CN108254972B - Backlight module, electronic device and installation method of backlight module - Google Patents

Abstract

The application discloses a backlight module, an electronic device and a mounting method of the backlight module. The backlight module includes: the upper back frame and the lower back frame are detachably connected, and an accommodating space is formed between the upper back frame and the lower back frame; light source and the flexible circuit board of setting in the accommodation space to and set up light guide plate and the even light rete on back of the body frame down, wherein: the flexible circuit board and the light homogenizing film layer are respectively arranged on two opposite sides of the light source, the flexible circuit board is arranged between the light source and the lower back frame, and the flexible circuit board is electrically connected with the light source; the light guide plate comprises a light incident surface and a light emergent surface, the light source is arranged on one side of the light incident surface, and the light homogenizing film layer is arranged on the light emergent surface. Therefore, when other elements of the backlight module are assembled, the upper back frame and the lower back frame can be disassembled firstly, the other elements of the backlight module are assembled on the lower back frame, and then the upper back frame and the lower back frame are assembled, so that the situation that the upper back frame obstructs the installation can be avoided, and the installation of the backlight module is facilitated.

Description

Backlight module, electronic device and installation method of backlight module

technical field

The present application relates to the field of backlight of electronic devices, and in particular, to a backlight module, an electronic device and an installation method of the backlight module.

Background technique

At present, with the development of science and technology, electronic devices such as smart phones have increasingly become the necessities of people's lives.

The backlight module is an important part of electronic devices. At present, the backlight module of portable electronic devices such as smartphones usually consists of a back frame, or iron frame, to form a accommodating space, and then other optical components of the backlight module are assembled to the in the accommodating space. However, the back frame of the prior art is usually a fixed integral structure, and the optical elements such as the light source, diffuser film, and light guide plate of the backlight module have different shapes and sizes, and need to be installed in multiple different positions, which leads to the installation of It's very inconvenient to get up.

SUMMARY OF THE INVENTION

On the one hand, the embodiment of the present application provides a backlight module, and the backlight module includes:

an upper back frame and a lower back frame, the upper back frame and the lower back frame are detachably connected, and an accommodation space is formed between the upper back frame and the lower back frame;

The light source and the flexible circuit board arranged in the accommodating space, and the light guide plate and the homogenizing film layer arranged on the lower back frame, wherein:

The flexible circuit board and the homogenizing film layer are respectively disposed on opposite sides of the light source, and the flexible circuit board is disposed between the light source and the lower back frame, and the flexible circuit board and the Light source electrical connection;

The light guide plate includes a light incident surface and a light emitting surface, the light source is arranged on one side of the light incident surface, and the light-diffusing film layer is arranged on the light emitting surface.

On the other hand, an embodiment of the present application further provides an electronic device, the electronic device includes a display panel and a backlight module, the backlight module provides backlight to the display panel, and the backlight module includes the aforementioned backlight module.

In another aspect, the embodiments of the present application also provide a method for installing a backlight module, wherein the backlight module includes the aforementioned backlight module, and the installation method includes:

The reflective sheet and the flexible circuit board are arranged on the bottom plate from the direction of the top plate, and the flexible circuit board and the reflective sheet are arranged at intervals;

assembling the light source on the flexible circuit board, and assembling the light guide plate and the uniform light film layer on the reflective sheet in sequence;

transferring the buffer to the light source;

The upper back frame and the lower back frame are detachably assembled.

In the embodiment of the present application, by setting the back frame as a structure in which the upper back frame and the lower back frame are detachably connected, when assembling other components of the backlight module, the upper back frame and the lower back frame can be disassembled first, and the backlight module The other components of the group are assembled on the lower back frame, and then the upper back frame and the lower back frame are assembled, thereby avoiding the situation that the upper back frame hinders the installation and facilitating the installation of the backlight module.

Description of drawings

1 is a schematic structural diagram of a backlight module provided by the first embodiment of the present application;

2 is a schematic structural diagram of a backlight module provided by the first embodiment of the present application;

3 is a schematic structural diagram of a flexible circuit board and a back frame assembly;

4 is a schematic structural diagram of the second double-sided adhesive tape 134;

5 is a schematic structural diagram of a backlight module according to a third embodiment provided by the present application;

6 is a schematic structural diagram of a backlight module according to a fourth embodiment provided by the present application;

7 is a schematic structural diagram of a backlight module according to a fifth embodiment provided by the present application;

8 is a flowchart of a method for installing a backlight module provided by an embodiment of the present application;

Fig. 9 is a process flow diagram corresponding to the installation method shown in Fig. 8;

FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

FIG. 11 is a schematic diagram of an exploded structure of another electronic device provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all the structures related to the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes For other steps or units inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a backlight module according to a first embodiment of the present application. In this embodiment, the backlight module 10 includes a back frame assembly 11 , a light source 12 , a flexible printed circuit (FPC, Flexible Printed Circuit) 13 , a light guide plate 14 , a light homogenizing film 15 and a reflection sheet 16 .

The back frame assembly 11 includes an upper back frame 110 and a lower back frame 111 . The upper back frame 110 and the lower back frame 111 are detachably connected to form an accommodating space for disposing other components of the backlight module 10 , such as the light source 12 and the flexible circuit board 13 .

Specifically, the lower back frame 111 includes a bottom plate 1110 and a lower side wall 1111 connected to the bottom plate 1110 by bending. The lower side wall 111 is bent in the direction of the upper back frame 110 . The upper back frame 110 includes a top plate 1101 and an upper side wall 1102 connected to the top plate 1101 by bending. The bottom plate 1110 and the top plate 1101 are parallel to each other. The top plate The top plate 1101 can prevent the force of the display panel on the backlight module from being transmitted to the light source 12, thereby avoiding problems such as burst lights, dark shadows, and unevenness of the backlight.

The upper side wall 1102 is bent in the direction of the lower back frame 111 . The upper side wall 1102 and the lower side wall 1111 are detachably connected.

Specifically, the upper side wall 1102 and the lower side wall 1111 are detachably connected in a snap-fit manner. The upper side wall 1102 is provided with an engaging hole 1103 , and the lower side wall 1111 is provided with an engaging block 1112 . The upper side wall 1102 and the lower side wall 1111 are engaged by the engaging hole 1103 and the engaging block 1112 to form a snap connection.

In other embodiments, in order to better realize the engagement between the lower side wall 1111 and the upper side wall 1102 , a guide portion may be provided on the lower side wall 1102 . Referring to FIG. 2 , a guide portion 1104 is provided on the side of the upper side wall 1102 facing the lower side wall 1111 , and the guide portion 1104 can be parallel to the inclined side of the engaging block 1112 . The guide portion 1104 is used to guide the upper side wall 1102 to slide down along the engaging block 1112 of the lower side wall 1111 when the upper side wall 1102 is engaged with the lower side wall 1111 , so as to facilitate the connection between the engaging block 1112 and the engaging hole 1103 . snap.

Please refer to FIG. 1 again. In this embodiment, the bottom plate 1110 includes a first bearing portion 1113 and a second bearing portion 1114 . The first bearing portion 1113 is connected to the lower side wall 1111 by bending, and the second bearing portion 1114 is connected to an end of the first bearing portion 1113 away from the lower side wall 1111 . The distance H1 from the first bearing portion 1113 to the plane where the top plate 1101 is located is greater than the distance H2 from the second bearing portion 1114 to the plane where the top plate 1101 is located.

The material of the upper back frame 110 and the lower back frame 111 may be the same, and may be metal, such as iron, aluminum, etc., or plastic.

The flexible circuit board 13 is disposed between the light source 12 and the lower back frame 111 , more specifically, the flexible circuit board 13 is disposed between the light source 12 and the first bearing portion 1113 of the bottom plate 112 , and the flexible circuit board 13 and the first bearing portion A first double-sided adhesive tape 113 is disposed between 1113 , and the flexible circuit board 13 is connected to the first bearing portion 1113 of the bottom plate 112 through the first double-sided adhesive tape 113 .

In combination with the foregoing, the distance H1 from the first bearing portion 1113 to the plane where the top plate 1101 is located is greater than the distance H2 from the second bearing portion 1114 to the plane where the top plate 1101 is located, wherein the difference between H1 and H2 may be equal to the thickness of the flexible circuit board 13, so that The flexible circuit board 13 may be flush with the second bearing portion 1114 of the bottom plate 112 .

Please also refer to FIG. 3 , which is a schematic structural diagram of the flexible circuit board and the back frame assembly. Wherein, at least one of the upper back frame 110 and the lower back frame 111 is provided with an opening 1105 that communicates with the accommodating space. In this embodiment shown in FIG. 3 , the upper back frame 110 and the lower back frame 111 are jointly provided with the opening 1105 . 1105. The flexible circuit board 13 extends to the side of the upper back frame 110 and the lower back frame 111 away from the accommodating space through the opening 1105

Please refer to FIG. 1 again. In this embodiment, the light source 12 is disposed on the flexible circuit board 13 . The flexible circuit board 13 is electrically connected to the light source 12 .

The light source 12 may be a plurality of LED (Light Emitting Diode, light emitting diode) lamps arranged at intervals.

The reflection sheet 16 is disposed on the bottom plate 1110 of the lower back frame 111 and is located inside the accommodating space. The reflection sheet 16 can reflect incident light. The reflection sheet 16 is provided at intervals from the flexible circuit board 13 .

The light guide plate 14 is arranged on the lower back frame 111 , specifically, the reflection sheet 16 . The light guide plate 14 includes a light incident surface 141 and a light exit surface 142 . The light source 12 is arranged on the side of the light incident surface, and the uniform light film layer 15 is arranged on the light emitting surface 142 . The light incident surface 141 and the light exit surface 142 are two mutually perpendicular surfaces of the light guide plate 14 . The flexible circuit board 13 and the reflection sheet 16 are disposed on the side of the light guide plate 14 facing away from the light exit surface 142 .

The flexible circuit board 13 further extends from the light source 12 in the direction of the light guide plate 14 , and is further located between the light guide plate 14 and the first bearing portion 1113 of the bottom plate 1110 . That is to say, the flexible circuit board 13 and the homogenizing film layer 15 are respectively disposed on opposite sides of the light guide plate 14, and similarly, the flexible circuit board 13 and the homogenizing film layer 15 are respectively disposed on the opposite sides of the light source 12, thereby When the flexible circuit board 13 is on the same side as the light-diffusing film layer 15 , the supporting element for supporting the flexible circuit board 12 can be saved, thereby saving cost and saving the space where the supporting element is located.

The flexible circuit board 13 is further connected to the light guide plate 14 by a double-sided adhesive tape 124 . A second double-sided adhesive tape 134 is further disposed between the flexible circuit board 13 and the light guide plate 14 . The flexible circuit board 13 is further connected to the light guide plate 14 through a second double-sided adhesive tape 134 .

Please refer to FIG. 4 , which is a schematic structural diagram of the second double-sided adhesive tape 134 . As shown in FIG. 4 , the second double-sided tape 134 includes a tape main body 1341 and a tape extension portion 1342 . The tape main body 1341 is provided between the light guide plate 14 and the flexible circuit board 13 . The tape extension portions 1342 are provided in plural at intervals. A plurality of tape extension parts 1342 extend from the direction of the tape main body 1341 to the direction of the light source 12, and the tape extension parts 1342 are provided between the spaced LED lamps. The arrangement of the tape extension portion 1342 can increase the sticking area of the double-sided tape 134, thereby improving sticking stability.

Please refer to FIG. 1 again, the light homogenizing film layer 15 includes a diffusing film 151 , a first anti-reflection film 152 and a second anti-reflection film 153 which are disposed on the light-emitting surface 142 in a manner of being away from each other in sequence.

The diffusion film 151 , the first anti-reflection film 152 and the second anti-reflection film 153 may be non-composite films, that is, film layers that are independent of each other. In addition, the diffusion film 151 , the first anti-reflection film 152 and the second anti-reflection film 153 may also be composite films. Specifically, two cases are included:

In the first case, the first anti-reflection film 152 and the second anti-reflection film 153 are composite films, that is, the first anti-reflection film 152 and the second anti-reflection film 153 are provided as an integral film layer, and the integral film layer and the diffusion film 151 independent layers of each other.

In the second case, the diffuser film 151 , the first anti-reflection film 152 and the second anti-reflection film 153 are composite films, that is, the diffuser film 151 , the first anti-reflection film 152 and the second anti-reflection film 153 are provided as an integral film layer.

The first anti-reflection coating 152 may be referred to as a lower anti-reflection coating, and the second anti-reflection coating 153 may be referred to as an upper anti-reflection coating.

A buffer member 18 is further arranged between the light source 12 and the top plate 1101 , and the buffer member 18 is arranged spaced apart from the light-diffusing film layer 15 . The buffer member 18 can buffer and protect the light source 12 and play a role of supporting the components above the light source 12 . The buffer member 18 can be a foam glue with adhesive on both sides, which can fix the light source 12 .

The top plate 1101 is further provided with a light-shielding tape 17, and the light-shielding tape 17 is a light-shielding tape with adhesive properties on both sides. One end of the light-shielding tape 17 is further extended from the top plate 1101 to the direction of the light-diffusing film layer 15 and then disposed on the second anti-reflection film 153 .

The other end of the light shielding tape 17 can be connected to the upper side wall 1103 .

In other embodiments, the other end of the light shielding tape 17 may extend from the upper end of the upper side wall 1103 along the side wall of the upper side wall 1103 downward to the lower end of the lower side wall 1111 . Thereby, the upper side wall 1103 and the lower side wall 1111 are covered with the adhesive tape, thereby increasing the bonding area.

The area where the light shielding tape 17 is provided is the non-display area, and the area outside the light shielding tape 17 is the display area. In this embodiment, since the flexible circuit board 13 and the light-diffusing film layer 15 are arranged staggered, the bearing element supporting the flexible circuit board 13 is saved, thereby saving the space of the non-display area and increasing the screen ratio.

Please refer to FIG. 5 , which is a schematic structural diagram of a backlight module according to a third embodiment of the present application. As shown in FIG. 5 , the backlight module 30 still includes a back frame assembly 31 , a light source 32 , a flexible circuit board 33 , a light guide plate 34 , a light homogenizing film layer 35 and a reflection sheet 36 .

The structure and connection relationship of the light source 32 , the flexible circuit board 33 , the light guide plate 34 , the light homogenizing film layer 35 and the reflective sheet 36 are respectively the same as those of the light source 12 , the flexible circuit board 13 , the light guide plate 14 and the light homogenizing film layer described above. 15 and the reflective sheet 16 are the same, and will not be repeated here.

In this embodiment, the back frame assembly 31 still includes an upper back frame 310 and a lower back frame 311 . The upper back frame 310 still includes a top plate 3101 and an upper side wall 3102 , and the lower back frame 311 still includes a bottom plate 3110 and a lower side wall 3111 . Different from the previous embodiment, the back frame assembly 31 of this embodiment further includes screws 311 .

The upper side wall 3102 and the lower side wall 3111 are respectively provided with threaded holes 3103 and 3112 at corresponding positions. The upper side wall 3102 and the lower side wall 3111 are connected by screwing the screws 311 and the threaded holes 3103 and 3112 .

The connection relationship between the upper side wall 3102 and the top plate 3101 is as described above, and the connection relationship between the lower side wall 3111 and the bottom plate 3110 is as described above, and will not be repeated here.

Please refer to FIG. 6 , which is a schematic structural diagram of a backlight module according to a fourth embodiment of the present application. As shown in FIG. 6 , the backlight module 40 still includes a back frame assembly 41 , a light source 42 , a flexible circuit board 43 , a light guide plate 44 , a light homogenizing film layer 45 and a reflection sheet 46 .

The structure and connection relationship of the back frame assembly 41 , the light source 42 , the flexible circuit board 43 , the light guide plate 44 and the reflective sheet 46 are respectively the same as those of the back frame assembly 11 , the light source 12 , the flexible circuit board 13 , the light guide plate 14 and the The reflective sheet 16 is the same and will not be repeated here.

The difference between the backlight module 40 in this embodiment and the aforementioned backlight module 10 is that the diffusing film 451 of the homogenizing film layer 45 in this embodiment includes the first antireflection film 452 and the second antireflection film 451 . The diffuser body 4511 on which the film 453 is stacked and the positioning part 4512 extending from the diffuser body 4511 to the direction of the light source 42 are arranged. The height of the positioning part 4512 is higher than that of the diffuser body 4511 .

A buffer member 48 is disposed between the top plate 4101 and the light source 42 , and the buffer member 48 is spaced apart from the positioning portion 4512 of the diffusion film 451 . The buffer member 48 can be foam glue with adhesive on both sides, which can fix the light source 42 .

A light shielding tape 47 is provided on the top plate 4101 . One end of the light-shielding tape 47 extends from the top plate 4101 to the direction of the light-diffusing film layer 45 and is disposed on the positioning portion 4512 . In this way, the bonding area can be increased by the positioning portion 4512 of the diffusion film 451 , thereby effectively fixing the diffusion film 451 . Further, one end of the light-shielding tape 47 is further extended to the top of the second anti-reflection film 453, and the second anti-reflection film 453 is bonded and fixed.

The other end of the light shielding tape 47 can be in contact with the upper side wall 4102 . That is, one end of the light-shielding tape 47 away from the light-diffusing film layer 45 can be connected to the upper side wall 4102 . and can extend to the bottom of the lower side wall.

Please refer to FIG. 7 , which is a schematic structural diagram of a backlight module according to a fifth embodiment of the present application. As shown in FIG. 7 , the backlight module 50 still includes a back frame assembly 51 , a light source 52 , a flexible circuit board 53 , a light guide plate 54 , a light homogenizing film layer 55 and a reflection sheet 56 .

The structure and connection relationship of the light source 52 , the flexible circuit board 53 , the light guide plate 54 , the light homogenizing film layer 55 and the reflective sheet 56 are respectively the same as those of the light source 42 , the flexible circuit board 43 , the light guide plate 44 and the light homogenizing film layer described above. 45 and the reflective sheet 46 are the same, and will not be repeated here.

Different from the previous embodiment, the top plate 5101 of the back frame assembly of this embodiment extends from the upper side wall 5102 to the positioning portion 5512 of the diffusion film 551 , and the positioning portion 5512 abuts the top plate 5101 to fix the diffusion film 551 .

The top plate 5101 is further provided with a light-shielding tape 57, and the light-shielding tape 57 is a light-shielding tape with adhesive properties on both sides. One end of the light-shielding tape 57 is further extended in the direction of the light-diffusing film layer 55 and disposed above the second anti-reflection film 553 , and the second anti-reflection film 553 is bonded and fixed.

Please refer to FIG. 8 and FIG. 9 together. FIG. 8 is a flowchart of an installation method of a backlight module provided by an embodiment of the present application, and FIG. 9 is a schematic process flow diagram corresponding to the installation method shown in FIG. 8 . It should be understood that the backlight module may be the backlight module of any of the foregoing embodiments. For the convenience of description, this embodiment is described by taking the installation of the backlight module 10 shown in FIG. 1 as an example. As shown in Figure 8, the installation method of this embodiment includes the following steps:

Step S1: The reflective sheet 16 and the flexible circuit board 13 are arranged on the bottom plate 1110 from the direction of the top plate, and the flexible circuit board 13 and the reflective sheet 16 are arranged at intervals.

In this step, specifically, the flexible circuit board 13 is arranged on the first bearing portion 1113 of the bottom plate 1110 , and before the flexible circuit board 13 is arranged on the first bearing portion 1113 , the first double The surface tape 113 is used to fix the flexible circuit board 13 on the first bearing portion 1113 . The reflection sheet 16 is disposed on the second bearing portion 1114 .

Step S2 : assembling the light source 12 on the flexible circuit board 13 , and assembling the light guide plate 14 and the light homogenizing film layer 15 on the reflective sheet 16 in sequence.

As shown in FIG. 9 , the light guide plate 14 , the diffusing film 151 of the homogenizing film layer 15 , the first anti-reflection film 152 and the second anti-reflection film 153 are assembled on the bottom reflector 16 in sequence.

And before assembling the light guide plate 14 , a second double-sided adhesive tape 134 can be provided at the position of the flexible circuit board 13 corresponding to the light guide plate 14 , so that the light guide plate 14 can be fixed to the flexible circuit board 13 through the second double-sided tape 134 .

Step S3 : assembling the buffer 18 on the light source 12 . And the buffer member 18 is spaced apart from the dodging film layer 15 .

Step S4 : detachably assemble the upper back frame 110 and the lower back frame 111 .

The light shielding tape 17 may be further attached to the top plate 1101 .

Therefore, when assembling other components of the backlight module in this embodiment, the upper back frame 110 and the lower back frame 111 can be disassembled first, so that the lower back frame 111 forms an opening without any obstruction, and other components of the backlight module are assembled to the Then, the upper back frame 110 and the lower back frame 111 are assembled together, so as to avoid the situation that the upper back frame 110 is blocked and hinder the installation, and the installation of the backlight module is facilitated.

Please refer to FIG. 10 , which is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As shown in FIG. 10 , the electronic device 70 of this embodiment includes a backlight module 71 and a display panel 72 . The backlight module 71 provides backlight to the display panel 72 , wherein the backlight module 71 is the aforementioned backlight module.

The display panel 72 includes a lower polarizer 711 , an array substrate 712 , a color filter substrate 713 , and an upper polarizer 714 , which are sequentially arranged in a direction away from the backlight module 71 in the light-emitting direction of the backlight module 71 . A liquid crystal layer (not shown) is further disposed between the array substrate 712 and the color filter substrate 713 . The array substrate 712 and the lower polarizer 711 are respectively bonded to both ends of the light shielding tape 717 of the backlight module 71 .

The electronic device may be a smart phone, a tablet computer, a palmtop computer, a smart watch, or the like.

Please refer to FIG. 11 . FIG. 11 is a schematic diagram of an exploded structure of another electronic device provided by an embodiment of the present application. In this embodiment, the electronic device 80 may be a smart phone, and in other embodiments, the electronic device may also be a tablet computer, a palmtop computer, a smart watch, or the like.

In this embodiment, the electronic device 80 includes a rear case 81 , a middle frame 82 , a backlight module 83 , a display panel 84 and a cover plate 85 .

The middle frame 82 is fixedly connected to the rear case 81 .

The display panel 84 is stacked on the backlight module 83 , and both the display panel 84 and the backlight module 83 are fixed to the middle frame 82 .

The backlight module 83 is used to provide backlight for the display panel 84, and it can be the aforementioned backlight module.

The display panel 84 may be a liquid crystal display panel or other display panels.

The cover plate 85 covers the display panel 84 . The cover plate 85 may be a transparent glass cover plate, and in the non-display area, the cover plate 85 may be opaque. For example, the cover plate 85 is coated with light-shielding ink in the non-display area.

It should be understood that other structures of the electronic device, such as a circuit board, etc., may be disposed between the rear case 81 and the middle frame 82. Since the present application does not involve the improvement of these components, no specific description is given here.

In other embodiments, the electronic device 80 may also adopt other structures, and the description of the structure of the electronic device 80 above does not limit the protection scope of the present application.

The above description is only an embodiment of the present application, and is not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims (11)

1. A backlight module, characterized in that the backlight module comprises: An upper back frame and a lower back frame, the upper back frame and the lower back frame are detachably connected, and an accommodation space is formed between the upper back frame and the lower back frame, and the lower back frame includes a bottom plate and a lower side wall bent and connected to the bottom plate, and the upper back frame includes a top plate and an upper side wall bent and connected to the top plate; The light source and the flexible circuit board arranged in the accommodating space, and the light guide plate and the homogenizing film layer arranged on the lower back frame, wherein: The flexible circuit board and the homogenizing film layer are respectively disposed on opposite sides of the light source, and the flexible circuit board is electrically connected to the light source; The light guide plate includes a light incident surface and a light emitting surface, the light source is arranged on one side of the light incident surface, and the light-diffusing film layer is arranged on the light emitting surface; The bottom plate includes a first bearing portion and a second bearing portion, the first bearing portion is connected to the lower side wall by bending, and the distance from the first bearing portion to the plane where the top plate is located is greater than the second bearing portion the distance from the top plate to the plane where the top plate is located; the flexible circuit board is arranged between the light source and the first bearing part, and the flexible circuit board is flush with the second bearing part; the flexible circuit A first double-sided tape is further arranged between the board and the first bearing portion, and the flexible circuit board is connected to the first bearing portion through the first double-sided tape; The flexible circuit board extends from the light source in the direction of the light guide plate, and is further located between the light guide plate and the first bearing portion, and a second board is further arranged between the flexible circuit board and the light guide plate. Two-sided tape, the second double-sided tape includes a tape main body and a tape extension portion, the tape main body is arranged between the light guide plate and the flexible circuit board, and the tape extension portion extends from the tape main body. the direction extends in the direction of the light source; A buffer member is also arranged between the light source and the top plate, and the buffer member fixes the light source; The backlight module further includes a reflection sheet, and the reflection sheet is arranged on the second bearing portion. 2 . The backlight module according to claim 1 , wherein the upper side wall and the lower side wall are detachably connected, and the bottom plate and the top plate are parallel to each other. 3 . 3 . The backlight module according to claim 2 , wherein the upper side wall is provided with an engaging hole, the lower side wall is provided with an engaging block, and the upper side wall and the lower side wall are provided with an engaging block. 4 . The side wall forms a snap connection through the engagement of the snap hole and the snap block. 4 . The backlight module according to claim 2 , wherein the backlight module further comprises screws, the upper side wall and the lower side wall are respectively provided with threaded holes at corresponding positions, and the upper side wall and the lower side wall are respectively provided with threaded holes. 5 . The wall and the lower side wall are connected by screwing the screw and the threaded hole. 5 . The backlight module of claim 1 , wherein the reflective sheet is located on a side of the light guide plate facing away from the light emitting surface, and the reflective sheet and the flexible circuit board are arranged at intervals. 6 . 6 . The backlight module according to claim 1 , wherein the homogenizing film layer comprises a diffusion film, a first anti-reflection film and a second anti-reflection film which are arranged on the light-emitting surface in a manner of being away from each other in sequence. 7 . membrane. 7 . The backlight module according to claim 6 , wherein the diffusing film comprises a diffusing body overlapping with the first anti-reflection film and the second anti-reflection film, and a self-diffusing body. 8 . A positioning portion extending in the direction of the light source, the height of the positioning portion being higher than that of the diffusing body. 8 . The backlight module according to claim 7 , wherein a light-shielding tape is further provided on the top plate, and the light-shielding tape is further extended from the top plate to the direction of the light-diffusing film layer and disposed on the top plate. 9 . on the positioning portion, or the top plate is arranged between the positioning portion and the light shielding tape. 9 . The backlight module of claim 7 , wherein the buffer member and the positioning portion are arranged at intervals. 10 . 10. An electronic device, characterized in that the electronic device comprises a display panel and a backlight module, the backlight module provides backlight to the display panel, wherein the backlight module comprises any of claims 1-9. The backlight module described in one item. 11. An installation method for a backlight module, wherein the backlight module comprises the backlight module according to any one of claims 1-9, wherein the installation method comprises: The flexible circuit board is disposed on the first carrying part and the reflection sheet is disposed on the second carrying part from the direction of the top plate, and the flexible circuit board and the reflecting sheet are spaced apart set up; assembling the light source on the flexible circuit board, and assembling the light guide plate and the uniform light film layer on the reflective sheet in sequence; assembling the buffer on the light source; The upper back frame and the lower back frame are detachably assembled.

Images