CN108346602B - Efficient chip packaging device for smart card - Google Patents
Efficient chip packaging device for smart card Download PDFInfo
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- CN108346602B CN108346602B CN201810282331.7A CN201810282331A CN108346602B CN 108346602 B CN108346602 B CN 108346602B CN 201810282331 A CN201810282331 A CN 201810282331A CN 108346602 B CN108346602 B CN 108346602B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses a chip packaging device of a high-efficiency intelligent card, which comprises a card conveying guide rail, a chip belt supply mechanism, a chip blanking mechanism, a chip auxiliary conveying mechanism and a chip packaging conveying mechanism; the chip auxiliary carrying mechanism comprises a vacuum suction head group, a chip temporary storage positioning die and a vacuum suction head group driving mechanism, wherein the vacuum suction head group comprises a rotary suction head and a movable suction head; the chip packaging and carrying mechanism comprises two packaging suction heads and a packaging suction head driving mechanism; the relative position between the two packaging suction heads is consistent with the relative position between two chips of the same group of different cards on two adjacent smart cards to be packaged on the card conveying track; the chip temporary storage positioning die is provided with two positioning grooves, and the relative position between the two positioning grooves is consistent with the relative position between the two packaging suction heads. The device can carry out the transport and the encapsulation task of two chips simultaneously to make the transport encapsulation rate of whole chip improve greatly.
Description
Technical Field
The invention relates to smart card production equipment, in particular to a chip packaging device of a smart card.
Background
In the production process of the smart card, a chip needs to be packaged into a card slot, and the chip packaging process comprises the following steps: firstly, a chip is blanked onto a chip blanking die from a chip belt by utilizing a chip blanking mechanism, then a chip is sucked from the chip blanking die by a chip packaging suction head, the chip is conveyed into a chip temporary storage positioning die, the chip temporary storage positioning die is adjusted in the conveying process, finally, the chip is conveyed into a clamping groove of a smart card to be packaged, which is positioned at a chip packaging position, from the chip temporary storage positioning die by the packaging suction head, and the chip is packaged by heating and fixing.
The invention patent application of application number 2017106661228.0 discloses a chip packaging device of a multi-core smart card. The device comprises a card conveying guide rail, a chip belt supply mechanism, a chip blanking mechanism, a chip auxiliary conveying mechanism and a chip packaging conveying mechanism; the chip blanking mechanism is provided with a chip blanking die, and the chip auxiliary carrying mechanism is provided with a vacuum suction head and a chip temporary storage positioning die; when the chip temporary storage positioning die works, firstly, a chip is sucked from the chip blanking die by the vacuum suction head, the posture of the chip is fixedly conveyed to the chip temporary storage positioning die, then the vacuum suction head returns to the chip blanking die to suck a chip, and the chip is conveyed to the chip temporary storage positioning die after rotating 180 degrees, so that the conveying and posture adjustment work of a group of chips is completed; and then the packaging suction head simultaneously sucks a group of chips positioned on the chip temporary storage positioning die, and carries the chips to a chip packaging station for packaging.
The chip packaging device of the multi-core intelligent card has the following problems in actual production:
in the process of carrying and packaging a group of chips, on one hand, the auxiliary chip carrying device can carry out the carrying task of two chips only by reciprocating the vacuum suction head twice, so that the carrying time is long; on the other hand, the packaging suction head needs to package the chips one by one to complete the packaging task of a group of two chips, so that the packaging speed is low and the efficiency is low.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-efficiency chip packaging device of a smart card, which can simultaneously carry out the carrying and packaging tasks of two chips, thereby greatly improving the carrying and packaging speed of the whole chip.
The technical scheme for solving the technical problems is as follows:
a chip packaging device of a high-efficiency smart card comprises a card conveying guide rail, a chip belt supply mechanism, a chip blanking mechanism, a chip auxiliary conveying mechanism and a chip packaging conveying mechanism;
wherein, the card conveying guide rail is provided with a chip packaging station; the chip blanking machine is provided with a chip blanking die; the chip auxiliary conveying mechanism comprises a vacuum suction head group for adsorbing chips, a chip temporary storage positioning die and a vacuum suction head group driving mechanism for driving the vacuum suction head group to move, wherein the vacuum suction head group comprises a rotary suction head and a movable suction head, and the chip temporary storage positioning die is arranged between a chip blanking die and a chip packaging station; the chip packaging and carrying mechanism comprises two packaging suction heads and a packaging suction head driving mechanism for driving the two packaging suction heads to move between a chip temporary storage positioning die and a chip packaging station, wherein the relative position between the two packaging suction heads is consistent with the relative position between two chips of the same group of different cards on two adjacent smart cards to be packaged on a card conveying track; the chip temporary storage positioning die is provided with two positioning grooves, the relative positions between the two positioning grooves are consistent with the relative positions between the two packaging suction heads, and the two positioning grooves and the two packaging suction heads are positioned on the same straight line in the horizontal carrying direction.
The invention is characterized in that the vacuum suction head group driving mechanism comprises a first horizontal carrying driving mechanism for driving the vacuum suction head group to horizontally move between the chip blanking die and the chip temporary storage positioning die, a first lifting driving mechanism for driving the vacuum suction head group to vertically move, a clutch driving mechanism for driving the rotary suction heads or the movable suction heads in the vacuum suction head group to move close to or away from each other, and a rotary driving mechanism for driving the rotary suction heads to rotate; the packaging suction head driving mechanism comprises a second horizontal conveying driving mechanism for driving the two packaging suction heads to horizontally move and a second lifting driving mechanism for driving the two packaging suction heads to lift. When the chip packaging device works, under the driving of the driving mechanism, the vacuum suction head group completes the auxiliary carrying task of the chip, and the two packaging suction heads complete the carrying and packaging task of the chip.
Preferably, the first horizontal conveying driving mechanism is composed of a first motor and a first screw rod transmission mechanism, wherein the first motor is connected with a screw rod in the first screw rod transmission mechanism through a coupler, and the vacuum suction head group is arranged on a horizontal moving fixed plate which is connected with a screw rod nut in the first screw rod transmission mechanism. During operation, the first motor drives the screw rod to rotate, and then drives the horizontal movement fixed plate and the rotary suction head and the movable suction head arranged on the horizontal movement fixed plate to perform horizontal movement together, and the die is moved to the die temporary storage positioning die position from the die blanking die, wherein the horizontal conveying driving mechanism formed by the first motor and the first screw rod transmission mechanism has the advantages of large driving force, high driving precision and stable operation.
Preferably, the first lifting driving mechanism is composed of a second motor and an eccentric wheel driving mechanism; the eccentric wheel driving mechanism comprises an eccentric wheel, a connecting piece and a lifting motion fixing plate for fixing the vacuum suction head group, wherein the eccentric wheel is connected with a rotating shaft of a second motor, one end of the connecting piece is rotationally connected with the eccentric wheel, the other end of the connecting piece is rotationally connected with the lifting motion fixing plate, and a lifting motion guide rail pair is further arranged between the vacuum suction head group and the lifting motion fixing plate. During operation, the second motor drives the eccentric wheel to rotate, and then drives the connecting piece connected with the eccentric wheel, the lifting motion fixing plate and the vacuum suction head group positioned on the lifting motion fixing plate to move up and down together, so that the lifting motion of the vacuum suction head is realized. The advantage of setting up like this is that on the one hand, eccentric wheel drive mechanism simple structure, and the functioning speed is fast and easily control, and on the other hand, the eccentric wheel is in the motion in-process, and the distance of vacuum suction head's up-and-down motion is limited in the upper and lower travel distance of eccentric wheel to play spacing effect.
Preferably, the rotary driving mechanism is composed of a third motor and a conveyor belt mechanism arranged on the lifting motion fixing plate, the conveyor belt mechanism comprises a driving belt wheel, a driven belt wheel and a conveyor belt, the driving belt wheel is connected with a rotary shaft of the third motor, and the rotary suction head is connected with the driven belt wheel. During operation, the third motor drives the driving belt wheel to rotate, and then drives the driven belt wheel and the rotary suction head to rotate through the conveyer belt to realize the rotation of the chip on the rotary suction head, wherein, because the rotation angle of the chip is the same as the rotation angle of the third motor, the rotation angle of the chip can be accurately controlled through controlling the rotation angle of the third motor, and therefore, the rotary mechanism formed by the third motor and the conveyer belt mechanism has the advantages of simple driving structure and high driving precision.
Preferably, the clutch driving mechanism comprises a first air cylinder and a sliding guide rail pair, wherein a cylinder body of the first air cylinder is fixed on the lifting motion fixing plate, a telescopic shaft of the first air cylinder is connected with a sliding block of the sliding guide rail pair, and the movable suction head is arranged on the sliding block through a first connecting block. When the rotary suction head is in operation, the telescopic shaft of the first air cylinder moves to drive the sliding block and the movable suction head connected with the sliding block to move, so that the rotary suction head is separated from the rotary suction head. The advantage that sets up like this lies in, realizes adjusting the gesture of chip through rotatory suction head, realizes adjusting the distance of chip through removing the suction head to the division of each suction head is clear and definite, can avoid concentrating the too complicated problem of structure of single suction head that leads to on single suction head with two suction heads, thereby has smooth and easy, the good advantage of harmony of operation in actual operation.
Preferably, the card conveying guide rail is provided with a card positioning device for positioning the smart card to be packaged before packaging, and the card positioning device is arranged on the card conveying guide rail and comprises a positioning claw and a positioning driving mechanism for driving the positioning claw to do lifting and positioning movement. When the intelligent card packaging machine works, the positioning driving mechanism drives the positioning clamping jaw to move downwards to position the card, and the chip packaging task can be completed only when the intelligent card to be packaged is located at the target position, so that the positioning operation of the intelligent card to be packaged before packaging is very important.
Preferably, the two sets of positioning claws are arranged along the direction of the card conveying track, each set of positioning claws comprises two positioning claws arranged along the direction of the long side of the card, the inner side surface of each positioning claw forms a positioning surface, wherein the bottom of the positioning surface is a guiding inclined surface, and the top of the positioning surface is a cylindrical surface. During operation, two intelligent cards in front of and behind can be fixed a position simultaneously to two sets of positioning claws, because the direction inclined plane of two positioning claws constitutes the guiding mouth that reduces gradually from the bottom up opening, therefore the intelligent card enters into and accomplishes the positioning action under the effect of face of cylinder behind this guiding mouth.
Preferably, the positioning driving mechanism is composed of a second cylinder, wherein a telescopic shaft of the second cylinder is connected with the positioning claw through a positioning claw fixing block. When the card positioning device works, the second cylinder telescopic shaft acts to drive the positioning claw fixing block and the positioning claw on the positioning claw fixing block to move up and down together so as to position the card.
Preferably, in the set of positioning claws, one positioning claw is a fixed claw, the fixed claw is fixedly arranged on the positioning claw fixing block, the other positioning claw is a rotating claw, the rotating claw is rotationally connected to the positioning claw fixing block, and an extension spring for promoting the rotating claw to rotate inwards is arranged between the rotating claw and the positioning claw fixing block. During operation, under the effect of extension spring, the initiative claw can promote the card laminating at the medial surface of locating claw to make the location more accurate.
The working principle of the invention is as follows:
during operation, carry out chip auxiliary handling work and chip handling encapsulation work simultaneously, wherein, chip auxiliary handling work is accomplished by chip auxiliary handling mechanism, and chip handling encapsulation work is accomplished by chip handling encapsulation mechanism, specifically:
1. the principle of the auxiliary carrying work of the chip is as follows: the vacuum suction head group carries out chip carrying work according to the order of coring, chip transferring and core placing, and can carry two chips from a chip groove of a chip blanking positioning die to a positioning groove of a chip temporary storage positioning die according to the chip packaging requirement in one carrying, and concretely, the coring operation is as follows: the rotary suction head and the movable suction head which are positioned above the chip blanking positioning die are driven by the vacuum suction head group driving mechanism to downwards move into two chip grooves on the chip blanking positioning die, then the chips are adsorbed in a negative pressure adsorption mode, and finally the two chips are taken out by upwards moving. The operation of chip transfer is as follows: under the drive of a vacuum suction head group driving mechanism, the rotary suction head and the movable suction head horizontally move from the upper part of the chip blanking positioning die to the chip temporary storage positioning die, and in the horizontal movement process, on one hand, the chip positioned on the rotary suction head rotates 180 degrees, and the posture of the chip positioned on the movable suction head is unchanged, so that the directions of the two chips are 180 degrees different, and the requirement on the posture of the chip in packaging is met; on the other hand, the rotary suction head and the movable suction head move away from each other, so that the relative positions of the two chips on the rotary suction head and the movable suction head are consistent with the relative positions of the two positioning grooves on the chip temporary storage positioning die and are positioned on the same horizontal line (the specific mutual moving away motion can be that the rotary suction head is not moved, the movable suction head moves away from the rotary suction head, the rotary suction head and one of the positioning grooves are always consistent in the longitudinal direction in the horizontal plane in the direction perpendicular to the horizontal motion, or the movable suction head is not moved, and the rotary suction head moves away from the movable suction head, and the movable suction head and one of the positioning grooves are always consistent in the longitudinal direction in the case). The core placing operation is as follows: after the chip is carried to the upper part of the chip temporary storage positioning die by the vacuum suction head group, the vacuum suction head group firstly moves downwards to carry two chips to two chip grooves on the chip blanking positioning die under the driving of the vacuum suction head group driving mechanism, and then the vacuum suction head group loses negative pressure, so that the chips fall into the two chip grooves under the action of gravity. After the core placing task is completed, the vacuum suction head group returns to the initial position to carry out auxiliary carrying work of the next group of chips.
2. The chip carrying and packaging working principle is as follows: during packaging, according to the different numbers of chips on the smart card to be packaged, the smart card is divided into single-chip packaging, double-chip packaging and four-chip packaging, and specifically:
a) The principle of the double chip package is as follows: referring to fig. 1, among the adjacent three smart cards (1) (2) (3), a chip a and a chip B are two chips of a group of different cards and a group of chips C are two chips of a group of different cards and a group of different cards. Because the relative position between the two positioning grooves on the chip temporary storage positioning die and the relative position between the two packaging suction heads are kept consistent and are positioned on the same horizontal carrying line, the two packaging suction heads can absorb two chips in the chip temporary storage positioning grooves at the same time; because the relative position between two encapsulation suction heads keeps consistent with the relative position between two chips of different cards in the same group, when two chip grooves of two different cards in the same group on a card conveying track move to be positioned on the same horizontal conveying line with the two encapsulation suction heads, the two encapsulation suction heads can simultaneously place two chips sucked from a chip temporary storage positioning groove in the two chip grooves and encapsulate the two chips, thereby realizing the conveying and encapsulation tasks of the two chips simultaneously. After packaging is completed, the two packaging suction heads return to the chip temporary storage positioning die to prepare for carrying and packaging the next group of chips, and meanwhile, the intelligent card located on the card conveying track integrally moves forward by a distance of one card (namely, a step distance) so that the next group of different cards to be packaged moves to the same line with the two packaging suction heads in the horizontal carrying direction with the two chip grooves of the same group, and the next group of different cards are prepared for packaging the two chips of the same group.
b) The principle of the single chip package is as follows: referring to fig. 2 and 3, among the adjacent four smart cards (1) (2) (3) (4), the smart cards (1) and (3) are rotated 180 degrees, the rotated chip a and the rotated chip a form a group of two chips of the same group of different cards, the chip B and the chip B form a group of two chips of the same group of different cards, and the relative positions between the two chips of the same group of different cards are consistent with the relative positions between the two packaging suckers. During operation, two encapsulation suction heads can be simultaneously from the chip absorption two chips in the constant head tank of keeping in, then carry it simultaneously to two chip grooves of different card same group that comprises two adjacent single core smart cards carry out the chip encapsulation task to once can accomplish the chip transport encapsulation task of two smart cards. The 180-degree rotation of the smart card is completed by a related turnover mechanism positioned on the card conveying track, after one packaging task is completed, all the single-core smart cards positioned on the card conveying track move forward by the distance of two cards (namely, two steps), so that the next group of different cards to be packaged move to the same group of two chip slots on the same line with the two packaging suction heads in the horizontal conveying direction, and the packaging task of the next group of different cards and the same group of two chips is prepared.
c) The principle of the four-chip package is as follows: referring to fig. 4, among the adjacent three smart cards (1) (2) (3), the chip a and the chip C are two chips of a group of different cards and the same group, the chip b and the chip D are two chips of a group of different cards and the same group, the chip C and the chip E are two chips of a group of different cards and the same group, and the chip D and the chip F are two chips of a group of different cards and the same group. When the chip packaging device works, two packaging suction heads firstly carry out a group of chip carrying packaging tasks of the same group of different cards, then carry out another group of chip carrying packaging tasks of the same group of different cards, so that a round of packaging task is completed, then four chip intelligent cards on a card conveying track integrally move forward by a distance of one card (namely, a step distance), so that the next group of different cards to be packaged move to the same line with the two packaging suction heads in the horizontal conveying direction with two chip grooves of the same group, and the next group of different cards are ready for carrying out the packaging tasks of the same group of chips.
Like this, through the supplementary transport work of chip and the mutual cooperation of chip transport encapsulation, can carry out the supplementary transport and the transport encapsulation work of two chips simultaneously to make encapsulation efficiency improve greatly.
Compared with the prior art, the invention has the following beneficial effects:
1. the high-efficiency chip packaging device of the intelligent card can simultaneously carry out auxiliary carrying and packaging work of two chips, and compared with the prior art that only one chip can be carried at a time in an auxiliary carrying and packaging work of one chip, the packaging efficiency is greatly improved.
2. The high-efficiency chip packaging device of the smart card not only can carry out the carrying packaging task of the single-chip smart card, but also can carry out the chip packaging tasks of the double-chip smart card and the four-chip smart card, so that the high-efficiency chip packaging device of the smart card has wide application range and strong universality.
The chip packaging device of the high-efficiency smart card can not only adjust the posture of the chip in the process of carrying the chip in an auxiliary manner, but also adjust the distance between the two chips, and the posture and the distance are adjusted in the process of horizontally moving the vacuum suction head group without occupying additional adjustment time, so that the auxiliary carrying efficiency is high and the time consumption is low.
Drawings
Fig. 1 is a schematic perspective view of a chip packaging apparatus for a high-efficiency smart card according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view of the auxiliary chip handling mechanism in fig. 1.
Fig. 3 is a schematic perspective view of the driving mechanism of the vacuum head set in fig. 1.
Fig. 4 is a view showing an operation state of the vacuum head set when carrying chips.
Fig. 5 is a schematic perspective view of the chip package handling mechanism in fig. 1.
Fig. 6 is a schematic perspective view of the encapsulated suction head and the second lift drive mechanism of fig. 1.
Fig. 7 is a schematic perspective view of the card positioning device in fig. 1.
Fig. 8 is a schematic diagram of the relative positional relationship of the four-core smart card with two positioning slots in fig. 7, in which the Aa group is packaged first, and then the Bb group is packaged.
Fig. 9 is a schematic diagram of the structure of a dual-core smart card (the arrow in the figure indicates the direction of movement on the card transport rail).
Fig. 10 is a schematic structural diagram of a single-core smart card.
Fig. 11 is a schematic structural diagram of a four-core smart card.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but embodiments of the present invention are not limited thereto.
Referring to fig. 1, a chip packaging device of a high-efficiency smart card of the present invention includes a card conveying rail 1, a chip tape supply mechanism 2, a chip blanking mechanism 3, a chip auxiliary carrying mechanism 4, and a chip packaging carrying mechanism 5;
referring to fig. 1-7, a chip packaging station is arranged on the card conveying guide rail 1; the chip blanking mechanism 3 is provided with a chip blanking die 3-1; the chip auxiliary carrying mechanism 4 comprises a vacuum suction head group 4-1 for adsorbing chips, a chip temporary storage positioning die 4-2 and a vacuum suction head group driving mechanism for driving the vacuum suction head group 4-1 to move, wherein the vacuum suction head group 4-1 comprises a rotary suction head 4-11 and a movable suction head 4-12, and the chip temporary storage positioning die 4-2 is arranged between a chip blanking die 3-1 and a chip packaging station; the chip packaging and carrying mechanism 5 comprises two packaging suction heads 5-1 and a packaging suction head driving mechanism for driving the two packaging suction heads 5-1 to move between a chip temporary storage positioning die 4-2 and a chip packaging station, wherein the relative position between the two packaging suction heads 5-1 is consistent with the relative position between two chips of the same group of different cards on two adjacent smart cards to be packaged on a card conveying track; the chip temporary storage positioning die 4-2 is provided with two positioning grooves 4-21, the relative positions of the two positioning grooves 4-21 and the two packaging suction heads 5-1 are consistent, and the two positioning grooves 4-21 and the two packaging suction heads 5-1 are positioned on the same straight line in the horizontal carrying direction.
Referring to fig. 2-4, the vacuum suction head group driving mechanism comprises a first horizontal carrying driving mechanism 4-3 for driving the vacuum suction head group 4-1 to horizontally move between the chip blanking die 3-1 and the chip temporary storage positioning die 4-2, a first lifting driving mechanism 4-4 for driving the vacuum suction head group 4-1 to vertically move, a longitudinal driving mechanism 4-7 for driving the vacuum suction head group 4-1 to move along the direction of the card conveying guide rail, a clutch driving mechanism 4-5 for driving the rotary suction heads 4-11 or the movable suction heads 4-12 in the vacuum suction head group 4-1 to move close to or far from each other, and a rotary driving mechanism 4-6 for driving the rotary suction heads 4-11 to rotate; the packaging suction head driving mechanism comprises a second horizontal conveying driving mechanism 5-2 for driving the two packaging suction heads 5-1 to horizontally move and a second lifting driving mechanism 5-3 for driving the two packaging suction heads 5-1 to lift. When the chip packaging device works, under the driving of the driving mechanism, the vacuum suction head group 4-1 completes the auxiliary carrying task of the chip, and the two packaging suction heads 5-1 complete the carrying and packaging task of the chip.
Referring to fig. 2-4, the first horizontal conveyance driving mechanism 4-3 is composed of a first motor 4-31 and a first screw transmission mechanism, wherein the first motor 4-31 is connected with a screw 4-32 in the first screw transmission mechanism through a coupling, the vacuum suction head group 4-1 is arranged on a horizontal movement fixing plate 4-33, and the horizontal movement fixing plate 4-33 is connected with a screw 4-32 nut in the first screw transmission mechanism. When the chip temporary storage positioning die 4-2 is in operation, the first motor 4-31 drives the screw rod 4-32 to rotate, and then drives the horizontal movement fixing plate 4-33 and the rotary suction head 4-11 arranged on the horizontal movement fixing plate 4-33 to move horizontally together with the movement suction head 4-12, and the chip blanking die 3-1 moves to the chip temporary storage positioning die 4-2, wherein the horizontal transport driving mechanism formed by the first motor 4-31 and the first screw rod transmission mechanism has the advantages of large driving force, high driving precision and stable operation.
Referring to fig. 2-4, the first lifting driving mechanism 4-4 is composed of a second motor 4-41 and an eccentric wheel 4-42 driving mechanism; the eccentric wheel 4-42 driving mechanism comprises an eccentric wheel 4-42, a connecting piece 4-43 and a lifting motion fixing plate 4-44 for fixing the vacuum suction head set 4-1, wherein the eccentric wheel 4-42 is connected with a rotating shaft of the second motor 4-41, one end of the connecting piece 4-43 is rotationally connected with the eccentric wheel 4-42, the other end of the connecting piece 4-43 is rotationally connected with the lifting motion fixing plate 4-44, and a lifting motion guide rail pair is further arranged between the vacuum suction head set 4-1 and the lifting motion fixing plate 4-44. When the vacuum suction head lifting device works, the second motor 4-41 drives the eccentric wheel 4-42 to rotate, and then drives the connecting piece 4-43 connected with the eccentric wheel 4-42, the lifting motion fixing plate 4-44 and the vacuum suction head group 4-1 positioned on the lifting motion fixing plate 4-44 to move up and down together, so that the vacuum suction head lifting motion is realized. The device has the advantages that on one hand, the transmission mechanism of the eccentric wheel 4-42 is simple in structure, high in running speed and easy to control, and on the other hand, the vertical movement distance of the vacuum suction head is limited within the vertical movement distance of the eccentric wheel 4-42 in the movement process of the eccentric wheel 4-42, so that the limiting effect is achieved.
Referring to fig. 2 to 4, the rotary driving mechanism 4-6 is composed of a third motor 4-61 provided on the elevating movement fixing plate 4-44 and a belt mechanism 4-62 including a driving pulley, a driven pulley, and a belt, wherein the driving pulley is connected with a rotation shaft of the third motor 4-61, and the rotary suction head 4-11 is connected with the driven pulley. During operation, the third motor 4-61 drives the driving belt wheel to rotate, and then the driving belt wheel and the rotary suction head 4-11 are driven by the conveyor belt to rotate to realize the rotation of the chip on the rotary suction head 4-11, wherein the rotation angle of the chip is identical to that of the third motor 4-61, and the rotation angle of the chip can be accurately controlled by controlling the rotation angle of the third motor 4-61, so that the rotary mechanism formed by the third motor 4-61 and the conveyor belt mechanism 4-62 has the advantages of simple driving structure and high driving precision.
Referring to fig. 2-4, the clutch driving mechanism 4-5 comprises a first cylinder 4-51 and a sliding guide rail pair, wherein a cylinder body of the first cylinder 4-51 is fixed on the lifting motion fixing plate 4-44, a telescopic shaft of the first cylinder 4-51 is connected with a sliding block of the sliding guide rail pair, and the movable suction head 4-12 is arranged on the sliding block through a first connecting block. When the rotary suction head works, the telescopic shaft of the first air cylinder 4-51 moves to drive the sliding block and the movable suction head 4-12 connected with the sliding block to move, so that the rotary suction head 4-11 is separated. The advantage of setting like this lies in that through rotatory suction head 4-11 realization to the gesture of chip is adjusted, realizes adjusting the distance of chip through removing suction head 4-12 to the division of work of each suction head is clear, can avoid concentrating the too complicated problem of structure of single suction head that leads to on single suction head with two suction heads, thereby has smooth and easy, the good advantage of harmony of operation in actual work.
Referring to fig. 6 and 7, the card conveying guide rail 1 is provided with a card positioning device 6 for positioning the smart card to be packaged before packaging, and the card positioning device 6 is arranged on the card conveying guide rail 1 and comprises a positioning claw 6-1 and a positioning driving mechanism for driving the positioning claw 6-1 to perform lifting positioning movement. When the smart card packaging device works, the positioning driving mechanism drives the positioning claw 6-1 to move downwards to position the smart card, and the packaging suction head 5-1 can complete a chip packaging task only when the smart card to be packaged is located at a target position, so that the positioning operation of the smart card to be packaged before packaging is very important.
Referring to fig. 6 and 7, the positioning claws 6-1 are two groups, the two groups of positioning claws 6-1 are arranged along the direction of the card conveying track, each group of positioning claws 6-1 comprises two positioning claws arranged along the direction of the long side of the card, the inner side surface of each positioning claw forms a positioning surface, wherein the bottom of the positioning surface is a guiding inclined surface, and the top of the positioning surface is a cylindrical surface. When the intelligent card positioning device works, two groups of positioning claws 6-1 can simultaneously position two intelligent cards in front of each other, and as the guiding inclined planes of the two positioning claws form a guiding opening with gradually reduced openings from bottom to top, the intelligent cards enter the guiding opening and then complete the positioning function under the action of the cylindrical surface.
Referring to fig. 6 and 7, the positioning driving mechanism is composed of a second cylinder, wherein a telescopic shaft of the second cylinder is connected with the positioning claw through a positioning claw fixing block. When the card positioning device works, the second cylinder telescopic shaft acts to drive the positioning claw fixing block and the positioning claw on the positioning claw fixing block to move up and down together so as to position the card.
Referring to fig. 6 and 7, in the set of positioning claws 6-1, one positioning claw is a fixed claw 6-11, the fixed claw 6-11 is fixedly arranged on the fixed claw block, the other positioning claw is a rotating claw 6-12, the rotating claw 6-12 is rotatably connected on the fixed claw block, and an extension spring for promoting the rotating claw 6-12 to rotate inwards is arranged between the rotating claw 6-12 and the fixed claw block. During operation, under the effect of extension spring, the initiative claw can promote the card laminating at the medial surface of locating claw to make the location more accurate.
Referring to fig. 1 to 11, the working principle of the invention is: during operation, the chip handling assisting work and the chip handling packaging work are simultaneously carried out, wherein the chip handling assisting work is completed by the chip handling assisting mechanism 4, the chip handling packaging work is completed by the chip handling packaging mechanism, and specifically:
1. the principle of the auxiliary carrying work of the chip is as follows: the vacuum suction head group 4-1 carries out chip carrying work according to the order of coring, chip transferring and core placing, and can carry two chips from a chip slot of a chip blanking positioning die to a positioning slot 4-21 of a chip temporary storage positioning die 4-2 according to the chip packaging requirement in one carrying, specifically, the coring operation is as follows: the rotary suction head 4-11 and the movable suction head 4-12 which are positioned above the chip blanking positioning die are driven by the vacuum suction head group driving mechanism to downwards move into two chip grooves on the chip blanking positioning die, then the chips are adsorbed in a negative pressure adsorption mode, and finally the two chips are taken out by upwards movement. The operation of chip transfer is as follows: under the drive of a vacuum suction head group driving mechanism, the rotary suction head 4-11 and the movable suction head 4-12 horizontally move from the upper part of a chip blanking positioning die to the chip temporary storage positioning die 4-2, and on one hand, the chip positioned on the rotary suction head 4-11 rotates 180 degrees and the chip positioned on the movable suction head 4-12 is unchanged in the posture, so that the directions of the two chips are different by 180 degrees, and the requirement on the chip posture during packaging is met; on the other hand, the rotary suction head 4-11 and the movable suction head 4-12 are moved away from each other so that the relative positions of the two chips on the rotary suction head 4-11 and the movable suction head 4-12 are kept identical to the relative positions of the two positioning grooves 4-21 on the chip temporary storage positioning die 4-2 and are on the same horizontal line (the specific mutual moving away motion may be that the rotary suction head 4-11 is stationary, the movable suction head 4-12 is moved away from the rotary suction head 4-11, in which case the rotary suction head 4-11 is kept identical to one of the positioning grooves 4-21 in the longitudinal direction, which means that the horizontal plane is always identical to the horizontal motion, or that the movable suction head 4-12 is stationary, and the rotary suction head 4-11 is moved away from the movable suction head 4-12, in which case the movable suction head 4-12 is always identical to one of the positioning grooves 4-21 in the longitudinal direction). The core placing operation is as follows: after the vacuum suction head group 4-1 conveys the chips to the upper part of the chip temporary storage positioning die 4-2, the vacuum suction head group 4-1 firstly moves downwards to convey the two chips to two chip grooves on the chip blanking positioning die under the drive of the vacuum suction head group driving mechanism, and then the vacuum suction head group loses negative pressure, and the chips fall into the two chip grooves under the action of gravity. After the core placing task is completed, the vacuum suction head group 4-1 returns to the initial position to carry out auxiliary carrying work of the next group of chips.
2. The chip carrying and packaging working principle is as follows: during packaging, according to the different numbers of chips on the smart card to be packaged, the smart card is divided into single-chip packaging, double-chip packaging and four-chip packaging, and specifically:
a) The principle of the double chip package is as follows: referring to fig. 8 and 9, among the adjacent three smart cards (1) (2) (3), the chip a and the chip B are two chips of the same group of a group of different cards, and the chip B and the chip C are two chips of the same group of a group of different cards. Because the relative positions between the two positioning grooves 4-21 on the chip temporary storage positioning die 4-2 and the relative positions between the two packaging suction heads 5-1 are kept consistent and are positioned on the same horizontal carrying line, the two packaging suction heads 5-1 can absorb two chips in the chip temporary storage positioning grooves 4-21 at the same time; because the relative position between the two packaging suction heads 5-1 is consistent with the relative position between the two chips in the same group of different cards, when the two chip grooves in the same group of the two different cards on the card conveying track move to be on the same horizontal conveying line with the two packaging suction heads 5-1, the two packaging suction heads 5-1 can simultaneously place the two chips sucked from the chip temporary storage positioning groove 4-21 in the two chip grooves to package the two chips, so that the conveying and packaging tasks of the two chips are simultaneously realized. After packaging is completed, the two packaging suction heads 5-1 return to the chip temporary storage positioning die 4-2 to prepare for carrying and packaging the next group of chips, and meanwhile, the intelligent card located on the card conveying track integrally moves forward by the distance of one card (namely, a step distance), so that the next group of different cards to be packaged moves to the same group of two chip slots on the same straight line with the two packaging suction heads 5-1 in the horizontal carrying direction, and the next group of different cards and the same group of two chips are prepared for carrying out the packaging task of the next group of different cards.
b) The principle of the single chip package is as follows: referring to fig. 8 and 10, among the adjacent four smart cards (1) (2) (3) (4), the smart cards (1) and (3) are rotated 180 degrees, the rotated chip a and chip a form a group of two chips of the same group of different cards, the chip B and chip B form a group of two chips of the same group of different cards, and the relative position between the two chips of the same group of different cards is identical to the relative position between the two package suction heads 5-1. When the chip packaging device works, the two packaging suction heads 5-1 can absorb two chips from the chip temporary storage positioning groove 4-21 at the same time, and then simultaneously carry the chips into two chip grooves of the same group of different cards formed by two adjacent single-core smart cards to carry out chip packaging tasks, so that the chip carrying packaging tasks of the two smart cards can be completed at one time. The 180-degree rotation of the smart card is completed by the related turnover mechanism positioned on the card conveying track, after one packaging task is completed, all the single-core smart cards positioned on the card conveying track move forward by the distance of two cards (namely, two steps), so that the next group of different cards to be packaged move to the same group of two chip slots on the same line with the two packaging suction heads 5-1 in the horizontal conveying direction, and the packaging task of the next group of different cards and the same group of two chips is ready to be performed.
c) The principle of the four-chip package is as follows: referring to fig. 8 and 11, among the adjacent three smart cards (1) (2) (3), the chip a and the chip C are two chips of a group of different cards and a group of different cards, the chip b and the chip D are two chips of a group of different cards and a group of different cards, the chip C and the chip E are two chips of a group of different cards and a group of different cards, and the chip D and the chip F are two chips of a group of different cards and a group of different cards. When the chip packaging machine works, the two packaging suction heads 5-1 firstly carry out a group of different cards with the same group of chip carrying packaging tasks, then carry out another group of different cards with the same group of chip carrying packaging tasks, so that a round of packaging tasks are completed, then, four chip smart cards on the card conveying track integrally move forwards by one card distance (namely, one step distance), so that the next group of different cards to be packaged with the same group of two chip slots move to be in the same straight line with the two packaging suction heads 5-1 in the horizontal conveying direction, and the next group of different cards with the same group of chips are ready to carry out packaging tasks.
Like this, through the supplementary transport work of chip and the mutual cooperation of chip transport encapsulation, can carry out the supplementary transport and the transport encapsulation work of two chips simultaneously to make encapsulation efficiency improve greatly.
The foregoing is illustrative of the present invention and is not to be construed as limiting thereof, but rather as various changes, modifications, substitutions, combinations, and simplifications which may be made therein without departing from the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (7)
1. The chip packaging device of the high-efficiency intelligent card comprises a card conveying guide rail, a chip belt supply mechanism, a chip blanking mechanism, an auxiliary chip carrying mechanism and a chip packaging carrying mechanism, and is characterized in that a chip packaging station is arranged on the card conveying guide rail, a chip blanking die is arranged on the chip blanking machine, and the auxiliary chip carrying mechanism comprises a vacuum suction head group for adsorbing chips, a chip temporary storage positioning die and a vacuum suction head group driving mechanism for driving the vacuum suction head group to move; the chip packaging and carrying mechanism comprises two packaging suction heads and a packaging suction head driving mechanism for driving the two packaging suction heads to move between the chip temporary storage and positioning die and the chip packaging station, wherein the relative position between the two packaging suction heads is consistent with the relative position between two chips of the same group of different cards on two adjacent smart cards to be packaged on a card conveying track; the chip temporary storage positioning die is provided with two positioning grooves, the relative positions of the two positioning grooves are consistent with the relative positions of the two packaging suction heads, and the two positioning grooves and the two packaging suction heads are positioned on the same straight line in the horizontal carrying direction;
the vacuum suction head group driving mechanism comprises a first horizontal carrying driving mechanism for driving the vacuum suction head group to horizontally move between the chip blanking die and the chip temporary storage positioning die, a first lifting driving mechanism for driving the vacuum suction head group to vertically move, a clutch driving mechanism for driving the rotary suction heads or the movable suction heads in the vacuum suction head group to mutually move close to or far away from each other, and a rotary driving mechanism for driving the rotary suction heads to rotationally move; the packaging suction head driving mechanism comprises a second horizontal conveying driving mechanism for driving the two packaging suction heads to horizontally move and a second lifting driving mechanism for driving the two packaging suction heads to lift;
the first horizontal conveying driving mechanism consists of a first motor and a first screw rod transmission mechanism, wherein the first motor is connected with a screw rod in the first screw rod transmission mechanism through a coupler, the vacuum suction head group is arranged on a horizontal moving fixed plate, and the horizontal moving fixed plate is connected with a screw rod nut in the first screw rod transmission mechanism;
the card conveying guide rail is provided with a card positioning device for positioning the smart card to be packaged before packaging, and the card positioning device is arranged on the card conveying guide rail and comprises a positioning claw and a positioning driving mechanism for driving the positioning claw to do lifting and positioning movement.
2. The efficient smart card chip packaging apparatus as recited in claim 1 wherein said first lift drive mechanism is comprised of a second motor and an eccentric drive mechanism; the eccentric wheel driving mechanism comprises an eccentric wheel, a connecting piece and a lifting motion fixing plate for fixing the vacuum suction head group, wherein the eccentric wheel is connected with a rotating shaft of a second motor, one end of the connecting piece is rotationally connected with the eccentric wheel, the other end of the connecting piece is rotationally connected with the lifting motion fixing plate, and a lifting motion guide rail pair is further arranged between the vacuum suction head group and the lifting motion fixing plate.
3. The efficient smart card chip packaging apparatus of claim 2, wherein the rotary driving mechanism is composed of a third motor and a belt mechanism provided on the elevating motion fixing plate, the belt mechanism including a driving pulley, a driven pulley, and a belt, wherein the driving pulley is connected with a rotation shaft of the third motor, and the rotary suction head is connected with the driven pulley.
4. A chip packaging apparatus for a high-efficiency smart card according to claim 1 or 3, wherein the clutch driving mechanism comprises a first cylinder and a sliding guide rail pair, wherein a cylinder body of the first cylinder is fixed on a lifting motion fixing plate, a telescopic shaft of the first cylinder is connected with a sliding block of the sliding guide rail pair, and the movable suction head is arranged on the sliding block through a first connecting block.
5. The efficient smart card chip packaging apparatus of claim 1, wherein the positioning claws are arranged in two groups, the two groups of positioning claws are arranged along the direction of the card conveying track, each group of positioning claws comprises two positioning claws, the two positioning claws are arranged along the long side direction of the card, the inner side surface of each positioning claw forms a positioning surface, wherein the bottom of the positioning surface is a guiding inclined surface, and the top of the positioning surface is a cylindrical surface.
6. The efficient smart card chip packaging apparatus as recited in claim 5, wherein the positioning drive mechanism is formed by a second cylinder, and wherein a telescopic shaft of the second cylinder is connected to the positioning pawl through a positioning pawl fixing block.
7. The chip packaging apparatus of claim 6, wherein one of the two positioning claws of the set of positioning claws is a fixed claw which is fixedly provided on the positioning claw fixing block, the other positioning claw is a rotating claw which is rotatably connected to the positioning claw fixing block, and an extension spring for urging the rotating claw to rotate toward one side of the fixed claw is provided between the rotating claw and the positioning claw fixing block.
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| CN201810282331.7A CN108346602B (en) | 2018-03-31 | 2018-03-31 | Efficient chip packaging device for smart card |
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| CN201810282331.7A CN108346602B (en) | 2018-03-31 | 2018-03-31 | Efficient chip packaging device for smart card |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109509719B (en) * | 2018-12-27 | 2023-11-10 | 东莞市锐祥智能卡科技有限公司 | Card slot back glue machine |
| CN110211938B (en) * | 2019-06-24 | 2020-07-24 | 深圳市财富云端信息技术有限公司 | Chip packaging device based on information technology control |
| CN112103211B (en) * | 2020-08-21 | 2024-03-12 | 大连佳峰自动化股份有限公司 | Multi-head chip picking and binding mechanism |
| CN114505326B (en) * | 2022-01-06 | 2023-07-21 | 广州巽文智能科技有限公司 | Intelligent card chip recycling equipment |
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| CN2687855Y (en) * | 2003-12-12 | 2005-03-23 | 超源精密电子设备(东莞)有限公司 | Cell Stacking Machine |
| CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
| CN201725785U (en) * | 2010-03-31 | 2011-01-26 | 深圳市大族激光科技股份有限公司 | Chip picking and placing device |
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| CN2687855Y (en) * | 2003-12-12 | 2005-03-23 | 超源精密电子设备(东莞)有限公司 | Cell Stacking Machine |
| CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
| CN201725785U (en) * | 2010-03-31 | 2011-01-26 | 深圳市大族激光科技股份有限公司 | Chip picking and placing device |
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