CN108291879B - Substrate defect detection device and detection method using the same - Google Patents

Abstract

The substrate defect detecting apparatus according to an embodiment of the present invention includes: a platform for mounting a substrate; a carriage movably coupled to the stage in an X-axis direction; a main moving block located above the base plate and movably coupled to the bracket in a Y-axis direction; a first sub moving block movably coupled to the main moving block in an X-axis direction; a probe provided on the first sub moving block to be located above the substrate, for detecting a defect of the substrate; and a control unit that continuously moves the carriage in an X-axis direction and controls a relative speed of the sub moving block with respect to the carriage.

Description

Substrate defect detection device and detection method using the same

technical field

The invention relates to a substrate defect detection device and a detection method using the same. More specifically, the present invention relates to a substrate defect detection device and a detection method using the same, which are used to detect defects generated on a substrate (glass), and can improve the tact-time by shortening the time required for substrate defect detection. ) and the yield.

Background technique

Generally, an optical display is composed of a substrate, a liquid crystal layer, a counter substrate, and the like, and the LCD display in the optical display is manufactured through a plurality of manufacturing processes. Typical manufacturing processes include exposure and etching (Photo) process, color filter (Color filter) processing process, cell (Cell) assembly process, module (Module) assembly process, among which the exposure and etching process of engraving circuit patterns on the substrate It is a process that requires precision by repeating implementation to laminate circuits.

After this exposure and etching process, an optical inspection device (AOI, Automatic Optical Inspection) is used to inspect whether the circuit pattern is well formed on the substrate, and when an open or short circuit pattern is found through inspection, repair (Repair) process repairs open circuit or short circuit.

In order to increase the speed of such defect detection, it is important to use optical inspection equipment to find as many defects as possible within the limited process time, especially as the speed of mass production of products increases, the detection of substrate defects in the shortest time in the process stage become more and more important.

FIG. 1 is a schematic diagram of a substrate defect inspection apparatus 10 as an optical inspection apparatus (AOI) according to the prior art, and the substrate defect inspection apparatus 10 according to the prior art is described with reference to FIG. 1 .

The substrate defect inspection apparatus 10 according to the related art includes a platform 30 , a gantry 20 , a moving block 21 , and a probe 23 . The substrate 33 to be inspected is placed on the platform 30, and the bracket 20 is movably coupled to the platform 30 along the X-axis direction and moves along the X-axis direction according to the inspection process. The moving block 21 is movably coupled to the carriage 20 in the Y-axis direction and has a probe 23 that is positioned over a defect of the substrate 33 based on the movement. The probe 23 is moved over the defect of the substrate 33 through the carriage 20 and the moving block 21, and the probe 23 moved to the detection point detects the defect.

Specifically, referring to FIGS. 1 and 2 , a method for detecting a plurality of defects using the substrate defect inspection apparatus 10 according to the prior art will be described as follows: move the carriage 20 in the X-axis direction and then stop, use the probe 23 to detect defects ①, and then pass the The moving block 21 moves the probe 23 in the Y-axis direction to detect the defect ②. Then, the carriage 20 is moved in the X-axis direction and then stopped, and then the probe 23 is moved in the Y-axis direction by the moving block 21 to detect defects ③, and thereafter the carriage 20 and the moving block 21 are repeatedly moved and stopped in sequence Detect defects ④ and defects ⑤.

The conventional substrate defect detection apparatus as described above has the following problems.

First, in the bracket structure according to the prior art, the moving block can only move along the Y-axis direction, so the probe can only detect defects with the same X-axis coordinates (defects on the X-axis), and for defects with different X-axis coordinates , and only after moving the carriage along the X-axis, the detection is performed. Therefore, as the number of times the probe is moved in the Y-axis direction increases, the time required for defect detection increases (see Figure 2).

Second, in order to detect defects, it is necessary to move and stop a heavy pallet at any time. When the above-mentioned operations are repeated, the inspection device will be damaged due to the weight of the pallet, the maintenance will be increased, and the cost will be increased. Repeated movement and stop operations increase the time required for defect detection.

SUMMARY OF THE INVENTION

technical problem

One aspect of the present invention provides a substrate defect detection device and a detection method using the same, which can improve tact-time and productivity by shortening the time required for substrate defect detection.

Technical solutions

According to one aspect of the present invention, there is provided a substrate defect inspection apparatus, the inspection apparatus includes: a platform for placing a substrate; a bracket movably coupled to the platform along an X-axis direction; a main moving block located at The upper part of the base plate is movably coupled to the bracket along the Y-axis direction; the first auxiliary moving block is movably coupled to the main moving block along the X-axis direction; the probe is arranged on the first auxiliary moving block. A pair of moving blocks are positioned above the base plate for detecting defects of the base plate; and a control unit, which makes the carriage move continuously along the X-axis direction and controls the pair of moving blocks relative to the carriage. The relative speed of the moving block.

The first sub-moving block may include: a horizontal sub-moving block which is opposite to the base plate and is movably coupled to the main moving block in the X-axis direction; and a vertical sub-moving block which is bent in the Z-axis direction And coupled to the horizontal sub-moving block.

The substrate defect detection apparatus may further include: a second sub-moving block movably coupled to the vertical sub-moving block along the Z-axis direction, and the probe may be coupled to the second sub-moving block to be positioned on the second sub-moving block. above the substrate.

The control unit controls the carriage to move at a preset constant speed, controls the detection action of the probe, and controls the first sub-moving block to move at the same speed as the carriage moving speed along the edge. Moving in the X-axis direction opposite to the moving direction of the carriage, when the probe is paused for the defect of the substrate, the defect of the substrate can be detected.

The bracket may include: a pair of brackets that move in the X-axis direction and are spaced apart on both sides of the platform; and a bracket body that is supported by the brackets and located above the platform.

The main moving block includes a first main moving block movably coupled to the carrier body in the Y-axis direction and a first main moving block spaced from the first main moving block and movably coupled to the carrier in the Y-axis direction The second main moving block of the frame body, the first auxiliary moving block is movably coupled to the first main moving block and the second main moving block along the X-axis direction through a link mechanism, and the link mechanism may include : a first link arm, one end of which is rotatably connected to the first main moving block, and the other end is coupled to the first auxiliary moving block; and a second link arm, one end of which is rotatably connected to the first auxiliary moving block the second main moving block, and the other end is coupled to the first sub-moving block.

The main moving block is movably coupled to the bracket body in the Y-axis direction, the first auxiliary moving block is movably coupled to the main moving block in the X-axis direction through a link mechanism, and the link The mechanism may include: a third link arm, one end of which is rotatably connected to the main moving block; the main moving block; a fifth link arm, one end of which is rotatably connected to the other end of the third link arm, and the other end is coupled to the first auxiliary moving block; and a sixth link arm, which is One end is rotatably connected to the other end of the fourth link arm, and the other end is coupled to the first auxiliary moving block.

According to another aspect of the present invention, there is provided a substrate defect detection method using the substrate defect detection device, the detection method comprising the steps of: inputting defect coordinates of the substrate placed on the platform; generating a moving path; moving the carriage along the X-axis direction at a preset constant speed according to the generated moving path; moving at least one of the main moving block and the first auxiliary moving block to make all The probe is close to the defect; the first auxiliary moving block is moved along the X-axis direction opposite to the moving direction of the carriage at the same speed as the moving speed of the carriage, so that the probe is aimed at Pausing for a defect of the substrate; and detecting a defect of the substrate when the probe is paused for the defect of the substrate.

In the step of generating a moving path according to the input defect coordinates, the defect coordinates located at the shortest distance from the currently detected defect coordinates among the defect coordinates located in the movable area of the first sub-moving block may be set as the next detection object to generate the shortest movement path.

After the step of detecting the defects of the substrate, it may further include the step of judging whether the currently detected defect coordinates are the final defect coordinates. The defect coordinate is the defect coordinate at the shortest distance. Invention effect

According to the embodiments of the present invention, an inspection apparatus and inspection method for inspecting defects generated on a substrate (glass) can improve tact-time and productivity by shortening the time required for inspection of substrate defects.

Description of drawings

FIG. 1 is a schematic diagram of a substrate defect detection apparatus according to the prior art.

FIG. 2 is a reference diagram for explaining a method of detecting a substrate defect using the substrate defect detection apparatus.

FIG. 3 is a schematic diagram of a substrate defect detection apparatus according to an embodiment of the present invention.

FIG. 4 is a reference diagram for explaining a method of detecting a substrate defect using the substrate defect detecting apparatus according to the present embodiment.

5 and 6 are reference diagrams of a substrate defect detection apparatus according to a modification of an embodiment of the present invention.

7 is a reference diagram of a substrate defect detection apparatus according to another modification of an embodiment of the present invention.

8 is a flowchart for explaining a substrate defect detection method using the substrate defect detection apparatus according to an embodiment of the present invention.

Detailed ways

The present invention is capable of various modifications and has various embodiments, and therefore specific embodiments are illustrated and described in detail. However, the present invention is not limited to a specific embodiment, and all transformations, equivalents or substitutes made under the technical idea and technical scope of the present invention should fall within the scope of the present invention.

In the description of the present invention, when it is considered that the specific description of related well-known functions or structures may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, ordinal numbers such as first and second used in this specification are only used to distinguish one component from another.

When it is stated in this specification that a certain component is "connected" or "coupled" to another component, the certain component may be directly connected or coupled to the other component, but it should be understood that in the absence of an obvious statement to the contrary The certain component may also be connected or coupled to another component through other components.

In addition, in this specification, terms such as "~part (unit)", "~device", "~module" and the like refer to a unit that processes at least one function or operation.

The substrate defect detection apparatus according to the present invention will be described in detail below with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and repeated descriptions are omitted.

3 is a schematic diagram of a substrate defect detection apparatus 100 according to an embodiment of the present invention, and FIG. 4 is a reference diagram for explaining a method for detecting defects of a substrate 310 using the substrate defect detection apparatus 100 according to the present embodiment.

3 and 4 show the substrate defect detection apparatus 100 , the carriage 200 , the bracket 210 , the carriage body 230 , the guide rail 231 , the guide rail 535 , the guide rail 537 , the platform 300 , the base plate 310 , the main moving block 510 , the horizontal main moving Block 511, vertical main moving block 513, LM (Linear Motion) guide block 518, LM guide block 519, LM guide block 551, first sub-moving block 530, horizontal sub-moving block 531, vertical sub-moving block 533, second sub-moving block Moving block 550 , probe 570 , control unit 600 .

The substrate defect detection apparatus 100 according to an embodiment of the present invention includes: a platform 300 for placing the substrate 310 ; a bracket 200 movably coupled to the platform 300 along the X-axis direction; a main moving block 510 located on the substrate 310 The upper part is movably coupled to the bracket 200 along the Y-axis direction; the first auxiliary moving block 530 is movably coupled to the main moving block 510 along the X-axis direction; the probe 570 is provided in the first auxiliary moving block 510 The block 530 is located above the substrate 310 for detecting defects of the substrate 310; the control unit 600 makes the carriage 200 move continuously along the X-axis direction and controls the relative speed of the auxiliary moving block with respect to the carriage 200, Thus, by shortening the time required for defect detection of the substrate 310, tact-time and yield can be improved.

The substrate 310 subjected to the exposure and etching process is placed on the stage 300 .

A bracket 200 is coupled to the platform 300 so as to be movable in the X-axis direction. A plurality of brackets 200 may be coupled to the platform 300 . The bracket 200 may include: a pair of brackets 210 that move along the X-axis direction and are spaced apart on both sides of the platform 300 ; and a bracket body 230 that is supported by the pair of brackets 210 and located above the platform 300 . A pair of brackets 210 are disposed on both sides of the platform 300 and move in the X-axis direction, and as the brackets 210 move, the bracket body 230 coupled to and supported by the brackets 210 moves in the X-axis direction. The following guide rails 231 may be provided on one side of the bracket body 230 for the movement of the main moving block 510 . At this time, a plurality of brackets 200 may be arranged along the X-axis direction to shorten the time required for defect detection of the substrate 310 .

The main moving block 510 is located above the base plate 310 and is movably coupled to the bracket 200 in the Y-axis direction. Specifically, the main moving block 510 may include a horizontal main moving block 511 and a vertical main moving block 513 . The horizontal main moving block 511 is disposed opposite to the base plate 310 and has an LM guide block 519 below, thereby being movably coupled to a guide rail 535 formed on the horizontal sub-moving block 531 of the first sub-moving block 530 described below. The vertical main moving block 513 can be bent along the Z-axis direction to be combined with the horizontal main moving block 511 and has an LM guide block 518 inside that is combined with the guide rail 231 of the bracket body 230 to move. As the LM guide block 518 provided on the vertical main moving block 513 moves along the guide rail 231 of the carriage body 230, the main moving block 510 moves in the Y-axis direction.

The first sub moving block 530 is movably coupled to the main moving block 510 in the X-axis direction. Specifically, the first sub-moving block 530 may include a horizontal sub-moving block 531 and a vertical sub-moving block 533 . The horizontal sub-moving block 531 is disposed opposite to the base plate 310 and a guide rail 535 may be formed thereon to correspond to the LM guide block 519 provided on the main moving block 510 . At this time, the guide rail 535 may be formed in the X-axis direction, whereby the LM guide block 519 and the guide rail 535 can be combined to be movable relative to each other in the X-axis direction. For example, the first sub-moving block 530 is movable in the X-axis direction relative to the main moving block 510 . The vertical sub-moving block 533 is bent in the Z-axis direction to be coupled to the horizontal sub-moving block 531, and a guide rail 537 may be formed on one side in the Z-axis direction so that the second sub-moving block 550 can move.

That is to say, through the LM guide block structure connecting the first auxiliary moving block 530 and the main moving block 510, the first auxiliary moving block 530 can move along the X-axis direction, so that the probe 570 combined with the first auxiliary moving block 530 can also be Move along the X axis. In this way, independently of the movement of the carriage 200 , the probe 570 can move along the X-axis direction, thereby not only detecting defects with the same X-axis coordinates, but also detecting defects with different X-axis coordinates within the moving range of the probe 570 .

Specifically, referring to FIG. 3 and FIG. 4 , according to the substrate defect detection apparatus 100 of the present embodiment, the probe 570 can be moved along the X-axis direction by the first auxiliary moving block 530 , so it is different from the prior art (refer to FIG. 2 ), Defects ①, ②, ③, ④, ⑤ can be detected in sequence with minimal movement in the Y-axis direction. Therefore, the movement of the probe 570 in the Y-axis direction can be minimized and defects of the substrate 310 can be detected, so that the defect detection time can be reduced.

The probe 570 is disposed on the first sub-moving block 530 to be located above the substrate 310 for detecting defects of the substrate 310 . The probe 570 for detecting defects of the substrate 310 according to the present embodiment may be an optical camera such as a CCD (Charge Coupled Device). At this time, a plurality of probes 570 may be provided on the plurality of main moving blocks 510 and the first sub-moving blocks 530 to shorten the time required for defect detection of the substrate 310 .

At this time, the probe 570 may be coupled to the second sub-moving block 550 movably coupled to the vertical sub-moving block 533 of the first sub-moving block 530 . Specifically, a guide rail 537 may be formed on one side of the vertical auxiliary moving block 533 of the first auxiliary moving block 530 along the Z-axis direction, and an LM guide block 551 may be provided on the second auxiliary moving block 550 so as to be movably coupled to the vertical auxiliary moving block 550. The guide rail 537 of the auxiliary moving block 533 . When the probe 570 is coupled to the first sub-moving block 530 through the second sub-moving block 550 , the probe 570 can move along the Z-axis direction, and the probe 570 can be moved along the Z-axis direction as needed to carefully observe the defects of the substrate 310 .

The control unit 600 continuously moves the carriage 200 along the X-axis direction and controls the relative speed of the first auxiliary moving block 530 with respect to the carriage 200 . The control unit 600 may control the carriage 200 to move at a preset constant speed, and may control the detection action of the probe 570 .

Specifically, the control unit 600 controls the carriage 200 to move in the X-axis direction at a constant speed, and controls the first sub-moving block 530 combined with the probe 570 to move at the same speed as the moving speed of the carriage 200 along the The carriage 200 moves in the X-axis direction opposite to the moving direction. That is, when the carriage 200 moves in the positive (+) X-axis direction at a constant speed, the control unit 600 controls the first sub-moving block 530 to move along the negative (+) direction at the same speed as the moving speed of the carriage 200 . -) Move in the X-axis direction. Through such a mechanism, the phenomenon that the probe 570 pauses with respect to the defect of the substrate 310 (the phenomenon that the relative speed of the probe 570 to the defect is 0) occurs, and by causing the stop phenomenon of the probe 570 to appear on the upper side of the defect of the substrate 310, the probe 570 may detect defects of the substrate 310 in a stopped state. In the prior art, when the carriage 200 moves, the probe 570 also moves together, and for accurate detection of defects on the substrate 310 , the carriage 200 must be stopped and then the probe 570 is used to detect defects. In contrast, in the present embodiment, the probe 570 can move in the X-axis direction independently of the movement of the carriage 200, so by moving the probe 570 in the opposite direction to the movement of the carriage 200, the probe can be caused to move 570 is directed to the phenomenon that the defect of the substrate 310 stops instantaneously. That is, during the movement of the carriage 200 in the X-axis direction, the position of the probe 570 in the X-axis direction may be fixed. Thereby, it is not necessary to stop the carriage 200, and when the carriage 200 is moved at a constant speed, the probe 570 does not rattle, and the defect of the substrate 310 can be detected. Therefore, by minimizing the repeated operations of moving and stopping the carriage 200, it is possible not only to prevent damage to the inspection device due to the weight of the carriage 200, but also to shorten the time required for defect detection.

5 and 6 are reference diagrams of a substrate defect detection apparatus 100 according to a modification of an embodiment of the present invention. Referring to FIGS. 5 and 6 , in the substrate defect detection apparatus 100 according to this embodiment, the main moving block 510 includes a The first main moving block 510a movably coupled to the carriage body 230 in the Y-axis direction and the second main moving block 510b spaced apart from the first main moving block 510a and movably coupled to the carriage body 230 in the Y-axis direction , the first auxiliary moving block 530 is movably coupled to the first main moving block 510a and the second main moving block 510b along the X-axis direction through a link mechanism. The link mechanism may include: a first link arm 517a, one end of which can be and a second link arm 517b, one end of which is rotatably connected to the second main moving block 510b, and the other end is coupled to the second main moving block 510b. The first sub-moving block 530 .

This embodiment is a modification of the previous embodiment, and the components for moving the probe 570 in the X-axis direction are different from those of the previous embodiment. For this embodiment, except for the first main moving block 510a and the second main moving block 510b, the first auxiliary moving block 530 and the link mechanism, other components are the same as the previous embodiment, so the description of the previous embodiment is used. to replace the description of the same component.

For this embodiment, the upper surface of the bracket body 230 is formed with a guide rail 231 along the Y-axis direction, and a plurality of main moving blocks 510 are formed, which are composed of a first main moving block 510a and a second main moving block 510b. The first main moving block 510a is movably coupled to the carriage body 230 in the Y-axis direction, and the second main moving block 510b is spaced apart from the first main moving block 510a and movably coupled to the carriage body 230 in the Y-axis direction.

The first sub-moving block 530 combined with the probe 570 is movably coupled to the first main moving block 510a and the second main moving block 510b in the X-axis direction through a link mechanism. The link mechanism includes a first link arm 517a and a second link arm 517b. One end of the first link arm 517 a is rotatably connected to the first main moving block 510 a through the hinge pin 515 , and the other end is coupled to the first auxiliary moving block 530 . One end of the second link arm 517b is rotatably connected to the second main moving block 510b, and the other end is coupled to the first auxiliary moving block 530. Referring to (b) of FIG. 6 , when the first main moving block 510a and the second main moving block 510b are separated from each other, the first link arm 517a and the second link arm 517b are rotated, thereby being coupled to the first link The arm 517a and the first sub-moving block 530 of the second link arm 517b are along the X-axis direction. Through such a link mechanism, the first sub-moving block 530 combined with the probe 570 can move in the X-axis direction, so that the movement of the probe 570 in the Y-axis direction can be reduced as much as possible, when the carriage 200 is moved at a constant speed down, the probe 570 will not shake and can detect defects.

7 is a reference diagram of a substrate defect detection apparatus according to another modification of an embodiment of the present invention. Referring to FIG. 7 , the main moving block 510 is movably coupled to the carriage body 230 along the Y-axis direction, and the first auxiliary moving block 530 is movably coupled to the main moving block 510 through a link mechanism along the X-axis direction, and the link mechanism may include: a third link arm 517c, one end of which is rotatably connected to the main moving block 510; a fourth link arm 517d , which is arranged to be spaced apart from the third link arm 517c and has one end rotatably connected to the main moving block 510; the fifth link arm 517e, one end of which is rotatably connected to the other end of the third link arm 517c, and The other end is coupled to the first sub-moving block 530;

This embodiment is another modification of the first embodiment, and the components for moving the probe 570 in the X-axis direction are different from those of the aforementioned first embodiment. For this embodiment, except for the main moving block 510, the first auxiliary moving block 530 and the link mechanism, other components are the same as those in the first embodiment, so the description of the first embodiment is used to replace the description of the same components. illustrate.

In this embodiment, the guide rail 231 is formed on the upper surface of the bracket body 230 along the Y-axis direction, and the main moving block 510 is movably coupled to the bracket body 230 along the Y-axis direction.

The first sub-moving block 530 combined with the probe 570 is movably coupled to the main moving block 510 in the X-axis direction through a link mechanism. The link mechanism includes a third link arm 517c, a fourth link arm 517d, a fifth link arm 517e, and a sixth link arm 517f. One end of the third link arm 517c is rotatably connected to the main moving block 510 through a hinge pin 515, and the other end is connected to one end of the fifth link arm 517e. The fourth link arm 517d is disposed to be spaced apart from the third link arm 517c and has one end rotatably connected to the main moving block 510 through a hinge pin 515 and the other end connected to one end of the sixth link arm 517f. One end of the fifth link arm 517e is rotatably connected to the other end of the third link arm 517c through the hinge pin 515 , and the other end is coupled to the first auxiliary moving block 530 . One end of the sixth link arm 517f is rotatably connected to the other end of the fourth link arm 517d through the hinge pin 515, and the other end is coupled to the first auxiliary moving block 530. 7 (b), as the third link arm 517c, the fourth link arm 517d, the fifth link arm 517e and the sixth link arm 517f rotate, the first sub-moving block 530 is along the X-axis direction. Through such a link mechanism, the first sub-moving block 530 combined with the probe 570 can move in the X-axis direction, so that the movement of the probe 570 in the Y-axis direction can be reduced as much as possible, when the carriage 200 is moved at a constant speed down, the probe 570 will not shake and can detect defects.

In addition, although not shown, the aforementioned two modifications may also include a second sub-moving block 550 movably coupled to the first sub-moving block 530 in the Z-axis direction, and the probe 570 may be coupled to the second sub-moving block 550.

FIG. 8 is a flowchart for explaining a substrate defect detection method using the substrate defect detection apparatus 100 according to an embodiment of the present invention. 8 , the substrate defect detection method according to the present embodiment includes the following steps: inputting the defect coordinates of the substrate 310 placed on the platform 300; generating a moving path of the substrate defect detecting apparatus 100 according to the input coordinates; The path moves the carriage 200 along the X-axis direction at a preset constant speed; moves the probe 570 close to the defect by moving at least one of the main moving block 510 and the auxiliary moving block; The same speed moves along the X-axis direction opposite to the moving direction of the carriage 200 to pause the probe 570 for the defect of the substrate 310;

The step S100 of inputting the defect coordinates of the substrate 310 is a step in which the operator inputs the coordinates that the substrate 310 is considered to be defective. At this time, a plurality of defect coordinates input by the operator can be input.

The step S200 of generating the entire moving path is a step of generating the shortest moving path between defect coordinates based on the input defect coordinates. The step of generating a movement path based on the input defect coordinates is a step of generating a movement path for moving the probe 570 by the shortest distance based on defects located on the plurality of input coordinates. Specifically, in the step of generating the moving path according to the input defect coordinates, the defect coordinate located at the shortest distance from the currently detected defect coordinate among the plurality of defect coordinates located in the movable area of the first sub-moving block 530 is set as The next object is detected to generate the shortest movement path. At this time, the movable area of the first auxiliary moving block 530 refers to the distance that the first auxiliary moving block 530 can move along the guide rail 535 along the X-axis direction, which may be the length of the guide rail 535 or a preset within the length of the guide rail 535 distance. For this embodiment, since the first sub-moving block 530 can be moved along the X-axis direction, even defects that are not on the same X-axis can be detected, so the defects located at the shortest distance from the currently detected defect coordinates can be detected. The coordinates are set as the next detection target, so that the shortest movement path between the defect coordinates can be generated (refer to FIG. 4 ). Therefore, compared with the related art (refer to FIG. 2 ), since the probe 570 moves the shortest distance, the defect detection time of the substrate 310 can be shortened.

Then, the carriage 200, the main moving block 510, and the first sub-moving block 530 move along the generated shortest moving path so that the probe 570 is positioned on the input coordinates.

The step S300 of moving the carrier 200 is a step of moving the carrier 200 in the X-axis direction so as to be located in the region where the defect is considered to exist. At this time, to move the carriage 200 and detect defects, the carriage 200 may be continuously moved at a preset constant speed.

The step S400 of moving the probe 570 is a step of moving the probe 570 close to the input defect coordinates using at least one of the main moving block 510 and the first sub-moving block 530 . At this time, independently of the movement of the carriage 200, the probe 570 can move along the X-axis direction. Therefore, unlike the prior art, not only defects with the same X-axis coordinates can be detected, but also within the X-axis movement range of the probe 570. Defects with different X-axis coordinates (refer to FIG. 4 ). In addition, when the carriage 200 is moved at a constant speed to detect defects, it is preferable that the probe 570 is positioned in advance at the defect coordinates in the X-axis direction, so that the movement of the first sub-moving block 530 causes a phenomenon to stop the defect.

The step S500 of detecting the defect of the substrate 310 is a step of detecting the defect of the substrate 310 using the probe 570 . At this time, the probe 570 can move in the X-axis direction through the first sub-moving block 530. Therefore, unlike the prior art (refer to FIG. 2 ), the movement in the Y-axis direction can be minimized and multiple defects can be detected (refer to FIG. 4 ). . In addition, when the carriage 200 is moved at a constant speed and defects are detected, the probe 570 is generated by moving the probe 570 in the X-axis direction opposite to the moving direction of the carriage 200 at the same speed as the moving speed of the carriage 200 With regard to the phenomenon that the defects of the substrate 310 are suspended, the defects can be detected without the probe 570 shaking. That is, by temporarily fixing the position of the probe 570, the defect of the substrate 310 can be detected.

Finally, the step S600 of judging whether the detected coordinates are the final defect coordinates is a step of judging whether the detected defect coordinates are the final defect coordinates among the input defect coordinates, and judging whether to end the detection of defects. Specifically, if the currently detected defect coordinates are not the final defect coordinates, move the probe 570 to other defect coordinates on the shortest moving path and detect the defect, and if the currently detected coordinates are the final defect coordinates, end the detection in the current detection area , and move the substrate defect inspection apparatus 100 to the next inspection area. By moving the probe 570 according to the shortest movement path generated by such a process, a plurality of defects can be detected in a short time.

The embodiments of the present invention have been described above, but those of ordinary skill in the art can easily understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention described in the claims.

Symbol Description

100: Substrate defect inspection device 200: Bracket

210: Bracket 230: Bracket body

231, 535, 537: Rail 300: Platform

310: Base plate 510: Main moving block

510a: first main moving block 510b: second main moving block

511: Horizontal main moving block 513: Vertical main moving block

515: Hinge pin 517a: First link arm

517b: Second link arm 517c: Third link arm

517d: Fourth link arm 517e: Fifth link arm

517f: Sixth link arm 518, 519, 551: LM guide block

530: The first sub-moving block 531: The horizontal sub-moving block

533: Vertical sub-moving block 550: Second sub-moving block

570: Probe 600: Control Unit

Claims (9)

1. A substrate defect inspection apparatus, comprising:

a platform for mounting a substrate;

a carriage movably coupled to the stage in an X-axis direction;

a main moving block located above the base plate and movably coupled to the bracket in a Y-axis direction;

a first sub moving block movably coupled to the main moving block in an X-axis direction;

a probe provided on the first sub moving block to be located above the substrate, for detecting a defect of the substrate; and

a control unit that continuously moves the carriage in an X-axis direction and controls a relative speed of the first sub moving block with respect to the carriage,

wherein the control unit controls the carriage to move at a predetermined constant speed, controls the detection operation of the probe, controls the first sub moving block to move at the same speed as the moving speed of the carriage in an X-axis direction opposite to the moving direction of the carriage, and detects the defect of the substrate when the probe is suspended for the defect of the substrate.

2. The substrate defect detecting apparatus according to claim 1,

the first secondary moving block includes:

a horizontal sub moving block which is opposite to the base plate and is movably coupled to the main moving block in an X-axis direction; and

and a vertical sub moving block bent in a Z-axis direction and coupled to the horizontal sub moving block.

3. The substrate defect detecting apparatus of claim 2, further comprising:

a second sub moving block movably coupled to the vertical sub moving block in a Z-axis direction,

the probe is coupled to the second secondary moving block to be located above the base plate.

4. The substrate defect detecting apparatus according to claim 1,

the bracket includes:

a pair of supports moving along the X-axis direction and arranged on two sides of the platform at intervals; and

a bracket main body supported by the bracket to be located above the platform.

5. The substrate defect detecting apparatus according to claim 4,

the main moving block includes a first main moving block movably coupled to the carrier main body in a Y-axis direction and a second main moving block spaced apart from the first main moving block and movably coupled to the carrier main body in the Y-axis direction,

the first sub moving block is movably coupled to the first and second main moving blocks in an X-axis direction through a link mechanism,

the link mechanism includes:

a first link arm having one end rotatably connected to the first main moving block and the other end coupled to the first sub moving block; and

a second link arm having one end rotatably connected to the second main moving block and the other end coupled to the first sub moving block.

6. The substrate defect detecting apparatus according to claim 4,

the main moving block is movably coupled to the bracket main body in a Y-axis direction,

the first sub moving block is movably coupled to the main moving block in an X-axis direction through a link mechanism,

the link mechanism includes:

a third link arm having one end rotatably connected to the main moving block;

a fourth link arm provided to be spaced apart from the third link arm and having one end rotatably connected to the main moving block;

a fifth link arm having one end rotatably connected to the other end of the third link arm and the other end coupled to the first secondary moving block; and

a sixth link arm having one end rotatably connected to the other end of the fourth link arm and the other end coupled to the first secondary moving block.

7. A substrate defect detecting method using the substrate defect detecting apparatus according to claim 1, comprising the steps of:

inputting defect coordinates of the substrate mounted on the stage;

generating all moving paths according to the input coordinates;

moving the carriage in an X-axis direction at a preset constant speed according to the generated movement path;

moving the probe toward the defect by moving at least one of the main moving block and the first sub moving block;

moving the first sub moving block in an X-axis direction opposite to a moving direction of the carriage at the same speed as the moving speed of the carriage to pause the probe with respect to the defect of the substrate; and

detecting the defect of the substrate when the probe is suspended for the defect of the substrate.

8. The method of claim 7, wherein,

in the step of generating the movement path based on the input defect coordinates, a defect coordinate located at a shortest distance from a currently detected defect coordinate among the defect coordinates located in the movable region of the first sub moving block is set as a next detection object to generate a shortest movement path.

9. The method of claim 8, wherein,

after the step of detecting the defect of the substrate, the method further comprises the step of judging whether the currently detected defect coordinate is a final defect coordinate,

if the currently detected defect coordinate is not the final defect coordinate, moving the probe to a defect coordinate located at the shortest distance from the currently detected defect coordinate.

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