CN108145586B - Polissoir and polishing method - Google Patents
Polissoir and polishing method Download PDFInfo
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- CN108145586B CN108145586B CN201810004291.XA CN201810004291A CN108145586B CN 108145586 B CN108145586 B CN 108145586B CN 201810004291 A CN201810004291 A CN 201810004291A CN 108145586 B CN108145586 B CN 108145586B
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 7
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The disclosure provides a kind of polissoir and polishing method.The polissoir includes: upper disk, wherein the upper disk includes: polishing unit, wherein the polishing unit includes height adjustment device, can be used in the height for adjusting the polishing unit；Telecontrol equipment is used to that the polishing unit to be enabled to do transverse movement and longitudinal movement；Polishing fluid delivery pipe；Solenoid valve, for controlling opening or closing for the polishing fluid delivery pipe；Wherein, each polishing unit is equipped with independent polishing fluid delivery pipe and solenoid valve.The disclosure can reduce whole polishing rate, polish caused Zara so as to greatly reduce by the independent polishing unit that disk on polissoir is arranged for realizing the independent polishing operation of each component units of polished part.
Description
Technical field
This disclosure relates to polishing technology field, in particular to a kind of polissoir and polishing method.
Background technique
After completing to box process, the Q-Panel for being cut into several Single-Panel composition is carried out liquid crystal display panel
Thinned is old process in the industry, has amplification to glass surface bad order due to being thinned, therefore needs after being thinned to Q-
Panel is polished to eliminate bad order, and common bad order has concave point, salient point, wheelprint, scuffing etc..
As thinned base plate of liquid crystal panel is more and more thinner (present thinning is required in≤0.2t or less), in thinning enterprise
In be frequently found to having etched TFT-LCD (Thin Film Transistor-Liquid Crystal Display, film
Transistor liquid crystal display (TFT-LCD)) after panel is processed by shot blasting, the TFT-LCD panel that manufacturer is but polished by customer complaint often is thinned
There is broken bright spot (Zara Particle) bad.Since the bad problem is that can not test out under the inspection of common fluorescent lamp
, thus how to improve and control liquid crystal display panel after attenuated polishing broken bright spot it is bad, also become thinned factory and panel thrown
One of the critically important requirement of light quality control.
Zara Particle is derived from Japanese, for indicating the bad of liquid crystal display panel, often refers to that liquid crystal display panel is drawn in dark-state
The small fine and closely woven bright spot that display area occurs under face.It is many to generate the bad reason of Zara Particle, with liquid crystal cell
(Panel) structure design, manufacturing process, Display panel mode etc. have relationship.Here Main Analysis is made of in panel
In the process such as broken bright spot caused by by pressure in polishing process.
Therefore, there is also the places that has much room for improvement for technical solution in the prior art.
It should be noted that information is only used for reinforcing the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
The disclosure is designed to provide a kind of polissoir and polishing method, so overcome at least to a certain extent by
One or more problem caused by the limitation and defect of the relevant technologies.
Other characteristics and advantages of the disclosure will be apparent from by the following detailed description, or partially by this public affairs
The practice opened and acquistion.
According to one aspect of the disclosure, a kind of polissoir is provided, comprising: upper disk, wherein the upper disk includes: polishing
Unit can be used in the height for adjusting the polishing unit wherein the polishing unit includes height adjustment device；Sportswear
It sets, is used to that the polishing unit to be enabled to do transverse movement and longitudinal movement；Polishing fluid delivery pipe；Solenoid valve, for controlling
Make opening or closing for the polishing fluid delivery pipe；Wherein, each polishing unit is equipped with independent polishing fluid delivery pipe and electricity
Magnet valve.
In a kind of exemplary embodiment of the disclosure, the telecontrol equipment includes: transverse movement guide rail, and the polishing is single
Member can do transverse movement along the transverse movement guide rail；Screw rod；Motion guide rail pedestal, adjacent motion guide rail pedestal pass through
The screw rod connection, the transverse movement guide rail can carry out longitudinal movement by the screw rod.
In a kind of exemplary embodiment of the disclosure, the height adjustment device is polishing unit center axis.
In a kind of exemplary embodiment of the disclosure, the polissoir further include: pressure inductor is set to institute
Polishing unit center axis one end is stated, for incuding the polish pressure of polishing unit.
According to another aspect of the disclosure, a kind of polishing method is provided, is applied to polissoir, comprising: obtain wait throw
Information before the polishing of each component units of light part；It is generated according to information before the polishing of each component units and polishing rule each
The burnishing parameters of component units；Control information is sent to the polissoir according to the burnishing parameters, wherein the control is believed
Breath carries out independent polishing operation to each component units for controlling the polissoir.
In a kind of exemplary embodiment of the disclosure, information includes the dimensional parameters of each component units before the polishing
With visual examination result before polishing.
In a kind of exemplary embodiment of the disclosure, the polissoir includes polishing unit, and each composition is single
The dimensional parameters of member include the first edge lengths A and the second edge lengths B of each component units, wherein the polishing is regular are as follows: root
According to the first edge lengths A and the second edge lengths B of each component units and the first edge lengths a and second of preset polishing unit
The laterally minimum amplitude of oscillation l and longitudinal minimum amplitude of oscillation h of edge lengths b, polishing unit, the polishing of transverse direction needed for obtaining each component units
Element number and longitudinal polishing element number, transverse direction amplitude of oscillation L and longitudinal amplitude of oscillation H；According to it is described laterally polishing element number and
Longitudinal polishing element number, combines the polishing unit that polishing unit is combined into each component units.
In a kind of exemplary embodiment of the disclosure, transverse direction needed for each component units of acquisition polishes unit number
Amount and longitudinal polishing element number, transverse direction amplitude of oscillation L and longitudinal direction amplitude of oscillation H include: the L=A-x*a as x*a < A < (x+1) * a；If
L > l then corresponds to component units and laterally uses x polishing unit；If L < l, corresponding component units laterally use x+1 polishing single
Member；And as y*b < B < (y+1) * b, H=B-y*b；If H > h, corresponding component units longitudinally use y polishing unit, if H
< h then corresponds to component units and longitudinally uses y+1 polishing unit.
In a kind of exemplary embodiment of the disclosure, visual examination result includes that each component units are thrown before the polishing
Whether there is defect before light, wherein described send control information, wherein institute to the polissoir according to the burnishing parameters
It includes: that adjustment polishing is single that control information, which is stated, for controlling the polissoir to carry out independent polishing operation to each component units
Member is incorporated into the polishing initial position of corresponding component units；When not having defect before component units polishing, phase is controlled
The polishing unit answered is combined without polishing operation；When there is defect before component units polishing, corresponding polishing is controlled
Unit combination carries out polishing operation.
In a kind of exemplary embodiment of the disclosure, visual examination result further includes each component units before the polishing
Defect level before polishing, wherein described send control information to the polissoir according to the burnishing parameters, wherein described
Control information carries out independent polishing operation to each component units for controlling the polissoir further include: according to described group
Defect level before polishing at unit controls the polishing condition of corresponding polishing unit combination.
In polissoir and polishing method in some embodiments of the disclosure, pass through the independence of disk setting on polissoir
Polishing unit for realizing the independent polishing operation of each component units of polished part, reduce whole polishing rate, so as to
Enough greatly reduce Zara caused by polishing.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 shows a kind of top view of disk on polissoir in disclosure exemplary embodiment.
Fig. 2 shows the cross-sectional views of disk on polissoir top a kind of in disclosure exemplary embodiment and polissoir.
Fig. 3 shows schematic diagram when a kind of polissoir works in disclosure exemplary embodiment.
Fig. 4 shows a kind of explanatory diagram of polishing rule in disclosure exemplary embodiment.
Fig. 5 shows movement locus schematic diagram when a kind of polissoir polishing operation in disclosure exemplary embodiment.
Fig. 6 shows a kind of flow chart of polishing method in disclosure exemplary embodiment.
Fig. 7 shows the flow chart of another polishing method in disclosure exemplary embodiment.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；Described feature, structure or characteristic can be with any suitable
Mode be incorporated in one or more embodiments.In the following description, many details are provided to provide to this
Disclosed embodiment is fully understood.It will be appreciated, however, by one skilled in the art that can be with technical solution of the disclosure
And omit it is one or more in the specific detail, or can be using other methods, constituent element, device, step etc..
It should be pointed out that in the accompanying drawings, for the size that may clearly exaggerate layer and region of diagram.And it can be with
Understand, when element or layer be referred in another element or layer "upper", it can be directly in other elements, or may exist
Intermediate layer.Additionally, it is appreciated that it can be directly at other when element or layer be referred in another element or layer "lower"
Under element, or there may be the layer of more than one centre or elements.In addition, it is to be appreciated that when layer or element are referred to as
Two layers or two elements " between " when, it can between two layers or two elements unique layer, or there may also be one
Above middle layer or element.Similar reference marker indicates similar element in the whole text.
Common polishing machine or polissoir, cardinal principle are that Q-Panel panel is adsorbed on to fixed lower polishing
Upper polishing disk (or being referred to as upper disk) is attached to the glass other side with certain pressure on disk (perhaps referred to as lower wall), when polishing
Lower polishing disk actively rotates, and polishing disk passive rotation in drive, the polishing fluid containing cerium oxide flows into glass metal from upper disk two sides
Between upper disk, so that the surface glass contacted with upper polishing disk be made to be polished, the bad order on Single-Panel is eliminated.
Q-Panel in the embodiment of the present invention refers to for the big glass of liquid crystal being cut into several small pieces, and every containing several small
Single-Panel (product).It is such to be just called Q-Panel per a piece of.It can be understood as comprising several small LCD screens
One glass, is usually applied to small-size product, such as mobile phone, pad class product.Liquid crystal factory is advantageous in this way, Ke Yirang
The foundries of profession are cut, and circuit board backlight is loaded on, and form final products.
Above scheme the problem is that: under normal conditions, the Q-Panel before polishing is counted according to Single-Panel
Bad order it is very low, only about 40% needs to polish, but existing polissoir be according to Q-Panel be unit polishing,
Eliminate about 40% Single-Panel bad order while, remaining about 60% it is also meaningless without bad Single-Panel
Polishing, i.e. Single-Panel polishing rate 100%.
This technical major defect has: on the one hand, it cannot individually control whether each Single-Panel polishes,
Single-Panel 100% is polished, and causes polishing Zara fraction defective high；On the other hand, each Single- cannot individually be controlled
The polishing condition of Panel and time, polishing time is long, and polishing cost is high, because the polishing time of Q-Panel depends on required throwing
The polishing time of longest Single Panel between light time.Meanwhile Q-Panel is integrally polished, polishing area is big, polishing cost
It is high.
Therefore, disclosure embodiment proposes a kind of polissoir, which may include: upper disk, wherein institute
Stating disk includes: polishing unit, wherein the polishing unit includes height adjustment device, can be used in adjusting the polishing unit
Height；Telecontrol equipment is used to that the polishing unit to be enabled to do transverse movement and longitudinal movement；Polishing fluid delivery pipe；
Solenoid valve, for controlling opening or closing for the polishing fluid delivery pipe；Wherein, each polishing unit is equipped with independent polishing
Liquid delivery pipe and solenoid valve.
In the exemplary embodiment, the telecontrol equipment may include: transverse movement guide rail, and the polishing unit being capable of edge
The transverse movement guide rail do transverse movement；Screw rod；Motion guide rail pedestal, adjacent motion guide rail pedestal pass through the screw rod
Connection, the transverse movement guide rail can carry out longitudinal movement by the screw rod.
It should be noted that the telecontrol equipment of the polishing unit transverse movement and longitudinal movement, which arbitrarily may be implemented, is
Can with, the disclosure is not limited to the specific structure and composition for the telecontrol equipment that above-described embodiment enumerates.
In the exemplary embodiment, the height adjustment device can be polishing unit center axis.
It should be understood that the height adjustment device that the polishing cell height regulatory function arbitrarily may be implemented is can
With the scheme applied to the disclosure, it's not limited to that for the disclosure.
In the exemplary embodiment, the polissoir can also include: pressure inductor, and it is single to be set to the polishing
First central axis one end, for incuding the polish pressure of polishing unit.
It should be noted that, although illustrated by taking the polishing of liquid crystal display panel as an example in the following examples, but
The polissoir of the actually disclosure can be applied to any workpiece for needing to polish, as long as it includes multiple for needing the workpiece polished
Component units not just can be applied to liquid crystal display panel.
The polissoir that embodiment of the present invention provides can be applied to liquid crystal panel surface polishing, can solve at present
General polishing mode is that whole polishing is carried out to Q-Panel in the industry, there is the meaningless polishing without undesirable Single-Panel
Problem, and to be also easy to produce polishing Zara etc. bad for whole polishing.
The main reason for being analyzed, polishing the generation of Zara is the opposing compression due in polishing process, polishing upper lower burrs
Friction drives the mutual extrusion and deformation between the upper layer and lower layer glass of Q-Panel, color film (Color after display screen pairing
Filter, referred to as CF) PS (Photo Spacer, support drum spacer material) on substrate stood in the thin of tft array substrate
On film transistor, PS and alignment film is made to rub under the action of extruding and deformation back and forth, to generate alignment film clast, clast
Into the display area AA, it is bad to form Zara, in liquid crystal display galvanization, shows that broken bright spot is bad.Therefore, polishing is reduced
The undesirable key of Zara is without polishing, or reduction polishing time, the conditions such as optimization polish pressure.
Embodiment of the present invention is described in detail with reference to the accompanying drawing.
Fig. 1 shows a kind of top view of disk on polissoir in disclosure exemplary embodiment.
As shown in Figure 1, wherein there are several independent polishing units 1, each polishing unit 1 can carry out past simultaneously
Multiple and oscillating motion, such as the polishing path of S type can be formed；Polish the transverse movement guide rail 2 of unit 1, each polishing unit 1
Transverse direction, the i.e. free movement in the direction X-Axis can be done along transverse movement guide rail 2, and each polishing unit can pass through Fig. 2
Shown in polishing unit center axis 10 carry out height adjustment；The motion guide rail pedestal 3 for polishing unit 1, wherein adjacent movement is led
Rail bottom seat 3 is attached by telescopic screw rod 4, i.e., the transverse movement guide rail 2 in the direction X-Axis can carry out Y- by screw rod 4
The free movement in the direction Axis.
Fig. 2 shows the cross-sectional views of disk on polissoir top a kind of in disclosure exemplary embodiment and polissoir.
As shown in Figure 2, comprising: mechanism center shaft 5 on polissoir, polishing fluid delivery pipe (or referred to as polishing fluid is led
Pipe) 7, it can be used for controlling disk basal disc 8 on the solenoid valve 6 being opened or closed and polissoir of polishing fluid delivery pipe.Its
In, polishing unit 1 can be along polishing about 10 small distance movement of unit center axis, when control polishing unit 1 moves upwards, the throwing
Light unit 1 is not contacted with corresponding Single-Panel, then the corresponding Single-Panel is unpolished；When control polishes unit
1 when moving downward, which contacts with corresponding Single-Panel, then carries out to the corresponding Single-Panel
Polishing.
Further, it is also possible to and realize each Single- by the pressure inductor 9 of polishing 10 upper end of unit center axis
The polish pressure of Panel controls, and polished unit 1 is single by transverse movement guide rail 2, the screw rod 4 of transverse movement guide rail 2, polishing
After first central axis 10 is adjusted, entire polissoir upper mechanism then can be in (the disk drive on such as of external dynamical system
Dynamic system) under do the amplitude of oscillation movement of certain frequency.
In the embodiment of the present invention, each polishing unit 1 is equipped with a polishing fluid delivery pipe 7 and solenoid valve 6, so as to
Polishing fluid is supplied to the polishing unit contacted with Single-Panel, the polishing unit not contacted with Single-Panel stops supplying
To polishing fluid, to realize the individually controllable polishing to Single-Panel.
It should be noted that, although above-mentioned be not shown in the figure, but above-mentioned polissoir can also include: rack, lower wall, on
Disc driving system, lower disc driving system, recovery system and pumped vacuum systems (using conventional pumped vacuum systems) etc. are conventional
Structure specifically can refer to the prior art, and this will not be detailed here.
Wherein, the upper disc driving system of entire polissoir further include have the conventional components such as lift cylinder, transmission mechanism, and under
Disc driving system then includes the components such as corresponding motor, transmission mechanism, and upper disc driving system and lower disc driving system are mounted on
In rack, and it can be controlled by operation panel.
Top view and polishing rule declaration figure when Fig. 3 and Fig. 4 is polishing machine work respectively.Wherein, 11 be polished Q-
Panel, each Q-Panel are made of several Single-Panel.
As shown in figure 3, computer is each by polishing regular (particular content see below) clearly polished Q-Panel
After the quantity of polishing unit needed for Single-Panel, work (polishing operation is carried out to corresponding Single-Panel) is needed
Polishing unit 1 it is single by the polishing adjustment height of unit center axis 10, then by transverse movement guide rail 2 and the adjustment polishing of screw rod 4
The position of member, the position for making each polishing unit combine opposite Single-Panel is identical, all polishes unit combination and is in phase
The upper left corner of Single-Panel is answered, which is the initial position polished.
Fig. 5 shows movement locus schematic diagram when a kind of polissoir polishing operation in disclosure exemplary embodiment.
As shown in figure 5, figure acceptance of the bid shows polishing of the polishing unit from Single-Panel initial position to terminal position
Motion profile, after reaching end, then opposite direction is polished to initial position with similar track, so does reciprocal polishing action.
Following for narration polishing rule is facilitated, do defined below:
Definition: the long side length of polished Single-Panel is A, bond length B, and the long side length for polishing unit is
A, bond length are b (as shown in Figure 4), and when polishing, actual transverse direction (direction the X-Axis) amplitude of oscillation was L, actual longitudinal direction (Y-
The direction Axis) amplitude of oscillation is H, polishing unit transverse and longitudinal minimum amplitude of oscillation are l and h.Transverse direction amplitude of oscillation L actual in this way by A, a,
L is codetermined, and H is determined by B, b, h.
Wherein, laterally polishing rule can be with are as follows: as x*a < A < (x+1) * a, L=A-x*a.
If L > l, corresponds to single Single-Panel and laterally use x polishing unit；It is corresponding single if L < l
Single-Panel laterally uses x+1 polishing unit.
Wherein, longitudinal polishing rule can be with are as follows: as y*b < B < (y+1) * b, H=B-y*b.
If H > h, y polishing unit is longitudinally used for single Single-Panel；If H < h, for single
Single-Panel longitudinally uses y+1 polishing unit.
In conclusion in the case where meeting horizontal and vertical polishing rule at the same time, the polishing of Single-Panel needs
The quantity of unit is the product of the two.
In the embodiment of the present invention, above-mentioned A, B can be input parameter, and a, b and l, h can be preset ginseng in systems
Number calculates L, the number of H and laterally polishing unit, longitudinal polishing unit according to this six known parameters systems automatically.
It should be noted that above-mentioned polishing rule is only for for example, specifically can according to circumstances be configured
And adjustment, it's not limited to that for the disclosure.
The polissoir that embodiment of the present invention provides, can be by the fixed lower wall of setting, and includes several
The upper disk composition of a independent reciprocal swing polishing unit of &, may be implemented the throwing to Single-Panel each on Q-Panel
The control of striation part is decided whether to be polished, polish pressure size, be thrown according to the bad order inspection result of each Panel
Light length of time etc..Such as the Single-Panel of bad order does not have wheelprint, salient point etc. easily to polish bad without polishing
Reduction polish pressure or the time；There is the bad increase polishing time of the more difficult polishing such as concave point, scuffing or improves polish pressure, from
And realize the optimal polishing condition of each Single-Panel, the polishing rate of Single-Panel is greatly reduced, to greatest extent
The generation of polishing Zara is reduced, while reducing polishing cost.
It should be noted that lower wall is fixed in the embodiment of the present invention, and realized by vacuum suction to liquid crystal display panel
Fixation usually only do the single-sided polishing in the face CF since liquid crystal display panel requires the bright and clean degree in the face CF high.But the disclosure is not
It is defined in this, in different applications, can require to carry out modification appropriate according to the different of polished part.
Fig. 6 shows a kind of flow chart of polishing method in disclosure exemplary embodiment.
As shown in fig. 6, the polishing method can be applied to the polissoir in above-described embodiment, this method may include with
Lower step.
In step s 110, information before the polishing of each component units of polished part is obtained.
In the exemplary embodiment, before the polishing information may include each component units dimensional parameters and polishing before
Visual examination result.
In the exemplary embodiment, the polissoir may include polishing unit, the size of each component units
Parameter may include the first edge lengths A and the second edge lengths B of each component units.
In the step s 120, each component units are generated according to information before the polishing of each component units and polishing rule
Burnishing parameters.
In the exemplary embodiment, the polishing rule can be with are as follows: according to the first edge lengths A of each component units and
The laterally minimum amplitude of oscillation l of the first edge lengths a and the second edge lengths b of two edge lengths B and preset polishing unit, polishing unit
With longitudinal minimum amplitude of oscillation h, transverse direction needed for obtaining each component units polishes element number and longitudinal polishing element number, cross
To amplitude of oscillation L and longitudinal amplitude of oscillation H；According to the laterally polishing element number and longitudinal polishing element number, unit will be polished
It is combined into the polishing unit combination of each component units.
In the exemplary embodiment, transverse direction polishing element number and longitudinal throwing needed for each component units of acquisition
Light unit quantity, transverse direction amplitude of oscillation L and longitudinal direction amplitude of oscillation H may include: the L=A-x*a as x*a < A < (x+1) a；It is right if L > l
Component units are answered laterally to use x polishing unit；If L < l, corresponding component units laterally use x+1 polishing unit；And
As y*b < B < (y+1) b, H=B-y*b；If H>h, corresponding component units longitudinally use y polishing unit, right if H<h
Component units are answered longitudinally to use y+1 polishing unit.
In step s 130, control information is sent to the polissoir according to the burnishing parameters, wherein the control
Information carries out independent polishing operation to each component units for controlling the polissoir.
In the exemplary embodiment, to may include before the polishing of each component units be visual examination result before the polishing
It is no that there is defect.
In the exemplary embodiment, described to send control information to the polissoir according to the burnishing parameters, wherein
The control information includes: adjustment polishing for controlling the polissoir to carry out independent polishing operation to each component units
Unit is incorporated into the polishing initial position of corresponding component units；When not having defect before component units polishing, control
Corresponding polishing unit combination is without polishing operation；When there is defect before component units polishing, corresponding throw is controlled
Light unit combination carries out polishing operation.
In the exemplary embodiment, visual examination result can also include before each component units polish before the polishing
Defect level.
In the exemplary embodiment, described to send control information to the polissoir according to the burnishing parameters, wherein
The control information can also include: root for controlling the polissoir to carry out independent polishing operation to each component units
According to the defect level before component units polishing, the polishing condition of corresponding polishing unit combination is controlled.
The polissoir and polishing method that embodiment of the present invention provides, can be single by designing independent reciprocating polishing
The independence polishing to Single-Panel each on Q-Panel may be implemented in member.According to visual examination knot after product is thinned
Fruit, only to there is the Single-Panel of bad order to polish, no bad order without polishing, bad order degree is not
Same selection different polish pressure and/or polishing time are improving Single- compared with traditional Q-Panel is integrally polished
While Panel polishes success rate, Zara caused by greatly reducing polishing cost and polishing etc. is bad.
Fig. 7 shows the flow chart of another polishing method in disclosure exemplary embodiment.
As shown in fig. 7, the polishing method may comprise steps of.
In step s 201, optics AOI detection is carried out to polished Q-Panel, obtains and forms the polished Q-
Whether the size of each Single-Panel of Panel has bad order, and as a certain or certain Single-Panel
When with bad order, bad order position, bad order degree etc..
Wherein, the full name of AOI (Automatic Optic Inspection) is automatic optics inspection, is former based on optics
The equipment for managing to detect the common deficiency encountered in production.AOI is a kind of measuring technology, but is quickly grown, Hen Duochang
Family is all proposed AOI test equipment.Upon automatic detection, machine is adopted by the camera automatically scanning polished Q-Panel
Collect image, each Single-Panel of test is compared with the qualified parameter in database, by image procossing, is checked
Defect on each Single-Panel out, and defect is shown/marked by display or Automatic Logos.
It should be noted that obtaining the size of each Single-Panel of the polished Q-Panel by AOI, being
It is not no that there is bad order, and when a certain or certain Single-Panel have bad order, it is bad order position, outer
The mode for seeing the information such as undesirable level is not limited in enumerated AOI mode, and the embodiment of the present disclosure can use other
Meaning mode obtains information above.
In step S202, each Single-Panel for the polished Q-Panel that above-mentioned steps S201 is obtained is uploaded
Size, whether there is bad order, and when with bad order, the information such as bad order position, undesirable level.
In step S203, according to polishing rule, polishing unit combination and the upper disk amplitude of oscillation are calculated.
In the embodiment of the present invention, calculates polishing unit combination and refer to the size according to polishing unit, Single
Lateral polishing unit number, the longitudinal polishing unit number for each polishing unit combination that the size of Panel is calculated, specifically may be used
Referring to the explanation in relation to polishing rule in the embodiment of above-mentioned polissoir.
In the embodiment of the present invention, the upper disk amplitude of oscillation can be the practical polishing calculated according to above-mentioned polishing rule
The lateral amplitude of oscillation L and longitudinal amplitude of oscillation H actually polished.
In step S204, polissoir adjust automatically polishes unit combination.
In the embodiment of the present invention, the polissoir adjust automatically polishing unit combination refers to according to above-mentioned polishing rule meter
Polishing unit number needed for result combines each Single-Panel is calculated, and corresponding polishing unit is combined into polishing list
Member combination, and combine corresponding polishing unit the initial position for being adjusted to the polishing of each Single-Panel.
In step S205, polishing unit center axis decline starts polishing operation.
Whether this refers to have bad order according to each Single-Panel of upload, determine do not have appearance not
The corresponding polishing unit combination of good Single-Panel does not need to carry out polishing operation, and corresponding polishing unit center axis is not
It needs to decline；And the corresponding Single-Panel with bad order polishes unit combination accordingly and needs to carry out polishing operation,
Its corresponding polishing unit center axis control decline starts polishing operation.
Further, the embodiment of the present invention can also be according to the different appearances of the Single-Panel with bad order
Undesirable level determines the difference of the decline degree of the polishing unit center axis in corresponding polishing unit combination, for example, there is wheel
The corresponding polishing unit center axis of the control of the bad orders such as print, salient point drops to the first height, and can pass through pressure sensitive
Device senses the first polish pressure of first height, has in the corresponding polishing unit of the control of the bad orders such as concave point, scuffing
Mandrel drops to the second height, wherein first height is greater than second height, and can pass through the pressure inductor
The second polish pressure of second height is sensed, wherein second polish pressure is greater than first polish pressure
Polish pressure is increased with the Single-Panel to the bad order for having more difficult polishing；Alternatively, there is the bad orders such as wheelprint, salient point
Polishing unit center axis corresponding with the control for having the bad orders such as concave point, scuffing declines identical height, but control has wheel
The control of the bad orders such as print, salient point corresponding polishing unit center axis decline first time, and controlling has concave point, scuffing etc. outer
It sees the corresponding polishing unit center axis of undesirable control and declined for the second time, wherein when second time is greater than described first
Between, i.e., polishing time can also be increased to the Single-Panel for the bad order for having more difficult polishing；Alternatively, throwing can also be passed through
Light pressure and the control simultaneously of the aspect of polishing time two are easier to or the Single-Panel of the bad order of more difficult polishing to having
Carry out the setting of different polishing conditions.
In step S206, polishing terminates.
With continued reference to embodiment shown in Fig. 7, the method can also include: in step S207, after above-mentioned polishing
Single-Panel carry out AOI reinspection.
In step S208, above-mentioned AOI reinspection result is followed up to judge whether the Single-Panel after above-mentioned polishing accords with
Close appearance regulation；If do not met, jumps back to step S203 and re-start polishing；If met, into next step
S209。
In step S209, polishing operation terminates.
Embodiment of the present invention provides a kind of novel Q-Panel polissoir, can be to each on Q-Panel
Single-Panel carries out the polishing operation of different parameters simultaneously, including unpolished to the Single-Panel for not needing polishing,
To which Single-Panel polishing rate about 60% be effectively reduced, it is bad to substantially reduce polishing Zara.Meanwhile because only to about 40%
Single-Panel polished, therefore 60% or more is substantially reduced with the polishing time that Single-Panel is calculated, thus real
The reduction for now polishing power, saves electric energy.In addition, the polishing condition of each Single-Panel is according to visual examination before polishing
As a result burnishing parameters can be automatically generated.Meanwhile the small distance movement function up and down of setting polishing unit, Ke Yitong can be passed through
Polishing or unpolished, the pressure sensor on cooperation polishing unit top of the Shi Shixian to Single-Panel, it is adjustable each
The polish pressure of Single-Panel, to realize the different polish pressures of different Single-Panel on same Q-Panel
Control.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
Claims (8)
1. a kind of polissoir characterized by comprising
Upper disk, wherein the upper disk includes:
Several polishing units can be used in adjusting each polishing unit wherein each polishing unit includes height adjustment device
Height；
Telecontrol equipment is used to that each polishing unit to be enabled to do transverse movement and longitudinal movement；
Polishing fluid delivery pipe；
Solenoid valve, for controlling opening or closing for the polishing fluid delivery pipe；
Wherein, each polishing unit is equipped with independent polishing fluid delivery pipe and solenoid valve.
2. polissoir according to claim 1, which is characterized in that the telecontrol equipment includes:
Transverse movement guide rail, the polishing unit can do transverse movement along the transverse movement guide rail；
Screw rod；
Motion guide rail pedestal, adjacent motion guide rail pedestal are connected by the screw rod, and the transverse movement guide rail can pass through
The screw rod carries out longitudinal movement.
3. polissoir according to claim 1 or 2, which is characterized in that the height adjustment device is in polishing unit
Mandrel.
4. polissoir according to claim 3, which is characterized in that further include:
Pressure inductor is set to polishing unit center axis one end, for incuding the polish pressure of polishing unit.
5. a kind of polishing method is applied to polissoir characterized by comprising
Obtain information before the polishing of each component units of polished part；
The burnishing parameters of each component units are generated according to information before the polishing of each component units and polishing rule；
Control information is sent to the polissoir according to the burnishing parameters, wherein the control information is for controlling the throwing
Light device carries out independent polishing operation to each component units；
Visual examination result before information includes the dimensional parameters of each component units and polishes before the polishing；
The polissoir includes polishing unit, and the dimensional parameters of each component units include the first of each component units
Edge lengths A and the second edge lengths B, wherein the polishing is regular are as follows:
According to the first edge lengths A of each component units and the second edge lengths B and the first edge lengths a of preset polishing unit
With the laterally minimum amplitude of oscillation l and longitudinal minimum amplitude of oscillation h of the second edge lengths b, polishing unit, cross needed for obtaining each component units
To polishing element number and longitudinal polishing element number, transverse direction amplitude of oscillation L and longitudinal amplitude of oscillation H；
According to the laterally polishing element number and longitudinal polishing element number, it is single that polishing unit is combined into each composition
The polishing unit combination of member.
6. polishing method according to claim 5, which is characterized in that transverse direction needed for each component units of acquisition is thrown
Light unit quantity and longitudinal polishing element number, transverse direction amplitude of oscillation L and longitudinal direction amplitude of oscillation H include:
As x*a < A < (x+1) * a, L=A-x*a；
If L > l, corresponding component units laterally use x polishing unit；If L < l, corresponding component units laterally use x+1
Polish unit；And
As y*b < B < (y+1) * b, H=B-y*b；
If H>h, corresponding component units longitudinally use y polishing unit, if H<h, corresponding component units longitudinally use y+1
Polish unit.
7. polishing method according to claim 6, which is characterized in that visual examination result includes each group before the polishing
Whether there is defect before polishing at unit, wherein described send control letter to the polissoir according to the burnishing parameters
Breath, wherein the control information includes: to the independent polishing operation of each component units progress for controlling the polissoir
Adjustment polishing unit is incorporated into the polishing initial position of corresponding component units；
When not having defect before component units polishing, corresponding polishing unit combination is controlled without polishing operation；
When there is defect before component units polishing, controls corresponding polishing unit combination and carry out polishing operation.
8. polishing method according to claim 7, which is characterized in that visual examination result further includes each before the polishing
Defect level before component units polishing, wherein described send control information to the polissoir according to the burnishing parameters,
Wherein the control information carries out independent polishing operation to each component units for controlling the polissoir further include:
According to the defect level before component units polishing, the polishing condition of corresponding polishing unit combination is controlled.
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| CN201810004291.XA CN108145586B (en) | 2018-01-03 | 2018-01-03 | Polissoir and polishing method |
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| CN201810004291.XA CN108145586B (en) | 2018-01-03 | 2018-01-03 | Polissoir and polishing method |
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| CN114851035A (en) * | 2022-04-25 | 2022-08-05 | 大连橡胶塑料机械有限公司 | A kind of automatic polishing numerical control integrated equipment and processing method of internal mixer rotor |
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| CN1512929A (en) * | 2001-05-29 | 2004-07-14 | 株式会社荏原制作所 | Polishing apparatus and polishing method |
| CN206105586U (en) * | 2016-09-26 | 2017-04-19 | 天津华海清科机电科技有限公司 | Polishing machine |
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| CN1179821C (en) * | 2000-05-12 | 2004-12-15 | 多平面技术公司 | Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same |
| KR100470227B1 (en) * | 2001-06-07 | 2005-02-05 | 두산디앤디 주식회사 | Carrier Head for Chemical Mechanical Polishing |
| DE10303407A1 (en) * | 2003-01-27 | 2004-08-19 | Friedrich-Schiller-Universität Jena | Method and device for high-precision processing of the surface of an object, in particular for polishing and lapping semiconductor substrates |
| JP4994227B2 (en) * | 2004-06-21 | 2012-08-08 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| JP2008171892A (en) * | 2007-01-09 | 2008-07-24 | Toyota Motor Corp | Semiconductor wafer support device |
| CN101407037B (en) * | 2008-11-26 | 2011-08-17 | 蔡崇友 | Full-automatic multi-grinding head polishing machine moving independently |
| CN104942690B (en) * | 2015-07-17 | 2018-10-12 | 厦门理工学院 | A kind of elastic polished equipment and method of special-shaped workpiece |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1512929A (en) * | 2001-05-29 | 2004-07-14 | 株式会社荏原制作所 | Polishing apparatus and polishing method |
| CN206105586U (en) * | 2016-09-26 | 2017-04-19 | 天津华海清科机电科技有限公司 | Polishing machine |
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