CN108300980B - X-ray zone plate preparation system - Google Patents
X-ray zone plate preparation system Download PDFInfo
- Publication number
- CN108300980B CN108300980B CN201810028022.7A CN201810028022A CN108300980B CN 108300980 B CN108300980 B CN 108300980B CN 201810028022 A CN201810028022 A CN 201810028022A CN 108300980 B CN108300980 B CN 108300980B
- Authority
- CN
- China
- Prior art keywords
- chamber
- precursor
- annular end
- pipeline
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
技术领域technical field
本发明涉及原子层沉积技术领域,尤其涉及一种X射线波带片制备系统。The invention relates to the technical field of atomic layer deposition, in particular to an X-ray zone plate preparation system.
背景技术Background technique
原子层沉积(ALD)是一种可以实现单原子层生长的薄膜制备技术,其自限制 性和互补性使得该技术对薄膜的成分和厚度具有出色的控制能力,所制备的薄膜 保形性好、纯度高且均匀,已经被广泛应用到各个领域。Atomic layer deposition (ALD) is a thin film preparation technology that can achieve single atomic layer growth. Its self-limitation and complementarity allow this technology to have excellent control over the composition and thickness of the thin film, and the prepared thin film has good conformality. , high purity and uniform, has been widely used in various fields.
目前,采用原子层沉积技术制备X射线波带片,是提高X射线波带片分辨 率和衍射效率的有效方法。X射线波带片是X射线波段的一种光学元件,具有对 X射线的色散、聚焦、成像等功能,传统制备方法主要有激光全息法、电子束光 刻法、溅射切片法等,但这些传统的制作手段只能够使波带片最外环的宽度在 20nm左右,同时,激光全息法、电子束光刻法在制作波带片时长径比是受限的, 而溅射切片法很难精确控制波带片每一环的宽度。因此,传统的方法很难实现高 分辨率和高衍射效率波带片的制作。At present, the preparation of X-ray zone plates by atomic layer deposition technology is an effective method to improve the resolution and diffraction efficiency of X-ray zone plates. The X-ray zone plate is an optical element in the X-ray band, which has the functions of dispersion, focusing and imaging of X-rays. The traditional preparation methods mainly include laser holography, electron beam lithography, sputtering sectioning, etc. These traditional manufacturing methods can only make the width of the outermost ring of the zone plate about 20nm. At the same time, the aspect ratio of the laser holography method and the electron beam lithography method is limited in the production of the zone plate, and the sputtering slicing method is very difficult. It is difficult to precisely control the width of each ring of the zone plate. Therefore, it is difficult to realize the fabrication of high-resolution and high-diffraction-efficiency zone plates by traditional methods.
利用ALD技术制备波带片,可以精确的控制波带片每一环的宽度,且厚度 均匀性高,同时可以将最外环的宽度控制在10nm以下,实现亚10nm的高分辨 率。而采用FIB进行的切片和抛光可以得到任意的长径比,使波带片具有高的衍 射效率。Using ALD technology to prepare the zone plate can precisely control the width of each ring of the zone plate, and the thickness uniformity is high. At the same time, the width of the outermost ring can be controlled below 10nm, and the sub-10nm high resolution can be achieved. However, slicing and polishing with FIB can obtain any aspect ratio, so that the zone plate has high diffraction efficiency.
如图1所示,在传统ALD的设备腔室1中,一般在加热盘2之上会设 有匀热盘3。这种传统的ALD设备腔室往往只能对片状的衬底进行加热,当目 标衬底为细丝状时,这种ALD设备腔室并没有固定金属细丝的夹具,不能实现 细丝状衬底上材料的生长。As shown in Fig. 1, in the
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种X射线波带片制备系统,可在细丝状衬底上进行 波带片材料的生长,使得加工效率大大提高。The object of the present invention is to provide an X-ray zone plate preparation system, which can grow the zone plate material on the filamentous substrate, so that the processing efficiency is greatly improved.
为了解决上述技术问题,本发明提供了一种X射线波带片制备系统,所述系 统包括:腔室;第一前驱体通入管路,所述第一前驱体通入管路与所述腔室的一 端连通,用于将第一前驱体输送进所述腔室;第二前驱体通入管路,所述第二前 驱体通入管路与所述腔室的一端连通,用于将第二前驱体输送进所述腔室;夹具, 所述夹具设置在所述腔室内,用于固定柱状细丝形的衬底;马弗炉,所述马弗炉 包裹着所述腔室,用于加热所述腔室;抽气管路,所述抽气管路的一端与所述腔 室的另一端连通;真空泵,所述真空泵与所述抽气管路的另一端相连,所述真空 泵通过所述抽气管路将所述腔室内抽为真空。In order to solve the above technical problems, the present invention provides an X-ray zone plate preparation system, the system includes: a chamber; a first precursor inlet pipeline, the first precursor inlet pipeline and the chamber One end of the first precursor is connected to the chamber for transporting the first precursor into the chamber; the second precursor is introduced into the pipeline, and the second precursor inlet pipeline is communicated with one end of the chamber and is used to transfer the second precursor The body is transported into the chamber; a jig, which is arranged in the chamber, is used for fixing the substrate in the shape of a columnar filament; a muffle furnace, which wraps the chamber and is used for heating the chamber; an air extraction pipeline, one end of the air extraction pipeline is connected to the other end of the chamber; a vacuum pump, the vacuum pump is connected to the other end of the air extraction pipeline, and the vacuum pump passes through the air extraction pipeline The circuit draws a vacuum inside the chamber.
进一步地,所述夹具包括:空心圆柱架,所述空心圆柱架包括第一环形端、 第二环形端和连接杆,所述第一环形端和所述第二环形端相对平行设置,所述第 一环形端和所述第二环形端分别固定在所述连接杆的两端;所述空心圆柱架的轴 向与所述第一前驱体和所述第二前驱体气流的方向一致;若干挂钩,若干所述挂 钩对称设置在所述第一环形端和所述第二环形端上;所述柱状细丝形的衬底两端 分别固定在一对对称的所述挂钩上。Further, the clamp includes: a hollow cylindrical frame, the hollow cylindrical frame includes a first annular end, a second annular end and a connecting rod, the first annular end and the second annular end are relatively parallel to each other, the The first annular end and the second annular end are respectively fixed on both ends of the connecting rod; the axial direction of the hollow cylindrical frame is consistent with the direction of the airflow of the first precursor and the second precursor; several The hooks are symmetrically arranged on the first annular end and the second annular end; the two ends of the cylindrical filament-shaped substrate are respectively fixed on a pair of symmetrical hooks.
进一步地,所述夹具的材质为不锈钢、铝、铜、钨中的一种。Further, the material of the clamp is one of stainless steel, aluminum, copper, and tungsten.
进一步地,所述腔室为柱状管式结构,所述第一前驱体和所述第二前驱体在 所述腔室内为单向直线流动,所述衬底的纵向沿着所述第一前驱体和所述第二前 驱体气流的方向。Further, the chamber is a cylindrical tubular structure, the first precursor and the second precursor flow in a unidirectional straight line in the chamber, and the longitudinal direction of the substrate is along the first precursor body and the direction of the gas flow of the second precursor.
进一步地,所述腔室为石英管,所述石英管的管壁厚2-5mm,管长0.8-2m, 内径1-5cm。Further, the chamber is a quartz tube, the wall thickness of the quartz tube is 2-5 mm, the tube length is 0.8-2 m, and the inner diameter is 1-5 cm.
进一步地,所述第一环形端和所述第二环形端的外径尺寸比所述石英管内径 尺寸小5mm。Further, the outer diameter of the first annular end and the second annular end is 5mm smaller than the inner diameter of the quartz tube.
进一步地,所述马弗炉的加热温度为50-1200℃。Further, the heating temperature of the muffle furnace is 50-1200°C.
进一步地,所述系统还包括:真空规,所述真空规设置在所述抽气管路上, 用于实时测量所述腔室内的真空度。Further, the system further includes: a vacuum gauge, which is arranged on the air extraction pipeline and is used to measure the vacuum degree in the chamber in real time.
进一步地,所述夹具的材质为不锈钢、铝、铜、钨中的一种。Further, the material of the clamp is one of stainless steel, aluminum, copper, and tungsten.
本发明提供的技术方案,具有如下技术效果或优点:The technical scheme provided by the present invention has the following technical effects or advantages:
1、本发明采用夹具固定柱状细丝形的衬底,可以实现在此形状的衬底上实 现两种波带片材料交替生长;1, the present invention adopts a clamp to fix the substrate of the columnar filament shape, and can realize the alternate growth of two kinds of zone plate materials on the substrate of this shape;
2、本发明的腔室采用柱状管式结构,两种前驱体的前驱体通入管路设置柱 状管式结构的一端,实现前驱体气流的单向流动,柱状细丝形衬底的纵向沿着前 驱体气流的方向,缩短了工艺吹扫时间;2. The chamber of the present invention adopts a columnar tubular structure, and one end of the columnar tubular structure is set in the precursor inlet pipeline of the two precursors to realize the unidirectional flow of the precursor gas flow. The longitudinal direction of the columnar filament substrate is along the The direction of the precursor gas flow shortens the process purge time;
3、本发明中采用马弗炉包裹腔室,维持衬底的恒定温度;3. In the present invention, a muffle furnace is used to wrap the chamber to maintain a constant temperature of the substrate;
4、本发明中夹具的材质采用不锈钢、铝、铜、钨等,导热性好,热膨胀系 数小,有利于对固定在夹具上的衬底进行热传导。4. The material of the fixture in the present invention adopts stainless steel, aluminum, copper, tungsten, etc., which has good thermal conductivity and small thermal expansion coefficient, which is beneficial to conduct heat conduction to the substrate fixed on the fixture.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例 或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的 附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳 动的前提下,还可以根据提供的附图获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.
图1为本发明实施例提供的一种X射线波带片制备系统的结构示意图。FIG. 1 is a schematic structural diagram of an X-ray zone plate preparation system according to an embodiment of the present invention.
图2为本发明实施例提供的一种金属丝夹具。FIG. 2 is a wire clamp provided by an embodiment of the present invention.
具体实施方式Detailed ways
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实 施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所 描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实 施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施 例,都属于本发明保护的范围。In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work, all belong to the protection scope of the present invention.
如图1所示,本发明实施例提供一种X射线波带片制备系统,所述系统包括: 腔室3;第一前驱体通入管路1,所述第一前驱体通入管路1与所述腔室3的一端连 通,用于将第一前驱体输送进所述腔室3;第二前驱体通入管路2,所述第二前驱 体通入管路2与所述腔室3的一端连通,用于将第二前驱体输送进所述腔室3;夹 具4,所述夹具4设置在所述腔室3内,用于固定柱状细丝形的衬底9;马弗炉5, 所述马弗炉5包裹着所述腔室3,用于加热所述腔室3;抽气管路6,所述抽气管路 6的一端与所述腔室3的另一端连通;真空泵8,所述真空泵8与所述抽气管路6的 另一端相连,所述真空泵8通过所述抽气管路6将所述腔室3内抽为真空。As shown in FIG. 1, an embodiment of the present invention provides an X-ray zone plate preparation system, the system includes: a
本实施例中,所述腔室3为柱状管式结构,所述第一前驱体和所述第二前驱 体在所述腔室3内为单向直线流动,所述衬底9的纵向沿着所述第一前驱体和所述 第二前驱体气流的方向。In this embodiment, the
本实施例中,如图2所示,所述夹具包括:空心圆柱架,所述空心圆柱架包 括第一环形端41、第二环形端42和连接杆43,所述第一环形端41和所述第二环形 端42相对平行设置,所述第一环形端41和所述第二环形端42分别固定在所述连接 杆43的两端;所述空心圆柱架的轴向与所述第一前驱体和所述第二前驱体气流的 方向一致;若干挂钩44,若干所述挂钩44对称设置在所述第一环形端41和所述第 二环形端42上;柱状细丝形的衬底9两端分别固定在一对对称的所述挂钩44上。In this embodiment, as shown in FIG. 2 , the clamp includes: a hollow cylindrical frame, the hollow cylindrical frame includes a first
在本实施例中,选择直径为30μm的钨丝作为衬底,钨丝两端分别在夹具4的 齿状结构上缠绕,并用Kapton胶带固定钨丝两端,钨丝纵向沿着前驱体气流的方 向。In this embodiment, a tungsten wire with a diameter of 30 μm is selected as the substrate, the two ends of the tungsten wire are wound on the toothed structure of the fixture 4 respectively, and Kapton tape is used to fix both ends of the tungsten wire, and the longitudinal direction of the tungsten wire is along the flow of the precursor airflow. direction.
本实施例中,所述夹具4的材质为不锈钢、铝、铜、钨等金属。本实施例优 选的是不锈钢。In this embodiment, the material of the clamp 4 is stainless steel, aluminum, copper, tungsten and other metals. Stainless steel is preferred in this embodiment.
本实施例中,所述腔室3为石英管,所述石英管的管壁厚2-5mm,管长0.8-2m, 内径1-5cm,耐高温可达1200℃。所述第一环形端41和所述第二环形端42的外径 尺寸比所述石英管内径尺寸小5mm。In this embodiment, the
本实施例中,所述马弗炉5的加热温度为50-1200℃。In this embodiment, the heating temperature of the muffle furnace 5 is 50-1200°C.
本实施例中,所述系统还包括:真空规7,所述真空规7设置在所述抽气管路 6上,用于实时测量所述腔室3内的真空度。In this embodiment, the system further includes: a
本发明实施例的工作过程如下:The working process of the embodiment of the present invention is as follows:
将多根钨丝通过夹具4固定在腔室3内,使得钨丝的纵向与前驱体流向一致; 开启真空泵8,通过真空规7实时测量腔室3内的真空度,当腔室内真空度达到要 求,向腔室3内通入前驱体。本发明实施例中沉积的两种波带片材料是薄膜叠层 材料,一种为X射线透过率较高的材料,诸如C、Al、Al2O3、Si3N4等,优选的是 氧化铝,另一种为X射线透过率较低的材料,诸如Ag、Cu、Ni、Ir、SiO2、Ta2O5、 HfO2等,优选的是HfO2、Ta2O5。所选的两种材料分别通过第一前驱体通入管路1 和第二前驱体通入管路2输送进入腔室3,由于所选的两种前驱体材料的工艺温度 为200℃,即需要作为衬底的钨丝的温度维持200℃的恒定温度;此时通过马弗 炉5来维持钨丝200℃的恒温,两种前驱体在钨丝衬底上交替生长波带片材料。A plurality of tungsten wires are fixed in the
本发明实施例中提供的一个或多个技术方案,至少具有如下技术效果或优点:One or more technical solutions provided in the embodiments of the present invention have at least the following technical effects or advantages:
1、本发明采用夹具固定多根柱状细丝形的衬底,可以实现在此形状的衬底 上实现两种波带片材料交替生长,并提高波带片的加工效率;1, the present invention adopts a fixture to fix the substrate of a plurality of columnar filaments, and can realize the alternate growth of two kinds of zone plate materials on the substrate of this shape, and improve the processing efficiency of the zone plate;
2、本发明的腔室采用柱状管式结构,两种前驱体的前驱体通入管路设置柱 状管式结构的一端,实现前驱体气流的单向流动,柱状细丝形衬底的纵向沿着前 驱体气流的方向,缩短了工艺吹扫时间;2. The chamber of the present invention adopts a columnar tubular structure, and one end of the columnar tubular structure is set in the precursor inlet pipeline of the two precursors to realize the unidirectional flow of the precursor gas flow. The longitudinal direction of the columnar filament substrate is along the The direction of the precursor gas flow shortens the process purge time;
3、本发明中采用马弗炉包裹腔室,维持衬底的恒定温度,精确控制薄膜的 生长厚度;3, in the present invention, adopt the muffle furnace to wrap the chamber, maintain the constant temperature of the substrate, and precisely control the growth thickness of the film;
4、本发明中夹具的材质采用不锈钢,导热性好,热膨胀系数小,有利于对 固定在夹具上的衬底进行热传导。4. The material of the fixture in the present invention adopts stainless steel, which has good thermal conductivity and small thermal expansion coefficient, which is beneficial to conduct heat conduction to the substrate fixed on the fixture.
尽管已描述了本发明的优选实施例,但本领域内的技术人员一旦得知了基本 创造性概念,则可对这些实施例作出另外的变更和修改。所以,所附权利要求意 欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。Although preferred embodiments of the present invention have been described, additional changes and modifications to these embodiments may occur to those skilled in the art once armed with the basic inventive concepts. Therefore, the appended claims are intended to be construed to include the preferred embodiment and all changes and modifications that fall within the scope of the present invention.
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明 的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等 同技术的范围之内,则本发明也意图包含这些改动和变型在内。It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Thus, provided that these modifications and variations of the present invention fall within the scope of the claims of the present invention and their technical equivalents, the present invention is also intended to include these modifications and variations.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810028022.7A CN108300980B (en) | 2018-01-11 | 2018-01-11 | X-ray zone plate preparation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810028022.7A CN108300980B (en) | 2018-01-11 | 2018-01-11 | X-ray zone plate preparation system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108300980A CN108300980A (en) | 2018-07-20 |
| CN108300980B true CN108300980B (en) | 2020-10-09 |
Family
ID=62868606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810028022.7A Active CN108300980B (en) | 2018-01-11 | 2018-01-11 | X-ray zone plate preparation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108300980B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109336418A (en) * | 2018-09-13 | 2019-02-15 | 中国科学院微电子研究所 | A kind of preparation method of central cylindrical glass optical fiber |
| CN112899655A (en) * | 2019-11-19 | 2021-06-04 | 中国科学院微电子研究所 | Device and method for crystallizing thin film material |
| CN112899653A (en) * | 2019-11-19 | 2021-06-04 | 中国科学院微电子研究所 | High-temperature atomic layer deposition device and method |
| CN112899652A (en) * | 2019-11-19 | 2021-06-04 | 中国科学院微电子研究所 | Device and method for preparing thin film material by atomic layer deposition |
| CN113088924A (en) * | 2021-04-07 | 2021-07-09 | 南京工业大学 | CVD device capable of locally and directionally depositing SiC coating and deposition method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100252049B1 (en) * | 1997-11-18 | 2000-04-15 | 윤종용 | The atomic layer deposition method for fabricating aluminum layer |
| JP2005104790A (en) * | 2003-10-01 | 2005-04-21 | Sumitomo Metal Mining Co Ltd | Carbon nanotube manufacturing method and carbon nanotube embedding material |
| JP2007162093A (en) * | 2005-12-15 | 2007-06-28 | Dialight Japan Co Ltd | Film deposition method and film deposition device practicing the same |
| WO2009111782A1 (en) * | 2008-03-07 | 2009-09-11 | Dow Agrosciences Llc | Stabilized oil-in-water emulsions including meptyl dinocap |
| DE102010010937A1 (en) * | 2009-10-26 | 2011-04-28 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Method and device for producing a Fresnel zone plate |
| CN203754804U (en) * | 2014-02-24 | 2014-08-06 | 中科联碳(北京)科技有限公司 | Hot-wire tensioning mechanism for chemical vapor deposition diamond equipment |
| CN107119264B (en) * | 2017-06-14 | 2019-03-08 | 东南大学 | Iridium-alumina high temperature coating apparatus and technique are deposited with chamber In-situ reaction |
-
2018
- 2018-01-11 CN CN201810028022.7A patent/CN108300980B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108300980A (en) | 2018-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108300980B (en) | X-ray zone plate preparation system | |
| TWI661084B (en) | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same | |
| US8623144B2 (en) | Apparatus for manufacturing large-area carbon nanotube films | |
| CN107217236B (en) | Low-temperature vacuum evaporation source | |
| US8562936B2 (en) | Carbon nanotube array structure and method for making the same | |
| JP2000282225A (en) | Formation of transparent electrically conductive film and transparent electrically conductive film formed by this method | |
| CN104962876A (en) | Boron-doped diamond film material on surface of graphite and preparation method thereof | |
| JP2002249868A (en) | Vapor deposition equipment | |
| Shukla et al. | Versatile UHV compatible Knudsen type effusion cell | |
| US10174422B2 (en) | Apparatus for selective gas injection and extraction | |
| JPH0533144A (en) | Instrument for temperature measurement of plasma chemical vapor deposition for preparing tungsten thin film | |
| JP7051300B2 (en) | Carbon nanotube aggregate | |
| CN101619442A (en) | Electron beam evaporation source device | |
| CN110512195A (en) | Method and device for performing MPCVD on inner surface of tubular material | |
| CN113597081B (en) | A Method for Local Heating of Tin Source Inside a Superconducting Cavity | |
| CN111705309A (en) | A chemical source introduction system for atomic layer deposition coating equipment | |
| US20050160979A1 (en) | Method and apparatus for applying a polycrystalline film to a substrate | |
| CN216864302U (en) | A two-dimensional material vapor deposition device with uniform temperature field | |
| TW201842331A (en) | Method for determining the partial pressure or a concentration of a vapour | |
| Kim et al. | Growth of carbon nanotube field emitters on single strand carbon fiber: a linear electron source | |
| CN209584364U (en) | A kind of special fixture applied to electric-resistivity method vacuum evaporated aluminium thick film devices | |
| CN106319461B (en) | Sputtering device | |
| CN116657118B (en) | A method for improving the thickness control accuracy of atomic layer deposition multilayer films | |
| CN114381696B (en) | Miniature multi-source metal ultrathin membrane electrode ultrahigh vacuum evaporation device and method | |
| CN107955935A (en) | A kind of device for film vapor deposition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |