CN108156761A - A kind of processing method of turmeric gold finger lead shape - Google Patents
A kind of processing method of turmeric gold finger lead shape Download PDFInfo
- Publication number
- CN108156761A CN108156761A CN201810041190.XA CN201810041190A CN108156761A CN 108156761 A CN108156761 A CN 108156761A CN 201810041190 A CN201810041190 A CN 201810041190A CN 108156761 A CN108156761 A CN 108156761A
- Authority
- CN
- China
- Prior art keywords
- pcb
- finger lead
- gold finger
- turmeric
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 24
- 239000010931 gold Substances 0.000 title claims abstract description 24
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 235000003392 Curcuma domestica Nutrition 0.000 title claims abstract description 11
- 244000008991 Curcuma longa Species 0.000 title claims abstract description 11
- 235000003373 curcuma longa Nutrition 0.000 title claims abstract description 11
- 235000013976 turmeric Nutrition 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 238000003801 milling Methods 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 10
- 239000004743 Polypropylene Substances 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention relates to a kind of processing methods of turmeric gold finger lead shape, are as follows：（1）It is drilled to the PCB obtained after pressing, heavy copper, electric plating of whole board are handled；（2）Outer graphics transfer is carried out, to produce the figure of outer-layer circuit, golden finger and finger lead；（3）In the PCB for having gold finger lead, milling cutter feed parameter is set at the time of molding；（4）Copper above PCB substrate is etched away, it is only necessary to Pp tabula rasas；（5）The Pp tabula rasas after etching are added on pcb board at the time of molding, reduce feed；（6）The surface treatment of process, completes processing after being carried out again to PCB after protection golden finger area.The beneficial effects of the invention are as follows：It is easy to operate, the quality problem that gold finger lead comes off, trails effectively is solved, improves product quality.
Description
Technical field
The present invention relates to a kind of processing methods, and in particular to a kind of processing method of turmeric gold finger lead shape belongs to
Gold finger lead manufacture field.
Background technology
With the development that PCB makes, client is more and more stringenter to appearance requirement.Gold finger plate finds golden hand in milling plate
Lead copper sheet can seriously be rolled at finger, can not do over again repairing due to having completed surface, cause scrappage high, seriously affect order
Delivery rate.For the quality problem that milling plate occurs, experimental study is carried out, finding out improves what gold finger lead milling plate copper sheet was rolled
Method and Instructing manufacture operation.Stress is when material is in external cause（External force, humiture variation）When cannot generate displacement under effect,
Its geometry and size will change, this deformation be known as strain, when material deforms upon inside produce size phase
Deng but the opposite reaction force in direction resist external force, this reaction force on unit area is stress（Stress=active force/face
Product）.Vertical with section is known as direct stress or normal stress, with the tangent referred to as shear stress in section.Stress can be with external force
Increase and increase, for a certain material, the growth of stress is limited, and more than this limit, material will destroy.
The external appearance characteristic to warp from copper sheet we can obtain the basic ideas of its producing cause：Copper sheet warps main appearance
At the edge of gold finger lead, illustrate that the stress intensity that copper sheet is caused to warp and copper face product are related；Gold finger lead area is small, into
Knife speed is smaller more easily to pull copper sheet, and it is longer to pull power action time, be easy to cause copper sheet tilting, and feed velocity is bigger, draws
It is shorter to pull power action time, it is not easy to copper sheet be caused to tilt；And copper sheet can be pressed down by increasing cover board above, so as to make copper
Skin is not easy to tilt.
Invention content
In view of the above-mentioned problems, the present invention provides a kind of processing method of turmeric gold finger lead shape, by adjusting parameter
And a kind of mode of Pp cover boards of increase can meet the improvement of quality.
To solve prior art problem, the technical solution adopted in the present invention is：
A kind of processing method of turmeric gold finger lead shape, is as follows：
（1）It is drilled to the PCB obtained after pressing, heavy copper, electric plating of whole board are handled；
（2）Outer graphics transfer is carried out, to produce the figure of outer-layer circuit, golden finger and finger lead；
（3）In the PCB for having gold finger lead, milling cutter feed parameter is set at the time of molding；
（4）Copper above PCB substrate is etched away, it is only necessary to Pp tabula rasas；
（5）The Pp tabula rasas after etching are added on pcb board at the time of molding, reduce feed；
（6）The surface treatment of process, completes processing after being carried out again to PCB after protection golden finger area.
Further, the feed is set as F30.
Further, the material selection of the Pp tabula rasas is polypropylene material.
Further, the reduction feed also alternatively rolls copper sheet into milling cutter when returning to.
The beneficial effects of the invention are as follows：It is easy to operate, the quality problem that gold finger lead comes off, trails effectively is solved, is carried
High yield quality.
Specific embodiment
In order to which those skilled in the art is made more to understand technical scheme of the present invention, the present invention is done further divide below
Analysis.
A kind of processing method of turmeric gold finger lead shape, is as follows：
（1）It is drilled to the PCB obtained after pressing, heavy copper, electric plating of whole board are handled；
（2）Outer graphics transfer is carried out, to produce the figure of outer-layer circuit, golden finger and finger lead；
（3）In the PCB for having gold finger lead, parameter setting feed at the time of molding；Feed is set as F30, different feeds speed
Degree rolls lead milling plate copper sheet, improvement of trail has different effects, wherein as F=30, the improvement on front and ground
Effect is the most apparent；
（4）Copper above PCB substrate is etched away, it is only necessary to Pp tabula rasas；It is verified using Pp supplies, works as feed velocity
Change and add conventional PP tabula rasas, gold finger lead comes off, the quality problem trailed can be improved and be eradicated；Pp tabula rasas
Material selection is polypropylene material, harder than PE and have higher fusing point；
（5）The tabula rasa after etching is added on pcb board at the time of molding, milling cutter rolls copper sheet when reducing feed or returning to；
（6）The surface treatment of process, completes processing after being carried out again to PCB after protection golden finger area.
The present invention is by adjusting parameter and increases a kind of mode of Pp cover boards, and conventionally employed conventional milling gong processing method,
Milling cutter high speed rotation is easy to cause the problems such as golden finger bottom end copper sheet is rolled, causes golden finger quality bad when returning knife and compares, thorough
Bottom improves and eradicates the quality problem that gold finger lead comes off, trails, and improves product quality.
Technical solution provided herein is described in detail above, embodiment used herein is to the application
Principle and embodiment be expounded, the explanation of above example is served only for helping to understand the present processes and its core
Thought；Meanwhile for those of ordinary skill in the art, according to the thought of the application, in specific embodiment and application range
Upper there will be changes, in conclusion the content of the present specification should not be construed as the limitation to the application.
Claims (4)
1. a kind of processing method of turmeric gold finger lead shape, it is characterised in that：It is as follows：
（1）It is drilled to the PCB obtained after pressing, heavy copper, electric plating of whole board are handled；
（2）Outer graphics transfer is carried out, to produce the figure of outer-layer circuit, golden finger and finger lead；
（3）In the PCB for having gold finger lead, milling cutter feed parameter is set at the time of molding；
（4）Copper above PCB substrate is etched away, it is only necessary to Pp tabula rasas；
（5）The Pp tabula rasas after etching are added on pcb board at the time of molding, reduce feed；
（6）The surface treatment of process, completes processing after being carried out again to PCB after protection golden finger area.
2. a kind of processing method of turmeric gold finger lead shape according to claim 1, it is characterised in that：It is described into
Knife is set as F30.
3. a kind of processing method of turmeric gold finger lead shape according to claim 1, it is characterised in that：The Pp
The material selection of tabula rasa is polypropylene material.
4. a kind of processing method of turmeric gold finger lead shape according to claim 1, it is characterised in that：Described subtracts
Few feed also alternatively rolls copper sheet into milling cutter when returning to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810041190.XA CN108156761A (en) | 2018-01-16 | 2018-01-16 | A kind of processing method of turmeric gold finger lead shape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810041190.XA CN108156761A (en) | 2018-01-16 | 2018-01-16 | A kind of processing method of turmeric gold finger lead shape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108156761A true CN108156761A (en) | 2018-06-12 |
Family
ID=62461577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810041190.XA Withdrawn CN108156761A (en) | 2018-01-16 | 2018-01-16 | A kind of processing method of turmeric gold finger lead shape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108156761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312665A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
-
2018
- 2018-01-16 CN CN201810041190.XA patent/CN108156761A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312665A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Circuit board and manufacturing method thereof |
| CN112312665B (en) * | 2020-10-29 | 2021-11-09 | 惠州市特创电子科技股份有限公司 | Circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180612 |
|
| WW01 | Invention patent application withdrawn after publication |