CN108376720A - A kind of photovoltaic cell component and preparation method thereof - Google Patents

Abstract

The present invention discloses a kind of photovoltaic cell component and preparation method thereof, is related to photovoltaic technology field, mitigates the weight of photovoltaic cell component on the basis of ensureing photovoltaic cell component sealing performance for photovoltaic generation, to extend the application range of photovoltaic cell component.The photovoltaic cell component includes solar battery chip and backboard, and solar battery chip and backboard are linked together by sealing framework, and the outer surface of the envelope framework is equipped with hydrophobic encapsulated layer.The production method of the photovoltaic cell component is for making above-mentioned photovoltaic cell component.

Description

A kind of photovoltaic cell module and its manufacturing method

technical field

The invention relates to the field of photovoltaic technology, in particular to a photovoltaic battery module and a manufacturing method thereof.

Background technique

A solar cell module, also known as a photovoltaic cell module, is a device that converts absorbed sunlight into electrical energy. Photovoltaic cell components usually have a service life of more than 25 years in the outdoor environment; if the humidity of the environment where the photovoltaic cell components are located is high, the water vapor in the environment is easy to corrode the photovoltaic cell components, resulting in the power generation of the solar cell chips in the photovoltaic cell components reduce. Therefore, all photovoltaic cell modules need to be subjected to moisture-proof sealing treatment to meet the environmental requirements of high humidity.

The existing photovoltaic cell assembly includes a light-transmitting substrate and a back plate, and a solar cell layer formed between the light-transmitting substrate and the back plate; between the light-transmitting substrate and the solar cell layer, and between the back plate and the solar cell layer, pass EVA (ethylene-vinyl acetate copolymer, English full name is Ethylene-vinyl Acetate Copolymer, abbreviated as EVA) film or PVB (polyvinyl butyral, English full name is Poly Vinyl Butyral, abbreviated as PVB) film bonded on together to seal the solar cell layer sandwich. However, due to the poor water resistance of PVB materials, long-term wet immersion is easy to fall off and open the glue, while EVA is easy to seep and yellow, so between the edge of the light-transmitting substrate and the edge of the solar cell layer, as well as the edge of the back sheet and the solar energy The edges of the battery layers are coated with butyl hot melt adhesive to achieve the purpose of waterproof sealing as much as possible. However, this sealing method also increases the weight of the photovoltaic cell assembly, making it difficult for the photovoltaic cell assembly to be used in an application environment with strict weight requirements, which limits the application range of the photovoltaic cell assembly.

Contents of the invention

The object of the present invention is to provide a photovoltaic cell assembly and its manufacturing method, so as to reduce the weight of the photovoltaic cell assembly on the basis of ensuring the sealing performance of the photovoltaic cell assembly, thereby expanding the application range of the photovoltaic cell assembly.

In order to achieve the above object, the present invention provides the following technical solutions:

A photovoltaic cell assembly, the photovoltaic cell assembly includes a solar cell chip and a back plate, the solar cell chip and the back plate are connected together through a sealing frame, and a hydrophobic encapsulation layer is provided on the outer surface of the sealing frame.

Compared with the prior art, in the photovoltaic cell assembly provided by the present invention, the outer surface of the sealing frame is provided with a hydrophobic encapsulation layer, so that the sealing frame has good hydrophobicity; when the photovoltaic cell assembly is used in an environment with high humidity , the water vapor contained in the air will only condense on the surface of the hydrophobic encapsulation layer in the form of water droplets, and cannot pass through the sealing frame to corrode the solar cell chip, so that the waterproof performance of the photovoltaic cell module can be guaranteed; in addition, because the sealing frame The outer surface of the part is provided with a hydrophobic encapsulation layer, so that the hydrophobic encapsulation layer is equivalent to the protective layer of the frame sealing part, so as to avoid the erosion of water and oxygen on the frame sealing part by using the hydrophobic encapsulation layer, and ensure the lasting performance of the frame sealing performance of the frame sealing part; and , in the photovoltaic cell assembly provided by the present invention, only a hydrophobic encapsulation layer is provided on the outer surface of the sealing frame to ensure the water vapor performance of the photovoltaic cell assembly, therefore, there is no need to form a waterproof seal on the surface of the back plate opposite to the solar cell chip Compared with the prior art, the weight of the photovoltaic cell assembly provided by the present invention is lighter, so that the application range of the photovoltaic cell assembly is broadened.

The present invention also provides a method for manufacturing a photovoltaic cell assembly. The method for manufacturing the photovoltaic cell assembly includes:

Provide solar cell chips, backplanes and sealing frames;

The solar cell chip and the back plate are connected together by a sealing frame, and a hydrophobic encapsulation layer is provided on the outer surface of the sealing frame.

Compared with the prior art, the beneficial effect of the manufacturing method of the photovoltaic cell assembly provided by the present invention is the same as that of the photovoltaic cell assembly provided by the above technical solution, and will not be repeated here.

Description of drawings

The accompanying drawings described here are used to provide a further understanding of the present invention, and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention, and do not constitute improper limitations to the present invention. In the attached picture:

Fig. 1 is a schematic structural view of a photovoltaic cell assembly provided by an embodiment of the present invention;

FIG. 2 is a schematic structural view of a solar cell chip in an embodiment of the present invention;

Fig. 3 is the flow chart of the manufacturing method of the photovoltaic cell assembly provided by the embodiment of the present invention;

FIG. 4 is a flow chart of connecting solar cell chips and backplanes together by using a frame sealing member in an embodiment of the present invention.

Reference signs:

1-solar cell chip, 10-transparent substrate;

11-solar battery unit, 111-first electrode layer;

112-the second electrode layer, 112a-AZO electrode layer;

112b-Ag/NiCr/Al electrode layer, 113-battery functional layer;

113a-the first PIN structure battery functional layer, 113b-the second PIN structure battery functional layer;

2-back panel, 3-sealing frame;

4-hydrophobic encapsulation layer, 40-side hydrophobic part;

401-the first bending part, 402-the second bending part;

41-the first hydrophobic contact part, 42-the second hydrophobic contact part;

51 - the first SGP adhesive film, 52 - the second SGP adhesive film.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

In view of the heavy moisture in the prior art, the water vapor will corrode the solar cell chip included in the photovoltaic cell module after the water vapor enters the interior of the photovoltaic cell module, so that the carrier concentration inside the photovoltaic cell module is reduced, and the conductivity is seriously reduced, resulting in battery The open-circuit voltage Voc and fill factor FF in the chip performance parameters drop significantly, which eventually leads to a reduction in power generation. Referring to Fig. 1 and Fig. 2, the photovoltaic cell assembly provided by the embodiment of the present invention includes a solar cell chip 1 and a back plate 2, and the solar cell chip 1 and the back plate 2 are connected together through a sealing frame 3, and the outer surface of the sealing frame 3 A hydrophobic encapsulation layer 4 is provided on the surface.

The manufacturing process of the photovoltaic cell module provided by the embodiment of the present invention will be described in detail below with reference to FIGS. 1 to 3 .

Step 1: Provide solar cell chip 1, backplane 2 and sealing frame 3;

Step 2: Connect the solar cell chip 1 and the back sheet 2 together by using the sealing frame 3 , and the outer surface of the sealing frame 3 is provided with a hydrophobic encapsulation layer 4 .

In the photovoltaic cell assembly provided based on the embodiment of the present invention, the outer surface of the sealing frame 3 is provided with a hydrophobic encapsulation layer 4, so that the sealing frame 3 has good hydrophobicity; when the photovoltaic cell assembly is applied to an environment with high humidity, The water vapor contained in the air will only condense on the surface of the hydrophobic encapsulation layer 4 in the form of water droplets, but cannot pass through the sealing frame 3 to corrode the solar cell chip 1, for example: when the photovoltaic power station is in operation for a long time, the water condensed on the edge of the photovoltaic cell module The beads will be air-dried, even in continuous rainy weather, during the operation and maintenance of the photovoltaic power station, the maintenance personnel only need to wipe off the water droplets condensed on the hydrophobic film on the edge of each module, so as to improve the service life of the photovoltaic modules and ensure the photovoltaic cells Water vapor resistance of components.

In addition, since the outer surface of the sealing frame 3 is provided with a hydrophobic encapsulating layer 4, the hydrophobic encapsulating layer 4 is equivalent to the protective layer of the sealing frame 3, so that the hydrophobic encapsulating layer 4 is used to avoid the corrosion of the sealing frame 3 by water and oxygen, ensuring The sealing performance of the sealing frame member 3 can be played for a long time; moreover, in the photovoltaic cell assembly provided by the embodiment of the present invention, only the outer surface of the sealing frame member 3 is provided with a hydrophobic encapsulation layer 4, which can ensure the waterproof performance of the photovoltaic cell assembly Therefore, there is no need to form a waterproof sealing structure on the surface of the back plate 2 opposite to the solar cell chip 1. Compared with the prior art, the photovoltaic cell assembly provided by the embodiment of the present invention is lighter, so that the application range of the photovoltaic cell assembly is broadened.

It should be noted that the backsheet 2 in the embodiment of the present invention can be transparent or opaque, and when the backsheet 2 is transparent, the carrier absorption of the solar cell chip 1 can be increased, thereby increasing its power generation.

Considering that in the prior art, the side of the sealing frame 3 exposed to the outside world is most likely to be exposed to water vapor, based on this, as shown in Figure 1 and Figure 2, the hydrophobic encapsulation layer 4 in the embodiment of the present invention includes at least a side hydrophobic part 40, and the side hydrophobic The portion 40 is arranged on the side of the frame sealing member 3 away from the solar cell chip 1 (i.e., the outer surface of the side hydrophobic portion 40), so as to protect the outer surface of the sealing frame member 3 from water and oxygen, so as to reduce the influence of water vapor on the sealing frame. Corrosion of piece 3.

Specifically, as shown in Figures 1 and 2, the hydrophobic encapsulation layer 4 in the embodiment of the present invention also includes a first hydrophobic contact part 41 and/or a second hydrophobic contact part 42; the first hydrophobic contact part 41 is located on the solar cell chip 1 Between the surface opposite to the back plate 2 and the sealing frame member 3, the second hydrophobic contact portion 42 is located between the back plate 2 and the sealing frame member 3, which is equivalent to the surface of the solar cell chip 1 opposite to the back plate 2 and the sealing frame member The first hydrophobic contact part 41 is added in the gap between 3 to prevent water vapor from entering the gap between the surface of the solar cell chip 1 opposite to the back plate 2 and the sealing frame 3 by using the first hydrophobic contact part 41, thereby further increasing The waterproof ability of the hydrophobic encapsulation layer 4 and the protective effect on the sealing frame 3; similarly, the second hydrophobic contact part 42 can prevent water vapor from entering the gap between the backplane 2 and the sealing frame 3, thereby further increasing the hydrophobic encapsulation layer 4's waterproof ability and the protective effect on the sealing frame 3.

For the convenience of manufacture, as shown in Figure 1 and Figure 2, in the embodiment of the present invention, the side hydrophobic part 40 is connected with the first hydrophobic contact part 41 and/or the second hydrophobic contact part 42, and an integral structure is the best connection method . Considering that the side hydrophobic portion 40 is arranged on the side of the sealing frame member 3 close to the outside world, the first hydrophobic contact portion 41 is located between the surface of the solar cell chip 1 opposite to the back plate 2 and the sealing frame member 3, and the second hydrophobic contact portion 42 is located between the back plate 2 and the sealing frame 3, so that when the first hydrophobic contact part 41, the second hydrophobic contact part 42 and the side hydrophobic part 40 are integrated, the first hydrophobic contact part 41 and the side hydrophobic part 40 The second hydrophobic contact portion 42 and the side hydrophobic portion 40 need to be connected by a bending portion. Based on this, the first hydrophobic contact part 41 is connected to the side hydrophobic part 40 through the first bent part 401. Compared with other parts of the hydrophobic encapsulation layer 4, the stress on the first bent part 401 is relatively large, and the second hydrophobic contact part 42 and the side hydrophobic part 40 are connected by the second bending part 402, compared with other parts of the hydrophobic encapsulation layer 4, the stress received by the second bending part 402 is relatively large; based on this, the first bending part 401 The bending resistance is at least greater than the bending resistance of the first hydrophobic contact portion 41, the bending resistance of the second hydrophobic contact portion 42 and the bending resistance of the side hydrophobic portion 40, and the bending resistance of the second bending portion 402 The performance is at least greater than the bending resistance of the first hydrophobic contact portion 41 , the bending resistance of the second hydrophobic contact portion 42 and the bending resistance of the side hydrophobic portion 40 . Specifically, the first bent part 401 and the second bent part 402 are bent parts treated by plasma bombardment, and the structural strength of the bent part after plasma bombardment treatment increases. Therefore, when the first hydrophobic contact part 41, the second When the two hydrophobic contact parts 42 and the side hydrophobic part 40 are of an integrated structure, only the first bending part 401 and the second bending part 402 need to be subjected to plasma bombardment treatment at the end to improve the first bending part 401 and the second bending part 401. The strength of the bent portion 402 prevents the first bent portion 401 and the second bent portion 402 from breaking due to excessive stress for a long time, thereby increasing the service life of the hydrophobic encapsulation layer 4 .

It can be understood that the hydrophobic encapsulation layer 4 in the embodiment of the present invention is a hydrophobic encapsulation layer 4 with a contact angle greater than 90°. Further, the hydrophobic encapsulation layer 4 is a hydrophobic encapsulation layer with a contact angle of 120° to 160°. At this time, the hydrophobic encapsulation layer 4 can better exert its hydrophobic ability, so that the water vapor contained in the air close to the hydrophobic encapsulation layer 4 can be maximized. condensation on the surface of the hydrophobic encapsulation layer 4.

Optionally, the hydrophobic encapsulation layer 4 in the embodiment of the present invention may be an organic hydrophobic film or an inorganic hydrophobic film. Wherein, the organic hydrophobic film is a polyamide hydrophobic film, PMMA- _SiO Composite hydrophobic film or polytetrafluoroethylene film, but not limited to this; the inorganic hydrophobic film is a silicon dioxide film, aluminum oxide film or insulating ceramic film, but It doesn't stop there.

For example: PMMA-SiO ₂ composite hydrophobic film uses hydrophilic engineering plastics polymethyl methacrylate (PMMA) and epoxy resin as the matrix, and prepares PMMA-SiO ₂ composite superhydrophobic film by introducing hydrophobic SiO ₂ nanoparticles. film, the surface of the PMMA-SiO ₂ composite superhydrophobic film has a contact angle with water even exceeding 150°, and has strong hydrophobic properties.

Considering the convenience of operation, the sealing frame member 3 in the embodiment of the present invention is a hot-melt sealing layer, and the hydrophobic sealing layer 4 is an organic hydrophobic film. In this case, since both the hot-melt sealing layer and the organic hydrophobic film can It melts under heating conditions and solidifies after cooling. Based on this feature, a hydrophobic substrate as a hydrophobic encapsulation layer 4 can be formed on the surface of the solar cell chip 1 opposite to the back plate 2, and then the hydrophobic substrate is away from the solar cell chip 1. The surface of the sealing frame 3 is formed, and then the sealing frame 3 is wrapped, and the back sheet 2 is opposite to the surface of the solar cell chip 1 forming the sealing frame 3, and finally the solar cell chip 1 and the back sheet 2 are thermally laminated repeatedly, so that the back sheet The plate 2 and the solar cell chip 1 are closely combined.

It should be noted that the frame sealing member 3 in the embodiment of the present invention may be butyl rubber, or other glues or resins capable of sealing the frame, which will not be listed here.

Optionally, as shown in Figure 1 and Figure 2, the solar cell chip 1 in the embodiment of the present invention is divided into a frame area and a photosensitive area, the solar cell chip 1 includes a light-transmitting substrate, and the surface of the light-transmitting substrate corresponding to the photosensitive area is provided with For the solar battery unit 11 , the sealing frame member 3 is disposed on the part of the transparent substrate 10 corresponding to the frame area.

Further, as shown in Fig. 1 and Fig. 2, the solar battery unit 11 in the embodiment of the present invention includes a first electrode layer 111, a battery function layer 113 and a second electrode layer 112 stacked on the light-transmitting substrate in sequence, the first electrode layer 111 is opposite to the surface of the photosensitive area of the transparent substrate, and the surface of the second electrode layer 112 facing away from the battery functional layer 113 is opposite to the back plate 2 .

When specifically making the solar cell chip 1, a film-forming process is used to form a laminated first electrode layer 111, a battery function layer 113, and a second electrode layer 112 on the surface of the transparent substrate 10. The film-forming process is a chemical vapor deposition process or magnetron sputtering. Then use laser (wavelength 1064nm) to remove part of the film layer on the edge of the transparent substrate 10, so that the manufactured solar cell chip 1 is divided into a frame area and a photosensitive area, and the film layer in the frame area is removed by the laser, and The film layer in the photosensitive area is retained, and the film layer retained in the photosensitive area is called a solar cell unit 11, and the frame area is an electrically insulating area with a width of 7mm-10mm, where the width of the electrically insulating area refers to: from the solar cell The shortest distance d from the side of the unit 11 to the side of the transparent substrate 10 .

Exemplarily, as shown in FIG. 2, the first electrode layer 111 is a TCO electrode layer, the second electrode layer 112 is an AZO electrode layer 112A and an Ag/NiCr/Al electrode layer 112b stacked together, and the AZO electrode layer 112A is located Between the Ag/NiCr/Al electrode layer 112b and the battery function layer 113, the battery function layer 113 is a double-layer PIN structure battery function layer, specifically including a first PIN structure battery function layer 113a and a second PIN structure battery function layer 113b, And the first PIN structure battery function layer 113a is located between the first electrode layer 111 and the second PIN structure battery function layer 113b.

In view of the defects of the EVA adhesive film or PVB adhesive film in the prior art, the original EVA adhesive film or PVB adhesive film is replaced by the SGP adhesive film in the embodiment of the present invention to increase the bonding performance. Specifically, as shown in Fig. 1 and Fig. 2, in the embodiment of the present invention, the surface of the back sheet 2 opposite to the solar cell unit 11 is formed with a first SGP adhesive film 51 for bonding the back sheet 2 and the solar cell unit 11, sealing the frame Part 3 is also in contact with the side of the first SGP adhesive film 51; and/or, a second SGP adhesive film for bonding the transparent substrate and solar cell unit 11 is formed between the transparent substrate and the solar cell unit 11 52 , the sealing frame component 3 is also in contact with the side of the second SGP adhesive film 52 . Since the hygroscopicity of the SGP adhesive film is relatively small and has good adhesive properties, therefore, in the photovoltaic power generation module provided by the embodiment of the present invention, although the first SGP adhesive film is passed between the back plate 2 and the solar cell unit 11 51 bonding, and/or between the light-transmitting substrate and the solar cell unit 11 through the second SGP adhesive film 52, but it is found through testing that the first SGP adhesive film 51 and/or the second SGP adhesive film 52 can Reducing the thickness of the back plate 2 and/or the transparent substrate 10 used reduces the weight of the photovoltaic power generation assembly.

Specifically, when the backplane 2 is ordinary glass or tempered glass, in the structures shown in Figures 1 and 2, the thickness of the 3.2mm backplane 2 and the transparent substrate 10 is reduced to 2.5mm by applying the SGP adhesive film, The thickness of the back plate 2 and the transparent substrate 10 of 4 mm is reduced to 2 mm. Simultaneously, the weight of the BIPV (Building Integrated Photovoltaic, English full name Building Integrated PV, abbreviated as BIPV) assembly for photovoltaic greenhouses made of the photovoltaic cell assembly provided by the embodiment of the present invention is reduced from 14.4kg to 9kg, thereby reducing the photovoltaic power consumption. Load-bearing requirements of greenhouse buildings.

It can be seen that the test shows that when the back plate 2 and/or the light-transmitting substrate are all light-transmitting glass, the thickness of the light-transmitting glass in the embodiment of the present invention is less than 3 mm, which can greatly reduce the weight of the photovoltaic cell module.

As shown in Figures 1 to 3, an embodiment of the present invention provides a method for manufacturing a photovoltaic cell assembly, the method for manufacturing a photovoltaic cell assembly includes:

Step S100: the first step: providing solar cell chips 1, backplane 2 and sealing frame 3;

Step S300 : Connect the solar cell chip 1 and the backsheet 2 together by using the sealing frame 3 , and the outer surface of the sealing frame 3 is provided with a hydrophobic encapsulation layer 4 .

Compared with the prior art, the beneficial effect of the manufacturing method of the photovoltaic cell assembly provided by the embodiment of the present invention is the same as the beneficial effect of the photovoltaic cell assembly provided by the above embodiment, and will not be repeated here.

As a realizable embodiment, as shown in Fig. 1, Fig. 2 and Fig. 4, using the sealing frame 3 to connect the solar cell chip 1 and the back plate 2 together in the embodiment of the present invention includes:

Step S310: forming a first hydrophobic contact portion 41 on the surface of the solar cell chip 1, the first hydrophobic contact portion 41 is connected to the second hydrophobic contact portion 42 through the side hydrophobic portion 40;

Step S320: forming the sealing frame 3 on the surface of the first hydrophobic contact portion 41 facing away from the solar cell chip 1;

Step S330 : Connect the side hydrophobic portion 40 to the side surface of the sealing frame member 3 , and connect the second hydrophobic contact portion 42 to the surface of the sealing frame member 3 away from the first hydrophobic contact portion 41 . During the specific operation, the side hydrophobic part 40 is brought into contact with the side surface of the sealing frame part 3 (to realize the connection) by bending, and the second hydrophobic contact part 42 is turned over to the position away from the first hydrophobic contact part 41 of the sealing frame part 3. surface, so that the second hydrophobic contact portion 42 is in contact with the surface of the sealing frame member 3 away from the first hydrophobic contact portion 41 (to realize connection).

Step S340: facing the surface of the solar cell chip 1 on which the first hydrophobic contact portion 41 is formed and the back plate 2;

Step S350: heat-laminate the solar cell chip 1 and the back sheet 2 repeatedly, so that the frame sealing member 3 connects the solar cell chip 1 and the back sheet 2 together; The part 3 is away from the side of the solar cell chip 1 .

Further, as shown in FIGS. 1 to 3 , before forming the first hydrophobic contact portion 41 on the surface of the solar cell chip 1, connecting the solar cell chip 1 and the back plate 2 together by using the sealing frame member 3 further includes:

Step S200: Divide the solar cell chip 1 into a photosensitive area and a non-photosensitive area arranged around the photosensitive area; remove the functional film layer contained in the non-photosensitive area of the solar cell chip 1, so that the non-photosensitive area of the solar cell chip 1 is formed Insulated border area;

Step S310 specifically includes: forming the first hydrophobic contact portion 41 on the surface of the solar cell chip 1 includes: forming the first hydrophobic contact portion 41 in the frame region.

As shown in Figure 1, Figure 2 and Figure 4, if the first hydrophobic contact part 41 and the side hydrophobic part 40 are connected through the first bending part 401, the second hydrophobic contact part 42 and the side hydrophobic part 40 are connected through the second bend The folding part 402 is connected; after the solar cell chip 1 and the back plate 2 are connected together by the above-mentioned sealing frame member 3, the method for manufacturing the photovoltaic cell module provided by the embodiment of the present invention further includes:

Step S400: Using a plasma bombardment process to treat the first bent part 401 and the second bent part 402 respectively, so that the bending resistance of the first bent part 401 is at least greater than that of the first hydrophobic contact part 41 , the bending resistance of the second hydrophobic contact portion 42 and the bending resistance of the side hydrophobic portion 40, the bending resistance of the second bending portion 402 is at least greater than the bending resistance of the first hydrophobic contact portion 41, the second The bending resistance of the hydrophobic contact portion 42 and the bending resistance of the side hydrophobic portion.

In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (16)

1. a kind of photovoltaic cell component, including solar battery chip and backboard, the solar battery chip and the backboard It is linked together by sealing framework, which is characterized in that the outer surface of the envelope framework is equipped with hydrophobic encapsulated layer.

2. photovoltaic cell component according to claim 1, which is characterized in that the hydrophobic encapsulated layer is dredged including at least side Water portion, the side hydrophobic portion are located at the side of the envelope framework far from the solar battery chip.

3. photovoltaic cell component according to claim 2, which is characterized in that the hydrophobic encapsulated layer further includes first hydrophobic Contact site and/or the second hydrophobic contact portion；

First hydrophobic contact portion is located at the solar battery chip with respect between the surface of backboard and the envelope framework, institute The second hydrophobic contact portion is stated between the backboard and the envelope framework.

4. photovoltaic cell component according to claim 3, which is characterized in that first hydrophobic contact portion and the side Hydrophobic portion is connected by the first bending part, passes through the second bending part between second hydrophobic contact portion and the side hydrophobic portion Connection；The warping resistance performance of first bending part at least more than first hydrophobic contact portion warping resistance performance, second dredge The warping resistance performance of water contact site and the warping resistance performance of side hydrophobic portion, the warping resistance performance of second bending part are at least big Warping resistance performance, the warping resistance performance in the second hydrophobic contact portion and the anti-folding of side hydrophobic portion in first hydrophobic contact portion Curved performance.

5. photovoltaic cell component according to claim 1, which is characterized in that the solar battery chip is divided into rim area Domain and photosensitive region, the solar battery chip include transparent substrates, and the surface that the transparent substrates correspond to photosensitive region is set There are solar battery cell, the envelope framework to be located at the surface that the transparent substrate corresponds to frame region.

6. photovoltaic cell component according to claim 5, which is characterized in that the solar battery cell includes folding successively Set the first electrode layer in transparent substrates, battery functi on layer and the second electrode lay, the first electrode layer and the transparent substrates Photosensitive region surface it is opposite, the second electrode lay away from battery functi on layer surface it is opposite with the backboard, the battery Functional layer is the PIN structural battery functi on layer of bilayer.

7. photovoltaic cell component according to claim 5, which is characterized in that the backboard is with respect to solar battery cell Surface is formed with the first SGP glued membranes for bonding the backboard and solar battery cell, and the envelope framework is also with described The contact aside of one SGP glued membranes；And/or

It is formed between the transparent substrates and the solar battery cell for bonding the transparent substrates and the sun 2nd SGP glued membranes of energy battery unit, contact aside of the envelope framework also with the 2nd SGP glued membranes.

8. photovoltaic cell component according to claim 7, which is characterized in that the backboard and/or the transparent substrates are equal Thickness for transparent glass, the transparent glass is respectively less than 3mm.

9. according to claim 1~8 any one of them photovoltaic cell component, which is characterized in that the hydrophobic encapsulated layer is to connect The hydrophobic encapsulated layer that feeler is 120 °~160 °.

10. according to claim 1~8 any one of them photovoltaic cell component, which is characterized in that the hydrophobic encapsulated layer is to have Machine hydrophobic film or inorganic hydrophobic film.

11. photovoltaic cell component according to claim 10, which is characterized in that organic hydrophobic film is dredged for polyamide Water film, PMMA-SiO₂Composite hydrophobic film or polytetrafluoroethylene film；The inorganic hydrophobic film be silica membrane, Aluminum oxide film or insulating ceramics film.

12. according to claim 1~8 any one of them photovoltaic cell component, which is characterized in that the envelope framework is hot melt Seal frame layer.

13. a kind of production method of photovoltaic cell component, which is characterized in that including：

Solar battery chip, backboard and envelope framework are provided；

The solar battery chip and the backboard are linked together using the envelope framework, the outer surface of the envelope framework Equipped with hydrophobic encapsulated layer.

14. the production method of photovoltaic cell component according to claim 13, which is characterized in that described to utilize envelope framework The solar battery chip and the backboard link together including：

The first hydrophobic contact portion is formed on the surface of the solar battery chip, first hydrophobic contact portion is dredged by side Water portion is connect with the second hydrophobic contact portion；

In first hydrophobic contact portion envelope framework is formed away from the surface of solar battery chip；

The side hydrophobic portion connect with the side of envelope framework, second hydrophobic contact portion and the envelope framework are deviated from the The surface in one hydrophobic contact portion connects；

The surface that the solar battery chip is formed to the first hydrophobic contact portion is opposite with backboard；

Solar battery chip described in heat lamination and the backboard repeatedly so that the envelope framework is by the solar battery chip It links together with the backboard；The side of the envelope framework connection side hydrophobic portion is located at the envelope framework far from the sun The side of energy battery chip.

15. the production method of photovoltaic cell component according to claim 14, which is characterized in that described to utilize envelope framework After the solar battery chip and the backboard link together, the production method of the photovoltaic cell component further includes：It adopts First bending part and second bending part are handled respectively with plasma bombardment technique.

16. according to the production method of claim 13~15 any one of them photovoltaic cell component, which is characterized in that described Before the surface of solar battery chip forms the first hydrophobic contact portion, it is described using envelope framework by the solar battery chip and The backboard, which links together, further includes：

The solar battery chip is divided into photosensitive region and is located at the non-photo-sensing region of photosensitive region circumferential direction；

Remove the functional film layer that the non-photo-sensing region of the solar battery chip is included so that the solar battery chip Non-photo-sensing region formed insulation frame region.