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CN108417599A - Testing of materials device of white light OLED and preparation method thereof - Google Patents

Testing of materials device of white light OLED and preparation method thereof Download PDF

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Publication number
CN108417599A
CN108417599A CN201810106050.6A CN201810106050A CN108417599A CN 108417599 A CN108417599 A CN 108417599A CN 201810106050 A CN201810106050 A CN 201810106050A CN 108417599 A CN108417599 A CN 108417599A
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CN
China
Prior art keywords
layer
light
white
anode
testing
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Pending
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CN201810106050.6A
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Chinese (zh)
Inventor
张卜芳
李松杉
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to CN201810106050.6A priority Critical patent/CN108417599A/en
Publication of CN108417599A publication Critical patent/CN108417599A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

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Abstract

The invention discloses a kind of testing of materials devices of white light OLED comprising:Substrate;The metal pattern layer being set on the substrate;The inorganic passivation layer being covered in the metal pattern layer and the substrate;The color light resistance layer being set on the inorganic passivation layer on the substrate;And it is set to the white-light organic light-emitting portion in the color light resistance layer.The invention also discloses a kind of production methods of the testing of materials device of white light OLED.The present invention is by being arranged inorganic passivation layer, the organic photoresist layer being coated with when making color light resistance layer is set to can be good at being attached on inorganic passivation layer, to improve the adhesive force for making color light resistance layer and inorganic passivation layer, while improving the homogeneity for the organic photoresist layer for making color light resistance layer.

Description

Testing of materials device of white light OLED and preparation method thereof
Technical field
The invention belongs to organic display technical fields, in particular, be related to a kind of white light OLED testing of materials device and Its production method.
Background technology
The manufacturing process of testing of materials (Material Test) device of traditional white light OLED is:Successively on substrate Make metal layer, color light resistance layer, the first inorganic barrier layer, anode, the second inorganic barrier layer, organic luminescent device and cathode.
In the manufacturing process of the testing of materials device of traditional white light OLED, after the processing procedure for completing metal layer, into coloured silk In the processing procedures of organic photoresist layer such as coloured light resistance layer, the first inorganic barrier layer, need on the metal layer first whole face be coated with organic photoresist Layer, then be exposed and develop;And the adhesive force of organic photoresist layer on the metal layer is poor, often results in organic photoresist tunic It is broken, to influence the homogeneity of organic photoresist layer film thickness.
Invention content
In order to solve the above-mentioned problems of the prior art, the purpose of the present invention is to provide one kind capable of improving organic light Testing of materials device of white light OLED of the adhesive force of resistance layer and metal layer and preparation method thereof.
According to an aspect of the present invention, a kind of testing of materials device of white light OLED is provided comprising:Substrate;Setting Metal pattern layer on the substrate;The inorganic passivation layer being covered in the metal pattern layer and the substrate;It is set to Color light resistance layer on the inorganic passivation layer on the substrate;And the white light being set in the color light resistance layer is organic Illumination region.
Further, the white-light organic light-emitting portion includes:The first Organic barrier being covered in the color light resistance layer Layer;Anode on first inorganic barrier layer and the inorganic passivation layer is set, and the anode runs through the inorganic passivation Layer with the metal pattern layer to connect;The second inorganic barrier layer being set on the anode, second inorganic barrier layer In there is the pixel of the exposure anode to limit hole;Being set to the white light that the pixel limits in hole and on the anode has Machine light emitting functional layer;And it is set to the cathode in the white-light organic light-emitting functional layer.
Further, the pixel limits hole and the color light resistance layer face.
Further, from the anode to the cathode, sequence includes the white-light organic light-emitting functional layer:Hole occurs Layer, hole transmission layer, white-light organic light-emitting layer, electron transfer layer, electron injecting layer.
Further, the inorganic passivation layer is by SiNxOr SiOxThe single layer structure or described inorganic being made Passivation layer is by SiNxAnd SiOxThe double-layer structure being made.
According to another aspect of the present invention, a kind of production method of the testing of materials device of white light OLED is additionally provided, Including:One substrate is provided;Metal pattern layer is formed on the substrate;It is formed in the metal pattern layer and the substrate Inorganic passivation layer;Color light resistance layer is formed on the inorganic passivation layer on the substrate;And in the color light resistance layer Upper formation white-light organic light-emitting portion.
Further, the method packet in white-light organic light-emitting portion is formed in the color light resistance layer and the inorganic passivation layer It includes:The first inorganic barrier layer is formed in the color light resistance layer;In first inorganic barrier layer and the inorganic passivation layer Upper formation anode, the anode is through the inorganic passivation layer to be connect with the metal pattern layer;It is formed on the anode Pixel with the exposure anode limits second inorganic barrier layer in hole;It limits in the pixel and is formed in vain on the anode in hole Light organic luminescence function layer;And form cathode in the white-light organic light-emitting functional layer.
Further, when forming the pixel restriction hole in second inorganic barrier layer, the pixel is made to limit hole With the color light resistance layer face.
Further, limiting the method that white-light organic light-emitting functional layer is formed on the anode in hole in the pixel includes: The pixel limit hole in anode on sequentially form lamination hole occur layer, hole transmission layer, white-light organic light-emitting layer, Electron transfer layer, electron injecting layer.
Beneficial effects of the present invention:The present invention makes making the first inorganic barrier layer and coloured silk by the way that inorganic passivation layer is arranged The organic photoresist layer being coated with when coloured light resistance layer can be good at being attached on inorganic passivation layer, organic to improve making first The adhesive force of barrier layer and color light resistance layer and inorganic passivation layer, while improving and making the first inorganic barrier layer and chromatic photoresist The homogeneity of organic photoresist layer of layer.
Description of the drawings
What is carried out in conjunction with the accompanying drawings is described below, above and other aspect, features and advantages of the embodiment of the present invention It will become clearer, in attached drawing:
Fig. 1 is the structural schematic diagram of the testing of materials device of white light OLED according to an embodiment of the invention;
Fig. 2A to Fig. 2 E is the processing procedure figure of the testing of materials device of white light OLED according to an embodiment of the invention;
Fig. 3 A to Fig. 3 E are the processing procedure figures in white-light organic light-emitting portion according to an embodiment of the invention.
Specific implementation mode
Hereinafter, with reference to the accompanying drawings to detailed description of the present invention embodiment.However, it is possible to come in many different forms real The present invention is applied, and the present invention should not be construed as limited to the specific embodiment illustrated here.On the contrary, providing these implementations Example is in order to explain the principle of the present invention and its practical application, to make others skilled in the art it will be appreciated that the present invention Various embodiments and be suitable for the various modifications of specific intended application.
In the accompanying drawings, for the sake of clarity, the thickness of layer and region is exaggerated.Identical label is in the whole instruction and attached Identical component is indicated in figure.
It will be appreciated that when the element of layer, film, region or substrate etc. element "upper" another referred to as " ", it should Element can be directly on another element, or there may also be intermediary elements.Selectively, when element is referred to as " directly Be connected on " another element "upper" when, be not present intermediary element.
Fig. 1 is the structural schematic diagram of the testing of materials device of white light OLED according to an embodiment of the invention.
Referring to Fig.1, the testing of materials device of white light OLED according to an embodiment of the invention includes:Substrate 100, metal figure Pattern layer 200, inorganic passivation layer 500, color light resistance layer 300 and white-light organic light-emitting portion 400.
Metal pattern layer 200 is set on substrate 100.In the present embodiment, metal pattern layer 200 is by using light shield pair Layer of metal film layer carries out yellow light technique and is molded.For example, make when metal pattern layer 200 can be formed it is U-shaped, but the present invention It is not restricted to this.
Inorganic passivation layer 500 is set on metal pattern layer 200 and substrate 100.In the present embodiment, inorganic passivation layer 500 can be for example by SiNxOr SiOxThe single layer structure or inorganic passivation layer 500 being made can be by SiNxWith SiOxThe double-layer structure being made, the present invention are simultaneously not especially limited.
Color light resistance layer 300 is set on the part of inorganic passivation layer 500 being located on substrate 100.In the present embodiment, Color light resistance layer 300 can be for example red photoresist layer, blue light resistance layer or green photoresist layer, and the present invention does not make specifically to limit It is fixed.
White-light organic light-emitting portion 400 is set in color light resistance layer 300.White-light organic light-emitting portion 400 is used for downward (i.e. court To the direction of color light resistance layer 300) transmitting light.
Here, due to being provided with inorganic passivation layer, the organic photoresist layer being coated with when making color light resistance layer 300 (is used for Make organic photoresist layer of color light resistance layer 300) it can be good at being attached on inorganic passivation layer 500, it is made to improve The adhesive force of the organic photoresist layer and inorganic passivation layer 500 of color light resistance layer 300, while improving and making color light resistance layer 300 Organic photoresist layer homogeneity.
Further, in the present embodiment, white-light organic light-emitting portion 400 includes:First inorganic barrier layer 410, anode 420, the second inorganic barrier layer 430, white-light organic light-emitting functional layer 440 and cathode 450.
First inorganic barrier layer 410 is set to being located in the interval of color light resistance layer 300 and inorganic passivation layer 500 On part.In this way, due to being provided with inorganic passivation layer, the organic photoresist layer being coated with when making the first inorganic barrier layer 410 (is used In the organic photoresist layer for making the first inorganic barrier layer 410) can be good at being attached to inorganic passivation layer 500 be located at it is described between On part in, to improve the attachment of the organic photoresist layer and inorganic passivation layer 500 that make the first inorganic barrier layer 410 Power, while improving the homogeneity for the organic photoresist layer for making the first inorganic barrier layer 410.
Anode 420 is set to the part of the first inorganic barrier layer 410 and inorganic passivation layer 500 being located in the interval On.In the present embodiment, anode 420 has high reflectivity.Anode 420 through inorganic passivation layer 500 with metal pattern layer 200 Connection contact.
Second inorganic barrier layer 430 is set on anode 420, and has exposure anode in the second inorganic barrier layer 430 420 pixel limits hole 431.Further, in order to make white-light organic light-emitting functional layer 440 and 300 face of color light resistance layer, with Improve light utilization, it is preferable that pixel is made to limit hole 431 and 300 face of color light resistance layer.
White-light organic light-emitting functional layer 440 is set to pixel and limits in hole 431 and on anode 420;Cathode 450 is arranged In in white-light organic light-emitting functional layer 440.In the present embodiment, cathode 450 has high transmittance.
Further, as an example, further, white-light organic light-emitting functional layer 440 is from anode 420 to cathode 450 sequences include:Layer, hole transmission layer, white-light organic light-emitting layer, electron transfer layer, electron injecting layer occur for hole.Here, White-light organic light-emitting layer sends out white light.
The production method of the testing of materials device of white light OLED according to an embodiment of the invention is retouched in detail below It states.Fig. 2A to Fig. 2 E is the processing procedure figure of the testing of materials device of white light OLED according to an embodiment of the invention.
The production method of the testing of materials device of white light OLED according to an embodiment of the invention includes:
Step 1:With reference to Fig. 2A, a substrate 100 is provided.
Step 2:With reference to Fig. 2 B, metal pattern layer 200 is formed on the substrate 100.
Step 3:With reference to Fig. 2 C, inorganic passivation layer 500 is formed in metal pattern layer 200 and substrate 100.
Step 4:With reference to Fig. 2 D, color light resistance layer 300 is formed in being located on substrate 100 for inorganic passivation layer 500.
Step 5:With reference to Fig. 2 E, white-light organic light-emitting portion 400 is formed in color light resistance layer 300.
Further, Fig. 3 A to Fig. 3 E are the processing procedure figures in white-light organic light-emitting portion according to an embodiment of the invention.
In step 5, the method that white-light organic light-emitting portion 400 is formed in color light resistance layer 300 includes:
First, with reference to Fig. 3 A, on the part of color light resistance layer 300 and inorganic passivation layer 500 being located in the interval Form the first inorganic barrier layer 410.
Secondly, with reference to Fig. 3 B, in the portion of the first inorganic barrier layer 410 and inorganic passivation layer 500 being located in the interval Anode 420 is formed on point, and makes anode 420 through inorganic passivation layer 500 to be contacted with metal pattern layer 200.
Then, with reference to Fig. 3 C, it is organic that second that there is the pixel of exposure anode 420 to limit hole 431 is formed on anode 420 Barrier layer 430.Here, anode 420 has high reflectance.In addition, in order to make white-light organic light-emitting functional layer 440 and chromatic photoresist 300 face of layer, to improve light utilization, it is preferable that pixel is made to limit hole 431 and 300 face of color light resistance layer.
Then, it with reference to Fig. 3 D, is limited in pixel and forms white-light organic light-emitting functional layer 440 on the anode 420 in hole 431. Further, layer, hole transmission layer, white light occur for the hole for lamination being sequentially formed on the anode 420 in pixel restriction hole 431 Organic luminous layer, electron transfer layer, electron injecting layer.
Finally, it with reference to Fig. 3 E, is made in white-light organic light-emitting functional layer 440 and forms cathode 450.Here, cathode 450 has There is high transmittance.
In conclusion the present embodiment makes making the first inorganic barrier layer and chromatic photoresist by the way that inorganic passivation layer is arranged The organic photoresist layer being coated with when layer can be good at being attached on inorganic passivation layer, and the first inorganic barrier layer is made to improve With the adhesive force of color light resistance layer and inorganic passivation layer, while improving and making having for the first inorganic barrier layer and color light resistance layer The homogeneity of machine photoresist layer.
Although the present invention has shown and described with reference to specific embodiment, it should be appreciated by those skilled in the art that: In the case where not departing from the spirit and scope of the present invention limited by claim and its equivalent, can carry out herein form and Various change in details.

Claims (10)

1. a kind of testing of materials device of white light OLED, which is characterized in that including:
Substrate;
The metal pattern layer being set on the substrate;
The inorganic passivation layer being covered in the metal pattern layer and the substrate;
The color light resistance layer being set on the inorganic passivation layer on the substrate;And
It is set to the white-light organic light-emitting portion in the color light resistance layer.
2. the testing of materials device of white light OLED according to claim 1, which is characterized in that the white-light organic light-emitting portion Including:
The first inorganic barrier layer being covered in the color light resistance layer;
Anode on first inorganic barrier layer and the inorganic passivation layer is set, and the anode runs through the inorganic passivation Layer with the metal pattern layer to connect;
The second inorganic barrier layer being set on the anode has the picture of the exposure anode in second inorganic barrier layer Element limits hole;
It is set to the pixel and limits the white-light organic light-emitting functional layer in hole and being located on the anode;And
The cathode being set in the white-light organic light-emitting functional layer.
3. the testing of materials device of white light OLED according to claim 2, which is characterized in that the pixel limits hole and institute State color light resistance layer face.
4. the testing of materials device of white light OLED according to claim 2 or 3, which is characterized in that the organic hair of white light From the anode to the cathode, sequence includes light functional layer:Layer, hole transmission layer, white-light organic light-emitting layer, electricity occur for hole Sub- transport layer, electron injecting layer.
5. the testing of materials device of white light OLED according to claim 1, which is characterized in that the inorganic passivation layer is served as reasons SiNxOr SiOxThe single layer structure or the inorganic passivation layer being made are by SiNxAnd SiOxThe bilayer being made Structure.
6. a kind of production method of the testing of materials device of white light OLED, which is characterized in that including:
One substrate is provided;
Metal pattern layer is formed on the substrate;
Inorganic passivation layer is formed in the metal pattern layer and the substrate;
Color light resistance layer is formed on the inorganic passivation layer on the substrate;And
White-light organic light-emitting portion is formed in the color light resistance layer.
7. the production method of the testing of materials device of white light OLED according to claim 6, which is characterized in that in the coloured silk The method in formation white-light organic light-emitting portion includes in coloured light resistance layer and the inorganic passivation layer:
The first inorganic barrier layer is formed in the color light resistance layer;
Anode is formed on first inorganic barrier layer and the inorganic passivation layer, the anode runs through the inorganic passivation layer To be connect with the metal pattern layer;
The second inorganic barrier layer that there is the pixel of the exposure anode to limit hole is formed on the anode;
It is limited in the pixel and forms white-light organic light-emitting functional layer on the anode in hole;And
Cathode is formed in the white-light organic light-emitting functional layer.
8. the production method of the testing of materials device of white light OLED according to claim 7, which is characterized in that described When forming the pixel restriction hole in two inorganic barrier layers, the pixel is made to limit hole and the color light resistance layer face.
9. the production method of the testing of materials device of white light OLED according to claim 2 or 3, which is characterized in that in institute Stating the method that white-light organic light-emitting functional layer is formed on the anode in pixel restriction hole includes:The sun in hole is limited in the pixel Layer, hole transmission layer, white-light organic light-emitting layer, electron transfer layer, electron injecting layer occur for the hole that lamination is sequentially formed on extremely.
10. the production method of the testing of materials device of white light OLED according to claim 6, which is characterized in that the nothing Machine passivation layer is by SiNxOr SiOxThe single layer structure or the inorganic passivation layer being made are by SiNxAnd SiOxSystem Double-layer structure made of work.
CN201810106050.6A 2018-02-02 2018-02-02 Testing of materials device of white light OLED and preparation method thereof Pending CN108417599A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120169217A1 (en) * 2011-01-03 2012-07-05 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and method of manufacturing the same
CN103187428A (en) * 2011-12-30 2013-07-03 乐金显示有限公司 Organic light emitting display device and manufacturing method thereof
CN103219283A (en) * 2013-03-19 2013-07-24 京东方科技集团股份有限公司 Array substrate, manufacturing method of array substrate and display device of array substrate
CN104952879A (en) * 2015-05-05 2015-09-30 深圳市华星光电技术有限公司 Dual-gate TFT (thin-film transistor) substrate structure using COA (color filter on array) technique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120169217A1 (en) * 2011-01-03 2012-07-05 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and method of manufacturing the same
CN103187428A (en) * 2011-12-30 2013-07-03 乐金显示有限公司 Organic light emitting display device and manufacturing method thereof
CN103219283A (en) * 2013-03-19 2013-07-24 京东方科技集团股份有限公司 Array substrate, manufacturing method of array substrate and display device of array substrate
CN104952879A (en) * 2015-05-05 2015-09-30 深圳市华星光电技术有限公司 Dual-gate TFT (thin-film transistor) substrate structure using COA (color filter on array) technique

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