CN108396929A - A kind of composite ceramics plank and preparation method thereof - Google Patents
A kind of composite ceramics plank and preparation method thereof Download PDFInfo
- Publication number
- CN108396929A CN108396929A CN201810339226.2A CN201810339226A CN108396929A CN 108396929 A CN108396929 A CN 108396929A CN 201810339226 A CN201810339226 A CN 201810339226A CN 108396929 A CN108396929 A CN 108396929A
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- China
- Prior art keywords
- ceramic
- adhesive layer
- thin plate
- glue
- tile
- Prior art date
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- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 187
- 239000002131 composite material Substances 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000012790 adhesive layer Substances 0.000 claims abstract description 44
- 150000001875 compounds Chemical class 0.000 claims abstract description 5
- 238000005498 polishing Methods 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 39
- 239000007787 solid Substances 0.000 claims description 30
- 239000003822 epoxy resin Substances 0.000 claims description 21
- 229920000647 polyepoxide Polymers 0.000 claims description 21
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 15
- 239000004831 Hot glue Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 12
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 12
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 12
- 229910052731 fluorine Inorganic materials 0.000 claims description 12
- 239000011737 fluorine Substances 0.000 claims description 12
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 10
- 229920000570 polyether Polymers 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 6
- 241000276489 Merlangius merlangus Species 0.000 claims description 6
- 239000006004 Quartz sand Substances 0.000 claims description 6
- 229920002472 Starch Polymers 0.000 claims description 6
- -1 alcohol ester Chemical class 0.000 claims description 6
- 125000002057 carboxymethyl group Chemical group [H]OC(=O)C([H])([H])[*] 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 6
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 claims description 6
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims description 6
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims description 6
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 claims description 6
- 239000004816 latex Substances 0.000 claims description 6
- 229920000126 latex Polymers 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 6
- 239000011118 polyvinyl acetate Substances 0.000 claims description 6
- 239000003469 silicate cement Substances 0.000 claims description 6
- 239000008107 starch Substances 0.000 claims description 6
- 235000019698 starch Nutrition 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 5
- 229910052573 porcelain Inorganic materials 0.000 claims description 5
- 229920002125 Sokalan® Polymers 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 235000013312 flour Nutrition 0.000 claims description 4
- 239000004584 polyacrylic acid Substances 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 230000008719 thickening Effects 0.000 claims description 4
- 239000010426 asphalt Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000005034 decoration Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000047 product Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 241000264877 Hippospongia communis Species 0.000 description 3
- 230000003712 anti-aging effect Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011449 brick Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F13/00—Coverings or linings, e.g. for walls or ceilings
- E04F13/07—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
- E04F13/08—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
- E04F13/14—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements stone or stone-like materials, e.g. ceramics concrete; of glass or with an outer layer of stone or stone-like materials or glass
- E04F13/142—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements stone or stone-like materials, e.g. ceramics concrete; of glass or with an outer layer of stone or stone-like materials or glass with an outer layer of ceramics or clays
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
- C04B28/02—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing hydraulic cements other than calcium sulfates
- C04B28/04—Portland cements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Civil Engineering (AREA)
- Finishing Walls (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of composite ceramics planks, including from top to bottom decorating film disposed in parallel, adhesive layer, ceramic thin plate, adhesive layer and porous ceramic plate successively, adhesive layer is for bonding decorating film and ceramic thin plate, adhesive layer is surface without the Ceramic Tiles of glaze or surface without polishing for bonding ceramic thin plate and porous ceramic plate, ceramic thin plate.Correspondingly, the invention also discloses a kind of preparation method of above-mentioned composite ceramics plank, include the following steps：The surface of ceramic thin plate is processed；Decorating film and ceramic thin plate are bonded by adhesive layer；Ceramic thin plate and porous ceramic plate is compound by adhesive layer；Obtain composite ceramics plank.By being compounded on porous ceramic plate after decorating film is arranged on the surface of ceramic thin plate, this decorative ceramic board has good decorative effect, not only light but also at low cost, manufacture craft is simple.The composite ceramics plank of the present invention can be used for inner wall decoration, decoration of exterior wall.
Description
Technical field
The present invention relates to technical field of construction and decoration materials more particularly to a kind of composite ceramics plank and preparation method thereof.
Background technology
The incrustation of ceramic tile is typically to be realized by techniques such as glazing, stamps, and the adobe after glazing or stamp is fired
As the ceramic tile with picture on surface decorative pattern, although diversified pattern may be implemented, pattern is not fine enough, and surface is arranged
The cost of pattern is higher.
Foamed ceramic passes through the development of more than ten years, has reached its maturity in architectural pottery application aspect, has stepped into scale
Change big production and Application in Building stage.In general, foamed ceramic production technology can be divided into according to the difference of production technology
Saggar filling process and cloth direct pressure forming technique, product its density range that the former produces is between 0.2-0.8, it is contemplated that fortune
The problem of defeated and product brittle strength, for general control 0.6 or so, density can also be lower.It needs to lead to after the firing of such product
The three-dimensional shape that semi-finished product are cut into rule by cutting equipment is crossed, but surface is that uniform cavernous structure needs to decorate by the later stage
It could apply.Such product is widely used in indoor partition at this stage, needs the later stage to carry out plaster and scrapes the techniques such as porcelain, incrustation
Single effect.
Invention content
It is an object of the invention to propose a kind of composite ceramics plank, have the characteristics that surface decoration effect is diversified..
It is an object of the invention to propose a kind of preparation method of composite ceramics plank, have the characteristics that simple for process.
For this purpose, the present invention uses following technical scheme：
A kind of composite ceramics plank, including decorating film disposed in parallel, adhesive layer, ceramic thin plate, viscous successively from top to bottom
Close layer and porous ceramic plate, adhesive layer is for bonding decorating film and ceramic thin plate, and adhesive layer is for bonding ceramic thin plate and porous
Ceramic wafer, ceramic thin plate are surface without the Ceramic Tiles of glaze or surface without polishing.
By being compounded on porous ceramic plate after decorating film is arranged on the surface of ceramic thin plate, this decorative ceramic board tool
There is a good decorative effect, it is not only light but also at low cost, manufacture craft is simple.The composite ceramics plank of the present invention can be used for
Inner wall decoration, decoration of exterior wall.
Further, adhesive layer includes liquid ceramic tile glue-line and solid ceramic tile glue-line, the bottom surface of ceramic thin plate and porous pottery
The top surface of porcelain plate all has liquid ceramic tile glue-line, and solid ceramic tile glue-line is between two liquid ceramic tile glue-lines.Using liquid ceramic tile
Glue and solid glue for tile are bonded ceramic thin plate and porous ceramic plate, and liquid ceramic tile glue-line and solid ceramic tile glue-line form slow
Punching combines so that the associativity and anti-aging property that two ceramic wafers bond are stronger, to improve the use longevity of composite ceramics plank
Life.
Further, the formula material of liquid glue for tile includes by weight percentage：Water-soluble phenolic resin adhesive 10
~18%, polyvinyl acetate copolymer 55~65%, modifying epoxy resin by organosilicon 2~3%, fluorine richness asphalt mixtures modified by epoxy resin 3~4%,
Agent for polyacrylic acid thickening 0.2%, polyether modified siloxane 0.3%, P-hydroxybenzoic acid 0.1%, alcohol ester ten two 0.4%, stone
English powder 5%, deionized water 14%.There is good heat resistance, flow leveling and base using the liquid glue for tile of above-mentioned formula
The adhesive property and crushing resistance of plate.
Further, the formula material of solid glue for tile includes：Common silicate cement 55%, quartz sand 25%, coarse whiting
10%, redispersable latex powder 4~6%, fluorine richness epoxy resin 1~3%, modifying epoxy resin by organosilicon 0.5~1.5%,
Hydroxypropyl methyl cellulose 0.5~1.5%, carboxymethyl starch ether 0.4~0.6%, polyether modified siloxane 0.4~0.6%.It adopts
There is better flow leveling and adhesive property with the solid glue for tile of above-mentioned formula.
Further, adhesive layer is inorganic glue adhesive layer or organic gel adhesive layer.
Further, adhesive layer is hot melt adhesive layer.Using hot melt adhesive as adhesive layer so that the adherency of decorating film is more firm
Gu and adhering step is simple to operation.
Further, decorating film is plastic foil or composite membrane..Two kinds of decorating films all have good decorative effect, can root
It is selected according to different use conditions.
Further, porous ceramic plate is foamed ceramics, ceramic honey comb or particulate ceramic knot body.Two kinds of Ceramic Tiles can be with
Decorating film is sticked as substrate, improves the diversity of product.
A kind of preparation method of above-mentioned composite ceramics plank, includes the following steps：
The surface of ceramic thin plate is processed；
Decorating film and ceramic thin plate are bonded by adhesive layer；
Ceramic thin plate and porous ceramic plate is compound by adhesive layer；
Obtain composite ceramics plank.
Further, pass through in adhesive layer composite steps in ceramic thin plate and porous ceramic plate：In the bottom surface of ceramic thin plate
Liquid glue for tile is respectively coated with the top surface of porous ceramic plate, it, will be ceramic by solid glue for tile after liquid glue for tile is dried
Thin plate and porous ceramic plate bonding, i.e. solid ceramic tile glue-line are located between two layers of liquid ceramic tile glue-line.
Further, adhesive layer is hot melt adhesive layer.
Beneficial effects of the present invention are：
1, it by the way that decorating film is arranged without the ceramic substrate of glaze or surface without polishing on surface, is filled relative to existing Low fire ceramic
The pattern of plaque, the composite board with decorating film is more fine true to nature, has a better decorative effect, and its is at low cost,
Manufacture craft is simple；
2, using porous ceramic plate as bottom plate so that composite ceramics plank has the characteristics that light.
3, ceramic thin plate and porous ceramic plate are bonded using liquid glue for tile and solid glue for tile, liquid glue for tile
Layer and solid ceramic tile glue-line form buffering and combine so that the associativity and anti-aging property that two ceramic wafers bond are stronger, to carry
The service life of high composite ceramics plank.
Description of the drawings
Fig. 1 is the decomposition diagram of the composite ceramic slab of one embodiment of the invention.
Wherein：Decorating film 1, adhesive layer 2, ceramic thin plate 3, adhesive layer 4 and porous ceramic plate 5.
Specific implementation mode
Below in conjunction with the accompanying drawings and the technical solution that further illustrates the present invention of specific implementation mode.
A kind of composite ceramics plank, including from top to bottom successively decorating film 1 disposed in parallel, adhesive layer 2, ceramic thin plate 3,
Adhesive layer 4 and porous ceramic plate 5, adhesive layer 2 is for bonding decorating film 1 and ceramic thin plate 3, and adhesive layer 4 is for bonding ceramic thin
Plate 3 and porous ceramic plate 5, ceramic thin plate 3 are surface without the Ceramic Tiles of glaze or surface without polishing.
By being compounded on porous ceramic plate 5 after decorating film 1 is arranged on the surface of ceramic thin plate 3, this ceramic decoration
Plate has good decorative effect, not only light but also at low cost, manufacture craft is simple.The composite ceramics plank of the present invention can
For inner wall decoration, decoration of exterior wall.
Vitrified tile may be used in ceramic thin plate 3, has shallower background color, the pattern color of decorating film 1 can be kept full, no
It is influenced by 3 background color of ceramic thin plate.The thickness of ceramic thin plate is 3~5mm.
Decorating film 1 can be plastic foil, such as PP films, PVC film, PVDF, printing or printed patterns on this plastic foil
Cost it is relatively low, and pattern is fine, rich in color, surface tactile sensation is true to nature.Decorating film 1 can also be composite membrane, such as non-woven fabrics
With the composite membrane of plastic foil, the composite membrane of thin layer wood skin and plastic foil, there is more rich pattern.The thickness of decorating film is 0.3
~2mm.
Adhesive layer is hot melt adhesive layer.Using hot melt adhesive as adhesive layer so that the adherency of decorating film is more secured, and viscous
Attached step is simple to operation.The parameter for the hot melt adhesive that present embodiment uses for：Melting temperature is 60 ± 10, the density after melting
For 520-640g/L；Hot melt adhesive is under the conditions of 160 DEG C, melt index 150g/min, melt viscosity 240Pa.s.Hot melt adhesive
The thickness of layer is 0.5~1.5mm.
Porous ceramic plate 4 can be foamed ceramics, ceramic honey comb or particulate ceramic knot body, be high-temperature firing silicates
Ceramic material, with high temperature resistant, fire prevention, ageing-resistant, intensity is higher, is not likely to produce cubic deformation, there is preferable resistance to compression load
And insulation is anti-.Thermal coefficient≤0.15W/ (mK) of porous ceramic plate 7.The porosity of foamed ceramics is 80~90%, honeycomb
The porosity of ceramics is 70%, and the porosity of particulate ceramic knot body is 30~50%, wherein the porosity refers to opening for ceramic material
Oral pore road volume accounts for the percentage of material total volume.
Adhesive layer 4 includes liquid ceramic tile glue-line 41 and solid ceramic tile glue-line 42, the bottom surface of ceramic thin plate 3 and porous ceramic plate
5 top surface all has liquid ceramic tile glue-line 41, and solid ceramic tile glue-line 42 is between two liquid ceramic tile glue-lines 41.Using liquid porcelain
Brick glue and solid glue for tile are bonded ceramic thin plate and porous ceramic plate, and liquid ceramic tile glue-line and solid ceramic tile glue-line are formed
Buffering combines so that the associativity and anti-aging property that two ceramic wafers bond are stronger, to improve the use of composite ceramics plank
Service life.The thickness of liquid ceramic tile glue-line is 0.5~1.5mm, and the thickness of solid ceramic tile glue-line is 2~5mm, it is preferred that liquid porcelain
The thickness of brick glue-line is 0.8~1mm, and the thickness of solid ceramic tile glue-line is 3~4mm.
Preferably, the formula material of liquid glue for tile includes by weight percentage：Water-soluble phenolic resin adhesive 10~
18%, polyvinyl acetate copolymer 55~65%, modifying epoxy resin by organosilicon 2~3%, fluorine richness asphalt mixtures modified by epoxy resin 3~4%, poly-
Acrylic thickener 0.2%, polyether modified siloxane 0.3%, P-hydroxybenzoic acid 0.1%, alcohol ester ten two 0.4%, quartz
Powder 5%, deionized water 14%.There is good heat resistance, flow leveling and substrate using the liquid glue for tile of above-mentioned formula
Adhesive property and crushing resistance.
It is further preferred that formula 1~3 may be used in liquid glue for tile, specifically, formula 1：Water-soluble phenolic resin adhesive
14%, polyvinyl acetate copolymer 60%, modifying epoxy resin by organosilicon 3%, fluorine richness epoxy resin 3%, polyacrylic
Thickener 0.2%, polyether modified siloxane 0.3%, P-hydroxybenzoic acid 0.1%, alcohol ester ten two 0.4%, is gone silica flour 5%
Ionized water 14%；
Formula 2：Water-soluble phenolic resin adhesive 18%, polyvinyl acetate copolymer 55%, modifying epoxy resin by organosilicon
3%, fluorine richness epoxy resin 4%, agent for polyacrylic acid thickening 0.2%, polyether modified siloxane 0.3%, P-hydroxybenzoic acid
0.1%, alcohol ester ten two 0.4%, silica flour 5%, deionized water 14%；
Formula 3：Water-soluble phenolic resin adhesive 10%, polyvinyl acetate copolymer 65%, modifying epoxy resin by organosilicon
2%, fluorine richness epoxy resin 3%, agent for polyacrylic acid thickening 0.2%, polyether modified siloxane 0.3%, P-hydroxybenzoic acid
0.1%, alcohol ester ten two 0.4%, silica flour 5%, deionized water 14%.
Liquid glue for tile forms a tunic, and cementitious to the low vitrified tile of water absorption rate, thus greatly reduces ceramic tile
Hollowing, the risk to fall off.Compression shear adhesive strength after liquid glue for tile heat ageing is 0.2MPa, lengthens open assembly time
30min stretches adhesive strength 0.2MPa, meets JC/T547-2005 standards.Liquid glue for tile need to meet national standard GB18582-2008
《Indoor decorating and refurnishing materials, adhesive limits of harmful substances》.
Preferably, the formula material of solid glue for tile includes：Common silicate cement 55%, quartz sand 25%, coarse whiting 10%,
Redispersable latex powder 4~6%, fluorine richness epoxy resin 1~3%, modifying epoxy resin by organosilicon 0.5~1.5%, hydroxypropyl
Methylcellulose 0.5~1.5%, carboxymethyl starch ether 0.4~0.6%, polyether modified siloxane 0.4~0.6%.Using above-mentioned
The solid glue for tile of formula has better flow leveling and adhesive property.
Further preferred：Formula 1~3 may be used in solid glue for tile, specifically, formula 1：Common silicate cement
55%, quartz sand 25%, coarse whiting 10%, redispersable latex powder 5%, fluorine richness epoxy resin 2%, silicon-modified epoxy tree
Fat 1%, hydroxypropyl methyl cellulose 1%, carboxymethyl starch ether 0.5%, polyether modified siloxane 0.5%；
Formula 2：Common silicate cement 55%, quartz sand 25%, coarse whiting 10%, redispersable latex powder 4%, fluorine richness ring
Oxygen resin 3%, hydroxypropyl methyl cellulose 1.5%, carboxymethyl starch ether 0.6%, gathers modifying epoxy resin by organosilicon 0.5%
Ether modified siloxane 0.4%；
Formula 3：Common silicate cement 55%, quartz sand 25%, coarse whiting 10%, redispersable latex powder 6%, fluorine richness ring
Oxygen resin 1%, hydroxypropyl methyl cellulose 0.5%, carboxymethyl starch ether 0.4%, gathers modifying epoxy resin by organosilicon 1.5%
Ether modified siloxane 0.6%.
Solid glue for tile is powdered, and when use tempers into thick.Solid glue for tile tensile bond strength >=
0.5MPa (adhesion strength, heat ageing containing immersion hang adhesion strength after 20min), meets C1 standards in JC/T 547-2005.
Further, in other embodiments, adhesive layer is inorganic glue adhesive layer or organic gel adhesive layer.
A kind of preparation method of above-mentioned composite ceramics plank, includes the following steps：
S1, the surface of ceramic thin plate 3 is processed, i.e., cleaned out the dust particles on the surface of ceramic thin plate 3, really
Pad pasting attachment surface is protected without bulky grain.
S2, decorating film 1 and ceramic thin plate 3 are bonded by adhesive layer 2.Hot melt adhesive layer 2 can be directly affixed to decorate
Decorating film 1 with hot melt adhesive layer 2 is adhered to ceramic tile 3 by the bottom surface of film 1 when needs and 3 compound tense of ceramic tile by pressing machine
Surface, it is simple and quick.
It is also possible that hot-melt adhesive powder is melted, hot melt adhesive melt is coated in the bottom surface of decorating film 1 or the surface of ceramic tile 3,
Decorating film 1 is sticked on ceramic tile 3 later.1 applying method of this decorating film is low for equipment requirements, saves equipment cost.
It is S3, ceramic thin plate 3 and porous ceramic plate 5 is compound by adhesive layer 4；Obtain composite ceramics plank.
Specifically, liquid glue for tile is respectively coated in the top surface of the bottom surface of ceramic thin plate 3 and porous ceramic plate 5, work as liquid
After glue for tile drying, ceramic thin plate and porous ceramic plate are bonded by solid glue for tile, i.e., solid ceramic tile glue-line 42 is located at two
Between layer liquid ceramic tile glue-line 41.
When applying liquid glue for tile, one is respectively coated in the top surface of the bottom surface of ceramic tile thin plate 1 and porous ceramic plate 7 with hairbrush
Layer liquid glue for tile, stands 10~15min, will using thick solid glue for tile is reconciled into after liquid glue for tile parches
Ceramic tile thin plate and porous ceramic plate bonding, stand 24 hours later.
Liquid glue for tile can be fully infiltrated into ceramic tile thin plate and porous ceramic plate, and buffering binder course is formed with solid glue for tile,
Glue for tile be combined with each other in two, and electric heating tile product adhesiveness and ageing-resistant performance are stronger.
Above-mentioned composite ceramics plank preparation method is simple to operation.
The technical principle of the present invention is described above in association with specific embodiment.These descriptions are intended merely to explain the present invention's
Principle, and it cannot be construed to limiting the scope of the invention in any way.Based on the explanation herein, the technology of this field
Personnel would not require any inventive effort the other specific implementation modes that can associate the present invention, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of composite ceramics plank, which is characterized in that including from top to bottom decorating film disposed in parallel, adhesive layer, pottery successively
Porcelain thin plate, adhesive layer and porous ceramic plate, the adhesive layer is for bonding decorating film and ceramic thin plate, and the adhesive layer is for gluing
Ceramic thin plate and porous ceramic plate are closed, the ceramic thin plate is surface without the Ceramic Tiles of glaze or surface without polishing.
2. composite ceramics plank according to claim 1, which is characterized in that the adhesive layer include liquid ceramic tile glue-line and
Solid ceramic tile glue-line, the bottom surface of the ceramic thin plate and the top surface of porous ceramic plate all have the liquid ceramic tile glue-line, described
Solid ceramic tile glue-line is between two liquid ceramic tile glue-lines.
3. composite ceramics plank according to claim 2, which is characterized in that the formula material of the liquid glue for tile includes
By weight percentage：It is water-soluble phenolic resin adhesive 10~18%, polyvinyl acetate copolymer 55~65%, organic-silicon-modified
Epoxy resin 2~3%, fluorine richness asphalt mixtures modified by epoxy resin 3~4%, agent for polyacrylic acid thickening 0.2%, polyether modified siloxane 0.3%,
P-hydroxybenzoic acid 0.1%, alcohol ester ten two 0.4%, silica flour 5%, deionized water 14%.
4. composite ceramics plank according to claim 3, which is characterized in that the formula material packet of the solid glue for tile
It includes：Common silicate cement 55%, quartz sand 25%, coarse whiting 10%, redispersable latex powder 4~6%, fluorine richness epoxy resin 1
~3%, modifying epoxy resin by organosilicon 0.5~1.5%, hydroxypropyl methyl cellulose 0.5~1.5%, carboxymethyl starch ether 0.4
~0.6%, polyether modified siloxane 0.4~0.6%.
5. composite ceramics plank according to claim 1, which is characterized in that the adhesive layer is inorganic glue adhesive layer or has
Machine glue bond layer.
6. composite ceramics plank according to claim 1, which is characterized in that the adhesive layer is hot melt adhesive layer.
7. composite ceramics plank according to claim 1, which is characterized in that the decorating film is plastic foil or composite membrane.
8. composite ceramics plank according to claim 1, which is characterized in that the porous ceramic plate is foamed ceramics, bee
Nest ceramics or particulate ceramic knot body.
9. the preparation method of composite ceramics plank described in a kind of claim 1, which is characterized in that include the following steps：
The surface of the ceramic thin plate is processed；
The decorating film and ceramic thin plate are bonded by adhesive layer；
The ceramic thin plate and porous ceramic plate is compound by adhesive layer；
Obtain composite ceramics plank.
10. the preparation method of composite ceramics plank according to claim 8, which is characterized in that in ceramic thin plate and porous
Ceramic wafer passes through in adhesive layer composite steps：Liquid is respectively coated in the top surface of the bottom surface of the ceramic thin plate and porous ceramic plate
Ceramic thin plate and porous ceramic plate are bonded, i.e. solid ceramic tile by glue for tile after liquid glue for tile is dried by solid glue for tile
Glue-line is located between two layers of liquid ceramic tile glue-line.
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| CN108396929B (en) | 2023-09-29 |
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