CN108413639A - Composite temperature fluctuation suppression structure using refrigerator as cold source - Google Patents
Composite temperature fluctuation suppression structure using refrigerator as cold source Download PDFInfo
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- CN108413639A CN108413639A CN201810307044.7A CN201810307044A CN108413639A CN 108413639 A CN108413639 A CN 108413639A CN 201810307044 A CN201810307044 A CN 201810307044A CN 108413639 A CN108413639 A CN 108413639A
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- 230000001629 suppression Effects 0.000 title abstract description 16
- 239000002131 composite material Substances 0.000 title abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 87
- 238000005057 refrigeration Methods 0.000 claims description 7
- 239000000696 magnetic material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 230000002401 inhibitory effect Effects 0.000 claims 1
- -1 rafifinal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 14
- 238000003466 welding Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000002238 attenuated effect Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
- F25B9/145—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle pulse-tube cycle
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/11—Reducing heat transfers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本发明涉及一种以制冷机为冷源的复合温度波动抑制结构，其包括：制冷机，其提供冷源；制冷机冷端法兰，其连接到所述制冷机；样品法兰，其与样品进行连接；在所述制冷机冷段法兰与所述样品法兰之间设置有复合温度波动抑制结构。本发明结合了热容法和热阻法两者各自的优点，采用薄片状的热容材料降低温度波动而基本不引起温度升高，采用细长且具有高导热的热阻材料降低温度波动而基本不引起温度升高；热容材料均采用高导热系数的低温胶或直接焊接的形式与其他部件相连接，杜绝了螺纹连接导致的接触热阻不可控的缺点。
The invention relates to a compound temperature fluctuation suppression structure using a refrigerator as a cold source, which includes: a refrigerator, which provides a cold source; a cold end flange of the refrigerator, which is connected to the refrigerator; a sample flange, which is connected to the refrigerator The sample is connected; a composite temperature fluctuation suppression structure is arranged between the cold section flange of the refrigerator and the sample flange. The present invention combines the respective advantages of the heat capacity method and the heat resistance method, adopts a thin sheet-shaped heat capacity material to reduce temperature fluctuations without causing temperature rise, and adopts a slender heat resistance material with high thermal conductivity to reduce temperature fluctuations. It basically does not cause temperature rise; heat capacity materials are connected with other components by low-temperature glue with high thermal conductivity or direct welding, which eliminates the disadvantage of uncontrollable contact thermal resistance caused by threaded connections.
Description
技术领域technical field
本发明涉及一种温度波动抑制结构，特别是涉及一种以制冷机为冷源的复合温度波动抑制结构。The invention relates to a temperature fluctuation suppression structure, in particular to a composite temperature fluctuation suppression structure using a refrigerator as a cold source.
背景技术Background technique
GM制冷机或GM脉冲管制冷机为目前唯一商用的4K温区制冷机，其在低温物理、医学等领域都有重要的应用，尤其在以制冷机为冷源的低温系统中，GM制冷机或GM脉冲管制冷机由于无需低温液体、操作便捷、运行时间长等优点而得到越来越多的应用。GM refrigerator or GM pulse tube refrigerator is currently the only commercial 4K temperature zone refrigerator, which has important applications in low-temperature physics, medicine and other fields, especially in low-temperature systems with refrigerators as cold sources, GM refrigerators Or GM pulse tube refrigerators are being used more and more due to the advantages of no cryogenic liquid, convenient operation, and long running time.
由于GM制冷机或GM脉冲管制冷机需要周期性的压力波驱动才可以产生制冷效应，其内部工质的温度将会随着压力的变化呈现周期性波动，加之低温下铜等材料的比热容很小，使得GM制冷机或GM脉冲管制冷机冷端换热器外部的温度存在较大幅度的波动(约200mK-500mK)，所以低温样品通常无法直接安装在制冷机冷端进行测试。为使制冷机冷端温度得到有效衰减，目前通常的做法分为两种，一种是热容法，即在制冷机冷端和样品之间增加液氦腔、铅块等低温高比热材料；另一种做法是热阻法，即在制冷机冷端和样品之间增加低导热材料。其中热容法将会增大制冷机冷端的负重和复杂度，并且温度波动抑制效果有限；而热阻法将会使得样品与制冷机存在较大的温差，使样品的最低温度升高。Since GM refrigerators or GM pulse tube refrigerators need periodic pressure wave drive to produce refrigeration effects, the temperature of the internal working medium will fluctuate periodically with pressure changes, and the specific heat capacity of materials such as copper at low temperatures is very high. The temperature outside the cold end heat exchanger of the GM refrigerator or GM pulse tube refrigerator fluctuates greatly (about 200mK-500mK), so low temperature samples usually cannot be directly installed on the cold end of the refrigerator for testing. In order to effectively attenuate the temperature at the cold end of the refrigerator, there are currently two common methods. One is the heat capacity method, that is, adding a liquid helium cavity, lead block and other low-temperature high-specific heat materials between the cold end of the refrigerator and the sample. ; Another approach is the thermal resistance method, that is, adding a low thermal conductivity material between the cold end of the refrigerator and the sample. Among them, the heat capacity method will increase the load and complexity of the cold end of the refrigerator, and the temperature fluctuation suppression effect is limited; while the thermal resistance method will cause a large temperature difference between the sample and the refrigerator, which will increase the minimum temperature of the sample.
针对目前制冷机冷端温度波动抑制方法的不足，需要提出一种简单有效的方法以实现样品温度波动的高效抑制。Aiming at the shortcomings of current methods for suppressing temperature fluctuations at the cold end of refrigerators, it is necessary to propose a simple and effective method to achieve efficient suppression of sample temperature fluctuations.
发明内容Contents of the invention
本发明的目的是解决传统以制冷机为冷源的样品结构及其温度波动抑制方法中存在的体积大、质量重、结构复杂、总热阻难以控制以及最低温度升高等问题。The purpose of the present invention is to solve the problems of large volume, heavy mass, complex structure, difficult control of total thermal resistance and rise of the minimum temperature in the traditional sample structure using a refrigerator as a cold source and its temperature fluctuation suppression method.
本发明提供了一种以制冷机为冷源的复合温度波动抑制结构，其包括：制冷机，其提供冷源；制冷机冷端法兰，其连接到所述制冷机；样品法兰，其与样品进行连接；在所述制冷机冷段法兰与所述样品法兰之间设置有复合温度波动抑制结构。The invention provides a compound temperature fluctuation suppression structure using a refrigerator as a cold source, which includes: a refrigerator, which provides a cold source; a cold end flange of the refrigerator, which is connected to the refrigerator; a sample flange, which It is connected with the sample; a composite temperature fluctuation suppression structure is arranged between the cold section flange of the refrigerator and the sample flange.
其中，所述复合温度波动抑制结构包括第一热容材料、热阻材料和第二热容材料。Wherein, the composite temperature fluctuation suppression structure includes a first heat capacity material, a heat resistance material and a second heat capacity material.
其中，述第一热容材料为HoCu2、Er3Ni、Er0.5Pr0.5、或ErNi等磁性材料。Wherein, the first heat capacity material is a magnetic material such as HoCu 2 , Er 3 Ni, Er 0.5 Pr 0.5 , or ErNi.
其中，所述第一热容材料为为铅等其他低温下具有较高比热容的材料。Wherein, the first heat capacity material is lead or other materials with high specific heat capacity at low temperature.
其中，所述第二热容材料为HoCu2、Er3Ni、Er0.5Pr0.5、或ErNi等磁性材料。Wherein, the second heat capacity material is a magnetic material such as HoCu 2 , Er 3 Ni, Er 0.5 Pr 0.5 , or ErNi.
其中，所述第二热容材料为为铅等其他低温下具有较高比热容的材料。Wherein, the second heat capacity material is lead or other materials with higher specific heat capacity at low temperature.
其中，所述第一热容材料与第二热容材料的材料相同。Wherein, the material of the first heat capacity material is the same as that of the second heat capacity material.
其中，所述第一热容材料与第二热容材料的材料不相同。Wherein, the materials of the first heat capacity material and the second heat capacity material are different.
其中，所述热阻材料为高纯无氧铜、高纯铝、蓝宝石或石墨烯等低温下具有高导热系数的材料。Wherein, the thermal resistance material is a material with high thermal conductivity at low temperature such as high-purity oxygen-free copper, high-purity aluminum, sapphire or graphene.
其中，所述制冷机为低振动的脉冲管制冷机，为样品提供2.2K-300K的工作温度。Wherein, the refrigerator is a low-vibration pulse tube refrigerator, which provides samples with a working temperature of 2.2K-300K.
本发明提出了一种复合温度波动抑制结构，使得采用简单的结构即可实现小温差下的温度波动高效抑制。The invention proposes a compound temperature fluctuation suppression structure, so that the temperature fluctuation under small temperature difference can be efficiently suppressed by adopting a simple structure.
附图说明Description of drawings
图1为本发明的复合温度波动抑制结构示意图。Fig. 1 is a schematic diagram of the composite temperature fluctuation suppression structure of the present invention.
具体实施方式Detailed ways
为了便于理解本发明，下面结合附图对本发明的实施例进行说明，本领域技术人员应当理解，下述的说明只是为了便于对发明进行解释，而不作为对其范围的具体限定。In order to facilitate the understanding of the present invention, the embodiments of the present invention will be described below in conjunction with the accompanying drawings. Those skilled in the art should understand that the following description is only for the convenience of explaining the present invention, not as a specific limitation on its scope.
本发明提供了一种复合温度波动抑制结构，图1为本发明的抑制结构示意图。如图1所示，本发明的复合温度波动抑制结构包括：制冷机1、制冷机冷端法兰2、第一热容材料3-1、热阻材料3-2、第二热容材料3-3、样品法兰4。其中制冷机1为样品测量所需的冷源；3-1、3-2和3-3形成成复合结构来抑制温度波动传递至样品法兰4；从而使得样品法兰4为样品提供无波动的恒定温度。The present invention provides a composite temperature fluctuation suppression structure, and FIG. 1 is a schematic diagram of the suppression structure of the present invention. As shown in Figure 1, the composite temperature fluctuation suppression structure of the present invention includes: a refrigerator 1, a cold end flange 2 of the refrigerator, a first heat capacity material 3-1, a heat resistance material 3-2, and a second heat capacity material 3 -3. Sample flange4. Among them, the refrigerator 1 is the cold source required for sample measurement; 3-1, 3-2 and 3-3 are formed into a composite structure to suppress temperature fluctuations from being transmitted to the sample flange 4; thus making the sample flange 4 provide the sample with no fluctuations constant temperature.
如图1所示的实施案例中，制冷机1，为低振动的脉冲管制冷机，可为样品提供2.2K-300K的工作温度，此时制冷机冷端法兰的温度原始波动约200mK-500mK。优选所述制冷机1可以为GM制冷机，或GM脉冲管制冷机、VM制冷机、VM脉冲管制冷机、斯特林制冷机、斯特林型脉冲管制冷机等其他采用压力波驱动的制冷机形式。In the implementation case shown in Figure 1, refrigerator 1 is a low-vibration pulse tube refrigerator that can provide samples with a working temperature of 2.2K-300K. At this time, the original temperature fluctuation of the cold end flange of the refrigerator is about 200mK- 500mK. Preferably, the refrigerator 1 can be a GM refrigerator, or a GM pulse tube refrigerator, a VM refrigerator, a VM pulse tube refrigerator, a Stirling refrigerator, a Stirling type pulse tube refrigerator, or other pressure wave-driven refrigerators. Refrigerator form.
第一热容材料3-1为薄片状，并通过高导热系数的低温胶粘贴在制冷机冷端法兰2上。所述第一热容材料3-1和制冷机冷端法兰2可以采用高导热系数的低温胶进行粘接，也可采用锡焊、银焊等其它焊接形式进行连接。The first heat capacity material 3-1 is in the shape of a sheet, and is pasted on the cold end flange 2 of the refrigerator by a low-temperature glue with high thermal conductivity. The first heat capacity material 3-1 and the cold end flange 2 of the refrigerator can be bonded by low-temperature glue with high thermal conductivity, or can be connected by other welding forms such as soldering and silver welding.
所述第一热容材料3-1的形状可以为圆形也可以为其他多边形，其厚度优选为0.01mm-10mm，其当量直径可以为小于制冷机冷端法兰2的任意尺寸；所述第一热容材料优选为HoCu2、Er3Ni、Er0.5Pr0.5、或ErNi等磁性材料；也可以为铅等其他低温下具有较高比热容的材料。The shape of the first heat capacity material 3-1 can be circular or other polygonal, its thickness is preferably 0.01mm-10mm, and its equivalent diameter can be any size smaller than the cold end flange 2 of the refrigerator; The first heat capacity material is preferably a magnetic material such as HoCu 2 , Er 3 Ni, Er 0.5 Pr 0.5 , or ErNi; it may also be other materials with higher specific heat capacity at low temperatures such as lead.
所述第一热容材料3-1在低温下具有较高的比热，热扩散系数低，从而自其上表面传递至下表面的温度波动可以得到有效衰减，温度波动可衰减至10mK左右，由于第一热容材料3-1厚度薄，其上下面的平均温度基本无差别。The first heat capacity material 3-1 has a high specific heat at low temperature and a low thermal diffusivity, so that the temperature fluctuation transmitted from the upper surface to the lower surface can be effectively attenuated, and the temperature fluctuation can be attenuated to about 10mK, Since the thickness of the first heat capacity material 3-1 is thin, there is basically no difference in the average temperature between its upper and lower sides.
热阻材料3-2与所述第一热容材料3-1相连接，所述热阻材料3-2与所述第一热容材料3-1之间可采用采用锡焊、银焊等其它焊接形式进行连接，也可以采用高导热系数的低温胶进行粘接。The heat resistance material 3-2 is connected to the first heat capacity material 3-1, and the heat resistance material 3-2 and the first heat capacity material 3-1 can be connected by soldering, silver soldering, etc. Other welding forms can be used for connection, and low-temperature adhesive with high thermal conductivity can also be used for bonding.
热阻材料3-2与热容材料3-1焊接至一起，热阻材料3-2选用低温下具有高导热系数的细长条状材料，高导热系数可保证平均温度基本不升高，细长丝状保证其截面积小而长度长，使得温度波动得到抑制，所以温度波动由热阻材料3-2的上端传至下端时，其温度波动可进一步衰减至1mK左右。The heat resistance material 3-2 is welded together with the heat capacity material 3-1. The heat resistance material 3-2 is a long and thin strip material with high thermal conductivity at low temperature. The high thermal conductivity can ensure that the average temperature does not rise basically, and the thin The filament shape ensures that the cross-sectional area is small and the length is long, so that the temperature fluctuation is suppressed, so when the temperature fluctuation is transmitted from the upper end to the lower end of the thermal resistance material 3-2, the temperature fluctuation can be further attenuated to about 1mK.
热阻材料3-2可以为细丝状，优选其直径为0.1mm-5mm，也可为薄片状，其厚度为0.1mm-5mm，其长度可为1mm-1m；使用时可以使一根，也可以为多根或者多根缠成的束状形式，根数1-10000根均可。热阻材料3-2可以为高纯无氧铜，也可为高纯铝、蓝宝石、石墨烯等低温下具有高导热系数的材料；热阻材料3-2的形状可以为C形，也可以为直线型、S形等其它形状，其界面形状可以为半圆形或圆形或椭圆形等任意适合的形状。The thermal resistance material 3-2 can be in the form of a filament, preferably with a diameter of 0.1mm-5mm, or a thin sheet with a thickness of 0.1mm-5mm and a length of 1mm-1m; It can also be in the form of a plurality of roots or a bundle formed by a plurality of roots, and the number of roots can be 1-10000. The thermal resistance material 3-2 can be high-purity oxygen-free copper, or high-purity aluminum, sapphire, graphene and other materials with high thermal conductivity at low temperatures; the shape of the thermal resistance material 3-2 can be C-shaped or It is linear, S-shaped and other shapes, and its interface shape can be any suitable shape such as semicircle, circle or ellipse.
第二热容材料3-3可选自HoCu2、Er3Ni、Er0.5Pr0.5、或ErNi等磁性材料，也可以为铅等其他低温下具有较高比热容的材料；第二热容材料3-3的形状可以为圆形也可以为其他多边形，其厚度为0.1mm-10mm，其当量直径可以为小于样品法兰4的任意尺寸。所述第二热容材料3-3为薄片状，所述第二热容材料3-3的上表面与热阻材料3-2相连接，所述热阻材料3-2与所述第二热容材料3-3之间可采用采用锡焊、银焊等其它焊接形式进行连接，也可以采用高导热系数的低温胶进行粘接；所述第二热容材料3-3的下表面通过高导热系数的低温胶粘贴在样品法兰4上。第二热容材料3-3和样品法兰2之间不局限采用高导热系数的低温胶进行粘接，也可采用锡焊、银焊等其它焊接形式进行连接。同第一热容材料3-1的原理一样，温度波动在经过热容材料3-3之后可进一步衰减至0.1mK以下，而整体的平均温度基本与制冷机冷端法兰3-1一致。The second heat capacity material 3-3 can be selected from magnetic materials such as HoCu 2 , Er 3 Ni, Er 0.5 Pr 0.5 , or ErNi, or other materials with high specific heat capacity at low temperatures such as lead; the second heat capacity material 3 The shape of -3 can be a circle or other polygons, its thickness is 0.1 mm-10 mm, and its equivalent diameter can be any size smaller than the sample flange 4 . The second heat capacity material 3-3 is in the shape of a sheet, the upper surface of the second heat capacity material 3-3 is connected to the heat resistance material 3-2, and the heat resistance material 3-2 is connected to the second heat capacity material 3-2. The heat capacity materials 3-3 can be connected by soldering, silver soldering and other welding methods, or can be bonded by low-temperature glue with high thermal conductivity; the lower surface of the second heat capacity material 3-3 passes through A low-temperature adhesive with high thermal conductivity is pasted on the sample flange 4. The bonding between the second heat capacity material 3 - 3 and the sample flange 2 is not limited to low-temperature glue with high thermal conductivity, and other welding forms such as tin soldering and silver soldering can also be used for bonding. Same as the principle of the first heat capacity material 3-1, the temperature fluctuation can be further attenuated to below 0.1mK after passing through the heat capacity material 3-3, and the overall average temperature is basically consistent with the cold end flange 3-1 of the refrigerator.
所述第一热容材料3-1和所述第二热容材料3-3可以为同一材料，也可为不同材料；采用第一热容材料3-1、热阻材料3-2和第二热容材料3-3形成复合结构连接制冷机冷端法兰2和样品法兰4时，可以采用1组，也可以采用多组，其数量可以为1-100组。The first heat capacity material 3-1 and the second heat capacity material 3-3 can be the same material or different materials; the first heat capacity material 3-1, the heat resistance material 3-2 and the second heat capacity material are used When the second heat capacity material 3-3 forms a composite structure to connect the cold end flange 2 of the refrigerator and the sample flange 4, one set or multiple sets can be used, and the number can be 1-100 sets.
本发明结合了热容法和热阻法两者各自的优点，采用薄片状的热容材料降低温度波动而基本不引起温度升高，采用细长且具有高导热的热阻材料降低温度波动而基本不引起温度升高；热容材料均采用高导热系数的低温胶或直接焊接的形式与其他部件相连接，杜绝了螺纹连接导致的接触热阻不可控的缺点。The present invention combines the respective advantages of the heat capacity method and the heat resistance method, adopts a thin sheet-shaped heat capacity material to reduce temperature fluctuations without causing temperature rise, and adopts a slender heat resistance material with high thermal conductivity to reduce temperature fluctuations. It basically does not cause temperature rise; heat capacity materials are connected with other components by low-temperature glue with high thermal conductivity or direct welding, which eliminates the disadvantage of uncontrollable contact thermal resistance caused by threaded connections.
可以理解的是，虽然本发明已以较佳实施例披露如上，然而上述实施例并非用以限定本发明。对于任何熟悉本领域的技术人员而言，在不脱离本发明技术方案范围情况下，都可利用上述揭示的技术内容对本发明技术方案作出许多可能的变动和修饰，或修改为等同变化的等效实施例。因此，凡是未脱离本发明技术方案的内容，依据本发明的技术实质对以上实施例所做的任何简单修改、等同变化及修饰，均仍属于本发明技术方案保护的范围内。It can be understood that although the present invention has been disclosed above with preferred embodiments, the above embodiments are not intended to limit the present invention. For any person skilled in the art, without departing from the scope of the technical solution of the present invention, the technical content disclosed above can be used to make many possible changes and modifications to the technical solution of the present invention, or be modified to be equivalent to equivalent changes. Example. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention, which do not deviate from the technical solution of the present invention, still fall within the protection scope of the technical solution of the present invention.
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