CN108152655A - OSA component test devices - Google Patents
OSA component test devices Download PDFInfo
- Publication number
- CN108152655A CN108152655A CN201810059316.6A CN201810059316A CN108152655A CN 108152655 A CN108152655 A CN 108152655A CN 201810059316 A CN201810059316 A CN 201810059316A CN 108152655 A CN108152655 A CN 108152655A
- Authority
- CN
- China
- Prior art keywords
- osa
- pressing plate
- probe
- tested
- fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 61
- 239000000523 sample Substances 0.000 claims abstract description 29
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 238000003466 welding Methods 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 235000011449 Rosa Nutrition 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The present invention relates to a kind of OSA component test devices, including fixture, wire jumper, probe, pressing plate, driving mechanism, wherein, the probe is connected with extraneous test equipment, and the probe is installed on the pressing plate, and the pressing plate is located at the top of the fixture；The wire jumper is installed on the fixture, and OSA components to be tested are installed on the wire jumper, and the wire jumper is located at the lower section of the probe, and the position of the probe is corresponding with the pin of the OSA components to be tested；The driving mechanism is used to that the pressing plate to be driven to move up and down relative to the fixture, when the driving mechanism drives the pressing plate to be moved downwardly to predeterminated position, the probe is in contact with the pin of the OSA components to be tested, to test the OSA components to be tested.The present invention effectively reduces the time of test relative to the prior art, improves work efficiency and test accuracy.
Description
Technical field
The present invention relates to OSA module testing tooling technical fields more particularly to a kind of OSA component test devices.
Background technology
At present, it based on the connection of the OSA components of optical communications industry 10G multimodes and PCBA board is mostly welded with soft board, is welding
It needs to cut pin before soft board, after welding with soft board, pin length is shorter.When supplied materials or the component removed in module
When needing test, then need to weld pin aptitude test again in component.
During test, need to weld pin again in component, the pin being welded will appear rosin joint, different in size, easily
Phenomena such as insecure is fallen, causes to be likely to occur the incorrectness of data during test, whether be non-defective unit, meeting when serious if cannot be distinguished
The phenomenon that component is caused to be electrocuted.
In addition, during weld assembly, need experienced person that pin can just be welded, and it is longer to weld five pins needs
Time could complete, less efficient.
It is necessary to propose a kind of to improve test accuracy, and the solution that testing efficiency is high as a result,.
Invention content
The present invention proposes a kind of OSA component test devices, it is intended to improve test OSA component efficiencies and accuracy.
To achieve the above object, the invention is realized in this way, the present invention provides a kind of OSA component test devices, described
OSA component test devices include fixture, wire jumper, probe, pressing plate, driving mechanism, wherein, the probe and extraneous test equipment phase
Connection, the probe are installed on the pressing plate, and the pressing plate is located at the top of the fixture；
The wire jumper is installed on the fixture, and OSA components to be tested are installed on the wire jumper, and the wire jumper is located at
The lower section of the probe, the position of the probe are corresponding with the pin of the OSA components to be tested；
The driving mechanism is for driving the pressing plate to move up and down relative to the fixture, when the driving mechanism drives
When the pressing plate is moved downwardly to predeterminated position, the probe is in contact with the pin of the OSA components to be tested, with to described
OSA components to be tested are tested.
Preferably, locating slot is provided on the fixture, the head of the wire jumper is inserted in the lower end of the locating slot.
Preferably, the head of the wire jumper is bolted to connection in the lower end of the locating slot.
Preferably, the OSA component test devices further include pedestal, and the fixture, pressing plate are mounted on the pedestal.
Preferably, guide post is provided on the pedestal, the guide sleeve being sheathed on the guide post, institute are installed on the pressing plate
Stating driving mechanism drives the pressing plate to move up and down by the guide sleeve along the guide post.Preferably, the driving mechanism is peace
Loaded on the duplex cylinder on the pedestal.
Preferably, the OSA component test devices further include the floor push for controlling the duplex cylinder ON/OFF.
Preferably, the OSA component test devices further include for be installed on the pedestal for adjusting the folder
Has the micro-adjusting mechanism of position.
The beneficial effects of the invention are as follows：When OSA component test devices of the present invention test OSA components to be tested, no
It needs to weld pin again on OSA components to be tested, directly OSA components to be tested is tested with probe power-up, are avoided
There is phenomena such as rosin joint, insecure during welding pin, so as to effectively reduce the time of test, improve work efficiency and survey
Try accuracy.
Description of the drawings
Fig. 1 is the dimensional structure diagram of OSA component test devices preferred embodiment of the present invention；
Fig. 2 is the assembling schematic diagram of wire jumper in OSA component test devices preferred embodiment of the present invention.
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Specifically, to Fig. 2 shows the OSA component test devices of present pre-ferred embodiments, which is suitable for Fig. 1
Through carrying out shear treatment to cutting pin, and the OSA components for welding soft board carry out various performance parameters test, are primarily adapted for use in
TOSA and the ROSA component of soft board are welded.
When the device tests OSA components to be tested, do not need to weld pin again on OSA components to be tested,
Directly OSA components to be tested are tested with probe power-up, phenomena such as rosin joint, insecure occur when avoiding welding pin,
So as to effectively reduce the time of test, improve work efficiency and test accuracy.
Fig. 1 is the dimensional structure diagram of OSA component test devices preferred embodiment of the present invention, and Fig. 2 is OSA groups of the present invention
The assembling schematic diagram of wire jumper in part test device preferred embodiment.
Specifically, as shown in Figure 1 and Figure 2, OSA component test devices preferred embodiment of the present invention includes fixture 10, wire jumper
20th, probe 30, pressing plate 40, driving mechanism, wherein, which is connected with extraneous test equipment, which is installed on this
On pressing plate 40, which is located at the top of the fixture 10.
The wire jumper 20 is installed on the fixture 10, and OSA components to be tested are installed on the wire jumper 20, and the wire jumper 20 is located at
The lower section of the probe 30, the position of the probe 30 are corresponding with the pin of the OSA components to be tested.
It should be noted that the OSA components to be tested can be TOSA ROSA components.
The driving mechanism is for driving the pressing plate 40 to move up and down relative to the fixture 10, when the driving mechanism drives the pressure
When plate 40 is moved downwardly to predeterminated position, which is in contact with the pin of the OSA components to be tested, with to be tested to this
OSA components are tested.
When testing the OSA components to be tested, the probe 30 on the pressing plate 40 is passed through into connecting line and outside first
Test equipment connects, and sets relevant parameter, which is mounted on the wire jumper 20, and adjust the folder
The position of tool 10, it is ensured that the probe 30 is directed at the pin, then the pressing plate 40 is driven to drive the probe 30 by the driving mechanism
It moves downward, when the pressing plate 40 is moved downwardly to predeterminated position, the pins contact of the probe 30 and the OSA components to be tested is good
Afterwards, external world's test equipment is to the OSA components power-on test to be tested.
As shown in Fig. 2, in the present embodiment, locating slot is provided on the fixture 10, the head of the wire jumper 20 is inserted in this and determines
The lower end of position slot, the head of the wire jumper 20 is fixedly connected on the lower end of the locating slot by bolt 50.
When it is implemented, arrow direction as shown in Figure 2, first inserts on the head of wire jumper 20 from the lower end of the locating slot
Enter, after locating slot is had good positioning, then the head with the locking of bolt 50 wire jumper 20, fix the wire jumper 20.Thus, it is possible to it avoids more
Secondary dismounting wire jumper 20, so as to improve testing efficiency.
Further, as a kind of embodiment, the present embodiment OSA component test devices further include pedestal 60, wherein, it should
Fixture 10, pressing plate 40 are mounted on the pedestal 60, which is the duplex cylinder being installed on the pedestal 60.By this
Duplex cylinder further improves testing efficiency.
Specifically, guide post 70 is provided on the pedestal 60, the guide sleeve being sheathed on the guide post 70 is installed on the pressing plate 40
80, which drives the pressing plate 40 to move up and down by the guide sleeve 80 along the guide post 70, so as to drive the pressing plate 40 opposite
It moves up and down in the fixture 10.
In addition, the OSA component test devices that the present embodiment proposes, further include the foot for controlling the duplex cylinder ON/OFF
Step on switch.
After the completion of the OSA module testings to be tested, the OSA components tested are powered off, unclamp the floor push, this pair
Connection cylinder is resetted with pressing plate 40, is taken out the OSA components tested, is tested OSA components to be tested successively.
Further, it in order to further improve test accuracy, in the present embodiment, further includes to be installed on the pedestal
The micro-adjusting mechanism 90 for being used to adjust 10 position of fixture on 60.
When it is implemented, after the OSA components to be tested are mounted on wire jumper 20, the fixture is adjusted with the micro-adjusting mechanism 90
10 position, so that it is guaranteed that the probe 30 is directed at pin, to improve test accuracy.Wherein described micro-adjusting mechanism may be used existing
Having has the micro-adjusting mechanism of position adjustment function in technology, this is not limited by the present invention.
In conclusion when OSA component test devices of the present invention test OSA components to be tested, do not need to be measured
Pin is welded again on examination OSA components, and directly OSA components to be tested are tested with probe power-up, avoid welding pin
When there is phenomena such as rosin joint, insecure, so as to effectively reduce the time of test, improve work efficiency and test accuracy.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every utilization
Equivalent structure or the flow transformation that description of the invention and accompanying drawing content are made, are directly or indirectly used in other relevant skills
Art field, is included within the scope of the present invention.
Claims (8)
1. a kind of OSA component test devices, which is characterized in that including fixture, wire jumper, probe, pressing plate, driving mechanism, wherein, institute
It states probe with extraneous test equipment to be connected, the probe is installed on the pressing plate, and the pressing plate is located at the upper of the fixture
Side；
The wire jumper is installed on the fixture, and OSA components to be tested are installed on the wire jumper, and the wire jumper is positioned at described
The lower section of probe, the position of the probe are corresponding with the pin of the OSA components to be tested；
The driving mechanism is for driving the pressing plate to move up and down relative to the fixture, when described in driving mechanism driving
When pressing plate is moved downwardly to predeterminated position, the probe is in contact with the pin of the OSA components to be tested, with to described to be measured
Examination OSA components are tested.
2. OSA component test devices according to claim 1, which is characterized in that locating slot, institute are provided on the fixture
The head for stating wire jumper is inserted in the lower end of the locating slot.
3. OSA component test devices according to claim 2, which is characterized in that the head of the wire jumper is consolidated by bolt
Surely it is connected to the lower end of the locating slot.
4. according to the OSA component test devices described in claim 1-3 any one, which is characterized in that pedestal is further included, it is described
Fixture, pressing plate are mounted on the pedestal.
5. OSA component test devices according to claim 4, which is characterized in that guide post is provided on the pedestal, it is described
The guide sleeve being sheathed on the guide post is installed on pressing plate, the driving mechanism drives the pressing plate by the guide sleeve described in
Guide post moves up and down.
6. OSA component test devices according to claim 5, which is characterized in that the driving mechanism is described to be installed on
Duplex cylinder on pedestal.
7. OSA component test devices according to claim 6, which is characterized in that further include to control the duplex gas
The floor push of cylinder ON/OFF.
8. OSA component test devices according to claim 4, which is characterized in that further include to be installed on the pedestal
On for adjusting the micro-adjusting mechanism of the chucking position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810059316.6A CN108152655A (en) | 2018-01-22 | 2018-01-22 | OSA component test devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810059316.6A CN108152655A (en) | 2018-01-22 | 2018-01-22 | OSA component test devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108152655A true CN108152655A (en) | 2018-06-12 |
Family
ID=62461817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810059316.6A Pending CN108152655A (en) | 2018-01-22 | 2018-01-22 | OSA component test devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108152655A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0782024A2 (en) * | 1995-12-22 | 1997-07-02 | Lucent Technologies Inc. | Method for positioning optical subassembly for testing |
| JP2000147041A (en) * | 1998-11-12 | 2000-05-26 | Mitsubishi Electric Corp | Tester for electronic equipment |
| US6697750B1 (en) * | 2001-01-11 | 2004-02-24 | Ciena Corporation | Method and apparatus for performing parallel asynchronous testing of optical modules |
| US20040074661A1 (en) * | 2002-02-14 | 2004-04-22 | Finisar Corporation | Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |
| US20040091231A1 (en) * | 2002-11-08 | 2004-05-13 | Hofmeister Rudolf J. | Optical subassembly tester and testing method |
| US20050025449A1 (en) * | 2002-11-08 | 2005-02-03 | Dirkson John C. | Methods and structures for testing optical subassemblies at higher and lower temperatures |
| CN103630787A (en) * | 2013-12-10 | 2014-03-12 | 索尔思光电（成都）有限公司 | Optical module testing device |
| US20140341578A1 (en) * | 2013-05-14 | 2014-11-20 | Applied Optoelectronics, Inc. | Aligning and directly optically coupling photodetectors to optical demultiplexer outputs in a multichannel receiver optical subassembly |
| US20150117855A1 (en) * | 2013-10-31 | 2015-04-30 | Hon Hai Precision Industry Co., Ltd. | Optical subassembly testing system |
-
2018
- 2018-01-22 CN CN201810059316.6A patent/CN108152655A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0782024A2 (en) * | 1995-12-22 | 1997-07-02 | Lucent Technologies Inc. | Method for positioning optical subassembly for testing |
| CN1156834A (en) * | 1995-12-22 | 1997-08-13 | 朗迅科技公司 | Method for positioning optical subassembly for testing Technical field |
| JP2000147041A (en) * | 1998-11-12 | 2000-05-26 | Mitsubishi Electric Corp | Tester for electronic equipment |
| US6697750B1 (en) * | 2001-01-11 | 2004-02-24 | Ciena Corporation | Method and apparatus for performing parallel asynchronous testing of optical modules |
| US20040074661A1 (en) * | 2002-02-14 | 2004-04-22 | Finisar Corporation | Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |
| US20040091231A1 (en) * | 2002-11-08 | 2004-05-13 | Hofmeister Rudolf J. | Optical subassembly tester and testing method |
| US20050025449A1 (en) * | 2002-11-08 | 2005-02-03 | Dirkson John C. | Methods and structures for testing optical subassemblies at higher and lower temperatures |
| US20140341578A1 (en) * | 2013-05-14 | 2014-11-20 | Applied Optoelectronics, Inc. | Aligning and directly optically coupling photodetectors to optical demultiplexer outputs in a multichannel receiver optical subassembly |
| US20150117855A1 (en) * | 2013-10-31 | 2015-04-30 | Hon Hai Precision Industry Co., Ltd. | Optical subassembly testing system |
| CN103630787A (en) * | 2013-12-10 | 2014-03-12 | 索尔思光电（成都）有限公司 | Optical module testing device |
Non-Patent Citations (1)
| Title |
|---|
| 曹建国: "金属冲压成形工艺与模具设计", 中国铁道出版社, pages: 238 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518000 809, 810, 811, block B, building 6, Shenzhen International Innovation Valley, Dali community, Xili street, Nanshan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN HI-OPTEL TECHNOLOGY Co.,Ltd. Address before: Hengbaotong building, No.2 building, Longjing Gaofa Science Park, Nanshan District, Shenzhen, Guangdong 518000 Applicant before: SHENZHEN HI-OPTEL TECHNOLOGY Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180612 |
|
| RJ01 | Rejection of invention patent application after publication |