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CN108198881A - Crystalline silicon solar cell module with snow melting function - Google Patents

Crystalline silicon solar cell module with snow melting function Download PDF

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Publication number
CN108198881A
CN108198881A CN201810161789.7A CN201810161789A CN108198881A CN 108198881 A CN108198881 A CN 108198881A CN 201810161789 A CN201810161789 A CN 201810161789A CN 108198881 A CN108198881 A CN 108198881A
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China
Prior art keywords
snow melting
front plate
silicon solar
glass front
conductive
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CN201810161789.7A
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Chinese (zh)
Inventor
张映斌
王禹
高纪凡
冯志强
王乐
侍明
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Trina Solar Co Ltd
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Trina Solar Co Ltd
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Priority to CN201810161789.7A priority Critical patent/CN108198881A/en
Publication of CN108198881A publication Critical patent/CN108198881A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H10F19/807Double-glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02SGENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/10Cleaning arrangements
    • H02S40/12Means for removing snow
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Surface Heating Bodies (AREA)

Abstract

The invention discloses a crystalline silicon solar cell module with a snow melting function, which comprises a glass front plate, a first packaging layer, a solar cell, a second packaging layer and a back plate which are sequentially arranged from top to bottom, wherein a conductive structure connected with an external circuit structure is arranged on the inner surface and/or the outer surface of the glass front plate. The conductive structure comprises a plurality of metal line segments printed on the inner surface and/or the outer surface of the glass front plate in a silk-screen mode, and the metal line segments are connected in series and/or in parallel to form a metal conductive circuit. The conductive structure comprises a transparent conductive film arranged on the inner surface and/or the outer surface of the glass front plate. The surface temperature of the solar cell module is increased, and snow and continuous snowfall can be continuously melted, so that the solar cell module has good snow melting capability, and the power generation amount of the solar cell module in a region with large snowfall can be continuously improved.

Description

一种带有融雪功能的晶体硅太阳能电池组件A crystalline silicon solar cell module with snow melting function

技术领域technical field

本发明属于光伏电池技术领域,具体涉及一种带有融雪功能的晶体硅太阳能电池组件。The invention belongs to the technical field of photovoltaic cells, and in particular relates to a crystalline silicon solar cell module with a function of melting snow.

背景技术Background technique

在日本北海道、中国东北、内蒙古等地区冬季下雪量大,下雪时间长,光伏组件表面长期被冰雪覆盖,组件存在数月不能发电的情况,将大大降低光伏组件及光伏系统的发电量。目前光伏组件没有融雪功能,一旦下雪时,光伏组件表面渐渐积雪,光伏组件表面逐渐被积雪遮挡,随着遮挡面积的增加,光伏组件发电量几乎为零。In Hokkaido, Japan, Northeast China, Inner Mongolia and other regions, there is a lot of snow in winter and the snowing time is long. The surface of photovoltaic modules is covered by ice and snow for a long time, and the modules may not be able to generate electricity for several months, which will greatly reduce the power generation of photovoltaic modules and photovoltaic systems. At present, photovoltaic modules do not have the function of melting snow. Once it snows, the surface of photovoltaic modules gradually accumulates snow, and the surface of photovoltaic modules is gradually covered by snow. With the increase of the shading area, the power generation of photovoltaic modules is almost zero.

从组件自身受温度的影响看,由于上述极寒地区温度低,光伏组件会有比较高的发电量输出,在这些地区有大量的地面电站、屋顶光伏电站需求,如果能够解决表面融雪的问题,将会大大提升光伏系统的发电量。From the perspective of the temperature of the components themselves, due to the low temperature in the above-mentioned extremely cold regions, photovoltaic modules will have a relatively high output of power generation. There are a large number of ground power stations and rooftop photovoltaic power stations in these regions. If the problem of surface snow melting can be solved, It will greatly increase the power generation capacity of the photovoltaic system.

发明内容Contents of the invention

为了解决上述问题,本发明提供了一种带有融雪功能的晶体硅太阳能电池组件,可以融化覆盖于太阳能电池组件上的积雪,提高光伏系统的发电量。In order to solve the above problems, the present invention provides a crystalline silicon solar cell assembly with a snow-melting function, which can melt snow covering the solar cell assembly and increase the power generation of the photovoltaic system.

本发明的技术方案为:一种带有融雪功能的晶体硅太阳能电池组件,包括从上至下依次布置的玻璃前板、第一封装层、太阳能电池、第二封装层以及背板,所述玻璃前板内表面和/或外表面上设置有与外部电路结构相连接的导电结构。The technical solution of the present invention is: a crystalline silicon solar cell assembly with snow melting function, comprising a glass front plate, a first encapsulation layer, a solar cell, a second encapsulation layer and a back plate arranged in sequence from top to bottom, the Conductive structures connected to external circuit structures are provided on the inner and/or outer surfaces of the glass front plate.

本发明中在玻璃前板的表面上设置有与外部电路结构相连接的导电结构,外部电路结构为导电结构提供电压以及电流,使导电结构发热,导电结构产生的热量经过传导使得玻璃前板表面温度升高,从而融化覆盖于玻璃前板表面的积雪。其中本发明中导电结构可以设置于玻璃前板的内表面或者外表面,也可以在玻璃前板的内表面和外表面上均设置。In the present invention, a conductive structure connected to the external circuit structure is provided on the surface of the glass front plate. The external circuit structure provides voltage and current for the conductive structure to make the conductive structure generate heat. The heat generated by the conductive structure is conducted to make the surface of the glass front plate The temperature rises, thereby melting the snow that covers the surface of the glass front. In the present invention, the conductive structure can be arranged on the inner surface or the outer surface of the glass front plate, and can also be arranged on both the inner surface and the outer surface of the glass front plate.

本发明中导电结构的结构形式有多种,作为优选,所述导电结构包括丝印于玻璃前板内表面和/或外表面上的多个金属线段,多个金属线段相互串联和/或并联形成金属导电电路。本发明中玻璃前板可以为超白压花玻璃或浮法玻璃,即金属线段可以在超白压花玻璃或浮法玻璃的锡面及非锡面,对应在与组件进行封装时,金属线段可以在封装胶膜侧或者在空气侧。There are many structural forms of the conductive structure in the present invention, preferably, the conductive structure includes a plurality of metal wire segments silk-screened on the inner surface and/or outer surface of the glass front plate, and the plurality of metal wire segments are connected in series and/or in parallel to form metal conductive circuit. In the present invention, the glass front plate can be ultra-clear embossed glass or float glass, that is, the metal line segment can be on the tin surface and the non-tin surface of ultra-clear embossed glass or float glass, corresponding to when it is packaged with the component, the metal line segment Can be on the encapsulant side or on the air side.

作为优选,所述导电结构还包括用于将多个金属线段汇流形成金属导电电路的导电母线以及与导电母线相连接的电极引出线。金属线段在玻璃表面可以呈一定形状排布,经由导电母线汇流形成串联或是并联的金属导电电路,最终由一处或多处电极引出线引出,经过外接电路结构提供电压和电流,使金属线段发热。Preferably, the conductive structure further includes a conductive bus bar for converging a plurality of metal wire segments to form a metal conductive circuit, and electrode lead-out lines connected to the conductive bus bar. The metal wire segments can be arranged in a certain shape on the glass surface, and form a series or parallel metal conductive circuit through the confluence of the conductive bus bars, and finally lead out from one or more electrode lead wires, and provide voltage and current through the external circuit structure, so that the metal wire segments fever.

本发明中金属导电电路可以为并联也可以为串联,作为进一步优选,所述金属导电电路为并联。In the present invention, the metal conductive circuits can be connected in parallel or in series. As a further preference, the metal conductive circuits are connected in parallel.

本发明中并联和串联的连接方式有多种,例如当为并联金属导电电路时,本发明中可以将多条金属线段并行布置,金属线段的两端分别通过导电母线汇流,使得多条金属线段相互并联,然后分别在两端的导电母线上设置电极引出线。其中金属线段可以为30条,金属线段的宽度可以为0.5mm,厚度为10~20μm;导电母线的宽度可以从一段朝向另一端逐渐减小,例如宽度从10mm减小至5mm,电极引出线的宽度为20mm,厚度为0.25mm,金属导电电路的电压值可以为24V,基本功率在300W左右。In the present invention, there are many ways to connect in parallel and in series. For example, when it is a parallel metal conductive circuit, multiple metal wire segments can be arranged in parallel in the present invention. They are connected in parallel with each other, and electrode lead-out lines are respectively arranged on the conductive busbars at both ends. Among them, there can be 30 metal wire segments, the width of the metal wire segment can be 0.5mm, and the thickness is 10-20μm; the width of the conductive bus can be gradually reduced from one end to the other end, for example, the width is reduced from 10mm to 5mm, and the electrode lead-out line The width is 20mm, the thickness is 0.25mm, the voltage value of the metal conductive circuit can be 24V, and the basic power is about 300W.

本发明中金属线段可以为多种金属制成,作为优选,所述金属线段为银浆线段或铝浆线段。本发明可以将银浆或铝浆丝印于玻璃前板上,形成金属导电电路。In the present invention, the metal wire segment can be made of various metals. Preferably, the metal wire segment is a silver paste wire segment or an aluminum paste wire segment. The invention can screen-print silver paste or aluminum paste on the glass front plate to form a metal conductive circuit.

作为优选,所述导电结构包括设置于玻璃前板内表面和/或外表面上的透明导电膜。本发明中的导电结构还可以为在玻璃前板表面镀一层透明导电膜,其中镀膜过程可以玻璃原片上加工。通过对透明导电膜通电,通电之后透明导电膜发热,产生的热量经过传导使得玻璃前板表面温度升高,从而融化覆盖于玻璃前板表面的积雪。Preferably, the conductive structure includes a transparent conductive film disposed on the inner surface and/or the outer surface of the glass front plate. The conductive structure in the present invention can also be coated with a layer of transparent conductive film on the surface of the glass front plate, wherein the coating process can be processed on the original glass. By energizing the transparent conductive film, the transparent conductive film will generate heat after energization, and the heat generated will increase the temperature of the surface of the glass front plate through conduction, thus melting the snow covering the surface of the glass front plate.

本发明中透明导电膜可以通过多种方式设置于玻璃前板上,作为优选,所述透明导电膜通过磁控溅射、印刷、滚涂或浸涂的方式设置于玻璃前板内表面和/或外表面上。其中玻璃前板可以是压延工艺玻璃或者浮法工艺玻璃。In the present invention, the transparent conductive film can be arranged on the glass front plate in various ways. As a preference, the transparent conductive film is arranged on the inner surface of the glass front plate and/or by magnetron sputtering, printing, roll coating or dip coating. or on the outer surface. Wherein the glass front plate may be rolled process glass or float process glass.

本发明中透明导电膜的材料有多种,作为优选,所述透明导电膜的材料为半导体材料或带有金属导电材料的透明或彩色薄膜。There are many kinds of materials for the transparent conductive film in the present invention, preferably, the material of the transparent conductive film is a semiconductor material or a transparent or colored film with a metal conductive material.

作为优选,所述半导体材料为石墨烯。Preferably, the semiconductor material is graphene.

作为优选,所述金属导电材料呈细丝状,所述金属导电材料铺设于透明或彩色薄膜内部。Preferably, the metal conductive material is in the form of a filament, and the metal conductive material is laid inside a transparent or colored film.

作为优选,所述金属导电材料为钨、银或铝,所述透明或彩色薄膜的材料为EVA、POE、PVB或硅胶。本发明中透明或彩色薄膜的材料也可以为其它多种高分子材料。Preferably, the metal conductive material is tungsten, silver or aluminum, and the material of the transparent or colored film is EVA, POE, PVB or silica gel. The material of the transparent or colored film in the present invention can also be other kinds of polymer materials.

与现有技术相比,本发明的有益效果体现在:Compared with the prior art, the beneficial effects of the present invention are reflected in:

本发明中太阳能电池组件表面温度升高,对积雪及持续降雪有持续融化,因此本发明的太阳能电池组件具备很好的融雪能力,持续提高太阳能电池组件在降雪较大地区的发电量。In the present invention, the surface temperature of the solar cell module rises, which can continuously melt snow and continuous snowfall. Therefore, the solar cell module of the present invention has a good snow melting ability, and continuously improves the power generation of the solar cell module in areas with heavy snowfall.

附图说明Description of drawings

图1为本发明第一种实施方式的结构示意图。Fig. 1 is a structural schematic diagram of the first embodiment of the present invention.

图2为本发明第二种实施方式的结构示意图。Fig. 2 is a schematic structural diagram of a second embodiment of the present invention.

图3为本发明第三种实施方式的结构示意图。Fig. 3 is a schematic structural diagram of a third embodiment of the present invention.

图4为图3的剖向结构示意图。FIG. 4 is a schematic cross-sectional structural view of FIG. 3 .

图5为本发明第四种实施方式的结构示意图。Fig. 5 is a schematic structural diagram of a fourth embodiment of the present invention.

图6为本发明中金属线段设置于玻璃前板外表面上的结构示意图。FIG. 6 is a structural schematic diagram of the metal wire segment disposed on the outer surface of the glass front plate in the present invention.

图7为本发明第五种实施方式的结构示意图。Fig. 7 is a schematic structural diagram of a fifth embodiment of the present invention.

图8为本发明第六种实施方式的结构示意图。Fig. 8 is a schematic structural diagram of a sixth embodiment of the present invention.

具体实施方式Detailed ways

如图1~图8所示,本发明包括从上至下依次布置的玻璃前板1、第一封装层、太阳能电池、第二封装层以及背板2,玻璃前板1内表面和/或外表面上设置有与外部电路结构相连接的导电结构。As shown in Figures 1 to 8, the present invention includes a glass front plate 1, a first encapsulation layer, a solar cell, a second encapsulation layer and a back plate 2 arranged in sequence from top to bottom, the inner surface of the glass front plate 1 and/or Conductive structures connected to external circuit structures are arranged on the outer surface.

本发明中在玻璃前板1的表面上设置有与外部电路结构相连接的导电结构,外部电路结构为导电结构提供电压以及电流,使导电结构发热,导电结构产生的热量经过传导使得玻璃前板1表面温度升高,从而融化覆盖于玻璃前板1表面的积雪。其中本发明中导电结构可以设置于玻璃前板1的内表面或者外表面,也可以在玻璃前板1的内表面和外表面上均设置。In the present invention, a conductive structure connected to the external circuit structure is provided on the surface of the glass front plate 1. The external circuit structure provides voltage and current for the conductive structure to make the conductive structure generate heat. The heat generated by the conductive structure is conducted to make the glass front plate 1 surface temperature rises, thereby melting the snow covering the surface of the glass front plate 1. In the present invention, the conductive structure can be arranged on the inner surface or the outer surface of the glass front plate 1 , or can be arranged on both the inner surface and the outer surface of the glass front plate 1 .

其中本发明中导电结构的结构形式有多种,如图1、图2、图3和图5所示,本实施例中导电结构包括丝印于玻璃前板1内表面和/或外表面上的多个金属线段4,多个金属线段4相互串联和/或并联形成金属导电电路。其中图1和图2为串联连接方式,图3和图5为并联连接方式,本发明中玻璃前板1可以为超白压花玻璃或浮法玻璃,即金属线段4可以在超白压花玻璃或浮法玻璃的锡面及非锡面,对应在与组件进行封装时,金属线段4可以在封装胶膜侧或者在空气侧。Wherein the structure form of conductive structure in the present invention has multiple, as shown in Figure 1, Figure 2, Figure 3 and Figure 5, in this embodiment the conductive structure comprises silk screen on the glass front plate 1 inner surface and/or outer surface A plurality of metal wire segments 4 are connected in series and/or in parallel to form a metal conductive circuit. Wherein Fig. 1 and Fig. 2 are series connection mode, Fig. 3 and Fig. 5 are parallel connection mode, glass front plate 1 can be ultra-clear embossed glass or float glass among the present invention, promptly metal wire segment 4 can be in ultra-clear embossed glass The tin surface and the non-tin surface of glass or float glass correspond to when the components are packaged, the metal line segment 4 can be on the side of the packaging film or on the air side.

如图3~图6所示,本发明中导电结构还包括用于将多个金属线段4汇流形成金属导电电路的导电母线5以及与导电母线5相连接的电极引出线6。金属线段4在玻璃表面可以呈一定形状排布,经由导电母线5汇流形成串联或是并联的金属导电电路,最终由一处或多处电极引出线6引出,经过外接电路结构提供电压和电流,使金属线段4发热。As shown in FIGS. 3 to 6 , the conductive structure in the present invention also includes a conductive bus bar 5 for converging a plurality of metal wire segments 4 to form a metal conductive circuit, and electrode lead wires 6 connected to the conductive bus bar 5 . The metal wire segments 4 can be arranged in a certain shape on the glass surface, and form a series or parallel metal conductive circuit through the conductive bus bar 5, and finally lead out from one or more electrode lead wires 6, and provide voltage and current through the external circuit structure. The metal wire segment 4 is heated.

本发明中并联和串联的连接方式有多种,例如当为并联金属导电电路时,如图3和图5所示,本实施例中可以将多条金属线段4并行布置,金属线段4的两端分别通过导电母线5汇流,使得多条金属线段4相互并联,然后分别在两端的导电母线5上设置电极引出线6。其中金属线段4可以为30条,金属线段4的宽度可以为0.5mm,厚度为10~20μm;导电母线5的宽度可以从一段朝向另一端逐渐减小,例如宽度从10mm减小至5mm,电极引出线6的宽度为20mm,厚度为0.25mm,金属导电电路的电压值可以为24V,基本功率在300W左右。金属线段4金属线段4In the present invention, there are many ways to connect in parallel and in series. For example, when it is a parallel metal conductive circuit, as shown in FIG. 3 and FIG. The terminals are converging through the conductive bus bars 5, so that a plurality of metal line segments 4 are connected in parallel, and then electrode lead-out lines 6 are respectively arranged on the conductive bus bars 5 at both ends. Among them, there can be 30 metal wire segments 4, the width of the metal wire segment 4 can be 0.5 mm, and the thickness is 10-20 μm; the width of the conductive bus bar 5 can gradually decrease from one end to the other end, for example, the width is reduced from 10 mm to 5 mm. The lead wire 6 has a width of 20mm and a thickness of 0.25mm, the voltage value of the metal conductive circuit can be 24V, and the basic power is about 300W. Metal Line Segment 4 Metal Line Segment 4

其中本发明中金属线段4可以为多种金属制成,金属线段4为银浆线段或铝浆线段。本发明可以将银浆或铝浆丝印于玻璃前板1上,形成金属导电电路。The metal wire segment 4 in the present invention can be made of various metals, and the metal wire segment 4 is a silver paste wire segment or an aluminum paste wire segment. In the present invention, silver paste or aluminum paste can be screen-printed on the glass front plate 1 to form a metal conductive circuit.

如图7和图8所示,本实施例中导电结构包括设置于玻璃前板1内表面和/或外表面上的透明导电膜3。本发明中的导电结构还可以为在玻璃前板1表面镀一层透明导电膜3,其中镀膜过程可以玻璃原片上加工。通过对透明导电膜3通电,通电之后透明导电膜3发热,产生的热量经过传导使得玻璃前板1表面温度升高,从而融化覆盖于玻璃前板1表面的积雪。透明导电膜3透明导电膜3As shown in FIGS. 7 and 8 , the conductive structure in this embodiment includes a transparent conductive film 3 disposed on the inner surface and/or the outer surface of the glass front plate 1 . The conductive structure in the present invention can also be coated with a layer of transparent conductive film 3 on the surface of the glass front plate 1, wherein the coating process can be processed on the original glass. By energizing the transparent conductive film 3 , the transparent conductive film 3 generates heat after energization, and the generated heat is conducted to increase the temperature of the surface of the glass front plate 1 , thus melting the snow covering the surface of the glass front plate 1 . Transparent Conductive Film 3 Transparent Conductive Film 3

本发明中透明导电膜3可以通过多种方式设置于玻璃前板1上,例如透明导电膜3通过磁控溅射、印刷、滚涂或浸涂的方式设置于玻璃前板1内表面和/或外表面上。其中玻璃前板1可以是压延工艺玻璃或者浮法工艺玻璃。In the present invention, the transparent conductive film 3 can be disposed on the glass front plate 1 in various ways, for example, the transparent conductive film 3 is disposed on the inner surface of the glass front plate 1 and/or by magnetron sputtering, printing, roll coating or dip coating or on the outer surface. Wherein the glass front plate 1 may be rolled process glass or float process glass.

本发明中透明导电膜3的材料有多种,例如透明导电膜3的材料为半导体材料或金属导电材料的透明或彩色薄膜。例如半导体材料可以为石墨烯。金属导电材料的透明或彩色薄膜中的金属导电材料呈细丝状,金属导电材料铺设于透明或彩色薄膜内部,金属导电材料可以为钨、银或铝,透明或彩色薄膜的材料为EVA、POE、PVB或硅胶等多种高分子材料。There are many kinds of materials for the transparent conductive film 3 in the present invention, for example, the material of the transparent conductive film 3 is a transparent or colored thin film of semiconductor material or metal conductive material. For example, the semiconductor material may be graphene. The metal conductive material in the transparent or colored film of metal conductive material is in the shape of a filament, and the metal conductive material is laid inside the transparent or colored film. The metal conductive material can be tungsten, silver or aluminum, and the material of the transparent or colored film is EVA, POE , PVB or silica gel and other polymer materials.

Claims (10)

1. a kind of crystal silicon solar battery component with snow melting function, including be sequentially arranged from top to bottom glass front plate, First encapsulated layer, solar cell, the second encapsulated layer and backboard, which is characterized in that the glass front plate inner surface and/or outer The conductive structure being connected with external circuit structure is provided on surface.
2. the crystal silicon solar battery component of snow melting function is carried as described in claim 1, which is characterized in that the conduction Structure includes silk-screen in multiple metal wire sections on glass front plate inner surface and/or outer surface, and multiple metal wire sections are serially connected And/or formation metallic conduction circuit in parallel.
3. the crystal silicon solar battery component of snow melting function is carried as claimed in claim 2, which is characterized in that the conduction Structure further includes to form the busbar of metallic conduction circuit for multiple metal wire sections to be converged and with busbar be connected The electrode outlet line connect.
4. the crystal silicon solar battery component of snow melting function is carried as claimed in claim 2 or claim 3, which is characterized in that described Metal wire sections are silver paste line segment or aluminium paste line segment.
5. the crystal silicon solar battery component of snow melting function is carried as described in claim 1, which is characterized in that the conduction Structure includes the transparent conductive film being set on glass front plate inner surface and/or outer surface.
6. the crystal silicon solar battery component of snow melting function is carried as claimed in claim 5, which is characterized in that described transparent Conductive film is set to by way of magnetron sputtering, printing, roller coating or dip-coating on glass front plate inner surface and/or outer surface.
7. the crystal silicon solar battery component of snow melting function is carried as claimed in claim 6, which is characterized in that described transparent The material of conductive film is semi-conducting material or the transparent or colorful film with conductive metal material.
8. the crystal silicon solar battery component of snow melting function is carried as claimed in claim 7, which is characterized in that described partly to lead Body material is graphene.
9. the crystal silicon solar battery component of snow melting function is carried as claimed in claim 7, which is characterized in that the metal Conductive material is in filament shape, and the conductive metal material is layed in inside transparent or colorful film.
10. the crystal silicon solar battery component of snow melting function is carried as claimed in claim 9, which is characterized in that the gold Category conductive material is tungsten, silver or aluminium, and described transparent or colorful film material is EVA, POE, PVB or silica gel.
CN201810161789.7A 2018-02-27 2018-02-27 Crystalline silicon solar cell module with snow melting function Pending CN108198881A (en)

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CN101529327A (en) * 2006-08-16 2009-09-09 法国圣戈班玻璃厂 Transparent electrode
CN101933163A (en) * 2007-12-03 2010-12-29 米克洛什·托斯 Solar power generation roof and manufacturing method thereof
CN102931246A (en) * 2011-08-11 2013-02-13 吉富新能源科技(上海)有限公司 Solar panel allowing accumulated snow to be automatically removed
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CN203504782U (en) * 2013-10-18 2014-03-26 李金良 Electric heating automobile front windshield glass
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Publication number Priority date Publication date Assignee Title
CN110299893A (en) * 2019-05-09 2019-10-01 中山宝立得高分子材料有限公司 Anti-icing solar panel

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Application publication date: 20180622