CN108226696A - A kind of chip deck tester - Google Patents

Abstract

The invention discloses a chip holder tester, which comprises: a base (11), a test circuit installed on the base, and a positioning groove (13) installed on the base for placing a chip holder (19) to be tested , a probe group (14) arranged in the positioning groove that can communicate with the chip holder to be tested and the test circuit, a pressure rod (1) that can move up and down and back and forth installed above the positioning groove, and a pressure plate fixed at the bottom of the pressure rod ( 2), the test chip card (16) connected to the test circuit through the wire (17), the test chip card can be inserted into the card holder of the chip to be tested; the present invention can detect whether there is a short circuit between the pins of the SIM and the TF card holder , Welding and open circuit, you only need to observe the LED light during the test to judge whether it is a good product. It has the characteristics of strong versatility, easy operation, high efficiency, and low requirements for the quality of operators.

Description

A chip card holder tester

technical field

The invention relates to electronic product testing equipment, in particular to a device for testing chip card holders.

Background technique

The ID of consumer electronic products is becoming thinner and thinner. Sometimes it is necessary to place the SIM card or TF card not on the motherboard during structural design, but to place it separately, and there will be an independent SIM card and TF card holder. Due to the separated SIM card and TF card holder, there will be a small amount of defective products in the manufacturing process, and the defective phenomenon is mainly manifested as short circuit or open circuit of solder pins. These defective products have no effective inspection methods to ensure the quality during the production process. After the finished products are assembled, they often cause functional defects due to problems with the SIM card or TF card holder, resulting in rework of the finished products, resulting in great waste.

Therefore, it is necessary to provide a test device capable of testing SIM cards and TF card holders, so that SIM cards and TF card holders can be tested before assembly to ensure the quality of product assembly, thereby ensuring the pass-through rate of products and improving production efficiency.

Contents of the invention

The present invention aims to solve the above-mentioned problems of the prior art, and proposes a chip holder tester.

In order to solve the above technical problems, the technical solution proposed by the present invention is to design a chip card holder tester, which includes: a base, a test circuit installed on the base, and a positioning device for placing the chip holder to be tested on the base. Groove, the probe group set in the positioning groove that can communicate with the chip holder to be tested and the test circuit, the pressing rod installed above the positioning groove that can move back and forth up and down, the pressing plate fixed at the bottom of the pressing rod, and the test circuit through the wire A connected test chip card, the test chip card can be inserted into the card holder of the chip to be tested.

The chip holder to be tested has a plurality of metal shrapnels that are arranged inside the holder and can contact the test chip card, and a plurality of PIN pins that extend out of the holder and can be welded on the circuit board, and the metal shrapnel It communicates with the PIN pins in one-to-one correspondence, and the PIN pins can be contacted with the probe set correspondingly.

The test circuit has a DC power supply module, a selector switch, a first LED lamp group, and a second LED lamp group. The selector switch divides the DC power supply in the DC power supply module into the first power supply and the second power supply and selects one to send out. The first and second power supplies are connected to the chip holder to be tested through the wires and the test chip card, the first and second power supplies alternately supply power to the adjacent metal shrapnel, and the first power supply is connected to half of the chip holder to be tested The number of metal shrapnel and PIN pins and the LED lamp beads in the first LED lamp group form multiple loops; the second power supply is connected to the other half of the number of metal shrapnel and PIN feet in the chip holder to be tested and the second LED lamp group. The LED lamp beads are also formed into multiple circuits.

The DC power supply module is a USB power socket.

The chip holder to be tested is a SIM card holder, or a TF card holder, or a combined SIM and TF card holder; the outline structure of the test chip card adopts the outline structure of a SIM card and/or the outline structure of a TF card.

Compared with the prior art, the present invention can detect whether there is a short circuit, virtual soldering or open circuit between the pins of the SIM and TF card holder. During the test, it is only necessary to observe the LED light to judge whether it is a good product, and it has strong versatility and easy operation. , high efficiency, and low requirements on the quality of operators.

Description of drawings

Figure 1 is a schematic diagram of the tester structure;

Figure 2 is a schematic diagram of the circuit connection of the tester;

Figure 3 is a circuit diagram of the test circuit.

Detailed ways

In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

The present invention discloses a chip card holder tester. Referring to the schematic structural diagram of the tester shown in FIG. 19 positioning groove 13, a probe group 14 arranged in the positioning groove that can communicate with the chip holder to be tested and the test circuit, a pressure rod 1 that can move up and down above the positioning groove, and a pressure plate fixed at the bottom of the pressure rod 2. A test chip card 16 connected to the test circuit through wires 17, the test chip card can be inserted into the card holder of the chip to be tested.

During use, first insert the test chip card 16 in the chip holder 19 to be tested, then put the chip holder to be tested in the positioning groove 13, pull down the pressing rod 1, and press the plate 2 on the upper surface of the chip holder to be tested , the chip holder to be tested is electrically connected to the probe set 14, and the test circuit is connected back to the test circuit through the wire 17, the test chip card 16, and the probe set 14 to form a test loop, thereby completing the test.

Referring to the circuit connection schematic diagram shown in Figure 2, the chip holder 19 to be tested has a plurality of metal shrapnels that can contact the test chip card 16 arranged inside the holder, and can be welded on the circuit board outside the holder. There are a plurality of PIN pins on the board, the metal shrapnel is in communication with the PIN pins one by one, and the PIN pins can be contacted with the probe set 14 correspondingly. The test circuit is connected back to the test circuit through the wire 17, the test chip card 16, the metal shrapnel, the PIN pin, and the probe set 14 to form a loop, thereby completing the test.

Fig. 3 has shown the circuit diagram of test circuit, in conjunction with Fig. 1 and Fig. 2, described test circuit has DC power supply module, selector switch 15, the first LED lamp group, the second LED lamp group, described selector switch connects DC power supply module The direct current power supply in is divided into the first power supply VCC1 and the second power supply VCC2 and selects one to send out, and the first and second power supply are connected to the chip holder 19 to be tested by the wire 17 and the test chip card 16, and the first and second power supply The power supply alternately supplies power to the adjacent metal shrapnel, and the first power supply connects half of the metal shrapnel and PIN pins in the chip holder to be tested and the LED lamp beads in the first LED lamp group to form multiple loops; the second power supply Connecting the other half of the number of metal shrapnels and PIN pins in the card holder to be tested and the LED lamp beads in the second LED light group also form multiple loops. There are multiple metal shrapnels in the card holder of the chip to be tested, which are closely arranged adjacent to each other, and the metal shrapnels are connected to corresponding PIN pins through internal circuits. Because the card holder is narrow and the internal circuits are adjacent to each other, it is easy to have short circuit, false soldering and open circuit faults during the production process.

Fig. 3 is the circuit diagram of preferred embodiment, wherein U1 is the test chip card of TF card profile, U2 is the test chip card of SIM card profile, and U3 is the plug of the lead wire 17 of test circuit connection test chip card. When testing, toggle the selector switch (SW1) to select the first power supply, and the first power supply passes through half the number of metal shrapnel, half the number of PIN pins, and the first LED light group to form multiple circuits. When the detected metal shrapnel and PIN pins are in good condition, all the LED beads in the first LED light group will be lit (the LED light beads in the second LED light group will be extinguished), if any point in a certain circuit appears When there is a weak soldering or an open circuit, the corresponding circuit will be disconnected, and the corresponding LED lamp bead will be extinguished; if a circuit is short-circuited with an adjacent circuit, the corresponding LED lamp bead in the second LED lamp group will be lit; In this way, it can be seen intuitively whether the card holder of the chip to be tested is a good product. After detecting the first group of circuits, toggle the selector switch to select the second power supply, and the second power supply passes through the other half of the number of metal shrapnel, the other half of the number of PIN pins, and the second LED light group to form multiple circuits to detect Whether the metal shrapnel and PIN pins on these circuits are good products.

In a preferred embodiment, the DC power supply module is a USB power socket (18), which can introduce 5v DC power from the outside.

The chip holder 19 to be tested is a SIM holder, or a TF holder, or a combined SIM and TF holder. The combined SIM and TF card holder is a card holder that has both a SIM card holder and a TF card holder, and can simultaneously insert a SIM card and a TF card. The outline structure of the test chip card 16 adopts the outline structure of SIM card and/or the outline structure of TF card. According to the test plan of the tester, the tester can be made into a SIM card holder tester, or a TF card holder tester, or a combined SIM and TF card holder tester.

The above examples are illustrative only and not limiting. Any equivalent modification or change made without departing from the spirit and scope of the present application shall be included in the scope of the claims of the present application.

Claims (5)

1. a kind of chip deck tester, it is characterised in that including：Pedestal（11）, test circuit on pedestal, installation On pedestal placing chip deck to be tested（19）Locating slot（13）, be arranged in locating slot connect it is to be tested The probe groups of chip deck and test circuit（14）, the compression bar that can be moved up and down above locating slot（1）, it is fixed Pressing plate in compression bar bottom end（2）, pass through conducting wire（17）The test chip card being connect with test circuit（16）, the test chip card It can be inserted into chip deck to be tested.

2. chip deck tester as described in claim 1, it is characterised in that：The chip deck to be tested（19）With setting The test chip card can be touched inside deck by putting（16）Multiple metal clips and stretch out deck outside it is solderable Multiple PIN foot on circuit boards, the metal clips are connected with PIN foot one-to-one correspondence, the PIN foot and the probe groups （14）It can correspond to and touch.

3. chip deck tester as claimed in claim 2, it is characterised in that：The test circuit has DC power supply mould Block, selecting switch（15）, the first LED light group, the second LED light group, the selecting switch is by the direct current in DC power supplier Source is divided into the first power supply（VCC1）And second source（VCC2）And a submitting is selected, the first and second power supplys pass through the conducting wire（17） With test chip card（16）It is connected to chip deck to be tested（19）On, the first and second power supplys are to the adjacent metal clips It staggeredly powers, the first power supply connects the metal clips of half quantity and PIN foot and the first LED light group in chip deck to be tested In LED lamp bead, form a plurality of circuit；Second source connect in chip deck to be tested the metal clips of the other half quantity and LED lamp bead in PIN foot and the second LED light group, also into a plurality of circuit.

4. chip deck tester as claimed in claim 3, it is characterised in that：The DC power supplier is inserted for USB power source Seat.

5. such as Claims 1-4 any one of them chip deck tester, it is characterised in that：The chip deck to be tested （19）Combine deck with TF for SIM card holder or TF card seat or SIM；The test chip card（16）Contour structures use SIM Card contour structures, and/or TF card contour structures.