CN108258152B - Thin film packaging structure and organic electroluminescent device - Google Patents
Thin film packaging structure and organic electroluminescent device Download PDFInfo
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- CN108258152B CN108258152B CN201810055573.2A CN201810055573A CN108258152B CN 108258152 B CN108258152 B CN 108258152B CN 201810055573 A CN201810055573 A CN 201810055573A CN 108258152 B CN108258152 B CN 108258152B
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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Abstract
The invention provides a film packaging structure and an organic electroluminescent device, wherein the film packaging structure comprises one or more inorganic packaging layers and organic-inorganic microsphere layers which cover the inorganic packaging layers or are covered by the inorganic packaging layers or are positioned between the inorganic packaging layers; the organic-inorganic microsphere layer is made of a high-molecular composite material and comprises a composite matrix and hollow nano microspheres dispersed in the composite matrix. In the film packaging material and the organic electroluminescent device provided by the invention, the organic-inorganic microsphere layer is adopted to replace the organic packaging material, so that the adhesive force between the organic-inorganic microsphere layer and the inorganic packaging layer is increased, the packaging effect is improved, and in addition, the light uniformity of the hollow nano microspheres in the organic-inorganic microsphere layer can improve the color cast of the film packaging structure.
Description
Technical Field
The invention relates to the field of photoelectric technology, in particular to a thin film packaging structure and an organic electroluminescent device.
Background
The Barix encapsulation technology, i.e., an organic-inorganic alternating multilayer film structure, commonly used in the thin film encapsulation technology at present, as shown in fig. 1, includes a first inorganic encapsulation layer 200 covering the OLED unit 100, an organic encapsulation layer 300 covering the first inorganic encapsulation layer 200, and a second inorganic encapsulation layer 400 covering the organic encapsulation layer 300. Wherein, the inorganic materials of the first inorganic packaging layer 200 and the second inorganic packaging layer 400 play a real barrier role as a barrier layer and a barrier for water and oxygen diffusion, and the common material is SiNXAnd SiOXThe organic material of the organic encapsulation layer 300 mainly improves the flatness of the substrate, reduces mechanical damage, and improves the thermal stability of the surface of the crystal grain, and the commonly used material is mainly polyacrylic resin. However, the inventor researches and discovers that the packaging structure has not ideal effect, the adhesion between film layers is poor, and the risk of packaging failure is caused.
Disclosure of Invention
The invention aims to provide a film packaging structure and an organic electroluminescent device, and aims to solve the problem that the packaging effect of the existing film packaging material is poor.
In order to solve the above technical problems, the present invention provides a thin film encapsulation material, wherein the thin film encapsulation structure comprises one or more inorganic encapsulation layers, and an organic-inorganic microsphere layer covering the inorganic encapsulation layers, or covered by the inorganic encapsulation layers, or located between the inorganic encapsulation layers; the organic-inorganic microsphere layer is made of a high-molecular composite material and comprises a composite matrix and hollow nano microspheres dispersed in the composite matrix.
Optionally, in the thin film encapsulation structure, the inorganic encapsulation layer includes a first inorganic encapsulation layer covered by the organic-inorganic microsphere layer, and a second inorganic encapsulation layer covered on the organic-inorganic microsphere layer.
Optionally, in the thin film encapsulation structure, the hollow nano-microsphere is made of polystyrene-SiNXOr polystyrene-SiOX。
Optionally, in the thin film encapsulation structure, the composite substrate is made of polydimethylsiloxane or ultraviolet-curable optical adhesive.
Optionally, in the thin film encapsulation structure, the material of the first inorganic encapsulation layer is SiNXOr SiOXThe second inorganic packaging layer is made of SiNXOr SiOX。
Optionally, in the thin film encapsulation structure, the hollow nano-microspheres are dispersed in the composite matrix by a direct dispersion method or a sol-gel method.
Optionally, in the thin film encapsulation structure, the thickness of the thin film encapsulation structure is 7 to 12 micrometers.
Optionally, in the film packaging structure, the refractive index of the hollow nano-microspheres is 1.5-1.8, and the diameter of the hollow nano-microspheres is 300-600 nm.
Optionally, in the film packaging structure, the filling amount of the hollow nano-microspheres is 10wt% to 30wt%, and the hollow nano-microspheres are prepared by a sol-gel method.
The invention also provides an organic electroluminescent device, which comprises a substrate, an OLED unit arranged on the substrate, and the film packaging structure of any one of the above parts, wherein the film packaging structure is connected with the substrate and used for packaging the OLED unit.
In the film packaging material and the organic electroluminescent device provided by the invention, the organic-inorganic microsphere layer is adopted to replace the organic packaging material, so that the adhesive force between the organic-inorganic microsphere layer and the inorganic packaging layer is increased, the adhesive force between the first inorganic packaging layer and the second inorganic packaging layer is further increased, the packaging effect is improved, and in addition, the light uniformity of the hollow nano microspheres in the organic-inorganic microsphere layer can improve the color cast of the film packaging structure.
Further, the organic-inorganic microsphere layer is prepared by mixing Polystyrene (PS) -SiNXOr SiOXHollow nanometer microsphere dispersed in polymer composite material of composite matrix, SiNXOr SiOXThe inorganic nanoparticles have a relatively large specific surface area, and when they are incorporated into a composite matrix, very strong interfacial interactions occur between the inorganic phase and the composite matrix, resulting in a significant improvement in the properties of the composite matrix. polystyrene-SiNXOr polystyrene-SiOXHollow nano-microsphere improved organic encapsulation and SiNXOr SiOXAffinity between particles, increase SiNXOr SiOXAdsorption on the surface of encapsulated organic molecular particles.
The thin film packaging structure used by the organic electroluminescent device increases the adhesive force of the interface of the organic packaging material and the inorganic packaging material, improves the hydrophobicity of the organic packaging material, increases the packaging effect, increases the scattering of light, increases the light extraction rate, improves the visual angle, and compared with a solid structure, the hollow structure of the nano microsphere has small density, large specific surface area, multiple functional groups and good dispersibility in the organic packaging material, organic matters penetrate into the microsphere through micropores on the surface of the microsphere and then are mutually crosslinked, so that the organic packaging material and the inorganic packaging material are better compounded.
Furthermore, polydimethylsiloxane and hollow nano-microsphere polystyrene-SiO in the composite matrixXThe chemical stability of the polystyrene in the component is good, and the polydimethylsiloxaneThe modified polystyrene copolymer is hydrophobic in nature and is similar to polystyrene in solubility, and is similar to ethanol and water in solubility, and the modified polystyrene copolymer are directly mixed in solubility, so that the modified polystyrene copolymer and the modified polystyrene copolymer are good in solubility. In addition, SiN is formed on the surface of the hollow nano microsphereXOr SiOXAfter the inorganic shell, the surface of the microsphere has some organic functional groups, which is beneficial to dissolving with a composite matrix.
Drawings
FIG. 1 is a schematic view of a conventional thin film encapsulation structure of an organic electroluminescent device;
FIG. 2 is a schematic view of a thin film package structure according to an embodiment of the present invention;
FIG. 3 is a schematic view of hollow nanospheres in a thin film encapsulation material according to an embodiment of the present invention;
shown in the figure:
the prior art is as follows:
100-an OLED cell; 200-a first inorganic encapsulation layer; 300-organic encapsulation layer; 400-a second inorganic encapsulation layer;
the invention comprises the following steps: 10-a first inorganic encapsulation layer; 20-organic-inorganic microsphere layer; 21-a composite matrix; 22-hollow nanospheres; 221-a polystyrene core; 222-a mineral shell; 30-a second inorganic encapsulation layer.
Detailed Description
In the background art, it has been mentioned that the packaging effect of the conventional thin film packaging structure is not ideal. The inventor researches and discovers that the organic packaging material of the organic packaging layer 300 and the inorganic packaging material of the first inorganic packaging layer 200 and the second inorganic packaging layer 400 belong to two materials with different properties, mainly mechanical combination on a microscopic or atomic scale, interface mismatching, low adhesive force of the two materials, easy generation of a film layer falling phenomenon, increase of water and oxygen invasion probability and influence of a packaging effect.
The inventors have found that the above problems can be ameliorated by using an organic-inorganic nanocomposite material as an alternative to the organic encapsulation layer, in particular, an inorganic nanoparticle (SiN)XOr SiOXNanoparticles) dispersed in a composite matrix (polydimethylsiloxane PMDS or uv-curable optical adhesive NOA 63). The inorganic nanoparticles have a considerable specific surface areaWhen the organic encapsulating material is added into a polymer matrix, very strong interface interaction can be generated between an inorganic phase and the polymer, so that the performance of the polymer is greatly improved, and the adhesive force of the organic encapsulating material and the inorganic encapsulating material can be increased; the hydrophobicity of the organic packaging material is improved, the packaging effect is improved, light rays pass through media with different refractive indexes, so that the light rays are subjected to a plurality of refraction, reflection and scattering phenomena, and the light rays can be corrected into a uniform surface light source to achieve the effect of optical diffusion. However, in this structure, the nanoparticles may move in the matrix.
Based on the above, the invention provides a thin film encapsulation structure and an organic electroluminescent device, wherein an organic-inorganic microsphere layer is adopted to replace an organic encapsulation material, so that the adhesion between the organic-inorganic microsphere layer and an inorganic encapsulation layer is increased, the adhesion between the first inorganic encapsulation layer and the second inorganic encapsulation layer is further increased, and the encapsulation effect is improved. In addition, the light uniformity of the hollow nano microspheres in the organic-inorganic microsphere layer can improve the color cast of the thin film packaging structure.
The following provides a detailed description of the thin film encapsulation structure and the organic electroluminescent device according to the present invention with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
The embodiment provides a thin film packaging material, wherein the thin film packaging structure comprises one or more inorganic packaging layers and organic-inorganic microsphere layers covering the inorganic packaging layers or covered by the inorganic packaging layers or positioned between the inorganic packaging layers; the organic-inorganic microsphere layer is made of a high-molecular composite material and comprises a composite matrix and hollow nano microspheres dispersed in the composite matrix. The inorganic encapsulation layer includes a first inorganic encapsulation layer covered by the organic-inorganic microsphere layer, and a second inorganic encapsulation layer covered on the organic-inorganic microsphere layer.
As shown in fig. 2, the thin film encapsulation structure includes a first inorganic encapsulation layer 10, an organic-inorganic microsphere layer 20 covering the first inorganic encapsulation layer 10, and a second inorganic encapsulation layer 30 covering the organic-inorganic microsphere layer 20. The organic-inorganic microsphere layer 20 is made of a polymer composite material, and includes a composite matrix 21 and hollow nano microspheres 22 dispersed in the composite matrix 21.
The thin film encapsulation structure used by the organic electroluminescent device in the embodiment increases the adhesive force of the interface between the organic encapsulation material and the inorganic encapsulation material, improves the hydrophobicity of the organic encapsulation material, increases the encapsulation effect, increases the scattering of light, increases the light extraction rate, and improves the viewing angle. Compared with a solid structure, the hollow structure of the nano microsphere has the advantages of small density, large specific surface area, multiple functional groups and good dispersibility in an organic packaging material, organic matters penetrate into the microsphere through micropores on the surface of the microsphere and are further crosslinked, and the nano microsphere and the microsphere are better compounded.
Specifically, the hollow nano-microsphere 22 may be made of polystyrene-SiNXOr polystyrene-SiOXThe composite matrix 21 can be made of polydimethylsiloxane or ultraviolet curing optical cement, polystyrene-SiNXOr polystyrene-SiOXHollow nano-microsphere improved organic encapsulation and SiNXOr SiOXAffinity between particles, increase SiNXOr SiOXAdsorption on the surface of encapsulated organic molecular particles. The polydimethylsiloxane in the composite matrix and the polystyrene in the hollow nano-microspheres have good chemical stability and good intersolubility. Further, the materials of the first inorganic encapsulation layer 10 and the second inorganic encapsulation layer 30 may respectively include SiNX、SiOXAlumina (Al)2O3) Or titanium oxide (TiO)2) One or more of them. The first inorganic encapsulation layer 10 and the second inorganic encapsulation layer 30 are formed by, for example, Chemical Vapor Deposition (CVD), physical chemical vapor deposition (PVD), Atomic Layer Deposition (ALD), or the like.
Further, in the thin film encapsulation structure, the thickness of the thin film encapsulation structure is 7 to 12 micrometers, the hollow nano-microspheres 22 can be dispersed in the composite matrix 21 by a direct dispersion method or a sol-gel method, the refractive index of the hollow nano-microspheres 22 is, for example, 1.5 to 1.8, the diameter of the hollow nano-microspheres 22 is, for example, 300 to 600 nanometers, the filling amount of the hollow nano-microspheres 22 is, for example, 10 to 30wt%, and wt% is weight percentage, which means that 10 to 30g of the hollow nano-microspheres 22 are filled in 100g of the composite matrix 21.
The hollow nano-microspheres are materials with unique forms, have particle sizes ranging from nano-scale (nano-scale means that the diameter of particles is 1-100 nm) to micron-scale (micron-scale means that the diameter of particles is 1-100 microns), and have the characteristics of large specific surface area, low density, good stability and the like. Because the interior of the hollow glass is hollow, volatile solvents such as gas or small molecular substances (such as water and hydrocarbons) and the like can be encapsulated, and other compounds with special functions can also be encapsulated; therefore, the method can be applied to the aspects of controlled drug release, morphology control templates or microcapsule packaging materials (drugs, pigments, cosmetics, printing ink and bioactive agents), water pollution treatment, chemical catalysis, biochemistry and the like; meanwhile, the design of sound insulation, light, heat, mechanical and other properties can be effectively realized at will by adjusting the size of the microsphere and the cavity and the wall thickness, and the method has wide application prospect in industry.
The preparation of the hollow nanospheres 22 by the sol-gel method will be described in detail below. As shown in fig. 3, the hollow nanosphere 22 comprises a polystyrene core 221 and an inorganic shell 222 coating the polystyrene core 221. Specifically, a polystyrene core 221 is formed first, and then an inorganic shell 222 is formed on the outer surface of the polystyrene core 221, wherein the inorganic shell 222 is made of SiNXOr SiOXThen, the central portion of the polystyrene core 221 is removed to form hollow nanospheres. Compared with direct bonding of SiNXOr SiOXThe particles are put into the composite matrix 21, the hollow nano-microspheres are put into the composite matrix, the chemical stability of the polydimethylsiloxane and the polystyrene in the composite matrix is good, the intersolubility of the composite matrix 21 and the hollow nano-microspheres 22 is improved, and the polydimethylsiloxaneStyrene is hydrophobic and is similar to ethanol and water, and the styrene and the ethanol are directly mixed and dissolved, so that the styrene and the ethanol are good in mutual solubility. In addition, SiN is formed on the surface of the hollow nano microsphereXOr SiOXAfter the inorganic shell, the surface of the microsphere has some organic functional groups, which is beneficial to dissolving with a composite matrix. And an inorganic substance SiNXOr SiOXDoes not freely float in the composite matrix or precipitate to the bottom of the matrix along with the increase of the service time, and inorganic SiN can be addedXOr SiOXDispersion of (2).
In this embodiment, a preparation method of a sol-gel method of hollow nano microspheres is exemplified, and the sol-gel method generally includes first preparing template particles with functionalized surfaces or adding a surfactant, and forming a silica shell layer on the surface of the template by using a hydrolysis/condensation reaction of organosilane. Both the polymer micelle and the latex particles can be applied as templates, and the latex particles have larger particle size as the templates; in the submicron to micron range, micelles have small particle sizes, mostly below 100nm, as templates.
In the embodiment, the polystyrene latex particles are used as the template, so that the cost can be saved. The polymer latex particles used have a core-shell structure composed of AB or ABA type polymers, which in this example constitute the core-shell structure of AB, i.e., polystyrene core 221 and inorganic shell 222. The shell of the polystyrene latex particle can collect inorganic precursor, and the core is used as a template with a hollow structure. The precursor of the inorganic material is adsorbed to the shell part of the emulsion particle and polymerized to form the shell of the hollow particle; the polystyrene core will be calcined or otherwise removed to form a hollow structure within the mineral shell.
For example: polystyrene microspheres prepared by a dispersion polymerization method are used as a template, and a surfactant of cetyltrimethylammonium chloride is added to self-assemble the polystyrene microspheres on the surface of the template (mainly playing a role in controlling mesopores on a shell layer); then adding Tetraethoxysilane (TMOS) and hydrochloric acid, forming silicon dioxide through a hydrolytic polycondensation reaction, and coating polymer microspheres in gaps of the surfactant by the silicon dioxide; and finally, washing and calcining the obtained polymer microspheres to obtain regular hollow silica microspheres, wherein the product obtained by the method has the particle size of 330-500 nm and the wall thickness of about 33 nm.
For another example: taking an aggregate of polyvinylpyrrolidone (PVP) and Cetyl Trimethyl Ammonium Bromide (CTAB) as a template, taking a sodium hydroxide solution as a catalyst in an aqueous medium, and carrying out sol-gel reaction on the surface of tetraethoxysilane to obtain a silicon dioxide microsphere with a core-shell structure; the hollow silicon dioxide microspheres with the shell thickness of 60nm and the particle size of about 200nm can be obtained by calcination treatment.
The above description has been given by taking the film package structure as a three-layer structure (first inorganic package layer/organic-inorganic microsphere layer/second inorganic package layer), but it should be understood that the film package layer is not limited to a three-layer structure, and may also be composed of more layers, for example, a five-layer structure (first inorganic package layer/organic-inorganic microsphere layer/second inorganic package layer/organic-inorganic microsphere layer/third inorganic package layer) may be adopted, and the number of the film package layers and the thickness of each layer may be adjusted according to actual requirements, which is not limited in the present invention.
The embodiment also provides an organic electroluminescent device, which comprises a substrate, an OLED unit disposed on the substrate, and the thin film encapsulation structure, wherein the thin film encapsulation structure is connected to the substrate and used for encapsulating the OLED unit, and is coated on the OLED unit by coating or inkjet printing.
The substrate material of the substrate may be quartz, glass, metal, resin, etc., wherein the resin substrate includes, but is not limited to, polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyethylene naphthalate (PBN), polycarbonate resin. For flexible display devices, flexible substrates, such as Polyimide (PI) substrates, are preferred. In addition, the substrate preferably has good barrier properties against water and gas, while for bottom-emitting devices the substrate should also have good transparency, i.e. the substrate is transparent to light in the visible wavelength range.
The OLED unit includes, for example, a bottom electrode (anode in this embodiment), a pixel defining layer, a functional layer, and a top electrode (cathode in this embodiment) formed on the substrate. The bottom electrode is formed on the substrate, for example, as anodes of the red pixel unit, the green pixel unit, and the blue pixel unit, respectively. The OLED display panel comprises a light emitting area and a non-light emitting area, the pixel opening of the pixel defining layer is used for defining the light emitting area and the non-light emitting area, the area corresponding to the pixel opening is the light emitting area, the area outside the pixel opening is the non-light emitting area, and the pixel defining layer is generally in a grid structure. The functional layer and the top electrode can be arranged not only in the pixel opening but also above the pixel defining layer, and only the corresponding part of the pixel opening emits light to form a light emitting area. The functional layer may have a multi-layer structure, and in addition to a light emitting layer necessary for ensuring normal light emitting display of the organic light emitting display panel, based on the consideration of product cost, light emitting brightness and light emitting efficiency, a person skilled in the art may selectively dispose other film layers according to actual product requirements, for example, an electron transport layer and a hole transport layer for balancing electrons and holes, and an electron injection layer and a hole injection layer for enhancing injection of electrons and holes. Generally, a red pixel unit, a green pixel unit and a blue pixel unit are mainly formed on a substrate, each pixel unit respectively comprises a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer which are sequentially stacked on the substrate, wherein the light emitting layer is arranged in a pixel opening, and other film layers (the hole injection layer, the hole transport layer, the electron transport layer and the electron injection layer) can be selectively patterned or not patterned, but the whole film layer is prepared, so that the mask cost is saved and the process flow is simplified.
In the film packaging material and the organic electroluminescent device provided by the invention, the organic-inorganic microsphere layer is adopted to replace the organic packaging material, so that the adhesive force between the organic-inorganic microsphere layer and the first inorganic packaging layer and the adhesive force between the organic-inorganic microsphere layer and the second inorganic packaging layer are increased, the packaging effect is improved, and in addition, the light uniformity of the hollow nano microspheres in the organic-inorganic microsphere layer can improve the color cast of the film packaging structure.
Further, the organic-inorganic microsphere layer is prepared by mixing Polystyrene (PS) -SiNXOr SiOXThe hollow nano-microsphere is dispersed in the polymer composite material of the composite matrix, and SiNX or SiOXThe inorganic nanoparticles have a relatively large specific surface area, and when they are incorporated into a composite matrix, very strong interfacial interactions occur between the inorganic phase and the composite matrix, resulting in a significant improvement in the properties of the composite matrix. polystyrene-SiNXOr polystyrene-SiOXHollow nano-microsphere improved organic encapsulation and SiNXOr SiOXAffinity between particles, increase SiNXOr SiOXAdsorption on the surface of encapsulated organic molecular particles.
The thin film packaging structure used by the organic electroluminescent device increases the adhesive force of the interface of the organic packaging material and the inorganic packaging material, improves the hydrophobicity of the organic packaging material, increases the packaging effect, increases the scattering of light, increases the light extraction rate, improves the visual angle, and ensures that polydimethylsiloxane and hollow nano microsphere polystyrene-SiO in the composite matrix are in contact with each otherXThe chemical stability of the polystyrene in the components is good, and the mutual solubility of the polystyrene and the polystyrene is good.
In summary, the above embodiments have described the thin film encapsulation structure and the organic electroluminescent device in detail, and it is understood that the present invention includes but is not limited to the configurations listed in the above embodiments, and any modifications based on the configurations provided in the above embodiments are within the scope of the present invention. One skilled in the art can take the contents of the above embodiments to take a counter-measure.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. A thin film encapsulation structure, comprising one or more inorganic encapsulation layers, and an organic-inorganic microsphere layer covering or covered by the inorganic encapsulation layers or located between the inorganic encapsulation layers; the organic-inorganic microsphere layer is made of a high-molecular composite material and comprises a composite matrix and hollow nano microspheres dispersed in the composite matrix so as to increase the adhesive force between the organic-inorganic microsphere layer and the inorganic packaging layer or the adhesive force between the inorganic packaging layer;
the dispersibility of the hollow nano microspheres in the composite matrix is larger than that of the solid nano microspheres in the composite matrix, so that organic matters of the composite matrix permeate into the hollow nano microspheres when passing through the surface micropores of the hollow nano microspheres, and the organic matters of the composite matrix permeate into the hollow nano microspheres when passing through the surface micropores of the hollow nano microspheres, so that the organic matters and the hollow nano microspheres are mutually crosslinked.
2. The thin film encapsulation structure of claim 1, wherein the inorganic encapsulation layer comprises a first inorganic encapsulation layer covered by the organic-inorganic microsphere layer, and a second inorganic encapsulation layer covering the organic-inorganic microsphere layer.
3. The thin film encapsulation structure of claim 1, wherein the hollow nanospheres are polystyrene-SiNXOr polystyrene-SiOX。
4. The film encapsulation structure of claim 1, wherein the composite matrix is made of polydimethylsiloxane or ultraviolet-curable optical adhesive.
5. The thin film encapsulation structure of claim 2, wherein the material of the first inorganic encapsulation layer is SiNXOr SiOXThe second inorganic packaging layer is made of SiNXOr SiOX。
6. The thin film encapsulation structure according to claim 1, wherein the hollow nano-microspheres are dispersed in the composite matrix by a direct dispersion method or a sol-gel method.
7. The film encapsulation structure of claim 1, wherein the thickness of the film encapsulation structure is 7-12 microns.
8. The thin film encapsulation structure of claim 1, wherein the refractive index of the hollow nanospheres is 1.5-1.8, and the diameter of the hollow nanospheres is 300-600 nm.
9. The film encapsulation structure according to claim 1, wherein the filling amount of the hollow nano-microspheres is 10wt% to 30wt%, and the hollow nano-microspheres are prepared by a sol-gel method.
10. An organic electroluminescent device, comprising a substrate, an OLED unit disposed on the substrate, and the thin film encapsulation structure according to any one of claims 1 to 9, wherein the thin film encapsulation structure is connected to the substrate and used for encapsulating the OLED unit.
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