CN108323092B - Liquid cooling head structure with uniform flow path - Google Patents

Abstract

The present invention provides a liquid cooling head structure with a uniform flow path, which includes an upper cover, a body and a bottom plate. The upper cover includes a fluid inlet and a fluid outlet. The body includes an upper surface, a lower surface and a first chamber to a fifth chamber. The first chamber is adjacent to the upper surface and extends along the central line direction, and is connected to the fluid inlet. The second chamber is adjacent to the lower surface and is connected to the first chamber. The third chamber and the fourth chamber pass through the upper surface and the lower surface, and are respectively arranged on two opposite sides of the body, and are mirror-symmetrical with the central line as the symmetry axis. The fifth chamber is adjacent to the upper surface and is connected to the fluid outlet, the third chamber and the fourth chamber. The bottom plate includes a plurality of guide grooves parallel to each other, and connects the second chamber to the third chamber and the fourth chamber to form a uniform flow channel with an equal length path on the bottom plate.

Description

Liquid-cooled head structure with uniform flow path

technical field

The invention relates to a liquid-cooled heat dissipation structure, in particular to a liquid-cooled head structure with a uniform flow path.

Background technique

With the development of science and technology, many electronic components generate more heat while improving their performance. As a result, general air-cooled heat sinks cannot meet the heat dissipation requirements of heat-generating electronic components, and must use liquid-cooled circulation technology. The liquid-cooled heat sink can effectively dissipate heat from the heat-generating electronic components. The traditional liquid-cooled radiator includes a liquid cooling block head, a liquid cooling pipe and a pump that are connected to each other, forming a circulation loop, wherein the circulation loop is filled with refrigerant fluid , the heat is taken away by the liquid cooling head contacting the heating electronic components and the heat exchange through the refrigerant fluid, the liquid cooling exhaust dissipates the heat to the outside to cool the refrigerant fluid, and the pump drives the refrigerant fluid to circulate in the circulation loop.

However, after the refrigerant fluid is introduced into the liquid-cooled head from the liquid-cooling discharge, if the refrigerant fluid flowing through the inner cavity of the liquid-cooled head cannot be transmitted in a uniform flow path, it will cause the temperature distribution of the contact surface between the liquid-cooled head and the electronic components. Non-uniformity, which in turn affects the performance of electronic components. In addition, the liquid-cooled radiator in use must also ensure that the refrigerant fluid is completely sealed in the circulation circuit. If the temperature distribution of the refrigerant fluid is not uniform, the closed structure of the liquid-cooled head may be affected, resulting in leakage of the refrigerant fluid and further damage. Electronic components cause a short circuit. Therefore, it is necessary to develop a liquid cooling head structure with a uniform flow path to improve the problems faced by the prior art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a liquid cooling head structure with a uniform flow path, so as to solve the problems of uneven flow path or poor heat exchange efficiency in the prior art.

Another object of the present invention is to provide a liquid-cooled head structure with a uniform flow path, wherein the liquid-cooled head has a simple structure, can be replaced, simply and stably assembled on the surface of a heat source of an electronic component, and has a uniform flow path. Conducting refrigerant liquid to avoid temperature difference on the bottom plate in contact with electronic components and affecting the performance of electronic components. In addition, part of the liquid-cooled head structure can be made of a light-transmitting material, and a light-emitting element is added, so that the liquid-cooled head structure can provide a light source lighting function while dissipating the heat energy generated by the electronic element and the light-emitting element.

In order to achieve the aforementioned object, the present invention provides a liquid cooling head structure with a uniform flow channel path, which includes an upper cover, a main body and a bottom plate. The upper cover includes a fluid inlet and a fluid outlet, wherein the fluid inlet and the fluid outlet form a central connection line. The body is arranged below the upper cover and includes an upper surface, a lower surface, a first chamber, a second chamber, a third chamber, a fourth chamber and a fifth chamber. The first chamber is adjacent to the upper surface and extends along the direction of the central connecting line of the part, and communicates with the fluid inlet. The second chamber is adjacent to the lower surface, extends along the direction of the central connecting line, and communicates with the first chamber. The third chamber and the fourth chamber penetrate through the upper surface and the lower surface, are respectively disposed on two opposite sides of the main body, and are mirror-symmetrical with the central connecting line as the symmetry axis. The fifth chamber is adjacent to the upper surface and communicates with the fluid outlet, the third chamber and the fourth chamber. The bottom plate includes a plurality of guide grooves, a first groove and a second groove, wherein the first groove and the second groove are respectively disposed on two opposite sides of the bottom plate relative to the third chamber and the fourth chamber. The plurality of guide grooves are parallel to each other and are connected between the first groove and the second groove, and are opposite to the second chamber, wherein the second chamber passes through the plurality of guide grooves, the first groove and the second groove The groove is connected to the third chamber and the fourth chamber, and a uniform flow channel with an equal length path is formed on the bottom plate.

The beneficial effect of the present invention is that the present invention provides a liquid cooling head structure with a uniform flow channel path, so as to solve the problems of uneven flow channel paths or poor heat exchange efficiency in the prior art. The liquid-cooling head has a simple structure, can be replaced, simply and stably assembled on the surface of the heat source of the electronic components, and conducts the refrigerant liquid with a uniform flow path, so as to avoid the temperature difference on the bottom plate that contacts the electronic components and affect the electronic components performance. In addition, part of the liquid-cooled head structure can be made of a light-transmitting material, and a light-emitting element is added, so that the liquid-cooled head structure can provide a light source lighting function while dissipating the heat energy generated by the electronic element and the light-emitting element.

Description of drawings

FIG. 1A is a structural exploded view of a liquid cooling head structure with a uniform flow path according to a first preferred embodiment of the present invention.

FIG. 1B is an exploded view of the structure of the liquid cooling head with a uniform flow path according to the first preferred embodiment of the present invention from another perspective.

FIG. 2 is a combined structural diagram showing the structure of the liquid cooling head having a uniform flow path in FIGS. 1A and 1B .

Fig. 3A is a top view showing the body in the first preferred embodiment of the present invention.

Fig. 3B is a bottom view showing the main body in the first preferred embodiment of the present invention.

FIG. 4 is a schematic diagram showing the flow path of the liquid cooling head structure of the present invention.

5 is a bottom view showing the body structure of the liquid cooling head structure according to the second preferred embodiment of the present invention.

6 is an exploded view showing the structure of the liquid cooling head according to the third preferred embodiment of the present invention.

Among them, the reference numerals are described as follows:

1: Liquid-cooled head structure

11: upper cover

111: Fluid inlet

112: Fluid outlet

113: Second locking hole

12: Ontology

120: accommodating slot

121: Upper surface

122: lower surface

123: First Chamber

124: Second Chamber

125: The third chamber

126: Fourth Chamber

127: Fifth Chamber

128: The third locking hole

129: Locking perforation

13: Bottom plate

131: Guide ditch

132: First groove

133: Second groove

134: Seal Assembly

1341: Limit Channel

1342: Seal Ring

135: The first locking hole

14: Locking element

15: Locking unit

16: Light-emitting element

L: central connection

Detailed ways

Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different aspects, all without departing from the scope of the present invention, and the descriptions and drawings therein are essentially used to illustrate it, not for use in Limit the invention.

1A and FIG. 1B are structural exploded views from different viewing angles of a liquid cooling head structure with a uniform flow path according to the first preferred embodiment of the present invention. FIG. 2 is a combined structural diagram showing the structure of the liquid cooling head having a uniform flow path in FIGS. 1A and 1B . 3A and 3B are respectively a top view and a bottom view of the body in the first preferred embodiment of the present invention. As shown in FIGS. 1A, 1B, 2, 3A and 3B, the liquid-cooled head structure 1 (hereinafter referred to as the liquid-cooled head structure) with a uniform flow path of the present invention is assembled for applications such as but not limited to central processing A heat source surface (not shown) of heat-generating electronic components such as a central processing unit (CPU). The liquid cooling head structure 1 of the present invention includes an upper cover 11 , a main body 12 and a bottom plate 13 . The upper cover 11 includes a fluid inlet 111 and a fluid outlet 112 , wherein a central connection line L is formed between the fluid inlet 111 and the fluid outlet 112 . The main body 12 is disposed below the upper cover 11 . The body 12 includes an upper surface 121 , a lower surface 122 , a first chamber 123 , a second chamber 124 , a third chamber 125 , a fourth chamber 126 and a fifth chamber 127 . The first chamber 123 is adjacent to the upper surface 121 and extends along a part of the central connecting line L direction, and communicates with the fluid inlet 111 . The second chamber 124 is adjacent to the lower surface 122 , extends along the direction of the central connecting line L, and communicates with the first chamber 123 . The third chamber 125 and the fourth chamber 126 penetrate through the upper surface 121 and the lower surface 122 of the main body 12 and are respectively disposed on two opposite sides of the main body 12 . The fifth chamber 127 is adjacent to the upper surface 121 of the main body 12 and communicates with the fluid outlet 112 , the third chamber 125 and the fourth chamber 126 . It should be noted that, in this embodiment, the third chamber 125 and the fourth chamber 126 are mirror-symmetrical chamber structures with the central connecting line L as the symmetry axis. In addition, the bottom plate 13 includes a plurality of guide grooves 131 , a first groove 132 and a second groove 133 . In this embodiment, the first groove 132 and the second groove 133 are respectively disposed on two opposite sides of the bottom plate 13 relative to the third chamber 125 and the fourth chamber 126 . The plurality of guide grooves 131 are parallel to each other, are connected between the first groove 132 and the second groove 133 , and are opposite to the second cavity 124 . The second chamber 124 is connected to the first groove 132 and the second groove 133 through two sides of the plurality of guide grooves 131 , and the third chamber 125 and the fourth chamber 126 are respectively connected to the first groove 132 and the second groove 133, whereby the second chamber 124 can be simultaneously communicated with the third chamber 125 and the fourth chamber 126 through the plurality of guide grooves 131, the first groove 132 and the second groove 133 , and thereby a uniform flow channel with equal length paths is formed on the bottom plate 13 .

FIG. 4 is a schematic diagram showing the flow path of the liquid cooling head structure of the present invention. In this embodiment, the second chamber 124 has an oblong hole-shaped orthographic projection, extends along the direction of the central connecting line L, and is located between the third chamber 125 and the fourth chamber 126, and is respectively connected to the third chamber. 125 is equidistant from the fourth chamber 126 . Therefore, the distances for the refrigerant liquid to flow from any point on both side edges of the second chamber 124 to the third chamber 125 or the fourth chamber 126 through the plurality of guide grooves 131 on the bottom plate 13 are the same. In this embodiment, the third chamber 125 and the fourth chamber 126 respectively have a trapezoidal orthographic projection, and the long bases of the trapezoidal orthographic projection are connected to the plurality of guide grooves 131 . After the refrigerant liquid flows into the third chamber 125 and the fourth chamber 126 through the plurality of guide grooves 131 on the bottom plate 13 respectively, it flows toward the short top sides of the trapezoidal orthographic projection of the third chamber 125 and the fourth chamber 126 , and At the same time, the lower surface 122 of the main body 12 is directed toward the upper surface 121 to the fifth chamber 127 . It is worth noting that the trapezoidal orthographic projection of the third chamber 125 and the fourth chamber 126 is beneficial to concentrate the refrigerant fluid and transmit the fifth chamber 127 from the lower surface 122 of the main body 12 to the upper surface 121. The bottom plate 13 can also include multiple A first locking hole 135 is disposed adjacent to both ends of the short top side of the orthographic projection of the trapezoid, so that the area of the bottom plate 13 can be effectively utilized. On the other hand, corresponding to the plurality of first locking holes 135 of the bottom plate 13 , the upper cover 11 and the main body 12 further respectively have a plurality of second locking holes 113 and a plurality of third locking holes 128 , both of which are opposite to the bottom plate 13 . The plurality of first locking holes 135 are assembled together to lock the upper cover 11 and the bottom plate 13 on the upper surface 121 and the lower surface 122 of the main body 12 respectively. In this embodiment, the liquid cooling head structure 1 further includes a plurality of locking elements 14 such as but not limited to screws, which pass through the corresponding second locking holes 113 , the third locking holes 128 and the first locking holes respectively. 135 to lock the upper cover 11 , the main body 12 and the bottom plate 13 . It should be emphasized that, in the body 12 of the liquid cooling head structure 1 of the present invention, in addition to the mirror-symmetrical arrangement of the third chamber 125 and the fourth chamber 126 , the first chamber 123 , the second chamber 124 , and the The structure of the five chambers 127 is also mirror-symmetrical with the central connecting line L as the axis of symmetry, and the relative dimensions thereof are not a limitation of the liquid cooling head structure 1 of the present invention. The dimensions of the first chamber 123 , the second chamber 124 and the fifth chamber 127 can be adjusted according to requirements without affecting the mirror-symmetric configuration. 5 is a bottom view showing the body structure of the liquid cooling head structure according to the second preferred embodiment of the present invention. In the present embodiment, the main body 12 is similar to the main body 12 shown in FIG. 3B , and the same component numbers represent the same components, structures and functions, which will not be repeated here. Different from the main body 12 shown in FIG. 3B , the second chamber 124 included in the main body 12 of the present embodiment only extends a short distance along the direction of the central connecting line L, but still maintains a similar shape as shown in FIG. 4 on both sides of the central connecting line L The mirror-symmetrical runner paths shown. It should be emphasized that, in the aforementioned embodiments, the dimensions of the first chamber 123 , the second chamber 124 and the fifth chamber 127 can be adjusted according to the shape of the heating electronic element corresponding to the liquid cooling head structure 1 , and the bottom plate The number and size of the plurality of guide grooves 131 on the 13 are not conditions that limit the characteristics of the present invention, and they can be adjusted as needed in practical applications, so that the liquid cooling head structure 1 of the present invention can have a mirror-symmetric uniform flow path path, Stable and effective heat dissipation of heat-generating electronic components.

Furthermore, in some embodiments, the fifth chamber 127 is communicated between the third chamber 125 and the fourth chamber 126 and the fluid outlet 112 respectively to form a confluence flow channel, as shown in FIGS. 1A and 3A . shown. Wherein, the cross-section of the confluence channel formed by the fifth chamber 127 is connected to the fluid outlet 112 in the center from the point where the fifth chamber 127 communicates with the third chamber 125 and the point where the fifth chamber 127 communicates with the fourth chamber 126, respectively. The point is gradually decreased, so as to increase the hydraulic pressure of the refrigerant fluid to increase the flow rate and smooth the flow field. Of course, the present invention is not limited to this.

In addition, please refer to FIG. 1A and FIG. 1B again, in this embodiment, the bottom plate 13 further includes a sealing element 134 disposed between the bottom plate 13 and the main body 12 , and surrounded by the plurality of guide grooves 131 and the first grooves 132 and the periphery of the second groove 133 . Specifically, the sealing assembly 134 includes a corresponding combined structure of a limiting channel 1341 and a sealing ring 1342 , wherein the sealing ring 1342 can be, for example, but not limited to, a rubber ring. The limiting channel 1341 is recessed in the bottom plate 13 and surrounds the periphery of the plurality of guide grooves 131 , the first grooves 132 and the second grooves 133 . The sealing ring 1342 is assembled and accommodated on the limiting channel 1342 . When the bottom plate 13 and the main body 12 are clamped, a complete seal can be formed by the arrangement of the sealing component 134 to avoid leakage of refrigerant liquid from the gap between the bottom plate 13 and the main body 12, thereby causing damage to the electronic components. On the other hand, in the aforementioned embodiment, the main body 12 may further include a plurality of locking through holes 129 , which are respectively disposed on a plurality of peripheral extension portions of the main body 12 and are assembled with a plurality of locking units 15 to cool the liquid. The head structure 1 is locked to a heat source surface (not shown) of an electronic component. In one embodiment, the plurality of locking units 15 can be, for example, but not limited to, screws, which are respectively assembled with the plurality of locking holes 129 of the main body 12 to engage and lock to the electronic components or the carrier board (not shown in the figure) provided with the electronic components. shown), and then the bottom plate 13 of the liquid cooling head structure 1 is brought into contact with the surface of the heat source. It should be emphasized that the manner in which the liquid-cooled head structure 1 is bonded to the surface of the heat source of the electronic component is not a condition for limiting the features of the present invention, and other possible locking methods are also suitable for locking the liquid-cooled head structure 1 of the present invention. The present invention is not limited to the foregoing examples and will not be repeated.

Since the liquid cooling head structure 1 of the present invention is assembled and applied to a heat source surface (not shown) of heat-generating electronic components such as but not limited to a central processing unit (CPU), the bottom plate 13 is made of a metal material is better. On the other hand, the upper cover 11 and the main body 12 may be formed of a light-transmitting material, of course, the present invention is not limited thereto. When the upper cover 11 and the main body 12 are made of a light-transmitting material, the liquid-cooled head structure 1 of the present invention can further be combined with a light-emitting element to provide an illumination light source. 6 is an exploded view showing the structure of the liquid cooling head according to the third preferred embodiment of the present invention. In this embodiment, the liquid-cooling head structure 1 is similar to the liquid-cooling head structure 1 shown in FIG. 1A and FIG. 1B , and the same component numbers represent the same components, structures and functions, which will not be repeated here. Different from the liquid cooling head structure 1 shown in FIG. 1A and FIG. 1B , in the liquid cooling head structure 1 of the present embodiment, the main body 12 further includes an accommodating groove 120 , which is arranged on one side edge of the main body 12 and is liquid-cooled. The head structure 1 further includes a light-emitting element 16 disposed in the accommodating groove 120 for assembling and providing an illumination light source. Therefore, the liquid-cooled head structure 1 not only provides the bottom plate 13 to dissipate heat from the surface of a heat source of the heat-generating electronic components, the light-emitting element 16 added to the main body 12 also provides an illumination light source to indicate or decorate the liquid-cooled head structure 1 . At the same time, the refrigerant fluid flowing through the chambers of the main body 12 also helps the main body 12 to escape the heat energy generated at the light-emitting element 16 . It should be emphasized that, in the foregoing embodiments, the number, size and arrangement position of the light-emitting elements 16 and the accommodating grooves 120 are not conditions that limit the characteristics of the present invention, and they can be adjusted according to actual application requirements, and provide a uniform flow path path. Effective heat dissipation efficiency, at the same time as an indication or decorative lighting.

To sum up, the present invention provides a liquid cooling head structure with a uniform flow path, so as to solve the problems of uneven flow path or poor heat exchange efficiency in the prior art. The liquid-cooling head has a simple structure, can be replaced, simply and stably assembled on the surface of the heat source of the electronic components, and conducts the refrigerant liquid with a uniform flow path, so as to avoid the temperature difference on the bottom plate that contacts the electronic components and affect the electronic components performance. In addition, part of the liquid-cooled head structure can be made of a light-transmitting material, and a light-emitting element is added, so that the liquid-cooled head structure can provide a light source lighting function while dissipating the heat energy generated by the electronic element and the light-emitting element.

The present invention can be arbitrarily conceived by those skilled in the art and various modifications can be made without departing from the scope of the appended claims.

Claims (14)

1. a kind of liquid cooling header structure with uniform flow path path, comprising:

One upper cover, including a fluid inlet and a fluid outlet, wherein the fluid inlet and the fluid outlet form a center even Line；

One ontology, is set to the lower section of the upper cover, and including a upper surface, a lower surface, a first chamber, a second chamber, One third chamber, one the 4th chamber and one the 5th chamber, wherein the first chamber is adjacent to the upper surface and being somebody's turn to do along part Central line direction extends, and is connected to the fluid inlet, which is adjacent to the lower surface, and along the center line Direction extends, and is connected to the first chamber, and the third chamber and the 4th chamber divide through the upper surface and the lower surface It is not set to the two opposite sides of the ontology, and is in mirror symmetry using the center line as symmetry axis, the 5th chamber neighbour sets In the upper surface, and with the fluid outlet, the third chamber and the 4th chamber；And

One bottom plate, including multiple guide channels, one first groove and one second groove, wherein first groove and second groove are distinguished The two opposite sides of the bottom plate are set to relative to the third chamber and the 4th chamber, multiple guide channel is parallel to each other, and even It is connected between first groove and second groove, and is arranged relative to the second chamber, wherein the second chamber is by being somebody's turn to do Multiple guide channels, first groove and second groove and be connected to the third chamber and the 4th chamber, and in shape on the bottom plate At a uniform flow path with isometric path.

2. wherein the second chamber is led with multiple as described in claim 1 with the liquid cooling header structure in uniform flow path path Ditch is connected, and the third chamber is connected with first groove and second groove respectively with the 4th chamber.

3. wherein the bottom plate further includes a sealing group as described in claim 1 with the liquid cooling header structure in uniform flow path path Part is set between the bottom plate and the ontology, and is located on the periphery of multiple guide channel and first groove and second groove.

4. having the liquid cooling header structure in uniform flow path path as claimed in claim 3, wherein the seal assembly includes:

One limit channel, it is recessed in the bottom plate, and it is surrounded on the periphery of multiple guide channel and first groove and second groove； And

One sealing ring is placed in the limit channel.

5. wherein the second chamber is oval with one as described in claim 1 with the liquid cooling header structure in uniform flow path path Poroid orthographic projection extends along the center line direction, and between the third chamber and the 4th chamber.

6. there is the liquid cooling header structure in uniform flow path path as described in claim 1, wherein the third chamber and the 4th chamber Room is respectively provided with a trapezoidal orthographic projection, and a long bottom edge of the trapezoidal orthographic projection is connect with multiple guide channel.

7. wherein the bottom plate includes multiple first locks as claimed in claim 6 with the liquid cooling header structure in uniform flow path path Solid hole is adjacent to two end sides of a short top margin of the trapezoidal orthographic projection.

8. wherein the upper cover has multiple second locks as claimed in claim 7 with the liquid cooling header structure in uniform flow path path Solid hole, multiple first locking hole and the ontology for being respectively relative to the bottom plate have multiple third locking holes, respectively relatively In multiple first locking hole of the bottom plate.

9. further including multiple lock members as claimed in claim 8 with the liquid cooling header structure in uniform flow path path, respectively By corresponding first locking hole, second locking hole and the third locking hole and the upper cover that locks, the ontology and the bottom plate.

10. wherein the bottom plate is by a metal material as described in claim 1 with the liquid cooling header structure in uniform flow path path It is constituted.

11. wherein the upper cover and the ontology are by one as described in claim 1 with the liquid cooling header structure in uniform flow path path Light-permeable material is constituted.

12. further including a light-emitting component as claimed in claim 11 with the liquid cooling header structure in uniform flow path path, and should Ontology further includes an accommodation groove, is set to the one side edge of the ontology, and wherein the light-emitting component is set to the accommodation groove, to assemble One radiation source is provided.

13. wherein the ontology includes that multiple lockings are worn as described in claim 1 with the liquid cooling header structure in uniform flow path path Hole is respectively arranged at multiple periphery extensions of the ontology, mutually to assemble with multiple locking units, and by the liquid cooling header structure Secure to a heat source surface of an electronic component.

14. as described in claim 1 with uniform flow path path liquid cooling header structure, wherein the 5th chamber be respectively communicated in The third chamber is to the fluid outlet and the 4th chamber between the fluid outlet, to constitute a confluence runner, the wherein remittance The section of runner is flowed respectively by the third chamber and the 5th chamber and the 4th chamber and the 5th chamber Place is to gradually successively decreasing at the fluid outlet and the 5th chamber.