CN108344521A - A kind of transient heat flow sensor - Google Patents
A kind of transient heat flow sensor Download PDFInfo
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- CN108344521A CN108344521A CN201810210225.8A CN201810210225A CN108344521A CN 108344521 A CN108344521 A CN 108344521A CN 201810210225 A CN201810210225 A CN 201810210225A CN 108344521 A CN108344521 A CN 108344521A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 62
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- 239000002470 thermal conductor Substances 0.000 claims abstract description 57
- 239000000523 sample Substances 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 13
- 239000010946 fine silver Substances 0.000 claims abstract description 10
- 238000005266 casting Methods 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 239000010445 mica Substances 0.000 claims description 7
- 229910052618 mica group Inorganic materials 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 23
- 230000004044 response Effects 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000003908 quality control method Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 8
- 238000004088 simulation Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000010006 flight Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
- G01K7/06—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials the thermoelectric materials being arranged one within the other with the junction at one end exposed to the object, e.g. sheathed type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
- G01K13/024—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving gases
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a kind of transient heat flow sensors, including：Calorimetric probe case body and heat flow transducer ontology, heat flow transducer ontology include：Oxygen-free copper thermal conductor, center are provided with receiving opening；And receiving opening increases close to its internal diameter of the position of oxygen-free copper thermal conductor front end；Oxygen-free copper thermal conductor is connected to by mounting flange structure in calorimetric probe case body；Dew type armoured thermocouple is held, is fixed in the receiving opening of oxygen-free copper thermal conductor, and holds the temperature measuring point of dew type armoured thermocouple to be in the center of oxygen-free copper thermal conductor receiving opening and the outlet port of its head distance receiving opening to have certain distance；Fine silver plunger is connected to the outlet port of oxygen-free copper thermal conductor receiving opening by way of casting or melting welding, and forms one with the head of end dew type armoured thermocouple；The new structural transient heat flow sensor simple, quality control easy to implement with processing and assembly technology is conducive to improve sensor thermal response speed and testing precision.
Description
Technical field
The invention belongs to ground solar heat protection experimental technique fields, and in particular to a kind of new structural transient heat flow sensor.
Background technology
Hypersonic aircraft can form height in endoatmosphere flight, with surrounding air interaction in aircraft surface
Warm boundary layer applies huge aerothermal load to the structure of aircraft, material, seriously affects structure safety and the longevity of aircraft
Life.In order to which Effective selection, assessment and identification aircraft heat insulation material and the anti-thermal characteristics of structure, arc tunnel and electro-arc heater are normal
As important Aerodynamic Heating and thermal protection ground simulation test platform, tens MW/m of simulation are generally required2Superelevation hot-fluid it is pneumatic
Heating environment.Transient heat flow measurement method is mainly based upon the Duhamel theoretical methods of surface temperature in the anti-heat test in ground.But
It is direct that sensor hull-skin temperature thermocouple in electric arc flow field is washed away in the anti-heat test superhigh temperature of hypersonic ground simulation, height
Test is often very difficult.Therefore it is usually used in the transient heat flow sensor of the impulse wind tunnel experimental test of millisecond magnitude
(such as film heat flux sensor and coaxial thermocouple) cannot be satisfied arc tunnel and electro-arc heater transient heat flow testing requirement.Often
The zero calorimeter measured for transient heat flow obtains Semi-infinite One-dimensional body thermal conductor indirectly using inner cavity " zero " position temperature
Front surface Temperature-time data, and thus calculate front surface input hot-fluid.But exist following difficult：1) due to inner cavity aperture
It is more than 10 less than 1mm, draw ratio and is blind hole, therefore mechanical processing difficulty is big, it is difficult to meets the processing of intracavity bottom geometric dimension
Required precision；2) in order to realize that transient heat flow is tested, the oxygen-free copper (fine copper) of high thermal conductivity coefficient is usually used to be used as thermal-flow sensor
Device thermal conductor, but it is difficult directly to carry out metallurgical thawing Welding Problems in cavity bottom that can bring thermal cross.Therefore, frequently with
Solder paste welding manner, but there are larger thermal contact resistance and soldering places deviation are big.The above problem directly results in zero amount
Heat meter processing quality is difficult to control, and the response time is slow and test error is big (even up to 20%), influences it and effectively applies.This
Invention is directed to the above situation, it is proposed that a kind of new structural transient heat flow sensor.
Invention content
It is excellent it is an object of the invention to solve at least the above and/or defect, and provide at least to will be described later
Point.
The purpose of the present invention is to provide a kind of new structural transient heat flow sensors, and it is suitable for hypersonic flights
High hot-fluid instantaneous measurement under the experimental conditions such as the anti-heat test of device ground simulation.
In order to realize these purposes and other advantages according to the present invention, a kind of transient heat flow sensor is provided, including：
Calorimetric probe case body, it is internal that there is accommodating chamber；The head of the calorimetric probe case body is provided with and accommodates
The receiving channel of chamber connection；
Heat flow transducer ontology is arranged in accommodating chamber, and the heat flow transducer ontology includes：
Oxygen-free copper thermal conductor, front end are arranged in receiving channel, and the center of the oxygen-free copper thermal conductor is provided with appearance
Receive through-hole；And the receiving opening increases close to its internal diameter of the position of oxygen-free copper thermal conductor front end；The oxygen-free copper thermal conductor is logical
The mounting flange structure being arranged thereon is crossed to be detachably connected in the accommodating chamber of calorimetric probe case body；
Dew type armoured thermocouple is held, being fixed on oxygen-free copper by the installation jackscrew for being arranged in oxygen-free copper thermal conductor end passes
In the receiving opening of hot body, and the temperature measuring point of end dew type armoured thermocouple is made to be in the center of oxygen-free copper thermal conductor receiving opening
Position and there is certain distance in the outlet port of its head distance receiving opening；
Fine silver plunger is arranged by way of casting or melting welding in the outlet port of oxygen-free copper thermal conductor receiving opening,
And it is formed and is connected with the head of end dew type armoured thermocouple.
Preferably, the calorimetric probe case body has circular head design.
Preferably, the oxygen-free copper thermal conductor is the tubular structure of diameter of phi 3mm, overall length 11.7mm, institute
The internal diameter for stating the receiving opening of oxygen-free copper thermal conductor center is Φ 0.68mm；And the receiving opening conducts heat close to oxygen-free copper
The internal diameter of the position of body front end increases to Φ 1mm.
Preferably, the outer diameter of the end dew type armoured thermocouple is Φ 0.5mm；The head of the end dew type armoured thermocouple
Distance of the portion apart from the outlet port of receiving opening is 0.3mm.
Preferably, the part that the end dew type armoured thermocouple is located at oxygen-free copper thermal conductor rear end passes through epoxide-resin glue
It is fixedly connected with the rear end of oxygen-free copper thermal conductor.
Preferably, the mounting flange structure on the oxygen-free copper thermal conductor is detachably connected on by M2 hexagon socket head cap screws
In calorimetric probe case body.
Preferably, between the mounting flange structure of the oxygen-free copper thermal conductor and calorimetric probe case body and six in M2
The mica spacer of 0.3mm thickness is all provided between corner bolt and the mounting flange structure of oxygen-free copper thermal conductor；The mica spacer
Thickness be 0.3mm.
Preferably, oxygen-free copper thermal conductor in receiving channel and calorimetric probe case side are set to having 0.1mm's
The gap magnesia powder of the heat-insulated gap of annular air and front end face is sealed with waterglass mixture.
Preferably, a diameter of Φ 16mm, thickness 3mm of the mounting flange structure.
Preferably, a diameter of Φ 1mm of the fine silver plunger.
The present invention includes at least following advantageous effect：A kind of new structural transient heat flow sensor system of the present invention
Standby technology difficulty reduces, and temperature thermocouple welding procedure is simple, welding position controllability is strong, and mounting flange structure facilitates zero
The installation of calorimeter and will not introduce heat transfer interference；The new structural transient state is all shown by simulation analysis and test result
Heat flow transducer is based on the heat transfer of Semi-infinite One-dimensional body and assumes that calorimetric formula, calorimetric response time are less than 0.03 second (as shown in Figure 2),
Contrast test relative deviation is less than 6% (as shown in table 1), meets transient heat flow testing requirement.
Part is illustrated to embody by further advantage, target and the feature of the present invention by following, and part will also be by this
The research and practice of invention and be understood by the person skilled in the art.
Description of the drawings：
Fig. 1 is the cross-sectional view of transient heat flow sensor of the present invention.
Fig. 2 is transient heat flow sensor calorimetric response time testing result of the present invention.
Specific implementation mode：
Present invention will be described in further detail below with reference to the accompanying drawings, to enable those skilled in the art with reference to specification text
Word can be implemented according to this.
It should be appreciated that such as " having ", "comprising" and " comprising " term used herein do not allot one or more
The presence or addition of a other elements or combinations thereof.
A kind of new structural transient heat flow sensor with calorimetric probe case of the present invention, can be suitable for electric arc wind
Hole and the scanning of Arc-jet test environmental flow heat flux distribution and stationary point hot-fluid transient test.For currently used for transient heat flow
There are processing qualities to be difficult to control for the zero calorimeter of measurement, and the response time is slow and the big problem of test error, the present invention design
Thermal conductor with mounting flange, and propose a kind of armoured thermocouple through-hole installation of tiny dew end and position fixed structure；It gives
Gone out a kind of new casting or welding Joining Technology, fine silver plunger formed in measuring junction outer end, ensure that thermocouple measuring point with
Relative position and connection between thermal conductor is good；The heat-insulated and insulation devised between sensor body and calorimetric probe case is pacified
Gasket is filled, heat transfer and electrical Interference are avoided.The new structural transient heat flow sensor have processing and assembly technology it is simple,
Quality control easy to implement is conducive to improve sensor thermal response speed and testing precision.
Fig. 1 shows a kind of transient heat flow sensor of the present invention, including：Calorimetric probe case body 8, it is internal that there is appearance
Receive chamber 81；The head of the calorimetric probe case body 8 is provided with the receiving channel 82 being connected to accommodating chamber；Heat flow transducer sheet
Body is arranged in accommodating chamber 81, and the heat flow transducer ontology includes：Oxygen-free copper thermal conductor 2, front end setting are logical in receiving
In road 82, the center of the oxygen-free copper thermal conductor 2 is provided with receiving opening 21；And the receiving opening 21 is passed close to oxygen-free copper
Its internal diameter of the position of 2 front end of hot body increases；The oxygen-free copper thermal conductor 2 is detachable by the mounting flange structure 22 being arranged thereon
It is connected in the accommodating chamber 81 of calorimetric probe case body 8；
Dew type armoured thermocouple 5 is held, anaerobic is fixed on by the installation jackscrew 3 for being arranged in 2 end of oxygen-free copper thermal conductor
In the receiving opening 21 of copper thermal conductor 2, and make the temperature measuring point of end dew type armoured thermocouple 5 is in oxygen-free copper thermal conductor and accommodates to lead to
The center in hole 21 and there is certain distance in the outlet port of its head distance receiving opening 21；2 end of the oxygen-free copper thermal conductor
The threaded hole to match with installation jackscrew 3 is provided on end；Fine silver plunger 1 is arranged by way of casting or melting welding in nothing
The outlet port of oxygen copper thermal conductor receiving opening 21, and formed and connected with the head of end dew type armoured thermocouple 5；
In this technical solution, by the way of casting or melting welding, fine silver welding is connect in end dew type armoured thermocouple
On head, formation fine silver plunger is simultaneously integral with the oxygen-free copper thermal conductor welding of surrounding, to ensure that heat carrier has with thermocouple
Good connection, it is ensured that conduct heat between oxygen-free copper thermal conductor and end dew type armoured thermocouple good, hence it is evident that thermal contact resistance is reduced,
It improves thermal response speed and reduces difficulty of processing.
In the above-mentioned technical solutions, the calorimetric probe case body has circular head design；The oxygen-free copper heat transfer
Body is the tubular structure of diameter of phi 3mm, overall length 11.7mm, the receiving opening of oxygen-free copper thermal conductor center
Internal diameter is Φ 0.68mm；And the internal diameter of the receiving opening close to the position of oxygen-free copper thermal conductor front end increases to Φ 1mm with logical
The mode for crossing casting or melting welding forms fine silver plunger.
In the above-mentioned technical solutions, the outer diameter of the end dew type armoured thermocouple is Φ 0.5mm；The end dew type armouring heat
The distance of the outlet port of the head distance receiving opening of galvanic couple is 0.3mm.
In the above-mentioned technical solutions, the end dew type armoured thermocouple 5 is located at the part of 2 rear end of oxygen-free copper thermal conductor and passes through
Epoxide-resin glue 4 is fixedly connected with the rear end of oxygen-free copper thermal conductor 2, in this way, further strengthens end dew type armouring heat
Galvanic couple is connected and fixed with oxygen-free copper thermal conductor.
In the above-mentioned technical solutions, the mounting flange structure on the oxygen-free copper thermal conductor can by M2 hexagon socket head cap screws 6
Dismantling connection is in calorimetric probe case body；A diameter of Φ 16mm, the thickness 3mm of the mounting flange structure, mounting flange
The through-hole of uniformly distributed four diameter of phi 2.2mm matches with M2 hexagon socket head cap screws in structure connect；The peace of the oxygen-free copper thermal conductor
Fill between flange arrangement and calorimetric probe case body and the mounting flange structure of M2 hexagon socket head cap screws and oxygen-free copper thermal conductor it
Between all be provided with 0.3mm thickness insulation mica spacer 7；The thickness of the insulation mica spacer is 0.3mm；Using mica spacer
Mode shields heat transfer and electric signal interference.
In the above-mentioned technical solutions, oxygen-free copper thermal conductor in receiving channel and calorimetric probe case side are set to having
The heat-insulated gap of annular air of 0.1mm, and the gap magnesia powder of front end face is sealed with waterglass mixture.
Fig. 2 shows being transient heat flow sensor calorimetric response time testing result of the present invention, specifically tested
Cheng Wei：Using the heat gun of 600 DEG C of set temperature as convection heat sources；It is equipped between heat gun and transient heat flow sensor
Manual shutter；By quickly opening shutter, realize to transient heat flow sensor step Convective Heating；And transient heat flow is acquired simultaneously
Thermocouple temperature in sensor rises data, and is conducted heat according to Semi-infinite One-dimensional body it is assumed that calculating input hot-fluid.According to the experiment
It is less than 0.03 second as a result, transient heat flow thermal response time of sensor can be evaluated.
In order to analyze the transient heat flow sensor test accuracy and application of the present invention, for three different hot-fluid water
Flat electro-arc heater flow field trystate, uses designed transient heat flow sensor and the plug calorimeter as benchmark respectively
Stationary point hot-fluid contrast test is carried out in same flow field position and identical test state status.As shown in table 1, contrast test result table
It is bright：Designed transient heat flow sensor can be applied to high hot-fluid experimental enviroment, and test relative deviation is less than 6%.
Table 1：Transient heat flow sensor heat flux measurement comparing result of the present invention
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (10)
1. a kind of transient heat flow sensor, which is characterized in that including：
Calorimetric probe case body, it is internal that there is accommodating chamber；The head of the calorimetric probe case body is provided with to be connected with accommodating chamber
Logical receiving channel；
Heat flow transducer ontology is arranged in accommodating chamber, and the heat flow transducer ontology includes：
Oxygen-free copper thermal conductor, front end are arranged in receiving channel, and the center of the oxygen-free copper thermal conductor is provided with receiving and leads to
Hole；And the receiving opening increases close to its internal diameter of the position of oxygen-free copper thermal conductor front end；The oxygen-free copper thermal conductor passes through it
The mounting flange structure of upper setting is detachably connected in the accommodating chamber of calorimetric probe case body；
Dew type armoured thermocouple is held, oxygen-free copper thermal conductor is fixed on by the installation jackscrew for being arranged in oxygen-free copper thermal conductor end
Receiving opening in, and the temperature measuring point of end dew type armoured thermocouple is made to be in the center of oxygen-free copper thermal conductor receiving opening
And there is certain distance in the outlet port of its head distance receiving opening；
Fine silver plunger is arranged by way of casting or melting welding in the outlet port of oxygen-free copper thermal conductor receiving opening, and with
The head of dew type armoured thermocouple is held to form connection.
2. transient heat flow sensor as described in claim 1, which is characterized in that the calorimetric probe case body has rounded nose
Portion's structure.
3. transient heat flow sensor as described in claim 1, which is characterized in that the oxygen-free copper thermal conductor is diameter of phi
The internal diameter of the tubular structure of 3mm, overall length 11.7mm, the receiving opening of oxygen-free copper thermal conductor center is Φ
0.68mm；And the internal diameter of the receiving opening close to the position of oxygen-free copper thermal conductor front end increases to Φ 1mm.
4. transient heat flow sensor as described in claim 1, which is characterized in that the outer diameter of the end dew type armoured thermocouple is
Φ0.5mm；The distance of the outlet port of the head distance receiving opening of the end dew type armoured thermocouple is 0.3mm.
5. transient heat flow sensor as described in claim 1, which is characterized in that the end dew type armoured thermocouple is located at anaerobic
The part of copper thermal conductor rear end is fixedly connected by epoxide-resin glue with the rear end of oxygen-free copper thermal conductor.
6. transient heat flow sensor as described in claim 1, which is characterized in that the mounting flange on the oxygen-free copper thermal conductor
Structure is detachably connected on by M2 hexagon socket head cap screws in calorimetric probe case body.
7. transient heat flow sensor as claimed in claim 6, which is characterized in that the mounting flange knot of the oxygen-free copper thermal conductor
All it is arranged between structure and calorimetric probe case body and between M2 hexagon socket head cap screws and the mounting flange structure of oxygen-free copper thermal conductor
The mica spacer of 0.3mm thickness；The thickness of the mica spacer is 0.3mm.
8. transient heat flow sensor as described in claim 1, which is characterized in that the oxygen-free copper heat transfer being arranged in receiving channel
Body and calorimetric probe case side are to the gap magnesia powder for having the heat-insulated gap of the annular air of 0.1mm and front end face and water glass
Glass mixture seals.
9. transient heat flow sensor as described in claim 1, which is characterized in that a diameter of Φ of the mounting flange structure
16mm, thickness 3mm.
10. transient heat flow sensor as described in claim 1, which is characterized in that a diameter of Φ 1mm of the fine silver plunger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810210225.8A CN108344521B (en) | 2018-03-14 | 2018-03-14 | Transient heat flow sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810210225.8A CN108344521B (en) | 2018-03-14 | 2018-03-14 | Transient heat flow sensor |
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| CN108344521A true CN108344521A (en) | 2018-07-31 |
| CN108344521B CN108344521B (en) | 2024-04-16 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111272314A (en) * | 2020-03-06 | 2020-06-12 | 中国航天空气动力技术研究院 | Simple coaxial calorimeter |
| CN111947882A (en) * | 2020-09-14 | 2020-11-17 | 中国空气动力研究与发展中心超高速空气动力研究所 | Transient heat flow sensor and testing method thereof |
| CN112432719A (en) * | 2020-11-06 | 2021-03-02 | 中国空气动力研究与发展中心超高速空气动力研究所 | Novel thermopile heat flow sensor |
| CN112484952A (en) * | 2020-12-11 | 2021-03-12 | 中国空气动力研究与发展中心超高速空气动力研究所 | Bulb and method for measuring stagnation point heat flow for long time |
| CN112504515A (en) * | 2020-11-11 | 2021-03-16 | 中国科学院合肥物质科学研究院 | Measuring method for heat flux density distribution based on protruding thermocouple |
| CN112548334A (en) * | 2020-12-04 | 2021-03-26 | 中国科学院力学研究所 | Coaxial thermocouple transient heat flow sensor node laser welding conduction device |
| CN113074839A (en) * | 2021-04-01 | 2021-07-06 | 北京强度环境研究所 | Plunger type heat flow sensor with double-thermocouple large heat sink structure |
| CN114264493A (en) * | 2021-12-09 | 2022-04-01 | 中国航天空气动力技术研究院 | A multipurpose water-cooled stagnant point measuring probe for aerodynamic thermal ground simulation test |
| WO2024119825A1 (en) * | 2022-10-20 | 2024-06-13 | 深圳市虎一科技有限公司 | Handheld temperature probe used for food material cooking and fabricating method therefor |
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| CN111272314A (en) * | 2020-03-06 | 2020-06-12 | 中国航天空气动力技术研究院 | Simple coaxial calorimeter |
| CN111947882A (en) * | 2020-09-14 | 2020-11-17 | 中国空气动力研究与发展中心超高速空气动力研究所 | Transient heat flow sensor and testing method thereof |
| CN111947882B (en) * | 2020-09-14 | 2024-03-29 | 中国空气动力研究与发展中心超高速空气动力研究所 | Transient heat flow sensor and test method thereof |
| CN112432719A (en) * | 2020-11-06 | 2021-03-02 | 中国空气动力研究与发展中心超高速空气动力研究所 | Novel thermopile heat flow sensor |
| CN112504515B (en) * | 2020-11-11 | 2022-05-31 | 中国科学院合肥物质科学研究院 | Measuring method for heat flux density distribution based on protruding thermocouple |
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| CN112548334A (en) * | 2020-12-04 | 2021-03-26 | 中国科学院力学研究所 | Coaxial thermocouple transient heat flow sensor node laser welding conduction device |
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| CN112484952A (en) * | 2020-12-11 | 2021-03-12 | 中国空气动力研究与发展中心超高速空气动力研究所 | Bulb and method for measuring stagnation point heat flow for long time |
| CN112484952B (en) * | 2020-12-11 | 2022-04-22 | 中国空气动力研究与发展中心超高速空气动力研究所 | Bulb and method for measuring stagnation point heat flow for long time |
| CN113074839A (en) * | 2021-04-01 | 2021-07-06 | 北京强度环境研究所 | Plunger type heat flow sensor with double-thermocouple large heat sink structure |
| CN114264493A (en) * | 2021-12-09 | 2022-04-01 | 中国航天空气动力技术研究院 | A multipurpose water-cooled stagnant point measuring probe for aerodynamic thermal ground simulation test |
| WO2024119825A1 (en) * | 2022-10-20 | 2024-06-13 | 深圳市虎一科技有限公司 | Handheld temperature probe used for food material cooking and fabricating method therefor |
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