CN108200728A - A kind of secondary dry film engraving method of PCB isolation patterns - Google Patents
A kind of secondary dry film engraving method of PCB isolation patterns Download PDFInfo
- Publication number
- CN108200728A CN108200728A CN201810030437.8A CN201810030437A CN108200728A CN 108200728 A CN108200728 A CN 108200728A CN 201810030437 A CN201810030437 A CN 201810030437A CN 108200728 A CN108200728 A CN 108200728A
- Authority
- CN
- China
- Prior art keywords
- dry film
- pcb
- etching
- press mold
- engraving method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000002955 isolation Methods 0.000 title claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 238000012546 transfer Methods 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims description 11
- 238000011161 development Methods 0.000 claims description 10
- 239000003513 alkali Substances 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 6
- 238000013461 design Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 2
- 230000018109 developmental process Effects 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 230000036301 sexual development Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to PCB processing technique fields, disclose a kind of secondary dry film engraving method of PCB isolation patterns, include the following steps：A. pattern transfer；B. graphic plating；C. Etching；D. second of pattern transfer；E. it etches for second.This method is suitable for the secondary dry film engraving method with partial isolated graphic designs, copper thickness 2OZ 3OZ PCB, greatly reduces production fraction defective, at low cost, efficient, is suitble to large-scale promotion.
Description
Technical field
The present invention relates to PCB processing technique fields, and in particular to a kind of secondary dry film engraving method of PCB isolation patterns.
Background technology
With the sexual development vdiverse in function of electronic product, PCB carrying performance it is also more and more, as PCB on RF lines design,
Local plug-in unit signal transmission, local high voltage design etc., this type design requirement PCB parts or whole face figure isolate（It is lonely
Vertical graphic designs refer to spacious area's cloth two-wire, double PAD, diplopore or other special-shaped figures, are protected between figure without enough spacing
Card compensation）.Because figure is unevenly distributed, the different zones current density in graphic plating is caused to be difficult to unanimously, etched figure is uniform
Property, the control such as figure tolerance it is difficult, it is bad to even result in the qualities such as folder film, the small, speaker hole in hole.
In order to improve the problem of isolation pattern plating is difficult, electroplating efficiency is promoted, improves the PCB electroplates of isolation pattern design
Matter, the special item for setting up " PCB isolation patterns engraving method " are imperative.
The traditional handicraft in combined circuit board field, by the way that PCB isolation patterns are designed classification adjustment compensating parameter, optimization is each
The flow production method of kind design, reaching reduces time cost, quality cost, keeps production smooth, controls the mesh of product yield
, so as to improve enterprise profit and promote company's synthesized competitiveness, capture and expand occupation rate of market.
Invention content
The technical problems to be solved by the invention are to provide a kind of suitable for partial isolated graphic designs, copper thickness
The secondary dry film engraving method of the PCB of 2OZ-3OZ, and copper thickness is bigger, then it is bigger that finished product copper thickness is electroplated（Parcel plating hole copper is thick
Degree is bigger）, cause etch differential bigger, in order to maintain production quality, it is necessary to be improved to technique and parameter.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of secondary dry film engraving method of PCB isolation patterns, includes the following steps：
A. pattern transfer；Last layer photosensitive film layer will be sticked or applied on processed copper face, under ultraviolet light, by the film
On line pattern be transferred on copper face, form a kind of mask pattern against corrosion, the unwanted copper foil of those non-envelopes protections,
It will be etched in subsequent etch process, take off etchant resist again after overetch to get to required naked copper circuitous pattern.
B. graphic plating；
C. Etching；
D. second of pattern transfer；
E. it etches for second；
Wherein, the step c includes alkali etching, and non-orphaned graph area, which is fully etched, does not stay residual copper；
The Step d includes the following steps：Paste one layer of dry film：Thickness of dry film 25-35um；First time pressing mold：Press mold speed 2.0
110 ± 5 DEG C of ± 0.5m/min, press mold temperature；Paste one layer of dry film：Thickness of dry film 25-35um；Second of pressing mold：Press mold speed 1.8
± 0.5m/min, 100 ± 5 DEG C of press mold temperature；Exposure：The unilateral compensation 1.2-1.5mil of isolation pattern windowing（Windowing, which then refers to, to be needed
The place welded or radiated is exposed outside green oil layer or solder mask copper foil）, non-orphaned graph area do not open a window, 6 lattice of exposure guide rule
It is full, table top vacuum -300 to -370mmHg；Development：Development point control 55 ± 5%.
The step e is acid etching, and parameter is 1.8 ± 0.2Kg/cm2 of etching pressure, etches number 1 time.
Compensation:PCB in transport, place, in production process because humiture, machine, it is artificial, etc. various factors cause
PCB harmomegathus itself.In the case, if not modifiers（Drilling, the film, web plate etc.）Harmomegathus value（That is offset）, it is real
Border tool data inherently has deviation with PCB, and the PCB produced does not meet actual demand.So need using offset, it is most
It is possible that PCB is allowed to meet practical application request.
The present invention has the advantages that：
First time pattern transfer+graphic plating is normally completed, the graph area etching of alkali etching control non-orphaned is clean, isolation pattern
Area carries out second of pattern transfer+acid etching by way of pressing dry film twice again, and remaining base copper is etched away.It is it is preferred that raw
Parameter is produced, prevents excessively to etch in alkali etching and the problems such as tin is subside, line width surpasses tolerance, etching factor is not up to standard occurs,
In the case of copper thickness 2OZ-3OZ, ensure that product meets Customer design, while ensures product quality requirement, improve product yield.
Specific embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
Embodiment 1
A kind of secondary dry film engraving method of PCB isolation patterns, includes the following steps：
A. pattern transfer；
B. graphic plating；
C. Etching；
D. second of pattern transfer；
E. it etches for second；
Wherein, the step c includes alkali etching, and non-orphaned graph area, which is fully etched, does not stay residual copper；
The Step d includes the following steps：Paste one layer of dry film：Thickness of dry film 30um；First time pressing mold：Press mold speed 2.0 ±
110 ± 5 DEG C of 0.5m/min, press mold temperature；Paste one layer of dry film：Thickness of dry film 30um；Second of pressing mold：Press mold speed 1.8 ±
0.5m/min, 100 ± 5 DEG C of press mold temperature；Exposure：The unilateral compensation 1.2mil of isolation pattern windowing（Windowing, which then refers to, to be needed to weld
Or the place of heat dissipation is exposed outside green oil layer or solder mask copper foil）, non-orphaned graph area do not open a window, and 6 lattice of exposure guide rule are expired, table top
Vacuum -340mmHg；Development：Development point control 55 ± 5%.
The step e is acid etching, and parameter is 1.8 ± 0.2Kg/cm2 of etching pressure, etches number 1 time.
By applying this engraving method, the qualities fraction defectives such as folder film, the small, speaker hole in hole reduce about 90%, promote production effect
Rate improves product and reaches friendship rate.
Embodiment 2
A kind of secondary dry film engraving method of PCB isolation patterns, includes the following steps：
A. pattern transfer；
B. graphic plating；
C. Etching；
D. second of pattern transfer；
E. it etches for second；
Wherein, the step c includes alkali etching, and non-orphaned graph area, which is fully etched, does not stay residual copper；
The Step d includes the following steps：Paste one layer of dry film：Thickness of dry film 35um；First time pressing mold：Press mold speed 2.0 ±
110 ± 5 DEG C of 0.5m/min, press mold temperature；Paste one layer of dry film：Thickness of dry film 25um；Second of pressing mold：Press mold speed 1.8 ±
0.5m/min, 100 ± 5 DEG C of press mold temperature；Exposure：The unilateral compensation 1.3mil of isolation pattern windowing（Windowing, which then refers to, to be needed to weld
Or the place of heat dissipation is exposed outside green oil layer or solder mask copper foil）, non-orphaned graph area do not open a window, and 6 lattice of exposure guide rule are expired, table top
Vacuum -300mmHg；Development：Development point control 55 ± 5%.
The step e is acid etching, and parameter is 1.8 ± 0.2Kg/cm2 of etching pressure, etches number 1 time.
By applying this engraving method, the qualities fraction defectives such as folder film, the small, speaker hole in hole reduce about 90%, promote production effect
Rate improves product and reaches friendship rate.
Embodiment 3
A kind of secondary dry film engraving method of PCB isolation patterns, includes the following steps：
A. pattern transfer；
B. graphic plating；
C. Etching；
D. second of pattern transfer；
E. it etches for second；
Wherein, the step c includes alkali etching, and non-orphaned graph area, which is fully etched, does not stay residual copper；
The Step d includes the following steps：Paste one layer of dry film：Thickness of dry film 31um；First time pressing mold：Press mold speed 2.0 ±
110 ± 5 DEG C of 0.5m/min, press mold temperature；Paste one layer of dry film：Thickness of dry film 30um；Second of pressing mold：Press mold speed 1.8 ±
0.5m/min, 100 ± 5 DEG C of press mold temperature；Exposure：The unilateral compensation 1.5mil of isolation pattern windowing（Windowing, which then refers to, to be needed to weld
Or the place of heat dissipation is exposed outside green oil layer or solder mask copper foil）, non-orphaned graph area do not open a window, and 6 lattice of exposure guide rule are expired, table top
Vacuum -370mmHg；Development：Development point control 55 ± 5%.
The step e is acid etching, and parameter is 1.8 ± 0.2Kg/cm2 of etching pressure, etches number 1 time.Pass through application
This engraving method, the qualities fraction defectives such as folder film, the small, speaker hole in hole reduce about 90%, and improving production efficiency improves product and reaches friendship rate.
Claims (1)
1. a kind of secondary dry film engraving method of PCB isolation patterns, which is characterized in that include the following steps：
A. pattern transfer；
B. graphic plating；
C. Etching；
D. second of pattern transfer；
E. it etches for second；
Wherein, the step c includes alkali etching, and non-orphaned graph area, which is fully etched, does not stay residual copper；
The Step d includes the following steps：Paste one layer of dry film：Thickness of dry film 25-35um；First time pressing mold：Press mold speed 2.0
110 ± 5 DEG C of ± 0.5m/min, press mold temperature；Paste one layer of dry film：Thickness of dry film 25-35um；Second of pressing mold：Press mold speed 1.8
± 0.5m/min, 100 ± 5 DEG C of press mold temperature；Exposure：The unilateral compensation 1.2-1.5mil of isolation pattern windowing, non-orphaned area does not open
Window, 6 lattice of exposure guide rule are expired, table top vacuum -300 to -370mmHg；Development：Development point control 55 ± 5%；
The step e is acid etching, and parameter is 1.8 ± 0.2Kg/cm2 of etching pressure, etches number 1 time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810030437.8A CN108200728A (en) | 2018-01-12 | 2018-01-12 | A kind of secondary dry film engraving method of PCB isolation patterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810030437.8A CN108200728A (en) | 2018-01-12 | 2018-01-12 | A kind of secondary dry film engraving method of PCB isolation patterns |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108200728A true CN108200728A (en) | 2018-06-22 |
Family
ID=62588864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810030437.8A Pending CN108200728A (en) | 2018-01-12 | 2018-01-12 | A kind of secondary dry film engraving method of PCB isolation patterns |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108200728A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246676A (en) * | 2020-02-20 | 2020-06-05 | 深圳崇达多层线路板有限公司 | Method for removing electric gold lead wire for preventing formation of secondary drilling burr |
| CN114513902A (en) * | 2022-04-19 | 2022-05-17 | 惠州威尔高电子有限公司 | Etching method of gold finger lead and PCB with gold finger |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6775907B1 (en) * | 1999-06-29 | 2004-08-17 | International Business Machines Corporation | Process for manufacturing a printed wiring board |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
-
2018
- 2018-01-12 CN CN201810030437.8A patent/CN108200728A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6775907B1 (en) * | 1999-06-29 | 2004-08-17 | International Business Machines Corporation | Process for manufacturing a printed wiring board |
| CN101938886A (en) * | 2010-09-03 | 2011-01-05 | 深圳崇达多层线路板有限公司 | Method for adhering multi-layer dry films to manufacture circuit boards |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
| CN107072046A (en) * | 2017-02-15 | 2017-08-18 | 深圳市景旺电子股份有限公司 | A kind of pcb board and its outer-layer circuit preparation method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111246676A (en) * | 2020-02-20 | 2020-06-05 | 深圳崇达多层线路板有限公司 | Method for removing electric gold lead wire for preventing formation of secondary drilling burr |
| CN114513902A (en) * | 2022-04-19 | 2022-05-17 | 惠州威尔高电子有限公司 | Etching method of gold finger lead and PCB with gold finger |
| CN114513902B (en) * | 2022-04-19 | 2022-08-05 | 惠州威尔高电子有限公司 | Etching method of gold finger lead and PCB with gold finger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180622 |
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| RJ01 | Rejection of invention patent application after publication |