CN108282570B

CN108282570B - Electronic device

Info

Publication number: CN108282570B
Application number: CN201810060423.0A
Authority: CN
Inventors: 张文真
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-01-22
Filing date: 2018-01-22
Publication date: 2020-05-08
Anticipated expiration: 2038-01-22
Also published as: CN108282570A

Abstract

The application discloses an electronic device. The electronic device includes: the casing, glass apron and display module assembly, the casing includes the base plate and from the lateral wall that the base plate periphery extends, the lateral wall is around forming an accommodating space, glass apron lid is established on the lateral wall of casing, display module assembly sets up in glass apron below and is located accommodating space, be provided with the colloid between glass apron and the casing, be provided with solid gluey structure on the point of glass apron with the colloid contact glues the face, be provided with the excessive groove of gluing on the contact surface with the colloid contact on the casing, the colloid is glued face and contact surface through the bonding point and is fixed glass apron on the casing. The embodiment of the application sets up solid gluey structure and sets up excessive gluey groove on the contact surface of casing through the point of gluing at glass apron, can increase the bonding area between glass apron or casing and colloid, and the bonding force between effectual increase touch-sensitive screen glass apron and the casing prevents that the touch-sensitive screen from coming unstuck to reach waterproof effect.

Description

Electronic device

Technical Field

The application relates to the technical field of mobile communication, in particular to the technical field of mobile equipment, and specifically relates to electronic equipment.

Background

With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. With the popularization of the concept of the full screen, the requirement of consumers on the screen ratio is higher and higher, and the narrow frame also becomes the target pursued by terminal manufacturers.

Due to the technical requirements of the intelligent terminal, the touch screen and the shell are usually fixed through dispensing, so that the touch screen is prevented from being separated from the shell. However, due to the requirement of the narrow frame, the width of the dispensing contact position between the touch screen and the housing is often small, so that the adhesive force between the touch screen and the housing is insufficient, and the touch screen is easily peeled off in the using process.

Disclosure of Invention

The embodiment of the application provides an electronic equipment, can realize promoting the screen and account for the ratio, and prevent that the touch-sensitive screen from coming unstuck.

The embodiment of the application provides an electronic equipment, including casing, glass apron and display module assembly, the casing includes the base plate and from the lateral wall that the base plate periphery extends, the lateral wall is around forming an accommodating space, the glass apron lid is established on the lateral wall of casing, display module assembly sets up glass apron below just is located in the accommodating space, the glass apron with be provided with the colloid between the casing, on the glass apron with be provided with solid gluey structure on the some face of colloid contact, on the casing with be provided with excessive gluey groove on the contact surface of colloid contact, the colloid through bonding the some glue face with the contact surface will the glass apron is fixed on the casing.

The embodiment of the application provides an electronic equipment, including casing, glass apron and display module assembly, the casing includes the base plate and from the lateral wall that the base plate periphery extends, the lateral wall is around forming an accommodating space, the glass apron lid is established on the lateral wall of casing, display module assembly sets up glass apron below just is located in the accommodating space, the glass apron with be provided with the colloid between the casing, on the glass apron with be provided with solid gluey structure on the some face of gluing of colloid contact, on the casing with be provided with excessive gluey groove on the contact surface of colloid contact, the colloid through bonding the some glue the face with the contact surface will the glass apron is fixed on the casing. This application embodiment is glued the face through the point at glass apron and is set up admittedly and glue the structure and set up excessive gluey groove on the contact surface of casing, can increase the bonding area between glass apron or casing and the colloid, and the bonding force between effectual increase touch-sensitive screen glass apron and the casing to realize super narrow frame point and glue the technique, the promotion screen accounts for the ratio, and prevents that the touch-sensitive screen from coming unstuck, in order to reach waterproof effect.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 3 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 4 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 5 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 6 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 7 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 8 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 9 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 10 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 11 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 12 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 13 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 14 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 15 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 16 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 17 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 18 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Specifically, please refer to fig. 1 and fig. 2, in which fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure, and fig. 2 is another schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The embodiment of the application provides electronic equipment which can be electronic equipment such as a smart phone and a tablet computer. Referring to fig. 1, the electronic device 100 includes a cover plate 10, a display module 20, a circuit board 30 and a housing 50.

The cover plate 10 is mounted on the display module 20 to cover the display module 20. The cover plate 10 may be a transparent glass cover plate. In some embodiments, the cover plate 10 may be a glass cover plate made of a material such as sapphire. In some embodiments, the cover 10 may also be a touch screen glass cover that is touch-enabled.

The display module 20 is mounted on the housing 50 to form a display surface of the electronic device 100. The display module 20 is used as a front housing of the electronic device 100 and forms an enclosed space with the housing 50 for accommodating other electronic components of the electronic device 100. Meanwhile, the display module 20 forms a display surface of the electronic device 100 for displaying information such as images and texts. The display module 20 may be a touch screen, and is configured to receive a touch signal, and output the touch signal correspondingly on a display surface, so as to implement human-computer interaction. For example, the display module 20 may be a transparent display screen. For example, the display module 20 may include an OLED display screen, an LCD display screen, and the like.

As shown in fig. 1, the display module 20 may include a non-display area 201 and a display area 202. The top area of the non-display area 201 can be provided with an opening for sound and light conduction, and the bottom area of the non-display area 201 can be provided with functional components such as a fingerprint module, a touch key and the like. The display area 202 may be used to display a screen of the electronic device 100 or provide a user with touch control. The cover plate 10 is mounted on the display module 20 to cover the display module 20, so as to form a display area and a non-display area which are the same as those of the display module 20, specifically referring to the display area and the non-display area of the display module 20. It should be noted that the structure of the display module 20 is not limited thereto. For example, the display module 20 may be a special-shaped screen.

As shown in fig. 2, the display module 20 may be a full-screen display, which can implement full-screen display.

The circuit board 30 is mounted inside the housing 50 to accommodate the circuit board 30 in the closed space. The circuit board 30 may be a motherboard of the electronic device 100. The circuit board 30 is provided with a grounding point to realize grounding of the circuit board 30. Functional components such as a camera and a processor may be integrated on the circuit board 30. Meanwhile, the display module 20 may be electrically connected to the circuit board 30.

In some embodiments, control circuitry is provided on the circuit board 30. The control circuit is connected to the display module 20, and outputs an electrical signal to the display module 20 to control the display module 20 to display information, receive a touch signal, illuminate a screen or turn off the screen. The control circuit may also be connected to a processor in the electronic device 100, so as to control the display module 20 to display information, receive a touch signal, turn on or turn off the screen, and the like according to an instruction of the processor.

The housing 50 is used to form the outer contour of the electronic device 100. The material of the housing 50 may be plastic or metal. The housing 50 may be integrally formed. The housing 50 may also include a center frame and a rear cover that are fixedly coupled to form the housing 50.

Wherein the housing 50 is used to form the outer contour of the electronic device 100. The housing 50 may be a metal housing, such as an aluminum alloy housing 50. It should be noted that the material of the housing 50 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the housing 50 may be a ceramic center frame or a glass center frame. For another example: the housing 50 may be a plastic bezel. Also for example: the housing 50 may be a structure in which metal and plastic are matched with each other, and the plastic part may be formed by injection molding on a metal plate.

In some embodiments, the cover plate 10 and the display module 20 can be packaged as a single display device 200, and the display device 200 is covered on the housing 50 of the electronic device 100.

In some embodiments, the cover plate 10 and the display module 20 may not be packaged as a single electronic device, but are individually mounted on the housing 50 of the electronic device 100 as separate components of the electronic device 100.

Referring to fig. 3, 4 and 5, fig. 3 is a view of the electronic device 100 in fig. 1 in an X-X direction, fig. 4 is a view of the electronic device 100 in fig. 1 in an X-X direction with another structure, and fig. 5 is a view of the electronic device 100 in fig. 1 in a Y-Y direction.

As shown in fig. 3 or fig. 4, the electronic device 100 includes a housing 50, a glass cover 10 and a display module 20.

The housing 50 includes a base 51 and a sidewall 52 extending from a periphery of the base 51, wherein the sidewall 52 surrounds and forms a receiving space 53.

The glass cover plate 10 is covered on the side wall 52 of the shell 50.

The display module 20 is disposed below the glass cover plate 10 and located in the accommodating space 53, wherein the display module 20 can be combined with the glass cover plate 10 through the optical cement 80. For example, the display module 20 may be an LCD display module or an OLED display module, and the optical adhesive 80 may be an OCA optical adhesive.

As shown in fig. 3 to 5, the glue dispensing surface 11 of the glass cover plate 10 contacting with the glue 60 is provided with a glue fixing structure 12, the contact surface 54 of the housing 50 contacting with the glue 60 is provided with a glue overflow groove 56, and the glue 60 fixes the glass cover plate 10 on the housing 50 by adhering the glue dispensing surface 11 and the contact surface 54. This application embodiment is through setting up admittedly gluey structure 12 on the some glue face 11 at glass apron 10 and set up excessive gluey groove 56 on the contact surface 54 of casing 50 for colloid 60 forms a reliable connection through this admittedly gluey structure 12 with glass apron 10, and this excessive gluey groove 56 is used for holding the colloid 60 that overflows, can increase the bonding area between glass apron 10 or casing 50 and colloid 60, the bonding force between effectual increase touch-sensitive screen glass apron 10 and the casing 50, in order to realize super narrow frame point gluey technique, promote the screen and account for the ratio, and prevent that the touch-sensitive screen from coming unstuck, in order to reach waterproof effect.

The glue overflow groove 56 is used for accommodating the overflowed glue 60, and the glue overflow groove 56 can increase the glue accommodating amount, enhance the reliable connection between the glass cover plate 10 and the housing 50 to a certain extent, and ensure that the glue 60 does not overflow to the appearance surface of the display device 200 or the electronic device 100.

In some embodiments, as shown in fig. 5, the glue fixing structure 12 includes a first groove 121 formed on the dispensing surface 11, wherein at least a portion of the glue 60 is accommodated in the first groove 121 to form the first bending structure 61. In this application embodiment, the glue 60 penetrates into the first groove 121 and then forms the first bending structure 61, so that the glue 60 and the glass cover plate 10 form a reliable connection through the first bending structure 61, the bonding force between the glass cover plate 10 and the housing 50 is further increased, a plurality of first grooves 121 can be arranged on the dispensing surface 11 of the glass cover plate 10, so that a plurality of first bending structures 61 are formed, the narrowest dispensing width is used, the ultra-narrow frame design is realized, and the screen occupation ratio is improved.

The colloid 60 may be a hot melt adhesive, which is a plastic adhesive, and the physical state of the adhesive changes with the temperature within a certain temperature range, while the chemical properties of the adhesive do not change. Compared with common glue, the hot melt adhesive has higher adhesive strength and better curing effect. And the thickness of the glue is easier to control, and the design requirement of the narrow frame of the electronic equipment can be met. In addition, the hot melt adhesive belongs to thermoplastic polyurethane, and products bonded by the hot melt adhesive are easier to detach or repair. For example, the hot melt adhesive can be a PUR hot melt adhesive, namely a moisture curing reaction type polyurethane hot melt adhesive, the main component of the hot melt adhesive is an isocyanate-terminated polyurethane prepolymer, the adhesiveness and toughness (elasticity) of the PUR hot melt adhesive can be adjusted, and the PUR hot melt adhesive has excellent adhesive strength, temperature resistance, chemical corrosion resistance and aging resistance.

For example, the glue 60 may be UV (UV glue), which is also called photosensitive glue or UV curable glue, and is a kind of adhesive that can be cured only by irradiation of Ultraviolet (UV) light, and it can be used as an adhesive, and can also be used as a glue for paint, coating, ink, etc. The UV glue curing principle is that a photoinitiator (or photosensitizer) in a UV curing material generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet light, and initiates monomer polymerization and crosslinking chemical reaction, so that the adhesive is converted from a liquid state to a solid state within several seconds. For example, the colloid 60 may be black uv glue, which can block light and shield light, and has the characteristics of strong bonding force, fast curing, thin glue dispensing, etc. by bonding the glass cover plate 10 and the housing 50 with the black uv glue, light leakage of the display module 20 can be prevented, and degumming of the glass cover plate 10 can be prevented, thereby playing a role of water proofing.

For example, the colloid 60 may be OCA (optical Clear Adhesive) glue or the like. The OCA optical adhesive has the characteristics of no color, transparency, high light transmittance (total light transmittance is more than 99%), high adhesive force, high weather resistance, water resistance, high temperature resistance, ultraviolet resistance and the like, has controlled thickness, can provide uniform spacing, and does not generate the problems of yellowing, peeling and deterioration after long-term use. The OCA optical adhesive is one of the important raw materials of the touch screen, and is a double-sided adhesive tape without a base material.

For example, the glue 60 may be a room temperature glue or a back glue.

The electronic device 100 provided by the embodiment of the application, set up glue fixation structure 12 on the dispensing surface 11 through glass cover plate 10 and set up glue overflow groove 56 on the contact surface 54 of casing 50, can increase the bonding area between glass cover plate 10 or casing 50 and colloid 60, wherein, glue fixation structure 12 includes first recess 121, at least some colloid holding is in order to form first bending structure 61 in first recess 121, can effectually increase the adhesive force between touch-sensitive screen glass cover plate 10 and casing 50, in order to realize super narrow frame dispensing technique, promote the screen to account for the ratio, and prevent that the touch-sensitive screen from coming unstuck, in order to reach waterproof effect.

In some embodiments, an ink layer 70 is disposed between the glass cover plate 10 and the gel 60. The ink layer 70 may be formed of hydrophilic ink, for example, the ink layer 70 may be formed of hydrophilic ink with high surface energy or low contact angle. The ink with high surface energy or low contact angle has high viscosity, and the glass cover plate 10 and the colloid 60 can be effectively and reliably bonded by arranging the ink layer 70 with high viscosity between the glass cover plate 10 and the colloid 60.

The adhesion occurs between the interfaces in contact with each other, and the formation of the adhesion is required to have both wettability and adhesion. Wetting is also called wetting, and is a phenomenon of uniform spreading of a liquid under the action of intermolecular forces on the surface of a solid, that is, the affinity of the liquid for the solid. Wetting of liquids is mainly caused by surface tension, both liquids and solids have surface tension, which is called surface tension for liquids, and solids are called surface energy. Wettability is mainly determined by the surface energy of the adhesive and the adherend. The wetting of the adhesive to the adherend is a prerequisite for bonding, and the purpose of bonding must be achieved by the ability to develop adhesive strength. The adhesive strength refers to a bonding force between an adhesive and an adherend, and is generated depending not only on the structure and state of the adhesive and the surface of the adherend, but also closely related to the process conditions of the bonding process, and is a force or a bonding force of the adherend to the interface of the adhesive, including a mechanical interlocking force, an intermolecular force, a chemical bond force, and the like. Wetting is a prerequisite for bonding. The surface energy and wettability relation, the solid surface energy size determines the wettability, the basic condition of the liquid on the solid surface can spread spontaneously is that the surface energy of the liquid is less than the surface energy of the solid, the lower the surface energy of the liquid, the higher the surface energy of the solid is, the more favorable the spreading is, otherwise, the spreading is not favorable. The same liquid has good wettability on a solid surface with large surface energy, so that the surface energy is an important factor influencing the bonding strength, and the wettability of the adhesive on an adherend can be enhanced by reducing the surface energy of the adhesive or increasing the surface energy of the adherend, thereby improving the bonding strength. In the embodiment of the present application, the adhesive is the adhesive 60, the adherend is the glass cover plate 10, and in order to increase the bonding strength between the glass cover plate 10 and the adhesive 60, the high surface energy ink layer 70 may be sprayed on the lower surface of the glass cover plate 10.

The water drop angle is defined as an included angle between a gas-liquid phase interface and a solid-liquid phase interface at a solid-liquid-gas three-phase interface, the water drop angle is a scale for displaying the humidity of the surface of the solid, most of sessile substance drops are used for measurement, the low contact angle indicates that the humidity is high (hydrophilicity), and the surface is easy to stick. A high contact drop angle indicates that the surface exhibits hydrophobicity and poor surface adhesion. In the embodiment of the present application, in order to increase the bonding strength between the glass cover plate 10 and the adhesive 60, an ink layer 70 with a low contact angle may be sprayed on the lower surface of the glass cover plate 10.

In some embodiments, the ink layer 70 may be a black ink layer, and the ink layer 70 can increase the bonding strength between the glass cover plate 10 and the colloid 60 and prevent the light leakage of the display module 20.

In some embodiments, as shown in fig. 5, a support 90 is disposed between the glass cover plate 10 and the housing 50. The supporting portion 90 can ensure that the glue in the Z direction between the glass cover plate 10 and the housing 50 fills the thickness space to ensure the thickness of the glue dispensing amount in the Z direction, and the glue dispensing amount with a certain thickness can ensure the adhesive force between the glass cover plate 10 and the housing 50 to a certain extent.

In some embodiments, as shown in fig. 5, the support 90 is integrally formed with the housing 50.

In some embodiments, the support portion 90 is integrally formed with the glass cover plate 10.

In some embodiments, as shown in fig. 3, the glass cover plate 10 covers the entire housing 50.

In some embodiments, as shown in fig. 4, a step 521 is formed at the top end of the side wall 52 of the housing 50, and the glass cover 10 is overlapped on the step 521, and the step 521 covers the periphery of the glass cover 10.

In some embodiments, the first groove 121 includes a first cavity 1211 perpendicular to the dispensing surface 11 and a second cavity 1212 extending outward from the bottom of the first cavity 1211, the molding compound 60 fills the first cavity 1211 in the first groove 121 to form the connecting portion 611 of the first bending structure 61, and the molding compound 60 fills the second cavity 1212 in the first groove 121 to form the bending portion 612 of the first bending structure 61.

In some embodiments, the second cavity 1212 of the first groove 121 is formed by extending outward from two sides of the bottom of the first cavity 1211, and the bending portion 612 of the first bending structure 61 is formed at two sides of the connecting portion 611.

In some embodiments, the first groove 121 includes at least one of a dovetail groove, a sector groove, a T-shaped groove, and a hook-shaped groove.

As shown in fig. 5 and 6, the first groove 121 is a dovetail groove, the second cavity 1212 of the dovetail groove 121 is formed by extending outward from two sides of the bottom of the first cavity 1211, and the bent portion 612 of the first bent structure 61 is formed at two sides of the connecting portion 611, so that the first bent structure 61 is in a dovetail structure. The end of the first bending structure 61 connected to the dispensing surface 11 is a root of the first bending structure 61, the end of the first bending structure 61 far away from the dispensing surface 11 is an end of the first bending structure 61, and the cross section of the root of the first bending structure 61 is smaller than that of the end of the first bending structure 61, so that the overall tensile strength of the glue 60 is increased, and the overall adhesion is enhanced. In fig. 5, an included angle formed between the side wall of the dovetail groove 121 and the low wall and/or the dispensing surface 11 and an included angle formed between the side wall of the dovetail groove 121 and the formed side wall are chamfers. Fig. 6 differs from fig. 5 in that the included angle formed between the side wall of the dovetail groove 121 and the lower wall and/or the dispensing surface 11 is a rounded corner, which is more favorable for sufficient filling of the glue 60.

As shown in fig. 7 and 8, the first groove 121 is a fan-shaped groove, the second cavity 1212 of the fan-shaped groove 121 is formed by extending outward from two sides of the bottom of the first cavity 1211, and the bending portion 612 of the first bending structure 61 is formed at two sides of the connecting portion 611, so that the first bending structure 61 is in a fan-shaped structure. The end of the first bending structure 61 connected to the dispensing surface 11 is a root of the first bending structure 61, the end of the first bending structure 61 far away from the dispensing surface 11 is an end of the first bending structure 61, and the cross section of the root of the first bending structure 61 is smaller than that of the end of the first bending structure 61, so that the overall tensile strength of the glue 60 is increased, and the overall adhesion is enhanced. Wherein, the side wall of the sector groove 121 in fig. 7 is a plane structure. The difference between fig. 8 and fig. 7 is that the side walls of the fan-shaped grooves 121 are in an arc structure, and the contact area of the arc structure is larger than that of the planar structure, so that the bonding area between the glue 60 and the glass cover plate 10 is further increased, and the bonding strength is increased.

As shown in fig. 9, the first groove 121 is a T-shaped groove, the second cavity 1212 of the T-shaped groove 121 is formed by extending from two sides of the bottom of the first cavity 1211 outwards, and the bending portion 612 of the first bending structure 61 is formed at two sides of the connecting portion 611, so that the first bending structure 61 is in a T-shaped structure. The end of the first bending structure 61 connected to the dispensing surface 11 is a root of the first bending structure 61, the end of the first bending structure 61 far away from the dispensing surface 11 is an end of the first bending structure 61, and the cross section of the root of the first bending structure 61 is smaller than that of the end of the first bending structure 61, so that the overall tensile strength of the glue 60 is increased, and the overall adhesion is enhanced.

As shown in fig. 10, the first groove 121 is a hook-shaped groove, the second cavity 1212 of the hook-shaped groove 121 is formed by extending from two sides of the bottom of the first cavity 1211 outwards, the bending portion 612 of the first bending structure 61 is formed at two sides of the connecting portion 611, and the end of the bending portion 612 is bent towards the dispensing surface 11, so that the first bending structure 61 is in a hook-shaped structure. The end of the first bending structure 61 connected to the dispensing surface 11 is a root of the first bending structure 61, the end of the first bending structure 61 far away from the dispensing surface 11 is an end of the first bending structure 61, and the cross section of the root of the first bending structure 61 is smaller than that of the end of the first bending structure 61, so that the overall tensile strength of the glue 60 is increased, and the overall adhesion is enhanced.

In some embodiments, the second cavity 1212 of the first groove 121 is formed by extending outward from a side of the bottom of the first cavity 1211, and the bent portion 612 of the first bent structure 61 is formed at a side of the connecting portion 611.

In some embodiments, the first groove 121 includes at least one of a J-shaped groove and an L-shaped groove.

As shown in fig. 11, the first groove 121 is a J-shaped groove, the second cavity 1212 of the J-shaped groove 121 is formed by extending outward from a side of the bottom of the first cavity 1211, and the bent portion 612 of the first bent structure 61 is formed at a side of the connecting portion 611, so that the first bent structure 61 is in a J-shaped structure. The end of the first bending structure 61 connected to the dispensing surface 11 is a root of the first bending structure 61, the end of the first bending structure 61 far away from the dispensing surface 11 is an end of the first bending structure 61, and the cross section of the root of the first bending structure 61 is smaller than that of the end of the first bending structure 61, so that the overall tensile strength of the glue 60 is increased, and the overall adhesion is enhanced.

In some embodiments, as shown in fig. 12, the first groove 121 includes a first cavity 1211 perpendicular to the contact surface 54 and a second cavity 1212 extending outward from a sidewall of the first cavity 1211, the colloid 60 fills the first cavity 1211 in the first groove 121 to form the connecting portion 611 of the first bending structure 61, and the colloid 61 fills the second cavity 1212 in the first groove 121 to form the bending portion 612 of the first bending structure 61.

In some embodiments, the first groove 121 includes a rivet hole formed by extending the second cavity 1212 from the sidewall of the first cavity 1211 to an outside in a zigzag or step-like structure, and the bending portion 612 of the first bending structure 61 is formed on the sidewall of the connecting portion 611, so that the first bending structure 61 is in a rivet structure. By forming the sidewall of the first groove 121 with a saw-tooth shape or a step shape, the contact area between the glue 60 and the glass cover plate 10 can be increased, so that the overall tensile strength of the glue 60 is increased, thereby enhancing the overall adhesion.

In some embodiments, as shown in fig. 13, the glue fixing structure 12 includes a rough structure 122 formed on the dispensing surface 11, so that a frosted surface is formed on the dispensing surface 11 to increase the adhesion between the glass cover plate 10 and the housing 50.

In some embodiments, as shown in fig. 14, a rough structure 541 may also be formed on the contact surface 54 of the glue 60 and the housing 50, so as to form a frosted surface on the contact surface 54, thereby increasing the adhesion between the glass cover plate 10 and the housing 50.

In some embodiments, as shown in fig. 15, a second groove 55 is disposed on the contact surface 54 of the housing 50, wherein at least a portion of the gel 60 is received in the second groove 55 to form a second bending structure 62. In the embodiment of the present application, the glue 60 penetrates into the second groove 55 to form the second bending structure 62, so that the glue 60 and the housing 50 form a reliable connection through the second bending structure 62, the bonding area between the glue 60 and the housing 50 is increased, and the bonding force between the glass cover plate 10 and the housing 50 is further increased. A plurality of second grooves 55 may be disposed on the contact surface 54 of the housing 50 to form a plurality of second bending structures 62, so as to realize the narrowest dispensing width, realize the ultra-narrow bezel design, and improve the screen coverage.

In some embodiments, the second groove 55 and the first groove 121 may be the same shape or different shapes. The second grooves 55 and the first grooves 121 may be respectively provided in plural, the positions of the second grooves 55 and the first grooves 121 may be arranged in a staggered manner, for example, one second groove 55 is provided on the contact surface 54 corresponding to the dispensing area between every two first grooves 121, and one first groove 121 is provided on the dispensing surface 11 corresponding to the dispensing area between every two second grooves 55.

In some embodiments, as shown in fig. 16, the second groove 55 and the first groove 121 are arranged in a mirror symmetry manner, that is, the second groove 55 and the first groove 121 are arranged in a mirror symmetry manner in shape and position, so that the second bending structure 62 formed on the second groove 55 and the first bending structure 61 formed on the first groove 121 are symmetrical to each other. Through the first bending structure 61 and the second bending structure 62 formed symmetrically, the adhesive force between the glass cover plate 10 and the housing 50 can be increased to a greater extent, and the waterproof effect of the display screen is better.

In some embodiments, as shown in fig. 17 or fig. 18, a difference between fig. 17 and fig. 3 or a difference between fig. 18 and fig. 4 is that an ink layer 70 may partially cover a glue 60, such that a portion of the glue 60 is directly contacted and adhered to the glass cover plate 10, and a portion of the glue 60 is adhered to the ink layer 70, where the glue 60 may be a black light-shielding glue, and the black light-shielding glue 60 may block light from a frame of the display screen and may also effectively adhere the glass cover plate 10 to the housing 50, and at the same time, the ink layer 70 may increase an adhesion strength between the glass cover plate 10 and the glue 60 and may also prevent light leakage from the display screen. For example, the black light-shielding glue may be black uv glue.

The electronic device 100 provided by the embodiment of the application, glue the face 11 through setting up admittedly glue structure 12 and set up gluey groove 56 on the contact surface 54 of casing 50 on the point of glass apron 10, make colloid 60 and glass apron 10 form a reliable connection through this gluey structure 12 admittedly, and this gluey groove 56 that overflows is used for holding the colloid 60 that overflows, can increase the bonding area between glass apron 10 or casing 50 and colloid 60, the effectual bonding force that increases between touch-sensitive screen glass apron 10 and the casing 50, and glue overflow groove 56 can increase the holding capacity, can strengthen the reliable connection of glass apron 10 and casing 50 to a certain extent, and guarantee that colloid 60 does not overflow electronic device 100's outward appearance face. In addition, the second groove 55 is formed on the contact surface 54 of the glass cover plate 10 and the housing 50, and at least part of the adhesive is accommodated in the second groove 55 to form the second bending structure 62, so that the bonding area between the housing 50 and the adhesive 60 can be increased, and the bonding force between the touch screen glass cover plate 10 and the housing 50 can be effectively increased. By arranging the ink layer 70 between the glass cover plate 10 and the colloid 60, the effective and reliable bonding between the glass cover plate 10 and the colloid 60 can be further ensured. The supporting portion 90 is disposed between the glass cover plate 10 and the housing 50, so that a Z-direction glue filling thickness space between the glass cover plate 10 and the housing 50 can be ensured, the thickness of the glue dispensing amount in the Z direction can be ensured, and the adhesive force between the glass cover plate 10 and the housing 50 can be ensured to a certain extent by the glue dispensing amount with a certain thickness. To sum up, the electronic device 100 provided by the embodiment of the present application can realize the ultra-narrow frame dispensing technology, promote the screen to account for, and prevent the touch screen from degumming, so as to achieve the waterproof effect. In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The foregoing describes in detail an electronic device provided in an embodiment of the present application, and a specific example is applied to explain the principle and the implementation of the present application, and the description of the foregoing embodiment is only used to help understand the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. An electronic device, comprising:

the shell comprises a substrate and a side wall extending from the periphery of the substrate, and the side wall surrounds to form an accommodating space;

the glass cover plate is covered on the side wall of the shell;

the display module is arranged below the glass cover plate and is positioned in the accommodating space;

the glue body is arranged between the glass cover plate and the shell, the glue fixing structure is arranged on the glue dispensing surface of the glass cover plate, which is in contact with the glue body, the glue overflow groove is arranged on the contact surface of the shell, which is in contact with the glue body, and the glue body fixes the glass cover plate on the shell by bonding the glue dispensing surface and the contact surface; the glue fixing structure comprises a first groove formed on the glue dispensing surface, wherein at least part of the glue body is accommodated in the first groove to form a first bending structure; the first bending structure is connected to the root of the first bending structure at one end of the dispensing surface, the end, far away from the dispensing surface, of the first bending structure is the end of the first bending structure, and the cross section of the root of the first bending structure is smaller than that of the end of the first bending structure.

2. The electronic device according to claim 1, wherein the first recess includes a first cavity perpendicular to the dispensing surface and a second cavity extending outward from a bottom of the first cavity, the first cavity in the first recess is filled with the glue to form the connecting portion of the first bending structure, and the second cavity in the first recess is filled with the glue to form the bending portion of the first bending structure.

3. The electronic device according to claim 2, wherein the second cavity of the first groove is formed by extending outward from two sides of the bottom of the first cavity, and the bending portion of the first bending structure is formed at two sides of the connecting portion.

4. The electronic device of claim 2, wherein the second cavity of the first recess is formed by extending outward from one side of the bottom of the first cavity, and the bending portion is formed on one side of the connecting portion.

5. The electronic device according to claim 1, wherein the first recess includes a first cavity perpendicular to the dispensing surface and a second cavity extending outward from a sidewall of the first cavity, the first cavity in the first recess is filled with the glue to form the connecting portion of the first bending structure, and the second cavity in the first recess is filled with the glue to form the bending portion of the first bending structure.

6. The electronic device according to claim 1, wherein a second groove is disposed on the contact surface of the housing, and at least a portion of the adhesive is accommodated in the second groove to form a second bending structure.

7. The electronic device of claim 6, wherein the second recess is arranged in mirror symmetry with the first recess.

8. The electronic device of claim 1, wherein the glue bond structure comprises a roughness structure formed on the glue dispensing surface.

9. The electronic device of any of claims 1-8, wherein a support is disposed between the glass cover plate and the housing.

10. The electronic device of claim 9, wherein the support portion is integrally formed with the housing.

11. The electronic device of claim 1, wherein an ink layer is disposed between the glass cover plate and the gel, and the ink layer is formed of hydrophilic ink.

12. The electronic device according to claim 1, wherein a stepped portion is formed at a top end of a side wall of the housing, and the glass cover is overlapped on the stepped portion.

13. The electronic device of claim 1, wherein the glass cover plate covers the entire housing.