CN108366500A - A kind of electronic component protection structure - Google Patents
A kind of electronic component protection structure Download PDFInfo
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- CN108366500A CN108366500A CN201810003595.4A CN201810003595A CN108366500A CN 108366500 A CN108366500 A CN 108366500A CN 201810003595 A CN201810003595 A CN 201810003595A CN 108366500 A CN108366500 A CN 108366500A
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- protective shell
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- electronic component
- electronic components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/10—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
本发明公开了一种电子元器件保护结构,包括第一保护外壳和第二保护外壳,所述第一保护外壳和第二保护外壳的一侧侧壁通过铰链连接,第一保护外壳和第二保护外壳的结构相同,且第一保护外壳的两端均焊接有引线管,第一保护外壳包括横杆、矩形框、导热杆和内固定壳,其中内固定壳和矩形框通过导热杆连接,矩形框和内固定壳的竖截面均呈矩形,横截面呈圆弧形,导热杆沿圆周方向均匀排布在内固定壳的外侧壁上。该电子元器件保护结构其上设置了由第一保护外壳和第二保护外壳等部件构成的保护机构,其能够防止电子元器件收到外力冲击而损坏,其能够有效的散去电子元器件运作时产生的热,能够达到对电子元器件很好的保护作用。
The invention discloses a protective structure for electronic components, comprising a first protective shell and a second protective shell, one side wall of the first protective shell and the second protective shell are connected by a hinge, the first protective shell and the second protective shell are The structure of the protective shell is the same, and both ends of the first protective shell are welded with lead pipes, the first protective shell includes a cross bar, a rectangular frame, a heat conducting rod and an internal fixed shell, wherein the internal fixed shell and the rectangular frame are connected by a heat conducting rod, Both the vertical section of the rectangular frame and the inner fixed shell are rectangular, and the cross section is arc-shaped, and the heat conducting rods are evenly arranged on the outer wall of the inner fixed shell along the circumferential direction. The electronic component protection structure is provided with a protection mechanism composed of the first protective shell and the second protective shell, which can prevent the electronic components from being damaged by external force impact, and can effectively dissipate the electronic components. The heat generated at the time can achieve a good protection effect on electronic components.
Description
技术领域technical field
本发明涉及电子元器件技术领域,尤其涉及一种电子元器件保护结构。The invention relates to the technical field of electronic components, in particular to a protective structure for electronic components.
背景技术Background technique
电子元器件是电子元件和电小型的机器、仪器的组成部分,其本身常由若干零件构成,可以在同类产品中通用;常指电器、无线电、仪表等工业的某些零件,如电容、晶体管、游丝、发条等子器件的总称。常见的有二极管等。Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-devices such as springs, hairsprings, and springs. Common ones include diodes, etc.
电子元器件包括:电阻、电容器、电位器、电子管、散热器、机电元件、连接器、半导体分立器件、电声器件、激光器件、电子显示器件、光电器件、传感器、电源、开关、微特电机、电子变压器、继电器、印制电路板、集成电路、各类电路、压电、晶体、石英、陶瓷磁性材料、印刷电路用基材基板、电子功能工艺专用材料、电子胶(带)制品、电子化学材料及部品等。Electronic components include: resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical components, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motors , electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectric, crystal, quartz, ceramic magnetic materials, base substrates for printed circuits, special materials for electronic functional processes, electronic glue (tape) products, electronic Chemical materials and parts, etc.
现有技术中,在电子元器件的安装结构中,电子元器件在运作时会产生大量的热,大量的热如果不及时对其进行散热处理,电子元器件其必然会被烧毁,造成不必要的经济损失。In the prior art, in the installation structure of electronic components, electronic components will generate a large amount of heat during operation. If the large amount of heat is not dissipated in time, the electronic components will inevitably be burned, causing unnecessary economic loss.
因此,如何提供一种电子元器件保护结构,是目前本领域技术人员亟待解决的问题。Therefore, how to provide a protection structure for electronic components is an urgent problem to be solved by those skilled in the art.
发明内容Contents of the invention
本发明的目的是为了解决现有技术中存在的缺点,而提出的一种电子元器件保护结构。The object of the present invention is to propose a protection structure for electronic components in order to solve the shortcomings in the prior art.
为了实现上述目的,本发明采用了如下技术方案:In order to achieve the above object, the present invention adopts the following technical solutions:
一种电子元器件保护结构,包括第一保护外壳和第二保护外壳,所述第一保护外壳和第二保护外壳的一侧侧壁通过铰链连接,第一保护外壳和第二保护外壳的结构相同,且第一保护外壳的两端均焊接有引线管,第一保护外壳包括横杆、矩形框、导热杆和内固定壳,其中内固定壳和矩形框通过导热杆连接,矩形框和内固定壳的竖截面均呈矩形,横截面呈圆弧形,导热杆沿圆周方向均匀排布在内固定壳的外侧壁上。A protection structure for electronic components, comprising a first protective shell and a second protective shell, one side wall of the first protective shell and the second protective shell are connected by a hinge, the structure of the first protective shell and the second protective shell The same, and both ends of the first protective shell are welded with lead tubes, the first protective shell includes a cross bar, a rectangular frame, a heat conduction rod and an inner fixed shell, wherein the inner fixed shell and the rectangular frame are connected by a heat conduction rod, the rectangular frame and the inner fixed shell The vertical section of the fixed shell is rectangular, the cross section is arc-shaped, and the heat conducting rods are evenly arranged on the outer wall of the inner fixed shell along the circumferential direction.
优选的,所述第一保护壳和第二保护壳的均由铜杆焊接而成,且两者规格大小相同。Preferably, both the first protective shell and the second protective shell are welded by copper rods, and both have the same specification and size.
优选的,所述横杆和导热杆的横截面均呈圆形,竖截面均呈矩形,且均采用铜杆。Preferably, the cross-sections of the horizontal bars and the heat-conducting rods are both circular, and the vertical sections are rectangular, and both are made of copper rods.
优选的,所述内固定壳的内腔与引线管的内腔相连通,且内固定壳的内侧侧壁涂覆有导热硅胶。Preferably, the inner cavity of the inner fixing shell communicates with the inner cavity of the lead wire tube, and the inner side wall of the inner fixing shell is coated with heat-conducting silica gel.
优选的,所述引线管的横截面呈圆形,竖截面呈矩形。Preferably, the cross section of the lead tube is circular, and the vertical section is rectangular.
优选的,所述铰链采用铜质铰链。Preferably, the hinge is a copper hinge.
本发明有益效果:该电子元器件保护结构其上设置了由第一保护外壳和第二保护外壳等部件构成的保护机构,其能够防止电子元器件收到外力冲击而损坏,且整个保护机构具备良好的导热性,且其还具备良好的散热性,其能够有效的散去电子元器件运作时产生的热,能够达到对电子元器件很好的保护作用,该电子元器件其结构简单,造价低,能够很好的保护电子元器件,减少不必要的经济损失。Beneficial effects of the present invention: the electronic component protection structure is provided with a protection mechanism composed of the first protective shell and the second protective shell, which can prevent the electronic components from being damaged by external impact, and the entire protection mechanism has Good thermal conductivity, and it also has good heat dissipation, which can effectively dissipate the heat generated when the electronic components are in operation, and can achieve a good protection effect on the electronic components. The electronic components are simple in structure and low in cost. Low, can well protect electronic components and reduce unnecessary economic losses.
附图说明Description of drawings
图1为本发明提出的一种电子元器件保护结构的结构示意图;Fig. 1 is the structural representation of a kind of electronic component protection structure that the present invention proposes;
图2为本发明提出的一种电子元器件保护结构的第一保护壳的结构示意图;Fig. 2 is a structural schematic diagram of a first protective shell of an electronic component protection structure proposed by the present invention;
图3为本发明提出的一种电子元器件保护结构的局部结构示意图。FIG. 3 is a schematic diagram of a partial structure of an electronic component protection structure proposed by the present invention.
图中:1第一保护壳、2引线管、3第二保护外壳、4铰链、11横杆、12矩形框、13导热杆、14内固定壳。In the figure: 1 first protective shell, 2 lead pipe, 3 second protective shell, 4 hinge, 11 cross bar, 12 rectangular frame, 13 heat conduction rod, 14 inner fixed shell.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them.
参照图1-3,一种电子元器件保护结构,包括第一保护外壳1和第二保护外壳3,第一保护外壳1和第二保护外壳3的一侧侧壁通过铰链4连接,第一保护外壳1和第二保护外壳3的结构相同,且第一保护外壳1的两端均焊接有引线管2,第一保护外壳1包括横杆11、矩形框12、导热杆13和内固定壳14,其中内固定壳14和矩形框12通过导热杆13连接,矩形框12和内固定壳14的竖截面均呈矩形,横截面呈圆弧形,导热杆13沿圆周方向均匀排布在内固定壳14的外侧壁上,第一保护壳1和第二保护壳3的均由铜杆焊接而成,且两者规格大小相同,横杆11和导热杆13的横截面均呈圆形,竖截面均呈矩形,且均采用铜杆,内固定壳14的内腔与引线管2的内腔相连通,且内固定壳14的内侧侧壁涂覆有导热硅胶,引线管2的横截面呈圆形,竖截面呈矩形,链4采用铜质铰链。Referring to Figures 1-3, a protective structure for electronic components includes a first protective shell 1 and a second protective shell 3, one side wall of the first protective shell 1 and the second protective shell 3 are connected by a hinge 4, the first The protective shell 1 and the second protective shell 3 have the same structure, and both ends of the first protective shell 1 are welded with lead tubes 2, and the first protective shell 1 includes a cross bar 11, a rectangular frame 12, a heat conducting rod 13 and an inner fixed shell 14, wherein the inner fixed shell 14 and the rectangular frame 12 are connected by heat conducting rods 13, the vertical sections of the rectangular frame 12 and the inner fixed shell 14 are rectangular, the cross section is arc-shaped, and the heat conducting rods 13 are evenly arranged in the circumferential direction On the outer wall of the fixed shell 14, the first protective shell 1 and the second protective shell 3 are welded by copper rods, and the specifications and sizes of the two are the same. The vertical sections are all rectangular, and copper rods are used. The inner cavity of the inner fixed shell 14 communicates with the inner cavity of the lead pipe 2, and the inner side wall of the inner fixed shell 14 is coated with thermal silica gel. The cross section of the lead pipe 2 It is circular, and the vertical section is rectangular, and the chain 4 adopts a copper hinge.
该电子元器件保护结构其上设置了由第一保护外壳和第二保护外壳等部件构成的保护机构,其能够防止电子元器件收到外力冲击而损坏,且整个保护机构具备良好的导热性,且其还具备良好的散热性,其能够有效的散去电子元器件运作时产生的热,能够达到对电子元器件很好的保护作用,该电子元器件其结构简单,造价低,能够很好的保护电子元器件,减少不必要的经济损失。The electronic component protection structure is provided with a protection mechanism composed of the first protective shell and the second protective shell, which can prevent the electronic components from being damaged by external impact, and the entire protection mechanism has good thermal conductivity. And it also has good heat dissipation, which can effectively dissipate the heat generated when the electronic components are in operation, and can achieve a good protection effect on the electronic components. The electronic components are simple in structure, low in cost, and can be well Protect electronic components and reduce unnecessary economic losses.
使用时,将需要进行保护的电子元器件放置在内固定壳14内,并在电子元器件和内固定壳14之间的缝隙里填充导热硅胶,然后再将第一保护壳1和第二保护壳3两者进行连接固定即可。During use, the electronic components that need to be protected are placed in the inner fixed shell 14, and the gap between the electronic components and the inner fixed shell 14 is filled with heat-conducting silica gel, and then the first protective shell 1 and the second protective shell 1 are placed together. Both shells 3 can be connected and fixed.
以上,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。The above is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone familiar with the technical field within the technical scope disclosed in the present invention, according to the technical solutions of the present invention and its Any equivalent replacement or change of the inventive concept shall fall within the protection scope of the present invention.
Claims (6)
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109104103A (en) * | 2018-10-17 | 2018-12-28 | 合肥凌山新能源科技有限公司 | A kind of automatic heat radiation and cleaning structure for inverter |
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EP2043147A2 (en) * | 2007-09-28 | 2009-04-01 | Shin-Etsu Chemical Co., Ltd. | Automotive electric/electronic package |
JP2013093472A (en) * | 2011-10-26 | 2013-05-16 | Toshiba Corp | Joint structure of member, joint method of member, and package |
CN204733504U (en) * | 2015-06-06 | 2015-10-28 | 杭州华泽医药科技有限公司 | A kind of general radiator structure |
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2018
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Patent Citations (3)
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EP2043147A2 (en) * | 2007-09-28 | 2009-04-01 | Shin-Etsu Chemical Co., Ltd. | Automotive electric/electronic package |
JP2013093472A (en) * | 2011-10-26 | 2013-05-16 | Toshiba Corp | Joint structure of member, joint method of member, and package |
CN204733504U (en) * | 2015-06-06 | 2015-10-28 | 杭州华泽医药科技有限公司 | A kind of general radiator structure |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN109104103A (en) * | 2018-10-17 | 2018-12-28 | 合肥凌山新能源科技有限公司 | A kind of automatic heat radiation and cleaning structure for inverter |
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