a kind of patterned fingerprint module of the present invention, it comprises:

Step S101 : providing a transfer film 10 and a fingerprint chip 50 , wherein one side of the fingerprint chip 50 is the plastic sealing layer 51 facing the user, and the other side is the functional circuit layer 52 .

In this step, specifically, the provision of the transfer film 10 may be as follows: the transfer film 10 of the coil is cut into a transfer film 10 of a size suitable for the embodiment of the present invention, and the transfer film 10 has high temperature resistance nature. The side facing the user of the large fingerprint chip 50 is a plastic encapsulation layer 51, and the side of the large fingerprint chip 50 facing away from the user is a functional circuit layer 52, and the functional circuit layer 52 includes a plurality of functional circuits arranged in an array. Structure 521, as shown in FIG. 7 .

In this step, optionally, before laminating the transfer module layer and the fingerprint chip 50 , the surface of the plastic sealing layer 51 is subjected to plasma treatment. Wherein, the content of argon is 50%～80%, the content of oxygen is 20%～50%, the pressure is 80～1200torr (Torr), the time is 60～120s, optionally, the content of argon is 65%, the content of oxygen 40%, the pressure is 1000torr, and the time is 90s, so as to reduce the surface energy of the plastic seal layer 51 and enhance its adhesion with the ink, as shown in Figure 5, which is a partial structural diagram of the fingerprint chip 50 of the embodiment of the present invention .

Step S102: Fabricate a hardening layer 20, a pattern layer (not shown in the figure) and a color layer 40 on one side of the transfer film 10 from bottom to top, and the color layer 40 covers the pattern layer and the hardening layer. Layer 20 to form the transfer module layer.

As shown in FIG. 2 , FIG. 2 is a top view of part of the structure of the patterned fingerprint module manufacturing method of the embodiment of the present invention after the hardened layer 20 is made on the transfer film 10 . In this step, specifically, the ink for forming the hardening layer 20 and the first target (not shown in the figure) are screen-printed on one surface of the transfer film 10 to form the hardening layer 20 . Wherein the area of the hardened layer 20 is smaller than that of the transfer film 10 , and the hardened layer 20 is contained in the transfer film 10 . The first target is located between the edge of the transfer film 10 and the ink edge of the hardened layer 20 , and the shape and size of the hardened layer 20 are adapted to the shape and size of the plastic sealing layer 51 .

In this embodiment, optionally, the pattern layer includes a plurality of preset patterns 30, and each of the preset patterns 30 is arranged at intervals, the functional circuit layer 52 includes a plurality of functional circuit structures 521, and Each of the functional circuit structures 521 has a one-to-one spatial correspondence with the plurality of preset patterns 30 .

In this embodiment, optionally, the hardened layer 20 is a transparent layer with a hardness greater than or equal to 4H, and optionally, the hardness is 7H. Wherein, the hardened layer 20 is a transparent layer. After the hardened layer 20 is irradiated with UV light, the adhesion on the surface of the transfer film 10 will drop sharply. The thickness of the hardened layer 20 is 10-20um. The embodiment of the present invention can Choose 14um. Further, the hardened layer 20 is pre-baked at a temperature of 70-85° C. for 20-30 minutes. Optionally, the temperature is 80° C. and the time is controlled for 26 minutes.

As shown in FIG. 3 , FIG. 3 is a top view of a part of the structure of the method for fabricating a patterned fingerprint module according to an embodiment of the present invention after fabricating a pattern layer on the hardened layer 20 . In this step, specifically, by overprinting the first target (not shown in the figure) set when making the hardened layer 20, the pattern layer ink is screen-printed on the surface of the hardened layer 20, and the pattern layer includes the preset pattern 30 and the corresponding For the second target, the pattern layer does not cover the first target produced in the previous step. The preset pattern 30 includes a circle, a triangle, a square or a logo, but is not limited thereto. The present invention may be a circle, and a plurality of circles are arranged in an array on the surface of the hardened layer 20. A plurality of the preset patterns The pattern 30 has a one-to-one correspondence with a plurality of the functional circuit structures 521, the thickness of the pattern layer is 5-10um, optionally, the thickness is 7um, the ink for making the pattern layer can be mirror silver or other types of ink, The embodiment of the present invention can be selected as mirror silver. Further, the pattern layer is pre-baked, the baking temperature is 80-90° C., and the baking time is 10-25 minutes. Optionally, the baking temperature is 84° C., and the baking time is 12 minutes.

As shown in FIG. 4 , FIG. 4 is a top view of a part of the structure after the color layer 40 is fabricated on the pattern layer in the method for fabricating a patterned fingerprint module according to an embodiment of the present invention. In this step, specifically, the ink of the color layer 40 is screen-printed on the hardened layer 20 and the surface of the patterned layer by overprinting the second target (not shown) set when making the pattern layer, and the color layer 40 completely covers the hardened layer 20 and the patterned layer without covering the second target made in the previous step. Wherein, the thickness of the color layer 40 is 20-70um, optionally, the thickness is 30um, the color of the color layer 40 includes black, white, gold and silver, etc., and the embodiment of the present invention can be black. Further, the color layer 40 is pre-baked at a temperature of 50-60°C for 5-10 minutes, optionally at a temperature of 55°C for 8 minutes. The color layer 40 is surface-dry after pre-curing, but still has strong adhesion after reheating.

Step S103 : aligning and bonding the transfer module layer and the fingerprint chip 50 to form a chip module, wherein the color layer 40 is aligned and bonded to the plastic sealing layer 51 .

As shown in FIG. 6 , FIG. 6 is a schematic diagram of a part of the structure of the patterned fingerprint module manufacturing method of the embodiment of the present invention after the transfer module layer is attached to the fingerprint chip 50 and the transfer film 10 is removed.

In this step, optionally, by respectively setting mutually corresponding targets on the transfer module layer and the fingerprint chip 50 layer to realize the alignment and bonding of the two, specifically, through a CCD (image sensor) The alignment system grabs the second target made on the pattern layer on the surface of the transfer film 10 and the third target preset on the surface of the plastic seal layer 51 to realize vacuum alignment and bonding, that is, the color layer 40 on the surface of the transfer film 10 is transferred to the A large surface of the plastic sealing layer 51 of the fingerprint chip 50 is used to make a chip module, and each preset pattern 30 of the pattern layer is guaranteed to be located at the center of each functional circuit structure 521 of the fingerprint functional circuit layer 52 . In addition, heat while vacuum laminating, the heating temperature is 85-100°C, and the heating time is 5-15min. Optionally, the heating temperature is 90°C, and the heating time is 12min, so that the color layer 40 is viscous again, so as to realize Bond with the color layer 40 plastic seal layer 51. Further, defoaming is also carried out, wherein the defoaming pressure is 5.5-6.5kg, the defoaming temperature is 35-45°C, and the defoaming time is 25-40min. Optionally, the defoaming pressure is 6kg, and the defoaming temperature is 40°C, the defoaming time is 35°C.

Step S104: removing the transfer film 10, and roughening the surface of the hardened layer 20 facing away from the pattern layer, so that the surface becomes a flat surface.

In this step, optionally, the transfer film 10 is removed by irradiation with ultraviolet light. Specifically, through UV light (ultraviolet light) irradiation, the adhesive force between the hardened layer 20 and the transfer film 10 is smaller than the adhesive force between the color layer 40 and the surface of the plastic seal layer 51 of the large fingerprint chip 50, and then the transfer film is peeled off. Film 10. Optionally, the energy of UV light is 200-800mj/cm2, and the irradiation time is 8-20s. Optionally, the energy is 500mj/ ^cm2 , and the irradiation time is 15s. Finally, final baking is carried out, the baking temperature is 130-150° C., and the time is 30-50 minutes. Optionally, the temperature is 140° C., and the time is 40 minutes. After the processing is completed, the pattern layer can be seen from the user's face (because the hardened layer 20 is a transparent layer), and the preset pattern 30 in the embodiment of the present invention is a ring, and the top view is shown in FIG. 6 . After peeling off the transfer film 10, use a grinding device to polish the side of the hardened layer 20 facing the user, the grinding depth is 2-5um, and the embodiment of the present invention can be 3um, so as to reduce the unevenness of the surface of the hardened layer 20 after transfer. Grinding off to ensure the flatness of the surface of the hardened layer 20 .

Step S105: cutting the chip module after step S104 into a plurality of patterned fingerprint modules, wherein each patterned fingerprint module includes the hardened layer 20 and one preset pattern 30 , the color layer 40 and one functional circuit structure 521 .

As shown in FIG. 7 , FIG. 7 is a cross-sectional view of a partial structure of a patterned fingerprint module according to the manufacturing method of the patterned fingerprint module according to the embodiment of the present invention. In this step, optionally, the chip module after polishing the hardened layer 20 is cut into a plurality of patterned fingerprint modules by laser cutting, the laser output power is 10-13W, and the pulse width is 17-19ms, the laser cutting speed is 100-300mm/s, optionally, the output power is 12W, the pulse width is 18ms, the cutting speed is 150mm/s, each patterned fingerprint module after cutting, from From bottom to top, it includes a functional circuit structure 521 , a plastic encapsulation layer 51 , a color layer 40 , a preset pattern 30 and a hardening layer 20 .

In this embodiment, optionally, the transfer module layer and the fingerprint chip 50 are bonded by means of vacuum alignment bonding, and after bonding, the multiple preset patterns 30 and multiple There is a one-to-one correspondence between the functional circuit structures 521, and each of the preset patterns 30 is located above the central position of the corresponding functional circuit structure 521, but not limited to above the central position.

In this embodiment, optionally, the multiple functional circuit structures 521 and the multiple preset patterns 30 are arranged in an array.

In this embodiment, optionally, a roughness treatment is performed on the surface of the hardened layer 20 facing away from the pattern layer, specifically including:

Grinding equipment is used to grind the surface of the hardened layer 20 facing away from the pattern layer to a depth of 2-5 um.

In this embodiment, optionally, the pattern shape of the preset pattern 30 includes a circular shape, a square shape and a rhombus shape, and the colors of the color layer 40 include black, white, gold and silver.

In the above-mentioned embodiment, for the convenience of explaining the technical essence of the present invention, the shape of the large-scale fingerprint chip 50 and the transfer film 10 is set to be a rectangle, but this is by no means a limitation to the embodiment of the present invention. The large-scale fingerprint described in the embodiment of the present invention The shapes of the chip 50 and the transfer film 10 may also be other shapes such as rhombus, circle or racetrack.

Compared with the spraying process of the traditional Coating scheme fingerprint module, the present invention can realize the surface patterning of the Coating scheme fingerprint module, and make signs such as rings, squares, triangles or logos on the surface of the Coating scheme fingerprint module, so that Diversified product expressions enhance user experience and enhance market competitiveness.

Compared with the prior art, the present invention adopts the transfer method to bond the transfer module layer and the fingerprint chip 50, which not only realizes the patterning of the surface of the fingerprint film group, but also simplifies and reduces the difficulty of manufacturing the process, improves the quality of the fingerprint module and Production efficiency.

The above is only the embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process conversion made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technologies fields, all of which are equally included in the scope of patent protection of the present invention.

Claims (10)

1. a kind of production method of patterning fingerprint module, which is characterized in that including：

A transfer film and a fingerprint chip are provided, wherein the one side of the fingerprint chip is plastic packaging layer, another side is functional circuit Layer；

Make hardened layer, pattern layer and color layers successively in the one side of the transfer film, the color layers cover the pattern Layer and the hardened layer shift module layer to be formed；

Wherein, the pattern layer includes multiple predetermined patterns, and each predetermined pattern is spaced arranged evenly, the work( Energy circuit layer includes multiple functional circuit structures, and each functional circuit structure and multiple predetermined patterns are spatially It corresponds；

The contraposition of the transfer module layer and the fingerprint chip is bonded so that chip module is made, wherein the color layers with it is described The contraposition fitting of plastic packaging layer；

The transfer film is removed, and roughness processing is carried out backwards to the surface of the pattern layer to the hardened layer, makes the table Face becomes burnishing surface；

The chip module is cut into multiple patterning fingerprint modules, wherein each patterning fingerprint module includes The hardened layer, the predetermined pattern, the color layers, the plastic packaging layer and the functional structure circuit.

2. the production method of patterning fingerprint module according to claim 1, which is characterized in that wherein, by the transfer Before module layer is bonded with the fingerprint chip, further include：The plastic packaging layer surface is subjected to plasma treatment.

3. the production method of patterning fingerprint module according to claim 1, which is characterized in that the hardened layer is hardness Hyaline layer more than or equal to 4H.

4. the production method of patterning fingerprint module according to claim 1, which is characterized in that irradiated by ultraviolet light Mode realize the removal transfer film.

5. the production method of patterning fingerprint module according to claim 1, which is characterized in that by way of laser cutting The chip module is cut into multiple patterning fingerprint modules.

6. the production method of patterning fingerprint module according to claim 1, which is characterized in that aligned and be bonded by vacuum Mode the transfer module layer is bonded with the fingerprint chip, and make multiple predetermined patterns and multiple after being bonded The functional circuit structure corresponds, and each predetermined pattern is located at the center of the corresponding functional circuit structure Above position.

7. the production method of patterning fingerprint module according to claim 1, which is characterized in that multiple functional circuits The arrangement mode of structure and multiple predetermined patterns is array arrangement.

8. the production method of patterning fingerprint module according to claim 1, which is characterized in that the back of the body of the hardened layer Roughness processing is carried out to the surface of the pattern layer, is specifically included：

Using grinding apparatus polishing backwards to the surface of the pattern layer to the hardened layer, grinding depth is 2~5um.

9. the production method of patterning fingerprint module according to claim 1, which is characterized in that the figure of the predetermined pattern Case shape includes circular, square shape and diamond shaped, and the color of the color layers includes black, white, gold and silver color.

10. the production method for patterning fingerprint module according to claim 1~9 any one of them, which is characterized in that by dividing Mutual corresponding target is not set on the transfer module layer and the fingerprint chip layer come realize the transfer module layer and The contraposition of the fingerprint chip layer is bonded.