CN108279517A - A kind of IC chip binding structure and preparation method thereof, display device - Google Patents
A kind of IC chip binding structure and preparation method thereof, display device Download PDFInfo
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- CN108279517A CN108279517A CN201810263687.6A CN201810263687A CN108279517A CN 108279517 A CN108279517 A CN 108279517A CN 201810263687 A CN201810263687 A CN 201810263687A CN 108279517 A CN108279517 A CN 108279517A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008093 supporting effect Effects 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A kind of IC chip binding structure of present invention offer and preparation method thereof, display device, it is related to display technology field, can improve the prior art in binding procedure because IC chip binding structure cannot with substrate is smooth is bonded, cause IC chip binding structure stress uneven, and then causes conductive bumps that cannot realize stable electrical contact with other devices or IC chip binding structure is caused the problem of Crack occur.The IC chip binds structure, includes the multiple conductive bumps of substrate and setting on the substrate, and the conductive bumps are electrically connected with the chip in the substrate；The substrate includes the firstth area and is arranged in secondth area on firstth area periphery, and the conductive bumps are arranged in secondth area；Further include at least one support protrusion of setting on the substrate, the support protrusion is arranged in firstth area.
Description
Technical Field
The invention relates to the technical field of display, in particular to an integrated circuit chip binding structure, a manufacturing method thereof and a display device.
Background
With the continuous development of display technology, large-sized display devices, such as liquid crystal displays, liquid crystal televisions, flat panel displays, and small-medium-sized electronic products, such as mobile phones, digital cameras, etc., are mainly developed in a light, thin, short, and small trend, so as to improve the use comfort and facilitate carrying. Under the development trend, the integrated circuit chip binding structure in the display module is required to have high density and small volume, and the occupation of the whole space of the display device is reduced as much as possible while the display module is connected and transmits input signals and output signals.
An example of a bonding structure of an integrated circuit chip in the prior art, as shown in fig. 1, includes a substrate 100 and a conductive bump 200 disposed on the substrate 100, where the substrate 100 includes a chip 10 having a contact pad, a redistribution Layers (RDLs) 20 electrically connected to the contact pad on the chip 10, and a package layer 30 for protecting the chip 10, and the conductive bump 200 is electrically connected to the redistribution Layers 20 to enable the chip 10 to be connected to other devices. As shown in fig. 2, the conductive bumps 200 are generally arranged at the edges of the substrate 100, and the conductive bumps 200 are not disposed in the central region.
The integrated circuit chip binding structure is bound in the flexible display panel for indication, in the integrated circuit chip binding process, the integrated circuit chip binding structure is generally bound and installed in a heating or pressurizing state, the corner of the flexible substrate is easy to warp and deform after being heated, a state with a low middle and a high periphery is formed, the deformation degree of the integrated circuit chip binding structure is smaller than that of the flexible substrate, and a gap exists between the central area of the integrated circuit chip binding structure and the flexible substrate.
Thus, during the bonding process, the central region of the bonding structure of the ic chip is not supported, and the peripheral region is supported by the flexible substrate, so that the pressure applied to each part is not uniform, and the conductive bump 200 cannot be stably electrically contacted with other devices. In addition, the package layer 30 of the integrated circuit chip bonding structure is usually made of an inorganic material, the substrate 100 is relatively hard and easily brittle, and the pressure applied to each part is not uniform, which easily causes Crack in the integrated circuit chip bonding structure, and has a great influence on the yield of the product and the reliability of the product in long-term use.
Disclosure of Invention
Embodiments of the present invention provide an integrated circuit chip bonding structure, a manufacturing method thereof, and a display device, which can solve the problem in the prior art that the integrated circuit chip bonding structure cannot be smoothly attached to a substrate in the bonding process, so that the integrated circuit chip bonding structure is unevenly stressed, and further, a conductive bump cannot be stably electrically contacted with other devices or the integrated circuit chip bonding structure has Crack.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
in a first aspect, an integrated circuit chip bonding structure is provided, which includes a substrate and a plurality of conductive bumps disposed on the substrate, wherein the conductive bumps are electrically connected to chips in the substrate; the substrate comprises a first area and a second area arranged on the periphery of the first area, and the conductive protrusion is arranged on the second area; further comprising at least one support protrusion disposed on the substrate, the support protrusion being disposed in the first region.
Optionally, the thickness of the conductive protrusion is the same as the thickness of the support protrusion in a direction perpendicular to the substrate.
Optionally, the material of the conductive bump is the same as the material of the support bump.
Optionally, the cross-sectional area of the plurality of conductive bumps in the direction parallel to the substrate is not exactly the same; the cross-sectional area of the support protrusion in a direction parallel to the substrate is larger than the minimum cross-sectional area of the plurality of conductive protrusions and smaller than the maximum cross-sectional area of the plurality of conductive protrusions.
Optionally, the first region is provided with a plurality of supporting protrusions, and the plurality of supporting protrusions are divided into a plurality of groups; the support protrusions in each set are arranged in two intersecting rows.
Optionally, the first region is provided with a plurality of supporting protrusions, and the plurality of supporting protrusions are divided into a plurality of groups; the support protrusions in each set are arranged in a closed pattern.
Optionally, a plurality of the support protrusions are parallel to each other.
Based on the above, optionally, the second region is arranged around the first region.
In a second aspect, a display device is provided, which includes a display panel, and further includes the integrated circuit chip bonding structure according to the first aspect bonded to the display panel.
Optionally, the display panel is a flexible display panel.
In a third aspect, a method for manufacturing a bonding structure of an integrated circuit chip is provided, the bonding structure of the chip includes a substrate and a plurality of conductive bumps formed on the substrate, and the chip on the substrate is electrically connected to the conductive bumps; the substrate comprises a first area and a second area located on the periphery of the first area, and the conductive bump is formed on the second area; the chip bonding structure further comprises at least one support bump formed on the substrate, the support bump being formed on the first region; wherein the first region is formed with at least one support protrusion; the conductive bumps are formed in synchronization with the support bumps.
The embodiment of the invention provides an integrated circuit chip binding structure, a preparation method thereof and a display device, wherein the integrated circuit chip binding structure comprises a substrate, a conductive bulge arranged on the periphery of the substrate and a supporting bulge arranged in the central area of the substrate, and in the binding process, a gap between the central area of the integrated circuit chip binding structure and a substrate is compensated by the supporting bulge, so that all parts of the integrated circuit chip binding structure are uniformly stressed, the binding effect is ensured, and the occurrence of Crack in the integrated circuit chip binding structure is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a cross-sectional view of a bonding structure of an integrated circuit chip provided in the prior art;
FIG. 2 is a top view of a bonding structure of an IC chip according to the prior art;
FIG. 3 is a cross-sectional view of a bonding structure of an integrated circuit chip according to an embodiment of the present invention;
FIG. 4 is a first top view of a bonding structure of an integrated circuit chip according to an embodiment of the present invention;
fig. 5 is a second top view of an integrated circuit chip bonding structure according to an embodiment of the present invention;
fig. 6 is a third top view of an integrated circuit chip bonding structure according to an embodiment of the present invention;
fig. 7 is a fourth top view of an integrated circuit chip bonding structure according to an embodiment of the present invention;
fig. 8 is a fifth top view of a bonding structure of an ic chip according to an embodiment of the invention;
fig. 9 is a schematic top view of a display device according to an embodiment of the invention.
Reference numerals
01-a display area; 02-non-display area; 10-a chip; 20-a rewiring layer; 30-an encapsulation layer; 100-a substrate; 110-a first zone; 120-a second zone; 200-conductive bumps; 300-support protrusions; 400-a gate line; 410-gate line lead; 500-data lines; 510-data line leads; 600-circuit board.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides an integrated circuit chip bonding structure, as shown in fig. 3, including a substrate 100 and a plurality of conductive bumps 200 disposed on the substrate 100, wherein the conductive bumps 200 are electrically connected to a chip 10 in the substrate 100; as shown in fig. 4, the substrate 100 includes a first region 110 and a second region 120 disposed at a periphery of the first region 110, and the conductive bump 200 is disposed at the second region 120; further comprising at least one support protrusion 300 disposed on the substrate 100, the support protrusion 300 being disposed on the first region 110.
It should be noted that, first, the structure of the substrate 100 is the same as the prior art, and for the area division of the substrate 100, as shown in fig. 4, the exemplary second region 120 is in the shape of a strip, the second region 120 is disposed on two opposite sides of the first region 110 along the length direction thereof, and signals are transmitted from one side and transmitted from the other side. Of course, the position relationship between the first region 110 and the second region 120 may be in other manners, the first region 110 is located in the central region of the integrated circuit chip bonding structure, and the second region 120 is disposed at the periphery of the first region 110.
Second, the supporting protrusion 300 is disposed in the first region 110, and is configured to provide a supporting force for a central region of the integrated circuit chip bonding structure during the bonding process of the integrated circuit chip bonding structure, so that each part of the integrated circuit chip bonding structure is stressed uniformly as much as possible, thereby ensuring the bonding effect and preventing the integrated circuit chip bonding structure from Crack. The specific shape, material, number of the supporting protrusions 300 and the arrangement position of the first region 110 are not limited, and the integrated circuit chip bonding structure is supported in the bonding process.
It should be understood by those skilled in the art that the supporting protrusion 300 functions to make the integrated circuit chip bonding structure uniformly stressed during the bonding process, and therefore, the thickness of the supporting protrusion 300 should not be too high nor too low as to properly set the relationship between the thickness of the supporting protrusion 300 and the thickness of the conductive protrusion 200 according to the specific application scenario.
And thirdly, the display panel comprises a display area and a non-display area, the display area comprises a plurality of transversely and longitudinally crossed grid lines and data lines, and the display of each pixel in the display area of the whole display panel is controlled by controlling signals of the plurality of transversely and longitudinally crossed grid lines and data lines, so that the picture display is realized. For example, for a Thin Film transistor-Liquid Crystal Display (TFT-LCD), an h (horizontal) side driver chip (IC) is usually disposed in a non-Display region around a Display region in a length direction, a v (vertical) side driver chip is disposed in a non-Display region around a Display region in a width direction, a scan signal line lead of the non-Display region leads out a gate line signal and is electrically connected to a conductive bump 200 in a chip bonding structure of an Integrated Circuit, and a data signal line lead of the non-Display region leads out a data signal and is electrically connected to a conductive bump 200 in the chip bonding structure of the Integrated Circuit, so that the data signal line lead is connected to a Circuit board through the chip bonding structure of the Integrated Circuit, and signals input and output to the gate line and the data line of the Display panel are transmitted.
The integrated circuit chip binding structure provided by the embodiment of the invention comprises a substrate 100, a conductive bulge 200 arranged on the periphery of the substrate 100 and a supporting bulge 300 arranged in the central area of the substrate 100, wherein in the binding process, a gap between the central area of the integrated circuit chip binding structure and a substrate is compensated by the supporting bulge 300, so that all parts of the integrated circuit chip binding structure are uniformly stressed, the binding effect is ensured, and the occurrence of Crack in the integrated circuit chip binding structure is avoided.
In order to avoid the small gap existing between the central region of the integrated circuit chip bonding structure and the substrate and the too large thickness of the supporting bump 300, which results in poor contact between the conductive bump 200 and the substrate, it is preferable that the thickness of the conductive bump 200 is the same as the thickness of the supporting bump 300 in the direction perpendicular to the substrate 100 according to an embodiment of the present invention.
Further, in order to save the manufacturing process, improve the production efficiency, and reduce the cost, in the embodiment of the present invention, it is preferable that the material of the conductive bump 200 is the same as the material of the support bump 300.
Here, although the material of the conductive bump 200 is the same as that of the support bump 300, the support bump 300 is not electrically connected to the chip in the substrate 100, and thus the support bump 300 still only serves as a support.
Preferably, as shown in fig. 4, the cross-sectional areas of the plurality of conductive bumps 200 disposed on the substrate 100 in the direction parallel to the substrate 100 are not completely the same, and the cross-sectional area of the support bump 300 in the direction parallel to the substrate 100 is larger than the minimum cross-sectional area of the plurality of conductive bumps 200 and smaller than the maximum cross-sectional area of the plurality of conductive bumps 200.
In order to satisfy the signal transmission requirement, the shape of the conductive bump 200 is different according to the function of the conductive bump 200, and therefore, the cross-sectional area of the conductive bump 200 in the direction parallel to the substrate 100 has a plurality of values, and the cross-sectional area of the supporting bump 300 in the direction parallel to the substrate 100 is greater than the minimum value of the plurality of values and less than the maximum value of the plurality of values.
Here, in order to reduce the resistance of the connection line when the conductive bumps 200 are connected to other signals, satisfy the minimum resistance specification value, and ensure normal signal input, the plurality of conductive bumps 200 provided on the substrate 100 are provided so that the cross-sectional areas in the direction parallel to the substrate 100 are not exactly the same. And the supporting protrusion 300 is provided such that the cross-sectional area in the direction parallel to the substrate 100 is greater than the minimum cross-sectional area of the plurality of conductive protrusions 200 and less than the maximum cross-sectional area of the plurality of conductive protrusions 200, the supporting effect can be secured.
In order to improve the supporting effect, optionally, as shown in fig. 5 and 6, the first region 110 is provided with a plurality of supporting protrusions 300, the plurality of supporting protrusions 300 are divided into a plurality of groups, and the supporting protrusions 300 in each group are arranged in two intersecting rows.
That is, each group includes two rows of supporting protrusions 300, the two rows of supporting protrusions 300 intersect, each row includes a plurality of supporting protrusions 300, the arrangement of the plurality of supporting protrusions 300 in each row is not limited, and fig. 5 and 6 are only schematic.
The shapes of the supporting protrusions 300 can be the same or not completely the same, and the supporting protrusions can be reasonably arranged according to needs. Of course, the arrangement of the supporting protrusions 300 in the plurality of sets may not be exactly the same, and fig. 5 and 6 are merely exemplary of the same.
In order to improve the supporting effect, optionally, as shown in fig. 7 and 8, the first region 110 is provided with a plurality of supporting protrusions 300, the plurality of supporting protrusions 300 are divided into a plurality of groups, and the supporting protrusions 300 in each group are arranged in a closed pattern.
Note that, the specific shape of the closed figure is not limited, and the closed figure may be a closed figure of any shape, and of course, the shapes of the closed figures in the plurality of groups may not be completely the same, and fig. 7 and 8 are merely exemplified by the same.
In order to simplify the manufacturing process, it is preferable that the plurality of support protrusions 300 are parallel to each other when the plurality of support protrusions 300 are disposed on the substrate 100.
Based on the above, in order to increase the function of the integrated circuit chip bonding structure, it is preferable that the second region 120 is disposed around the first region 110 as shown in fig. 5 to 8.
That is, a circle of conductive bumps 200 is disposed on the substrate 100, and the conductive bumps 200 at different positions play different roles.
The embodiment of the invention also provides a display device which comprises a display panel and the integrated circuit chip binding structure bound with the display panel.
Of course, the display panel herein may be a flexible display panel or a non-flexible display panel.
The display device provided by the embodiment of the invention comprises the integrated circuit chip binding structure, and the beneficial effects of the display device are the same as those of the integrated circuit chip binding structure, and are not repeated herein.
Illustratively, as shown in fig. 9, the display panel includes a display region 01 and a non-display region 02 surrounding the display region 01, a plurality of gate lines 400 and data lines 500 are disposed in the display region 01 of the display panel, the plurality of gate lines 400 are connected to gate line signal line leads 410 in the non-display region 02, and the plurality of data lines 500 are connected to data line signal line leads 510 in the non-display region 02.
The substrate 100 is fixedly disposed in the non-display area 01 and connected to the circuit board 600, and the conductive bump 200 is electrically connected to the gate line signal line lead 410 and the circuit board 600 to implement transmission of a scanning signal; alternatively, the conductive bumps 200 are electrically connected to the data line signal line leads 510 and the wiring board 600 to realize transmission of data signals.
As shown in fig. 9, a plurality of gate lines 400 and data lines 500 crossing in the horizontal and vertical directions in a display region 01 of a display panel define a plurality of sub-pixel units, and the control of each sub-pixel unit realizes the screen display of the display region 01. The plurality of gate lines 400 are connected to the gate line signal line lead 410 in the non-display region 02, and are electrically connected to the integrated circuit chip bonding structure through the gate line signal line lead 410, and the integrated circuit chip bonding structure is also electrically connected to the circuit board 600, so that the circuit board 600 can be connected to the gate line signal line lead 410 through the integrated circuit chip bonding structure to control input and output of gate line signals on the display panel. Similarly, the plurality of data lines 500 are electrically connected to the data line signal line leads 510 in the non-display area 02, and are electrically connected to the integrated circuit chip bonding structure through the data line signal line leads 510, and the integrated circuit chip bonding structure is also electrically connected to the circuit board 600, so that the circuit board 600 can be connected to the data line signal line leads 510 through the integrated circuit chip bonding structure to control the input and output of data line signals on the display panel.
The circuit board 600 is generally a flexible printed circuit board, and after the flexible printed circuit board is connected with the integrated circuit chip binding structure, the flexible printed circuit board can be bent, so that the flexible printed circuit board can be bent to the back of the display panel, and the space of the non-display area 02 of the display panel is saved.
The embodiment of the invention also provides a preparation method of the integrated circuit chip binding structure, the chip binding structure comprises a substrate 100 and a plurality of conductive bumps 200 formed on the substrate 100, and a chip 10 on the substrate 100 is electrically connected with the conductive bumps 200; the substrate 100 includes a first region 110 and a second region 120 located at a periphery of the first region 110, and the conductive bump 200 is formed at the second region 120; the chip bonding structure further includes at least one support bump 300 formed on the substrate 100, the support bump 300 being formed at the first region 110; wherein the first region 110 is formed with at least one support protrusion 300; the conductive bump 200 is formed simultaneously with the support bump 300.
That is, the support protrusion 300 is formed at the same time as the conductive protrusion 200, and at this time, the support protrusion 300 does not transmit a signal although it has a conductive capability, and only plays a supporting role, unlike the conductive protrusion 200.
According to the preparation method of the integrated circuit chip binding structure provided by the embodiment of the invention, the conductive bump 200 and the supporting bump 300 are synchronously formed, so that the process can be saved, and the production efficiency can be improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. An integrated circuit chip binding structure comprises a substrate and a plurality of conductive bumps arranged on the substrate, wherein the conductive bumps are electrically connected with chips in the substrate; it is characterized in that the preparation method is characterized in that,
the substrate comprises a first area and a second area arranged on the periphery of the first area, and the conductive protrusion is arranged on the second area;
further comprising at least one support protrusion disposed on the substrate, the support protrusion being disposed in the first region.
2. The integrated circuit chip bonding structure of claim 1, wherein the conductive bump has a thickness that is the same as a thickness of the support bump in a direction perpendicular to the substrate.
3. The integrated circuit chip bonding structure of claim 1, wherein the conductive bumps are made of the same material as the support bumps.
4. The integrated circuit chip bonding structure of claim 1, wherein the cross-sectional area of the plurality of conductive bumps along a direction parallel to the substrate is not exactly the same;
the cross-sectional area of the support protrusion in a direction parallel to the substrate is larger than the minimum cross-sectional area of the plurality of conductive protrusions and smaller than the maximum cross-sectional area of the plurality of conductive protrusions.
5. The integrated circuit chip bonding structure of claim 1, wherein the first region is provided with a plurality of the supporting bumps, the plurality of supporting bumps being divided into a plurality of groups;
the support protrusions in each group are arranged into two intersecting rows;
or,
the support protrusions in each set are arranged in a closed pattern.
6. The integrated circuit chip bonding structure of claim 5, wherein the supporting bumps are parallel to each other.
7. The integrated circuit chip bonding structure of any one of claims 1-6, wherein the second region is disposed around the first region.
8. A display device comprising a display panel, further comprising the integrated circuit chip bonding structure of any one of claims 1-7 bonded to the display panel.
9. The display device according to claim 8, wherein the display panel is a flexible display panel.
10. A method for preparing a binding structure of an integrated circuit chip is characterized in that the binding structure of the chip comprises a substrate and a plurality of conductive bumps formed on the substrate, wherein the chip on the substrate is electrically connected with the conductive bumps; the substrate comprises a first area and a second area located on the periphery of the first area, and the conductive bump is formed on the second area; the chip bonding structure further comprises at least one support bump formed on the substrate, the support bump being formed on the first region;
wherein the first region is formed with at least one support protrusion; the conductive bumps are formed in synchronization with the support bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810263687.6A CN108279517A (en) | 2018-03-28 | 2018-03-28 | A kind of IC chip binding structure and preparation method thereof, display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810263687.6A CN108279517A (en) | 2018-03-28 | 2018-03-28 | A kind of IC chip binding structure and preparation method thereof, display device |
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| CN108279517A true CN108279517A (en) | 2018-07-13 |
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| CN201810263687.6A Pending CN108279517A (en) | 2018-03-28 | 2018-03-28 | A kind of IC chip binding structure and preparation method thereof, display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020019428A1 (en) * | 2018-07-26 | 2020-01-30 | 武汉华星光电技术有限公司 | Display panel and display device |
| CN110828417A (en) * | 2018-08-08 | 2020-02-21 | 乐金显示有限公司 | Integrated circuit package and display device using the same |
| CN110957411A (en) * | 2018-09-27 | 2020-04-03 | 昆山工研院新型平板显示技术中心有限公司 | A Micro-LED chip, its preparation method, and display device |
| CN111554202A (en) * | 2020-05-27 | 2020-08-18 | 上海中航光电子有限公司 | Display panel and display device |
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