CN108305846B - 一种硅片上料/下料传输系统及其工作方法 - Google Patents
一种硅片上料/下料传输系统及其工作方法 Download PDFInfo
- Publication number
- CN108305846B CN108305846B CN201710021386.8A CN201710021386A CN108305846B CN 108305846 B CN108305846 B CN 108305846B CN 201710021386 A CN201710021386 A CN 201710021386A CN 108305846 B CN108305846 B CN 108305846B
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- tray
- silicon
- flower
- feeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 206
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 202
- 239000010703 silicon Substances 0.000 title claims abstract description 202
- 238000000034 method Methods 0.000 title claims description 38
- 230000005540 biological transmission Effects 0.000 title claims description 13
- 238000007599 discharging Methods 0.000 title 1
- 235000012431 wafers Nutrition 0.000 claims abstract description 202
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000011017 operating method Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000009776 industrial production Methods 0.000 description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710021386.8A CN108305846B (zh) | 2017-01-12 | 2017-01-12 | 一种硅片上料/下料传输系统及其工作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710021386.8A CN108305846B (zh) | 2017-01-12 | 2017-01-12 | 一种硅片上料/下料传输系统及其工作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108305846A CN108305846A (zh) | 2018-07-20 |
CN108305846B true CN108305846B (zh) | 2020-06-19 |
Family
ID=62872258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710021386.8A Active CN108305846B (zh) | 2017-01-12 | 2017-01-12 | 一种硅片上料/下料传输系统及其工作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108305846B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109065492A (zh) * | 2018-10-15 | 2018-12-21 | 深圳市捷佳伟创新能源装备股份有限公司 | 一种生产线竖向上料系统及硅片传输系统 |
CN111169979B (zh) * | 2019-12-10 | 2021-06-15 | 苏州市创怡盛实业有限公司 | 机械手搬运方法以及系统 |
CN111805417A (zh) * | 2020-06-03 | 2020-10-23 | 浙江博蓝特半导体科技股份有限公司 | 晶片研磨生产用上下料装置及晶片批量取放方法 |
CN115020316A (zh) * | 2022-07-27 | 2022-09-06 | 江苏和瑞鑫智能科技有限公司 | 一种硅片的安全运输装置及其工作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101764076A (zh) * | 2008-10-30 | 2010-06-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 半导体加工设备及其传输系统及基片的传输方法 |
CN104409405A (zh) * | 2014-11-18 | 2015-03-11 | 中国电子科技集团公司第四十八研究所 | 用平板式pecvd制备hit太阳电池的传片机构及方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002059961A1 (fr) * | 2001-01-24 | 2002-08-01 | Takehide Hayashi | Systeme de transfert d'une seule tranche en semi-conducteur et unite de transfert associee |
JP4761907B2 (ja) * | 2005-09-28 | 2011-08-31 | 株式会社Sokudo | 基板処理装置 |
-
2017
- 2017-01-12 CN CN201710021386.8A patent/CN108305846B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101764076A (zh) * | 2008-10-30 | 2010-06-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 半导体加工设备及其传输系统及基片的传输方法 |
CN104409405A (zh) * | 2014-11-18 | 2015-03-11 | 中国电子科技集团公司第四十八研究所 | 用平板式pecvd制备hit太阳电池的传片机构及方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108305846A (zh) | 2018-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102290486B (zh) | 用于加载或卸载基板的基板处理装置 | |
CN108305846B (zh) | 一种硅片上料/下料传输系统及其工作方法 | |
CN202076306U (zh) | 一种全自动硅片翻转叠双片插片机 | |
KR101027050B1 (ko) | 태양전지용 웨이퍼의 로딩 및 언로딩 장치 | |
JP2013214739A (ja) | 金属箔から半導体チップを剥離する方法 | |
JP2009049232A (ja) | 基板処理装置 | |
TW201524717A (zh) | 具有可變機械手的四臂搬運機器人 | |
JP6621771B2 (ja) | 半導体製造装置および半導体装置の製造方法 | |
KR20130043371A (ko) | 다이 본딩 장치 | |
TWI462212B (zh) | Processing system and processing methods | |
CN110660723B (zh) | 一种机械手、键合腔体、晶圆键合系统及键合方法 | |
CN106653667A (zh) | 一种片材装卸设备、其控制方法及太阳能电池生产线 | |
TWI604557B (zh) | 晶圓片架的取放片裝置 | |
KR20100033282A (ko) | 태양전지용 웨이퍼의 로딩 및 언로딩 장치 | |
CN103268850B (zh) | 一种太阳能电池片离子注入机 | |
WO2024179398A1 (zh) | 上下料系统、载料舟、吸盘组件及装载基片的方法 | |
CN111540812A (zh) | 一种太阳能电池生产设备配套的硅片自动化上下料系统 | |
CN101764050A (zh) | 半导体基板加工设备 | |
TW201444756A (zh) | 兩段式太陽能晶圓水平取放系統及其取放方法 | |
KR101014747B1 (ko) | 태양전지용 웨이퍼의 로딩 및 언로딩 장치 | |
CN102332418A (zh) | 半导体晶圆运送系统 | |
CN111312642A (zh) | 一种硅片抽放定位装置及转送系统 | |
CN221758807U (zh) | 一种玻璃载具下料装置 | |
CN104835767B (zh) | 湿法刻蚀机及采用该刻蚀机进行刻蚀的方法 | |
CN105460599A (zh) | 薄膜沉积设备及其基材传输装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 201306 plant 3, Lane 2699, Jiangshan Road, Lingang xinpian District, China (Shanghai) pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: Ideal Wanlihui Semiconductor Equipment (Shanghai) Co.,Ltd. Address before: 201203 No.1, Curie Road, Zhangjiang hi tech, Pudong New Area, Shanghai Patentee before: SHANGHAI LIXIANG WANLIHUI FILM EQUIPMENT Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20180720 Assignee: HEFEI IDEA TECHNOLOGIES CO.,LTD. Assignor: Ideal Wanlihui Semiconductor Equipment (Shanghai) Co.,Ltd. Contract record no.: X2023980036582 Denomination of invention: A silicon wafer loading/unloading transmission system and its working method Granted publication date: 20200619 License type: Common License Record date: 20230614 |
|
EE01 | Entry into force of recordation of patent licensing contract |