CN108321292B - 磁性物理不可克隆函数器件及磁性物理不可克隆函数装置 - Google Patents
磁性物理不可克隆函数器件及磁性物理不可克隆函数装置 Download PDFInfo
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- CN108321292B CN108321292B CN201810239799.8A CN201810239799A CN108321292B CN 108321292 B CN108321292 B CN 108321292B CN 201810239799 A CN201810239799 A CN 201810239799A CN 108321292 B CN108321292 B CN 108321292B
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- 239000000395 magnesium oxide Substances 0.000 claims abstract description 44
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 27
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910001385 heavy metal Inorganic materials 0.000 claims abstract description 22
- ZDZZPLGHBXACDA-UHFFFAOYSA-N [B].[Fe].[Co] Chemical compound [B].[Fe].[Co] ZDZZPLGHBXACDA-UHFFFAOYSA-N 0.000 claims abstract description 21
- 230000005641 tunneling Effects 0.000 claims abstract description 18
- 239000010408 film Substances 0.000 claims description 28
- 239000010409 thin film Substances 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000010884 ion-beam technique Methods 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 97
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000004044 response Effects 0.000 description 9
- 229910019236 CoFeB Inorganic materials 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229910052715 tantalum Inorganic materials 0.000 description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 230000003993 interaction Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910020707 Co—Pt Inorganic materials 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- 241000904014 Pappus Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010367 cloning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 210000000554 iris Anatomy 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
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- Thin Magnetic Films (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Abstract
Description
Claims (7)
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CN201810239799.8A CN108321292B (zh) | 2018-03-22 | 2018-03-22 | 磁性物理不可克隆函数器件及磁性物理不可克隆函数装置 |
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CN201810239799.8A CN108321292B (zh) | 2018-03-22 | 2018-03-22 | 磁性物理不可克隆函数器件及磁性物理不可克隆函数装置 |
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CN108321292A CN108321292A (zh) | 2018-07-24 |
CN108321292B true CN108321292B (zh) | 2024-03-08 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US11195991B2 (en) | 2018-09-27 | 2021-12-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Magnetic random access memory assisted devices and methods of making |
WO2020197922A1 (en) * | 2019-03-22 | 2020-10-01 | Lexmark International, Inc. | Tamper-proof physical unclonable function seals for authentication of bottles |
CN110752288B (zh) | 2019-09-29 | 2022-05-20 | 华中科技大学 | 一种基于非易失器件阵列构造可重构强puf的方法 |
CN110752287B (zh) * | 2019-09-29 | 2021-04-20 | 华中科技大学 | 一种基于随机性磁畴壁移动的可重构puf构造方法 |
KR20230046561A (ko) * | 2021-09-30 | 2023-04-06 | 현대자동차주식회사 | 스핀오빗토크 소자 및 스핀오빗토크 소자 제조 방법 |
CN115994390A (zh) * | 2021-10-19 | 2023-04-21 | 中国科学院微电子研究所 | 基于全电场控制磁畴壁运动的可重构puf器件 |
CN116094719B (zh) * | 2022-11-16 | 2024-11-08 | 北京工业大学 | 基于物理不可克隆函数的轻量级工业传感器数据流完整性验证方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900262A (zh) * | 2014-03-07 | 2015-09-09 | 英特尔公司 | 使用电阻式存储器件的物理防克隆功能电路 |
WO2016018503A1 (en) * | 2014-07-30 | 2016-02-04 | University Of South Florida | Magnetic memory physically unclonable functions |
CN207909918U (zh) * | 2018-03-22 | 2018-09-25 | 武汉华芯纳磁科技有限公司 | 磁性物理不可克隆函数器件及磁性物理不可克隆函数装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20150071432A1 (en) * | 2013-09-09 | 2015-03-12 | Qualcomm Incorporated | Physically unclonable function based on resistivity of magnetoresistive random-access memory magnetic tunnel junctions |
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- 2018-03-22 CN CN201810239799.8A patent/CN108321292B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104900262A (zh) * | 2014-03-07 | 2015-09-09 | 英特尔公司 | 使用电阻式存储器件的物理防克隆功能电路 |
WO2016018503A1 (en) * | 2014-07-30 | 2016-02-04 | University Of South Florida | Magnetic memory physically unclonable functions |
CN207909918U (zh) * | 2018-03-22 | 2018-09-25 | 武汉华芯纳磁科技有限公司 | 磁性物理不可克隆函数器件及磁性物理不可克隆函数装置 |
Non-Patent Citations (1)
Title |
---|
"Extracting Physically Unclonable Function From Spin Transfer Switching Characteristics in Magnetic Tunnel Junctions";Takao Marukame 等;《 IEEE Transactions on Magnetics》;第50卷(第11期);3402004 * |
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Effective date of registration: 20240811 Address after: 430000 Qidi Xiexin Science and Technology Innovation Park, Nantaizi Lake Innovation Valley, Wuhan Economic and Technological Development Zone, Wuhan City, Hubei Province (QDXX-F2309) Patentee after: Wuhan Jintang Xin'an Technology Co.,Ltd. Country or region after: China Address before: Room 17, 1st Floor, Building H7, Phase III, Financial Port Backend Service Center, No. 78 Guanggu Avenue, Donghu New Technology Development Zone, Wuhan City, Hubei Province, 430000 Patentee before: WUHAN HUAXIN NANO MAGNETIC TECHNOLOGY Co.,Ltd. Country or region before: China |
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