[go: up one dir, main page]

CN108320268B - Large-area manufacturing method of femtosecond laser complex component - Google Patents

Large-area manufacturing method of femtosecond laser complex component Download PDF

Info

Publication number
CN108320268B
CN108320268B CN201810131341.0A CN201810131341A CN108320268B CN 108320268 B CN108320268 B CN 108320268B CN 201810131341 A CN201810131341 A CN 201810131341A CN 108320268 B CN108320268 B CN 108320268B
Authority
CN
China
Prior art keywords
processing
pattern
area
laser
algorithm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810131341.0A
Other languages
Chinese (zh)
Other versions
CN108320268A (en
Inventor
李明
姜澜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XiAn Institute of Optics and Precision Mechanics of CAS
Beijing Institute of Technology BIT
Original Assignee
XiAn Institute of Optics and Precision Mechanics of CAS
Beijing Institute of Technology BIT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XiAn Institute of Optics and Precision Mechanics of CAS, Beijing Institute of Technology BIT filed Critical XiAn Institute of Optics and Precision Mechanics of CAS
Priority to CN201810131341.0A priority Critical patent/CN108320268B/en
Publication of CN108320268A publication Critical patent/CN108320268A/en
Application granted granted Critical
Publication of CN108320268B publication Critical patent/CN108320268B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00Geometric image transformations in the plane of the image
    • G06T3/40Scaling of whole images or parts thereof, e.g. expanding or contracting
    • G06T3/4038Image mosaicing, e.g. composing plane images from plane sub-images
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T3/00Geometric image transformations in the plane of the image
    • G06T3/40Scaling of whole images or parts thereof, e.g. expanding or contracting
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/62Analysis of geometric attributes of area, perimeter, diameter or volume
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2200/00Indexing scheme for image data processing or generation, in general
    • G06T2200/32Indexing scheme for image data processing or generation, in general involving image mosaicing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30164Workpiece; Machine component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Geometry (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

本发明提出了一种飞秒激光复杂构件大面积制造方法,对复杂构件进行表面加工,具体包括:采用复杂构件模型重构和表面加工图案拼接算法,根据激光加工区域面积和焦深,设定约束条件和区域生长算法,划分加工区域,并对区域边界进行简化处理得到加工区域,对组成加工图案图元种类及布局特点提取关键特征,根据周期性和非周期性布局的过程,设计拼接算法使得加工图案自动快速地在复杂构件表面进行布局,采用加工区域划分和图案分割算法,设置加工图案中图元的种类和组合方式,求得图元与加工区域边界的交点并归类子图案到对应的加工区域,采用加工图案实时检测和在线拼接制造技术,通过设置和安装高精度CCD摄像机获得加工部位的视频图像,基于图像处理算法实时识别已加工图案的边界,进而根据待加工图案边界信息来预判两幅加工图案的配准误差,获取所需矫正变换参数,实现激光加工过程中的在线拼接制造。

The invention proposes a large-area manufacturing method for complex components by femtosecond laser, which is used for surface processing of complex components, which specifically includes: using complex component model reconstruction and surface processing pattern splicing algorithm, according to the laser processing area area and focal depth, setting Constraints and region growth algorithm, divide the processing area, and simplify the boundary of the area to obtain the processing area, extract the key features for the types and layout characteristics of the primitives that make up the processing pattern, and design the stitching algorithm according to the process of periodic and aperiodic layout. The processing pattern can be automatically and quickly laid out on the surface of complex components. The processing area division and pattern segmentation algorithms are used to set the type and combination of primitives in the processing pattern, and the intersection between the primitive and the boundary of the processing area is obtained and the sub-patterns are classified into For the corresponding processing area, real-time detection of processing patterns and online splicing manufacturing technology are adopted. Video images of processing parts are obtained by setting and installing high-precision CCD cameras. It can predict the registration error of the two processing patterns, obtain the required correction transformation parameters, and realize the online splicing manufacturing in the laser processing process.

Description

A kind of femtosecond laser complex component large area manufacturing method
Technical field
The invention belongs to advanced laser manufacturing fields, are related to a kind of femtosecond laser complex component surface machining manufacture. This method using complex component model reconstruction and surface processing graphic pattern stitching algorithm, machining area divides and pattern partitioning algorithm, Processing graphic pattern real-time detection and complex component surface is processed in splicing manufacturing technology.
Background technique
There is a kind of new type light source the 1960s, has that monochromaticjty is good, good directionality, coherence are good, energy is concentrated The features such as.Femtosecond Optical Pulses refer to that the duration is 10-12s-10-15The laser pulse of s, this laser pulse have high peak The characteristics of value power, very wide spectral width and extremely short laser emission time.When femtosecond laser is unique ultrashort lasting with its Between and superpower peak power started material it is hyperfine, it is low damage and space three-dimensional working process frontier, and application get over Come wider.According to the ultrashort and superpower feature of femtosecond laser, Applied research fields can be generally divided into ultrafast transient phenomenon Research and superpower phenomenon research.They are all continuous with the shortening of laser pulse width and the increase of pulse energy It is able to deeply and develops.The most direct application of femtosecond pulse is that people use it as light source, forms a variety of time resolutions Spectral technique and pumping/Detection Techniques.Its development directly drive physics, chemistry, biology, material and information science research into Enter microcosmic ultrafast process field, and started some completely new research fields, such as femtochemistry, is partly led at Quantum control chemistry Body coherent swpectrum etc..The combination of femtosecond pulse and nanometer microscopy allows people to study the nanostructure of semiconductor Carrier dynamics in (quantum wire, quantum dot and nanocrystal).In terms of biology, people are utilizing femtosecond laser skill Molecular dynamics provided by art, pumping/Detection Techniques study the biography energy of photosynthesis reaction center, turn energy and charge Separation process.Ultra-short pulse laser is also applied to the transmission of information, processing and storage aspect.
The successful operating for the desk-top terawatt (TW) laser that First is realized using chirped pulse amplification technique starts from 1988, this Achievement indicates that femtosecond is superpower and the beginning of the strong optical physics research of superelevation in laboratory.In this area research, due to super The effect of short laser field has been equivalent to or has substantially exceeded the constraint field that electron institute in atom is subject to, and perturbation theory is untenable, New theoretical treatment is up for development.Under the light intensity of 1020W/cm2, the research of simulation Astronomical Phenomena may be implemented. The thermoelectron (200KeV) that the superelevation light laser of 1019-1021W/ cm2 generates.Another important application of femtosecond laser is just It is micro- retrofit.In general, by for laser pulse standard, duration swashing greater than 10 picoseconds (being equivalent to heat conduction time) Light pulse belongs to long pulse, with it come rapidoprint, since fuel factor makes adjacent material change, to influence processing essence Degree.And pulse width only has the femto-second laser pulse of thousands of part per trillion seconds then to possess unique material processing characteristics, such as adds The melting zone very little in work aperture does not have;Multiple material may be implemented, such as even life inside metal, semiconductor, transparent material The micromachined of object tissue etc., engraving;Machining area can be less than focal dimension, break through diffraction limit etc..Some automobiles Just research with femtosecond laser processes better engine nozzle at present for manufactory and heavy equipment processing factory.Use ultrashort pulse Laser can get the wide aperture of several hundred nanometers on metal.On being most bordering on the Optical Society of America's meeting held Orlando, The Hai Te of IBM Corporation says that a kind of fs-laser system is used in the photoetching process of large scale integrated chip by IBM.With Femtosecond laser is cut, almost without heat transmitting.U.S.'s Lao Lunsi livermore national laboratory it was discovered by researchers that This laser beam can safely cut high explosive.The Loews gram in the laboratory is said: " femtosecond laser holds promise as a kind of cold place Science and engineering tool, for removing retired rocket, cannon bomb and other weapons."
Femtosecond laser can be used to cut frangible polymer, without changing its important biochemical characteristic.It is biomedical Expert using it as ultraprecise surgical knife, is used for vision correcting surgery, not only can be reduced tissue damage but also will not leave behind hand Art sequelae, or even can individual cells be moved with delicate surgery or be used for gene therapy.How people will also fly in research at present Second laser is used for dental treatment.There is scientist's discovery, a fritter of tooth can be removed using ultra-short pulse laser, around influencing Substance.The UMW series ultrafast laser micro Process workbench that Clark-MXR company, the U.S. releases recently exactly represents this neck The commercial femtosecond laser parallel micromachining system of forefront in domain, it includes all needed for carrying out micro Process with ultra-short pulse laser Equipment and accessory can be used for micro Process any material, generate sub-micron fine structure, without being damaged to periphery material, Material splashing is not will cause, processing result is extremely accurate and has high performance reproducibility.
The direct purposes of femtosecond pulse is exactly time-resolved spectroscopy.Physics, chemistry and biology are observed with femtosecond pulse Equal ultrafast process, femtosecond pulse can make the light source of confocal microscope, to make the three-dimensional image of biological sample.Make light with femtosecond pulse The three of optical coherence tomography (optical coherence tomography, abbreviation OCT) the observable active somatic cell in source Image is tieed up, is not at this time the time response using femtosecond pulse, but utilizes the wide spectrum of femtosecond light source, it is similar white to generate The interference of light, the reflection of the phonon excited in the semiconductors using femtosecond pulse can be used to the thickness of real-time measurement semiconductive thin film Degree, to monitor the growth of semiconductive thin film, makees micro machining with femtosecond pulse, and punched hole is smooth without burr, because Femtosecond pulse does not melt re-evaporation first by fuel factor, directly evaporates material by high field, femtosecond pulse is used as optic communication Existing communication speed can be improved hundred times by light source, and femtosecond pulse and the Plasma Interaction of high-energy can produce Raw higher hamonic wave and X-ray, and it is possibly used for controlled nuclear fusion, the tera hertz that people's also trial is generated with femtosecond pulse Radiation, to detect the packaging quality of integrated circuit or even the fat content of meat product.In short, there are many application of femtosecond pulse.
With femtosecond pulse laser it is further development and it is perfect, one surely hews out more application prospects.It is worth It is noted that just there is a group of people to separate from research group in the researcher of various countries whenever research and development to certain phase, Research achievement is converted into product, certain original laser company, which also notes that, absorbs new research achievement.Such as also existed at that time Bar sinus (P.Bado) of University of Rochester has just set up the company's wheat Haddock Adamss (Medox) of oneself early in 1985, and production is high Fast photoswitch, later with the development of Femtosecond pulse amplification technology, he and the Clarke instrument with production femtosecond pulse laser (ClarkInstruments) company, which combines, has set up Clarke-wheat Haddock Adamss (Clark-MXR) company, specially produces femtosecond Pulsed solidstate, fiber laser and amplifier and its peripheral equipment, state (Washington State) university in Washington be not interior Grace and its husband's Kapp court of a feudal ruler (H.Kapteyn) are after creating 11-fs ti sapphire laser, although it is (existing not to be detached from university Equal migration University of Michigan teaches), the amateurish company " KM-Laboratory " with their Mr. and Mrs' namings is but set up, out Sell them the 10-fs laser of manufacture, Shi Dinggeer (A.Stingl) in the Crouse group of Vienna University of Technology etc. is several Femto Lasers, the sub- 10-fs using disperse reflection mirror for selling their manufactures swashs for personal also independent incorporation The Cai Boqi of light device, solid-state physics research institute, Hungary also " retains the job but suspends the salary ", has set up Laser Optics company, has utilized breast tooth The equipment of sharp solid-state physics research institute produces the disperse reflection mirror of femtosecond pulse laser, is said with the words of himself, be him Other people in " supporting " research institute, another pair study famous Mr. and Mrs Kai Le and denapon coffee with femtosecond pulse (K.Weingarten) more interesting, one is still taught in university, another has exited light wave company, the U.S. (Lightwave Electronics) Switzerland is come with the triumphant Le of wife and has established the company (Time-bandwidth for being " time-bandwidth product " Products), the triumphant femtosecond pulse laser with saturable absorbing mirror starting mode locking for strangling invention, Liang great laser company are produced Relevant company and spectrum physics company also take as own duty, rely on their considerable strengths from pump laser, femtosecond pulse oscillation Device, amplifier to parametric oscillator every field and heroes' expansion competition comprehensively.
In terms of national science and technology strategy, the way in the U.S. is to support several key universities and National Laboratory, such as Mi Xi The ultra-fast optical center of root university, the Strong-field physics laboratory in University of California San Diego branch school, Lao Lunsi-benefit object not laboratory Deng.It is Japanese then be in the form of large-scale " produce (industry) official (government office, i.e. National Laboratory) and learn (the university) " research project of Ministry of International Trade and Industry, Started so-called " femtosecond technical plan " in 1996, concentrated Japanese almost all of famous big company, National Laboratory and University has also pulled on the AT&T Labs in the U.S., carries out the research of femtosecond pulse technology, target is in billion bit high-speed communication Technical aspect is come out top.
Various features based on femtosecond laser, the present invention are used in the processing of complex component.Especially aerospace The pattern on typical members surface manufactures, since aerospace component is big and the guarantee of structural intergrity, to its difficulty of processing Very big, processing method proposed by the present invention fully meets aerospace industry requirement.The present invention develops laser large scale curved surface The segmentation of pattern precision and the online splicing apparatus of unit, break through the conventionally manufactured limit for relying on mechanical integrated kinematic accuracy in process System realizes the high-precision high-efficiency manufacture of complex pattern on large scale curved surface.The pattern dimension detection accuracy error of device≤ 0.005mm, workpiece surface target point positional accuracy measurement error≤0.005mm.
Summary of the invention
In conventional laser manufacturing process, generallys use component movement cooperation single point laser processing technology and realize picture on surface Manufacture, but this kind of processing technology is applied in the large complicated carved component of this project, and the processing of picture on surface can be seriously affected Efficiency and quality, by pattern segmentation with unit pattern Rapid Manufacturing Technology, it can be achieved that large complicated carved high efficiency manufacture, because This proposes a kind of new manufacturing method.
The laser processing precision of complex large-scale component is influenced by mechanical integrated movement accumulated error, and there are single-point processing Caused inefficiency problem.Quality and efficiency are manufactured for improving laser, it is necessary to large-scale component is divided into multiple machining areas, The accurate segmentation and unit pattern for carrying out pattern are manufactured in splicing.The present invention proposes a kind of large-scale component method of surface finish, The segmentation of pattern precision and the online splicing apparatus of unit, break through conventionally manufactured dependence machine during exploitation laser large scale Machining of Curved Surface The high-precision high-efficiency manufacture of complex pattern on large scale curved surface is realized in the limitation of the comprehensive kinematic accuracy of tool.The pattern dimension of device is examined Survey trueness error≤0.005mm, workpiece surface target point positional accuracy measurement error≤0.005mm.
Processing specific method mainly includes three parts: first part is complex component model reconstruction and surface processing graphic pattern Stitching algorithm.After complex component is converted into mathematical model, there are normal vector missing or mistakes, lead to topological defect, for this reason, it may be necessary to Reasonable interpolation algorithm is designed, correct complex component model is reconstructed.In addition, being processed pattern etch to realize, meet pattern Topological relation and splicing precision, need to be spliced on complex component surface, develop efficient pattern splicing algorithm.It analyzes all kinds of multiple Miscellaneous component model normal vector mistake rule, designs complex component topology detection algorithm, proposes topological defect type decision method, base Topological defect problem is handled in interpolation algorithm, rebuilds component surfacial pattern;Different pel types and layout characteristics are analyzed, it is generated Envelope outer profile, and then process and feature of the processing graphic pattern on complex component surface periodically with aperiodicity layout are studied, if Efficient pattern splicing algorithm is counted, realizes processing graphic pattern fast layout.Second part is that machining area divides and pattern partitioning algorithm. When the picture on surface being laid out is divided into multiple machining areas, need according to space dough sheet method arrow and Curvature varying, laser Depth of focus and vibration mirror scanning range design reasonable area efficient partitioning algorithm, to guarantee the borderline segmentation of a large amount of machining areas Effect and efficiency.Based on single process region area parameter and focal depth parameter, the three-dimensional body data of complex component are analyzed, are designed Algorithm of region growing searches for adjacent triangular faces on the work surface for the complex component for meeting constraint condition, and then proposes high The picture on surface machining area partitioning algorithm of effect;Pel type and combined method in processing graphic pattern are analyzed, according to machining area Space is divided, proposes complete pattern along the figure partitioning algorithm of different machining areas.Part III is processing graphic pattern real-time detection With in splicing manufacturing technology.During picture on surface retrofit, the machined registration accuracy between region to be processed Directly affect the continuity between pattern.For this purpose, the machined zone boundary detection technique based on image-recognizing method need to be studied, if Count zone map to be processed correction transformation algorithm, complete the accurate matching with machined region, realize pattern in splicing system It makes.Working position video image acquisition methods are designed, the machined zone boundary detection technique based on image-recognizing method is studied, It proposes pattern to be processed and machined pattern registration method, and then calculates rotation, translation according to the boundary information of pattern to be processed With the correction transformation parameter of the operations such as scaling, propose that pattern to be processed carries out correction transform process method, completion laser machined Being manufactured in splicing in journey.
First according to laser processing area area and depth of focus, constraint condition and algorithm of region growing are set, divides processing district Domain, and zone boundary simplify handling and obtains reasonable machining area;Secondly, analysis and summary form processing graphic pattern pel kind Class and layout characteristics, according to process and feature that periodicity and aperiodicity are laid out, design stitching algorithm makes processing graphic pattern certainly It is dynamic to be rapidly laid out on complex component surface;Again, the type and combination of pel in processing graphic pattern are analyzed and is designed Partitioning algorithm acquires the intersection point of pel and machining area boundary and correctly sorts out sub-pattern to suitable machining area;Finally, logical The video image that design and installation high-precision CCD video camera obtains working position is crossed, is identified in real time based on image processing algorithm The boundary of processing graphic pattern, and then the registration error of two width processing graphic patterns is prejudged according to pattern boundaries information to be processed, obtain institute Transformation parameter need to be corrected, realizes manufacturing in laser processing procedure in splicing.
The above method is special based on adjacent area topological continuity, period and aperiodic layout rule, the pel of processing graphic pattern The component surfaces pattern-informations such as point, and mature high-precision camera shooting and image procossing basic algorithm, ensured the technology can Row.Since the processing graphic pattern processing software system of complete function is very rarely seen, domestic more dependence imports, independent research is directed to The three-dimensional process software systems that the function of laser accurate manufacture is relatively complete are substantially at blank, or only for planar graph or open up Simple regular figure is flutterred, is unable to satisfy complex component picture on surface splicing manufacture demand, therefore the present invention is for completing aviation Aerospace structural component processing is very effective.
Detailed description of the invention
Fig. 1 femtosecond laser complex component surface machining manufacture schematic diagram.
The segmentation of Fig. 2 pattern splices manufacturing step schematic diagram with unit pattern.
Specific embodiment
Satellite consolidates the large-scale components tables such as surface antenna transmitter, radar invisible frequency selector, engine crankcase thin-wall barrel The pattern in face finely manufactures and fine quarter type, is such as realized using the fixed position single-point processing combination member movement of conventional laser big Scale surface chart shape is made, and not only processing efficiency is low, but also the mechanical integrated precision of big stroke apparatus directly influences pattern The accuracy of manufacture.
Quality and efficiency are manufactured to promote the laser on complex large-scale component surface, this project proposes large format three-D pattern essence Large-scale component is divided into multiple machining areas, according to space dough sheet method in splicing manufacturing technology by close segmentation and unit pattern Arrow and Curvature varying, laser depth of focus and vibration mirror scanning range, design reasonable region partitioning algorithm, realize that segmentation is single using galvanometer The quick manufacture of element pattern;It is converted into existing topological defect after mathematical model for complex component, reasonable interpolation is designed and calculates Method reconstructs correct component model;Later, according to processing graphic pattern pel type and layout characteristics, according to the efficient pattern of exploitation Stitching algorithm is spliced in component surface, to meet pattern topological relation and splicing required precision.
In addition, the registration accuracy between machined region and region to be processed is straight during picture on surface retrofit Connect the continuity and accuracy influenced between pattern.For this purpose, developing machined zone boundary based on image-recognizing method detects skill Art designs the various correction transformation algorithms of zone map to be processed, and then completes the accurate matching with machined region, realizes surface The high-precision of pattern is manufactured in splicing.
Processing specific method mainly includes three parts: first part is complex component model reconstruction and surface processing graphic pattern Stitching algorithm.After complex component is converted into mathematical model, there are normal vector missing or mistakes, lead to topological defect, for this reason, it may be necessary to Reasonable interpolation algorithm is designed, correct complex component model is reconstructed.In addition, being processed pattern etch to realize, meet pattern Topological relation and splicing precision, need to be spliced on complex component surface, develop efficient pattern splicing algorithm.It analyzes all kinds of multiple Miscellaneous component model normal vector mistake rule, designs complex component topology detection algorithm, proposes topological defect type decision method, base Topological defect problem is handled in interpolation algorithm, rebuilds component surfacial pattern;Different pel types and layout characteristics are analyzed, it is generated Envelope outer profile, and then process and feature of the processing graphic pattern on complex component surface periodically with aperiodicity layout are studied, if Efficient pattern splicing algorithm is counted, realizes processing graphic pattern fast layout.Second part is that machining area divides and pattern partitioning algorithm. When the picture on surface being laid out is divided into multiple machining areas, need according to space dough sheet method arrow and Curvature varying, laser Depth of focus and vibration mirror scanning range design reasonable area efficient partitioning algorithm, to guarantee the borderline segmentation of a large amount of machining areas Effect and efficiency.Based on single process region area parameter and focal depth parameter, the three-dimensional body data of complex component are analyzed, are designed Algorithm of region growing searches for adjacent triangular faces on the work surface for the complex component for meeting constraint condition, and then proposes high The picture on surface machining area partitioning algorithm of effect;Pel type and combined method in processing graphic pattern are analyzed, according to machining area Space is divided, proposes complete pattern along the figure partitioning algorithm of different machining areas.Part III is processing graphic pattern real-time detection With in splicing manufacturing technology.During picture on surface retrofit, the machined registration accuracy between region to be processed Directly affect the continuity between pattern.For this purpose, the machined zone boundary detection technique based on image-recognizing method need to be studied, if Count zone map to be processed correction transformation algorithm, complete the accurate matching with machined region, realize pattern in splicing system It makes.Working position video image acquisition methods are designed, the machined zone boundary detection technique based on image-recognizing method is studied, It proposes pattern to be processed and machined pattern registration method, and then calculates rotation, translation according to the boundary information of pattern to be processed With the correction transformation parameter of the operations such as scaling, propose that pattern to be processed carries out correction transform process method, completion laser machined Being manufactured in splicing in journey.
For those skilled in the art, above-described embodiment is merely a preferred embodiment of the present invention, and should not be understood as to this hair The limitation of bright the scope of the patents, under the premise of not departing from design of the invention, several improvement for making, substitution belong to this hair Bright protection scope.

Claims (3)

1.一种飞秒激光复杂构件表面加工制造方法,对复杂构件进行表面加工,具体包括:采用复杂构件模型重构和表面加工图案拼接算法,根据激光加工区域面积和焦深,设定约束条件和区域生长算法,划分加工区域,并对区域边界进行简化处理得到加工区域;1. A femtosecond laser surface processing and manufacturing method for complex components, which performs surface processing on complex components, specifically including: using complex component model reconstruction and surface processing pattern splicing algorithms, and setting constraints according to the area and focal depth of the laser processing area. And the region growing algorithm, divide the processing area, and simplify the area boundary to obtain the processing area; 对组成加工图案图元种类及布局特点提取关键特征,根据周期性和非周期性布局的过程,设计拼接算法使得加工图案自动快速地在复杂构件表面进行布局;Extract key features from the types of primitives and layout characteristics that make up the processing pattern, and design a splicing algorithm according to the process of periodic and aperiodic layout, so that the processing pattern can be automatically and quickly laid out on the surface of complex components; 采用加工区域划分和图案分割算法,设置加工图案中图元的种类和组合方式,求得图元与加工区域边界的交点并归类子图案到对应的加工区域;Using the processing area division and pattern segmentation algorithm, set the type and combination of primitives in the processing pattern, obtain the intersection of the primitive and the boundary of the processing area, and classify the sub-patterns into the corresponding processing areas; 采用加工图案实时检测和在线拼接制造技术,通过设置和安装高精度CCD 摄像机获得加工部位的视频图像,基于图像处理算法实时识别已加工图案的边界,进而根据待加工图案边界信息来预判两幅加工图案的配准误差,获取所需矫正变换参数,实现激光加工过程中的在线拼接制造;Using real-time detection of processing patterns and online splicing manufacturing technology, video images of processing parts are obtained by setting and installing high-precision CCD cameras, and the boundaries of processed patterns are identified in real time based on image processing algorithms, and then two images are pre-judged based on the boundary information of the pattern to be processed. The registration error of the processing pattern is obtained, the required correction transformation parameters are obtained, and the online splicing manufacturing in the laser processing process is realized; 所述复杂构件模型重构和表面加工图案拼接算法包括:The complex component model reconstruction and surface processing pattern stitching algorithms include: 根据各类复杂构件模型法向量错误规律,得到复杂构件拓扑检测算法,根据拓扑缺陷类型判定方法和插补算法处理拓扑缺陷,重建构件表面图形;According to the normal vector error law of various complex component models, the topology detection algorithm of complex components is obtained, the topological defects are processed according to the determination method of topological defect types and the interpolation algorithm, and the surface graphics of components are reconstructed; 根据不同图元种类及布局特点,生成其包络外轮廓,通过上述包络外轮廓提取复杂构件表面的加工图案周期性和非周期性布局的过程和特点;According to different types of primitives and layout characteristics, the outer contour of its envelope is generated, and the process and characteristics of the periodic and aperiodic layout of the machining pattern on the surface of the complex component are extracted through the above envelope outer contour; 所述加工区域划分和图案分割算法包括:The processing area division and pattern segmentation algorithms include: 基于单次加工区域面积参数和焦深参数,构建复杂构件的三维形体数据,设计区域生长算法,搜索符合约束条件的复杂构件的待加工表面上相邻三角面片,得到表面图案加工区域划分算法;Based on the area parameters and focal depth parameters of the single machining area, construct the 3D shape data of the complex component, design the area growth algorithm, search for the adjacent triangular patches on the surface to be machined of the complex component that meets the constraints, and obtain the surface pattern machining area division algorithm ; 由加工图案中图元种类及组合方法,根据加工区域的划分空间,得到完整图案沿不同加工区域的图形分割算法。From the types and combination methods of primitives in the processing pattern, and according to the division space of the processing area, the graphics segmentation algorithm of the complete pattern along different processing areas is obtained. 2.根据权利要求1所述的飞秒激光复杂构件表面加工制造方法,所述待加工图案边界信息通过基于相邻区域拓扑连续性、周期和非周期布局规律、加工图案的图元特点、高精度摄像与图像处理基础算法构建。2. The femtosecond laser complex surface processing and manufacturing method for a complex component according to claim 1, wherein the boundary information of the pattern to be processed is determined by the topological continuity, periodic and aperiodic layout rules of adjacent areas, the primitive characteristics of the processing pattern, the high Construction of basic algorithms for precision photography and image processing. 3.根据权利要求1所述的飞秒激光复杂构件表面加工制造方法,所述加工图案实时检测和在线拼接制造技术包括:由加工部位视频图像获取方法,基于图像识别方法的已加工区域边界检测技术,通过待加工图案与已加工图案配准,依据待加工图案的边界信息计算旋转、平移与缩放等操作的矫正变换参数,对待加工图案进行矫正变换处理,完成激光加工过程中的在线拼接制造。3. The femtosecond laser complex surface processing and manufacturing method according to claim 1, the processing pattern real-time detection and online splicing manufacturing technology include: a method for acquiring a video image of a processing part, a processing area boundary detection based on an image recognition method Technology, through the registration of the pattern to be processed and the processed pattern, according to the boundary information of the pattern to be processed, the correction and transformation parameters of operations such as rotation, translation and scaling are calculated, and the pattern to be processed is corrected and transformed to complete the online splicing in the laser processing process. .
CN201810131341.0A 2018-02-09 2018-02-09 Large-area manufacturing method of femtosecond laser complex component Active CN108320268B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810131341.0A CN108320268B (en) 2018-02-09 2018-02-09 Large-area manufacturing method of femtosecond laser complex component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810131341.0A CN108320268B (en) 2018-02-09 2018-02-09 Large-area manufacturing method of femtosecond laser complex component

Publications (2)

Publication Number Publication Date
CN108320268A CN108320268A (en) 2018-07-24
CN108320268B true CN108320268B (en) 2019-05-28

Family

ID=62902367

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810131341.0A Active CN108320268B (en) 2018-02-09 2018-02-09 Large-area manufacturing method of femtosecond laser complex component

Country Status (1)

Country Link
CN (1) CN108320268B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109760305B (en) * 2019-02-19 2020-12-11 杭州志英科技有限公司 Femtosecond laser-based large-size 3D micro-nano printing control method, model slicing method and device
CN110548999A (en) * 2019-08-29 2019-12-10 河南大学 Vertical laser marking equipment and marking method based on the equipment
CN110834154A (en) * 2019-11-29 2020-02-25 中国航发沈阳黎明航空发动机有限责任公司 I-shaped rib laser photoetching method
CN113296364B (en) * 2020-02-24 2022-07-26 苏州苏大维格科技集团股份有限公司 Lithography control method, device and storage medium
CN112289171B (en) * 2020-09-30 2022-09-27 北京德弦科技有限公司 A method and device for data identification processing, reading and detection of transparent medium
CN112427801B (en) * 2020-11-25 2022-08-30 西安中科微精光子科技股份有限公司 Laser processing method and device based on intersection point search and computer storage medium
CN115003446B (en) * 2020-12-23 2024-11-29 深圳市创客工场科技有限公司 Processing method, processing device, computer-readable storage medium, and electronic apparatus
CN113020428B (en) * 2021-03-24 2022-06-28 北京理工大学 Progressive die machining monitoring method, device, equipment and storage medium
CN113298076B (en) * 2021-06-18 2022-08-26 蓝思智能机器人(长沙)有限公司 Method, device, equipment and medium for collecting correction data of plane processing equipment
CN114769898B (en) * 2022-03-11 2024-06-07 大族激光科技产业集团股份有限公司 Laser processing control method, device and readable storage medium
CN114535825B (en) * 2022-04-28 2022-07-12 安普森智能科技(江苏)有限公司 Laser marking vehicle identification code system based on manipulator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101125392B (en) * 2006-08-14 2010-06-23 日产自动车株式会社 Laser working apparatus and method of controlling laser working apparatus
CN102828604A (en) * 2012-09-18 2012-12-19 江苏肯帝亚木业有限公司 Process method for manufacturing block floor
CN206402330U (en) * 2015-12-17 2017-08-11 耐克创新有限合伙公司 Image mosaic and manufacture system
CN107243697A (en) * 2017-07-17 2017-10-13 北京理工大学 A kind of femtosecond laser without mask manufactures super-hydrophobic and anti-reflecting surface method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002086576A (en) * 2000-07-13 2002-03-26 Hitachi Ltd How to provide 3D objects

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101125392B (en) * 2006-08-14 2010-06-23 日产自动车株式会社 Laser working apparatus and method of controlling laser working apparatus
CN102828604A (en) * 2012-09-18 2012-12-19 江苏肯帝亚木业有限公司 Process method for manufacturing block floor
CN206402330U (en) * 2015-12-17 2017-08-11 耐克创新有限合伙公司 Image mosaic and manufacture system
CN107243697A (en) * 2017-07-17 2017-10-13 北京理工大学 A kind of femtosecond laser without mask manufactures super-hydrophobic and anti-reflecting surface method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
一种大尺寸环形薄壁零件激光刻型新方法;滕志强 等;《机械设计与制造》;20161231(第12期);第177-183页 *

Also Published As

Publication number Publication date
CN108320268A (en) 2018-07-24

Similar Documents

Publication Publication Date Title
CN108320268B (en) Large-area manufacturing method of femtosecond laser complex component
DE102019216315B4 (en) Processing condition adjustment device and 3D laser processing system
CN106583949B (en) The processing method of the low damage of the high whirlpool hollow blade air film hole of aero-engine monocrystalline
CN105855722B (en) The processing method of curved surface part superficial objects figure based on laser polarization system
US20150129565A1 (en) Method and device for processing a workpiece using laser radiation
Nasrollahi et al. Laser drilling with a top-hat beam of micro-scale high aspect ratio holes in silicon nitride
CN105127604A (en) Laser processing system and method
O'Hana et al. Laser surface colouring of titanium for contemporary jewellery
CN105904107A (en) Mobile robot laser marking system and laser marking method
CN108717718A (en) The method of measurement Combustion three-dimensional structure spatial distribution based on tomography
CN109097797A (en) Metal additive manufacturing device and method based on laser local electroplating
CN112496531B (en) An integrated femtosecond laser marking method based on space shaping
CN101480757A (en) Micro-fine processing system of femtosecond laser for material surface modification
US11313971B1 (en) Three-dimensional imaging system and method
JP2013173150A (en) Laser beam machining device and laser beam machining method
Bamoto et al. Autonomous parameter optimization for femtosecond laser micro-drilling
Grigor'yants et al. Laser precision microprocessing of materials
Kumar et al. Introduction to optics and laser-based manufacturing technologies
US11117222B2 (en) Method and device for processing cooling hole on workpiece with laser
CN114137902B (en) Control method and device of laser ablation equipment and computer readable storage medium
Holder et al. High-precision laser ablation using OCT closed-loop control
CN114970632B (en) Pollutant removal method and device based on multi-pulse laser
CN115813546A (en) Laser emitting device and laser beauty instrument
CN204893208U (en) Laser machining system
Abdullah et al. Roundness error evaluation of cold embossed hole based on profile measurement technique

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant