CN108408684B - Alignment bonding device for manufacturing MEMS (micro-electromechanical system) device - Google Patents

Abstract

The invention belongs to the technical field of alignment bonding, and relates to an alignment bonding device for manufacturing an MEMS (micro-electromechanical system) device. The device comprises a base, a main two-dimensional moving platform, a supporting frame, an auxiliary three-dimensional moving platform, a leveling component, a rotating component and a CCD (charge coupled device) observation component; the base is provided with a bracket, and the bracket is detachably provided with a CCD observation assembly; the main two-dimensional moving platform is fixed on the base, and the support frame is fixed on the main two-dimensional moving platform; the auxiliary three-dimensional moving platform is fixed on the support frame, the XY-axis moving platform is a magnet type moving platform, and the Z-axis moving platform is a spiral screw rod platform; the leveling component is in spherical contact leveling and is fixed on the Z-axis moving platform; the rotating assembly is used for spherical contact leveling and is positioned above the leveling assembly, and the incomplete sphere at the bottom is in contact with the leveling assembly. The alignment bonding device integrates the functions of alignment, leveling and bonding, and solves the problem of larger error of manually aligning the chip.

Description

An Alignment Bonding Device for MEMS Device Fabrication

technical field

The invention belongs to the technical field of alignment bonding, and relates to an alignment bonding device used for the manufacture of MEMS devices.

Background technique

The full English name of MEMS is: Micro-Electro-Mechanical Systems, also known as Micro-Electro-Mechanical Systems. Micro-electro-mechanical systems refer to high-tech devices with a size of a few millimeters or even smaller. An independent intelligent system is a micro-device or system that integrates micro-sensors, micro-actuators, micro-mechanical structures, micro-power and micro-energy sources, signal processing and control circuits, high-performance electronic integrated devices, interfaces, and communications. MEMS technology is the broadening and extension of microelectronics technology. It integrates microelectronics technology and precision machining technology. It is a revolutionary new technology and is widely used in high-tech industries. It is a key technology related to the country's scientific and technological development, economic prosperity and national defense security.

MEMS devices usually have 3D microstructures, such as microfluidic chips, and traditional processing methods are difficult to achieve 3D microstructure processing. Therefore, researchers propose a method of bonding two chips with microstructures on the upper and lower sides. Fabrication of 3D microstructures. The alignment bonding device generally realizes the precise bonding of two-layer chips through a CCD camera and a precision adjustment platform, but the microstructure on the chip is usually between a few microns and tens of microns. Even with the help of a microscope, manual adjustment will produce larger error.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide an alignment bonding device for the fabrication of micromechanical devices, so as to realize high-precision bonding of two-layer chips with microstructures.

Technical scheme of the present invention:

An alignment bonding device for MEMS device fabrication, comprising a base 1, a main two-dimensional mobile platform 2, a support frame 3, a secondary three-dimensional mobile platform 4, a leveling component 5, a rotating component 6 and a CCD observation component 7 ;

The base 1 is provided with a bracket for dismounting and installing the CCD observation assembly 7;

The main two-dimensional mobile platform 2 is a screw screw platform, which is fixed on the base 1; the main two-dimensional mobile platform 2 includes a casing, a slideway, a slider, a lead screw, a nut, a coupling and a nut seat , the support frame 3 is fixed on the nut seat;

The support frame 3 is a frame structure with a bottom plate, and the bottom plate is fixed on the nut seat of the main two-dimensional mobile platform 2. When the lead screw of the main two-dimensional mobile platform 2 rotates, the nut follows the rotation angle of the lead screw according to the corresponding rotation angle. The lead of the CCD is converted into linear motion, the main two-dimensional mobile platform 2 moves along the XY axis, and drives the support frame 3 to move along the XY axis, so as to realize the precise positioning of the chip and the CCD observation assembly 7; the support frame 3 The upper end of the glass plate A32 is provided with a slot, the glass plate A32 is inserted in the slot, and is fixed on the support frame 3 by bolts 31, and the upper chip of the microstructure is fixed on the lower surface of the glass plate A32; the X axis of the bottom plate of the support frame 3 There are vertical plates on both sides of the direction, one vertical plate is used to support the spiral differential head a411 of the auxiliary three-dimensional mobile platform 4, and the other vertical plate is pasted with a strong magnet sheet 412; A V-shaped guide rail 413 is fixed on the side, which is matched with the V-shaped guide rail 413 of the X-axis moving platform 41;

The auxiliary three-dimensional mobile platform 4 is a combined platform, located in the support frame 3 and fixed on the bottom plate of the support frame 3; the auxiliary three-dimensional mobile platform 4 includes an X-axis moving platform 41 and a Y-axis moving platform 42. and the Z-axis mobile platform 43; the X-axis mobile platform 41 is located at the bottom, and the V-shaped guide rail on the lower surface is matched with the V-shaped guide rail of the support frame 3, and the relative sliding is realized through the V-shaped guide rail; the Y-axis moving platform 42 is located on the upper surface of the X-axis moving platform 41, the V-shaped guide rail on the lower surface of the Y-axis moving platform 42 cooperates with the V-shaped guide rail on the upper surface of the X-axis moving platform 41, and relative sliding is realized through the V-shaped guide rail; the Z The axis moving platform 43 is fixed on one side of the vertical reinforcing plate of the Y axis moving platform 42;

The lower surface of the X-axis moving platform 41 is respectively fixed with V-shaped guide rails 413 on both sides of the Y-axis direction, which are matched with the V-shaped guide rails 413 on the support frame 3, and a V-shaped guide rail 413 is arranged between the two matching V-shaped guide rails 413. There is a cage 415, balls 414 are placed in the V-shaped grooves of the V-shaped guide rails 413, and relative sliding is realized through the cage 415 and the balls 414; the X-axis moving platform 41, on both sides of the X-axis direction, one side is equipped with a screw The differential head a411 is attached with a strong magnet piece 412 on the other side, which corresponds to the strong magnet piece 412 on the vertical plate of the bottom plate of the support frame 3; the upper surface of the X-axis moving platform 41 is provided with two sides in the Y direction. Vertical plate, a spiral differential head a411 is installed on the vertical plate on one side, the spiral differential head a411 is in contact with one side of the Y-axis moving platform 42, and a strong magnet sheet 412 is attached to the vertical plate on the other side, which is connected to the Y-axis moving platform. The strong magnet pieces 412 on the side of 42 correspond to each other; the upper surface of the X-axis moving platform 41 is fixed with V-shaped guide rails 413 on both sides in the X direction; the lower surface of the Y-axis moving platform 42 is fixed on both sides in the X direction There are V-shaped guide rails 413, through which the cage 415 and the balls 414 cooperate with the V-shaped guide rails 413 on the upper surface of the X-axis moving platform 41 to achieve relative sliding; the Y-axis moving platform 42, on both sides of the Y-axis direction, A spiral differential head a411 is installed on one side, and a strong magnet piece 412 is attached on the other side, which corresponds to the strong magnet piece 412 on the vertical plate of the X-axis moving platform 41; the repulsive force generated between the strong magnet pieces 412 in groups, The two helical differential heads a411 are in close contact with the sides of the X-axis moving platform 41 and the Y-axis moving platform 42 respectively, and are guided by the helical differential heads a411, so that the pre-compression force and the repulsive force of the helical differential heads a411 cancel each other out, and then adjust the screw The fine-tuning knob pair of the differential head a411 moves the three-dimensional mobile platform 4 along the X and Y axis directions respectively; the Y axis mobile platform 42 is provided with a vertical reinforcing plate, and the slideways, sliders, wires provided on the vertical reinforcing plate Lever, nut, nut seat, coupling and knob, the slideway is fixed on one side of the vertical reinforcing plate, the slider is connected with the slideway through the slide groove, and the other side of the slide is fixed on the vertical plate of the Z-axis moving platform 43 The screw and the nut are provided with an arc-shaped spiral groove, the screw and the nut are sleeved together to form a spiral raceway, and the ball is placed in the spiral raceway; one end of the lead screw is provided with a coupling, the knob is fixed on the coupling, and the nut The seat is a hollow structure and fits closely with one end of the nut. The upper surface of the nut seat is provided with a threaded hole for fixing the Z-axis moving platform 43; The process is converted into linear motion, thereby realizing that the Z-axis mobile platform 43 moves along the Z-axis direction; the Z-axis mobile platform 43 is a Γ-shaped structural plate composed of a vertical plate and a horizontal plate, and the vertical plate is fixed on the Y-axis mobile platform. On the nut seat of 42, there are spherical grooves 44 and threaded holes on the horizontal plate;

The leveling assembly 5 is matched with the threaded holes on the horizontal plate of the Z-axis moving platform 43 through bolts, and is movably connected to the horizontal plate of the Z-axis moving platform 43. The leveling assembly 5 includes a quick clamp 51, a ball clamp a52 , the connecting piece 53 and the ball clamp b54, the leveling assembly 5 is used to clamp and level the incomplete sphere 61; the ball clamp a52 and the ball clamp b54 have a semicircular opening on one side, and the two are symmetrical Placed, one end is connected by a connector 53, and the other end is connected by a quick clamp 51; the quick clamp 51 is a door buckle type clamp for clamping the incomplete sphere 61;

The rotating assembly 6 is used for spherical contact leveling and is located above the leveling assembly 5, and the incomplete sphere 61 at the bottom is in contact with the leveling assembly 5; the rotating assembly 6 is mainly composed of the incomplete sphere 61, the substrate 62. The object loading plate 63 and the rotating mechanism 64 are composed; the incomplete sphere 61 is fixed on the lower surface of the base plate 62, the lower hemisphere is complete, and is in contact with the spherical groove 44 on the horizontal plate of the Z-axis moving platform 43; the said The rotating mechanism 64 includes a spring tip 641, a moving block 642, a fixed block 643 and a helical differential head b644; the middle of the fixed block 643 is provided with a notch, the moving block 642 is located in the notch, and the fixed block 643 is fixed on the base plate 62. On the upper surface, the moving block 642 is fixed on the lower surface of the carrier plate 63; the helical differential head b644 and the spring tip 641 are in contact with both sides of the moving block 642 respectively, adjust the fine-tuning knob of the helical differential head b644, and push the moving block 642 to the side. One side of the spring tip 641 moves, so that the spring in the spring tip 641 is compressed, so that the moving block 642 drives the object carrier 63 to rotate around the central axis; the upper surface of the object carrier 63 is fixed with the glass plate B, the glass plate A lower chip with microstructures is fixed on the upper surface of B.

The base 1 is made of metal; the support frame 3 is made of aluminum alloy.

The frame of the support frame 3 is connected with the bottom plate by screws, or processed into one body.

The X-axis moving platform 41 , the Y-axis moving platform 42 and the Z-axis moving platform 43 are made of non-magnetically conductive materials.

Beneficial effects of the present invention:

1. Solve the problem of large error in manual alignment of the chip;

2. The screw screw has a self-locking function, which improves the positioning accuracy of the chip and the CCD observation assembly;

3. The position of the upper chip is fixed, and the precise positioning of the lower chip and the upper chip microstructure is realized through the auxiliary three-dimensional mobile platform and the rotating assembly;

4. The introduction of leveling components solves the gap problem caused by the non-parallel upper and lower chips;

5. It integrates alignment and bonding functions, simple operation and strong scalability, and can bond silicon wafer/PMMA, silicon wafer\glass, glass\PMMA and other chips.

Description of drawings

Figure 1 is a front view of the device of the present invention.

FIG. 2 is a right side view of FIG. 1 .

FIG. 3 is a top view of FIG. 1 .

FIG. 4 is a schematic structural diagram of the support frame 3 .

FIG. 5 is a schematic diagram of the fixing method of the glass plate A. FIG.

FIG. 6 is a schematic three-dimensional structure diagram of a secondary three-dimensional mobile platform.

FIG. 7 is a schematic diagram of the structure of the X-axis moving platform.

FIG. 8 is a schematic structural diagram of a Y-axis moving platform.

FIG. 9 is a schematic diagram of the positional relationship between the X-axis moving platform and the Y-axis moving platform.

Figure 10 is a schematic diagram of the combination of leveling and rotating components.

Figure 11 is a simple schematic diagram of the leveling assembly.

Figure 12 is a structural diagram of a quick clamp.

FIG. 13 is a schematic diagram of the connection between the substrate and the carrier board.

Figure 14 is a simple schematic diagram of the rotating assembly.

In the picture: 1 base; 2 main two-dimensional mobile platform; 3 support frame; 4 pairs of three-dimensional mobile platforms; 5 leveling components; 6 rotating components; 7 CCD observation components; 31 bolts; 32 glass plate A; 41 X axis Mobile platform; 42 Y-axis mobile platform; 43 Z-axis mobile platform; 44 spherical groove; 411 helical differential head a; 412 strong magnet sheet; a; 53 connector; 54 ball clamp b; 511 hook; 512 rivet; 513 nut; 514 round head nut; 515 handle; 516 pin; 517 sheet metal; 63 object plate; 64 rotating mechanism; 621 circular plate A; 622 circular plate B; 623 fastening screws; 641 spring top; 642 moving blocks;

Detailed ways

The present invention will be further described in detail below with reference to the accompanying drawings and technical solutions.

As shown in Figures 1-3, an alignment bonding device for MEMS device fabrication includes a base 1, a main two-dimensional mobile platform 2, a support frame 3, a secondary three-dimensional mobile platform 4, a leveling assembly 5, The rotating assembly 6 and the CCD observation assembly 7, the base 1 is provided with a bracket, the bracket can be detachably installed with the CCD observation assembly 7, the main two-dimensional moving platform 2 is a screw screw platform, fixed on the base 1, and the two-dimensional moving platform 2 is provided with There is a support frame 3 , and the support frame 3 can realize the XY axis movement, and realize the precise positioning of the chip and the CCD observation assembly 7 .

As shown in Figure 4-5, the upper end of the support frame 3 is provided with a slot into which the glass plate A 32 can be inserted. The glass plate A 32 is fixed on the support frame 3 by six bolts 31, and the upper chip with microstructure is fixed On the lower surface of glass plate A32.

As shown in FIG. 6 , the auxiliary three-dimensional mobile platform 4 is located in the support frame 3 and is fixed on the bottom plate of the support frame 3. The X and Y axis movements are magnet-type movements to realize the positioning of the lower chip and the upper chip in the X and Y axis directions. The Z-axis movement is a screw-screw type movement, which is self-locking and accurate in positioning. It can not only achieve direct contact between the upper and lower chip surfaces, but also apply a certain bonding force.

As shown in Fig. 10, the rotating component 6 is a spherical contact leveling, located above the leveling component 5 and in contact with the leveling component 5; the glass plate B is fixed on the rotating component 6, the fixing method is not unique, and has a microstructure The lower chip is fixed on the upper surface of the glass plate B, and the specific operation is as follows: The relative position of the chip and the CCD observation assembly 7 can be realized by adjusting the main two-dimensional mobile platform 2 to obtain the best observation field and magnification. Adjust the screw screw in the Z-axis direction to make the upper and lower chips pre-contact, release the quick clamp 51, the incomplete sphere 61 can freely rotate around the spherical surface of the ball clip a52 and the ball clip b54, continue to raise the screw screw until the Z axis When the displacement reaches the limit, the quick clamp 51 is fastened to realize the relative fixation of the ball clamp a52, the ball clamp b54 and the incomplete sphere 61. At this time, the lower chip is in direct contact with the upper chip without gaps, and then the screw screw is lowered to obtain high-precision parallel surfaces. Adjust the X-axis moving platform 41, the Y-axis moving platform 42, and the rotating assembly 6 to achieve the precise microstructure of the upper and lower chips. Align, and finally raise the screw screw again to apply a certain bonding force evenly. The bonding device of the present invention integrates the functions of alignment, leveling and bonding, and solves the problem of large errors in manually aligning chips.

Further, the material of the base 1 is preferably a metal material with high strength, some threaded holes need to be machined on the base 1 to facilitate fixing the main two-dimensional mobile platform 2, and the base 1 should have a certain weight to prevent the overall device from tipping. The support frame 3 is preferably made of an aluminum alloy material with a lighter weight, and the frame and the bottom plate can be connected by screws or processed into one body.

Further, the X-axis moving platform 41, the Y-axis moving platform 42, and the Z-axis moving platform 43 are made of non-magnetic materials, as shown in FIG. , corresponding to the strong magnet pieces on the vertical plate on the bottom plate of the support frame 3; the strong magnet pieces in the Y-axis direction of the Y-axis moving platform 42 correspond to the strong magnet pieces on the vertical plate of the X-axis moving platform 41; A certain repulsive force will be generated between the strong magnetic sheets, and the spiral differential head a411 is in close contact with the sides of the X-axis moving platform 41 and the Y-axis moving platform 42. The pressing force and the repulsive force cancel each other out, and then adjust the fine-tuning knob to move the lower chip along the X and Y axes.

Further, the incomplete sphere 61 and the spherical groove 44 need to have certain machining accuracy.

Further, as shown in FIG. 12 , the door buckle type quick clamp 51 adopts commercially available products, including a hook 511 , a rivet 512 , a nut 513 , a round head nut 514 , a handle 515 , a pin 516 , a sheet metal 517 , and a tension link 518 , the tensioning link 518 is U-shaped, the closed end is fixed on the hook 511, and the open end is fixed on the sheet metal 517 through the nut 513, the round head nut 514 and the pin 516; the handle 515 It is fixedly installed on the sheet metal 517 and located in the middle of the open end of the tension link 518; but it is not limited to this fixing method.

Further, the object carrier plate 63 of the rotating assembly is a movable part relative to the base plate 62. The connection method is shown in Figure 13. The circular plate A621 is connected to the upper surface of the base plate 62 by bolts, and the center of the circular plate A621 is provided with a one-way cylindrical structure. The circular plate B622 is connected to the lower surface of the carrier plate 63 by bolts. The center of the circular plate B622 is provided with a one-way column hole structure. The one-way column structure and the one-way column hole structure are assembled with a gap. Countersunk head hole, the fastening screw 623 passes through the countersunk head hole and contacts with the one-way column hole, this connection method keeps the object carrier 63 horizontal, and loosening the fastening screw 623 can make the object carrier 63 revolve around the central axis in a wide range turn. Under the condition of tightening the screw 623, the rotating mechanism 64 relatively rotates the object plate 63 around the central axis in a small range. The rotating mechanism 64 is shown in FIG. 14 , the moving block 642 is fixed on the object carrier 63 by bolts, the fixed block 643 is fixed on the base plate 62 by bolts, the helical differential head b644 and the spring tip 641 are in contact with both sides of the moving block 642 respectively, By adjusting the fine adjustment knob of the helical differential head b644, the spring in the spring tip 641 is compressed, so that the moving block 642 drives the carrier plate 63 to rotate.

Further, the fixing method of the glass plate must be easy to disassemble. As shown in Figure 5, the glass plate A32 can be easily removed by loosening the six bolts that fix the glass plate A32, but the fixing method of the glass plate B is not unique, such as: rotating A square PDMS can be placed on the carrier plate 63 of the component 6. Using the softness and adsorption properties of PDMS, it adheres to the bottom of the glass plate, and the glass plate can be fixed on the carrier plate. If the chip has been processed by plasma and other means, the alignment and bonding will also be completed at the same time. If it has not been processed, because the glass plate A32 and the glass plate B are easy to disassemble, you can use clips to fix the two glass plates and the chip at the same time. Heating, etc.

Claims (5)

1. an alignment bonding device for the manufacture of MEMS devices, characterized in that the alignment bonding device comprises a base (1), a main two-dimensional mobile platform (2), a support frame (3), a secondary three-dimensional type moving platform (4), leveling assembly (5), rotating assembly (6) and CCD observation assembly (7); The base (1) is provided with a bracket for dismounting and installing the CCD observation assembly (7); The main two-dimensional mobile platform (2) is a screw screw platform, which is fixed on the base (1); the main two-dimensional mobile platform (2) includes a casing, a slideway, a slider, a lead screw, a nut, Coupling and nut seat, the support bracket (3) is fixed on the nut seat; The support frame (3) is a frame structure with a bottom plate, the bottom plate is fixed on the nut seat of the main two-dimensional mobile platform (2), and when the lead screw of the main two-dimensional mobile platform (2) rotates, the nut follows the thread The rotation angle of the rod is converted into linear motion according to the corresponding lead, the main two-dimensional moving platform (2) moves along the XY axis, and drives the support frame (3) to move along the XY axis, so as to realize the chip and CCD observation assembly ( 7) precise positioning; the upper end of the support frame (3) is provided with a slot, the glass plate A (32) is inserted in the slot, and is fixed on the support frame (3) by bolts (31), and the glass plate A (32) is inserted into the slot. A microstructured upper chip is fixed on the lower surface of A (32); vertical plates are provided on both sides of the bottom plate of the support frame (3) in the X-axis direction, and one vertical plate is used to support the auxiliary three-dimensional mobile platform (4) The spiral differential head a (411) on the other side of the vertical plate is attached with a strong magnet sheet (412); V-shaped guide rails (413) are fixed on both sides of the bottom plate of the support frame (3) in the Y-axis direction, and the X-axis mobile platform The V-shaped guide rail (413) of (41) is matched; The auxiliary three-dimensional mobile platform (4) is a combined platform, located in the support frame (3) and fixed on the bottom plate of the support frame (3); the auxiliary three-dimensional mobile platform (4) includes an X-axis movement A platform (41), a Y-axis moving platform (42) and a Z-axis moving platform (43); the X-axis moving platform (41) is located at the bottom, and the V-shaped guide rails on the lower surface and the V-shaped guide rails of the support frame (3) In cooperation, relative sliding is realized through the V-shaped guide rail; the Y-axis moving platform (42) is located on the upper surface of the X-axis moving platform (41), and the V-shaped guide rail on the lower surface of the Y-axis moving platform (42) is connected to the X-axis. The V-shaped guide rails on the upper surface of the mobile platform (41) cooperate with each other, and relative sliding is realized through the V-shaped guide rails; the Z-axis moving platform (43) is fixed on one side of the vertical reinforcing plate of the Y-axis moving platform (42); V-shaped guide rails (413) are respectively fixed on the lower surface of the X-axis moving platform (41) on both sides in the Y-axis direction, and are matched with the V-shaped guide rails (413) on the support frame (3), and the matched two guide rails (413). A cage (415) is arranged between the V-shaped guide rails (413), balls (414) are placed in the V-shaped grooves of the V-shaped guide rails (413), and relative sliding is achieved through the cage (415) and the balls (414); Said X-axis moving platform (41) is installed on both sides in the X-axis direction, one side is provided with a helical differential head a (411), the other side is affixed with a strong magnet sheet (412), and the bottom plate of the support frame (3) is attached. The strong magnet pieces (412) on the vertical plate correspond; the upper surface of the X-axis moving platform (41) is provided with vertical plates on both sides in the Y direction, and a helical differential head a (411) is installed on the vertical plate on one side , the spiral differential head a (411) is in contact with one side of the Y-axis moving platform (42), and a strong magnet sheet (412) is attached to the vertical plate on the other side, which is in contact with the strong magnet on the side of the Y-axis moving platform (42). The plate (412) corresponds; the upper surface of the X-axis moving platform (41) is fixed with V-shaped guide rails (413) on both sides in the X direction; the lower surface of the Y-axis moving platform (42) is in the X direction. V-shaped guide rails (413) are fixed on both sides, and the relative sliding is realized by matching with the V-shaped guide rails (413) on the upper surface of the X-axis moving platform (41) through the cage (415) and the balls (414). The axis moving platform (42) is installed on both sides of the Y axis direction, one side is equipped with a helical differential head a (411), and the other side is attached with a strong magnet sheet (412), which is connected to the vertical plate of the X axis moving platform (41). The strong magnet pieces (412) corresponding to each other; the repulsive force generated between the groups of strong magnet pieces (412), the two helical differential heads a (411) are respectively connected with the X-axis moving platform (41), the Y-axis moving platform ( 42) are in close contact with the sides, guided by the helical differential head a (411), so that the pre-compression force and the repulsive force of the helical differential head a (411) cancel each other, and then adjust the three-dimensional fine-tuning knob pair of the helical differential head a (411). The vertical moving platform (4) moves along the X and Y axis directions respectively; the Y axis moving platform (42) is provided with a vertical reinforcing plate, and the vertical reinforcing plate is provided with slideways, sliders, leadscrews, nuts, The nut seat, the coupling and the knob, the slideway is fixed on one side of the vertical reinforcing plate, the slider and the slideway are connected by the slideway, and the other side of the slider is fixed on the vertical plate of the Z-axis moving platform (43); The screw rod and the nut are provided with an arc-shaped helical groove. The screw rod and the nut are assembled together to form a spiral raceway, and balls are placed in the spiral raceway; one end of the lead screw is provided with a coupling, the knob is fixed on the coupling, and the nut seat is The hollow structure is closely matched with one end of the nut, and the upper surface of the nut seat is provided with a threaded hole for fixing the Z-axis moving platform (43). The process is converted into linear motion, so that the Z-axis moving platform (43) moves along the Z-axis direction; the Z-axis moving platform (43) is a vertical plate and a a Γ-shaped structural plate composed of a horizontal plate, the vertical plate is fixed on the nut seat of the Y-axis moving platform (42), and the horizontal plate is provided with spherical grooves (44) and threaded holes; The leveling assembly (5) is matched with the threaded holes on the horizontal plate of the Z-axis moving platform (43) through bolts, and is movably connected to the horizontal plate of the Z-axis moving platform (43). The leveling assembly (5) It includes a quick clamp (51), a ball clamp a (52), a connecting piece (53) and a ball clamp b (54), and the leveling assembly (5) is used to clamp and level the incomplete sphere (61); The ball clamp a (52) and the ball clamp b (54) have a semicircular opening on one side, the two are placed symmetrically, one end is connected by a connector (53), and the other end is connected by a quick clamp (51); Said quick clamp (51) is a door buckle type clamp for clamping the incomplete sphere (61); The rotating assembly (6) is used for spherical contact leveling and is located above the leveling assembly (5), and the incomplete sphere (61) at the bottom is in contact with the leveling assembly (5); the rotating assembly ( 6) It is mainly composed of an incomplete sphere (61), a base plate (62), an object carrier (63) and a rotating mechanism (64); the incomplete sphere (61) is fixed on the lower surface of the base plate (62), The hemisphere is complete and is in contact with the spherical groove (44) on the horizontal plate of the Z-axis moving platform (43); the rotating mechanism (64) includes a spring tip (641), a moving block (642), and a fixed block (643) and the helical differential head b (644); the middle of the fixed block (643) is provided with a notch, the moving block (642) is located in the notch, the fixed block (643) is fixed on the upper surface of the base plate (62), and the moving block (642) is fixed on the lower surface of the carrier plate (63); the helical differential head b (644) and the spring tip (641) are in contact with both sides of the moving block (642) respectively, and the helical differential head b (644) is adjusted The fine adjustment knob pushes the moving block (642) to the side of the spring top (641), so that the spring in the spring top (641) is compressed, so that the moving block (642) drives the carrier plate (63) to rotate around the central axis ; A glass plate B is fixed on the upper surface of the object carrier plate (63), and a lower chip with a microstructure is fixed on the upper surface of the glass plate B. 2 . The alignment bonding device for MEMS device fabrication according to claim 1 , wherein the base ( 1 ) is made of metal; the support frame ( 3 ) is made of aluminum alloy. 3 . material. 3 . The alignment bonding device for MEMS device fabrication according to claim 1 or 2 , wherein the frame of the support frame ( 3 ) and the bottom plate are connected by screws or processed into one body. 4 . 4. The alignment bonding device for MEMS device fabrication according to claim 1 or 2, wherein the X-axis moving platform (41), the Y-axis moving platform (42) and the Z-axis are The moving platform (43) is made of non-magnetic material. 5. The alignment bonding device for MEMS device fabrication according to claim 3, wherein the X-axis moving platform (41), the Y-axis moving platform (42) and the Z-axis moving platform (43) Made of non-magnetic material.

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