CN108203497B - Epoxy resin composition for filling holes in printed wiring board, cured product, and printed wiring board using same - Google Patents
Epoxy resin composition for filling holes in printed wiring board, cured product, and printed wiring board using same Download PDFInfo
- Publication number
- CN108203497B CN108203497B CN201611182316.2A CN201611182316A CN108203497B CN 108203497 B CN108203497 B CN 108203497B CN 201611182316 A CN201611182316 A CN 201611182316A CN 108203497 B CN108203497 B CN 108203497B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- printed wiring
- resin composition
- wiring board
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 89
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 89
- 239000000203 mixture Substances 0.000 title claims abstract description 48
- 238000011049 filling Methods 0.000 title claims abstract description 41
- 239000004593 Epoxy Substances 0.000 claims abstract description 41
- 150000001875 compounds Chemical class 0.000 claims abstract description 40
- -1 boric acid ester compound Chemical class 0.000 claims abstract description 33
- 239000011256 inorganic filler Substances 0.000 claims abstract description 16
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 16
- 239000004327 boric acid Substances 0.000 claims abstract description 11
- 125000000524 functional group Chemical group 0.000 claims abstract description 6
- 238000011156 evaluation Methods 0.000 claims description 21
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 claims description 10
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 5
- 238000009792 diffusion process Methods 0.000 claims 1
- 239000011342 resin composition Substances 0.000 abstract description 41
- 238000005498 polishing Methods 0.000 abstract description 23
- 239000010410 layer Substances 0.000 description 41
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 239000000758 substrate Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 20
- 239000004020 conductor Substances 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 238000007747 plating Methods 0.000 description 13
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 11
- 238000009413 insulation Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 10
- 239000011229 interlayer Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
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- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
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- 239000003208 petroleum Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
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- 150000002460 imidazoles Chemical class 0.000 description 3
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 3
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
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- 238000011161 development Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
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- KPRZOPQOBJRYSW-UHFFFAOYSA-N o-hydroxybenzylamine Natural products NCC1=CC=CC=C1O KPRZOPQOBJRYSW-UHFFFAOYSA-N 0.000 description 2
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- FRCAGVUKJQCWBD-UHFFFAOYSA-L iodine green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(\C=1C=CC(=CC=1)[N+](C)(C)C)=C/1C=C(C)C(=[N+](C)C)C=C\1 FRCAGVUKJQCWBD-UHFFFAOYSA-L 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- JAOPKYRWYXCGOQ-UHFFFAOYSA-N n,n-dimethyl-1-(4-methylphenyl)methanamine Chemical compound CN(C)CC1=CC=C(C)C=C1 JAOPKYRWYXCGOQ-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- LGQXXHMEBUOXRP-UHFFFAOYSA-N tributyl borate Chemical compound CCCCOB(OCCCC)OCCCC LGQXXHMEBUOXRP-UHFFFAOYSA-N 0.000 description 1
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 description 1
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- LTEHWCSSIHAVOQ-UHFFFAOYSA-N tripropyl borate Chemical compound CCCOB(OCCC)OCCC LTEHWCSSIHAVOQ-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/55—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to an epoxy resin composition for filling holes in a printed wiring board, a cured product, and a printed wiring board using the same. The invention provides an epoxy resin composition for filling holes in a printed wiring board, which can reduce the number of times of polishing by suppressing the shape of a resin composition (rib) discharged from a through hole to be wider than the diameter of the through hole compared with the conventional one, and which has excellent adhesion, and a printed wiring board using the same. The epoxy resin composition for filling holes in printed wiring boards is characterized by comprising (A) an epoxy resin having 2 or more functional groups, (B) a monofunctional epoxy compound, (C) a boric acid ester compound and (D) an inorganic filler, wherein the amount of the monofunctional epoxy compound (B) is 5 parts by mass per 100 parts by mass of the epoxy resin having 2 or more functional groups (A)
20 parts by mass.
Description
Technical Field
The present invention relates to an epoxy resin composition for filling holes in a printed wiring board (hereinafter also simply referred to as "resin composition"), a cured product, and a printed wiring board using the same, and more particularly, to an epoxy resin composition for filling holes in a printed wiring board, a cured product, and a printed wiring board using the same, in which the number of times of polishing can be reduced by suppressing the shape of a resin composition (rib) discharged from a hole from becoming wider than the diameter of the hole, and which has excellent adhesion.
Background
In recent years, the pattern of printed wiring boards has been made thinner and the mounting area has been made smaller, and further, in order to cope with the miniaturization and high functionality of devices provided with printed wiring boards, further thinning and shortening of printed wiring boards have been desired. Therefore, the printed circuit board is being developed to a Build-up (Build-up) method in which resin insulation layers are formed on the upper and lower sides of a core substrate to form a necessary conductor circuit, and then resin insulation layers are further formed to form a conductor circuit; and the mounted components are being developed to the area array type of BGA (ball grid array), LGA (land grid array), and the like. Under such circumstances, it is desired to develop a resin composition for filling holes such as through holes and via holes of a printed wiring board, which is excellent in filling properties, polishing properties, cured product properties, and the like.
As a resin composition for filling holes in a printed wiring board, a thermosetting epoxy resin composition is generally widely used because a cured product thereof is excellent in mechanical properties, electrical properties, and chemical properties and also has good adhesion. The process for filling permanent holes in printed wiring boards using such a resin composition generally comprises the following steps: filling the hole of the printed circuit board with an epoxy resin composition; a precuring step of heating the filled composition to precure the composition into a grindable state; polishing and removing a portion of the pre-cured resin composition protruding from the surface of the hole; and a step of further heating the pre-cured resin composition to perform main curing.
In the permanent hole-filling process of the printed wiring board, when the resin composition is filled into a hole portion such as a through hole or a via hole, a void is generated in any case due to entrainment of air or the like. In addition, in the permanent hole filling process of the printed wiring board, there is a problem that cracks are generated at the time of curing the resin composition.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2014-208751
Disclosure of Invention
Problems to be solved by the invention
However, in the epoxy resin composition of patent document 1, the shape of the resin composition discharged from the hole after application is wider than the diameter of the hole, and the resin composition is filled up to a place where filling is not necessary. Further, when the spread of the discharged resin composition is large, the number of times of polishing increases, and the processability is poor. Further, the epoxy resin composition of patent document 1 has a problem that adhesion between copper in the hole and the cured product is not sufficient.
Accordingly, the present invention has been made to solve the above-mentioned problems of the prior art, and a main object of the present invention is to provide an epoxy resin composition for filling holes in a printed wiring board, which can suppress the resin composition (rib) discharged from a hole from having a shape wider than the diameter of the hole, reduce the number of times of polishing, and have excellent adhesion, a cured product, and a printed wiring board using the same.
Means for solving the problems
The present inventors have conducted intensive studies in order to solve the above problems, and as a result, have found that the above problems can be solved by using a monofunctional epoxy compound together with a 2-or more-functional epoxy resin or a borate compound, and have completed the present invention.
That is, the present invention relates to an epoxy resin composition for filling a hole in a printed wiring board, which is used for filling at least one of a recess and a through hole in a printed wiring board, and which contains (a) an epoxy resin having a 2-or more functional group, (B) a monofunctional epoxy compound, (C) a borate compound, and (D) an inorganic filler.
The epoxy resin composition for filling holes in a printed wiring board of the present invention is characterized in that the amount of the monofunctional epoxy compound (B) is such that the monofunctional epoxy compound (B) is contained in an amount of 100 parts by mass of the 2-or more-functional epoxy resin (A)
The epoxy resin composition for filling holes in a printed wiring board of the present invention is characterized in that the compounding ratio of the monofunctional epoxy compound (B) to the boric acid ester compound (C) is 1: 0.04 to 0.12.
The epoxy resin composition for filling holes in a printed wiring board of the present invention is characterized in that the monofunctional epoxy compound (B) is a phenylglycidyl ether type monofunctional epoxy compound.
The epoxy resin composition for filling holes in a printed wiring board of the present invention is characterized in that the inorganic filler (D) is 100 parts by mass of the epoxy resin (A) having a 2-or more functional group
The present invention also relates to a cured product obtained by curing the epoxy resin composition for filling holes in a printed wiring board of the present invention.
The present invention also relates to a printed wiring board having the cured product of the present invention.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, there can be provided an epoxy resin composition for filling holes in a printed wiring board, which can suppress the width of the shape of the resin composition discharged from the hole portion from being wider than the diameter of the hole portion, can reduce the number of times of polishing, and has excellent adhesion, a cured product, and a printed wiring board using the same. In the epoxy resin composition for filling holes in a printed wiring board of the present invention, the use of a monofunctional epoxy compound improves thixotropy, and the shape of the resin composition discharged from the through-hole after filling can be controlled, thereby reducing the number of times of polishing. Conventionally, in order to improve thixotropy, a relatively large amount of a leveling agent such as BYK-R606 is added, and there is a problem that bubbles are likely to be generated. In the present invention, by compounding a monofunctional epoxy compound, bubbles are not generated, thixotropy is improved, and the shape of the resin composition discharged from the through-hole after filling can be controlled. In addition, the composition of the present invention has improved adhesion to copper in the through hole.
Drawings
Fig. 1 is a schematic cross-sectional view showing an example of a part of a process for manufacturing a printed wiring board according to the present invention.
Fig. 2 is a schematic cross-sectional view showing an example of a process after the process of manufacturing the printed wiring board of the present invention shown in fig. 1.
Fig. 3 is a schematic cross-sectional view showing another example of the method for manufacturing a printed wiring board of the present invention.
Fig. 4 is a diagram for explaining the evaluation of the performance concerning the protrusion shape of the present invention.
Description of the symbols
1 substrate
2 copper foil
3 through hole
4 coating film
5 resin composition
6 resist layer
7 conductor circuit layer
8 interlayer resin insulation layer
9 opening
10 plating resist
11 via hole
12 bonding pad
13 solder resist layer
14 solder bump
15 length of bottom edge of cured product in protrusion shape
Diameter length of 16 through holes
Detailed Description
Embodiments of the present invention will be described in detail below.
The epoxy resin composition of the present invention comprises (A) an epoxy resin having 2 or more functional groups, (B) a monofunctional epoxy compound, (C) a boric acid ester compound, and (D) an inorganic filler.
< epoxy resin having 2 or more functions >
The epoxy resin composition having 2 or more functions of the present invention may use a known epoxy resin having 2 or more functions. Examples thereof include bisphenol a type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol a type epoxy resin, brominated bisphenol a type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol a novolac type epoxy resin, biphenyl type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, phosphorus-containing epoxy resin, anthracene type epoxy resin, norbornene type epoxy resin, adamantane type epoxy resin, fluorene type epoxy resin, aminophenol type epoxy resin, aminomethylphenol type epoxy resin, alkylphenol type epoxy resin and the like.
The resin composition of the present invention is preferably solvent-free and thus suitably contains a liquid 2-functional or higher epoxy resin. In view of this, in the resin composition of the present invention, at least one of a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, an aminophenol type epoxy resin, and a phenol novolac type epoxy resin can be suitably used as the 2-or higher-functional epoxy resin. In the resin composition of the present invention, these (a) 2-functional or higher epoxy resins may be used alone or in combination of 2 or more. In the case of using a solid epoxy resin instead of a liquid epoxy resin, a monofunctional epoxy compound, a borate compound, and an inorganic filler, which will be described later, may be dispersed in the solid epoxy resin using a solvent.
Examples of commercially available products of (a) 2-or more functional epoxy resins include: 840 manufactured by DIC corporation, 828 manufactured by mitsubishi chemical corporation, YD127 manufactured by shin iron seiko chemical corporation as a bisphenol a type liquid epoxy resin; 830 manufactured by DIC corporation as a bisphenol F type liquid epoxy resin, 807 manufactured by mitsubishi chemical corporation, YD170 manufactured by shinkanji chemical corporation; JeR-630 manufactured by Mitsubishi chemical corporation, and ELM-100 manufactured by Sumitomo chemical corporation, which are aminophenol type liquid epoxy resins (p-aminophenol type liquid epoxy resins), and the like.
< B) monofunctional epoxy Compound >
(B) The monofunctional epoxy compound controls the shape of a cured product of the resin composition discharged from the hole after curing, and can suppress the cured product from being wider than the diameter of the hole. This reduces the number of times of polishing. Further, by using (B) a monofunctional epoxy compound and (C) a boric acid ester compound in combination, the adhesion between copper in the via and the cured product can be improved.
In the epoxy resin composition of the present invention, a known monofunctional epoxy compound can be used. Examples of the monofunctional epoxy compound (B) of the present invention include alkyl monoglycidyl ether, alkenyl monoglycidyl ether, and phenyl monoglycidyl ether having an aromatic ring having a substituent having 1 or more carbon atoms, and examples of commercially available products include Denacol EX-141 (manufactured by Nagase ChemteX Co., Ltd.), ED-509S, ED-509E, ED-529 (both manufactured by ADEKA Co., Ltd.), and the like.
Among them, a phenyl glycidyl ether type monofunctional epoxy compound is preferable in terms of controlling the shape of the resin composition discharged from the hole. The use of a phenylglycidyl ether type monofunctional epoxy compound is preferable because the shape of a cured product can be easily controlled. The phenyl glycidyl ether type monofunctional epoxy compound may have a phenyl glycidyl ether skeleton, and examples thereof include ED-509E, ED-529 and EX-141 available from ADEKA. In the resin composition of the present invention, the monofunctional epoxy compound (B) may be used alone or in combination of 2 or more.
The phenyl glycidyl ether type monofunctional epoxy compound is preferably 60% by mass or more, more preferably 80% by mass, and particularly preferably 100% by mass of the total amount of the monofunctional epoxy compounds (B).
In the resin composition of the present invention, the amount of the monofunctional epoxy compound (B) added is preferably such that the monofunctional epoxy compound (B) is added to 100 parts by mass of the 2-or more-functional epoxy resin (A)Is selected as
When the amount of the monofunctional epoxy compound (B) added is 5 to 20 parts by mass, the balance among the diffusibility of the projection shape, the heat resistance, and the crack resistance is further excellent.
[ boric acid ester Compound (C) >
In the epoxy resin composition of the present invention, a known borate ester compound can be used. For example, triphenyl borate or cyclic borate having low volatility can be given. Cyclic borate ester compounds are preferred. The cyclic borate ester compound is a compound containing boron in a cyclic structure, and 2,2 '-oxybis (5, 5' -dimethyl-1, 3, 2-oxapentaborane) is particularly preferable. Examples of the borate ester compound include triphenyl borate and cyclic borate ester compounds, as well as trimethyl borate, triethyl borate, tripropyl borate, tributyl borate, and the like, and these borate ester compounds are highly volatile, and therefore the effect thereof may be insufficient particularly in the storage stability of the composition at high temperatures. In the resin composition of the present invention, these borate ester compounds may be used alone or in combination of 2 or more.
Examples of commercially available products of the borate ester compound (C) include HIBORON BC1, HIBORON BC2, HIBORON BC3, HIBORON BCN (all of them are manufactured by bone International, Inc.), CURREDUCT L-07N (manufactured by Kabushiki Kaisha), and the like.
In the resin composition of the present invention, the compounding ratio of the monofunctional epoxy compound (B) to the boric acid ester compound (C) is preferably set to be within the range of
< inorganic Filler >
In the epoxy resin composition of the present invention, a known inorganic filler used in a general resin composition can be used. Specific examples thereof include non-metal fillers such as silica, barium sulfate, calcium carbonate, silicon nitride, aluminum nitride, boron nitride, alumina, magnesium oxide, aluminum hydroxide, magnesium hydroxide, titanium dioxide, mica, talc, Nojenberg silica, and organobentonite; copper, gold, silver, palladium, silicon and other metal fillers. In the resin composition of the present invention, these inorganic fillers may be used alone or in combination of 2 or more.
Among these, silica and calcium carbonate having low hygroscopicity and excellent low volume expansibility are suitable. The silica may be amorphous or crystalline, or may be a mixture of these. Amorphous (fused) silica is particularly preferred. The calcium carbonate may be either natural ground calcium carbonate or synthetic precipitated calcium carbonate. In the case where the resin composition of the present invention is used as a hole-filling filler for a printed wiring board, calcium carbonate having excellent grindability is suitable.
Examples of the shape of such an inorganic filler include a spherical shape, a needle shape, a plate shape, a scaly shape, a hollow shape, an amorphous shape, a hexagonal shape, a cubic shape, a flake shape, and the like, and a spherical shape is preferable from the viewpoint of high filling of the inorganic filler.
Further, the average particle diameter of these inorganic fillers is preferably
When the average particle diameter is 0.1 μm or more, the specific surface area is small, the filler can be dispersed well by the effect of the aggregation action of the fillers, and the filler loading amount is easily increased. On the other hand, when the average particle diameter is 25 μm or less, the resin composition of the present invention has an effect that, when used as a hole-filling filler for a printed wiring board, the filling property in the hole of the printed wiring board is good, and the smoothness is good when a conductor layer is formed in the hole-filled portion. More preferably
Here, the average particle diameter refers to an average primary particle diameter. The average particle diameter (D50) can be measured by a laser diffraction/scattering method.
In the resin composition of the present invention, the content of the (D) inorganic filler is preferably 90 to 200 parts by mass, more preferably 110 to 200 parts by mass, per 100 parts by mass of the (a) 2-or higher-functional epoxy resin. When the content of the inorganic filler (D) is 90 parts by mass or more, the obtained cured product exhibits sufficiently low expansibility, and exhibits polishing property and adhesion. On the other hand, when the amount is 200 parts by mass or less, liquid pasting is likely to occur, and printability, hole-filling property, and the like can be obtained.
(curing catalyst)
The resin composition of the present invention preferably contains a curing catalyst. The curing catalyst is not particularly limited as long as it promotes the curing reaction of the epoxy resin, and a known and conventional curing catalyst can be used.
Examples of the curing catalyst include imidazole derivatives such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-1-benzyl-1H-imidazole, 2-phenylimidazole, 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1- (2-cyanoethyl) -2-ethyl-4-methylimidazole; imidazole derivatives having a triazine structure such as 2, 4-diamino-6- [2' -methylimidazolyl- (1') ] -ethyl-s-triazine, 2, 4-diamino-6- [2' -undecylimidazolyl- (1') ] -ethyl-s-triazine, and 2, 4-diamino-6- [2' -ethyl-4 ' -methylimidazolyl- (1') ] -ethyl-s-triazine; isocyanurates of imidazole derivatives such as 2, 4-diamino-6- [2 '-methylimidazolyl- (1') ] -ethyl-s-triazine isocyanuric acid adduct and 2-phenylimidazole isocyanuric acid adduct; imidazole methylol bases such as 2-phenyl-4, 5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole; amine compounds such as dicyandiamide, benzyldimethylamine, 4- (dimethylamino) -N, N-dimethylbenzylamine, 4-methoxy-N, N-dimethylbenzylamine, and 4-methyl-N, N-dimethylbenzylamine; hydrazine compounds such as adipic acid dihydrazide and sebacic acid dihydrazide; phosphorus compounds such as triphenylphosphine; triazine derivatives such as guanamine, 2, 4-diamino-6-methyl-1, 3, 5-triazine, benzoguanamine, melamine, 2, 4-diamino-6-methacryloyloxyethyl-s-triazine, 2-vinyl-2, 4-diamino-s-triazine, 2-vinyl-4, 6-diamino-s-triazine-isocyanuric acid adduct, and 2, 4-diamino-6-methacryloyloxyethyl-s-triazine-isocyanuric acid adduct.
Examples of commercially available products include 1B2PZ, 2E4MZ, 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ and 2P4MHZ (all trade names of imidazole compounds) manufactured by Sizhou chemical industry Co., Ltd, U-CAT (registered trademark) 3503N, U-CAT3502T (all trade names of blocked isocyanate compounds of dimethylamine) manufactured by San-Apro Co., Ltd, DBU, DBN, U-CATA AC 102 and U-CAT5002 (all bicyclic amidine compounds and salts thereof). These curing catalysts may be used alone or in combination of 2 or more.
< others >
The epoxy resin composition of the present invention comprises (a) an epoxy resin having 2 or more functions, (B) a monofunctional epoxy compound, (C) a boric acid ester compound and (D) an inorganic filler, and if necessary, other known additives may be added. For example, one may add: known and conventional colorants such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium dioxide, carbon black, and naphthalene black; amine-based catalysts as curing agents; known and conventional thermal polymerization inhibitors for imparting storage stability during storage, such as hydroquinone, hydroquinone monomethyl ether, t-butylcatechol, pyrogallol, and phenothiazine; known and conventional thickeners or thixotropic agents such as clay, kaolin, organobentonite and montmorillonite; silicone-based, fluorine-based, polymer-based defoaming agents and/or leveling agents; and known and conventional additives such as adhesiveness imparting agents including imidazole-based, thiazole-based, triazole-based and silane coupling agents.
In the resin composition of the present invention, (a) the 2-or more functional epoxy resin is preferably a liquid, and as described above, a solid epoxy resin may be dissolved in a solvent and used. In this case, as the solvent, ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like can be used. Specific examples thereof include: ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; esters such as ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol butyl ether acetate, methyl lactate, ethyl lactate, and butyl lactate; alcohols such as ethanol, propanol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha. These solvents may be used alone or in combination of 2 or more. The amount of the solvent to be mixed may be determined as appropriate depending on workability and the like within a range where the desired effect of the present invention is obtained.
The resin composition of the present invention can be easily filled into a hole portion such as a via hole or a through hole of a printed wiring board by a conventionally employed method, for example, a screen printing method, a roll coating method, a die coating method, or the like. Next, for example, at about
Heating the mixture
And curing the epoxy resin composition. Since the epoxy resin composition thus cured has a small number of unnecessary portions discharged from the holes, it can be easily removed by physical polishing with a small number of times of polishing, and a flat surface can be formed. The physical polishing can be performed by a conventionally known method.
Next, the printed wiring board of the present invention will be explained.
The printed wiring board of the present invention is obtained using the resin composition of the present invention. Reference is now made to
The method for manufacturing a printed wiring board of the present invention will be described in detail.
< formation of Via >
Fig. 1 is a schematic cross-sectional view showing an example of a part of a process for manufacturing a printed wiring board according to the present invention. First, as shown in fig. 1(a), a through hole is formed in a substrate 1 on which a copper foil 2 is laminated by a drill, and a wall surface of the through hole and a surface of the copper foil are subjected to electroless plating to form a through hole 3. As the substrate 1, a resin substrate such as a glass epoxy substrate, a polyimide substrate, a bismaleimide-triazine resin substrate, or a fluororesin substrate, or a copper clad laminate, a ceramic substrate, a metal substrate, or the like of these resin substrates can be used. In the case of a substrate having poor leveling property (つきまわり) in such a fluororesin substrate, surface modification such as a pretreatment agent comprising organic sodium metal and plasma treatment is performed. Next, electrolytic plating is performed to increase the thickness, and a plating film 4a is formed on the surface of the substrate 1 and the inner wall of the through-hole 3 as shown in fig. 1 (b). As the electrolytic plating, copper plating is preferable.
< filling of holes >
The through-hole 3 formed in the substrate 1 is filled with the resin composition 5 of the present invention as shown in fig. 1 (c). Specifically, a mask having an opening is placed on the substrate 1 in the through-hole 3, and the through-hole 3 can be easily filled by coating by a printing method or the like, a screen printing method, or the like. Next, the resin composition 5 was added to the mixture
Heating the mixture
And left and right, and then, as shown in fig. 1(d), unnecessary portions of the resin composition 5 which have overflowed from the through-hole 3 are removed by polishing, and planarization is performed. The grinding may be performed by a belt sander, a polishing grinder, or the like.
< formation of conductor Circuit layer >
On the surface of the substrate 1 in which the hole of the through-hole 3 is filled, a plating film 4b is formed as shown in fig. 1 (e). Thereafter, as shown in FIG. 1(f), a resist layer 6 is formed, and the resist non-formation portion is etched. Next, the resist layer 6 is peeled off, and the conductor circuit layer 7a is formed as shown in fig. 1 (g).
< formation of interlayer resin insulation layer >
Fig. 2 is a schematic cross-sectional view showing an example of a process after the process of manufacturing the printed wiring board of the present invention shown in fig. 1. An interlayer resin insulating layer 8a is formed on the conductor circuit layer 7 a. As the interlayer resin insulation layer 8a, a thermosetting resin, a photocurable resin, a thermoplastic resin, a composite or a mixture of these resins, a resin-impregnated glass cloth composite, or an adhesive for electroless plating can be used.
< formation of Via hole >
Next, as shown in fig. 2(a), an opening 9a is provided in the interlayer resin insulation layer 8 a. The perforation of the opening 9a is performed by exposure and development treatment when the interlayer resin insulating layer 8a is made of a photosensitive resin, and by laser light when it is made of a thermosetting resin or a thermoplastic resin. In the case where the opening 9a is provided by laser light, desmearing treatment may be performed.
Next, as shown in fig. 2(b), a plating film 4c is formed on the entire surface. Then, as shown in fig. 2(c), a plating resist layer 10 is formed on the plating film 4 c. The plating resist layer 10 is formed by laminating a photosensitive dry film and performing exposure and development processing. Further, electroplating is performed to increase the thickness of the conductor circuit portion, as shown in FIG. 2(c), to form a plated film 4 d.
Next, after the plating resist layer 10 is peeled off, the electroless plating film 4c under the plating resist layer 10 is dissolved and removed by etching, and as shown in fig. 2(d), an independent conductor circuit (including the via hole 11a) is formed.
Fig. 3 is a schematic cross-sectional view showing another example of the method for manufacturing a printed wiring board of the present invention. After the core substrate fabrication process shown in fig. 1(d) is completed, when the conductor layers on both surfaces of the core substrate 1 are etched in a predetermined pattern, as shown in fig. 3(a), the 1 st conductor circuit layer 7b having a predetermined pattern is formed on both surfaces of the substrate 1, and the pad 12 is formed at the same time in a part of the conductor circuit layer 7b connected to the through hole 3.
Next, as shown in fig. 3(b), interlayer resin insulation layers 8b are formed on both the upper and lower surfaces of the substrate 1. Further, as shown in fig. 3(c), a via hole 11b is formed in the resin insulation layer 8b located immediately above the pad 12. Next, plating layers are formed in the via hole 11b and on the interlayer resin insulation 8b layer by copper plating, and etching is performed after forming a resist layer thereon. Thereby, as shown in fig. 3(c), the 2 nd conductor circuit layer 7c is formed on the interlayer resin insulation layer 8 b. The 1 st and 2 nd conductor circuit layers 7b and 7c are electrically connected to each other through the via hole 11b, and the conductor circuit layers 7b on both surfaces of the substrate are also electrically connected to each other through the through hole 3.
As shown in fig. 3(c), a solder resist layer 13 is formed on each of the resin insulation layer 8b and the 2 nd conductor circuit layer 7c, and a solder bump 14 that penetrates the solder resist layer 13 and rises from the surface of the conductor circuit layer is formed on the upper solder resist layer 13. Further, the surface of the conductor circuit layer 7c exposed from the opening 9b formed between the solder resist layers 13 below is plated with Au and Ni to obtain a multilayer wiring board used as a connection terminal.
Examples
The present invention will be specifically described below by way of examples and comparative examples, but the present invention is not limited to the following examples. Hereinafter, "part" and "%" are based on mass unless otherwise specified.
The epoxy resin compositions were prepared by compounding the components shown in Table 1 at the ratios (parts by mass) shown in Table 1. Next, each resin composition was filled into through holes of a glass epoxy substrate (thickness 1.6mm, diameter 0.5mm) having through holes formed in advance by a plate plating method by a screen printing method. The sample was placed in a hot air circulation type drying furnace and kept at 150 ℃ for 30 minutes to prepare an evaluation sample. The heat resistance, crack resistance, protrusion shape, adhesion, and polishing properties of each of the obtained evaluation samples were evaluated by the following methods. The obtained results are shown in table 1.
< evaluation of Properties >
< Heat resistance >
For each evaluation sample, physical grinding was performed by a resin grinding uniaxial polishing corresponding to #320 using a grinder. Thereafter, the evaluation sample was cut, polished with a grinder corresponding to #600, and then polished with a resin corresponding to #1000, and the evaluation sample was immersed in a solder liquid at 288 ℃.
O: under the conditions of 288 ℃ X30 seconds X3 times or more, the cured product and the through hole were not dissociated.
X: the cured product and the through-hole were dissociated under the conditions of 288 ℃ X30 seconds X3 times.
< cracks >
For each evaluation sample, physical grinding was performed by a resin grinding uniaxial polishing corresponding to #320 using a grinder. Thereafter, the evaluation sample was cut, polished with a grinder corresponding to #600, and then polished with a resin corresponding to #1000, and the evaluation sample was immersed in a solder liquid at 288 ℃.
O: the cured product in the through-hole was free from cracks under the conditions of 288 ℃ X30 seconds X5 times or more.
And (delta): the cured product in the through-hole did not crack under the conditions of 288 ℃ x 30 seconds x 3 times or more and less than 5 times, but cracks occurred at5 times or more.
X: the cured product in the through-hole did not crack under the conditions of 288 ℃ X30 seconds X less than 3 times, but cracks occurred at3 times or more.
< shape of projection >
In each evaluation sample, as shown in fig. 4, the shape of the cured product discharged from the through-hole was confirmed and evaluated. Here, the evaluation of the diffusibility indicates a value obtained by dividing the length 15 of the bottom side of the cured product of the protrusion shape after filling the through hole by the diameter length 16 of the through hole.
O: the diffusivity evaluation value is less than 2.0 relative to the through hole inner hole of 0.5 mm.
And (delta): the diffusivity evaluation value is 2.0 or more and less than 2.5 relative to the through hole inner hole of 0.5 mm.
X: the diffusivity evaluation value is 2.0 or more and less than 3.0 relative to the through hole inner hole of 0.5 mm.
< adhesion to copper in through hole >
In each evaluation sample, adhesion to copper in the through hole was evaluated according to the following evaluation criteria.
O: there is no dissociation between the copper in the via and the cured material.
X: the copper in the through hole is dissociated from the cured material.
< defoaming Property in through-hole >
In each evaluation sample, whether or not air bubbles were present in the cured product of the through-hole was confirmed according to the following evaluation criteria.
O: no air bubble is in the condensate in the through hole.
X: the solidified material in the through hole contains air bubbles.
< abrasiveness >
For the evaluation samples, physical polishing was carried out using a grinder by a polishing uniaxial shaft for resin polishing corresponding to #320, and the number of passes until the resin was completely removed at this time was compared.
O: 2 times or less
X: 3 times or more
From the results shown in table 1, it is clear that the epoxy resin compositions of examples 1 to 7 can control the shape of the cured product after curing, and that the occurrence of cracks is small, and the heat resistance and the adhesion to copper are excellent. Further, the shape of the cured product is controlled, thereby improving the polishing properties. Further, the defoaming property in the through hole is also good.
On the other hand, in comparative example 1, since the monofunctional epoxy compound (B) was not used, the projection shape of the cured product discharged from the through hole was large, the polishing property was poor, and the adhesion to copper was poor. In comparative examples 2 and 3, the (C) boric acid ester compound was not used, and thus the adhesion to copper was poor. In comparative example 3, since the amount of the leveling agent added was large, the defoaming property was poor.
Claims (7)
1. An epoxy resin composition for filling holes in a printed wiring board, which is used for filling through holes in a printed wiring board,
which comprises (A) a liquid epoxy resin having 2 or more functions, (B) a monofunctional epoxy compound, (C) a boric acid ester compound and (D) an inorganic filler,
a diffusion evaluation value obtained by dividing the length of the bottom side of the cured product in the protrusion shape after filling the through hole by the diameter of the through hole is less than 2.0,
the monofunctional epoxy compound (B) contains a phenyl glycidyl ether type monofunctional epoxy compound,
the content of the phenyl glycidyl ether type monofunctional epoxy compound in the total amount of the (B) monofunctional epoxy compounds is 60% by mass or more,
the epoxy resin composition for filling holes in a printed circuit board is solvent-free.
2. The epoxy resin composition for filling holes in a printed wiring board according to claim 1, wherein the amount of the monofunctional epoxy compound (B) is 5 to 20 parts by mass per 100 parts by mass of the 2-or more-functional epoxy resin (A).
3. The epoxy resin composition for filling holes in a printed wiring board according to claim 1 or 2, wherein the compounding ratio of the (B) monofunctional epoxy compound to the (C) boric acid ester compound is 1: 0.04 to 0.12.
4. The epoxy resin composition for filling holes in printed wiring boards according to claim 1 or 2, wherein the monofunctional epoxy compound (B) is a phenylglycidyl ether type monofunctional epoxy compound.
5. The epoxy resin composition for filling holes in a printed wiring board according to claim 1 or 2, wherein the inorganic filler (D) is 90 to 200 parts by mass based on 100 parts by mass of the epoxy resin (A) having a 2-or more functional group.
6. A cured product obtained by curing the epoxy resin composition for filling holes in a printed wiring board according to any one of claims 1 to 5.
7. A printed wiring board comprising the cured product according to claim 6.
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| CN201611182316.2A CN108203497B (en) | 2016-12-20 | 2016-12-20 | Epoxy resin composition for filling holes in printed wiring board, cured product, and printed wiring board using same |
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| CN101575439A (en) * | 2008-05-07 | 2009-11-11 | 太阳油墨制造株式会社 | Porefilling heat curing resin composition |
| CN104072947A (en) * | 2013-03-26 | 2014-10-01 | 太阳油墨制造株式会社 | Epoxy resin composition, composition for filling in hole plugging, and printed wiring board using same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101575439A (en) * | 2008-05-07 | 2009-11-11 | 太阳油墨制造株式会社 | Porefilling heat curing resin composition |
| CN104072947A (en) * | 2013-03-26 | 2014-10-01 | 太阳油墨制造株式会社 | Epoxy resin composition, composition for filling in hole plugging, and printed wiring board using same |
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