CN108303195A - A kind of binding type temperature sensor - Google Patents
A kind of binding type temperature sensor Download PDFInfo
- Publication number
- CN108303195A CN108303195A CN201810236506.0A CN201810236506A CN108303195A CN 108303195 A CN108303195 A CN 108303195A CN 201810236506 A CN201810236506 A CN 201810236506A CN 108303195 A CN108303195 A CN 108303195A
- Authority
- CN
- China
- Prior art keywords
- conducting plate
- temperature sensor
- metal heat
- shell
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000010897 surface acoustic wave method Methods 0.000 claims description 3
- 229920006351 engineering plastic Polymers 0.000 claims description 2
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/22—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects
- G01K11/26—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects of resonant frequencies
- G01K11/265—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects of resonant frequencies using surface acoustic wave [SAW]
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention is a kind of binding type temperature sensor, is adopted the following technical scheme that：The temperature sensor includes metal heat-conducting plate, shell, SAW Temperature Sensors chip, inductance and antenna, the shell is located in metal heat-conducting plate, the SAW Temperature Sensors chip, inductance and antenna are arranged in metal heat-conducting plate and are located at enclosure, the metal heat-conducting plate is equipped with bundle hole, is connect metal heat-conducting plate with testee across bundle hole by high temperature resistant band.The present invention realizes effective connection with testee using binding mode, solves defective mounting existing for traditional tuning-fork-type fixed form, so that the temperature of testee is quickly introduced and give sensor sensor chip, improve measuring accuracy and response speed.
Description
Technical field
It is the present invention relates to temperature sensor field, more particularly to a kind of using the passive of SAW Temperature Sensors chip
Radio temperature sensor realizes the quick conduction of dut temperature by cluster.
Background technology
High-tension switch cabinet in power equipment is in During Process of Long-term Operation, the positions such as internal breaker and connection plug
It can cause to generate heat due to contact resistance is excessive because of manufacture, transport, the bad and aging of installation, if the temperature of these heating positions can not
Monitoring, cannot overhaul in time, then eventually results in the fire incident generation for burning switchgear.Therefore realize that temperature online is real-time
Monitoring becomes the important means for ensureing high-tension switch cabinet safe operation.
Traditional temp measuring system is for example infrared, optical fiber, active radio etc. exist in safety, stability, real-time etc.
Certain technological deficiency, high failure rate cannot meet requirement.
Traditional tuning-fork-type fixed form is suitble to various Power tabs, for that can not use the fixed occasion of fastening bolt can not
It uses, requirement cannot be met.
Invention content
The present invention provides a kind of binding type sensor and its quick conductive methods, are a kind of use surface acoustic wave temperature biographies
The passive wireless temperature sensor of sensor chip, solves the technological deficiency of traditional temp measuring system, and passive advantage makes the biography
Sensor can permanently be placed in a device, Maintenance free；Wireless advantage allow the sensor provide safe high pressure every
From characteristic.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：The temperature sensor includes metal heat-conducting plate,
Shell, SAW Temperature Sensors chip, inductance and antenna, the shell are located in metal heat-conducting plate, the sound table
Surface wave temperature sensor chip, inductance and antenna are arranged in metal heat-conducting plate and are located at enclosure, the metal heat-conducting
Plate is equipped with bundle hole, is connect metal heat-conducting plate with testee across bundle hole by high temperature resistant band.
Preferably, the shell is equipped with bundle hole, high temperature resistant band passes through bundle hole in metal heat-conducting plate, on shell
Bundle hole by shell, metal heat-conducting plate is bundled with testee.
Preferably, the both sides of the shell extend outwardly equipped with interconnecting piece, the interconnecting piece is equipped with bundle hole, described
The both sides of heat-conducting plate extend outwardly equipped with engaging portion, and the engaging portion is equipped with bundle hole, the bundle of the interconnecting piece and engaging portion
Hole Corresponding matching is tied up, high temperature resistant band passes through the bundle hole of the interconnecting piece and engaging portion.
Preferably, the high temperature resistant band includes taking the lead, it is band-like to prick item and around the latch for pricking a surrounding.
Preferably, being in an angle of 90 degrees between bundle item and the latch.
Preferably, the metal heat-conducting plate uses copper base.
Preferably, the SAW Temperature Sensors chip, inductance, antenna are welded in metal heat-conducting plate.
Preferably, the shell is heat-resistant fireproof engineering plastic materials shell.
Preferably, a bit of band of band rostral is without latch.It is convenient in this way across bundle hole, the latch and bundle
It ties up hole to offset, securely to install sensor, realizes quick conductive.
Preferably, the copper base is fabricated to different shapes according to application environment.
Compared with prior art, the invention has the advantages that：
The technical solution adopted by the present invention is that the temperature of testee, SAW Temperature Sensors are conducted by heat-conducting plate
Chip is used for perceiving the temperature of testee, and capturing electromagnetic wave by helical antenna is used as work capacity, while returning to carrying temperature
The electromagnetic wave of information is spent, and temperature sensor is made through the above way, solving traditional temperature sensor cannot gather around simultaneously
There is passive, wireless characteristic.
The present invention realizes effective connection with testee using binding mode, solves traditional tuning-fork-type fixed form and deposits
Defective mounting, so that the temperature of testee is quickly introduced and give sensor sensor chip, realize dut temperature quickly conduct, carry
High measuring accuracy and response speed.
Description of the drawings
The invention will be further described with reference to the accompanying drawings and detailed description：
Fig. 1 is the general structure schematic diagram of the present invention；
Fig. 2 is shell mechanism schematic diagram；
Fig. 3 is metal heat-conducting plate mounting structure schematic diagram；
Fig. 4 is SAW Temperature Sensors functional block diagram.
Specific implementation mode
The present invention is illustrated with reference to Fig. 1 to Fig. 4, a kind of binding type sensor, including one be fixed on testee
On heat-conducting plate 1, SAW Temperature Sensors chip 3, inductance 4, antenna 5, shell 2 are installed on the heat-conducting plate.It is described outer
The inside of shell is disposed with antenna, SAW Temperature Sensors chip, inductance, heat-conducting plate from top to bottom；The shell 2
Both sides extend outwardly equipped with interconnecting piece 21,22, and the interconnecting piece is equipped with bundle hole 211,221, and the both sides of the heat-conducting plate are equal
Extend outwardly and be equipped with engaging portion 11,12, the engaging portion is equipped with bundle hole 111,121, the binding of the interconnecting piece and engaging portion
Hole Corresponding matching, high temperature resistant band (diagram is not shown, using routine) pass through the bundle hole of the interconnecting piece and engaging portion；I.e.
The bundle hole 111,121 is corresponded with bundle hole 211,221 and is matched, and is passed through for high temperature resistant band as bundle hole.
The band is high-temperature silica gel band；It is illustrated as marking, using conventional silica gel band, it is preferable that described
Band includes taking the lead, band-like to prick item and around the latch for pricking a surrounding；It is in an angle of 90 degrees between bundle item and the latch.It is described to take the lead
The a bit of band in side is without latch.The latch is fastened in bundle hole, in this way, sensor connect with testee it is closer securely,
It is not easy to loosen offset；The a bit of no latch of band rostral, in this way, band bundle hole is facilitated to bundle.
The heat-conducting plate is metal heat-conducting plate, and the heat-conducting plate is using the high copper base of thermal coefficient；The surface acoustic wave temperature
Degree sensor chip, inductance, antenna are welded on copper base；The shell is heat-resisting material.
Silica gel band used in the sensor tenses after the bundle hole at sensor both ends, and latch offsets with bundle hole,
To which sensor closely to be connect with testee, realize that dut temperature quickly conducts.
Metal heat-conducting plate, SAW Temperature Sensors chip, inductance, antenna, shell are incorporated into through the above way
Temperature sensor is made together, passive, wireless characteristic cannot be possessed simultaneously by solving conventional temperature sensor, meet high-precision
The demand that temperature measures.
Effective connection with testee is realized by using binding mode, solves traditional tuning-fork-type fixed form and exists
Defective mounting, by binding can effectively be connect with testee, realize dut temperature quickly conduct.
The present invention have it is small, light-weight, processability of product structure is good, be suitable for high-tension switch cabinet, transformer, high-voltage electricity
The monitoring temperature of the high voltage electric equipments such as cable, motor.
Claims (10)
1. a kind of binding type temperature sensor, it is characterised in that：The temperature sensor includes metal heat-conducting plate, shell, sound surface
Wave temperature sensor chip, inductance and antenna, the shell are located in metal heat-conducting plate, the surface acoustic wave temperature sensing
Device chip, inductance and antenna are arranged in metal heat-conducting plate and are located at enclosure, and the metal heat-conducting plate is equipped with binding
Metal heat-conducting plate is connect by hole by high temperature resistant band across bundle hole with testee.
2. binding type temperature sensor according to claim 1, it is characterised in that：The shell is equipped with bundle hole, resistance to
High temperature band passes through the bundle hole in metal heat-conducting plate, the bundle hole on shell by shell, and metal heat-conducting plate is tied with testee
It is held together.
3. binding type temperature sensor according to claim 1, it is characterised in that：The both sides of the shell are to extension
It stretches and is equipped with interconnecting piece, the interconnecting piece is equipped with bundle hole, and the both sides of the heat-conducting plate extend outwardly equipped with engaging portion, the knot
Conjunction portion be equipped with bundle hole, the bundle hole Corresponding matching of the interconnecting piece and engaging portion, high temperature resistant band pass through the interconnecting piece with
The bundle hole of engaging portion.
4. binding type temperature sensor according to claim 1, it is characterised in that：The high temperature resistant band is pricked for silica gel
Band.
5. binding type temperature sensor according to claim 4, it is characterised in that：The high temperature resistant band includes band
Head, it is band-like to prick item and around the latch for pricking a surrounding；It is in an angle of 90 degrees between bundle item and the latch.
6. binding type temperature sensor according to claim 1, it is characterised in that：The metal heat-conducting plate is using copper-based
Plate.
7. binding type temperature sensor according to claim 1, it is characterised in that：The SAW Temperature Sensors
Chip, inductance, antenna are welded in metal heat-conducting plate.
8. binding type temperature sensor according to claim 1, it is characterised in that：The shell is heat-resistant fireproof work
Engineering plastics material envelope.
9. binding type temperature sensor according to claim 5, it is characterised in that：The a bit of band of band rostral without
Latch.
10. binding type temperature sensor according to claim 1, it is characterised in that：The copper base is according to using ring
Border is fabricated to different shapes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810236506.0A CN108303195A (en) | 2018-03-21 | 2018-03-21 | A kind of binding type temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810236506.0A CN108303195A (en) | 2018-03-21 | 2018-03-21 | A kind of binding type temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108303195A true CN108303195A (en) | 2018-07-20 |
Family
ID=62850310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810236506.0A Pending CN108303195A (en) | 2018-03-21 | 2018-03-21 | A kind of binding type temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108303195A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108692824A (en) * | 2018-03-21 | 2018-10-23 | 中电科技德清华莹电子有限公司 | A kind of passive wireless acoustic surface wave temperature sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203534718U (en) * | 2013-11-07 | 2014-04-09 | 成都赛康信息技术有限责任公司 | Binding type passive wireless temperature measuring device |
| CN203551138U (en) * | 2013-04-22 | 2014-04-16 | 江苏声立传感技术有限公司 | Surface acoustic wave wireless temperature sensor for measuring power switch cabinet static contact temperature |
-
2018
- 2018-03-21 CN CN201810236506.0A patent/CN108303195A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203551138U (en) * | 2013-04-22 | 2014-04-16 | 江苏声立传感技术有限公司 | Surface acoustic wave wireless temperature sensor for measuring power switch cabinet static contact temperature |
| CN203534718U (en) * | 2013-11-07 | 2014-04-09 | 成都赛康信息技术有限责任公司 | Binding type passive wireless temperature measuring device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108692824A (en) * | 2018-03-21 | 2018-10-23 | 中电科技德清华莹电子有限公司 | A kind of passive wireless acoustic surface wave temperature sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104568016A (en) | Cable joint health diagnosis and heat fault pre-warning system | |
| CN102879126A (en) | Wireless temperature sensing system for switch cabinet equipment | |
| CN202419024U (en) | Heat tracing composite pipe | |
| CN109813464A (en) | Overhead transmission line wireless temperature-measuring terminal | |
| CN108692824A (en) | A kind of passive wireless acoustic surface wave temperature sensor | |
| CN108303195A (en) | A kind of binding type temperature sensor | |
| CN206313400U (en) | A kind of high security bus duct connector | |
| CN205940773U (en) | Wireless temperature measurement system of reactor | |
| CN207923317U (en) | A kind of passive wireless acoustic surface wave temperature sensor | |
| CN204346508U (en) | Cable splice Gernral Check-up and hot fault warning system | |
| CN106768426B (en) | Cathode temperature measurement sensor of aluminum electrolysis cell and installation and use method thereof | |
| CN207763838U (en) | Passive and wireless on-line temperature monitoring instrument | |
| CN211553119U (en) | Temperature sensing device and looped netowrk cabinet temperature monitoring system | |
| CN107941375A (en) | Temperature of high-tension switch cabinet exception intelligent monitoring method and system | |
| CN207798997U (en) | A kind of cable fire-fighting on-line monitoring system based on gas sensor | |
| CN111307310A (en) | A temperature sensing device and a temperature monitoring system for a ring network cabinet | |
| CN110031120A (en) | Bus temperature measuring equipment | |
| CN206575038U (en) | A kind of regulator cubicle early warning protector | |
| CN201348810Y (en) | Wire and cable terminal overheating monitoring device | |
| CN205228668U (en) | Integrated wireless temperature measuring device of electric wire netting contact | |
| CN208399024U (en) | A kind of wireless temperature measuring device | |
| CN202869678U (en) | High-voltage wireless temperature measuring equipment and system including the equipment | |
| CN209802525U (en) | An RFID-based circuit breaker temperature monitoring device | |
| CN217111235U (en) | Online temperature measuring device for bus copper bar of yellow phosphorus electric furnace transformer | |
| CN201819751U (en) | Combined thermocouple |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180720 |