CN108365847B - Calibration method for parasitic capacitance of charge type SAR-ADC - Google Patents
Calibration method for parasitic capacitance of charge type SAR-ADC Download PDFInfo
- Publication number
- CN108365847B CN108365847B CN201711483390.2A CN201711483390A CN108365847B CN 108365847 B CN108365847 B CN 108365847B CN 201711483390 A CN201711483390 A CN 201711483390A CN 108365847 B CN108365847 B CN 108365847B
- Authority
- CN
- China
- Prior art keywords
- adc
- capacitor
- capacitance
- sar
- compensation circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
- H03M1/12—Analogue/digital converters
- H03M1/14—Conversion in steps with each step involving the same or a different conversion means and delivering more than one bit
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Analogue/Digital Conversion (AREA)
Abstract
本发明公开了一种针对电荷型SAR‑ADC寄生电容的校准方法,所述电荷型SAR‑ADC包括LSB电容阵列,将LSB电容阵列的所有上极板与第一补偿电路的一端相连,第一补偿电路的另一端接任意恒定电位,第一补偿电路由第一固定电容Cdl和第一可调电容Cdl'并联组成,通过调节第一补偿电路来调节SAR‑ADC的非线性误差。LSB电容阵列中单位电容值为Cu,共L位,从低位到高位分别以2倍的关系递增,最高位电容值为2L‑1Cu。当LSB电容阵列的总电容值为CLt时,则如下关系式成立:CLt=(2L‑1)·Cu+Cdl+Cdl'。所述针对电荷型SAR‑ADC寄生电容的校准方法能达到很高的线性和增益的调节精度,特别适合高精度ADC的设计。
The invention discloses a method for calibrating parasitic capacitance of a charge-type SAR-ADC. The charge-type SAR-ADC includes an LSB capacitor array, and all upper plates of the LSB capacitor array are connected to one end of a first compensation circuit, and the first The other end of the compensation circuit is connected to any constant potential. The first compensation circuit is composed of a first fixed capacitor C dl and a first adjustable capacitor C dl ' in parallel, and the nonlinear error of the SAR-ADC is adjusted by adjusting the first compensation circuit. In the LSB capacitor array, the unit capacitance value is C u , and there are L bits in total. From the low order to the high order, the relationship is increased by 2 times, and the highest capacitance value is 2 L‑1 C u . When the total capacitance value of the LSB capacitor array is C Lt , the following relation is established: C Lt =(2 L -1)·C u +C dl +C dl '. The calibration method for the parasitic capacitance of the charge-type SAR-ADC can achieve high linearity and gain adjustment accuracy, and is especially suitable for the design of high-precision ADCs.
Description
技术领域technical field
本发明涉及一种芯片设计领域,特别涉及一种针对电荷型SAR-ADC寄生电容的校准方法。The invention relates to the field of chip design, in particular to a calibration method for the parasitic capacitance of a charge-type SAR-ADC.
背景技术Background technique
模拟和数字信号之间的转换是信号处理重要的组成部分,自然界的声、光、电等模拟信号要先经过模拟数字转换器(ADC)转成数字信号才能被数字系统进一步的转换和处理。不同的系统对ADC的指标要求也不尽相同,不同的ADC指标要求都有相应的ADC结构与之相适应。随着集成电路工艺尺寸的减小和制造工艺精度的提高,目前应用最为广泛的ADC结构有SAR-ADC、sigma-delta ADC和流水线ADC。而逐次逼近转换器(SAR-ADC)具有中等速度、中等精度、低功耗和低成本的综合优势,在更加广阔的领域中得到了应用。The conversion between analog and digital signals is an important part of signal processing. The natural sound, light, electricity and other analog signals must be converted into digital signals by an analog-to-digital converter (ADC) before they can be further converted and processed by the digital system. Different systems have different requirements for ADC indicators, and different ADC indicators require corresponding ADC structures to adapt to them. With the reduction of integrated circuit process size and the improvement of manufacturing process precision, the most widely used ADC structures are SAR-ADC, sigma-delta ADC and pipeline ADC. The successive approximation converter (SAR-ADC) has the comprehensive advantages of medium speed, medium precision, low power consumption and low cost, and has been applied in a wider field.
SAR-ADC的基本结构包含一个比较器、一个数字模拟转换器(DAC)和一个逐次逼近控制器(SAR)。它将采样信号与已知电压不断地进行比较,一个周期完成一位转换,N个周期完成N位转换,SAR-ADC的分辨率和转换速度是相互矛盾的。其中ADC的精度主要由数字模拟转换器的精度决定。数字模拟转换器的结构很多,应用最为广泛的为电荷型数模转换器,如图1所示。所谓电荷型数模转换器的工作过程是通过电荷在二元比例划分电容阵列中的再分配来完成的,通过电荷的再分配将输入电压与基准电压比例进行比较,找到最接近输入电压的基准电压比例,也就实现了模拟和数字之间的转换。电荷型DAC的精度和所需要的面积都是限制位数的因素,其中,精度指的是电容的比例精度。电容的比例精度与电容的面积正相关,要想实现更高的比例精度,必须消耗更大的面积。在现有的工艺条件下,电容比例精度可以低至0.1%,0.1%的电容比例精度只适用于电容比例接近1时,当比例增大时,这个精度会相应减小。相同的条件下不经过数字校准的电荷型DAC一般可以达到10-bit的精度,也就是说二元比例划分的电容阵列中最大电容和最小电容之间的比值为512:1。为了使匹配精度不会随着DAC精度的增加而下降,可以将一个高精度DAC划分成多个子DAC,每个子DAC之间通过缩放电容来实现连接,如图2所示。MSB和LSB分别M位和L位的子DAC,电容Ca为缩放电容,将MSB和LSB连接成一个M+L位的DAC。为了保证每个子DAC的匹配精度,单个子DAC的位数不宜过高。当整个DAC的精度很高时,为了保证单个子DAC的匹配精度,可以将整个电容阵列分成多个分段,通过多个缩放电容进行连接。为了保证各个分段DAC之间的线性关系,需要满足以下公式:The basic structure of a SAR-ADC consists of a comparator, a digital-to-analog converter (DAC), and a successive approximation controller (SAR). It continuously compares the sampled signal with the known voltage, completes one-bit conversion in one cycle, and completes N-bit conversion in N cycles. The resolution and conversion speed of SAR-ADC are contradictory. The accuracy of the ADC is mainly determined by the accuracy of the digital-to-analog converter. There are many structures of digital-to-analog converters, and the most widely used is the charge-type digital-to-analog converter, as shown in Figure 1. The working process of the so-called charge-based digital-to-analog converter is accomplished through the redistribution of charges in the binary proportional division capacitor array. The voltage ratio also realizes the conversion between analog and digital. Both the accuracy of a charge-type DAC and the required area are factors limiting the number of bits, where accuracy refers to the proportional accuracy of the capacitance. The proportional accuracy of the capacitor is positively related to the area of the capacitor. To achieve higher proportional accuracy, a larger area must be consumed. Under the existing process conditions, the capacitance ratio accuracy can be as low as 0.1%, and the 0.1% capacitance ratio accuracy is only applicable when the capacitance ratio is close to 1. When the ratio increases, the accuracy will decrease accordingly. Under the same conditions, the charge-type DAC without digital calibration can generally achieve 10-bit accuracy, that is to say, the ratio between the maximum capacitance and the minimum capacitance in the binary proportional capacitor array is 512:1. In order to keep the matching accuracy from decreasing as the DAC accuracy increases, a high-precision DAC can be divided into multiple sub-DACs, and each sub-DAC is connected by scaling capacitors, as shown in Figure 2. MSB and LSB are M-bit and L-bit sub-DACs respectively. Capacitor C a is a scaling capacitor, and MSB and LSB are connected to form an M+L-bit DAC. In order to ensure the matching accuracy of each sub-DAC, the number of bits of a single sub-DAC should not be too high. When the accuracy of the entire DAC is high, in order to ensure the matching accuracy of a single sub-DAC, the entire capacitor array can be divided into multiple segments and connected through multiple scaling capacitors. In order to ensure the linear relationship between each segmented DAC, the following formula needs to be satisfied:
Ca·Ceq/(Ca+Ceq)=k·Cu C a ·C eq /(C a +C eq )=k·C u
理想情况下电容分段解决了匹配精度随着DAC精度的增加而下降的问题,但是在非理想情况下,电容的上下极板对地和极板之间存在寄生电容,如附图3所示。Top、Bottom两点为电容的两端,Shield端为电容的屏蔽端(用于屏蔽电容极板和衬底的干扰)或者衬底。Cpa为Top、Bottom两端的走线寄生电容。Cp1和Cp2分别为Top/Shield和Bottom/Shield之间的寄生电容。由于该寄生电容在设计的时候并没有考虑,况且寄生电容会随着工艺角的变化而变化,所以该寄生电容的存在会引起各个分段DAC之间的非线性。Ideally, capacitor segmentation solves the problem that the matching accuracy decreases with the increase of DAC accuracy, but in non-ideal cases, there is parasitic capacitance between the upper and lower plates of the capacitor and the plate, as shown in Figure 3 . Top and Bottom are the two ends of the capacitor, and the Shield end is the shielding end of the capacitor (used to shield the interference between the capacitor plate and the substrate) or the substrate. C pa is the trace parasitic capacitance at both ends of Top and Bottom. C p1 and C p2 are the parasitic capacitances between Top/Shield and Bottom/Shield, respectively. Since the parasitic capacitance is not considered in the design, and the parasitic capacitance will change with the change of the process angle, the existence of the parasitic capacitance will cause nonlinearity among the segmented DACs.
为了调节各个分段电容之间的非线性,通常的做法是在电路中引入可调电容Ca',如图4所示。Ca'的调节是通过MOS开关或者FIB的方式接入A、B两点或者与A、B两点断开。由于同一批次的电容寄生是一样的,可以通过流片后的测量结果对可变电容进行线性调节,使调节后的子DAC之间满足线性要求。In order to adjust the nonlinearity between each segmented capacitance, the usual practice is to introduce an adjustable capacitance C a ' into the circuit, as shown in Figure 4. The adjustment of C a ' is to connect two points A and B or disconnect from two points A and B by means of MOS switch or FIB. Since the capacitance parasitics of the same batch are the same, the variable capacitance can be linearly adjusted through the measurement results after tape-out, so that the adjusted sub-DACs meet the linearity requirements.
通过对以上现有技术的研究和实际电路系统应用环境的考虑很容易发现现有技术存在以下缺点:It is easy to find the following shortcomings in the existing technology through the research on the above existing technology and the consideration of the actual circuit system application environment:
(1)一般情况下,为了减小缩放电容的寄生电容,缩放电容的取值相对较小。当ADC对线性化要求很高时,就需要缩放电容中可调节部分的精度要足够高,为了实现足够高的电容调节精度需要足够小的电容,当电容小到与调节开关寄生电容相当时,将无法向更高精度调节,导致调节精度受限。(1) In general, in order to reduce the parasitic capacitance of the scaling capacitor, the value of the scaling capacitor is relatively small. When the ADC has high requirements for linearization, the precision of the adjustable part of the scaling capacitor needs to be high enough. In order to achieve a high enough capacitance adjustment precision, a small enough capacitance is required. When the capacitance is small enough to be equivalent to the parasitic capacitance of the adjustment switch, It will not be possible to adjust to higher accuracy, resulting in limited adjustment accuracy.
(2)当缩放电容采用MOS开关方式进行调节时,A点或者B点必然会与调节开关的一端相连,而A、B两点的电压在转换过程中会剧烈变化,电压的变化会导致调节开关寄生电容的剧烈变化,A、B两点寄生电容的变化会严重影响ADC本身的精度和增益。(2) When the scaling capacitor is adjusted by MOS switch, point A or point B will inevitably be connected to one end of the adjustment switch, and the voltages of points A and B will change drastically during the conversion process, and the change in voltage will cause adjustment. The drastic change of the parasitic capacitance of the switch and the changes of the parasitic capacitance of A and B will seriously affect the accuracy and gain of the ADC itself.
(3)当采用FIB的方式调节缩放电容时,需要对每颗芯片进行FIB调节,由于FIB本身存在经济和时间成本,采用此种方式,在大幅增加芯片的成本的同时也严重限制的芯片的产能。(3) When using the FIB method to adjust the scaling capacitor, it is necessary to adjust the FIB of each chip. Since the FIB itself has economic and time costs, this method will greatly increase the cost of the chip and also seriously limit the chip's performance. capacity.
公开于该背景技术部分的信息仅仅旨在增加对本发明的总体背景的理解,而不应当被视为承认或以任何形式暗示该信息构成已为本领域一般技术人员所公知的现有技术。The information disclosed in this Background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种针对电荷型SAR-ADC寄生电容的校准方法,用于高精度SAR-ADC设计。The purpose of the present invention is to provide a calibration method for the parasitic capacitance of a charge-type SAR-ADC, which is used in the design of a high-precision SAR-ADC.
为实现上述目的,本发明提供了一种针对电荷型SAR-ADC寄生电容的校准方法,所述电荷型SAR-ADC包括LSB电容阵列,将LSB电容阵列的所有上极板与第一补偿电路的一端相连,第一补偿电路的另一端接任意恒定电位,第一补偿电路由第一固定电容Cdl和第一可调电容Cdl'并联组成,通过调节第一补偿电路来调节SAR-ADC的非线性误差。LSB电容阵列中单位电容值为Cu,共L位,从低位到高位分别以2倍的关系递增,最高位电容值为2L-1Cu。当LSB电容阵列的总电容值为CLt时,则如下关系式成立:CLt=(2L-1)·Cu+Cdl+Cdl'。In order to achieve the above object, the present invention provides a calibration method for the parasitic capacitance of a charge-type SAR-ADC, the charge-type SAR-ADC includes an LSB capacitor array, and all upper plates of the LSB capacitor array and the first compensation circuit are connected. One end is connected, the other end of the first compensation circuit is connected to any constant potential, the first compensation circuit is composed of a first fixed capacitor C dl and a first adjustable capacitor C dl ' in parallel, and the SAR-ADC is adjusted by adjusting the first compensation circuit. nonlinear error. The unit capacitance value in the LSB capacitor array is C u , with a total of L bits, which are increased by a factor of 2 from the low order to the high order, and the highest capacitance value is 2 L-1 C u . When the total capacitance value of the LSB capacitor array is C Lt , the following relation is established: C Lt =(2 L -1)·C u +C dl +C dl '.
优选地,上述技术方案中,所述第一可调电容Cdl'由多个电容组电路并联组成。所述第一可调电容Cdl'中的每个所述电容组电路均由两个电容串联组成,并且其中一个电容与一个选通开关并联。Preferably, in the above technical solution, the first adjustable capacitor C dl ' is composed of a plurality of capacitor bank circuits in parallel. Each of the capacitor group circuits in the first adjustable capacitor C dl ' is composed of two capacitors connected in series, and one of the capacitors is connected in parallel with a gate switch.
优选地,上述技术方案中,所述第一可调电容中的每个所述电容组电路中的电容取值相同或不同。Preferably, in the above technical solution, the capacitors in each of the capacitor bank circuits in the first adjustable capacitors have the same value or different values.
优选地,上述技术方案中,所述电荷型SAR-ADC还包括MSB电容阵列,将所述MSB电容阵列的所有上极板与第二补偿电路的一端相连,所述第二补偿电路的另一端一路通过选通开关接入任意恒定电位,另一路通过另一选通开关接入采样信号。所述第二补偿电路由第二固定电容和第二可调电容并联组成。通过调节所述第二补偿电路调节所述SAR-ADC的整体增益。所述MSB电容阵列中单位电容值为Cu,共M位,从低位到高位分别以2倍的关系递增,最高位电容值为2M-1Cu。Preferably, in the above technical solution, the charge-type SAR-ADC further includes an MSB capacitor array, and all upper plates of the MSB capacitor array are connected to one end of the second compensation circuit, and the other end of the second compensation circuit is connected One channel is connected to any constant potential through the gating switch, and the other is connected to the sampling signal through another gating switch. The second compensation circuit is composed of a second fixed capacitor and a second adjustable capacitor in parallel. The overall gain of the SAR-ADC is adjusted by adjusting the second compensation circuit. The unit capacitance value in the MSB capacitor array is C u , with a total of M bits, which are increased by a factor of 2 from the low order to the high order, and the highest capacitance value is 2 M-1 C u .
优选地,上述技术方案中,所述第二可调电容由N个电容组电路并联组成。所述第二可调电容中的每个电容组电路均由两个电容串联组成,其中一个电容与一个选通开关并联。Preferably, in the above technical solution, the second adjustable capacitor is composed of N capacitor group circuits in parallel. Each capacitor group circuit in the second adjustable capacitor is composed of two capacitors connected in series, one of which is connected in parallel with a gate switch.
优选地,上述技术方案中,所述第二可调电容中的每个所述电容组电路中的电容取值相同或不同。Preferably, in the above technical solution, the capacitors in each of the capacitor bank circuits in the second adjustable capacitors have the same value or different values.
优选地,上述技术方案中,所述电荷型SAR-ADC还包括比较器。所述电荷型SAR-ADC的采样只针对所述MSB电容阵列进行,在转换过程中,根据所述比较器判别结果将各个权重电容的下极板陆续接到基准电位上,当采样电容与接到基准电位的总电容之比等于1时,所述电荷型SAR-ADC增益为1;当采样电容与接到基准电位的总电容之比大于1时,所述电荷型SAR-ADC增益为小于1;当采样电容与接到基准电位的总电容之比小于1时,所述电荷型SAR-ADC增益为大于1。Preferably, in the above technical solution, the charge-type SAR-ADC further includes a comparator. The sampling of the charge-type SAR-ADC is only performed for the MSB capacitor array. During the conversion process, the lower plates of each weight capacitor are connected to the reference potential one after another according to the judgment result of the comparator. When the ratio of the total capacitance to the reference potential is equal to 1, the gain of the charge-type SAR-ADC is 1; when the ratio of the sampling capacitance to the total capacitance connected to the reference potential is greater than 1, the gain of the charge-type SAR-ADC is less than 1. 1; when the ratio of the sampling capacitance to the total capacitance connected to the reference potential is less than 1, the gain of the charge-type SAR-ADC is greater than 1.
与现有技术相比,本发明具有如下有益效果:能达到很高的线性和增益的调节精度,特别适合高精度ADC的设计。Compared with the prior art, the present invention has the following beneficial effects: high linearity and gain adjustment precision can be achieved, and it is especially suitable for the design of high precision ADC.
附图说明Description of drawings
图1是根据现有技术的电荷型SAR-ADC的电路框架图。FIG. 1 is a circuit frame diagram of a charge-type SAR-ADC according to the prior art.
图2是根据现有技术的DAC分段的电荷型SAR-ADC电路框架图。FIG. 2 is a circuit block diagram of a charge-type SAR-ADC segmented by a DAC according to the prior art.
图3是根据现有技术的电容寄生示意图。FIG. 3 is a schematic diagram of capacitance parasitics according to the prior art.
图4是根据现有技术的DAC分段且寄生电容校准的电荷型SAR-ADC电路框架图。FIG. 4 is a circuit block diagram of a charge-type SAR-ADC with DAC segmentation and parasitic capacitance calibration according to the prior art.
图5是根据本发明一实施方式的电荷型SAR-ADC寄生电容的校准方法的SAR-ADC电路框架图。FIG. 5 is a SAR-ADC circuit frame diagram of a method for calibrating parasitic capacitance of a charge-type SAR-ADC according to an embodiment of the present invention.
图6是根据本发明一实施方式的电荷型SAR-ADC寄生电容的校准方法的可调电容结构图。FIG. 6 is a structural diagram of an adjustable capacitance of a method for calibrating parasitic capacitance of a charge-type SAR-ADC according to an embodiment of the present invention.
具体实施方式Detailed ways
下面结合附图,对本发明的具体实施方式进行详细描述,但应当理解本发明的保护范围并不受具体实施方式的限制。The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.
除非另有其它明确表示,否则在整个说明书和权利要求书中,术语“包括”或其变换如“包含”或“包括有”等等将被理解为包括所陈述的元件或组成部分,而并未排除其它元件或其它组成部分。Unless expressly stated otherwise, throughout the specification and claims, the term "comprising" or its conjugations such as "comprising" or "comprising" and the like will be understood to include the stated elements or components, and Other elements or other components are not excluded.
本发明的目的是提出一种针对电荷型SAR-ADC寄生电容的校准方法。如图5所示。图5是根据本发明一实施方式的电荷型SAR-ADC寄生电容的校准方法的SAR-ADC电路框架图。The purpose of the present invention is to propose a calibration method for the parasitic capacitance of the charge-type SAR-ADC. As shown in Figure 5. FIG. 5 is a SAR-ADC circuit frame diagram of a method for calibrating parasitic capacitance of a charge-type SAR-ADC according to an embodiment of the present invention.
首先在只有MSB电容参与采样的电路基础上,分别引入固定电容和可调节电容用来调节A、B两点寄生电容所引起的线性误差和增益误差。其中,Cdl和Cdl'用于调节各个分段子DAC之间的线性关系,Cdm和Cdm'用于调节ADC的整体增益。First, on the basis of the circuit in which only the MSB capacitor participates in the sampling, a fixed capacitor and an adjustable capacitor are respectively introduced to adjust the linearity error and gain error caused by the parasitic capacitance of the A and B points. Among them, C dl and C dl ' are used to adjust the linear relationship between the sub-DACs of each segment, and C dm and C dm ' are used to adjust the overall gain of the ADC.
第一固定电容Cdl和第一可调节电容Cdl'的上极板接A点,下极板接VCM,其中VCM为任意恒定电位。Cdl的引入使缩放电容两端子DAC之间基本满足线性关系。但是由于每个电容存在极板寄生电容,只引入Cdl是不能满足所有工艺角下各个子DAC之间的线性关系的,因此需要引入Cdl'用于调节不同工艺角下的寄生电容的变化。The upper plates of the first fixed capacitor C dl and the first adjustable capacitor C dl ' are connected to point A, and the lower plates are connected to VCM, where VCM is an arbitrary constant potential. The introduction of C dl makes the two-terminal DAC of the scaling capacitor basically satisfy the linear relationship. However, due to the parasitic capacitance of the plate in each capacitor, only the introduction of C dl cannot satisfy the linear relationship between the sub-DACs under all process corners. Therefore, it is necessary to introduce C dl ' to adjust the parasitic capacitance changes in different process corners. .
为了保证分段DAC之间的线性关系,需要缩放电容Ca两端相邻位保持两倍的权重关系,即MSB最高位的权重是LSB最低位的权重的两倍。可以简单的理解为在①、②两点分别输入等幅度的阶跃电压,使其在B点引起的电压变化分别为dV1和dV2,并且要求:In order to ensure the linear relationship between the segmented DACs, it is necessary to maintain twice the weight relationship between the adjacent bits at both ends of the scaling capacitor C a , that is, the weight of the MSB highest bit is twice the weight of the LSB lowest bit. It can be simply understood as inputting step voltages of equal amplitude at points ① and ②, so that the voltage changes caused by point B are dV 1 and dV 2 respectively, and requires:
dV2=2dV1 公式1dV 2 =2dV 1 Equation 1
为了满足公式2的要求,各个电容之间的取值需要满足以下关系:In order to meet the requirements of Equation 2, the value of each capacitor needs to satisfy the following relationship:
k·(Ca+CLt)=2L·Ca 公式2k·(C a +C Lt )=2 L ·C a Formula 2
其中,in,
CLt=(2L-1)·Cu+Cdl+Cdl' 公式3C Lt = (2 L -1)·C u +C dl +C dl ' Equation 3
当电容存在寄生或失配导致MSB和LSB之间出现非线性时,通过调节Cdl和Cdl'即可对其非线性进行补偿,使其满足线性要求。Cdl为设计的标准值,Cdl'的调节用于抵消由于工艺和寄生等非理想因素所造成的非线性误差。When the parasitic or mismatch of the capacitance causes nonlinearity between MSB and LSB, the nonlinearity can be compensated by adjusting C dl and C dl ' to make it meet the linearity requirement. C dl is the standard value of the design, and the adjustment of C dl ' is used to offset the nonlinear error caused by non-ideal factors such as process and parasitics.
第二固定电容Cdm和第二可调电容Cdm'的上极板接B点,下极板通过两个开关分别接到VIN和VCM,其中VCM为任意恒定电位。The upper plates of the second fixed capacitor C dm and the second adjustable capacitor C dm ' are connected to point B, and the lower plates are respectively connected to V IN and V CM through two switches, where V CM is an arbitrary constant potential.
在本发明中,ADC的采样只针对MSB位进行,在转换的过程中,根据比较器判别结果将各权重电容的下极板陆续接到基准电位上。当采样电容与接到基准电位的总电容之比为1时,ADC的增益为1;当采样电容与接到基准电位的总电容之比大于1时,ADC的增益为小于1;当采样电容与接到基准电位的总电容之比小于1时,ADC的增益为大于1;因此,在不影响ADC线性的情况下,可以通过调节采样电容的值直接调节ADC的增益。采样电容可以通过调节Cdm和Cdm'来进行调节,Cdm为设计的标准值,Cdm'的调节用来抵消由于工艺和寄生等非理想因素所造成的增益误差。In the present invention, the sampling of the ADC is performed only for the MSB bit. During the conversion process, the lower plates of each weight capacitor are connected to the reference potential one after another according to the judgment result of the comparator. When the ratio of the sampling capacitance to the total capacitance connected to the reference potential is 1, the gain of the ADC is 1; when the ratio of the sampling capacitance to the total capacitance connected to the reference potential is greater than 1, the gain of the ADC is less than 1; When the ratio of the total capacitance connected to the reference potential is less than 1, the gain of the ADC is greater than 1; therefore, the gain of the ADC can be directly adjusted by adjusting the value of the sampling capacitor without affecting the linearity of the ADC. The sampling capacitor can be adjusted by adjusting C dm and C dm ', C dm is the standard value of the design, and the adjustment of C dm ' is used to offset the gain error caused by non-ideal factors such as process and parasitics.
图6是根据本发明一实施方式的电荷型SAR-ADC寄生电容的校准方法的可调电容结构图。Top、Bottom两端分别为可调节电容的上下极板,C1、C2…Cn的上极板与Top端相连,C1、C2…Cn的下极板分别与C11、C21…Cn1的上极板相连于S1、S2…Sn,C11、C21…Cn1的下极板与Bottom相连,节点S1、S2…Sn分别通过开关SW1、SW2…SWn与Bottom端相连。FIG. 6 is a structural diagram of an adjustable capacitance of a method for calibrating parasitic capacitance of a charge-type SAR-ADC according to an embodiment of the present invention. The two ends of Top and Bottom are the upper and lower plates of the adjustable capacitor, respectively. The upper plates of C 1 , C 2 ... C n are connected to the Top ends, and the lower plates of C 1 , C 2 , ... C n are respectively connected to C 11 , C The upper plates of 21 ... Cn1 are connected to S1, S2... Sn , the lower plates of C11 , C21 ... Cn1 are connected to the Bottom, and the nodes S1, S2 ... Sn are respectively connected through switches SW1 , SW 2 ...SW n are connected to the Bottom side.
当SW1开关闭合时,电容C1接入Top、Bottom两端,当SW1开关断开时,电容C1·C11/(C1+C11)接入Top、Bottom两端;当SW2开关闭合时,电容C2接入Top、Bottom两端,当SW2开关断开时,电容C2·C21/(C2+C21)Top、Bottom两端;依此类推,当SWn开关闭合时,电容Cn接入Top、Bottom两端,当SWn开关断开时,电容Cn·Cn1/(Cn+Cn1)接入Top、Bottom两端;通过以上分析可以算出,可调节电容Ctot的调节范围是:When the SW 1 switch is closed, the capacitor C 1 is connected to both ends of Top and Bottom; when the SW 1 switch is open, the capacitor C 1 ·C 11 /(C 1 +C 11 ) is connected to both ends of the Top and Bottom; 2 When the switch is closed, the capacitor C 2 is connected to both ends of Top and Bottom. When the SW 2 switch is open, the capacitor C 2 ·C 21 /(C 2 +C 21 ) Top and Bottom ends; and so on, when SWn When the switch is closed, the capacitor C n is connected to both ends of Top and Bottom. When the switch of SW n is turned off, the capacitor C n ·C n1 /(C n +C n1 ) is connected to both ends of Top and Bottom; through the above analysis, it can be calculated , the adjustment range of the adjustable capacitor C tot is:
C1·C11/(C1+C11)+C2·C21/(C2+C21)+…+Cn·Cn1/(Cn+Cn1)≤Ctot≤C1+C2+…+Cn C 1 ·C 11 /(C 1 +C 11 )+C 2 ·C 21 /(C 2 +C 21 )+…+C n ·C n1 /(C n +C n1 )≤C tot ≤C 1 + C 2 +…+C n
在工艺角确定的情况下,寄生电容也是确定的,在不同的工艺角下通过调节可调电容Cdl'的值就可以消除寄生电容对各个子DAC之间线性关系的影响,通过调节Cdm'的值就可以对ADC的增益进行调节。When the process angle is determined, the parasitic capacitance is also determined. By adjusting the value of the adjustable capacitor C dl ' under different process angles, the influence of the parasitic capacitance on the linear relationship between the sub-DACs can be eliminated. By adjusting the C dm The value of ' can adjust the gain of the ADC.
前述对本发明的具体示例性实施方案的描述是为了说明和例证的目的。这些描述并非想将本发明限定为所公开的精确形式,并且很显然,根据上述教导,可以进行很多改变和变化。对示例性实施例进行选择和描述的目的在于解释本发明的特定原理及其实际应用,从而使得本领域的技术人员能够实现并利用本发明的各种不同的示例性实施方案以及各种不同的选择和改变。本发明的范围意在由权利要求书及其等同形式所限定。The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise form disclosed, and obviously many changes and modifications are possible in light of the above teachings. The exemplary embodiments were chosen and described for the purpose of explaining certain principles of the invention and their practical applications, to thereby enable one skilled in the art to make and utilize various exemplary embodiments and various different aspects of the invention. Choose and change. The scope of the invention is intended to be defined by the claims and their equivalents.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711483390.2A CN108365847B (en) | 2017-12-29 | 2017-12-29 | Calibration method for parasitic capacitance of charge type SAR-ADC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711483390.2A CN108365847B (en) | 2017-12-29 | 2017-12-29 | Calibration method for parasitic capacitance of charge type SAR-ADC |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108365847A CN108365847A (en) | 2018-08-03 |
CN108365847B true CN108365847B (en) | 2020-09-01 |
Family
ID=63010713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711483390.2A Active CN108365847B (en) | 2017-12-29 | 2017-12-29 | Calibration method for parasitic capacitance of charge type SAR-ADC |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108365847B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108923786A (en) * | 2018-08-23 | 2018-11-30 | 中国电子科技集团公司第二十四研究所 | A kind of march-past capacitor array structure SAR ADC |
CN109756229B (en) * | 2018-12-07 | 2023-01-17 | 国网天津市电力公司 | Configurable ΣΔADC Modulator for Wireless Communication Systems |
CN109818617A (en) * | 2019-01-28 | 2019-05-28 | 西安微电子技术研究所 | A kind of high-precision calibration device of SAR type ADC |
CN110138387B (en) * | 2019-06-05 | 2020-11-03 | 中国电子科技集团公司第二十四研究所 | SAR ADC based on single-channel time interleaved sampling and sampling method |
CN111162787B (en) | 2019-12-27 | 2022-01-04 | 清华大学 | Passive Noise Shaping Successive Approximation Analog-to-Digital Converter |
CN112311395B (en) * | 2020-11-17 | 2022-02-01 | 北京智芯微电子科技有限公司 | Calibration method of charge type SAR ADC |
TWI763524B (en) * | 2021-06-04 | 2022-05-01 | 瑞昱半導體股份有限公司 | Method of operating analog-to-digital converter |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102594353A (en) * | 2011-01-13 | 2012-07-18 | 中兴通讯股份有限公司 | Digital-to-analog converter and successive approximation storage converter |
CN103475373A (en) * | 2013-09-02 | 2013-12-25 | 深圳市汇顶科技股份有限公司 | Digital-to-analog converter with sectional capacitor array structure |
CN104124967A (en) * | 2014-07-10 | 2014-10-29 | 天津大学 | Segmented capacitor array type successive approximation analog-digital converter calibration structure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6707403B1 (en) * | 2002-11-12 | 2004-03-16 | Analog Devices, Inc. | Analog to digital converter with a calibration circuit for compensating for coupling capacitor errors, and a method for calibrating the analog to digital converter |
JP2010045723A (en) * | 2008-08-18 | 2010-02-25 | Fujitsu Ltd | Digital-to-analog converter |
DE102009010155B4 (en) * | 2009-02-23 | 2013-02-07 | Texas Instruments Deutschland Gmbh | Digital trimming of (SAR) ADCs |
JP6102521B2 (en) * | 2013-05-29 | 2017-03-29 | 株式会社ソシオネクスト | SAR analog-digital conversion method and SAR analog-digital conversion circuit |
CN104917527B (en) * | 2015-06-30 | 2017-12-05 | 东南大学 | Capacitor mismatch calibration circuit and its calibration method applied to single-ended SAR ADC |
TWI591969B (en) * | 2016-04-15 | 2017-07-11 | 瑞昱半導體股份有限公司 | Calibration circuit and calibration method for DAC |
-
2017
- 2017-12-29 CN CN201711483390.2A patent/CN108365847B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102594353A (en) * | 2011-01-13 | 2012-07-18 | 中兴通讯股份有限公司 | Digital-to-analog converter and successive approximation storage converter |
CN103475373A (en) * | 2013-09-02 | 2013-12-25 | 深圳市汇顶科技股份有限公司 | Digital-to-analog converter with sectional capacitor array structure |
CN104124967A (en) * | 2014-07-10 | 2014-10-29 | 天津大学 | Segmented capacitor array type successive approximation analog-digital converter calibration structure |
Non-Patent Citations (2)
Title |
---|
A self-testing and calibration method for embedded successive approximation register ADC;Xuan-Lun Huang;《ASPDAC "11: Proceedings of the 16th Asia and South Pacific Design Automation Conference》;20110131;713-718页 * |
基于16位SAR模数转换器的误差校准方法;乔高帅;《微纳电子技术》;20091031;第46卷(第10期);636-639页 * |
Also Published As
Publication number | Publication date |
---|---|
CN108365847A (en) | 2018-08-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108365847B (en) | Calibration method for parasitic capacitance of charge type SAR-ADC | |
CN103873059B (en) | Digital calibration method for high-precision SAR ADC (successive approximation register analog to digital converter) | |
US9019140B2 (en) | System and method for analog to digital (A/D) conversion | |
CN101277112B (en) | Low-power consumption assembly line a/d converter by sharing operation amplifier | |
CN104242935A (en) | SAR ADC segmented capacitor mismatch correction method | |
CN104168020B (en) | The electric capacity gamma correction circuit and method of a kind of analog-digital converter of approach type by turn | |
KR20180105027A (en) | Successive approximation register analog-digital converter having split-capacitor based digital-analog converter | |
CN110401449A (en) | A High Precision SAR ADC Structure and Calibration Method | |
CN112636757B (en) | Successive approximation type analog-to-digital converter and offset compensation method thereof | |
CN107346975B (en) | SAR type ADC's high accuracy calibrating device | |
CN112803946B (en) | Capacitor mismatch and offset voltage correction method applied to high-precision successive approximation ADC (analog to digital converter) | |
CN103840827B (en) | Assembly line ADC interstage gain calibration method | |
CN105049049A (en) | Capacitor exchange method for improving DNL (Differential Nonlinearity)/INL (Integral Nonlinearity) of successive approximation analog to digital converter | |
Zhang et al. | A 12-bit two-step single-slope ADC with a constant input-common-mode level resistor ramp generator | |
CN112039528B (en) | Capacitor array logic control method in successive approximation analog-to-digital converter | |
CN108155909B (en) | Successive approximation type analog-to-digital converter with capacitor segmented structure | |
CN114050827A (en) | Digital calibration method applied to capacitance three-section successive approximation type analog-to-digital converter | |
CN110176930B (en) | Multi-position resolution sub-pipeline structure for measuring jump height of transmission curve | |
CN115425983A (en) | High-precision MASH type high-order noise shaping analog-to-digital converter | |
CN105071811A (en) | Bit circulation method used for improving successive approximation analog to digital converter DNL/INL | |
Zhang et al. | A low-power and area-efficient 14-bit SAR ADC with hybrid CDAC for array sensors | |
Zhang et al. | A 16-bit 2.5-MS/s SAR ADC with on-chip foreground calibration | |
Xin et al. | 99.83% Switching energy reduction over conventional scheme for SAR ADC without reset energy | |
CN108259040A (en) | Eliminate the method that voltage coefficient of capacitance influences fully differential SAR-ADC performances | |
CN114826263A (en) | Floating node calibration method applied to sectional type successive approximation analog-to-digital converter |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |