CN108401355A - A kind of Novel circuit board based on heat conductive silica gel - Google Patents
A kind of Novel circuit board based on heat conductive silica gel Download PDFInfo
- Publication number
- CN108401355A CN108401355A CN201710068504.0A CN201710068504A CN108401355A CN 108401355 A CN108401355 A CN 108401355A CN 201710068504 A CN201710068504 A CN 201710068504A CN 108401355 A CN108401355 A CN 108401355A
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- silica gel
- blind
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of Novel circuit boards based on heat conductive silica gel, including include the first heat dissipating layer, protective layer, conductive layer, base and the second heat dissipating layer successively from top to bottom；There is first through hole in first heat dissipating layer; there is the second through-hole in second heat dissipating layer; circuit board further includes multiple first blind holes and multiple second blind holes; the open end of first blind hole and the first through hole unicom; the blind end of first blind hole is located in the protective layer; the open end of second blind hole and the second through-hole unicom, the blind end of the second blind hole are located in the base, and heat conductive silica gel is each filled in the first and second blind hole；Circuit board further includes the second thermally conductive sheet through the first thermally conductive sheet of the first through hole and through the second through-hole, and the first and second thermally conductive sheet is connected by connection sheet, has multiple radiating fins in connection sheet.The heat dissipation for circuit board effect of the present invention is good.
Description
Technical field
The present invention relates to circuit fields, and in particular to a kind of Novel circuit board based on heat conductive silica gel.
Background technology
Circuit board is the component for being integrated with multiple electronic devices on it, especially as the progress of technology, existing circuit
More electronic devices are integrated on plate, it is also increasing to the calorific value of circuit board, if heat dissipation is bad, circuit can be caused
The efficiency of plate declines, or even damage.
Invention content
Goal of the invention：The present invention is directed to overcome the deficiencies of existing technologies, a kind of new-type circuit based on heat conductive silica gel is provided
Plate.
Technical solution：A kind of circuit board includes the first heat dissipating layer, protective layer, conductive layer, base and the successively from top to bottom
Two heat dissipating layers；There is first through hole in first heat dissipating layer, there is the second through-hole, the circuit board in second heat dissipating layer
Further include multiple first blind holes and multiple second blind holes, the open end of first blind hole and the first through hole unicom are described
The blind end of first blind hole is located in the protective layer, the open end of second blind hole and the second through-hole unicom, and described second
The blind end of blind hole is located in the base, and heat conductive silica gel is each filled in first and second blind hole；The circuit board further includes passing through
The first thermally conductive sheet of the first through hole and the second thermally conductive sheet through second through-hole are worn, first and second thermally conductive sheet is logical
Connection sheet connection is crossed, there are multiple radiating fins in the connection sheet.
A new step, the base is made of polyimide material.
A new step, the conductive layer is copper foil.
A new step, first and second thermally conductive sheet is made of albronze.
A new step, the connection sheet and multiple radiating fins are integrally formed, the connection sheet and multiple radiating fins by
Albronze is made.
A new step, the first through hole is the through-hole of rectangular shape, and parallel with the protective layer.
A new step, second through-hole is the through-hole of rectangular shape, and parallel with the base.
A new step, first and second heat dissipating layer is insulating radiation layer.
Advantageous effect：The circuit board of the present invention exports heat by heat conductive silica gel, and by thermally conductive sheet and radiating fin, makes
It is strong to obtain heat dissipation effect.
Description of the drawings
Fig. 1 is circuit board schematic diagram.
Specific implementation mode
Reference numeral：1 protective layer；2 conductive layers；3 bases；11 first heat dissipating layers；21 second heat dissipating layers；12 first heat conduction
Piece；22 second thermally conductive sheets；13 first blind holes；23 second blind holes；4,5 connection sheet；4.1,5.1 radiating fin.
A kind of circuit board is dissipated including the first heat dissipating layer 11, protective layer 1, conductive layer 2, base 3 and second successively from top to bottom
Thermosphere 21；There is first through hole in first heat dissipating layer 11, there is the second through-hole, the circuit in second heat dissipating layer 21
Plate further includes multiple first blind holes 13 and multiple second blind holes 23, and open end and the first through hole of first blind hole 13 join
Logical, the blind end of first blind hole 13 is located in the protective layer, and open end and the second through-hole of second blind hole 23 join
Logical, the blind end of second blind hole 23 is located in the base, and heat conductive silica gel is each filled in first and second blind hole；It is described
Circuit board further includes the second thermally conductive sheet 22 through the first thermally conductive sheet 12 of the first through hole and through second through-hole, institute
It states the first and second thermally conductive sheet to connect by connection sheet 4,5, there are multiple radiating fins 4.1,5.1 in the connection sheet 4,5.It is described
Base is made of polyimide material.The conductive layer is copper foil.First and second thermally conductive sheet 12,22 is by albronze system
At.The connection sheet and multiple radiating fins are integrally formed, and the connection sheet and multiple radiating fins are made of albronze.Institute
The through-hole that first through hole is rectangular shape is stated, and parallel with the protective layer.Second through-hole is the logical of rectangular shape
Hole, and it is parallel with the base.First and second heat dissipating layer 11,21 is insulating radiation layer.
The circuit board of the present invention, the heat of protective layer are transferred to the first thermally conductive sheet by the heat conductive silica gel in the first blind hole,
Connection sheet is transferred to again to shed from radiating fin；Silica gel of the heat of base out of second blind hole is transferred to the second thermally conductive sheet, then
Connection sheet is transferred to shed from radiating fin.And the heat of protective layer can also be transferred directly to the first heat dissipating layer and give out
It goes, the heat of base can also be transferred directly to the second heat dissipating layer and distribute.
Although the present invention is illustrated and has been described with regard to preferred embodiment, it is understood by those skilled in the art that
Without departing from scope defined by the claims of the present invention, variations and modifications can be carried out to the present invention.
Claims (8)
1. a kind of Novel circuit board based on heat conductive silica gel, which is characterized in that include the first heat dissipating layer, protection successively from top to bottom
Layer, conductive layer, base and the second heat dissipating layer；There is first through hole in first heat dissipating layer, have in second heat dissipating layer
Second through-hole, the circuit board further include multiple first blind holes and multiple second blind holes, the open end of first blind hole and institute
First through hole unicom is stated, the blind end of first blind hole is located in the protective layer, the open end of second blind hole and the
The blind end of two through-hole unicom, second blind hole is located in the base, and thermal conductive silicon is each filled in first and second blind hole
Glue；The circuit board further includes the second heat conduction through the first thermally conductive sheet of the first through hole and through second through-hole
Piece, first and second thermally conductive sheet are connected by connection sheet, have multiple radiating fins in the connection sheet.
2. the Novel circuit board according to claim 1 based on heat conductive silica gel, which is characterized in that the base is by polyamides Asia
Amine material is made.
3. the Novel circuit board according to claim 1 based on heat conductive silica gel, which is characterized in that the conductive layer is copper
Foil.
4. the Novel circuit board according to claim 1 based on heat conductive silica gel, which is characterized in that first and second heat conduction
Piece is made of albronze.
5. the Novel circuit board according to claim 1 based on heat conductive silica gel, which is characterized in that the connection sheet and multiple
Radiating fin is integrally formed, and the connection sheet and multiple radiating fins are made of albronze.
6. the Novel circuit board according to claim 1 based on heat conductive silica gel, which is characterized in that the first through hole is length
The through-hole of cube shape, and it is parallel with the protective layer.
7. the Novel circuit board according to claim 1 based on heat conductive silica gel, which is characterized in that second through-hole is length
The through-hole of cube shape, and it is parallel with the base.
8. according to the Novel circuit board described in claim 1 based on heat conductive silica gel, which is characterized in that first and second heat dissipating layer
It is insulating radiation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710068504.0A CN108401355A (en) | 2017-02-08 | 2017-02-08 | A kind of Novel circuit board based on heat conductive silica gel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710068504.0A CN108401355A (en) | 2017-02-08 | 2017-02-08 | A kind of Novel circuit board based on heat conductive silica gel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108401355A true CN108401355A (en) | 2018-08-14 |
Family
ID=63093854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710068504.0A Pending CN108401355A (en) | 2017-02-08 | 2017-02-08 | A kind of Novel circuit board based on heat conductive silica gel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108401355A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020232761A1 (en) * | 2019-05-22 | 2020-11-26 | 昆山欧贝达电子科技有限公司 | Circuit board substrate having high thermal conductivity |
-
2017
- 2017-02-08 CN CN201710068504.0A patent/CN108401355A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020232761A1 (en) * | 2019-05-22 | 2020-11-26 | 昆山欧贝达电子科技有限公司 | Circuit board substrate having high thermal conductivity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180814 |
|
| WD01 | Invention patent application deemed withdrawn after publication |