CN108233699A - A kind of power management chip, electric power system and electronic equipment - Google Patents
A kind of power management chip, electric power system and electronic equipment Download PDFInfo
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- CN108233699A CN108233699A CN201710643161.6A CN201710643161A CN108233699A CN 108233699 A CN108233699 A CN 108233699A CN 201710643161 A CN201710643161 A CN 201710643161A CN 108233699 A CN108233699 A CN 108233699A
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- charge pump
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- buck
- power management
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- 230000006837 decompression Effects 0.000 claims abstract description 88
- 238000012546 transfer Methods 0.000 claims abstract description 45
- 238000006243 chemical reaction Methods 0.000 claims description 123
- 230000009467 reduction Effects 0.000 claims description 74
- 230000005611 electricity Effects 0.000 claims description 11
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- 206010037660 Pyrexia Diseases 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of DC power input into DC power output
- H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
- H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
- H02M3/06—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider
- H02M3/07—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0067—Converter structures employing plural converter units, other than for parallel operation of the units on a single load
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
Abstract
The invention discloses a kind of power management chip, electric power system and electronic equipment, to solve the problems, such as that power management chip transfer efficiency is low in the prior art.Power management chip includes：BUCK is depressured modular converter and charge pump modular converter；The output terminal of charge pump modular converter is connect with the input terminal of BUCK decompression modular converters, and the output terminal of BUCK decompression modular converters is connected with corresponding load；Charge pump modular converter, the first voltage after the input voltage of power management chip is depressured are transferred to BUCK decompression modular converters；BUCK is depressured modular converter, and the second voltage after first voltage is depressured is exported to load.Since the input of BUCK decompression modular converters, output pressure difference become smaller, transfer efficiency improves, and improves the transfer efficiency of power management chip.
Description
Technical field
The present invention relates to power supply chip technical field, more particularly to a kind of power management chip, electric power system and electronics are set
It is standby.
Background technology
As chip making technology is increasingly advanced, chip volume reduces, and lower power consumption has become development trend.General core
The supply voltage of piece kernel is 0.5V-1.4V, such as CPU supply voltages (VCORE), graphics processor (Graphics
Processing Unit, GPU) supply voltage (VGPU), modem supply voltage (VMD), dynamic randon access
Memory (Dynamic Random Access Memory, DRAM), supply voltage (VDRAM) are 0.5V-1.4V.Power management
Chip interior is provided with buck conversion circuit, generally BUCK reduction voltage circuits, and the input voltage of power management chip is carried out
Decompression reaches the voltage value of chip core.Fig. 1 is the electrical schematic of traditional power management chip, and BUCK decompressions are electric
The power supply unit of 3V-5V is depressured to 0.5V-1.4V by road for its input voltage provided, negative for what is connect with power management chip
Carry power supply, it can be understood as power to chip core, naturally it is also possible to be other loads.
Since the switching tube in BUCK reduction voltage circuits is there are conduction loss and switching loss, there are coil losses and magnetic for inductance
Core loss, so the decompression transfer efficiency of BUCK reduction voltage circuits cannot accomplish very high, the transfer efficiency of BUCK reduction voltage circuits is general
For 80%-85% or so.And for BUCK reduction voltage circuits, the pressure difference of input voltage and output voltage is bigger, and transfer efficiency is got over
It is low.Therefore lower and lower with the supply voltage of chip core, the transfer efficiency of BUCK reduction voltage circuits continues to decline, and chip
Fever can also strengthen.
Transfer efficiency of the following table 1 for the BUCK reduction voltage circuits of certain external well-known power supply producer：
Table 1
It can be obtained by table 1, when output current is identical, the pressure difference of input voltage and output voltage is bigger, transfer efficiency
It is lower.These be all genuine on embedded computer plate (Embedded Computer Board, EVB), in thermal diffusivity, work(
In the case that rate inductance etc. is all optimal, the data tested.But in practical circuit design, more uses printing
Circuit board (Printed Circuit Board, PCB), due to being laid out cabling, the influence of parts selection, BUCK decompressions by PCB
The transfer efficiency of circuit can also reduce 1%-5% again.The power management chip used in terminal is that relevant BUCK is depressured electricity
Road integrates, integrate after BUCK reduction voltage circuits, than single BUCK reduction voltage circuits transfer efficiency also than reduce, and
By layout cabling, parts selection, after the influence radiated etc., the practical transfer efficiency of BUCK reduction voltage circuits will also reduce again.Cause
This transfer efficiency for improving power management chip has become extremely important.
Invention content
The embodiment of the invention discloses a kind of power management chip, electric power system and electronic equipment, to solve existing skill
The problem of power management chip transfer efficiency is low in art.
In order to achieve the above objectives, the embodiment of the invention discloses a kind of power management chip, the power management chip packets
It includes：Charge pump modular converter and BUCK decompression modular converters；
The output terminal of the charge pump modular converter is connect with the input terminal of BUCK decompression modular converters, the BUCK
The output terminal for being depressured modular converter is connected with corresponding load；
The charge pump modular converter, for the input voltage of power management chip to be carried out first time decompression, and by the
First voltage after primary decompression is transferred to the BUCK decompressions modular converter；
The BUCK is depressured modular converter, is depressured for the first voltage received to be carried out second, and will be second
Second voltage after decompression is exported to corresponding load.
Further, the BUCK decompressions modular converter includes a BUCK reduction voltage circuit or more than two BUCK in parallel
Reduction voltage circuit.
Further, the charge pump modular converter includes a charge pump conversion sub-circuit, charge pump conversion
The output terminal of the connection of the input terminal of the output terminal of circuit and BUCK reduction voltage circuit or the charge pump conversion sub-circuit with
The input terminal connection of more than two BUCK reduction voltage circuits in parallel.
Further, the charge pump modular converter includes more than two charge pump conversion sub-circuits in parallel, when described
When BUCK decompression modular converters include the BUCK reduction voltage circuits of more than two parallel connections, wherein, each charge pump conversion sub-circuit
Output terminal is connect with the input terminal of a BUCK reduction voltage circuit or more than two BUCK reduction voltage circuits in parallel.
Further, the output terminal of each charge pump conversion sub-circuit is defeated with all BUCK reduction voltage circuits in parallel respectively
Enter end connection.
Further,
For any charge pump conversion sub-circuit, the charge pump conversion sub-circuit includes：First switch, second switch,
Third switch, the 4th switch, the first capacitance and the second capacitance；Wherein：
The output of power supply unit of the input terminal of the first switch with providing input voltage for the power management chip
End connection, the output terminal of the first switch first end phase with the input terminal of third switch, first capacitance respectively
Even；
The input terminal of the second switch and the second end of first capacitance and the input terminal phase of the 4th switch
Even；The output terminal of the second switch is connected with the output terminal that the first end of second capacitance and the third switch；
The output terminal of 4th switch is connected with the second end of second capacitance；
Input terminal of the input terminal of the first switch as the charge pump conversion sub-circuit, the second switch it is defeated
The first end of outlet, the output terminal of third switch or second capacitance is as the defeated of the charge pump conversion sub-circuit
Outlet.
Further, for the charge pump modulus of conversion any charge pump conversion sub-circuit in the block, the charge pump turns
The relationship changed between the input voltage of sub-circuit and input current and output voltage and output current is：
Wherein, Vc represents the input voltage of the charge pump conversion sub-circuit；The Ic represents charge pump conversion
The input current of circuit；The Vbat represents the output voltage of the charge pump conversion sub-circuit；The Ibat represents the electricity
Lotus pumps the output current of conversion sub-circuit；The η represents the decompression transfer efficiency of the charge pump conversion sub-circuit；The M is
The number of charge pump conversion sub-circuit that positive integer and the expression charge pump modular converter include.
Further, the load includes following at least one：
CPU, graphics processor GPU, modem, dynamic random access memory DRAM.
An embodiment of the present invention provides a kind of electric power system, the electric power system include above-mentioned power management chip, with
The power supply unit and connect with the power management chip output terminal at least one that the power management chip input terminal connects
Load.
An embodiment of the present invention provides a kind of electronic equipment, the electronic equipment includes above-mentioned power management chip.
The embodiment of the invention discloses a kind of power management chip, electric power system and electronic equipment, the power management core
Piece includes：BUCK is depressured modular converter and charge pump modular converter；The output terminal of the charge pump modular converter and the BUCK
The input terminal connection of modular converter is depressured, the output terminal of the BUCK decompressions modular converter is connected with corresponding load；The electricity
Lotus pumps modular converter, for the input voltage of power management chip to be carried out first time decompression, and the after being depressured for the first time
One voltage is transferred to the BUCK decompressions modular converter；The BUCK is depressured modular converter, for the first voltage that will be received
It carries out second to be depressured, and the second voltage after second of decompression is exported to corresponding load.Due in the embodiment of the present invention
In, power management chip includes charge pump modular converter and BUCK decompression modular converters, and charge pump modular converter is by power supply pipe
After the input voltage progress first time decompression for managing chip, BUCK decompression modular converters are sent to, since load required voltage is
Determining, because the input voltage of BUCK decompression modular converters reduces, the input of BUCK decompression modular converters, output voltage
Pressure difference reduce, BUCK decompression modular converter transfer efficiency improve, and in charge pump modular converter do not include inductance component,
Transfer efficiency is very high, therefore the transfer efficiency of the power management chip based on BUCK decompression modular converters and charge pump modular converter
It is greatly improved, so as to reduce thermal power loss, reduces the temperature of power management chip, alleviate the fever of terminal
Situation reduces the power consumption of chip, improves the cruising ability of terminal.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of power management chip structure diagram that the prior art provides；
Fig. 2 implements a kind of 1 power management chip structure diagram provided for the present invention；
Fig. 3 implements a kind of 3 power management chip structure diagrams provided for the present invention；
Fig. 4 implements a kind of 3 power management chip structure diagrams provided for the present invention；
Fig. 5 implements a kind of 4 power management chip structure diagrams provided for the present invention；
Fig. 6 implements a kind of 4 power management chip structure diagrams provided for the present invention；
Fig. 7 implements a kind of 5 power management chip structure diagrams provided for the present invention；
Fig. 8 implements a kind of 6 charge pump conversion sub-circuit structure diagrams provided for the present invention；
Fig. 9 implements 6 another charge pump conversion sub-circuit structure diagrams provided for the present invention；
Figure 10 is a kind of power management chip structure diagram provided in an embodiment of the present invention；
Figure 11 is a kind of power management chip structure diagram provided in an embodiment of the present invention；
Figure 12 implements 7 for the present invention and provides a kind of electric power system structure diagram.
Specific embodiment
In order to improve the decompression transfer efficiency of power management chip, an embodiment of the present invention provides a kind of power management cores
Piece, electric power system and electronic equipment.
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1：
A kind of power management chip structure diagram that Fig. 2 is provided for the embodiment of the present invention 1, the power management chip packet
It includes：Charge pump modular converter 11 and BUCK decompression modular converters 12；
The output terminal of the charge pump modular converter 11 is connect with the input terminal of BUCK decompression modular converters 12, described
The output terminal of BUCK decompression modular converters 12 and corresponding 13 connection of load；
The charge pump modular converter 11, for the input voltage of power management chip to be carried out first time decompression, and will
First voltage after being depressured for the first time is transferred to the BUCK decompressions modular converter 12；
The BUCK is depressured modular converter 12, is depressured for the first voltage received to be carried out second, and by second
Second voltage after secondary decompression is exported to corresponding load 13.
In embodiments of the present invention, power management chip includes BUCK decompression modular converters and charge pump modular converter.
The output terminal of the charge pump modular converter is connect with the input terminal of BUCK decompression modular converters, and charge pump modular converter can incite somebody to action
The input voltage of power management chip carries out first time decompression, obtains first voltage, and the first voltage is transferred to the BUCK
It is depressured modular converter.The output terminal of BUCK decompression modular converters is connected with corresponding load, and BUCK decompressions modular converter will receive
The first voltage arrived carries out second and is depressured, and the second voltage after second of decompression is exported to corresponding load, is negative
Carry power supply.
Since in embodiments of the present invention, power management chip includes charge pump modular converter and BUCK decompression moduluss of conversion
Block after the input voltage of power management chip is carried out first time decompression by charge pump modular converter, is sent to BUCK decompression conversions
Module is to determine due to load required voltage, because the input voltage of BUCK decompression modular converters reduces, BUCK drops
The input of modular converter, the pressure difference of output voltage is pressed to reduce, the first transfer efficiency of BUCK decompression modular converters improves, reachable
90%, and do not include inductance component in charge pump modular converter, transfer efficiency reaches as high as 98%, because of the first transfer efficiency
It is more than 85% with the product of the second transfer efficiency, so improving the transfer efficiency of power management chip, reduces thermal power damage
Consumption, reduces the temperature of power management chip, alleviates the heat condition of terminal, reduce the power consumption of chip, improve terminal
Cruising ability.
Embodiment 2：
On the basis of above-described embodiment, in embodiments of the present invention, charge pump modular converter includes at least one charge
Conversion sub-circuit is pumped, the BUCK decompressions modular converter includes at least one BUCK reduction voltage circuits；It is converted for each charge pump
Sub-circuit, the input terminal of the output terminal of the charge pump conversion sub-circuit respectively at least one BUCK reduction voltage circuits are connect；
Specifically, for each BUCK reduction voltage circuits, the input terminal of the BUCK reduction voltage circuits is defeated with charge pump conversion sub-circuit
Outlet is connected or is connect with the output terminal of more than two charge pump conversion sub-circuits in parallel.For each BUCK reduction voltage circuits,
The load that the output terminal of the BUCK reduction voltage circuits is corresponding connects；Each charge pump conversion sub-circuit, for by power supply
The input voltage of managing chip carries out first time decompression, and the first voltage after first time is depressured be sent to it is connected to it extremely
A few BUCK reduction voltage circuit；Each BUCK reduction voltage circuits, for the first voltage received to be carried out second
Decompression, and the second voltage after second of decompression is exported to corresponding load.The load includes following at least one：
CPU, graphics processor GPU, modem, dynamic random access memory DRAM.Each load needs
Voltage may be identical, it is also possible to it is different.
The charge pump modular converter includes a charge pump conversion sub-circuit or more than two charge pump conversions in parallel
Sub-circuit, specific quantity can flexibly be set according to actual conditions, such as may be configured as 2,5,10, this not made any
It limits.Preferably, it is generally the case that the charge pump modular converter may include at least two charge pump conversion parallel with one another
Circuit does not repeat this.
The BUCK decompressions modular converter includes a BUCK reduction voltage circuit or more than two BUCK reduction voltage circuits in parallel,
Specific quantity can flexibly be set according to actual conditions, and under normal circumstances, a BUCK reduction voltage circuit connects a load, each
BUCK reduction voltage circuits connect different loads, and the voltage of each BUCK reduction voltage circuits output is different at this time.Multiple BUCK decompressions electricity
The input terminal on road can be connect with the output terminal of a charge pump conversion sub-circuit simultaneously.
Individually below by different embodiments, to the charge pump modular converter included and BUCK in power management chip
The connection of decompression modular converter is described in detail.
Embodiment 3：
On the basis of the various embodiments described above, in embodiments of the present invention, the charge pump modular converter includes an electricity
Lotus pumps conversion sub-circuit, and BUCK decompressions modular converter can include at least one BUCK reduction voltage circuits, each BUCK reduction voltage circuits
Output terminal of the input terminal with a charge pump conversion sub-circuit connect.
The specific can be that as shown in figure 3, charge pump modular converter 11 include a charge pump conversion sub-circuit 111,
BUCK decompression modular converter 12 include a BUCK reduction voltage circuit 121, the output terminal of a charge pump conversion sub-circuit 111 and
The input terminal connection of one BUCK reduction voltage circuit 121, a BUCK reduction voltage circuit 121 and corresponding 13 connection of load.
If the power management chip includes a BUCK reduction voltage circuit, a charge pump conversion son electricity can be passed through
Lu Weiqi is depressured.
Or as shown in figure 4, charge pump modular converter 11 includes a charge pump conversion sub-circuit 111, BUCK decompressions turn
Change the mold block 12 and include more than two in parallel BUCK reduction voltage circuits 121, the output terminal of a charge pump conversion sub-circuit 111 with
The input terminal connection of the BUCK reduction voltage circuits 121 of two or more parallel connection, each BUCK reduction voltage circuits 121 and corresponding load 13
Connection.
In order to effectively reduce the area of power management chip, an electricity can be specifically included in power management chip
Lotus pumps conversion sub-circuit and more than two BUCK reduction voltage circuits, the charge pump conversion sub-circuit are more than two in parallel with this
BUCK reduction voltage circuits connect, and are depressured for it.
Embodiment 4：
In order to reduce the current stresses that charge pump conversion sub-circuit is born, on the basis of the various embodiments described above, in this hair
In bright embodiment, the charge pump modular converter includes more than two charge pump conversion sub-circuits in parallel, when the decompression turns
When changing the mold BUCK reduction voltage circuit of the block including more than two parallel connections, wherein, the output terminal and one of each charge pump conversion sub-circuit
The input terminal connection of a BUCK reduction voltage circuits or more than two BUCK reduction voltage circuits in parallel.
When power management chip includes more than two BUCK reduction voltage circuits, in order to effectively reduce because charge pump turns
Change sub-circuit failure, the problem of leading to not for load supplying, the charge pump modular converter packet in embodiments of the present invention
The charge pump conversion sub-circuit of more than two parallel connections is included, risk is reduced by more than two charge pump conversion sub-circuits in parallel.
One charge pump conversion sub-circuit can connect a BUCK reduction voltage circuit, can also be depressured with more than two BUCK in parallel
Circuit connects, can be effective when a charge pump conversion sub-circuit is connect with more than two BUCK reduction voltage circuits in parallel
Reduce the current stresses that charge pump conversion sub-circuit is born.
The specific can be that as shown in figure 5, the charge pump modular converter 11 includes three charge pump conversion in parallel
Circuit 111, BUCK decompression modular converters 12 include three BUCK reduction voltage circuits 121 in parallel, each charge pump conversion sub-circuit
111 output terminal is connect with the input terminal of a BUCK reduction voltage circuit 121, each BUCK reduction voltage circuits 121 and corresponding load
13 connections.
Or as shown in fig. 6, the charge pump modular converter 11 include two charge pump conversion sub-circuits 111 in parallel,
BUCK decompression modular converters 12 include 5 BUCK reduction voltage circuits 121 in parallel, the output of a charge pump conversion sub-circuit 111
End connect with the input terminal of two BUCK reduction voltage circuits 121 in parallel, the output terminal of another charge pump conversion sub-circuit 111 and
The input terminal connection of three BUCK reduction voltage circuits 121 in parallel, each BUCK reduction voltage circuits 121 and corresponding 13 connection of load.
Embodiment 5：
In order to avoid when some charge pump conversion sub-circuit breaks down, it is impossible to BUCK reduction voltage circuits connected to it
First voltage after transmission decompression, so as to be load supplying, on the basis of the various embodiments described above, in the embodiment of the present invention
In, the input terminal of the output terminal of each charge pump conversion sub-circuit respectively with the BUCK reduction voltage circuits of all parallel connections is connect.
In order to effectively reduce the risk that cannot be load supplying, two or more may be used in embodiments of the present invention simultaneously
The charge pump conversion sub-circuit of connection, the output terminal of each charge pump conversion sub-circuit are depressured electricity with all BUCK in parallel respectively
The input terminal connection on road.For example, if the charge pump modular converter 11 in power supply chip includes 2 charge pump conversion sub-circuits
111, BUCK decompression modular converters 12 include 3 BUCK reduction voltage circuits 121 in parallel, the specific can be that the as shown in fig. 7, the 1st
It is a to be connect with the 2nd charge pump conversion sub-circuit 111 with 3 BUCK reduction voltage circuits 121 in parallel, each BUCK reduction voltage circuits
121 connect with corresponding load 13.Accordingly even when a certain charge pump conversion sub-circuit breaks down, it is impossible to be connected to it
BUCK reduction voltage circuits transmit first voltage, and BUCK reduction voltage circuits can also obtain the charge pump conversion sub-circuit of other normal works
The first voltage of output, so as to be the load supplying being connect with the BUCK reduction voltage circuits.
Embodiment 6：
On the basis of the various embodiments described above, in embodiments of the present invention, as shown in figure 8, being converted for any charge pump
Sub-circuit, the charge pump conversion sub-circuit include：First switch Q1, second switch Q2, third switch Q3, the 4th switch Q4,
First capacitance C1 and the second capacitance C2；Wherein：
Power supply unit of the input terminal of the first switch Q1 with providing input voltage for the power management chip it is defeated
Outlet connects；The output terminal of the first switch Q1 respectively with the third switch input terminal of Q3, the first capacitance C1
First end is connected；
The input terminal of the second switch Q2 switchs the defeated of Q4 with the second end of the first capacitance C1 and the described 4th
Enter end to be connected；The output terminal of the second switch Q2 switchs the defeated of Q3 with the first end of the second capacitance C2 and the third
Outlet is connected；
The output terminal of the 4th switch Q4 is connected with the second end of the second capacitance C2；
Input terminal of the input terminal of the first switch Q1 as the charge pump conversion sub-circuit, the second switch Q2
Output terminal, the third switch Q3 output terminal or the second capacitance C2 first end as the charge pump convert son
The output terminal of circuit.
The power supply unit of input voltage is provided for the power management chip can be defeated with the power management chip
Enter the supplying cell or adapter of end connection.
Compared with the prior art, due to the charge/discharge member used in the power management chip described in the embodiment of the present invention
Part is capacitance (i.e. the first capacitance and the second capacitance) rather than inductance, because without coil loss, core loss, conversion effect
The input voltage that rate reaches as high as 98%, BUCK decompression modular converters reduces, and output voltage is constant, then defeated when being depressured
Enter, the reduction of the pressure difference of output voltage, the first transfer efficiency raising of BUCK decompression modular converters, reachable 90%, then power management
The total transfer efficiency of chip：98%*90%=88.2%, and only the buck Jing Guo level-one drops power management chip in the prior art
Piezoelectricity pressure, transfer efficiency is generally in 80%-85% or so.
In embodiments of the present invention, using charge pump conversion sub-circuit and BUCK reduction voltage circuits, the side of two-stage decompression is carried out
Formula, the transfer efficiency highest in power management chip can reach 88.2%, it is opposite can be than BUCK reduction voltage circuits one be used alone
Transfer efficiency 80%-85% of mode of grade decompression or so, transfer efficiency has the raising of 3%-8%.For entire terminal,
Cruise duration can be increased, if the battery core of 3000mAH, transfer efficiency improves 3%-8%, it is meant that, power supply unit can be more
Go out 3000mAH*3%-3000mAH*8% i.e. 90mAH-240mAH to can be used for continuing a journey.When being worked normally such as terminal, operating current
1A or so, it is possible to which be delayed 5.4min-11.4min on the basis of original continuation of the journey.Cell phone standby electric current 3mA or so, it is possible to
Increase 30h-80h on the basis of original standby continuation of the journey.And charge pump conversion sub-circuit, peripheral circuit is simple, needs several
Storage capacitor, cost also can be than relatively low.High conversion efficiency, output voltage ripple is small, and electromagnetic interference EMI can be much smaller.Turn simultaneously
The raising of efficiency is changed, the thermal power loss of power management chip will reduce, and can reduce the operating temperature of chip.To terminal
Speech reduces operating temperature, this can also play very big help.
It should be noted that due to by the first switch Q1, second switch Q2, third switch Q3, the 4th switch Q4, the
The circuit structure that one capacitance C1 and the second capacitance C2 are formed may be commonly referred to as charge pump conversion (Charge Pump
Converter) circuit, therefore, the power management chip described in the embodiment of the present invention are specifically referred to alternatively as based on Charge
The power management chip (being subsequently still referred to as power management chip) of Pump Converter circuits.
Further, the first switch Q1, second switch Q2, the third switches of switch Q3 and the 4th Q4 may each comprise one
The switch element of a or more than two parallel connections, so as to be effectively reduced the first switch Q1, second switch Q2, third switch
The conducting resistance of the switches of Q3 and the 4th Q4, improves the decompression transfer efficiency of charge pump conversion sub-circuit, improves power supply pipe
The transfer efficiency of chip is managed, reduces thermal power loss, reduces the temperature of power management chip, mitigates the heat condition of terminal, drop
The power consumption of low chip, improves the cruising ability of terminal, and the embodiment of the present invention does not repeat this.
Preferably, the switch element can be transistor.
Optionally, the transistor may include triode or field-effect tube.
It should be noted that if the switch element is triode, then the control terminal of the switch element can be three poles
The base stage of pipe, the input terminal of the switch element can be the collector (or emitter) of triode, the switch element it is defeated
Outlet can be the emitter (or collector) of triode；If the switch element is field-effect tube, the switch element
Control terminal can be the grid of field-effect tube, and the input terminal of the switch element can be the drain electrode (or source electrode) of field-effect tube,
The output terminal of the switch element can be the source electrode (or drain electrode) of field-effect tube.Certainly, the input terminal of the switch element and
Output terminal can also be intercoursed, and the embodiment of the present invention is not limited in any way this.
Still optionally further, the triode may include NPN type triode, PNP type triode, and the field-effect tube can wrap
N-channel type field-effect tube and P-channel type field-effect tube etc. are included, the embodiment of the present invention is not also limited in any way this.
In addition, it is necessary to explanation, the first switch Q1, second switch Q2, the third switches of switch Q3 and the 4th Q4
Can also be any hardware switch that can realize switching function, such as can be single-pole double-throw switch (SPDT), double-point double-throw switch, the present invention
Embodiment is not limited in any way this.
Optionally, the first capacitance C1 and the second capacitance C2 at least may include one or more parallel connection
Capacity cell.Since the capacity cell of multiple parallel connections can effectively reduce the ESR of integral capacitor, thus, can effectively it increase
Electric current improves the transfer efficiency of power management chip, reduces thermal power loss, reduces the temperature of power management chip, mitigates eventually
The heat condition at end reduces the power consumption of chip, improves the cruising ability of terminal, and the embodiment of the present invention does not also repeat this.
Optionally, as shown in figure 9, its another circuit for the charge pump conversion sub-circuit described in the embodiment of the present invention
Structure diagram.Specifically, as shown in Figure 9, the charge pump conversion sub-circuit may also include third capacitance C3, wherein：
When first charge pump conversion sub-circuit in charge pump conversion sub-circuit converting branch where it, institute
Stating the first end of third capacitance C3 can export with the output terminal for the power supply unit that input voltage is provided for the power management chip
End is connected.
Wherein, the third capacitance C3 can be used for the first switch Q1 and second in the charge pump conversion sub-circuit
When switching Q2 unlatchings, the third switch Q4 closings of switch Q3 and the 4th, capacitance (the i.e. institute into the charge pump conversion sub-circuit
State the first capacitance C1 and second capacitance C2) and the power management chip in current compensation.
It should be noted that in order to further reduce ESR (the Equivalent Series of the third capacitance C3
Resistance, equivalent series resistance), reduce the charging time, improve charge efficiency, the third capacitance C3 at least may include one
The capacity cell of a or more than two parallel connections, does not also repeat this.
That is, similarly to the prior art, it in embodiments of the present invention, can also be in the charge pump conversion sub-circuit
One third capacitance C3 of input terminal parallel connection.Since the third capacitance C3 is also connected in parallel on input is provided for the power management chip
The output terminal of the power supply unit of voltage, thus the power supply unit for providing for the power management chip input voltage can be always to institute
Third capacitance C3 chargings are stated, so that when first switch Q1, second switch Q2 are connected, the third capacitance C3 can be to institute
The first capacitance C1, the second capacitance C2 and load supplying to be powered are stated, and then realizes the effect of current compensation, is avoided
The electric current of the power supply unit output of input voltage is provided for the power management chip too small to be caused be normally that load supplies
The problem of electric.
Further, for the charge pump modulus of conversion any charge pump conversion sub-circuit in the block, for the charge
Pump modulus of conversion any charge pump conversion sub-circuit in the block, the input voltage and input current of the charge pump conversion sub-circuit
Relationship between output voltage and output current is：
Wherein, Vc represents the input voltage of the charge pump conversion sub-circuit；The Ic represents charge pump conversion
The input current of circuit；The Vbat represents the output voltage of the charge pump conversion sub-circuit；The Ibat represents the electricity
Lotus pumps the output current of conversion sub-circuit；The η represents the decompression transfer efficiency of the charge pump conversion sub-circuit；The M is
The number of charge pump conversion sub-circuit that positive integer and the expression charge pump modular converter include.
For example, for only including a charge pump conversion sub-circuit in charge pump modular converter, it is assumed that described first opens
Close Q1, the second switch Q2, third switch Q3 and the 4th switch Q4 is metal-oxide-semiconductor, and conducting resistance point
Can not be RQ1、RQ2、RQ3And RQ4, the ESR of the first capacitance C1 and the second capacitance C2 can be respectively RC1And RC2,
It is then first control signal (being such as high level 1) when the charge pump conversion sub-circuit receives control signal, then charge pump turns
Mold changing block 11 and the connection of BUCK decompression modular converters 12 can be reduced to circuit structure shown in Fig. 10；When the charge pump converts son
The control signal that circuit receives is second control signal (such as can be low level 0), then charge pump modular converter 11 and BUCK
The connection of decompression modular converter 12 can be reduced to the circuit structure shown in Figure 11.
Further, for charge pump conversion sub-circuit, it is assumed that (the control signal received is first in the first stage
Control the stage of signal, preceding T/2 stages), electric current (charging current of i.e. described first capacitance C1 and the second capacitance C2,
The T/2 stages afterwards) virtual value can be Ic, second stage (receive control signal be second control signal stage),
Electric current (discharge current of i.e. described first capacitance C1 and the second capacitance C2) virtual value is Id；Assuming that input current can be
Iin, output current can be Iout, and loss power can be P in the first stagec, can be P in second stage loss powerd, thus,
(i.e. first stage+second stage) total loss power can be P in whole cyclet.Further more, the duty ratio due to two stages begins
Eventually for 50% (i.e. first stage and second stage respectively account for the half of whole cycle), thus total loss power and two stages
Loss power between relationship shown in there are formula 2：
Due to P=I2* R, thus the loss power of first stage and second stage is represented by formula 3 and formula 4：
Pc=Ic 2*(RQ1+RC1+RQ3+RC2) formula 3；
Total loss power of charge pump conversion sub-circuit can be obtained by above-mentioned two formula, as shown in formula 5：
Pass through above formula, you can calculated charge pumps the loss power of conversion sub-circuit.Specifically, due to normal conditions
Under, the conducting resistance of metal-oxide-semiconductor generally can between 2~20m Ω, the capacity cell of more than 10uF at low-frequency range (1MHZ or so)
ESR can between 2~15m Ω, if assume the embodiment of the present invention in RQ1=RQ2=RQ3=RQ4=15m Ω, RC1=RC2=
10m Ω can then calculate the loss power that charge pump conversion sub-circuit is total in the embodiment of the present invention, as shown in formula 6：
Pt=0.025*Ic 2+0.004*Id 2Formula 6；
It is further assumed thatId=Iout(it should be noted that IcAnd IdValue can pass through practical experience
It is worth to, does not repeat herein), thus the total loss power of charge pump conversion sub-circuit can also be represented by formula 7：
Pt≈0.0165*Iout 2Formula 7；
In conclusion the total loss power of charge pump conversion sub-circuit can be determined by output current in the embodiment of the present invention.
For only including a charge pump conversion sub-circuit in charge pump modular converter, such as output is that (i.e. output voltage is 4V/4A
4V, output current 4A), then it can be 0.264W that the total loss power of charge pump modular converter, which can be calculated,.Need what is illustrated
It is, due to transfer efficiencyCharge pump modular converter transfer efficiency can also further thus be calculated (herein may be used
To be depressured transfer efficiency) can beDetails are not described herein again.
As shown in the above, charge pump conversion sub-circuit decompression transfer efficiency can generally achieve in the embodiment of the present invention
More than 98% (as long as selecting rational parameter).
Further, it due to switch element conducting resistance in itself and is not zero, thus, when switch element is connected on circuit
When middle, it will appear pressure drop at the both ends of switch element, this results in charge pump conversion sub-circuit output voltage and not equal to charge
Pump the half (i.e. VOUT ≠ VIN/2) of conversion sub-circuit input voltage.
But for electric current, due in charge pump conversion sub-circuit and there is no can loss current inductance element
(or resistive element), thus charge pump conversion sub-circuit output current can always remain as 2 times of input current, i.e. Iout=2*
Iin.Therefore, the size of output voltage can be determined according to the size of output current, to further determine that the size of input voltage.
That is, power management chip is used in the embodiment of the present invention to load (such as CPU, GPU, MODEM, DRAM)
When being charged, can first determine that the charging voltage and charging current of load, then can according to the charging voltage and
The charging current determines the output voltage and output current of BUCK reduction voltage circuits, and then determines charge pump conversion sub-circuit
Output voltage and output current.So as to ensure that the safety of entire power supply circuit and high efficiency, the embodiment of the present invention pair
This is not limited in any way.
Likewise, it is assumed that the charge pump modular converter in the power management chip may include that M (M >=2) a charge pump turns
Sub-circuit is changed, since each charge pump conversion sub-circuit is parallel with one another, thus the equivalent resistance of entire charge pump modular converter
It can further reduce, and then may be such that the charge pump modular converter exports larger electric current.
Embodiment 7：
Figure 12 implements 7 for the present invention and provides a kind of electric power system structure diagram, and the electric power system includes power supply pipe
It manages chip 22, the power supply unit 21 being connect with 22 input terminal of power management chip and is exported with the power management chip 22
Hold at least one load 13 of connection.
The embodiment of the present invention additionally provides a kind of electronic equipment, and the electronic equipment includes power management chip.
The embodiment of the invention discloses a kind of power management chip, electric power system and electronic equipment, the power management core
Piece includes：BUCK is depressured modular converter and charge pump modular converter；The output terminal of the charge pump modular converter and the BUCK
The input terminal connection of modular converter is depressured, the output terminal of the BUCK decompressions modular converter is connected with corresponding load；The electricity
Lotus pumps modular converter, for the input voltage of power management chip to be carried out first time decompression, and the after being depressured for the first time
One voltage is transferred to the BUCK decompressions modular converter；The BUCK is depressured modular converter, for the first voltage that will be received
It carries out second to be depressured, and the second voltage after second of decompression is exported to corresponding load.Due in the embodiment of the present invention
In, power management chip includes charge pump modular converter and BUCK decompression modular converters, and charge pump modular converter is by power supply pipe
After the input voltage progress first time decompression for managing chip, BUCK decompression modular converters are sent to, since load required voltage is
Determining, because the input voltage of BUCK decompression modular converters reduces, the input of BUCK decompression modular converters, output voltage
Pressure difference reduce, the first transfer efficiency of BUCK decompression modular converters improves, up to 90%, and in charge pump modular converter not
Comprising inductance component, transfer efficiency reaches as high as 98%, because the product of the first transfer efficiency and the second transfer efficiency is more than
85%, so improving the transfer efficiency of power management chip, thermal power loss is reduced, reduces the temperature of power management chip
Degree alleviates the heat condition of terminal, reduces the power consumption of chip, improves the cruising ability of terminal.
For systems/devices embodiment, since it is substantially similar to embodiment of the method, so the comparison of description is simple
Single, the relevent part can refer to the partial explaination of embodiments of method.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Either an operation distinguishes body with another entity or another operation, without necessarily requiring or implying these entities
Or there are any actual relationship or orders between operation.
It should be understood by those skilled in the art that, embodiments herein can be provided as method, system or computer program
Product.Therefore, complete hardware embodiment, complete Application Example or the reality of connected applications and hardware aspect can be used in the application
Apply the form of example.Moreover, the computer for wherein including computer usable program code in one or more can be used in the application
The computer program production that usable storage medium is implemented on (including but not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
The application is with reference to the flow according to the method for the embodiment of the present application, equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that it can be realized by computer program instructions every first-class in flowchart and/or the block diagram
The combination of flow and/or box in journey and/or box and flowchart and/or the block diagram.These computer programs can be provided
The processor of all-purpose computer, special purpose computer, Embedded Processor or other programmable data processing devices is instructed to produce
A raw machine so that the instruction performed by computer or the processor of other programmable data processing devices is generated for real
The device of function specified in present one flow of flow chart or one box of multiple flows and/or block diagram or multiple boxes.
These computer program instructions, which may also be stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that the instruction generation being stored in the computer-readable memory includes referring to
Enable the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one box of block diagram or
The function of being specified in multiple boxes.
These computer program instructions can be also loaded into computer or other programmable data processing devices so that counted
Series of operation steps are performed on calculation machine or other programmable devices to generate computer implemented processing, so as in computer or
The instruction offer performed on other programmable devices is used to implement in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in a box or multiple boxes.
Although the preferred embodiment of the application has been described, those skilled in the art once know basic creation
Property concept, then can make these embodiments other change and modification.So appended claims be intended to be construed to include it is excellent
It selects embodiment and falls into all change and modification of the application range.
Obviously, those skilled in the art can carry out the application essence of the various modification and variations without departing from the application
God and range.In this way, if these modifications and variations of the application belong to the range of the application claim and its equivalent technologies
Within, then the application is also intended to include these modifications and variations.
Claims (10)
1. a kind of power management chip, which is characterized in that the power management chip includes：Charge pump modular converter and BUCK drops
Press modular converter；
The output terminal of the charge pump modular converter is connect with the input terminal of BUCK decompression modular converters, the BUCK decompressions
The output terminal of modular converter is connected with corresponding load；
The charge pump modular converter, for the input voltage of power management chip to be carried out first time decompression, and will for the first time
First voltage after decompression is transferred to the BUCK decompressions modular converter；
The BUCK is depressured modular converter, is depressured for the first voltage received to be carried out second, and will be depressured for second
Second voltage afterwards is exported to corresponding load.
2. power management chip as described in claim 1, which is characterized in that the BUCK decompressions modular converter includes one
BUCK reduction voltage circuits or more than two BUCK reduction voltage circuits in parallel.
3. power management chip as claimed in claim 2, which is characterized in that the charge pump modular converter includes a charge
Pump conversion sub-circuit, the input terminal connection of the output terminal of the charge pump conversion sub-circuit and BUCK reduction voltage circuit or
The output terminal of the charge pump conversion sub-circuit is connect with the input terminal of more than two BUCK reduction voltage circuits in parallel.
4. power management chip as claimed in claim 2, which is characterized in that the charge pump modular converter includes two or more
Charge pump conversion sub-circuit in parallel, when BUCK decompression modular converters include more than two BUCK reduction voltage circuits in parallel
When, wherein, the output terminal of each charge pump conversion sub-circuit is dropped with a BUCK reduction voltage circuit or more than two BUCK in parallel
The input terminal connection of volt circuit.
5. power management chip as claimed in claim 4, which is characterized in that the output terminal point of each charge pump conversion sub-circuit
Input terminal not with the BUCK reduction voltage circuits of all parallel connections is connect.
6. such as claim 3-5 any one of them power management chips, which is characterized in that
For any charge pump conversion sub-circuit, the charge pump conversion sub-circuit includes：First switch, second switch, third
Switch, the 4th switch, the first capacitance and the second capacitance；Wherein：
The output terminal of power supply unit of the input terminal of the first switch with providing input voltage for the power management chip connects
It connects, the first end of the output terminal of the first switch respectively with the input terminal of third switch, first capacitance is connected；
The input terminal of the second switch is connected with the second end of first capacitance and the input terminal of the 4th switch；Institute
The output terminal for stating second switch is connected with the output terminal that the first end of second capacitance and the third switch；
The output terminal of 4th switch is connected with the second end of second capacitance；
Input terminal of the input terminal of the first switch as the charge pump conversion sub-circuit, the output of the second switch
Output of the first end at end, the output terminal of third switch or second capacitance as the charge pump conversion sub-circuit
End.
7. power management chip as claimed in claim 6, which is characterized in that in the block any for the charge pump modulus of conversion
Charge pump conversion sub-circuit, input voltage and input current and the output voltage and output electricity of the charge pump conversion sub-circuit
Relationship between stream is：
Wherein, Vc represents the input voltage of the charge pump conversion sub-circuit；The Ic represents the charge pump conversion sub-circuit
Input current；The Vbat represents the output voltage of the charge pump conversion sub-circuit；The Ibat represents the charge pump
The output current of conversion sub-circuit；The η represents the decompression transfer efficiency of the charge pump conversion sub-circuit；The M is just whole
The number of charge pump conversion sub-circuit that number and the expression charge pump modular converter include.
8. such as claim 1-5 any one of them power management chips, which is characterized in that the load includes following at least one
Kind：
CPU, graphics processor GPU, modem, dynamic random access memory DRAM.
9. a kind of electric power system, which is characterized in that the electric power system includes such as claim 1-8 any one of them power supply pipes
It reason chip, the power supply unit that is connect with the power management chip input terminal and is connect with the power management chip output terminal
At least one load.
10. a kind of electronic equipment, which is characterized in that the electronic equipment includes such as claim 1-8 any one of them power supplys
Managing chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710643161.6A CN108233699A (en) | 2017-07-31 | 2017-07-31 | A kind of power management chip, electric power system and electronic equipment |
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|---|---|---|---|
| CN201710643161.6A CN108233699A (en) | 2017-07-31 | 2017-07-31 | A kind of power management chip, electric power system and electronic equipment |
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| CN108233699A true CN108233699A (en) | 2018-06-29 |
Family
ID=62654158
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| CN109302055A (en) * | 2018-10-31 | 2019-02-01 | 深圳码时创新科技有限公司 | Alternating current turns the power-supply system of direct current |
| CN110299842A (en) * | 2019-07-23 | 2019-10-01 | 东莞保力电子有限公司 | A kind of pressurization afterflow low voltage difference Buck type switching power unit |
| CN112583255A (en) * | 2020-12-18 | 2021-03-30 | 合肥联宝信息技术有限公司 | Power supply device of electronic equipment and electronic equipment |
| CN113541472A (en) * | 2020-04-13 | 2021-10-22 | 中国移动通信集团终端有限公司 | Voltage reduction circuit and power supply chip |
| CN113872417A (en) * | 2020-06-12 | 2021-12-31 | 华为技术有限公司 | DVFS power supply system and DVFS power supply control method |
| CN114498790A (en) * | 2020-10-28 | 2022-05-13 | 苏州能讯高能半导体有限公司 | Mobile device power supply method, mobile device power supply and mobile device |
| CN114498789A (en) * | 2020-10-28 | 2022-05-13 | 苏州能讯高能半导体有限公司 | Mobile device fast charging method and device |
| CN114678915A (en) * | 2020-12-24 | 2022-06-28 | 苏州能讯高能半导体有限公司 | Mobile device power supply method and mobile device power supply |
| CN114825489A (en) * | 2021-01-18 | 2022-07-29 | 苏州能讯高能半导体有限公司 | Mobile device power supply, mobile device and mobile device power supply method |
| CN115134436A (en) * | 2021-03-25 | 2022-09-30 | 北京小米移动软件有限公司 | Power supply units and electronic equipment |
| CN117614088A (en) * | 2024-01-24 | 2024-02-27 | 荣耀终端有限公司 | Power processing circuits, methods and electronic devices |
| CN117707265A (en) * | 2023-06-14 | 2024-03-15 | 荣耀终端有限公司 | Electronic equipment and voltage adjustment chip |
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| CN115134436A (en) * | 2021-03-25 | 2022-09-30 | 北京小米移动软件有限公司 | Power supply units and electronic equipment |
| CN117707265A (en) * | 2023-06-14 | 2024-03-15 | 荣耀终端有限公司 | Electronic equipment and voltage adjustment chip |
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Application publication date: 20180629 |
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| WW01 | Invention patent application withdrawn after publication |