CN108256605A - A kind of spring pendant type high temperature resistant electronic tag - Google Patents
A kind of spring pendant type high temperature resistant electronic tag Download PDFInfo
- Publication number
- CN108256605A CN108256605A CN201711451339.3A CN201711451339A CN108256605A CN 108256605 A CN108256605 A CN 108256605A CN 201711451339 A CN201711451339 A CN 201711451339A CN 108256605 A CN108256605 A CN 108256605A
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- China
- Prior art keywords
- antenna
- high temperature
- electronic tag
- spring
- packaging body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 claims abstract description 49
- 238000007789 sealing Methods 0.000 claims abstract description 44
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000009413 insulation Methods 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 238000005034 decoration Methods 0.000 claims description 2
- 238000001727 in vivo Methods 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims 1
- 239000011214 refractory ceramic Substances 0.000 description 12
- 238000003825 pressing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000725 suspension Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000012856 packing Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
- G06K19/022—Processes or apparatus therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
Abstract
The invention discloses spring pendant type high temperature resistant electronic tag, including：Heat resistant type ceramic packaging body, antenna and radio-frequency module, heat resistant type ceramic packaging body inner hollow；Antenna is spring antenna, includes a short antenna and a long antenna；The both ends of radio-frequency module connect short antenna and long dwi hastasana into label core respectively, the label core is fixed on by the sealing of sealing glue in the hollow cavity of ceramic packaging body, wherein short antenna is locked in by sealing glue in ceramic package body, and to stretch out ceramic package external for long antenna part, and the end wraparound of free end is locked in by sealing glue in ceramic packaging body hollow cavity, is formed and is stretched out the external loop configuration of ceramic package.Spring pendant type high temperature resistant electronic tag provided by the invention encapsulates the main body of entire electronic tag by heat resistant type ceramic packaging body to carry, and protection is packaged to it, greatly improves the resistance to high-performance of entire label.
Description
Technical field
The present invention relates to electronic tags, and in particular to high temperature resistant electronic label technology.
Background technology
Traditional radio frequency identification tag package, pass through production line include substrate charging, gluing, chip overturning attachment (upside-down mounting),
Hot-press solidifying, test, substrate rewinding, antenna make, are molded, modelling, Tag Packaging, multiple steps such as label drop glue, more
A stage, different links can realize that link is more in different workshops, production cycle length, of high cost, each link increase
Yields can be reduced, performance is greatly reduced.In addition, under conditional electronic label producing method, the label of some special shapes or
The label of person's property can not be realized.It, can be normal in the environment to 600 degree for that can be spent -60 such as high-low temperature resistant label
The RFID electronic label of work.It is this according to traditional radio frequency identification tag package technology, will be unable to realize high-low temperature resistant.
And generally existing poor reliability, high temperature resistance are poor in actual use for existing high temperature resistant labels, it can not
Meets the needs of actual condition.
It can be seen that a kind of high reliability is provided and the superior high temperature resistant electronic tag of high temperature resistance be this field there is an urgent need for
It solves the problems, such as.
Invention content
For the problems of existing high temperature resistant labels, a kind of new high temperature resistant labels scheme is needed.
For this purpose, problem to be solved by this invention is to provide a kind of spring pendant type high temperature resistant electronic tag, it is existing to overcome
There is the problems of technology.
To solve the above-mentioned problems, spring pendant type high temperature resistant electronic tag provided by the invention, including：
Heat resistant type ceramic packaging body, the heat resistant type ceramic packaging body inner hollow；
Antenna, the antenna are spring antenna, include a short antenna and a long antenna；
Radio-frequency module, the both ends of the radio-frequency module connect short antenna and long dwi hastasana into label core, the mark respectively
Label core is fixed on by the sealing of sealing glue in the hollow cavity of ceramic packaging body, and wherein short antenna is locked in ceramics by sealing glue
In packaging body, and long antenna part stretching ceramic package is external, and the end wraparound of free end is locked in ceramic envelope by sealing glue
It fills in body hollow cavity, is formed and stretch out the external loop configuration of ceramic package.
Further, it is provided with thermal insulation layer in the hollow cavity of the ceramic packaging body.
Further, the radio-frequency module is integrally directly locked in by sealing glue in ceramic package body.
Further, the radio-frequency module is put in the sealing glue sealing of both ends sealing antenna in the hollow of ceramic packaging body
In cavity.
Further, the antenna is made of stainless steel wire, diameter 0.1-0.5mm, spring diameter 0.5-3.0mm, spring
Spacing is 0.2-1.5mm, electrode straight line portion bit length 1-5mm.
Further, it is attached between the antenna and radio-frequency module by being cold-pressed structure.
Further, the radio-frequency module is a rectangular parallelepiped structure, and the electrode for connection is symmetrical arranged on both sides.
Further, the ceramic packaging body is that the elongated tubular product formed or abnormity dress are fired by heat safe ceramic material
Adorn body shape, inner hollow.
Further, the surface of the ceramic packaging body is provided with one or more installation mounting holes.
Further, the sealing glue is heat safe colloid, and forming and hardening is in antenna and the middle cavity of ceramic packaging body
Between inner wall.
It is whole that spring pendant type high temperature resistant electronic tag provided by the invention carries encapsulation by heat resistant type ceramic packaging body
The main body (i.e. label core) of a electronic tag, is packaged it protection, by heat resistant type ceramic packaging body as entire electronics
The heat-resisting main body of being heated of label, greatly improves the resistance to high-performance of entire label, while by heat resistant type ceramic packaging body to encapsulating it
The main body (i.e. label core) of interior electronic tag is protected comprehensively, greatly improves the reliability of entire label.
Furthermore spring pendant type high temperature resistant electronic tag provided by the invention directly forms the ring for suspension by antenna
Shape structure in the case where not influencing label heat resistance and reliability, that is, improves the convenience that high temperature resistant electronic tag uses,
The radio-frequency performance of high temperature resistant electronic tag is improved again.
Description of the drawings
It is further illustrated the present invention below in conjunction with the drawings and specific embodiments.
Fig. 1 is the surface structure schematic diagram of spring pendant type high temperature resistant electronic tag in present example；
Fig. 2 is the schematic diagram of ceramic packaging body in spring pendant type high temperature resistant electronic tag in present example；
Fig. 3 is the structure diagram of label core in spring pendant type high temperature resistant electronic tag in present example；
Fig. 4 is the composition structure diagram of the label core of spring pendant type high temperature resistant electronic tag in present example；
Fig. 5 is the structure diagram of package module in spring pendant type high temperature resistant electronic tag in present example；
Fig. 6 is the short spring antenna schematic diagram of spring pendant type high temperature resistant electronic tag in present example；
Fig. 7 is the long spring antenna schematic diagram of spring pendant type high temperature resistant electronic tag in present example.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Conjunction is specifically illustrating, and the present invention is further explained.
Referring to Fig. 1, the basic composition structure of spring pendant type high temperature resistant electronic tag in this example is given.
As seen from the figure, this spring pendant type high temperature resistant electronic tag is mainly by 200 liang of label core 100 and ceramic packaging body
Person, which matches, to be combined into.
Wherein, label core 100 is locked in by corresponding sealing glue in ceramic packaging body 200, and by label core 100
On antenna formed directly outside ceramic packaging body 200 for suspension loop configuration；And ceramic packaging body 200 is as entire resistance to
The heat-resisting main body of being heated of high-temperature electronic label forms the label core 100 being encapsulated in it heat-insulated comprehensive protection, so as to protect
Demonstrate,prove the reliability and heat resistance of entire label.
On this basis, 200 outer ring suspended structure 150 of ceramic packaging body is molded directly within by antenna, and by sealing
Glue carries out sealing, can improve what high temperature resistant electronic tag used in the case where not influencing label heat resistance and reliability
Convenience and the signal coupling ability for greatly improving antenna.
Referring to Fig. 2, it show the example of 200 structure of ceramic packaging body in this example.The ceramic packaging body 200 generally by
Interior hollow structure made of heat safe ceramic material, inner hollow cavity are used to dispose label core 100.
For the concrete structure of the ceramic packaging body 200, can be used be made of the firing of heat safe ceramic material it is elongated
Tubulose (as shown in Figure 2), inner hollow, for disposing label core 100.
As an alternative, which also can be used the inside being made of the firing of heat safe ceramic material
Hollow special-shaped decoration, internal hollow cavity placement label core 100.
On the basis of, this example is provided with one or more apertures 210 on the surface of ceramic packaging body, for fixed spring
Antenna or mounting fixing parts.It, can be depending on actual demand for the installation position of the installation mounting hole 210.
On this basis, in order to further improve ceramic packaging body 200 to the label in hollow cavity disposed inside
The protective capability of core 100, to improve the high temperature resistance of entire label, this example can be in the hollow cavity of ceramic packaging body 200
Corresponding thermal insulation layer is set in vivo.The thermal insulation layer preferably covers the medial surface of hollow cavity, can be carried out by corresponding sealing glue
It is fixed.
Referring to Fig. 3, it show the example of 100 structure of label core in this example.As seen from the figure, the label core in this example
Body 100 is mainly made of radio-frequency module 110, short antenna 120 and the cooperation of long antenna 130, wherein, by short antenna 120 and the vast of heaven
Line 130 connects and composes label core 100 with the electrode on radio-frequency module 110 respectively.
Referring to Fig. 5, the generally packaging body of radio-frequency module 110 in this example has encapsulation main body 111 and is arranged on envelope
Fill the electrode 112 on ontology.
This radio-frequency module 110 is specifically formed by corresponding radio frequency chip molded packages, and preferred package forms length in this example
The encapsulation main body 111 of cube structure, and be respectively arranged on its both sides one for connection electrode 112, the two electrodes 112 are right
Claim distribution, for connecting antenna.
The radio-frequency module 110 of molded packages is used in this example, can be easily installed, while using molded packages to penetrating
Frequency chip forms second and protects again, greatly improves the reliability of finished product label.
Referring to Fig. 6, the short antenna 120 in this example uses spring antenna, and one end sets the electricity of linear type connection
Pole 121.
The 120 preferred stainless steel wire of spring short antenna supports, and ensures the reliability of antenna.Simultaneously dimensionally, this bullet
The rust steel wire diameter of spring formula short antenna 120 in 0.1-1.0mm, spring diameter in 0.5-2.5mm, spring spacing in 0.3-2.0mm,
Spring span access location length is in 15-40mm, and electrode straight line span access location length is in 1-5mm.On the basis of this time, this spring short antenna 120 is excellent
Size is selected in the rust steel wire diameter 0.3mm for forming antenna, spring diameter 1.3mm, spring spacing is 0.7mm, spring span access location length
For 25mm, electrode straight line portion bit length 3mm；Thus, it is possible to the signal coupling performance of spring short antenna 120 is caused to reach best.
Referring to Fig. 7, the long antenna 130 in this example uses spring antenna, and one end sets the electricity of linear type connection
Pole 131.
Long 130 preferred stainless steel wire of the antenna support of the spring ensures the reliability of antenna.Simultaneously dimensionally, this bullet
The rust steel wire diameter of the long antenna 130 of spring formula in 0.1-1.0mm, spring diameter in 0.5-2.5mm, spring spacing in 0.3-2.0mm,
Spring span access location length is in 70-120mm, and electrode straight line span access location length is in 1-5mm.On the basis of this time, the long antenna 130 of this spring is excellent
Size is selected in the rust steel wire diameter 0.3mm for forming antenna, spring diameter 1.3mm, spring spacing is 0.7mm, spring span access location length
For 95mm, electrode straight line portion bit length 3mm；Thus, it is possible to the signal coupling performance of the long antenna 130 of spring is caused to reach best.
The long antenna 130 of spring short antenna 120 and spring based on above structure, the side that this example is connected using cold pressing
Formula is attached to form label core 100 with radio-frequency module 110.
Referring to Fig. 4, specifically realize that the cold pressing between antenna and radio-frequency module connects using cold pressing copper sleeve 140 in this example
It connects.
Specifically, using two cold pressing copper sleeves 140, the both ends of one of cold pressing copper sleeve 140 are arranged radio frequency respectively
One electrode 112 of module 110 and the linear electrode 121 of spring short antenna, the both ends point of another cold pressing copper sleeve 140
The linear electrode 131 not being arranged on another electrode 112 and the long antenna 130 of spring of radio-frequency module 110；Again by two
A cold pressing copper sleeve 140 is cold-pressed, and the electrode 121 of realization spring short antenna and the electrode 131 of the long antenna of spring are with penetrating
Two electrodes on frequency module 110 are fixedly connected, and keep electrical connection properties.This machine by being cold-pressed copper sleeve 140
Tool connection mode can ensure the electrical connectivity of the reliability and stabilization connected between antenna and radio-frequency module；Meanwhile it also keeps away
Exempt from normal welding influences caused by radio-frequency module.
The label core 100 formed accordingly is whole in strip (as shown in Figure 3), passes through corresponding high temperature resistant sealing glue
It is locked in and the spring pendant type high temperature resistant electronic tag with annular suspension structure is formed in ceramic packaging body 200.The electronics
Label is specially hyperfrequency, read-write RF tag.
Below illustratively in this example spring pendant type high temperature resistant electronic tag assembling sealing process.
First, radio frequency chip is subjected to molded packages, forms radio-frequency module；
Then, the electrode of antenna electrode and radio-frequency module is formed into label core by cold pressing connection (scheme is as above)；
Followed by label core is packed into refractory ceramics packaging body, then with high temperature resistant sealing glue fixed antenna.Specifically such as
Under (referring to Fig. 1)：
The short antenna of label core is partially loaded in the hollow cavity of refractory ceramics pipe, and causes long antenna part dew
Go out outside refractory ceramics pipe；By the long antenna part of exposing around circlewise 150, antenna head is inserted into ceramic packaging body
In cavity, then with high temperature resistant sealing glue sealing is carried out to the antenna in the lumen body of ceramic packaging body and radio-frequency module, thus shape
Into the ceramic packaging body to be mounted with radio-frequency module as pendant, the spring pendant type that annular suspension structure is formed with spring antenna is resistance to
High-temperature electronic label.
The sealing glue used in this example is specially high temperature resistant colloid, is consolidated antenna and ceramic inside pipe wall after curing
It is fixed, if if having thermal insulation layer in the cavity of ceramic packaging body, antenna and thermal insulation layer can be adhesively fixed.
For the sealing glue initially in glue is melted, the place that being injected into needs to carry out sealing carries out curing sealing.This example
In, after label core is placed in the hollow cavity of refractory ceramics pipe, injected in the hollow cavity of refractory ceramics pipe
Melt gelatinous sealing glue, which will fill entire hollow cavity, it is fully wrapped around live hollow cavity in label core, then into
Row curing bonds so that sealing glue-line is formed between the cavity wall of label core and refractory ceramics pipe, it thus can be by label core
Firm is fixed in the hollow cavity of refractory ceramics pipe, while the sealing glue-line being wrapped on label core is to the mark in it
For label core (such as antenna and radio-frequency module) other than being adhesively fixed, it can also be used as protective layer and thermal insulation layer simultaneously, further
Improve reliability and heat resistance.
In addition, for sealing glue to the packing structure of label core other than above-mentioned fully wrapped around structure, can also be used
Both ends seal, the packing structure of intermediate hollow.Only the antenna part at both ends in label core is sealed using sealing glue
Sealing so that put in the hollow cavity of refractory ceramics pipe in radio-frequency module entirety in label core.In such packing structure,
Antenna part positioned at refractory ceramics pipe hollow cavity interior label core is by sealing glue sealing, and radio-frequency module is in sealing
Hollow between radio-frequency module and the cavity wall of refractory ceramics pipe in the middle part of hollow cavity, the hollow cavity of this sealing can be used as sky
Air bound thermosphere is thermally shielded protection to the radio-frequency module in it, greatly improves the resistance to thermal reliability of entire label.
Furthermore annular suspension is directly formed outside refractory ceramics pipe in this example using long spring antenna in label core
Structure circularizes spring antenna in refractory ceramics pipe shape, coordinate spring structure by ring-type, can greatly improve antenna
Signal coupling ability, so as to improve the readwrite performance of entire label.
Thus the high temperature resistant electronic tag formed carries the entire electronic tag of encapsulation by heat resistant type ceramic packaging body
Main body (i.e. label core), is packaged it protection, by heat resistant type ceramic packaging body as the heated resistance to of entire electronic tag
Hot main body, while multiple protective layer and thermal insulation layer are formed between heat resistant type ceramic packaging body and label core inside it,
Greatly improve the resistance to high-performance and reliability of entire label.The loop configuration for being used for suspension is directly formed by antenna simultaneously,
In the case of not influencing label heat resistance and reliability, that is, the convenience that high temperature resistant electronic tag uses is improved, and improve resistance to
The radio-frequency performance of high-temperature electronic label.
Basic principle, main feature and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (10)
1. spring pendant type high temperature resistant electronic tag, which is characterized in that including：
Heat resistant type ceramic packaging body, the heat resistant type ceramic packaging body inner hollow；
Antenna, the antenna are spring antenna, include a short antenna and a long antenna；
Radio-frequency module, the both ends of the radio-frequency module connect short antenna and long dwi hastasana into label core, the label core respectively
Body is fixed on by the sealing of sealing glue in the hollow cavity of ceramic packaging body, and wherein short antenna is locked in ceramic package by sealing glue
In vivo, long antenna part stretching ceramic package is external, and the end wraparound of free end is locked in ceramic packaging body by sealing glue
In hollow cavity, formed and stretch out the external loop configuration of ceramic package.
2. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the ceramic packaging body
Thermal insulation layer is provided in hollow cavity.
3. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the radio-frequency module is whole
It is directly locked in ceramic package body by sealing glue.
4. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the radio-frequency module is by two
End seal, which is consolidated in the sealing glue sealing of antenna, puts in the hollow cavity of ceramic packaging body.
5. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the antenna is by stainless steel
Silk is formed, diameter 0.1-0.5mm, spring diameter 0.5-3.0mm, and spring spacing is 0.2-1.5mm, electrode straight line portion bit length 1-
5mm。
6. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the antenna and radio frequency mould
It is attached between block by being cold-pressed structure.
7. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the radio-frequency module is one
Rectangular parallelepiped structure is symmetrical arranged the electrode for connection on both sides.
8. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the ceramic packaging body is
The elongated tubular product or special-shaped decoration shape be made of the firing of heat safe ceramic material, inner hollow.
9. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the ceramic packaging body
Surface is provided with one or more installation mounting holes.
10. spring pendant type high temperature resistant electronic tag according to claim 1, which is characterized in that the sealing glue is resistance to
The colloid of high temperature, forming and hardening is between antenna and the middle cavity inner wall of ceramic packaging body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711451339.3A CN108256605A (en) | 2017-12-27 | 2017-12-27 | A kind of spring pendant type high temperature resistant electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711451339.3A CN108256605A (en) | 2017-12-27 | 2017-12-27 | A kind of spring pendant type high temperature resistant electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108256605A true CN108256605A (en) | 2018-07-06 |
Family
ID=62724095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711451339.3A Pending CN108256605A (en) | 2017-12-27 | 2017-12-27 | A kind of spring pendant type high temperature resistant electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108256605A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102073901A (en) * | 2010-12-20 | 2011-05-25 | 甘肃金盾信息安全技术有限公司 | RFID (radio frequency identification) ceramic-substrate card electronic tag |
| CN203287929U (en) * | 2013-04-28 | 2013-11-13 | 杭州中瑞思创科技股份有限公司 | Miniature RFID label suitable for hanging to jewelry |
| CN104050497A (en) * | 2014-06-10 | 2014-09-17 | 杨雪 | Electronic tag inlay, processing method of electronic tag inlay and electronic tag |
| CN106203607A (en) * | 2016-08-26 | 2016-12-07 | 上海仪电智能电子有限公司 | A kind of tire implanted electronic tag and packaging technology |
-
2017
- 2017-12-27 CN CN201711451339.3A patent/CN108256605A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102073901A (en) * | 2010-12-20 | 2011-05-25 | 甘肃金盾信息安全技术有限公司 | RFID (radio frequency identification) ceramic-substrate card electronic tag |
| CN203287929U (en) * | 2013-04-28 | 2013-11-13 | 杭州中瑞思创科技股份有限公司 | Miniature RFID label suitable for hanging to jewelry |
| CN104050497A (en) * | 2014-06-10 | 2014-09-17 | 杨雪 | Electronic tag inlay, processing method of electronic tag inlay and electronic tag |
| CN106203607A (en) * | 2016-08-26 | 2016-12-07 | 上海仪电智能电子有限公司 | A kind of tire implanted electronic tag and packaging technology |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180706 |
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| RJ01 | Rejection of invention patent application after publication |