CN108384195A - It is a kind of to nickel high-adhesion epoxy resin component and its application - Google Patents
It is a kind of to nickel high-adhesion epoxy resin component and its application Download PDFInfo
- Publication number
- CN108384195A CN108384195A CN201810227058.8A CN201810227058A CN108384195A CN 108384195 A CN108384195 A CN 108384195A CN 201810227058 A CN201810227058 A CN 201810227058A CN 108384195 A CN108384195 A CN 108384195A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- adhesion
- resin component
- nickel high
- proportion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 89
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 89
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 37
- 239000000203 mixture Substances 0.000 claims abstract description 33
- 239000007822 coupling agent Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 19
- -1 amino 2H tetrazoles Chemical class 0.000 claims abstract description 9
- 239000001301 oxygen Substances 0.000 claims abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 7
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical class NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000005011 phenolic resin Substances 0.000 claims description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2-methyl-4-methylimidazole Natural products CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000011049 filling Methods 0.000 claims description 6
- 239000003063 flame retardant Substances 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- 239000004843 novolac epoxy resin Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 150000003512 tertiary amines Chemical class 0.000 claims description 6
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 150000004693 imidazolium salts Chemical class 0.000 claims description 5
- 229920001568 phenolic resin Polymers 0.000 claims description 5
- SUEIINDYWPMJEW-UHFFFAOYSA-N 2-ethyltetrazol-5-amine Chemical compound CCN1N=NC(N)=N1 SUEIINDYWPMJEW-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 230000004927 fusion Effects 0.000 claims description 4
- 238000012986 modification Methods 0.000 claims description 4
- 230000004048 modification Effects 0.000 claims description 4
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 3
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims description 3
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 claims description 3
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- AZUKLCJYWVMPML-UHFFFAOYSA-N 2-methyltetrazol-5-amine Chemical class CN1N=NC(N)=N1 AZUKLCJYWVMPML-UHFFFAOYSA-N 0.000 claims description 3
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical class CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 3
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 claims description 3
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 claims description 3
- 235000021286 stilbenes Nutrition 0.000 claims description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 2
- 239000010426 asphalt Substances 0.000 claims 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- 150000003851 azoles Chemical class 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 150000001412 amines Chemical class 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 230000000712 assembly Effects 0.000 abstract description 3
- 238000000429 assembly Methods 0.000 abstract description 3
- 125000003831 tetrazolyl group Chemical group 0.000 abstract 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 1
- 238000004382 potting Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 239000000206 moulding compound Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 229910001415 sodium ion Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- FLLHLQMJMNFMIP-UHFFFAOYSA-N 2-methyl-2H-pyrrol-5-amine Chemical class NC1=NC(C=C1)C FLLHLQMJMNFMIP-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 235000010919 Copernicia prunifera Nutrition 0.000 description 1
- 244000180278 Copernicia prunifera Species 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- KXPVVIGIQFYGPL-UHFFFAOYSA-N NC(CC1)C1C1CC1 Chemical compound NC(CC1)C1C1CC1 KXPVVIGIQFYGPL-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical group [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- LCDFWRDNEPDQBV-UHFFFAOYSA-N formaldehyde;phenol;urea Chemical compound O=C.NC(N)=O.OC1=CC=CC=C1 LCDFWRDNEPDQBV-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- IHHCJKNEVHNNMW-UHFFFAOYSA-N methane;phenol Chemical compound C.OC1=CC=CC=C1 IHHCJKNEVHNNMW-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of to nickel high-adhesion epoxy resin component and its application.It is a kind of to nickel high-adhesion epoxy resin component, the coupling agent used in 2 methyl, 5 amino 2H tetrazoles, 2 ethyl 2H tetrazoliums, 5 amine, 1 ethyl 1H tetrazoliums, 5 amine, 2 the third 25 amine of alkenyl tetrazolium, 5 aminotetrazoles and 3 [2 alkyl 3 (5 amino of 2H tetrazoliums) third oxygen] propyl trimethoxy silicanes one kind or in which several mixtures in any proportion.Using：The a kind of to nickel high-adhesion epoxy resin component of the present invention is encapsulated for component as encapsulating material, more secure bond power is generated with nickel surface；With excellent flame retardancy, flowing forming and curability, operability is good；It is applied as encapsulating material has the characteristics that excellent adhesion, reflow soldering resistance, electric stability and moisture-proof in package assembling, is suitable for various assemblies and encapsulates.
Description
Technical field
The present invention relates to IC package field, to nickel high-adhesion epoxy resin component and its answered more particularly to a kind of
With.
Background technology
The high molecular material (Epoxy molding compound) of epoxy resin its solidification after have excellent machinery,
Heat-resisting, acid and alkali-resistance and electrical properties so that epoxy resin occupies phase in the composite materials such as sports equipment, automobile and aerospace industry
Work as consequence, since epoxy resin has easily solidification, low cure shrinkage and good adherence, mechanicalness and resistance toization
The property learned, is also widely used in 3C industries the IC package material of (computer, communication, consumer electrical product) in recent years.IC
The main purpose of encapsulation is to protect chip and conducting wire, circuit, makes it from by the aqueous vapor in air, dust and other outer
The injury of power, to improve the service life and reliability of chip, recently as IC package industry to epoxy resin reliability, safety
The requirement of property is increasingly increased, and the requirement to ethoxyline resin antiflaming performance is also gradually increased.
Adhesive property of the epoxy resin material inside PKG is particularly important to the Reliability Check of device.Because in PKG
All Nian Jie problem of Presence of an interface between the surfaces such as internal moulding compound and chip, lead frame, slide glass, if poor attachment will go out
Existing so-called PKG laminations.Therefore, the adhesive property for improving moulding compound is extremely important to improving PKG interior laminate layer phenomenons
's.In essence, it is exactly the firmness for improving boundary layer reaction to improve cementability, wherein what is played a crucial role is exactly to be coupled
Agent.In potting resin, it is a core skill of manufacture unit generally to use silane coupling agent, type and proportioning
Art.The effect of coupling agent exactly improves the compatibility at interface, is mainly manifested in following two aspects：(1) silica and epoxy
The organic interfaces such as resin.Silica is inorganic matter, poor with the compatibility of the organic matters such as epoxy resin, so using dioxy
When SiClx, surface modification treatment carried out to it, change the physicochemical properties on its surface, improved and the organic groups such as epoxy resin
The interface compatibility of body.Studies have shown that after a kind of coupling agent is added, FT-IR methods are utilized, it was demonstrated that in SiO2/ epoxy resin interfaces
Really coupling reaction has occurred, and forms chemical bond.Experimental data also indicates that, whether the addition of coupling agent, is formed by multiple
Condensation material boundary layer is completely different, directly affects sealing and the adhesive property of potting resin.(2) potting resin and gold
The interfaces such as category, chip.Include releasing agent and coupling agent in this interface, and releasing agent is to epoxy resin and chip and lead frame
Intensity is connect to have a great impact.Since releasing agent is while potting resin flows, because its molecular weight little Yi flows, than other trees
Fat is mobile soon, can be adsorbed on the surface of chip and lead frame quickly and be glued with the normal of its surface to influence potting resin
It connects, demoulding dosage is bigger, and the area for covering interface is bigger, can seriously affect bonding between potting resin and other interfaces
Property.So on the one hand we will reduce the amount of releasing agent as far as possible, on the other hand can by adding different types of coupling agent,
Such as silane coupling agent and molecular weight is small and movement speed is fast, can be adsorbed on and generate coupling reaction on interface, be formed relatively secured
Combination, to improve the bonding force of potting resin and other surfaces.In short, selecting suitable coupling agent to chip, lead frame
The metal materials such as frame, slide glass can greatly improve the adhesive property of potting resin, to improve PKG interior laminate layer phenomenons.
In addition, the adhesive property of different metals and coupling agent also has very big difference.Common PKG be mostly copper facing, it is silver-plated,
Nickel plating etc., and the lively type of three kinds of metals is different, compared with copper, silver, nickel is easier to be aoxidized, and surface forms oxidation film, hinders
- the OH of nickel surface is reacted with coupling agent, causes cohesive force poor, is easy layering.
Invention content
The present invention provides a kind of to nickel high-adhesion epoxy resin component, it can adequately with the-OH of nickel surface shapes
At intermolecular force, generate stronger cohesive force, have excellent anti-flammability outside, and with excellent flowing forming with
Curability, operability is good, is applied in package assembling with excellent adhesion strength, reflow soldering resistance, electricity as encapsulating material
Gas stability and moisture-proof feature, are suitable for the encapsulation of various assemblies.
It is a kind of to nickel high-adhesion epoxy resin component, the coupling agent used is four nitrogen of 2- methyl -5- amino -2H-
Azoles, 2- ethyl -2H- tetrazolium -5- amine, 1- ethyls -1H-TETRAZOLE -5- amine, 2- propyl- 2- alkenyl tetrazolium -5- amine, 5- aminotetrazoles
With one kind in 3- [2- alkyl -3- (2H- tetrazolium -5- amino) the-the third oxygen]-propyl trimethoxy silicane or in which several by arbitrary
The mixture of ratio.
It is a kind of to nickel high-adhesion epoxy resin component, it specifically presses epoxy resin, 2- of the mass fraction by 2-15 parts
10 parts of curing agent, 0.1-6 parts of fire retardant, 0.01-1 parts of hardening accelerator, 70-95 parts of inorganic filling material and 0.1-
0.8 part of coupling agent is prepared.
The epoxy resin is bisphenol epoxy, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol S type ring
Oxygen resin, tris-phenol type epoxy resin, naphthol type epoxy resin, stilbene type epoxy resin, contains three at biphenyl type epoxy resin
Epoxy resin, phenol aldehyde type novolac epoxy resin, phenol aldehyde type alkyl phenolic epoxy resin, the modification novolac epoxy resin of piperazine nuclear structure
With in DCPD-containing epoxy resin one kind or in which several mixtures in any proportion.
The curing agent is phenol resin；The phenol resin is novolac resin, cresol novolac resin, triphenol
Alkyl phenol, aralkyl resin, naphthalene type phenolic resin and one kind in Cyclopeutadiene type phenolic resin or in which several press arbitrary ratio
The mixture of example.
The hardening accelerator is tertiary amine, imidazolium compounds, one kind in nitrogen-containing hetero cyclics or in which several
Mixture in any proportion.
The tertiary amine is in triethylamine, dimethylaniline, benzyl diformazan ammonia and N, N- dimethyl-amines ylmethyl phenol
One kind or in which several mixtures in any proportion.
The imidazolium compounds is, 2-methylimidazole, 2- methyl -4-methylimidazole, 2- heptadecyl imidazoles and 1- cyanogen second
One kind in base -4-methylimidazole or in which several mixtures in any proportion.
The nitrogen-containing hetero cyclics include 1,8- diazabicyclos [5,4,0], 11 carbon -7- alkene.
The inorganic filling material is fusion silica, powdered quartz, talcum powder, aluminium oxide and silicon nitride
In one kind or in which several mixtures in any proportion.
A kind of application to nickel high-adhesion epoxy resin component is used for the encapsulation of component as encapsulating material.
Advantages of the present invention：The present invention's is a kind of to nickel high-adhesion epoxy resin component, it can adequately with nickel table
- the OH in face forms intermolecular force, generates stronger cohesive force；With excellent anti-flammability, there is excellent flow into
Type and curability, operability are good；It is applied in package assembling as encapsulating material with excellent adhesion strength, reflux-resisting welded
Property, electric stability and moisture-proof feature, be suitable for the encapsulation of various assemblies.
Specific implementation mode
In order to deepen the understanding of the present invention, the present invention is described in further detail below in conjunction with embodiment, the reality
It applies example to be only used for explaining the present invention, protection scope of the present invention is not constituted and is limited.
Specific implementation mode one：Present embodiments provide for a kind of to nickel high-adhesion epoxy resin component, uses
Coupling agent be 2- methyl -5- amino -2H- tetrazoles, 2- ethyl -2H- tetrazolium -5- amine, 1- ethyls -1H-TETRAZOLE -5- amine, 5-
Aminotetrazole, 2- propyl-s 2- alkenyls tetrazolium -5- amine and 3- [2- alkyl -3- (2H- tetrazolium -5- amino) the-the third oxygen]-propyl front three
One kind in oxysilane or in which several mixtures in any proportion.
In present embodiment,
The structural formula of 2- methyl -5- amino -2H- tetrazoles is
The structural formula of 2- ethyl -2H- tetrazolium -5- amine is
The structural formula of 1- ethyls -1H-TETRAZOLE -5- amine is
The structural formula of 2- propyl- 2- alkenyl tetrazolium -5- amine is
The structural formula of 5- aminotetrazoles is
The structural formula of 3- [2- alkyl -3- (2H- tetrazolium -5- amino) the-the third oxygen]-propyl trimethoxy silicane is
In present embodiment, amido is contained in coupling agent, very vivaciously, more covalent bonds is easily formed with-OH, makes epoxy
Moulding compound is bonded together with nickel material, while molecular bulk frame is ring-type, and high stability is not easily decomposed later through IR,
Advantageously form stable cohesive force；And other characteristics of product are not influenced by verifying examination discovery.
Specific implementation mode two：Present embodiments provide for a kind of to nickel high-adhesion epoxy resin component, specifically presses
Mass fraction is promoted by 2-15 parts of epoxy resin, 2-10 parts of curing agent, 0.1-6 parts of fire retardant, 0.01-1 parts of hardening
Agent, 70-95 parts of inorganic filling material and 0.1-0.8 parts of coupling agent are prepared.
The mass percentage of coupling agent described in present embodiment is 0.1% to 0.8%；If coupling agent quality hundred
Divide less than 0.1%, the PKG of content to have partial hierarchical phenomenon, is unable to reach ideal effect；If coupling agent mass percentage is super
0.8% is crossed, resin system reaction and gelation time can be influenced, can also introduce more ions, influenced electrically.
The mass percentage of epoxy resin described in present embodiment is 2% to 15%, preferably 6% to 12%.
The mass percentage of curing agent described in present embodiment is 2% to 10%, preferably 3% to 8%.
The mass percentage of hardening accelerator described in present embodiment is 0.01% to 1%, and preferably 0.1% arrives
0.3%.
Fire retardant described in present embodiment is halogen-free or antimonial, and the halogen atom in final constituent with
The content (from that can not avoid the catalyst used or additive in resin preparation process) of antimony atoms, with constituent total weight,
Less than 0.1 weight %, therefore it can reach environmental requirement.
Specific implementation mode three；Present embodiment is with two difference of specific implementation mode：The epoxy resin is double
Phenol epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, biphenyl type epoxy resin, three
Phenol methane type epoxy resin, naphthol type epoxy resin, stilbene type epoxy resin, the epoxy resin containing triazine nuclear structure, phenolic aldehyde
In type novolac epoxy resin, phenol aldehyde type alkyl phenolic epoxy resin, modification novolac epoxy resin and DCPD-containing epoxy resin
One kind or in which several mixtures in any proportion.
In present embodiment, the example of commercially available epoxy resin includes：CNE-200ELA (Changchun chemistry system)；ESCN-
195XL, (Sumitomo Chemical system)；YX-4000H, (Shell corporations)；N-670 (Japanese DIC systems)；JECN-801 (Jiang Huanhua
System)；NC-3000H (Japanese chemical drug system)；NPEB-400 (South Asia epoxy resin system).
In present embodiment, epoxy resin is well-known to those skilled in the art, be can be used alone, can also be two kinds
Or the two or more form of mixtures mixed in any proportion use；Have no specifically limited, present embodiment is only to include one
Part epoxy, this should not become limitation of the present invention.
Specific implementation mode four：Present embodiment is with two difference of specific implementation mode：The curing agent is phenol system
Resin；The phenol resin is novolac resin, cresol novolac resin, triphenol alkyl phenol, aralkyl resin, naphthalene type phenol
Urea formaldehyde and one kind in Cyclopeutadiene type phenolic resin or in which several mixtures in any proportion.
In present embodiment, the example of commercially available phenol resin includes：TD-2131 (Japanese DIC systems), HRJ-1583
(Schenectady corporations), XLC-3L (Mitsui Chemicals system), HP-5000 (Japanese DIC systems), PK-7500 (golden Longhuas
System), HP-7200 (Japanese DIC systems), KPH-F3065 (KOLON systems).
In present embodiment, curing agent need to arrange in pairs or groups epoxy resin to use, this is well-known to those skilled in the art, example
Such as but it is not limited to phenol resin；The phenol resin of present embodiment contains two or more hydroxyl-functional bases；Present embodiment is only
It is to include a part of curing agent, this should not become limitation of the present invention.
Specific implementation mode five：Present embodiment is with two difference of specific implementation mode：The hardening accelerator is
Tertiary amine, imidazolium compounds, one kind in nitrogen-containing hetero cyclics or in which several mixtures in any proportion.
In present embodiment, hardening accelerator can accelerate epoxy resin cycloalkyl groups and curing agent in phenol system hydroxyl base
Sclerous reaction between group；Present embodiment is only to include a part of hardening accelerator, this should not become the limit to the present invention
System.
Specific implementation mode six：Present embodiment is with five difference of specific implementation mode：The tertiary amine is three second
Base amine, dimethylaniline, benzyl diformazan ammonia and one kind in N, N- dimethyl-amines ylmethyl phenol or in which several press arbitrary ratio
The mixture of example.
Specific implementation mode seven：Present embodiment is with five difference of specific implementation mode：The imidazolium compounds is,
2-methylimidazole, 2- methyl -4-methylimidazole, 2- heptadecyl imidazoles and one kind in 1- cyanoethyls -4-methylimidazole or its
In several mixtures in any proportion.
Specific implementation mode eight：Present embodiment is with five difference of specific implementation mode：The nitrogen heterocyclic ring class
It includes 1,8- diazabicyclos [5,4,0], 11 carbon -7- alkene to close object.
Specific implementation mode nine：Present embodiment is with two difference of specific implementation mode：The inorganic filling material
For one kind in fusion silica, powdered quartz, talcum powder, aluminium oxide and silicon nitride or in which several by arbitrary
The mixture of ratio.
In present embodiment, the balance based on moldability and solder resistance, the quality percentage of inorganic filler be added
Content is between about 70% to about 95%；If inorganic filler mass percentage is less than 70%, the increasing absorbed due to moisture
Add, the solder of resin combination will be reduced；If inorganic filler mass percentage is higher than 95%, resin forms in molding
The mobility of object reduces, and easily causes filling failure.
Specific implementation mode ten：Present embodiment is with two difference of specific implementation mode：In epoxy resin component
Further include other various additives, such as silane coupling agent, releasing agent, colorant, fire retardant.
The silane coupling agent of present embodiment includes 2,3- glycidyl propyl trimethoxy silicane or β-(3,4- epoxide rings
Hexane) ethyl trimethoxy silane.
The releasing agent of present embodiment includes paraffin, palm wax, long chain fatty acids or its metal salt, polyethylene/alkene conjunction
At wax.
The colorant of present embodiment includes carbon black.
The fire retardant of present embodiment includes aluminium hydroxide.
Specific implementation mode 11：Nickel high-adhesion epoxy resin component is answered present embodiments provide for a kind of
With：Epoxy resin component is used for the encapsulation of component as encapsulating material.
Beneficial effects of the present invention are verified using following embodiment：
Embodiment
Present embodiments provide it is a kind of to nickel high-adhesion epoxy resin component, by its carrying with same amount proportioning
5 comparative examples of different types of coupling agent are compared, to verify beneficial effects of the present invention.
According to mode described below prepare embodiment and comparative example 1-5 to nickel high-adhesion epoxy resin component,
It is formed as listed in table 1.
Each component is at room temperature mixed each composition using mixer with the parts by weight listed by table 1, temperature is controlled 60
It~120 DEG C, is mediated with biaxial rneader high-temperature fusion, obtains fire-retarded epoxy resin constituent.
One the Comparative Examples 1 to 5 of table and embodiment 1
Each ingredient data is as described below in table 1：
Epoxy resin：CNE-200ELA, softening point：65 DEG C, epoxide equivalent：200g/eq, purchased from Changchun chemistry；Specific knot
Structure formula is as follows：
Phenol resin：TD-2131, softening point：80 DEG C, OH equivalents：102g/eq is purchased from Japan DIC；Concrete structure formula is such as
Under：
Ball-type fused silica：SS-0183R is purchased from South Korea KOSEM.
Aluminium hydroxide：Purchased from SHOWA DENKO companies.
DBU (1,8- diazabicyclo [5,4,0], 11 carbon -7- alkene)：Purchased from Japanese Shang Yong companies.
Coupling agent 1：2- methyl -5- amino -2H- tetrazoles.
Coupling agent 2：2- ethyl -2H- tetrazolium -5- amine.
Coupling agent 3：1- ethyls -1H-TETRAZOLE -5- amine.
Coupling agent 4：2- propyl- 2- alkenyl tetrazolium -5- amine.
Embodiment coupling agent：3- [2- alkyl -3- (2H- tetrazolium -5- amino) the-the third oxygen]-propyl trimethoxy silicane.
Releasing agent：It is poly- by 0.4 parts by weight palm wax (Carnauba No.1 are melted into company purchased from East Asia) and 0.3 parts by weight
Ethylene/olefin synthetic wax (PED-522 is purchased from Clariant companies) composition.
Carbon black：MA-600 is purchased from Mitsubishi Corporation of Japan.
Test method：
Helical flow：This measurement is according to EMMI-1-66, using a mold to measure helical flow, in 175 DEG C of mould
At a temperature of system, in injection clamping pressure under 6.9MPa, and firm time is under conditions of 120 seconds, measured to arrive spiral flow
Dynamic length, unit are indicated with cm.
Gel time：The method measures the forming and hardening characteristic and mixing uniformity of epoxy resin molding material.It will be above-mentioned
Composition is poured into 175 ± 2 DEG C of electric heating disk center, and drives with pressure tongue stick that shakeout area be about 5cm2 away immediately, molten from composition
Melt and start to press manual time-keeping, powder is driven away with the frequency of 1 time/second with pressure tongue stick, when powder gradually becomes gel state by fluid
For terminal, the time used is read.(measured value is not more than 2s twice) twice is operated in the same way, and gelation time takes twice
Test value is averaged.
Anti-flammability：Using low pressure rotate into forming machine device molding testing piece (127mm × 12.7mm and there are three types of thickness 1.0mm,
2.0mm and 3.0mm), and molding temperature is at 175 DEG C, under the injection pressure of 6.9MPa and firm time is 120 seconds, then
Make after-hardening 8 hours in 175 DEG C.Method vertical according to UL-94 later measures the time of ∑ F, Flaming, and judges its resistance
Combustion property.Anti-flammability grade evaluation criterion is as follows：
Criterion：
Flaming：Burned flame Glowing：Red heat state, does not cause flame
Shore hardness：With reference to the testing standard of GB2411-80,16P SOP (20mm*6.5mm* are made by transfer moudling
It 3.3mm) is molded, condition of molding is：Metal die temperature is 175 ± 3 DEG C, 70 ± 5kg/cm of injection pressure2, hardening time 2 divides
Clock.Using sclerometer after the mould was opened 10 seconds when measure shaped article case hardness.
Melt viscosity：The melt viscosity that EMC is tested using heightization rheometer (CFT-500D) is selected according to the height of viscosity
The aperture of die.After installing die, starts software and start to heat die, make its constant temperature to 175 ± 1 DEG C.It is weighed with electronic balance
Appropriate EMC samples (generally about 2g), it is Φ 0.5mm to break into size with pancake making machine, high 1.0mm cylindrical samples.Sample is quick
It is put in rheometer and is tested by start button, melt is flowed out from aperture, and melt viscosity value is calculated and be shown in instrument automatically.
Na+、Cl-, conductance：Take appropriate epoxy molding plastic in temperature be 175 ± 3 DEG C of electric hot trays on planish, make its solidification, from
By under the material shovel after solidification on electric hot plate, solidification 6 hours after being placed in 175 ± 5 DEG C of baking oven, the tablet after curing after is cold
But to after room temperature, grinding and crossing 80 mesh sieve, extract liquor is prepared.Extract liquor is taken, its Na ion is surveyed with Atomic Absorption Spectrometer
Content surveys its Cl ion concentration with titration, its conductivity is surveyed with conductivity meter.
Hygroscopicity：Batten (the size made with composition epoxy resin* height 3mm), by water suction after molding
Rate batten after curing process, is placed in the storing basket of autoclaving instrument (PCT), at 121 DEG C after being carried out 8 hours at 175 DEG C
Under the conditions of after autoclaving 24 hours, test its weight increase that absorbs water.
Reflow soldering resistance：It is packaged that (size of semiconductor subassembly is 8.0* to 100P TQFP with composition epoxy resin
8.0mm, lead frame are made of 42 alloys), condition of molding is：Metal die temperature is 175 ± 3 DEG C, 70 ± 5kg/ of injection pressure
cm2, hardening time is 1.5 minutes.Moreover, 8 hours rear curing process are carried out at 175 DEG C, however the packaging part that will be obtained
It is 60 DEG C to be placed in temperature, and 40hrs is kept in the environment that relative humidity is 60%；Hereafter, packaging part is immersed to 240 DEG C of solder bath
It is middle to maintain 10 seconds.The peels off area of epoxy resin composition product, i.e., cured ring are measured using scanning sound chromatographic technique
The area that epoxy resin composition is removed from leadframe base material surface, stripping rate are calculated by following equation：
[stripping rate]={ (peels off area)/(surface area of semiconductor subassembly) * 100% }
Sample number n=10.The unit of stripping rate is %.
Test result：Above-mentioned gained test result is embedded in table 2：
Table 2
It can be obtained from table 2, embodiment 1 is the present invention to nickel high-adhesion epoxy resin component, test result
Display has good anti-flammability, mobility, adhesion strength, reflow soldering resistance and agent of low hygroscopicity.Comparative example adds compared with example 1
After the coupling agent for adding the present invention, stripping rate is extremely low, thoroughly solves the lamination problem to nickel, wherein Na+、Cl-, conductance, suction
It is moist to wait variation unobvious and other characteristics are not impacted, show that modifier plays positive effect to layering, and
It does not bring a negative impact.
Therefore, it is learnt from table 2, the present invention shows to nickel good bonding nickel high-adhesion epoxy resin component
Property, while anti-flammability, Na are not influenced yet+、Cl-, the characteristics such as conductance and hygroscopicity.
Above-described embodiment should not in any way limit the present invention, all to be obtained by the way of equivalent replacement or equivalency transform
Technical solution all fall in protection scope of the present invention.
Claims (10)
1. a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：The coupling agent that epoxy resin component uses for
2- methyl -5- amino -2H- tetrazoles, 2- ethyl -2H- tetrazolium -5- amine, 1- ethyls -1H-TETRAZOLE -5- amine, 2- propyl- 2- alkenyls four
In azoles -5- amine, 5- aminotetrazoles and 3- [2- alkyl -3- (2H- tetrazolium -5- amino) the-the third oxygen]-propyl trimethoxy silicane
A kind of or in which several mixtures in any proportion.
2. according to claim 1 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：It specifically presses matter
Measure number by 2-15 parts of epoxy resin, 2-10 parts of curing agent, 0.1-6 parts of fire retardant, 0.01-1 parts of hardening accelerator,
The coupling agent of 70-95 parts of inorganic filling material and 0.1-0.8 part is prepared.
3. according to claim 1 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：The asphalt mixtures modified by epoxy resin
Fat is bisphenol epoxy, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, biphenyl type epoxy tree
Fat, tris-phenol type epoxy resin, naphthol type epoxy resin, stilbene type epoxy resin, the epoxy resin containing triazine nuclear structure,
Phenol aldehyde type novolac epoxy resin, phenol aldehyde type alkyl phenolic epoxy resin, modification novolac epoxy resin and dicyclopentadiene asphalt mixtures modified by epoxy resin
One kind in fat or in which several mixtures in any proportion.
4. according to claim 1 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：The curing agent
For phenol resin；The phenol resin be novolac resin, cresol novolac resin, triphenol alkyl phenol, aralkyl resin,
Naphthalene type phenolic resin and one kind in Cyclopeutadiene type phenolic resin or in which several mixtures in any proportion.
5. according to claim 1 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：The hardening promotees
It is one kind or in which several mixtures in any proportion in tertiary amine, imidazolium compounds, nitrogen-containing hetero cyclics into agent.
6. according to claim 5 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：The tertiary amine
For in triethylamine, dimethylaniline, benzyl diformazan ammonia and N, N- dimethyl-amines ylmethyl phenol one kind or in which several press
The mixture of arbitrary proportion.
7. according to claim 5 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：The imidazoles
Close object be, one in 2-methylimidazole, 2- methyl -4-methylimidazole, 2- heptadecyl imidazoles and 1- cyanoethyls -4-methylimidazole
Kind or in which several mixtures in any proportion.
8. according to claim 5 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：The nitrogen-containing hetero
Cyclics include 1,8- diazabicyclos [5,4,0], 11 carbon -7- alkene.
9. according to claim 2 a kind of to nickel high-adhesion epoxy resin component, it is characterised in that：It is described inorganic to fill out
It is one kind or in which several in fusion silica, powdered quartz, talcum powder, aluminium oxide and silicon nitride to fill material
Mixture in any proportion.
10. a kind of as described in any claim in claim 1 to 9 answering nickel high-adhesion epoxy resin component
With, it is characterised in that：Epoxy resin component is used for the encapsulation of component as encapsulating material.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100067213A (en) * | 2008-12-11 | 2010-06-21 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
| KR20140082523A (en) * | 2012-12-24 | 2014-07-02 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
| CN104513462A (en) * | 2014-12-22 | 2015-04-15 | 科化新材料泰州有限公司 | High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof |
| CN105778409A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy resin composition for semiconductor packaging, and preparation method thereof |
-
2018
- 2018-03-19 CN CN201810227058.8A patent/CN108384195B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100067213A (en) * | 2008-12-11 | 2010-06-21 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same |
| KR20140082523A (en) * | 2012-12-24 | 2014-07-02 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
| CN105778409A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy resin composition for semiconductor packaging, and preparation method thereof |
| CN104513462A (en) * | 2014-12-22 | 2015-04-15 | 科化新材料泰州有限公司 | High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof |
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